JP2014239102A - Electronic control device and electronic control unit - Google Patents

Abstract

An electronic control device is provided that can easily perform a failure analysis without fear of damaging a substrate or an electronic circuit. A substrate 3 on which an electronic circuit 2 is formed, an electronic component 4 provided on the substrate 3 and connected to the electronic circuit 2, and a resin that covers the surface of the substrate 3 so as to seal the electronic component 4. In the electronic control device 1 including the covering member 5 made of the structure, a recess 1b extending from the surface of the through hole 1a or the covering member 5 to the substrate 3 is formed, and the electronic circuit 2 is exposed in the through hole 1a or the recess 1b. To do. [Selection] Figure 2

Description

  The present invention relates to an electronic control device mounted on an automobile, a railway vehicle, a ship, an aircraft, an agricultural machine, and the like, and an electronic control unit including the same.

  In recent automobiles, in addition to ECUs (Electronic Control Units) that drive and control engines, automatic transmissions, electric power steerings, etc., it also detects engine and vehicle operation information and sends detection signals to each ECU. A number of sensors for output are installed. In ECUs and some sensors, etc., a covering portion (for example, a resin) that seals electronic components to a substrate on which electronic components such as a microcomputer, ROM, and RAM are mounted on an electronic circuit for waterproofing, oil resistance, dustproofing, etc. Mold) may be provided.

  However, if electronic parts are sealed with resin or the like, even if a defect occurs in the electronic circuit part, it cannot be visually confirmed or inspected by electrical contact, making it difficult to determine the cause of the defect. Become. Therefore, in order to enable failure analysis of the electronic circuit part, a metal body for electrical inspection on the board is formed in a protruding shape with solder, and the metal body and electronic parts are sealed with resin for electronic control. There has been proposed an invention in which the metal body is exposed when the resin is cut or cut according to the marking by forming a marking indicating the position of the metal body on the outer surface of the resin that constitutes the apparatus (Patent) Reference 1).

Japanese Patent No. 4887163

  However, in the electronic control device of Patent Document 1, it is necessary to cut or cut the resin in order to perform failure analysis, which takes time and man-hours. In addition, there is a risk of damage to the board or electronic circuit when cutting or cutting the resin. If the board or electronic circuit is damaged, the electronic control unit cannot be reused, and failure analysis becomes impossible. turn into.

  The present invention has been made in view of such a background, and provides an electronic control device and an electronic control unit including the electronic control device that can easily perform failure analysis without fear of damaging a substrate or an electronic circuit. For the purpose.

  In order to solve such a problem, according to one aspect of the present invention, a substrate (3) on which an electronic circuit (2) is formed, and the substrate (3) are provided on the electronic circuit (2). Electronic control device (1) comprising an electronic component (4) to be connected and a covering member (5) made of a resin for covering the surface of the substrate (3) so as to seal the electronic component (4) And at least one of a through-hole (1a) and a hollow (1b) is formed, and it is set as the structure which the said electronic circuit (2) exposes to at least one of the said through-hole (1a) and the said hollow (1b).

  According to this configuration, since the depression or the through hole is formed on the surface of the electronic control device, the test pin is inserted into the depression or the through hole without contacting or cutting the covering member, thereby causing a problem. Analysis can be performed. This recess or through hole can also be used for pre-shipment testing of electronic control devices and writing to electronic components, so that testing and writing can be performed easily without mounting terminals or pads on the board for testing purposes. become.

  According to another aspect of the present invention, a conductive film (8) forming a part of the electronic circuit (2) is formed on the inner surface of the recess (1b) or the through hole (1a). It can be.

  According to this configuration, since the area of the electronic circuit exposed on the inner surface of the recess or the through hole can be increased, the inserted test pin can be easily brought into contact with the electronic circuit.

  In order to solve such a problem, according to one aspect of the present invention, an electronic device comprising the electronic control device (1) and a housing (22) that houses the electronic control device (1). The control unit (20), the edge connector (6) formed so as to be exposed from the covering member (5) at the edge of the substrate (3), and the electronic control unit (1) can be inserted. The edge connector (6) can be inserted into the opening (22a) formed in the casing (22) and the inside of the casing (22) on the side opposite to the opening (22a). The edge connector socket (23) and the edge connector socket (23) with the edge connector (6) inserted between the inner surface of the housing (22) and the outer surface of the electronic control unit (1) Waterproof structure formed on ( And the recess (1b) or the through hole (1a) with the edge connector (6) inserted into the edge connector socket (23). ) To the edge connector (6) side position.

  When the electronic control unit is installed in an engine room of an automobile, it is necessary to prevent moisture, oil, or dust from entering the inside of the through hole or the recess. The formed part can be reliably waterproofed.

  According to another aspect of the present invention, a groove (5b) is formed on an outer surface of the covering member (5), and the waterproof structure (7) is fitted into the groove (5b). It can be set as the structure attached to the control apparatus (1).

  According to this configuration, it is easy to visually confirm the waterproof structure when the electronic control device is removed while fixing the position of the waterproof structure. In addition, since the waterproof structure is attached to the electronic control device, even if the waterproof structure is displaced when the electronic control device is inserted into the housing, the waterproof structure is displaced in a direction away from the depression or the through hole. Or a through-hole does not become an outer side of a waterproof structure, and confirmation of the visual check is also easy.

  As described above, according to the present invention, it is possible to provide an electronic control device and an electronic control unit including the electronic control device that can easily perform a failure analysis without fear of damaging a substrate or an electronic circuit.

The top view of the electronic control unit concerning a 1st embodiment II-II sectional view in FIG. Sectional drawing which shows the manufacture state of the electronic control apparatus shown in FIG. Cross section of electronic control unit when test pin is inserted Sectional drawing of the electronic control unit which concerns on 1st Embodiment Sectional drawing of the electronic control apparatus which concerns on 2nd Embodiment The top view of the electronic control unit concerning a 3rd embodiment VIII-VIII sectional view in FIG. Sectional drawing of the principal part corresponding to FIG. 8 of the electronic controller which concerns on 4th Embodiment

  Hereinafter, several embodiments of the present invention will be described in detail with reference to the drawings.

<< First Embodiment >>
First, the electronic control device 1 and the electronic control unit 20 according to the first embodiment will be described with reference to FIGS. As shown in FIGS. 1 and 2, the electronic control device 1 includes an electronic circuit 2 formed on a substrate 3 having a substantially rectangular shape, and a CPU (Central Processing Unit) mounted on the surface (both sides here) of the substrate 3. And a covering member 5 made of a resin coated on the surface of the substrate 3 so as to seal the electronic component 4, and has a long rectangular parallelepiped shape along the extending surface of the substrate 3. ing.

  The electronic control device 1 controls, for example, a PGM-FI (Programmed Fuel Injection) ECU (Electronic Control Unit) that controls an electronically controlled fuel injection device of an automobile and a VSA (Vehicle Stability Assist system). It is used as a VSA control unit to perform, MICU (multiplex integrated control unit), etc., for example, installed in the engine room of a car.

  The substrate 3 is a resin substrate made of an insulating resin such as an epoxy resin or a polyimide resin, or a mixture of these with glass fiber. An electronic circuit 2 (wiring portion) made of copper foil or the like is formed on the surface of the substrate 3 as an external circuit layer, and an electronic component 4 is mounted so as to be connected to the electronic circuit 2. In the illustrated example, the electronic circuit 2 is formed on both main surfaces of the substrate 3 through through holes (not shown) provided on the substrate 3, and the electronic component 4 is also mounted on both main surfaces of the substrate 3.

  As the substrate 3, for example, a metal core substrate including a flat core metal layer made of a metal such as aluminum, copper, iron, or magnesium, or a ceramic substrate including a layer made of ceramic may be used. By using the metal core substrate or the ceramic substrate, the core metal layer or the ceramic layer functions as a high thermal conductive layer and heat is diffused, so that the temperature rise of the electronic component 4 can be suppressed.

  A plurality of electrodes 2a (terminals) constituting the end of the electronic circuit 2 are formed on one edge (one side) of the substrate 3, and this edge constitutes an edge connector 6 (card edge connector). . In the present embodiment, the electrodes 2 a are formed on both main surfaces of the substrate 3. The covering member 5 is provided so that the edge connector 6 on which these electrodes 2a are formed is exposed and the entire surface of the other part is covered.

  The electronic circuit 2 may be formed in such a manner that a pattern is directly formed on the surface of the substrate 3 by screen printing or the like, and the circuit layer formed on the entire surface of the substrate 3 is selectively removed by etching or the like to form a pattern. It may be formed in a manner. Further, a solder resist layer (not shown) may be formed further outside the electronic circuit 2.

  The covering member 5 is made of a resin having a small coefficient of thermal expansion, insulation, and excellent heat resistance, moisture resistance, and oil resistance. As the covering member 5, for example, polyamide or polyethylene can be used. From the viewpoint of ease of manufacture, it is preferable to use a thermoplastic resin as the covering member 5, but a thermosetting resin may be used as the covering member 5.

  An annular sealing member 7 having flexibility is attached to the side opposite to the edge connector 6 side of the covering member 5 so as to surround the covering member 5. The seal member 7 is provided so as to protrude from the outer surface of the covering member 5, and forms a waterproof structure that ensures the waterproofness of the electronic control device 1 in cooperation with a casing 22 described later. An annular groove 5b having the same width as the seal member 7 is formed on the surface of the covering member 5, and the seal member 7 is provided so as to be fitted into the annular groove 5b. The seal member 7 may be bonded to the covering member 5.

  At a position closer to the edge connector 6 than the seal member 7 of the electronic control device 1, a circular cross section extending from one main surface of the covering member 5 to the other main surface in a manner of penetrating the covering member 5 and the substrate 3 at a right angle. A plurality of (here, eight) through holes 1a are formed. Each through-hole 1a is comprised from the through-hole 3a formed in the board | substrate 3, and the through-hole 5a formed in the coating | coated member 5 so that it may have the same diameter as this, and it may be continuing coaxially on both sides of this through-hole 3a. A conductive film 8 is formed on the inner surface of the through hole 3 a of the substrate 3. The conductive film 8 is connected to a portion formed on the surface of the substrate 3 of the electronic circuit 2 and is a part of the electronic circuit 2.

  Next, a manufacturing method of the electronic control device 1 configured as described above will be described. First, a substrate 3 on which an electronic circuit 2 is formed is prepared. In the electronic circuit 2, a portion formed on the main surface of the substrate 3 forms a conductive pattern by screen printing or etching as described above, and the conductive film 8 on the inner surface of the through hole 3 a is similar to the through hole. For example, a metal layer such as copper may be formed on the wall surface of the hole by electroless plating. Next, the electronic component 4 is attached to the substrate 3 so as to be connected to the electronic circuit 2.

  The substrate 3 formed in this way is set in a mold 11 for forming the covering member 5 as shown in FIG. The mold 11 is for resin injection by a pair of molding recesses 11a by clamping a pair of mold plates (respectively referred to as an upper mold 11U and a lower mold 11L) each having a molding recess 11a. A space 12 is formed. The upper mold 11U and the lower mold 11L are each formed with a clamping portion 13 that clamps the substrate 3 when the mold is clamped to hold the substrate 3.

  The substrate 3 is held by the pair of holding portions 13 so that the portion disposed in the resin injection space 12 of the substrate 3 and the electronic component 4 are not in contact with the mold 11. A resin injection hole 14 is formed in the upper mold 11U, and a pin insertion hole 15 is formed in the lower mold 11L at a position corresponding to the through hole 3a of the substrate 3. Eight pins 16 are inserted into the pin insertion holes 15, and these eight pins 16 are inserted and fixed to the position reaching the upper mold 11 </ b> U through the through holes 3 a of the substrate 3.

  In addition, in order to fix the position of the board | substrate 3, especially the vertical direction position of the part far from the clamping part 13, you may use the pin 17 for position fixing as shown by an imaginary line. Such pins 17 may be configured to be pushed out of the resin injection space 12 by the resin injection pressure so that the entire surface of the substrate 3 disposed in the resin injection space 12 is covered with the covering member 5.

  With the substrate 3 held in the mold 11 in this way, the molten resin is injected from the resin injection hole 14 by the injection molding machine and filled into the resin injection space 12, and the resin is supplied while maintaining the injection pressure. Harden. Thereby, the covering member 5 which covers the surface of the substrate 3 so as to enclose the electronic component 4 is formed. If a thermoplastic resin is used, the mold 11 may be cooled to cure (solidify) the resin. If a thermosetting resin is used, the mold 11 is heated. What is necessary is just to harden resin.

  After the resin is cured, the eight pins 16 are removed, the mold 11 is opened, and the mold is released using an appropriate release mechanism such as an ejector mechanism, whereby the through hole 1a is formed and the edge connector 6 is formed. As a result, the electronic control device 1 having the above-described configuration is exposed.

  As described above, the conductive film 8 forming a part of the electronic circuit 2 is exposed on the inner surface of the through-hole 1a of the electronic control device 1. Therefore, as shown in FIG. 4, a test pin 18 can be inserted into the through-hole 1a and brought into contact with the conductive film 8, and an operation check test can be performed after the electronic control device 1 is manufactured (after the covering member 5 is formed). Writing to the electronic component 4 can be performed. Here, a banana plug provided with elastic pieces in all directions is used as the test pin 18, and the elastic pieces are in contact with the conductive film 8 with a wide area. As a result, stress is not generated in the conductive film 8 compared to a mere rod-shaped pin whose only tip contacts the conductive film 8, and damage to the conductive film 8 is prevented. Further, since the electronic control device 1 is formed with the through hole 1a through which the conductive film 8 is exposed on the inner surface, the test pin 18 is brought into contact with the conductive film 8 even when a failure occurs in the electronic control device 1 during use. Failure analysis. Further, since the conductive film 8 is formed in the through hole 1a, the area of the electronic circuit 2 exposed on the inner surface of the through hole 1a is increased, and the inserted test pin 18 can be easily brought into contact with the electronic circuit 2. Can do.

  FIG. 5 shows a cross section of an electronic control unit 20 using the electronic control device 1. The electronic control unit 20 includes an electronic control device 1 and a housing 22 that houses the electronic control device 1. The casing 22 has a rectangular parallelepiped box shape, and an open portion 22a for inserting the electronic control device 1 is formed on one surface. The open portion 22a is formed so as to remove one entire surface of the housing 22, and thereby the inner wall surface 22b and the internal space of the housing 22 have the same cross-sectional shape in the depth direction from the open portion 22a. It is supposed to present. An edge connector socket 23 into which the edge connector 6 of the electronic control device 1 inserted from the opening 22a is inserted is provided inside the housing 22 on the side opposite to the opening 22a.

  The edge connector socket 23 includes a pair of wall portions 24 that define a recess that opens toward the open portion 22a, and an electrode 26 (including a metal piece attached to the inner surfaces of the pair of wall portions 24 so as to face each other. Terminal). Each electrode 26 has a curved shape protruding toward the inside of the recess, and elastically holds the electrode 2a of the electronic circuit 2 when the edge connector 6 is inserted into the recess. Each electrode 26 extends through the housing 22 to the outer surface of the housing 22, and an electric wire 27 constituting a harness is connected to an outer portion of the housing 22 of each electrode 26.

  When the electronic control device 1 is pushed to the position where the edge connector 6 is inserted into the edge connector socket 23, the housing 22 has a length (the length in the depth direction from the opening portion 22a) at which the seal member 7 is located. It is said that. The casing 22 is set such that the cross-sectional dimension of the inner wall surface 22b orthogonal to the depth direction from the opening 22a is larger than the covering member 5 of the electronic control device 1 and slightly smaller than the sealing member 7. Yes. As a result, when the electronic control device 1 is inserted into the housing 22 and the edge connector 6 is inserted into the edge connector socket 23, the seal member 7 comes into contact with the inner wall surface 22b of the housing 22 over the entire periphery. 1 (connector portion) functions as a waterproof structure that ensures waterproofness, and the electronic control device 1 can be installed in the engine room.

  Since the electronic control device 1 can be easily removed from the housing 22 even after it is installed in the engine room, the electronic control device 1 is removed from the housing 22 when performing failure analysis or the like, as described above. The failure analysis can be performed by bringing the test pin 18 into contact with the conductive film 8.

  Further, since the seal member 7 is attached to the covering member 5 so that a part thereof is accommodated in the annular groove 5b, the seal member 7 can be easily aligned and fixed. Further, since the seal member 7 is attached to the electronic control device 1 side, the seal member 7 moves away from the through hole 1a even if the seal member 7 is displaced when the electronic control device 1 is inserted into the housing 22. Since it shifts in the direction, the through-hole 1a does not become outside the seal member 7, and it is easy to check the shift visually.

<< Second Embodiment >>
Next, the electronic control device 1 according to the second embodiment will be described with reference to FIG. In addition, the same code | symbol is attached | subjected to the element which is the same or the same as that of 1st Embodiment, or a function, and the overlapping description is abbreviate | omitted. The same applies to the third embodiment.

  In the electronic control device 1 of the present embodiment, a recess 1b is formed in the covering member 5 instead of the through hole 1a formed in the first embodiment. The recess 1b is formed so as to reach the substrate 3 from the surface of the covering member 5, and the electronic circuit 2 is exposed on the bottom surface of the recess 1b. In the illustrated example, the recess 1b is formed on both main surfaces of the electronic control unit 1, but may be formed only on one main surface.

  When forming such a recess 1b, the pin insertion hole 15 shown in FIG. 3 is also formed on the upper die 11U side, and eight pins 16 are provided on both the lower die 11L and the upper die 11U. The tip of the pin 16 is set so as to contact the electronic circuit 2 formed on the substrate 3. In this state, resin may be injected from the resin injection hole 14 to fill the resin injection space 12. In the case where the recess 1b is formed only on one main surface, the pin 16 to be brought into contact with the electronic circuit 2 may be provided on the lower mold 11L or the upper mold 11U.

  Even if the electronic control device 1 is configured in this way, the test pin 18 can be inserted into the recess 1b and brought into contact with the electronic circuit 2, and the failure analysis of the electronic control device 1 can be easily performed.

«Third embodiment»
Furthermore, the electronic control unit 1 according to the third embodiment will be described with reference to FIGS. 7 and 8. In this embodiment, the through-hole 1a is formed in the position different from 1st and 2nd embodiment. Specifically, the through hole 1 a is formed along the edge of the portion of the substrate 3 covered with the covering member 5, and penetrates only the covering member 5. On the other hand, a semicircular recess 3b corresponding to the outline of the through hole 1a is formed at the edge of the substrate 3, and a conductive film 8 is formed on the inner surface of the recess 3b (side surface of the substrate 3). The hole 1a is formed so that the conductive film 8 is exposed.

  Thus, even if the through hole 1a is provided in a manner not penetrating the substrate 3, the test pin 18 can be inserted into the through hole 1a and brought into contact with the exposed conductive film 8, and failure analysis of the electronic control device 1 can be performed. Can be easily performed.

<< Fourth Embodiment >>
FIG. 9 is a cross-sectional view of an essential part of the electronic control device 1 according to the fourth embodiment, and corresponds to FIG. 8 of the third embodiment. In the present embodiment, the recess 1 b is formed in a notch shape in the ridge line portion of the covering member 5, and the conductive film 8 formed on the side surface of the substrate 3 is exposed. The shape of the recess 1b is not limited to that indicated by the solid line in FIG. 9, but is formed in a cutout shape on the side surface of the covering member 5 in such a manner as to vertically penetrate the covering member 5 as indicated by the imaginary line in FIG. May be. Even if the depression 1b is configured in this way, the same effects as those of the other embodiments performed in the previous operation can be obtained.

  Although the description of the specific embodiment is finished as described above, the present invention is not limited to the above embodiment and can be widely modified. For example, in the above-described embodiment, the electronic control device 1 and the electronic control unit 20 are described as in-vehicle use as an example. However, the present invention can be widely applied to railway vehicles, airplanes, and the like. Moreover, the said embodiment is combinable. For example, in the above embodiment, the electronic control device 1 is configured to include one of the through hole 1a and the recess 1b. However, the electronic control device 1 may include both the through hole 1a and the recess 1b. Moreover, in the said embodiment, although the sealing member 7 is attached to the annular groove 5b formed in the coating | coated member 5, a groove | channel may be formed in the inner surface of the housing | casing 22 and the sealing member 7 may be attached to the housing | casing 22 side. . In addition, the specific configuration of the electronic circuit 2, the substrate 3, the electronic component 4, the covering member 5, and the like, the material, the arrangement, the quantity, the angle, and the like can be changed as appropriate without departing from the spirit of the present invention. On the other hand, all the components of the electronic control device 1 and the electronic control unit 20 shown in the above embodiment are not necessarily essential, and can be appropriately selected.

DESCRIPTION OF SYMBOLS 1 Electronic control apparatus 1a Through-hole 1b Indentation 2 Electronic circuit 3 Board | substrate 4 Electronic component 5 Cover member 5b Annular groove 6 Edge connector 7 Seal member (waterproof structure)
8 Conductive film 20 Electronic control unit 22 Case 22a Open part 23 Edge connector socket

Claims (4)

A substrate on which an electronic circuit is formed;
An electronic component provided on the substrate and connected to the electronic circuit;
An electronic control device comprising a covering member made of a resin that covers the surface of the substrate so as to seal the electronic component,
At least one of a through hole and a depression is formed,
The electronic control device according to claim 1, wherein the electronic circuit is exposed in at least one of the through hole and the recess.   The electronic control device according to claim 1, wherein a conductive film that forms a part of the electronic circuit is formed on at least a part of an inner surface of at least one of the through hole and the recess. An electronic control unit comprising: the electronic control device according to claim 1 or claim 2; and a housing that houses the electronic control device.
An edge connector formed to be exposed from the covering member at an edge of the substrate;
An opening formed in the housing so that the electronic control device can be inserted;
An edge connector socket formed so that the edge connector can be inserted into the inside of the housing on the side opposite to the open portion;
A waterproof structure formed between the inner surface of the housing and the outer surface of the electronic control unit in a state where the edge connector is inserted into the edge connector socket;
The electronic control unit, wherein the recess or the through hole is disposed at a position closer to the edge connector than the waterproof structure in a state where the edge connector is inserted into the edge connector socket. A groove is formed on the outer surface of the covering member,
The electronic control unit according to claim 3, wherein the waterproof structure is attached to the electronic control device so as to fit in the groove.

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