JP2014225390A - Connector - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a connector capable of detachably attaching a housing to circuit substrates of various thickness without rattling.SOLUTION: A connector includes: a housing 25; a plurality of contacts 20 which can be mounted on a circuit substrate CB1 fixed to the housing, and can be contacted with a thin-plate connection object inserted in a storing space; an attaching hole CB1a made from a through hole formed on the circuit substrate; an attaching arm 32 formed on the housing, capable of projecting out from one surface side to the other surface side of the circuit substrate by penetrating the attaching hole, and capable of elastically deforming; and a coming-off preventive projecting portion 33 protrusively provided on the attaching arm, and opposing to the other surface when the attaching arm penetrates the attaching hole. On an opposite surface to the other surface of the coming-off preventive projecting portion, a plurality of engaging protrusions 34 and 35 selectively engaged with the other surface when the attaching arm penetrates the attaching hole while the housing is contacted with the one surface, and having different projecting amount to the other surface side are formed.

Description

  The present invention relates to a connector.

In general, a connector to which an IC card can be connected is attached to one surface of a circuit board to form a housing space between the one surface and a plurality of contacts (pins) fixed to the housing. And. Each contact is mounted on a circuit pattern on a circuit board by soldering (for example, Patent Document 1).
When the IC card is inserted into the storage space formed between the circuit board and the housing, the terminals of the IC card are connected to the contacts, so that the IC card and the circuit board are electrically connected through the contacts.

The housing can be fixed to the circuit board by various methods (means).
As an example, there is one using an attachment hole formed of a through hole formed in a circuit board and an elastically deformable attachment arm provided in a housing. A tip of the mounting arm is provided with a retaining protrusion that faces the other surface when the mounting arm passes through the mounting hole from one surface side of the circuit board to the other surface side.
When the mounting arm is inserted into the mounting hole while the housing is in contact with one surface of the circuit board, the retaining protrusion provided on the mounting arm engages with the other surface of the circuit board. Can be attached without rattling.
In addition, after the housing is mounted on the circuit board, the housing is separated from the circuit board by pulling the mounting arm and the retaining protrusion to one side of the circuit board through the mounting hole while elastically deforming the mounting arm. Is possible.
Thus, if the mounting structure using the mounting hole formed of the through hole formed in the circuit board and the elastically deformable mounting arm formed in the housing is used, the housing can be detachably mounted on the circuit board. it can.

JP-A-8-203607 JP-A-8-315934

There are various types of circuit boards, and their thicknesses vary.
Therefore, when the mounting structure is used, it is possible to attach the housing to the circuit board (thick circuit board) having a specific thickness without rattling, but another circuit board (thinner than the thick circuit board) ( When the housing is attached to the thin circuit board, a gap is formed between the retaining protrusion and the thin circuit board (the other surface), so that the housing rattles the thin circuit board.

  An object of the present invention is to provide a connector that can be detachably attached to a circuit board having various thicknesses without rattling.

  The connector of the present invention can be mounted on the circuit board fixed to the housing by forming a housing space between the one surface of the circuit board by contacting with the one surface of the circuit board. And a plurality of contacts that can come into contact with the thin plate-like connection object inserted into the storage space, a mounting hole formed of a through hole formed in the circuit board, and the one surface side formed in the housing. An attachment arm that penetrates the attachment hole and can project to the other surface side of the circuit board and can be elastically deformed, and the other arm that protrudes from the attachment arm and passes through the attachment hole. A retaining protrusion facing the surface, and the mounting arm penetrates the mounting hole in a state where the housing is in contact with the one surface on the surface facing the other surface of the retaining protrusion. When It is characterized in that the selectively engages against the other face, and protruding amount to the other surface forms a plurality of different engagement projections mutually.

  The engagement protrusions are arranged along a linear direction connecting the distal end and the base end of the retaining protrusion, and the amount of protrusion of the engagement protrusion toward the other surface is determined from that positioned on the distal end side. You may enlarge what is located in the said base end side.

  A pair of mounting holes may be provided in the circuit board, and a pair of mounting arms may be provided in the housing.

  The housing may include an insulator that supports the contact, and a cover member that is separate from the insulator and includes the mounting arm.

  An attachment hole engagement surface that engages with the peripheral edge of the attachment hole when any of the engagement protrusions engages with the other surface may be formed on the retaining protrusion. .

In the present invention, when the mounting arm is inserted into the mounting hole in a state where the housing is in contact with one surface of a thick circuit board (hereinafter referred to as a thick circuit board), the retaining protrusion provided on the mounting arm is a thick plate. One of the engaging protrusions (thick plate engaging protrusions) facing the other surface of the circuit board and provided at the retaining protrusion engages with the other surface of the circuit board. Therefore, the housing can be attached to the thick circuit board without rattling (in the thickness direction of the thick circuit board).
Further, when the mounting arm is inserted into the mounting hole of the thin circuit board in a state where the housing is in contact with one surface of another circuit board (hereinafter referred to as a thin circuit board) thinner than the thick circuit board, the mounting arm is provided. An engaging protrusion (thin plate engaging protrusion) different from the thick plate engaging protrusion engages with the other surface of the circuit board. Therefore, it is possible to attach the housing to the thin circuit board without rattling.
In addition, after the housing is attached to the circuit board, the housing is separated from the circuit board by pulling the mounting arm and the retaining protrusion to one side of the circuit board through the mounting hole while elastically deforming the mounting arm. It is possible.

It is the disassembled perspective view seen from back diagonally upward which shows the connector for IC cards and thick board circuit board of one Embodiment of this invention. It is the disassembled perspective view seen from the front diagonally upper direction which shows the connector for IC cards, and a thick board circuit board. It is the perspective view seen from the front diagonal upper direction which shows the assembly body of a thick circuit board and an insulator, and the cover member spaced apart upward from this assembly body. It is the perspective view seen from the assembly | attachment body of the thick board circuit board and the connector for IC cards, and the back diagonally upward of an IC card. It is a front view of an IC card. It is sectional drawing cut | disconnected in the position which passes along an attachment arm which shows a part of housing which spaced apart upward from the assembly | attachment body of a thick board circuit board and an insulator. It is sectional drawing corresponding to FIG. 6 when a housing is mounted | worn with a thick circuit board. It is an enlarged view of the VIII part of FIG. It is sectional drawing corresponding to FIG. 8 when a housing is mounted | worn with a thin-plate circuit board.

Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. In the following description, front and rear, left and right, and up and down directions are based on the directions of arrows in the figure.
The IC card connector 10 (connector) of the present embodiment is a connector that can be selectively attached to the thick circuit board CB1 and the thin circuit board CB2. The insulator 15, the contact 20, and the cover member 25 are large components. It has.

The insulator 15 (housing) is formed by injection molding an insulating and heat-resistant synthetic resin material. The insulator 15 includes a contact support portion 16 extending in the left-right direction and a pair of card support portions 17 extending rearward from both left and right ends of the contact support portion 16. A rear end is provided on the inner surface of the left and right card support portions 17. A card insertion groove 18 that is open and extends in the front-rear direction is recessed.
The multiple (plurality) of contacts 20 (contact pins) have a shape shown in the drawing using a progressive die (stamping) of a thin plate of a copper alloy (for example, phosphor bronze, beryllium copper, titanium copper) or a Corson copper alloy having spring elasticity. It is formed by processing. The entire surface of each contact 20 is plated with Sn (tin) -Cu (copper) after a base is formed by nickel plating. Each contact 20 is substantially L-shaped in side view. That is, each contact 20 includes a connection piece 21 that penetrates the contact support portion 16 in the front-rear direction and is supported by the contact support portion 16 in a fixed state, and a tail piece 22 that extends downward from the front end of the connection piece 21. doing.

The insulator 15 integrated with the contact 20 can be mounted on the upper surface (one surface) of the thick circuit board CB1 and the thin circuit board CB2 which are rigid boards. The thick circuit board CB1 is a board having a large thickness (vertical dimension), and the thin board circuit board CB2 is a board having a smaller thickness than the thick circuit board CB1. A circuit pattern (not shown) is formed on the upper surfaces of the thick circuit board CB1 and the thin circuit board CB2, and a pair of left and right mounting holes CB1a and CB2a are formed on the upper surfaces of the thick circuit board CB1 and the thin circuit board CB2. Are formed as through holes. The left-right direction distance between the left and right mounting holes CB1a and the left-right direction distance between the left and right mounting holes CB2a are the same.
In order to mount the insulator 15 integrated with the contact 20 on the upper surface of the thick circuit board CB1, first, the upper surface of the insulator 15 is sucked by suction means (not shown) located above the insulator 15. Next, by moving the suction means, the lower surface of the insulator 15 (contact support portion 16, card support portion 17) is brought into contact with the upper surface of the thick plate circuit board CB1, and the tail piece 22 of each contact 20 is further connected to the thick plate circuit. It puts on the solder paste apply | coated to the circuit pattern of board | substrate CB1. When each solder paste is heated and melted in a reflow furnace and each tail piece 22 is soldered to the circuit pattern, the mounting of the insulator 15 on the thick circuit board CB1 is completed.
The insulator 15 integrated with the contact 20 can be mounted on the upper surface of the thin circuit board CB2 in the same manner as the mounting process on the thick circuit board CB1.

The cover member 25 (housing) is formed by injection molding an insulating synthetic resin material.
The cover member 25 includes a pair of left and right side surface protection portions 26 extending in the front-rear direction, a top surface protection portion 29 extending in the left-right direction connecting the upper edges of the front end portions of the left and right side surface protection portions 26, and the left and right side surface protection portions 26. Left and right lower surface protection portions 30 extending in the left-right direction connecting the lower edges of the rear end portions, and left and right sides hanging from the left and right end portions of the front edge portion of the upper surface protection portion 29 and connected to the front end portions of the left and right side surface protection portions 26 A pair of front surface protection portions 31 and a pair of left and right attachment arms 32 extending downward from the outer surfaces of the left and right side surface protection portions 26 are integrally provided. On the inner surfaces of the left and right side surface protection portions 26, card support protrusions 27 protruding inward are formed. The card support protrusion 27 extends in the front-rear direction. The front and rear positions of the front end face of the card support protrusion 27 are substantially the same as the rear end face of the upper surface protection part 29, and the front and rear positions of the rear end face of the card support protrusion 27 are the same position as the rear end face of the side face protection part 26. . Further, on the inner surfaces of the left and right card support protrusions 27, card insertion grooves 28 that are open at both front and rear ends and extend in the front-rear direction are recessed.
The base end portions (upper end portions) of the left and right mounting arms 32 are integrated with the outer surfaces of the left and right side surface protection portions 26, and the lower ends of the left and right mounting arms 32 extend below the lower surface of the side surface protection portion 26. The mounting arm 32 can be elastically deformed in the left-right direction with the base end portion of the mounting arm 32 as a center. At the lower end portion of each mounting arm 32, a retaining projection 33 protruding toward the outside (the right mounting arm 32 is on the right side and the left mounting arm 32 is on the left side) projects. Further, a first engagement projection 34 and a second engagement projection 35 are both projected upward on the upper surface of the retaining projection 33. The first engagement protrusion 34 and the second engagement protrusion 35 are arranged along the left-right direction (a linear direction connecting the distal end and the proximal end of the retaining protrusion 33). It is closer to the base end side (lower end side of the mounting arm 32) of the retaining projection 33 than the first engagement protrusion 34 located on the distal end side (opposite side of the lower end of the mounting arm 32) of the retaining protrusion 33. The amount of upward protrusion of the second engaging protrusion 35 located is larger. Further, the upper surfaces of the first engagement protrusion 34 and the second engagement protrusion 35 are constituted by planes substantially parallel to each other. Further, between the upper surface of the second engagement protrusion 35 and the upper surface of the first engagement protrusion 34, a first inclined surface 36 that is inclined with respect to the upper surface of the second engagement protrusion 35 and the upper surface of the first engagement protrusion 34. (Attachment surface for attachment hole) is formed, and a second inclined surface 37 (attachment) that is inclined with respect to the upper surface of the second engagement protrusion 35 between the upper surface of the second engagement protrusion 35 and the attachment arm 32. Hole engagement surface) is formed.

The cover member 25 can be mounted on the upper surface (one surface) of the thick circuit board CB1 and the thin circuit board CB2 on which the insulator 15 is mounted.
For example, in order to mount the cover member 25 on the upper surface of the thick circuit board CB1 on which the insulator 15 is mounted, the front portions of the left and right side surface protection portions 26, the upper surface protection portion 29, and the left and right front surface protection portions 31 are used. The retaining protrusions 33 cover the outer surfaces of the left and right card support portions 17, the upper surfaces of the contact support portion 16 and the card support portion 17, and the left and right end portions of the front surface of the contact support portion 16, respectively. The left and right mounting arms 32 are inserted (penetrated) into the mounting holes CB1a until they are positioned on the side, and the lower surface of the side surface protection part 26 is brought into contact with the upper surface of the thick circuit board CB1. Then, the front end surfaces of the left and right card support protrusions 27 face the rear end surfaces of the left and right card support portions 17, and the rear end portion of the card insertion groove 18 and the front end portion of the card insertion groove 28 communicate with each other as shown in FIG. To do.
When the left and right mounting arms 32 are in a free state, the distance in the left-right direction between the distal ends of the left and right retaining projections 33 is the outer edge of the left and right mounting holes CB1a (the right edge of the right mounting hole CB1a, the left Slightly longer than the distance in the left-right direction between the left side edge of the mounting hole CB1a. For this reason, when the lower end portions (retaining protrusions 33) of the left and right mounting arms 32 are positioned on the lower surface side of the thick circuit board CB1 through the mounting holes CB1a, the operator uses their hands or the like to move the left and right mounting arms 32. The lower end portions (the retaining projections 33) of the left and right mounting arms 32 are inserted (penetrated) into the respective mounting holes CB1a while the left and right mounting arms 32 are elastically deformed in a direction approaching each other.
If the force applied to the left and right mounting arms 32 after the left and right retaining projections 33 pass through the mounting holes CB1a and are positioned on the lower surface side of the thick circuit board CB1 is removed, the left and right mounting arms 32 move away from each other. Since it is elastically deformed (will return to the free state), as shown in FIGS. 7 and 8, the upper surface of the first engagement protrusion 34 of the left and right retaining protrusions 33 is formed on the lower surface of the thick circuit board CB1 from below. Further, the first inclined surface 36 comes into contact with the opening edge on the lower end side of the mounting hole CB1a.
As described above, the lower surface of the side surface protection portion 26 of the cover member 25 is in contact with the upper surface of the thick circuit board CB1, and the upper surfaces of the first engagement protrusions 34 of the left and right retaining protrusions 33 are the lower surface of the thick circuit board CB1. The cover member 25 can be attached to the thick circuit board CB1 in the vertical direction (in the thickness direction of the thick circuit board CB1) without rattling.
Further, even after the cover member 25 is attached to the thick circuit board CB1, the left and right attachment arms 32 are elastically deformed in a direction approaching each other (the state does not return to the free state, and the left and right attachment arms 32 face outward). And the left and right first inclined surfaces 36 abut against the opening edge (outer edge) on the lower end side of the corresponding mounting hole CB1a, so that the thick circuit board CB1 of the cover member 25 The backlash in the horizontal direction with respect to can also be regulated. In addition, after attaching the cover member 25 to the thick circuit board CB1, the left and right attachment arms 32 are in a free state. In this state, the left and right first inclined surfaces 36 are open edge portions (outer sides) on the lower end side of the attachment holes CB1a corresponding to the left and right attachment surfaces You may make it contact | abut to an edge part. Also in this case, it is possible to regulate the backlash of the cover member 25 in the left-right direction with respect to the thick circuit board CB1.

When the IC card connector 10 is attached to the thick circuit board CB1 in this way, a storage space 38 whose rear surface is open is formed between the upper surface of the thick circuit board CB1 and the cover member 25.
An IC card 40 (for example, a PCMCIA card) (an object to be connected) can be detachably inserted into the storage space 38 from the rear end of the storage space 38.
The IC card 40 has a substantially rectangular shape in plan view, and guide ridges 41 having a vertical dimension smaller than the thickness of the IC card 40 are provided on both left and right side surfaces. Further, a large number (the same number as the contacts 20) of connection holes 42 are formed on the front end surface of the IC card 40. Inside each connection hole 42, a terminal (not shown) connected to the internal circuit of the IC card 40 is provided.
When the IC card 40 is inserted into the storage space 38 from the rear end of the storage space 38, a pair of left and right guide grooves 39 (see FIG. 7) formed by the lower and side surfaces of the card insertion groove 28 and the upper surface of the card insertion groove 18. On the other hand, the left and right guide protrusions 41 of the IC card 40 are slidably fitted. When the IC card 40 is completely inserted into the storage space 38, the rear end portion of the connection piece 21 of each contact 20 is fitted from the front into each connection hole 42 of the IC card 40, and The rear end is connected to each terminal of the IC card 40. Therefore, the circuit pattern of the IC card 40 (internal circuit thereof) and the thick circuit board CB1 is electrically connected via each contact 20.

The IC card 40 connected to the IC card connector 10 can be pulled out of the IC card connector 10 by sliding backward relative to the IC card connector 10 and the thick circuit board CB1.
Further, the cover member 25 attached to the thick circuit board CB1 has the lower ends (the retaining projections 33) of the left and right mounting arms 32 while elastically deforming the left and right mounting arms 32 in a direction approaching each other by hand. By pulling out to the upper surface side of the thick circuit board CB1 through each mounting hole CB1a, it is possible to remove from the thick circuit board CB1.

The cover member 25 can also be mounted on the upper surface of the thin circuit board CB2 on which the insulator 15 is mounted.
Also in this case, the front surfaces of the left and right side surface protection portions 26, the upper surface protection portion 29, and the left and right front surface protection portions 31, the outer surfaces of the left and right card support portions 17, the upper surfaces of the contact support portions 16 and the card support portions 17, and contacts. The left and right attachment arms 32 are inserted (penetrated) into the attachment holes CB2a until the retaining protrusions 33 are positioned on the lower surface side of the thin circuit board CB2, while covering the left and right ends of the front surface of the support portion 16, respectively, and side protection The lower surface of the part 26 is brought into contact with the upper surface of the thin circuit board CB2.
In this case as well, as in the case of mounting on the thick circuit board CB1, the operator applies a force to the left and right mounting arms 32 by hand or the like, and elastically deforms the left and right mounting arms 32 in a direction approaching each other. However, the lower end portions (the retaining projections 33) of the left and right mounting arms 32 are inserted (penetrated) into the respective mounting holes CB2a.
If the force applied to the left and right mounting arms 32 after the left and right retaining projections 33 pass through the mounting holes CB2a and are positioned on the lower surface side of the thin circuit board CB2 is removed, the left and right mounting arms 32 are elastic in the direction away from each other. As shown in FIG. 9, the upper surface of the second engagement protrusion 35 of the left and right retaining protrusions 33 engages with the lower surface of the thin circuit board CB2 from below as shown in FIG. The second inclined surface 37 contacts the opening edge on the lower end side of the attachment hole CB2a.
In this way, the lower surface of the side surface protection portion 26 of the cover member 25 is in contact with the upper surface of the thin circuit board CB2, and the upper surface of the second engagement protrusion 35 of the left and right retaining protrusions 33 is below the lower surface of the thin circuit board CB2. Therefore, the cover member 25 can be attached to the thin circuit board CB2 in the vertical direction (in the thickness direction of the thin circuit board CB2) without rattling.
Further, even after the cover member 25 is attached to the thin circuit board CB2, the left and right attachment arms 32 are elastically deformed in a direction approaching each other (from a free state than when the cover member 25 is attached to the thick circuit board CB1). And the left and right second inclined surfaces 37 abut against the opening edge (outer edge) on the lower end side of the corresponding mounting hole CB2a, so that the cover member 25 is horizontally oriented with respect to the thin circuit board CB2. You can also regulate the backlash. As in the case of attachment to the thick circuit board CB1, the left and right attachment arms 32 may be in a free state after the cover member 25 is attached to the thin circuit board CB2.
The IC card 40 can be removably inserted into the storage space 38 formed in the upper surface of the thin circuit board CB2 and the cover member 25 (the connection piece 21 of each contact 20 can be connected to the terminal of the IC card 40). is there).
Further, the cover member 25 attached to the thin circuit board CB2 has the lower end portions (the retaining projections 33) of the left and right mounting arms 32 being elastically deformed in the direction in which the left and right mounting arms 32 approach each other by hand or the like. By pulling out to the upper surface side of the thin circuit board CB2 through the attachment hole CB2a, it is possible to remove from the thin circuit board CB2.

As mentioned above, although this invention was demonstrated based on the said embodiment, this invention is not limited to said each embodiment, It can implement, giving various deformation | transformation.
For example, the number of engagement protrusions formed on the retaining protrusion 33 may be three or more. In this way, the cover member 25 can be attached to and detached from the three or more types of circuit boards (rigid boards) having different thicknesses without rattling.
Furthermore, even when the number of engagement protrusions formed on the retaining protrusion 33 is three or more, it is possible to provide inclined surfaces (mounting hole engagement surfaces) corresponding to the first inclined surface 36 and the second inclined surface 37. preferable.

In addition, the engagement protrusions do not need to be arranged in one linear direction regardless of the number of engagement protrusions.
However, regardless of the number of engaging protrusions, the engaging protrusions are arranged along the linear direction connecting the distal end and the proximal end of the retaining protrusion 33, and the upward protrusion amount of each engaging protrusion is set. It is preferable that the one located on the proximal end side of the retaining projection 33 is larger than the one located on the distal end side of the retaining projection 33. This increases the thickness of the base end portion of the retaining protrusion 33, so that the retaining protrusion 33 is loaded when the engaging protrusion is engaged with the lower surface of the circuit board and the retaining protrusion 33 is loaded. The possibility that the protrusion 33 is damaged is reduced.

  Further, the mounting arm 32 (and the retaining protrusion 33) may be provided on the insulator 15.

Further, the insulator 15 and the cover member 25 may be an integrally molded product (housing) made of resin.
When the insulator 15 and the cover member 25 are integrally molded, if the tail piece 22 of the contact 20 is soldered to the circuit board using a reflow furnace, the resin material that is the raw material of the integrally molded product is insulated. It is preferable to have heat resistance in addition to the properties.
Further, the present invention may be applied to a connector for connecting a thin plate-like connection object (for example, FPC, FFC, etc.) having a different type from the IC card 40.

10 IC card connector (connector)
15 Insulator (housing)
16 Contact support portion 17 Card support portion 18 Card insertion groove 20 Contact 21 Connection piece 22 Tail piece 25 Cover member (housing)
26 Side protector 27 Card support projection 28 Card insertion groove 29 Upper surface protection unit 30 Lower surface protection unit 31 Front surface protection unit 32 Mounting arm 33 Retaining projection 34 First engagement projection 35 Second engagement projection 36 First inclined surface (Mounting surface for mounting hole)
37 Second inclined surface (engagement surface for mounting hole)
38 Storage space 39 Guide groove 40 IC card (object to be connected)
41 Guide protrusion 42 Connection hole CB1 Thick circuit board CB1a mounting hole CB2 Thin circuit board CB2a mounting hole

Claims (5)

A housing that forms a storage space between the one surface of the circuit board and the one surface of the circuit board;
A plurality of contacts fixed to the housing, capable of being mounted on the circuit board, and capable of contacting a thin plate-like connection object inserted into the storage space;
A mounting hole made of a through hole formed in the circuit board;
An attachment arm formed in the housing, capable of protruding and elastically deforming from the one surface side through the attachment hole to the other surface side of the circuit board;
A retaining protrusion that projects from the mounting arm and faces the other surface when the mounting arm penetrates the mounting hole;
With
When the mounting arm penetrates the mounting hole in a state where the housing is in contact with the one surface on the surface facing the other surface of the retaining projection, the selective projection is selectively performed with respect to the other surface. A connector characterized in that a plurality of engaging protrusions are formed which are engaged and have different protrusion amounts toward the other surface. The connector according to claim 1, wherein
Arranging the engaging protrusions along a linear direction connecting the distal end and the proximal end of the retaining protrusion,
A connector in which the amount of protrusion of each engagement protrusion toward the other surface is larger than that located on the distal end side. The connector according to claim 1 or 2,
A pair of mounting holes are provided in the circuit board,
A connector provided with a pair of mounting arms on the housing. The connector according to any one of claims 1 to 3,
The housing is
An insulator that supports the contact;
A cover member separate from the insulator and having the mounting arm;
Connector with. The connector according to any one of claims 1 to 4,
The connector which formed the engagement surface for attachment holes which engages with the peripheral part of the said attachment hole when one of the said engagement protrusions engages with the said other surface in the said retaining protrusion.

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