JP2015003988A - Adhesive tape for semiconductor processing - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an adhesive tape for semiconductor processing that exhibits excellent antistatic performance in a semiconductor device processing process, and has high die fly prevention performance.SOLUTION: An adhesive tape for semiconductor processing has an adhesive layer formed on at least one face of a substrate resin film, characterized in that a contact angle of the adhesive layer to pure water is 75° or more and 120° or less, and the adhesive layer contains ionic liquid.

Description

  The present invention relates to an adhesive tape for semiconductor processing.

  Conventionally, when processing semiconductor devices used for electrical components and electronic components, back grinding process for grinding semiconductor device wafers, dicing process for cutting semiconductor device wafers and semiconductor resin encapsulated packages, etc. In the process, an adhesive tape for semiconductor processing intended for fixing and protecting parts is used.

  In the process using the above-mentioned adhesive tape for semiconductor processing, peeling, friction, contact, etc. at the time of separator peeling, back grinding, dicing, cleaning of cutting powder with ultrapure water with high electrical insulation, picking up, etc. Causes static electricity. In the case where the substrate of a component forming a circuit is an insulating material such as ceramics or glass, static electricity is not leaked quickly, and there is a concern about the occurrence of discharge breakdown of the circuit due to a short circuit or adhesion of foreign matters such as dust. In order to improve static electricity disturbance, static elimination devices such as ionizers have been introduced, but in reality, sufficient antistatic effects have not been obtained, and the adhesive tape for semiconductor processing itself is made antistatic. It is hoped that. Further, in recent years, as the wafer becomes thinner, circuits are highly integrated, the risk of circuit destruction due to static electricity is further increased, and the demand for adhesive tapes for antistatic semiconductor processing is increasing.

  Then, the adhesive tape for semiconductor processing which provided the antistatic layer containing conductive polymers, such as polythiophene and polypyrrole, on the single side | surface or both surfaces of the base resin film is proposed (for example, refer patent document 1, 2). However, this pressure-sensitive adhesive tape requires an extra processing step for providing the antistatic layer, and thus the cost cannot be denied.

  Therefore, an adhesive tape in which an ionic liquid is added to the adhesive layer has been proposed (see, for example, Patent Document 3). Unlike the former, this type of tape does not require an extra processing step, and it is easy to suppress an increase in cost. However, the addition of the ionic liquid has a great adverse effect on the physical properties of the adhesive, and particularly the probability of die fly occurrence is dramatically increased.

JP 2008-255345 A JP 2008-280520 A Japanese Patent No. 3912686

  An object of the present invention is to provide an adhesive tape for semiconductor processing that exhibits excellent antistatic properties in a semiconductor device processing step and has high die fly prevention performance.

The present inventors have intensively studied to achieve the above object. as a result,
(1) In the adhesive tape for semiconductor processing in which the adhesive layer is formed on at least one surface of the base resin film, the contact angle of the adhesive layer with respect to pure water is 75 ° or more and 120 ° or less, and the adhesive layer An adhesive tape for semiconductor processing characterized by containing an ionic liquid;
(2) The adhesive tape for semiconductor processing according to (1), wherein the adhesive tape for semiconductor processing contains a radiation curable compound having a carbon-carbon unsaturated bond,
(3) The adhesive tape for semiconductor processing according to (1) or (2), wherein the anionic component of the ionic liquid of the ionic liquid is bis (fluorosulfonyl) imide or bis (trifluoromethanesulfonyl) imide ,
Has found that it exhibits excellent antistatic properties in the semiconductor device processing step and has high anti-die-flying performance. The present invention has been made based on these findings.

  According to the present invention, it has become possible to provide an adhesive tape for semiconductor processing which exhibits excellent antistatic properties in a semiconductor device processing step and has high die fly prevention performance.

It is sectional drawing which shows one embodiment of the tape for semiconductor processing of this invention.

Embodiments of the present invention will be described below.
FIG. 1 is a cross-sectional view showing an embodiment of a pressure-sensitive adhesive tape for semiconductor processing of the present invention, in which a pressure-sensitive adhesive layer 1 is laminated on the surface of a base resin film 2 to form a pressure-sensitive adhesive tape for semiconductor processing. .

<< Adhesive layer >>
<Base polymer>
Although it does not restrict | limit especially as a base polymer which comprises the adhesive layer 1, A (meth) acrylic-type pressure-sensitive base polymer and normal rubber-type resin can be used.
As the (meth) acrylic resin, a homopolymer and a copolymer having (meth) acrylic acid ester as a main constituent monomer unit (50% by mass or more) can be used. Specific examples include poly (meth) acrylic acid alkyl esters, and copolymers of (meth) acrylic acid alkyl esters with (meth) acrylic acid and other monomers having an ethylenically unsaturated group. In this invention, what was copolymerized with the monomer of acid components, such as (meth) acrylic acid, is preferable.
Examples of other monomers having an ethylenically unsaturated group include butadiene, styrene, (meth) acrylonitrile, vinyl acetate, vinyl chloride, maleic acid, maleic anhydride and the like.

  1-18 are preferable and, as for carbon number of an alcohol part, (meth) acrylic-acid alkylester has 1-12 more preferable. Examples include methyl acrylate, ethyl acrylate, n-butyl acrylate, 2-ethylhexyl acrylate, n-dodecyl acrylate, hexadecyl acrylate, 2-hydroxyethyl acrylate, and the corresponding methacrylic acid esters. .

  As the rubber-based resin, various synthetic rubbers such as natural rubber and acrylic rubber can be used.

  The pace polymer preferably has a weight average molecular weight of 200,000 to 1,400,000. This is because antistatic performance when an ionic liquid is added tends to be expressed.

<Radiation curable compound>
The radiation curable compound having a carbon-carbon double bond that constitutes the pressure-sensitive adhesive layer 1 can be used without particular limitation as long as it is cured by irradiation with radiation to form a three-dimensional network. The radiation curable compound preferably has a molecular weight of 20,000 or less. Moreover, the number of radiation-polymerizable carbon-carbon double bonds in the molecule is 5,000 or less and the number of radiation-polymerizable carbon-carbon double bonds in the molecule is 2 to 15 so that the three-dimensional networking of the pressure-sensitive adhesive layer can be efficiently performed by radiation irradiation. A low molecular weight compound is preferable, and furthermore, since the antistatic performance deteriorates due to the improvement of the elastic modulus by irradiation with radiation, the number of carbon-carbon double bonds is preferably 8 or less with respect to the molecular weight of 1000.

  Examples of the radiation curable compound include trimethylolpropane triacrylate, tetramethylolmethane tetraacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate, 1,4-butylene glycol. Examples include diacrylate, 1,6-hexanediol diacrylate, polyethylene glycol diacrylate, organopolysiloxane composition, commercially available oligoester acrylate, and urethane acrylate.

  The radiation curable compound having a carbon-carbon double bond may be used alone or in combination of two or more. A compounding quantity is 5-150 weight part with respect to 100 weight part of base polymers. Preferably, it is 8-130 weight part with respect to 100 weight part of base polymers, More preferably, it is 10-100 weight part. If the amount is too small, the pressure-sensitive adhesive layer is not sufficiently three-dimensionally formed by irradiation with radiation, and it is difficult to peel off from the adherend, so that pick-up performance is deteriorated and adhesive residue tends to occur. On the other hand, if the amount is too large, the polymerization reaction due to radiation proceeds excessively and curing shrinkage due to radiation irradiation occurs. As a result, the pressure-sensitive adhesive layer bites the surface of the adherend and becomes difficult to peel off from the adherend, so that pickup performance is deteriorated and adhesive residue is likely to occur. Moreover, when there is too much quantity of a radiation-curable compound, there exists a problem that it becomes difficult to hold | maintain the shape of an adhesive layer and thickness accuracy worsens.

<Ionic liquid>
In the present invention, the pressure-sensitive adhesive layer 1 contains at least one ionic liquid.
Here, the ionic liquid is an organic salt compound comprising a combination of an organic cation and an inorganic or organic anion, and refers to a molten salt that exhibits a liquid state at 70 ° C. or lower, and has a melting point of 70 ° C. or lower, preferably room temperature (25 ° C.). Refers to the following compounds: Since the ionic liquid has high ionic conductivity, the antistatic property can be expressed even in a small amount when added to the adhesive. Therefore, the influence on the adhesive physical property by addition can be suppressed to some extent.

Examples of the organic cation constituting the ionic liquid include onium, typically ammonium of a quaternary nitrogen atom (representative structure: R ¹ ₄ N ⁺ ), immonium (representative structure: R ² ₂ C═N ^+). R ¹ ₂ ), sulfonium (representative structure: R ¹ ₃ S ⁺ ), oxonium (representative structure: R ¹ ₂ O ⁺ ), phosphonium of quaternary phosphorus atom (representative structure: R ¹ ₄ P ⁺ ), iodonium (representative) Structure: R ¹ ₂ I ⁺ ) and the like. Here, R ¹ represents a substituent such as an alkyl group, an aryl group, or a heterocyclic group, and R ² represents a hydrogen atom or a substituent. A plurality of R ¹ , a plurality of R ^2, or R ¹ and R ² may be bonded to each other to form a ring. Furthermore, two R ¹ and two R ² may jointly form a double bond group (eg, ═O, ═S, ═NR ² ). R ² represents a hydrogen atom or a substituent.

  In the present invention, ammonium, immonium and sulfonium having a quaternary nitrogen atom are preferable. These include, for example, pyridinium cation, piperidinium cation, pyrrolidinium cation, imidazolium cation, tetrahydropyrimidinium cation, Examples thereof include a midinium cation, a pyrazolium cation, a tetraalkylammonium cation, and a trialkylsulfonium cation. Among these, a pyridinium cation and an imidazolium cation are preferably used. In particular, it is preferable to use a pyridinium cation because it is excellent in the antistatic property of the radiation-curable pressure-sensitive adhesive tape for semiconductor processing and in the pick-up property of the semiconductor after dicing.

  Specific examples of the pyridinium cation include, for example, 1-ethylpyridinium cation, 1-butylpyridinium cation, 1-hexylpyridinium cation, 1-butyl-3-methylpyridinium cation, 1-butyl-4-methylpyridinium cation, 1 -Hexyl-3-methylpyridinium cation, 1-hexyl-4-methylpyridinium cation, 1-butyl-3,4-dimethylpyridinium cation, etc., among which 1-hexyl-4-methylpyridinium cation Etc. are preferably used.

The inorganic anion is not particularly limited as long as it satisfies that it becomes an ionic liquid. For example, Cl ⁻ , Br ⁻ , I ⁻ , AlCl ₄ ⁻ , Al ₂ Cl ₇ ⁻ , BF ₄ ⁻ , PF ₆ ⁻ , ClO ₄ ⁻ , NO ₃ ⁻ , AsF ₆ ⁻ , SbF ₆ ⁻ , NbF ₆ ⁻ , TaF ₆ ⁻ , F (HF) n ⁻ , (CN) ₂ N ^{− and the} like. Here, n is an integer of 0 or more.
The organic anion is not particularly limited as long as it satisfies that it becomes an ionic liquid. For example, CH ₃ COO ⁻ , CF ₃ COO ⁻ , CH ₃ SO ₃ ⁻ , CF ₃ SO ₃ ⁻ , (CF ₃ SO _{^{2) 2 N -, (FSO}} 2) 2 N -, (CF 3 SO 2) 3 C -, C 4 F 9 SO 3 -, (C 2 F 5 SO 2) 2 N -, C 3 F 7 COO - , (CF ₃ SO ₂ ) (CF ₃ CO) N ^{— and the} like.

Among inorganic or organic anions, particularly, an anion component containing a fluorine atom is excellent in ionic conductivity, and among these, a fluorine-containing organic anion is preferable. In particular, (FSO ₂ ) ₂ N ⁻ , (CF ₃ SO ₂ ) ₂ N ^When- is used, it is preferable because the antistatic performance of the radiation-curable adhesive tape for semiconductor device processing is excellent.

  In the present invention, a preferable ionic liquid can be represented by the following general formula (I).

In the formula, Ra and Rb each independently represent a substituent. n represents an integer of 0 to 5.
X represents an organic or inorganic anion.

  The substituent in Ra is preferably an alkyl group, an alkenyl group, a cycloalkyl group or an aryl group, and more preferably an alkyl group. 1-18 are preferable and, as for carbon number of an alkyl group, 1-12 are more preferable.

  The substituent in Rb is a halogen atom, an alkyl group, an alkenyl group, a cycloalkyl group, an aryl group, a heterocyclic group, an alkoxy group, an aryloxy group, an alkylthio group, an arylthio group, an alkylsulfonyl group, an arylsulfonyl group, an amino group, Examples include alkylamino group, arylamino group, heterocyclic amino group, acyl group, acylamino group, sulfonamido group, carbamoyl group, sulfamoyl group, hydroxyl group, cyano group, nitro group, carboxyl group, sulfo group, alkyl group, aryl group Group is preferred, and an alkyl group is more preferred.

  The position at which Rb is substituted may be any of the 2-6 positions of the pyridine ring, but the 3-6 positions are preferred, and the 4 position is particularly preferred.

n is preferably 0 to 3, more preferably 0 to 2, still more preferably 0 or 2, and particularly preferably 1.
When n is 2 or more, the plurality of Rb may be the same as or different from each other.

X is a halogen anion, an inorganic anion of BF ₄ ⁻ , PF ₆ ⁻ , ClO ₄ ⁻ , RxCO ₂ ⁻ , RySO ₃ ⁻ , (RxCO) ₂ N ⁻ , (RxCO) (RySO ₂ ) N ⁻ , (RySO ₂₎ ) ₂ N ^- organic anions are preferred. Here, Rx and Ry each independently represents an alkyl group or an aryl group.

X is preferably PF ⁶⁻ , (RxCO) (RySO ₂ ) N ⁻ , (RySO ₂ ) ₂ N ^−, more preferably (RxCO) (RySO ₂ ) N ⁻ , (RySO ₂ ) ₂ N ⁻ , and (RySO ₂ ). _{2) 2} N ^- is particularly preferred.
Rx and Ry are preferably an alkyl group or an aryl group substituted with a halogen atom, and the halogen atom is preferably a fluorine atom, more preferably a perfluoroalkyl group or a perfluoroaryl group, and particularly preferably a perfluoroalkyl group. . 1-10 are preferable, as for carbon number of an alkyl group, 1-6 are more preferable, and 1-4 are more preferable. 6-10 are preferable and, as for carbon number of an aryl group, 6-8 are more preferable.

  Specific examples of the compound represented by the general formula (I) include those described above.

  In addition, as the ionic liquid, for example, those commercially available from Guangei Chemical Industry Co., Ltd. or Nippon Carlit Co., Ltd. can be preferably used.

  3-50 mass parts is preferable with respect to 100 mass parts of base polymers, and, as for the compounding quantity of an ionic liquid, 5-40 mass parts is more preferable.

<Isocyanate compound>
In the present invention, the pressure-sensitive adhesive layer 1 is preferably crosslinked with an isocyanate compound.
The isocyanate compound is not particularly limited. For example, 4,4′-diphenylmethane diisocyanate, tolylene diisocyanate, xylylene diisocyanate, 4,4′-diphenyl ether diisocyanate, 4,4 ′-[2,2-bis (4- Aromatic isocyanate such as phenoxyphenyl) propane] diisocyanate, hexamethylene diisocyanate, 2,2,4-trimethyl-hexamethylene diisocyanate, isophorone diisocyanate, 4,4′-dicyclohexylmethane diisocyanate, 2,4′-dicyclohexylmethane diisocyanate, Examples include lysine diisocyanate and lysine triisocyanate. Specifically, Coronate L (trade name, manufactured by Nippon Polyurethane Co., Ltd.) or the like can be used as a commercial product.

  In the present invention, the content of the isocyanate compound in the pressure-sensitive adhesive layer is preferably 0.01 to 10% by mass, more preferably 0.1 to 8% by mass, based on the total weight of the radiation-curable pressure-sensitive adhesive. . If the content ratio of the isocyanate compound is too small, the crosslinking reaction of the pressure-sensitive adhesive slows down, and sufficient characteristics cannot be obtained. If it is too large, the pressure-sensitive adhesive composition is mixed and applied to the base resin film. This is because the pot life is shortened and troubles occur when the adhesive tape for semiconductor processing of the present invention is produced.

  In cross-linking, in the present invention, it is preferable to cross-link without using a cross-linking catalyst such as dialkyl tin dialiphatic carboxylate such as dibutyl tin dilaurate.

<Physical characteristics of the adhesive layer>
(Contact angle against pure water)
The pressure-sensitive adhesive layer 1 preferably has a contact angle with respect to pure water of 75 ° or more and 120 ° or less. When the contact angle with pure water is less than 75 °, the affinity between the pressure-sensitive adhesive layer and the cutting water used during dicing increases, and cutting water easily enters between the pressure-sensitive adhesive layer and the adherend during dicing. Will help. As a result, the adhesive force to the adherend is extremely reduced, and die fly is induced. Moreover, if the contact angle with respect to pure water is larger than 120 °, the interaction with the adherend becomes too strong, and a problem may occur during pick-up.

  The contact angle with respect to pure water is preferably 75 ° to 117 ° C, and more preferably 75 ° to 110 °.

  In order to set the contact angle of the pressure-sensitive adhesive layer with respect to pure water to 75 ° or more and 120 ° or less, for example, by selecting from the base polymer of the pressure-sensitive adhesive and the ionic liquid, and further adjusting the type and amount, Can be 75 ° or more and 120 ° or less.

(Adhesive layer thickness)
Moreover, 3-50 micrometers is preferable and, as for the thickness of the adhesive layer 1, More preferably, it is 5-20 micrometers. These numbers are derived from the viewpoints of mechanical properties and heat shrinkage required for adhesive tapes for semiconductor processing.

<Base resin film>
The base resin film 2 used in the present invention shown in FIG. 1 is a polyolefin such as polyethylene, polypropylene and polybutene, an ethylene-vinyl acetate copolymer, an ethylene- (meth) acrylic acid copolymer and an ethylene- (meta ) Ethylene copolymers such as acrylic acid ester copolymers, soft polyvinyl chloride, polyethylene terephthalate, polyethylene naphthalate, semi-rigid polyvinyl chloride, polyester, polyurethane, polyamide, polyimide, natural rubber and synthetic rubber, metal ions It is composed of a polymer material such as a cross-linked ethylene ionomer.
In the present invention, polyolefin and ethylene copolymer are preferable.
The thickness of the base resin film 2 is usually 30 to 300 μm, more preferably 50 to 200 μm. These numbers are derived from the viewpoint of mechanical properties required for semiconductor processing tapes.

  Here, the base resin film 2 may be produced by mixing a single resin or a plurality of resins, or may be a laminate of various types of resins.

EXAMPLES Hereinafter, although this invention is demonstrated further in detail based on an Example, this invention is not limited to this.
In addition, the weight average molecular weight of the base polymer is a polystyrene conversion value obtained by measuring a 1% solution obtained by dissolving in tetrahydrofuran by gel permeation chromatography (product name: 150-C ALC / GPC). Calculated.

  The following were used as the base resin film.

(Base resin film)
Low density polyethylene (trade name: Novatec LD LF640MA manufactured by Nippon Polyethylene Co., Ltd.) was put into an extruder, and a base resin film having a thickness of 150 μm was produced by extrusion molding.

The following polymers A and B were used as base polymers.
(Polymer A)
Polymer A was obtained by emulsion polymerization using 40% by mass of ethyl acrylate, 55% by mass of butyl acrylate, and 10% by mass of acrylonitrile as raw materials. The weight average molecular weight was 700,000.

(Polymer B)
Polymer B was obtained by solution polymerization using 65% by mass of methyl acrylate, 30% by mass of 2-ethylhexyl acrylate, and 5% by mass of acrylic acid as raw materials. The weight average molecular weight was 350,000.

  The following adhesives A to H were used as the adhesive.

(Adhesive A)
25 parts by mass of a radiation curable compound (molecular weight 3,600, urethane acrylate oligomer having 10 carbon-carbon double bonds in one molecule) and 100 parts by mass of polymer A, 1-n-hexyl which is an ionic liquid 8 parts by mass of -4-methylpyridinium bis (trifluoromethanesulfonyl) imide, 2 parts by mass of a polyisocyanate compound (manufactured by Nippon Polyurethane Co., Ltd., trade name Coronate L), and a photopolymerization initiator (manufactured by Ciba Geigy Japan, trade name Irgacure 184) was added and mixed to prepare a radiation-curable pressure-sensitive adhesive A.

(Adhesive B)
25 parts by mass of a radiation curable compound (molecular weight 3,600, urethane acrylate oligomer having 10 carbon-carbon double bonds in one molecule) and 100 parts by mass of polymer A, 1-n-hexyl which is an ionic liquid 12 parts by mass of -4-methylpyridinium bis (trifluoromethanesulfonyl) imide, 2 parts by mass of a polyisocyanate compound (manufactured by Nippon Polyurethane Co., Ltd., trade name Coronate L), and a photopolymerization initiator (manufactured by Ciba Geigy Japan, trade name Irgacure 184) was added and mixed to prepare a radiation-curable pressure-sensitive adhesive B.

(Adhesive C)
30 parts by mass of a radiation-curable compound (molecular weight 1100, urethane acrylate oligomer having 6 carbon-carbon double bonds in one molecule) and 1-n-hexyl which is an ionic liquid with respect to 100 parts by mass of polymer B 5 parts by weight of -4-methylpyridinium bis (trifluoromethanesulfonyl) imide, 2 parts by weight of a polyisocyanate compound (trade name Coronate L, manufactured by Nippon Polyurethane Co., Ltd.), and a photopolymerization initiator (trade name, Irgacure, manufactured by Ciba Geigy Japan) 184) was added and mixed to prepare a radiation curable pressure-sensitive adhesive C.

(Adhesive D)
30 parts by mass of a radiation-curable compound (molecular weight 1100, urethane acrylate oligomer having 6 carbon-carbon double bonds in one molecule) and 1-n-hexyl which is an ionic liquid with respect to 100 parts by mass of polymer B 14 parts by mass of -4-methylpyridinium bis (trifluoromethanesulfonyl) imide, 2 parts by mass of a polyisocyanate compound (manufactured by Nippon Polyurethane, trade name Coronate L), and a photopolymerization initiator (manufactured by Ciba Geigy Japan, trade name Irgacure) 184) was added and mixed to prepare a radiation-curable pressure-sensitive adhesive D.

(Adhesive E)
30 parts by mass of a radiation-curable compound (molecular weight 1100, urethane acrylate oligomer having 6 carbon-carbon double bonds in one molecule) and 1-n-hexyl which is an ionic liquid with respect to 100 parts by mass of polymer B 14 parts by mass of -4-methylpyridinium hexafluorophosphate, 2 parts by mass of a polyisocyanate compound (manufactured by Nippon Polyurethane, trade name Coronate L), and a photopolymerization initiator (manufactured by Ciba Geigy Japan, trade name Irgacure 184) 0.5 mass part was added and mixed, and the radiation-curable adhesive E was prepared.

(Adhesive F)
25 parts by mass of a radiation curable compound (molecular weight 3600, urethane acrylate oligomer having 10 carbon-carbon double bonds in one molecule) with respect to 100 parts by mass of polymer A, polyisocyanate compound (manufactured by Nippon Polyurethane Co., Ltd., 0.5 mass parts by weight of 2 parts by mass of trade name Coronate L) and a photopolymerization initiator (product name: Irgacure 184, manufactured by Ciba Geigy Japan, Inc.) were added and mixed to prepare a radiation curable pressure-sensitive adhesive F.

(Adhesive G)
25 parts by mass of a radiation curable compound (molecular weight 3,600, urethane acrylate oligomer having 10 carbon-carbon double bonds in one molecule) and 100 parts by mass of polymer A, 1-n-hexyl which is an ionic liquid 4 parts by mass of -4-methylpyridinium bis (trifluoromethanesulfonyl) imide, 2 parts by mass of a polyisocyanate compound (manufactured by Nippon Polyurethane, trade name Coronate L), and a photopolymerization initiator (manufactured by Ciba Geigy Japan, trade name Irgacure) 184) was added and mixed to prepare a radiation curable pressure-sensitive adhesive G.

(Adhesive H)
30 parts by mass of a radiation curable compound (molecular weight 1,600, urethane acrylate oligomer having 6 carbon-carbon double bonds in one molecule) and 100 parts by mass of polymer B, 1-n-hexyl which is an ionic liquid 5 parts by mass of -4-methylpyridinium hexafluorophosphate, 2 parts by mass of a polyisocyanate compound (trade name Coronate L, manufactured by Nippon Polyurethane Co., Ltd.), and a photopolymerization initiator (trade name, Irgacure 184, manufactured by Ciba Geigy Japan) 0.5 mass part was added and mixed, and the radiation-curable adhesive H was prepared.

[Preparation of adhesive tape for semiconductor processing]
Each pressure-sensitive adhesive tape was prepared by applying each of the pressure-sensitive adhesives on the base resin film so that the thickness after drying was 20 μm.

[Evaluation]
Thus, each produced adhesive tape for semiconductor processing was evaluated as follows.

(1) Measurement of contact angle The surface where the adhesive layer of the base resin film was not provided was fixed on a glass plate having a flat surface using a double-sided tape. After the separator was peeled off, pure water was dropped, and the contact angle θ was measured using a FACE contact angle meter CA-S150 manufactured by Kyowa Chemical Co., Ltd. The measurement temperature is 23 ° C. and the measurement humidity is 50% RH.

(2) Evaluation of antistatic property Using a digital ultrahigh resistance / microammeter R8340 / 8340A and a resiliency chamber R12702A (both manufactured by Advantest Co., Ltd.), a voltage of 500 V was applied in an environment of 23 ° C. and 50% RH. Applied, the current value 60 seconds after the application was read, the surface resistivity of the pressure-sensitive adhesive surface of each obtained adhesive tape was measured, and evaluated according to the following criteria.

Evaluation criteria A: Surface resistivity is less than 1 × 10 ¹² Ω / □ ○: Surface resistivity is 1 × 10 ¹² Ω / □ or more and less than 5 × 10 ¹² Ω / □ Δ: Surface resistivity is 5 × 10 ¹² Ω / □ or more and less than 1 × 10 ¹³ Ω / □ ×: Surface resistivity is 1 × 10 ¹³ Ω / □ or more

(3) Evaluation of die fly A ring frame was bonded, and a batch sealed resin-sealed package having a width of 50 mm, a length of 150 mm, and a thickness of 500 μm was fixed to the center of the ring frame. Thereafter, dicing was performed under the conditions shown below, followed by washing and drying.

Dicing conditions Dicing machine: DFD-6340 manufactured by DISCO Corporation
Blade: Metal bond blade manufactured by DISCO Corporation
B1A801 SD320N100M42
56.5mm x 0.22mm x 40mm
Dicing size: 2mm square Blade rotation speed: 20000rpm
Cutting speed: 50 mm / s
Blade cooler water volume: 2L / min
Shower water volume: 1 L / min
Spray water volume: 1 L / min
Dicing size: 2mm square Blade height: 80μm
Cleaning time: 20s
Washing speed: 1800 rpm
Drying time: 20s
Dry tail rotation speed: 1800 rpm

Evaluation criteria ○: When there is no package scattering ×: When package scattering is observed

The results obtained are summarized in Table 1 below.
In the table below, 1-n-hexyl-4-methylpyridinium bis (trifluoromethanesulfonyl) imide of ionic liquid is changed to PyN ⁺ TFSI ⁻ , and 1-n-hexyl-4-methylpyridinium hexafluorophosphate is changed to PyN ⁺ PF _6. ^- .

From Table 1, Examples 1-5 which contain an ionic liquid, and the contact angle with respect to the pure water of an adhesive layer satisfy | fills 75 degrees or more and 120 degrees or less are all less than 5 * 10 < ¹² > ohm / square in anti-static performance. In the evaluation of the die fly, no scattering of the package was observed. On the other hand, as is clear from Comparative Example 1, even when the contact angle of the pressure-sensitive adhesive layer with respect to water is not less than 75 ° and not more than 120 °, if the ionic liquid is not contained, the antistatic performance is inferior. As can be seen from FIG. 3, on the contrary, even if the ionic liquid is contained, if the contact angle of the pressure-sensitive adhesive layer to the pure water is not 75 ° or more and 120 ° or less, the scattering of the package is observed in the evaluation of the die fly. It can be seen that the contact angle with respect to the pure water of the pressure-sensitive adhesive layer must be 75 ° or more and 120 ° or less.

DESCRIPTION OF SYMBOLS 1 Adhesive layer 2 Base resin film (base film)

Claims (3)

  A pressure-sensitive adhesive tape for semiconductor processing in which a pressure-sensitive adhesive layer is formed on at least one surface of a base resin film, wherein a contact angle of the pressure-sensitive adhesive layer with respect to pure water is 75 ° or more and 120 ° or less, and the pressure-sensitive adhesive layer An adhesive tape for semiconductor processing, comprising an ionic liquid.   The adhesive tape for semiconductor processing according to claim 1, wherein the adhesive tape for semiconductor processing contains a radiation curable compound having a carbon-carbon unsaturated bond.   The pressure-sensitive adhesive tape for semiconductor processing according to claim 1 or 2, wherein an anionic component of the ionic liquid of the ionic liquid is bis (fluorosulfonyl) imide or bis (trifluoromethanesulfonyl) imide.

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