JP2014223759A - Method for manufacturing transparent surface material with adhesive layer, and transparent surface material with adhesive layer - Google Patents

Abstract

A method of manufacturing a transparent surface material with an adhesive layer, which reduces a deviation in thickness of an end portion of a resin applied by a die coating method and has excellent adhesion to a display panel, and an adhesive layer manufactured by the method. Provide transparent surface materials. A step of forming a frame-shaped portion on a peripheral portion on one surface of a transparent surface material, and applying a resin composition to a region surrounded by the frame-shaped portion using a die coating device, and forming a resin layer And a step of curing the resin layer to form an adhesive layer, the method comprising the steps of: [Selection] Figure 2

Description

  The present invention relates to a method for producing a transparent surface material with an adhesive layer and a transparent surface material with an adhesive layer.

  In order to protect a display panel of a display device such as a liquid crystal display (LCD), a touch panel, or an organic electroluminescence (EL) display, a transparent surface material having a curable resin layer having an adhesive property is used. It is known to bond to a display panel (for example, Patent Document 1). In Patent Document 1, a dispenser method is used as a method of applying a resin constituting the adhesive curable resin layer.

Japanese Patent No. 5138820

  On the other hand, a die coating method is known as a coating method that is superior in productivity and the like as compared with a dispenser method. However, in the application of the resin by the die coating method, the film thickness at the coated end of the resin is likely to be larger than other portions, and the end of the applied resin is spread and the end shape is likely to change. Therefore, the film thickness deviation at the end of the adhesive curable resin layer (adhesive layer) increases, and when the transparent surface material is bonded to the display panel, the end of the transparent surface material is bonded to the display panel. There is a problem that the adhesion between the transparent surface material and the display panel becomes unstable.

  The present invention has been made in view of the above-mentioned problems of the prior art, and is a pressure-sensitive adhesive layer that reduces the film thickness deviation at the end of the resin applied by the die coating method and has excellent adhesion to the display panel. Provided is a method for producing a transparent surface material with a contact, and a transparent surface material with an adhesive layer produced by the production method.

  The method for producing a transparent surface material with an adhesive layer according to the present invention uses a die coating apparatus in a step of forming a frame-shaped portion on the peripheral edge on one surface of the transparent surface material, and a region surrounded by the frame-shaped portion. And applying a resin composition to form a resin layer, and curing the resin layer to form an adhesive layer.

  The step of forming the frame-like portion may include a step of curing a curable resin composition.

  You may have the process of forming a 1st light-shielding part in a frame shape in the peripheral part on the one surface of the said transparent surface material.

  The step of forming the frame-shaped portion may include a step of forming a second light-shielding portion on the first light-shielding portion so that the inner edge is outside the inner edge of the first light-shielding portion.

  You may have the process of planarizing the said resin layer, before hardening the said resin layer.

  In the step of planarizing the resin layer, the resin layer may be heated.

  The step of forming the adhesive layer includes a step of semi-curing the resin layer, a step of attaching a protective film on the semi-cured resin layer, and the resin layer having the protective film attached thereto. And a step of curing.

  At least the surface of the frame-like portion may have liquid repellency.

  The transparent surface material with an adhesive layer of the present invention is formed on a transparent surface material, a peripheral portion on one surface of the transparent surface material, and at least a surface having liquid repellency, and the frame shape on the one surface. The adhesive layer formed in the area | region enclosed by the part, and the peelable protective film stuck on the said adhesive layer are provided.

  The height of the frame-shaped part may be smaller than the thickness of the adhesive layer.

  The transparent surface material with an adhesive layer according to the present invention includes a transparent surface material, a first light-shielding portion formed in a frame shape on a peripheral portion on one surface of the transparent surface material, and an outer side than an inner edge of the first light-shielding portion. A second light-shielding part formed on the first light-shielding part, an adhesive layer formed in a region surrounded by the second light-shielding part on the one surface, and a paste on the adhesive layer And a removable protective film.

  The second light shielding part may have liquid repellency.

  According to the method for producing a transparent surface material with an adhesive layer and the transparent surface material with an adhesive layer of the present invention, the film thickness deviation at the end of the resin applied by the die coating method is reduced, and the adhesiveness to the display panel is excellent. A transparent surface material with an adhesive layer is obtained.

It is a figure which shows the protection board with an adhesion layer of 1st Embodiment, Comprising: (a) is a top view, (b) is AA sectional drawing in (a). It is a flowchart which shows the manufacturing method of the protection board with an adhesion layer of 1st Embodiment. It is a figure which shows the procedure of frame-shaped part formation process S2 in 1st Embodiment, Comprising: (a) is a top view, (b) is BB sectional drawing in (a). It is a figure which shows the procedure of resin layer formation process S3 in 1st Embodiment, Comprising: (a) is a top view, (b) is CC sectional drawing in (a), (c) is resin layer formation. It is sectional drawing which shows immediately after process S3 is complete | finished. It is a figure which shows the procedure of planarization process S4 in 1st Embodiment, Comprising: (a) is a top view, (b) is DD sectional drawing in (a). It is a figure which shows the procedure of semi-hardening process S5a in 1st Embodiment, Comprising: (a) is a top view, (b) is EE sectional drawing in (a). It is a figure explaining the effect of the frame-shaped part in 1st Embodiment, Comprising: It is sectional drawing which shows the case of the protection board with the conventional adhesion layer in which the frame-shaped part is not provided. It is a figure explaining the effect of the frame-shaped part in 1st Embodiment, Comprising: It is sectional drawing which shows the case of the protection board with an adhesion layer of 1st Embodiment. It is a figure which shows the protective plate with the adhesion layer of 2nd Embodiment, Comprising: (a) is sectional drawing, (b) is the partial expanded sectional view in (a). It is a figure which shows the protection board with an adhesion layer of 3rd Embodiment, Comprising: (a) is sectional drawing, (b) is the elements on larger scale in (a). It is a figure which shows the protection board with an adhesion layer of 4th Embodiment, Comprising: (a) is sectional drawing, (b) is the elements on larger scale in (a). It is a graph which shows the result of an Example.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
The scope of the present invention is not limited to the following embodiment, and can be arbitrarily changed within the scope of the technical idea of the present invention. Moreover, in the following drawings, in order to make each structure easy to understand, the actual structure may be different from the scale, number, or the like in each structure.

In this specification, “transparent” means that the whole or a part of the display image of the display panel is subjected to optical distortion after the face material and the display surface of the display panel are bonded through the adhesive layer without any gap. It means a state that can be seen through the face material without any problem. Therefore, even if a part of light incident on the face material from the display panel is absorbed and reflected by the face material, or the visible light transmittance of the face material is low due to a change in optical phase, etc. If the display image on the display panel can be viewed without optical distortion through the material, it can be said to be “transparent”.
As used herein, “(meth) acrylate” means acrylate or methacrylate.
The “thickness” in the present invention means a thickness measured by a measuring method using a micro gauge or a laser displacement meter.

  In the following embodiments, a case where a transparent plate is used as a protective plate for protecting the display surface of the display panel will be described.

<First Embodiment>
(Protective plate with adhesive layer)
First, a protective plate with a pressure-sensitive adhesive layer (transparent surface material with a pressure-sensitive adhesive layer) 1 manufactured by the manufacturing method of the present embodiment will be described with reference to FIGS.
Fig.1 (a) is a top view which shows the protection board 1 with the adhesion layer of this embodiment, FIG.1 (b) is AA sectional drawing in Fig.1 (a).

  As shown in FIGS. 1A and 1B, the protective plate 1 with an adhesive layer of the present embodiment includes a protective plate (transparent surface material) 10, a first light shielding printing portion (first light shielding portion) 11, The frame-shaped part 12, the adhesion layer 14, and the protective film 13 are provided.

[Protective plate]
The protection plate 10 is a transparent flat plate. The shape of the protective plate 10 in plan view is not particularly limited, and can be set as appropriate according to the shape of the display panel to which the protective plate 10 is adhered, or the display device provided with the display panel (in FIG. 1A). Rectangular shape.)
The protection plate 10 is provided on the image display surface side of the display panel and protects the display panel. Examples of the material of the protection plate 10 include a glass plate or a transparent resin plate. Protective plate not only has high transparency with respect to light emitted from and reflected from the display panel, but also has light resistance, low birefringence, high planar accuracy, surface scratch resistance, and high mechanical strength. The material 10 is most preferably a glass plate. A glass plate is also preferred from the viewpoint of sufficiently transmitting light for curing a photocurable resin composition described later.

  Examples of the material of the glass plate include glass materials such as soda lime glass, and high transmittance glass (white plate glass) having lower iron content and less bluishness is more preferable. In order to improve safety, tempered glass may be used as a surface material. In particular, when a thin glass plate is used, it is preferable to use a chemically strengthened glass plate. Examples of the material of the transparent resin plate include highly transparent resin materials (such as polycarbonate and polymethyl methacrylate).

  The protective plate 10 may be subjected to a surface treatment in order to improve the interfacial adhesive force with the adhesive layer 14. Examples of the surface treatment include a method of treating the surface of the protective plate 10 with a silane coupling agent, a method of forming a silicon oxide thin film by an oxidation flame using a frame burner, and the like.

  In order to increase the contrast of the display image, the protective plate 10 may be provided with an antireflection layer on the lower surface 10b opposite to the upper surface (one surface) 10a on which the adhesive layer 14 is formed. Further, depending on the purpose, a part or the whole of the protective plate 10 is colored, or part or the whole of the upper surface 10a and the lower surface 10b of the protective plate 10 is polished to form a glass to scatter light. A fine unevenness or the like may be formed on part or the whole of the upper surface 10a and the lower surface 10b to refract or reflect the transmitted light. In addition, a colored film, a light scattering film, a photorefractive film, a light reflecting film, or the like may be attached to part or all of the upper surface 10a and the lower surface 10b of the protective plate 10.

  In the case of a glass plate, the thickness of the protective plate 10 is preferably 0.5 mm to 25 mm in view of mechanical strength and transparency. In applications such as a television receiver and a PC display used indoors, 1 mm to 6 mm is preferable from the viewpoint of weight reduction of the display device, and in public display applications installed outdoors, 3 mm to 20 mm is preferable. When chemically strengthened glass is used, the thickness of the glass is preferably about 0.5 mm to 1.5 mm in terms of strength. In the case of a transparent resin plate, 2 mm to 10 mm is preferable.

[First shading printing section]
The 1st light-shielding printing part 11 is a decorative printing part formed in frame shape. The first light-shielding printing unit 11 is formed on the peripheral edge of the upper surface 10 a of the protection plate 10.
The first light-shielding printing unit 11 hides the wiring members and the like connected to the display panel so that areas other than the image display area of the display panel cannot be viewed from the protective plate 10 side (lower surface 10b side). When the protective plate 10 is a glass plate, it is preferable to use ceramic printing containing a black pigment for the first light-shielding printing unit 11 because of high light-shielding properties.

[Frame part]
The frame-like part 12 is a frame-like structure formed on the first light-shielding printing part 11. The inner edge of the frame-shaped part 12 is located outside the inner edge 11 a of the first light-shielding printing part 11. The outer edge of the frame-shaped part 12 is located inside the outer edge of the first light-shielding printing part 11. The frame-shaped part 12 is provided along the outer periphery of the adhesion layer 14, and the planar view shape of the frame-shaped part 12 can be set according to the planar view shape of the adhesion layer 14 desired.
The width w1 of the frame-shaped part 12 is preferably 0.5 mm to 2.5 mm, and more preferably 0.8 mm to 1.2 mm. Further, the thickness h1 of the frame portion 12 is substantially equal to the thickness h2 of the adhesive layer 14 or has a thickness difference in the range of 0.005 mm to 0.05 mm as compared with the thickness h2 of the adhesive layer 14. It doesn't matter.

  As a method of adjusting the thickness h1 of the frame-shaped portion 12, a method of adjusting the supply amount of the curable resin composition supplied to the peripheral portion of the upper surface 10a of the protective plate 10, the viscosity of the curable resin composition, and the time of curing A method for adjusting the shrinkage ratio of the resin.

[Adhesive layer]
The adhesive layer 14 is surrounded by the frame-shaped part 12, the first light-shielding printing part 11, the protective plate 10, and the protective film 13.
The adhesive layer 14 has a shear modulus at 35 ° C. of preferably 10 ² Pa to 10 ⁷ Pa, and more preferably 10 ³ Pa to 10 ⁶ Pa. Furthermore, in order to eliminate the space | gap at the time of bonding with a display panel for a shorter time, as for the shear elastic modulus in 35 degreeC of the adhesion layer 14, 10 < ³ > Pa-10 < ⁵ > Pa is especially preferable. If the shear modulus of the adhesive layer 14 is 10 ³ Pa or more, the shape of the adhesive layer 14 can be maintained. Moreover, even when the thickness h2 of the adhesive layer 14 is relatively thick, the thickness h2 can be maintained uniformly throughout the adhesive layer 14, and when the protective plate 1 with the adhesive layer and the display panel are bonded, the display panel And voids are unlikely to occur at the interface between the adhesive layer 14 and the adhesive layer 14. Moreover, when the shear modulus of the adhesive layer 14 is 10 ³ Pa or more, it is easy to suppress deformation of the adhesive layer 14 when the protective film 13 is peeled off.

If the shear modulus of the adhesive layer 14 is 10 ⁷ Pa or less, the adhesive layer 14 can exhibit good adhesion when bonded to a display panel. Moreover, since the molecular mobility of the resin material which forms the adhesion layer 14 is comparatively high, after bonding the display panel and the protective plate 1 with the adhesion layer in a reduced pressure atmosphere, this was returned to the atmospheric pressure atmosphere. At this time, the volume of the voids tends to decrease due to the differential pressure between the pressure in the voids (still reduced pressure) and the pressure applied to the adhesive layer 14 (atmospheric pressure). In addition, the gas in the gap whose volume has been reduced dissolves in the adhesive layer 14 and is easily absorbed.

The shear elastic modulus at 35 ° C. of the adhesive layer 14 is measured as follows.
Using a rheometer (a modular rheometer Physica MCR-301, manufactured by Anton paar), the gap between the measuring spindle and the translucent plate is the same as the thickness h2 of the adhesive layer 14, and the adhesive layer 14 is inserted in the gap. A material (an uncured curable resin composition 41 described later) is disposed. Further, the shear modulus of the curing process is measured while applying heat and light necessary for curing to the uncured curable resin composition 41, and the measured value under a predetermined curing condition is defined as the shear modulus of the adhesive layer 14.

  The thickness h2 of the adhesive layer 14 is preferably 0.03 mm to 2 mm, and more preferably 0.1 mm to 0.8 mm. When the thickness h2 of the adhesive layer 14 is 0.03 mm or more, the adhesive layer 14 can effectively buffer an impact caused by an external force from the protective plate 10 side (the lower surface 10b side), thereby protecting the display panel. In addition, even if foreign matter not exceeding the thickness h2 of the adhesive layer 14 is mixed between the display panel and the protective plate 1 with the adhesive layer, the thickness h2 of the adhesive layer 14 does not change greatly, and the light transmission performance is affected. Less is. If the thickness h2 of the adhesive layer 14 is 2 mm or less, it is difficult for a gap to remain between the protective plate 10 and the adhesive layer 14, and the overall thickness of the display device does not become unnecessarily thick.

  As a method of adjusting the thickness h2 of the adhesive layer 14, a method of adjusting the thickness h1 of the frame-like portion 12 and adjusting the supply amount of the curable resin composition supplied to the upper surface 10a of the protective plate 10, The method of adjusting the shrinkage rate at the time of hardening of curable resin composition is mentioned.

[Protective film]
The protective film 13 protects the surface of the pressure-sensitive adhesive layer 14 and maintains the shape of the pressure-sensitive adhesive layer 14 until immediately before the protective plate 1 with the pressure-sensitive adhesive layer is bonded to the display panel.

  The protective film 13 is peeled from the adhesive layer 14 when the protective plate 1 with an adhesive layer and the display panel are bonded together. Thereby, the adhesion layer 14 covered with the protective film 13 is exposed, and the protection plate 1 with the adhesion layer and the display panel are bonded together by bringing the adhesion layer 14 into contact with the display panel. The size of the protective film 13 is substantially equal to the size of the protective plate 10 in plan view.

  The protective film 13 is required not to be firmly adhered to the adhesive layer 14. Therefore, the protective film 13 is preferably a base film with relatively low adhesion made of polyethylene, polypropylene, fluorine resin, or the like. Although the suitable thickness of the protective film 13 changes with kinds of resin to be used, when using comparatively flexible films, such as polyethylene and a polypropylene, 0.04 mm-0.2 mm are preferable, and 0.06 mm-0.1 mm are preferable. Further preferred. When the thickness of the protective film 13 is 0.04 mm or more, excessive deformation of the protective film 13 can be suppressed when the protective film 13 is peeled from the adhesive layer 14. When the thickness of the protective film 13 is 0.2 mm or less, the protective film 13 is easily bent at the time of peeling, and is easily peeled off.

(Method for producing protective plate with adhesive layer)
Next, the manufacturing method of the protection board 1 with the adhesion layer of this embodiment is demonstrated.
FIG. 2 is a flowchart showing a method for manufacturing the protective plate 1 with an adhesive layer of the present embodiment.

  As shown in FIG. 2, the manufacturing method of the protective plate 1 with the adhesive layer of the present embodiment includes a first light-shielding print portion forming step S 1, a frame-like portion forming step S 2, a resin layer forming step S 3, and a planarizing step. S4 and adhesion layer formation process S5.

First, the first light shielding printing part forming step S <b> 1 is a process of forming the first light shielding printing part 11 on the upper surface 10 a of the protection plate 10.
A decorative print having a light shielding property such as black is applied to the peripheral portion of the upper surface 10 a of the protection plate 10 to form the first light shielding printing portion 11. As a method of decorative printing, for example, when the protective plate 10 is glass, a ceramic printing method can be used.
Through this process, the first light-shielding printing unit 11 is formed.

Next, the frame-shaped portion forming step S <b> 2 is a step of forming the frame-shaped portion 12 on the first light shielding printing portion 11.
In the frame-shaped portion forming step S2, as shown in FIG. 2, an application step S2a for applying the curable resin composition to the peripheral portion on the upper surface 10a of the protective plate 10 and the applied curable resin composition are cured. Curing step S2b.

FIG. 3A is a plan view showing the procedure of the frame-shaped portion forming step S2, and FIG. 3B is a cross-sectional view taken along the line BB in FIG.
As shown in FIGS. 3 (a) and 3 (b), the first light-shielding printing unit 11 is arranged such that the inner edge of the applied curable resin composition is located outside the inner edge 11 a of the first light-shielding printing part 11. A curable resin composition is applied in a frame shape. By this step, an uncured frame-like portion is formed (application step S2a). The application method is not particularly limited, and for example, an inkjet method, a die coating method, a dispenser method, a screen printing method, or the like can be selected.

  The viscosity of the curable resin composition to be applied is preferably 500 Pa · s to 3000 Pa · s, more preferably 800 Pa · s to 2500 Pa · s, and still more preferably 1000 Pa · s to 2000 Pa · s. If the viscosity is 500 Pa · s or more, the shape of the uncured frame portion can be maintained for a relatively long time, and the thickness of the uncured frame portion can be sufficiently maintained. If the viscosity is 3000 Pa · s or less, an uncured frame-like portion can be formed by coating.

Moreover, even when the viscosity at the time of application | coating of the curable resin composition which forms an uncured frame-shaped part is smaller than 500 Pa.s, when the curable resin composition is a photocurable resin composition The viscosity of the curable resin composition after the light irradiation may be set to the above-described preferable range by irradiating light immediately after the application. In view of ease of application, the viscosity at the time of application of the curable resin composition is preferably 500 Pa · s or less, and more preferably 200 Pa · s or less.
In this specification, the viscosity of the curable resin composition refers to that measured at 35 ° C. using an E-type viscometer.

  The curable resin composition constituting the frame-like portion 12 may be a photocurable resin composition or a thermosetting resin composition. Photocuring containing a curable compound and a photopolymerization initiator (C) because it can be cured at a low temperature and has a high curing rate, and can be increased in viscosity by light irradiation immediately after application of a low-viscosity curable resin composition. A functional resin composition is preferred.

  As a curable resin composition for forming an uncured frame-shaped part, it has a curable group and has a number average molecular weight of 30,000 to 100,000 as the curable compound from the viewpoint of easily adjusting the viscosity to the above range. It contains a certain oligomer (A) and a monomer (B) having a curable group and a molecular weight of 125 to 600, and the proportion of the monomer (B) is the sum of the oligomer (A) and the monomer (B) Among (100% by mass), those of 15% by mass to 50% by mass are preferable. When adjusting the viscosity to the above range by light irradiation immediately after coating, the proportion of the monomer (B) is 30% by mass in the total (100% by mass) of the oligomer (A) and the monomer (B). What is -70 mass% is preferable.

Examples of the curable group of the oligomer (A) include addition polymerizable unsaturated groups (acryloyloxy group, methacryloyloxy group, etc.), combinations of unsaturated groups and thiol groups, and the like.
A group selected from an acryloyloxy group and a methacryloyloxy group is preferred from the viewpoint of a high curing rate and a highly transparent frame-like part.
The oligomer (A) preferably has an average of 1.8 to 4 curable groups per molecule from the viewpoint of the curability of the resin composition and the mechanical properties of the frame portion. Examples of the oligomer (A) include urethane oligomers having a urethane bond, poly (meth) acrylates of polyoxyalkylene polyols, poly (meth) acrylates of polyester polyols, and the like after curing by molecular design of urethane chains. A urethane oligomer is preferable from the viewpoint that the mechanical properties of the resin, the adhesion to the protective plate or the display panel, etc. can be adjusted widely. One or more oligomers (A) may be used.

Examples of the curable group of the monomer (B) include addition polymerizable unsaturated groups (acryloyloxy group, methacryloyloxy group, etc.), combinations of unsaturated groups and thiol groups, and the like. A group selected from an acryloyloxy group and a methacryloyloxy group is preferred from the viewpoint of a high curing rate and a highly transparent frame-like part.
The monomer (B) preferably contains a monomer having a hydroxyl group from the viewpoint of the adhesion between the protective plate or the display panel and the frame-like part and the solubility of various additives described later. Specifically, a hydroxy acrylate having a hydroxyalkyl group having 1 to 2 hydroxyl groups and 3 to 8 carbon atoms, or hydroxy methacrylate (2-hydroxypropyl acrylate, 2-hydroxybutyl acrylate, 4-hydroxybutyl acrylate, 6 -Hydroxyhexyl acrylate, 2-hydroxypropyl methacrylate, 2-hydroxybutyl methacrylate, 4-hydroxybutyl methacrylate, 6-hydroxyhexyl methacrylate and the like are preferable, and 4-hydroxybutyl acrylate or 2-hydroxybutyl methacrylate is particularly preferable. Monomer (B) may be used alone or in combination of two or more.

  Examples of the photopolymerization initiator (C) include acetophenone series, ketal series, benzoin or benzoin ether series, phosphine oxide series, benzophenone series, thioxanthone series, and quinone series. By using two or more kinds of photopolymerization initiators (C) having different absorption wavelength ranges, the curing time can be further accelerated, or the surface curability of the uncured frame-like portion can be increased. In the case where the viscosity of the photocurable resin composition is adjusted to the above preferable range by light irradiation immediately after coating, it is particularly preferable to use two or more types of photopolymerization initiators (C) having different absorption wavelength ranges.

  Furthermore, you may add a noncurable oligomer (D) to a resin composition. The non-curable oligomer (D) is an oligomer having 0.8 to 3 hydroxyl groups per molecule that does not undergo a curing reaction with the curable compound in the composition when the photocurable resin composition for resin layer formation is cured. . The number of hydroxyl groups per molecule is more preferably 2 to 3. The number average molecular weight (Mn) per hydroxyl group of the non-curable oligomer (D) is preferably 400 to 8000. A non-curable oligomer (D) may be used individually by 1 type, and may use 2 or more types together.

Next, the uncured frame portion formed in the frame shape is cured (curing step S2b). When the curable resin composition constituting the uncured frame-shaped portion has photocurability, the uncured frame-shaped portion is cured by irradiating light. For example, the photocurable resin composition is cured by irradiating ultraviolet light or short wavelength visible light from a light source (ultraviolet lamp, high pressure mercury lamp, UV-LED, etc.).
Moreover, when the curable resin composition which comprises an uncured frame-shaped part has thermosetting property, an uncured frame-shaped part is hardened by heating.
Through the above steps, the frame-shaped portion forming step S2 is completed, and the frame-shaped portion 12 is formed.

Next, resin layer formation process S3 is a process of forming the resin layer 42a by apply | coating a curable resin composition.
4A is a plan view showing the procedure of the resin layer forming step S3, FIG. 4B is a sectional view taken along the line CC in FIG. 4A, and FIG. 4C is the resin layer forming step S3. It is sectional drawing which showed immediately after completion | finish.

As shown in FIGS. 4A and 4B, a curable resin composition 41 is applied by a die coating method using a die coating apparatus 40.
The die coating apparatus 40 is disposed above the protection plate 10. The relative position between the die coating device 40 and the protection plate 10 can be moved in the horizontal direction. The relative position of the die coating device 40 and the protective plate 10 may be moved by moving the die coating device 40 or moving the protective plate 10. In this embodiment, the case where the protection plate 10 is moved with respect to the die coating apparatus 40 will be described.

As shown in FIG. 4B, the die coating apparatus 40 has a substantially pentagonal shape in cross-sectional view. A slit portion 40a is provided at the center of the die coating device 40 in the short side direction in the plan view (the left-right direction in FIG. 4A).
The slit portion 40a extends in the longitudinal direction of the die coating apparatus 40 (vertical direction in FIG. 4A). An uncured curable resin composition 41 is discharged from the slit portion 40a.
Note that the die coating apparatus is not limited to the above form, and a known form can be used as appropriate.

The protective plate 10 is placed on the moving device 33, and the protective plate 10 is placed in a direction opposite to the direction in which the curable resin composition 41 is applied (right direction in FIG. 4B) (left direction in FIG. 4B). Move. Accordingly, the relative position of the die coating apparatus 40 with respect to the protection plate 10 is moved from one end portion in the longitudinal direction of the protection plate 10 (left and right direction in FIG. 4B) to the vicinity of the other end portion to protect A curable resin composition 41 is applied on the plate 10.
The moving device 33 is not particularly limited as long as the protective plate 10 can be moved, and any known moving device can be used. For example, in FIGS. 4A and 4B, the moving device 33 is a belt conveyor.

  The region where the curable resin composition 41 is applied is inside the recess 45 formed by the frame-shaped portion 12 and the upper surface 10a of the protective plate 10. As shown in FIG.4 (c), the curable resin composition 41 is apply | coated so that the clearance gap 44 may be formed between the frame-shaped part 12 and the formed resin layer 42a. In other words, the curable resin composition 41 is applied so that the curable resin composition 41 does not come into contact with the frame-shaped portion 12. The gap 44 is formed surrounding the outer periphery of the resin layer 42a.

  The amount of the curable resin composition 41 discharged from the die coating apparatus 40 is adjusted so that the thickness h3 immediately after application of the resin layer 42a to be formed is larger than the thickness h1 of the frame-like portion 12. The thickness h3 of the resin layer 42a can be set according to the width of the gap 44 (the distance between the resin layer 42a and the frame portion 12). When the resin layer 42a is flattened in the next flattening step S4, the thickness of the flattened resin layer 42b, which will be described later, is substantially equal to the thickness h1 of the frame-like portion 12 as described above, or slightly It is preferable to adjust the thickness h3 of the resin layer 42a so as to decrease.

  By this step, as shown in FIG. 4C, a gap 44 is formed between the frame portion 12 and the resin layer made of the curable resin composition 41 having a thickness larger than the thickness of the frame portion 12. 42a is formed.

  The viscosity of the curable resin composition 41 is preferably 0.05 Pa · s to 50 Pa · s, and more preferably 1 Pa · s to 20 Pa · s. If the viscosity is 0.05 Pa · s or more, the proportion of the monomer (B ′) described later can be suppressed, and the physical properties of the adhesive layer 14 can be prevented from being lowered. Further, when the viscosity is 50 Pa · s or less, voids hardly remain in the adhesive layer 14.

  As the curable resin composition 41, the one having a characteristic that the viscosity is lowered by being heated in the next flattening step S4 is used. The curable resin composition 41 is preferably a photocurable resin composition containing a curable compound and a photopolymerization initiator (C ′) from the viewpoint that it can be cured at a low temperature and has a high curing rate.

  As the curable resin composition 41, one of oligomers (A ′) having a curable group and having a number average molecular weight of 1,000 to 100,000 as the curable compound from the viewpoint of easily adjusting the viscosity to the above range. Including at least one species and at least one monomer (B ′) having a curable group and a molecular weight of 125 to 600, and the ratio of the monomer (B ′) is the oligomer (A ′) and the monomer (B Among the total (100 mass%) with '), what is 40 mass%-80 mass% is preferred.

  Examples of the curable group of the oligomer (A ′) include addition-polymerizable unsaturated groups (acryloyloxy group, methacryloyloxy group, etc.), combinations of unsaturated groups and thiol groups, and the like. A group selected from an acryloyloxy group and a methacryloyloxy group is preferable from the viewpoint of obtaining a highly transparent adhesive layer 14.

Examples of the curable group of the monomer (B ′) include addition polymerizable unsaturated groups (acryloyloxy group, methacryloyloxy group, etc.), combinations of unsaturated groups and thiol groups, etc. A group selected from an acryloyloxy group and a methacryloyloxy group is preferable from the viewpoint of obtaining a highly transparent adhesive layer 14.
As the monomer (B ′), one having 1 to 3 curable groups per molecule is preferable from the viewpoint of the curability of the curable resin composition 41 and the mechanical properties of the adhesive layer 14.

  Examples of the photopolymerization initiator (C ′) include acetophenone series, ketal series, benzoin or benzoin ether series, phosphine oxide series, benzophenone series, thioxanthone series, and quinone series.

  Further, a non-curable oligomer (D ′) may be added to the resin composition. The non-curable oligomer (D ′) is an oligomer having 0.8 to 3 hydroxyl groups per molecule that does not undergo a curing reaction with the curable compound in the composition when the photocurable resin composition for resin layer formation is cured. is there. The number of hydroxyl groups per molecule is more preferably 2 to 3. Further, the number average molecular weight (Mn) per hydroxyl group of the non-curable oligomer (D ′) is preferably 400 to 8000. The non-curable oligomer (D ′) may be used alone or in combination of two or more.

Next, the flattening step S4 is a step of flattening the thickness of the resin layer 42a by heating the resin layer 42a.
Fig.5 (a) is a top view which shows the procedure of planarization process S4, FIG.5 (b) is DD sectional drawing in Fig.5 (a).
The resin layer 42a is heated for a predetermined time to reduce the viscosity of the resin layer 42a. As a result, the resin layer 42 a spreads out and flows into the gap 44. The wet and spread resin layer 42 a is blocked by the frame-shaped portion 12, and the end shape of the resin layer 42 a is a shape along the inner surface 12 a of the frame-shaped portion 12. Moreover, the thickness of the resin layer 42a is made uniform by decreasing the viscosity of the resin layer 42a.
By this step, as shown in FIGS. 5A and 5B, the gap 44 disappears, and the resin layer 42a becomes a flattened resin layer 42b.

Next, the adhesive layer forming step S5 is a step of forming the adhesive layer 14.
As shown in FIG. 2, the adhesion layer forming step S5 includes a semi-curing step S5a, a protective film attaching step S5b, and a main curing step S5c.
The semi-curing step S5a is a step of semi-curing the flattened resin layer 42b.
Fig.6 (a) is a top view which shows semi-hardening process S5a, FIG.6 (b) is EE sectional drawing in Fig.6 (a).
As shown in FIGS. 6A and 6B, the flattened resin layer 42 b is semi-cured to form a semi-cured resin layer 43. As a semi-curing method, for example, when the curable resin composition 41 constituting the resin layer 42b is a photocurable resin, ultraviolet light or short light is emitted from a light source (ultraviolet lamp, high pressure mercury lamp, UV-LED, etc.). A method of irradiating visible light having a wavelength can be selected. Specifically, the curable resin composition 41 is semi-cured by, for example, shortening the time for irradiating light shorter than the time required for the main curing, or irradiating light having a lower intensity than the light used for the main curing. Let
By this step, a semi-cured resin layer 43 that is semi-cured and retained in its outer shape is formed.

Here, “semi-curing” means curing without polymerization until the target degree of polymerization when the degree of polymerization of the adhesive layer 14 of the protective plate 1 with the adhesive layer shown in FIG. It means to finish the process. In other words, “semi-cured” means that the resin layer 42b has been polymerized (cured), but the polymerization (curing) has not progressed to the degree of polymerization of the adhesive layer 14 of the protective plate 1 with the adhesive layer. doing.
If the polymerization until the polymerization degree of the pressure-sensitive adhesive layer 14 (target polymerization degree) is reached is assumed to be “main-curing”, it can be said that the intermediate stage of the polymerization is in a “half-cured” state. Up to, it is shown that the layer is not polymerized.

Protective film sticking process S5b is a process of sticking protective film 13 on semi-cured resin layer 43.
The method for attaching the protective film 13 is not particularly limited. For example, a method can be selected in which the protective plate 10 is moved by a roller and the protective film 13 wound in a roll shape is stuck on the semi-cured resin layer 43.
By this step, the protective film 13 is stuck to the semi-cured resin layer 43, and the semi-cured resin layer 43 is covered with the protective film 13 (see FIGS. 1A and 1B). ).

The main curing step S5c is a step of main curing the semi-cured resin layer 43.
The method of main-curing the semi-cured resin layer 43 can be the same as the method of semi-curing the resin layer 42b in the semi-curing step S5a. Conditions such as the time for irradiating light and the intensity of the irradiating light are such that the semi-cured resin layer 43 can be fully cured.
Through this step, the semi-cured resin layer 43 is fully cured.
Through the above steps, the pressure-sensitive adhesive layer forming step S5 is completed, and the pressure-sensitive adhesive layer 14 is formed.

  The protective plate 1 with the adhesive layer of the present embodiment is manufactured through the first light-shielding printed part forming step S1 to the adhesive layer forming step S5 (see FIGS. 1A and 1B).

  According to the manufacturing method of the protective plate with an adhesive layer of the present embodiment, the curable resin composition is formed in the concave portion 45 formed by the frame-shaped portion 12 and the upper surface 10a of the protective plate 10 after the frame-shaped portion 12 is formed. An object 41 is applied to form a resin layer 42a. Then, the viscosity of the resin layer 42a is lowered by heating, and the thickness of the resin layer 42a is made uniform by spreading and wetting. In other words, the resin layer 42a is planarized. The wetting and spreading of the resin layer 42 a is suppressed by the frame-shaped part 12. As a result, a flattened resin layer 42b is formed. Then, the resin layer 42b is cured to form the adhesive layer 14 having a substantially uniform thickness as a whole. Therefore, the protection board 1 with the adhesion layer excellent in adhesiveness is obtained. Hereinafter, it demonstrates in detail using figures.

  FIGS. 7A and 7B are views for explaining the effect of the frame-shaped portion, and are cross-sectional views showing the case of the protective plate with the adhesive layer in which the frame-shaped portion is not provided, and FIG. ), (B) are diagrams for explaining the effect of the frame-shaped portion, and are cross-sectional views showing the case of the protective plate 1 with the adhesive layer of the present embodiment provided with the frame-shaped portion 12.

  When the curable resin composition 41 is applied by a die coating method, as shown in FIGS. 7 (a) and 8 (a), the film thickness of the coating end portion increases, and a convex portion is formed at the end portion of the resin layer 42a. 70 may be formed. If the convex part 70 is formed in the edge part of the resin layer 42a, when the protection board 10 and a display panel are bonded together, the part of the convex part 70 will float and adhesion | attachment of the protection board 10 and a display panel will be unstable. become.

  The convex portion 70 is eliminated when the resin layer 42a spreads and is flattened. However, in the case of the protective plate with the adhesive layer not provided with the frame-shaped portion 12, the end portion of the flattened resin layer 42c spreads wet as shown in FIG. It tends to be a shape in which the film thickness decreases gradually. For this reason, the end shape of the adhesive layer formed by curing the resin layer 42c also has the same shape. Therefore, when the protective plate with the adhesive layer and the display panel are bonded together, a gap is generated between the protective plate 10 and the display panel at the end, and the end of the protective plate 10 is difficult to adhere to the display panel. As a result, the adhesion between the protective plate 10 and the display panel may become unstable.

  On the other hand, according to the present embodiment, since the flattening step S4 is provided before the resin layer 42a is cured, the convex portion 70 is eliminated by the resin layer 42a being spread and flattened. And the wetting spread of the edge part of the resin layer 42a is suppressed by the frame-shaped part 12, as shown in FIG.8 (b). Thereby, the edge part shape of the resin layer 42b becomes a shape along the shape of the inner surface 12a of the frame-shaped part 12. FIG. Therefore, the inner surface 12a is provided substantially perpendicular to the upper surface 10a of the protective plate 10, so that the film thickness deviation at the end of the resin layer 42b can be reduced. Thereby, by hardening the resin layer 42b, the adhesive layer 14 with a small film thickness deviation can be formed as a whole, and the protective plate 1 with the adhesive layer excellent in adhesiveness is obtained.

Moreover, since the resin layer 42a is comprised by the uncured curable resin composition 41, it naturally wets and spreads over time and is flattened.
According to the present embodiment, in the planarization step S4, by heating the resin layer 42a, the viscosity of the curable resin composition 41 constituting the resin layer 42a is decreased, and the wettability is easily spread. As a result, the time required for planarizing the resin layer 42a can be shortened.

  Moreover, according to this embodiment, since the 1st light shielding printing part 11 is formed in the upper surface 10a by the side in which the adhesion layer 14 in the protection board 10 is formed, the 1st light shielding printing part 11 and an image display area | region The parallax can be reduced.

  In addition, in the protection board 1 with the adhesion layer of this embodiment, the following method is also employable.

  You may form the 1st light-shielding printing part 11 in the peripheral part of the lower surface 10b of the protection board 10. FIG. In this case, the frame-like part 12 is directly formed on the upper surface 10a of the protective plate 10 so as to overlap the first light-shielding printing part 11 in plan view.

  You may abbreviate | omit 1st light-shielding printing part formation process S1. That is, the first light-shielding printing unit 11 may not be formed.

  The curing step S2b in the frame-shaped portion forming step S2 may be omitted. In this case, it is preferable that the curable resin composition used in the coating step S2a has a higher viscosity. Further, in the semi-curing step S5a and the main curing step S5c, the uncured frame-shaped portion is cured together with the resin layer 42b and the semi-cured resin layer 43 to form the frame-shaped portion 12.

  In the resin layer forming step S3, the thickness h3 of the resin layer 42a to be formed may be substantially equal to the thickness h1 of the frame-shaped portion 12 or smaller than the thickness h1 of the frame-shaped portion 12.

  In the resin layer forming step S <b> 3, the curable resin composition 41 may be applied in the recess 45 without forming the gap 44. In this case, the film thickness of the resin layer to be formed is set to be approximately equal to that of the frame-like portion 12. In this case, the planarization step S4 may be omitted.

In the planarization step S4, the resin layer 42a may not be heated. For example, the resin layer 42a may be flattened by a roller or the like, or the resin layer 42a may be naturally flattened by being left for a predetermined time. In this case, the curable resin composition 41 may have thermosetting properties.
Further, the planarization step S4 may be omitted.

  The same resin composition may be sufficient as the material which comprises the frame-shaped part 12 and the adhesion layer 14. FIG.

  The frame-shaped part 12 may be formed, for example, by installing another frame-shaped member made of plastic or metal on the protective plate 10.

  The outer edge of the frame-shaped part 12 may overlap with the outer edge of the first light-shielding printing part 11 in plan view.

Second Embodiment
Next, a second embodiment will be described. The second embodiment is different from the first embodiment in that a second light-shielding print portion forming step is performed instead of the frame-like portion forming step S2.
In addition, about the component similar to the said embodiment, the code | symbol similar to the said embodiment is attached | subjected suitably, and the description is simplified or abbreviate | omitted.

(Protective plate with adhesive layer)
Fig.9 (a) is sectional drawing which shows the protection board 2 with the adhesion layer of 2nd Embodiment, FIG.9 (b) is an expanded sectional view which expanded the edge part of Fig.9 (a).
As shown in FIGS. 9A and 9B, the protective plate 2 with an adhesive layer of the present embodiment includes a protective plate 10, a first light shielding printing unit 11, and a second light shielding printing unit (second light shielding unit, Frame-shaped portion) 20, adhesive layer 80, and protective film 13.

[Second shading printing section]
The second light-shielding printing unit 20 is a decorative printing unit that is formed in a frame shape and is similar to the first light-shielding printing unit 11. The second light shielding printing unit 20 is formed on the peripheral edge on the first light shielding printing unit 11. The inner edge 20 a of the second light-shielding printing unit 20 is located outside the inner edge 11 a of the first light-shielding printing part 11. The outer edge of the second light-shielding printing unit 20 overlaps with the outer edge of the first light-shielding printing unit 11 in plan view.

The material of the second light-shielding printing unit 20 may be the same as or different from the material of the first light-shielding printing unit 11. The material of the second light-shielding printing unit 20 is preferably the same material as that of the first light-shielding printing unit 11 because it is easy to form.
The film thickness of the second light-shielding printing unit 20 is not particularly limited as long as the wetting and spreading of the resin layer can be suppressed, and may be the same as or different from the film thickness of the first light-shielding printing unit 11.

(Method for producing protective plate with adhesive layer)
The manufacturing method of the protection board 2 with the adhesion layer of this embodiment is a 1st light-shielding printing part formation process, a 2nd light-shielding printing part formation process, a resin layer formation process, a planarization process, an adhesion layer formation process, Have

  The first light-shielding print portion forming step is the same as the first light-shielding print portion forming step S1 in the first embodiment. Through this process, the first light-shielding printing unit 11 is formed.

The second light shielding printing part forming step is a process of forming the second light shielding printing part 20 on the first light shielding printing part 11.
In the same manner as in the first light-shielding print portion forming step, decorative printing having a light-shielding property such as black in a frame shape is performed on the peripheral portion of the first light-shielding print portion 11. Through this process, the second light-shielding printing unit 20 is formed.

  The resin layer forming step is the same as the resin layer forming step S3 in the first embodiment. Through this step, a resin layer is formed.

The planarization step is the same as the planarization step S4 in the first embodiment.
The heated resin layer is spread and flattened. At this time, wetting and spreading of the end portion of the resin layer is suppressed by the second light-shielding printing unit 20. Thereby, the edge part of a resin layer becomes circular arc shape as shown in FIG.9 (b).
By this step, a flattened resin layer is formed.

The adhesive layer forming step is the same as the adhesive layer forming step S5 in the first embodiment, and includes a semi-curing step, a protective film attaching step, and a main curing step. Moreover, a semi-hardening process, a protective film sticking process, and a main hardening process are also the same as the semi-hardening process S5a, the protective film sticking process S5b, and the main hardening process S5c of the adhesion layer forming process S5 in the first embodiment.
By this step, the adhesive layer 80 is formed.

  The protective plate 2 with an adhesive layer is manufactured by the above steps.

  According to the method for manufacturing the protective plate with an adhesive layer of the present embodiment, the second light-shielding printing unit 20 is formed on the first light-shielding printing unit 11, thereby suppressing the wetting and spreading of the resin layer. Therefore, the film thickness deviation at the end of the resin layer can be reduced.

  Moreover, according to this embodiment, the 2nd light-shielding printing part 20 which suppresses the wetting spread of a resin layer can be formed with the formation method similar to the 1st light-shielding printing part 11. FIG. Thereby, according to this embodiment, the formation process of a frame-shaped part, ie, the application | coating process of a curable resin composition, and the hardening process of a curable resin composition are unnecessary, and it is simple.

  In the present embodiment, the following method can also be employed.

  The second light-shielding printing unit 20 may be formed of a material having liquid repellency. In addition, after the second light-shielding print unit 20 is formed, the surface of the second light-shielding print unit 20 may be subjected to a liquid repellent treatment. According to this method, wetting and spreading at the end of the resin layer can be effectively suppressed, and the film thickness deviation at the end of the resin layer can be further reduced.

  The outer edge of the second light-shielding printing unit 20 may be located inside the outer edge of the first light-shielding printing unit 11.

<Third Embodiment>
Next, a third embodiment will be described. The third embodiment differs from the first embodiment in that a liquid repellent portion forming step is performed instead of the frame-like portion forming step S2.
In addition, about the component similar to the said embodiment, the code | symbol similar to the said embodiment is attached | subjected suitably, and the description is simplified or abbreviate | omitted.

(Protective plate with adhesive layer)
Fig.10 (a) is sectional drawing which shows the protection board 3 with the adhesion layer of 3rd Embodiment, FIG.10 (b) is an expanded sectional view which expanded the edge part of Fig.10 (a).
As shown in FIGS. 10A and 10B, the protective plate 3 with an adhesive layer of the present embodiment includes a protective plate 10, a first light-shielding printing part 11, a liquid repellent part (frame-like part) 91, An adhesive layer 90 and a protective film 13 are provided.

[Liquid repellent part]
The liquid repellent portion 91 is formed in a frame shape on the peripheral edge of the first light-shielding print portion 11. The inner edge of the liquid repellent part 91 is located outside the inner edge 11 a of the first light-shielding printing part 11. The outer edge of the liquid repellent part 91 is located inside the outer edge of the first light-shielding printing part 11.
The liquid repellent portion 91 is a thin film made of a material having liquid repellency. Examples of the material having liquid repellency include a fluorine-based coating agent and a silicon-based coating agent. The liquid repellency of the liquid repellent portion 91 is more preferable as the contact angle is larger.

(Method for producing protective plate with adhesive layer)
The manufacturing method of the protection board 3 with the adhesion layer of this embodiment has a 1st light-shielding printing part formation process, a liquid-repellent part formation process, a resin layer formation process, a planarization process, and an adhesion layer formation process. .

  The first light-shielding print portion forming step is the same as the first light-shielding print portion forming step S1 in the first embodiment. Through this process, the first light-shielding printing unit 11 is formed.

The liquid repellent portion forming step is a step of forming the liquid repellent portion 91 on the first light shielding printing portion 11.
A material having liquid repellency in a frame shape is formed so that the inner edge of the applied liquid-repellent material is located outside the inner edge 11a of the first light-shielding printing section 11 at the peripheral edge of the first light-shielding printing section 11. Apply. A method for applying the material having liquid repellency is not particularly limited. Through this step, the liquid repellent portion 91 is formed.

  The resin layer forming step is the same as the resin layer forming step S3 in the first embodiment. Through this step, a resin layer is formed.

The planarization step is the same as the planarization step S4 in the first embodiment.
The heated resin layer is spread and flattened. At this time, when the end portion of the resin layer comes into contact with the liquid repellent portion 91, wetting and spreading are suppressed by the liquid repellency of the liquid repellent portion 91. Thereby, the edge part shape of a resin layer becomes circular arc shape, as shown in FIG.10 (b). By this step, a flattened resin layer is formed.

The adhesive layer forming step is the same as the adhesive layer forming step S5 in the first embodiment, and includes a semi-curing step, a protective film attaching step, and a main curing step. Moreover, a semi-hardening process, a protective film sticking process, and a main hardening process are also the same as the semi-hardening process S5a, the protective film sticking process S5b, and the main hardening process S5c of the adhesion layer forming process S5 in the first embodiment.
By this step, the adhesive layer 90 is formed.

  The protective plate 3 with an adhesive layer is manufactured by the above steps.

  According to the method for manufacturing a protective plate with an adhesive layer of the present embodiment, the liquid repellent portion 91 has an effect of suppressing the wetting and spreading of the resin layer, and can reduce the film thickness deviation at the end of the resin layer.

  Note that the outer edge of the liquid repellent portion 91 may overlap the first light-shielding printing portion 11 in plan view.

<Fourth embodiment>
Next, a fourth embodiment will be described. The fourth embodiment is different from the first embodiment in that a liquid-repellent frame-shaped portion forming step is performed instead of the frame-shaped portion forming step S2.
In addition, about the component similar to the said embodiment, the code | symbol similar to the said embodiment is attached | subjected suitably, and the description is simplified or abbreviate | omitted.

(Protective plate with adhesive layer)
Fig.11 (a) is sectional drawing which shows the protection board 4 with the adhesion layer of 3rd Embodiment, FIG.11 (b) is an expanded sectional view which expanded the edge part of Fig.11 (a).
As shown in FIGS. 11A and 11B, the protective plate 4 with an adhesive layer according to the present embodiment includes a protective plate 10, a first light-shielding printing unit 11, and a liquid-repellent frame-shaped portion (frame-shaped portion). 110, an adhesive layer 100, and a protective film 13.

[Liquid repellent frame]
The liquid repellent frame portion 110 is a frame-like structure formed on the first light-shielding print portion 11. The inner edge of the liquid repellent frame portion 110 is located outside the inner edge 11 a of the first light-shielding print portion 11. The liquid repellent frame portion 110 is provided so as to surround the outer periphery of the adhesive layer 100, and the planar view shape of the liquid repellent frame portion 110 can be set according to the desired planar view shape of the adhesive layer 100.
The width of the liquid repellent frame portion 110 is preferably 0.5 mm to 2.5 mm, and more preferably 0.8 mm to 1.2 mm. Further, the thickness h4 of the liquid repellent frame portion 110 is smaller than the thickness h5 of the adhesive layer 100.

The liquid repellent frame 110 is composed of a curable resin composition and a substance having liquid repellency. The curable resin composition can be the same as the curable resin composition constituting the frame-like portion 12 in the first embodiment.
The substance having liquid repellency covers the surface of the liquid repellent frame 110. As the substance having liquid repellency, a surfactant having a low surface tension is used so that the substance having liquid repellency is pushed out to the surface in the curing step of the liquid repellant frame forming step described later. Moreover, in order to suppress dissociation with the curable resin composition which comprises the liquid repellent frame-shaped part 110, it is preferable that it is a substance which has a reactive group with a curable resin composition. For example, a fluorine-based coating agent having a perfluoroalkyl group (Rf) or an acrylic / silicon-based coating agent.

(Method for producing protective plate with adhesive layer)
The manufacturing method of the protection board 4 with the adhesion layer of this embodiment is the 1st light-shielding printing part formation process, the liquid-repellent frame part formation process, the resin layer formation process, the planarization process, and the adhesion layer formation process. Have.

  The first light-shielding print portion forming step is the same as the first light-shielding print portion forming step S1 in the first embodiment. Through this process, the first light-shielding printing unit 11 is formed.

  The liquid repellent frame portion forming step is a step of forming the liquid repellent frame portion 110 on the first light-shielding print portion 11. The liquid repellent frame-shaped portion forming step includes a resin composition application step and a curing step.

A mixed material of a curable resin composition and a substance having liquid repellency is applied in a frame shape on the first light-shielding printing portion 11 (resin composition application step). The inner edge of the applied mixed material is positioned outside the inner edge 11 a of the first light-shielding printing unit 11.
By this step, an uncured liquid repellent frame portion is formed.

Then, the uncured liquid-repellent frame portion formed in the frame shape is cured (curing step). As a method of curing, when the curable resin composition constituting the uncured frame-shaped portion has photocurability, it is cured by light such as ultraviolet rays, and when it has thermosetting, heating is performed. To cure. In the process of curing the curable resin composition, the mixed liquid-repellent substance has a lower surface tension than the curable resin composition, and is thus pushed out to the surface of the uncured liquid-repellent frame portion. .
Through the above steps, the liquid repellent frame portion forming step is completed, and the liquid repellent frame portion 110 whose surface is covered with a liquid repellent material is formed.

  The resin layer forming step is the same as the resin layer forming step S3 in the first embodiment. Through this step, a resin layer is formed.

The planarization step is the same as the planarization step S4 in the first embodiment.
The heated resin layer is spread and flattened. At this time, when the end portion of the resin layer comes into contact with the liquid repellent frame portion 110, the resin layer is blocked by the inner side surface 110 a of the liquid repellent frame portion 110. In addition, the portion of the resin layer above the liquid repellent frame 110 is prevented from overflowing from the liquid repellent frame 110 due to the liquid repellency of the surface of the liquid repellent frame 110. Thereby, the wetting spread of the edge part of a resin layer is suppressed. As a result, as shown in FIG. 11B, the shape of the end portion of the resin layer follows the shape of the inner side surface 110a of the liquid repellent frame portion 110 at the lower portion from the liquid repellent frame portion 110. The portion above the liquid repellent frame portion 110 has an arc shape.
By this step, a flattened resin layer is formed.

The adhesive layer forming step is the same as the adhesive layer forming step S5 in the first embodiment, and includes a semi-curing step, a protective film attaching step, and a main curing step. Moreover, a semi-hardening process, a protective film sticking process, and a main hardening process are also the same as the semi-hardening process S5a, the protective film sticking process S5b, and the main hardening process S5c of the adhesion layer forming process S5 in the first embodiment.
By this step, the adhesive layer 100 is formed.

  The protective plate 4 with an adhesive layer is manufactured by the above process.

  According to the method for manufacturing the protective plate with an adhesive layer of the present embodiment, the liquid repellent frame portion 110 has an effect of suppressing the wetting and spreading of the resin layer, and can reduce the film thickness deviation at the end of the resin layer.

  Further, according to the present embodiment, even when the thickness of the liquid repellent frame portion 110 is smaller than the thickness of the adhesive layer 100, the wet and spread resin layer overflows beyond the liquid repellent frame portion 110. This can be suppressed. Therefore, the trouble of adjusting the thickness h4 of the liquid repellent frame 110 and the thickness h5 of the adhesive layer 100 can be saved.

  Moreover, since the thickness h4 of the liquid repellent frame 110 is smaller than the thickness h5 of the pressure-sensitive adhesive layer 100, adhesion between the pressure-sensitive adhesive layer 100 and the display panel is hardly inhibited when the protective plate 10 is bonded to the display panel.

  In the present embodiment, the following method can also be employed.

  In the liquid repellent frame portion forming step, a frame portion is formed in the same manner as the frame portion forming step S2 in the first embodiment, and then the surface of the frame portion is made liquid-repellent The liquid repellent frame 110 may be formed by covering with.

  The thickness h4 of the liquid repellent frame portion 110 may be substantially equal to or slightly larger than the thickness h5 of the adhesive layer 100, similarly to the frame shape portion 12 in the first embodiment.

<Example>
Next, as an example, a protective plate with an adhesive layer produced by the method for producing a protective plate with an adhesive layer of the first embodiment will be described. The edge shape of the pressure-sensitive adhesive layer of the protective plate with the pressure-sensitive adhesive layer of this example and the edge shape of the pressure-sensitive adhesive layer of the conventional protective plate with the pressure-sensitive adhesive layer as a comparative example were image-measured with a microscope for comparison. As the curable resin composition for forming the adhesive layer, a photocurable resin composition was used.

(Photocurable resin composition)
The photocurable resin composition used in this example was obtained as follows.
Bifunctional polypropylene glycol having a molecular end modified with ethylene oxide (number average molecular weight calculated from hydroxyl value: 4000) and hexamethylene diisocyanate were mixed in a molar ratio of 6 to 7, and then isobornyl acrylate (Osaka) After diluting with IBXA, manufactured by Organic Chemical Industry Co., Ltd., 2-hydroxyethyl acrylate was added to the prepolymer obtained by reacting at 70 ° C. in the presence of a tin compound catalyst at a molar ratio of approximately 1: 2. By making it react at 70 degreeC, the urethane acrylate oligomer (henceforth UC-1) solution diluted with 30 mass% isobornyl acrylate was obtained. The number of curable groups of UC-1 was 2, and the number average molecular weight was about 55000. The viscosity of the UC-1 solution at 60 ° C. was about 580 Pa · s.

  50 parts by mass of the UC-1 solution and 50 parts by mass of 4-hydroxybutyl acrylate (manufactured by Osaka Organic Chemical Co., Ltd., 4-HBA) were uniformly mixed to obtain a mixture. 100 parts by mass of the mixture, 75 parts by mass of a bifunctional polypropylene glycol having a molecular terminal modified with ethylene oxide (number average molecular weight calculated from hydroxyl value: 4000), and a trifunctional polypropylene glycol having a molecular terminal modified with ethylene oxide (hydroxyl value) Number average molecular weight calculated from 6200) 75 parts by mass, 1 part by weight of 1-hydroxy-cyclohexyl-phenyl-ketone (photopolymerization initiator, manufactured by Ciba Specialty Chemicals, IRGACURE 184), 2,5-di- 0.08 parts by mass of t-butylhydroquinone (polymerization inhibitor, manufactured by Tokyo Chemical Industry Co., Ltd.) and 0.5 parts by mass of antioxidant (IRSFANOX 1010, manufactured by BASF) are uniformly mixed to form a photocurable resin composition. I got a thing.

The obtained photocurable resin composition was applied onto the protective plate by moving the protective plate at a speed of 33 mm / s with respect to the die coating apparatus. Moreover, the thickness of the frame-shaped part formed on the protective plate of a present Example is 400 micrometers.
FIG. 12 is a graph showing the measurement results in this example. The horizontal axis indicates the distance from the tip of the adhesive layer, and the vertical axis indicates the film thickness of the adhesive layer.

As shown in FIG. 12, in the protective plate with the adhesive layer of the comparative example in which no frame-shaped part is provided, the adhesive layer is wet and spread, from a position of about 7 mm from the tip part of the adhesive layer, toward the tip part. It can be seen that the film thickness gradually decreases.
On the other hand, in the protective plate with an adhesive layer of the present example, it can be seen that wetting and spreading are suppressed by the frame-shaped portion, and the end shape is substantially perpendicular to the protective plate.
Thereby, it was confirmed that the film thickness deviation of the edge part of the adhesion layer of this embodiment can be made small.

  1, 2, 3, 4 ... protective plate with adhesive layer (transparent surface material with adhesive layer), 10 ... protective plate (transparent surface material), 10a ... upper surface (one surface) of the protective plate, 11 ... first light-shielding printing section ( 1st light-shielding part), 12 ... frame-like part, 13 ... protective film, 14, 80, 90, 100 ... adhesive layer, 20 ... second light-shielding printing part (second light-shielding part, frame-like part), 40 ... die coating Device, 42a, 42b ... resin layer, 45 ... recess, 91 ... liquid repellent part (frame-like part), 110 ... liquid repellent frame-like part (frame-like part)

Claims (12)

A step of forming a frame-like portion on the peripheral edge on one surface of the transparent surface material;
Applying a resin composition to a region surrounded by the frame-shaped portion using a die coating apparatus to form a resin layer;
Curing the resin layer to form an adhesive layer;
The manufacturing method of the transparent surface material with the adhesion layer which has this.   The method for producing a transparent face material with an adhesive layer according to claim 1, wherein the step of forming the frame-shaped portion includes a step of curing a resin composition having curability.   The manufacturing method of the transparent surface material with the adhesion layer of Claim 1 which has the process of forming a 1st light-shielding part in frame shape in the peripheral part on the one surface of the said transparent surface material.   The step of forming the frame-shaped portion includes a step of forming a second light-shielding portion on the first light-shielding portion so that an inner edge is outside the inner edge of the first light-shielding portion. Manufacturing method of transparent face material with adhesive layer.   The manufacturing method of the transparent surface material with the adhesion layer as described in any one of Claim 1 to 4 which has the process of planarizing the said resin layer, before hardening the said resin layer.   The manufacturing method of the transparent surface material with the adhesion layer of Claim 5 which heats the said resin layer in the process of planarizing the said resin layer. The step of forming the adhesive layer includes
Semi-curing the resin layer;
A step of attaching a protective film on the semi-cured resin layer;
A step of permanently curing the resin layer to which the protective film is attached;
The manufacturing method of the transparent surface material with the adhesion layer as described in any one of Claim 1 to 6 which has these.   The manufacturing method of the transparent surface material with the adhesion layer as described in any one of Claim 1 to 7 with which at least the surface of the said frame-shaped part has liquid repellency. Transparent face material,
A frame-shaped portion formed on a peripheral portion on one surface of the transparent surface material, and having at least a surface having liquid repellency;
An adhesive layer formed in a region surrounded by the frame-shaped portion on the one surface;
A peelable protective film stuck on the adhesive layer;
A transparent surface material with an adhesive layer.   The transparent surface material with an adhesive layer according to claim 9, wherein a height of the frame-shaped portion is smaller than a thickness of the adhesive layer. Transparent face material,
A first light-shielding portion formed in a frame shape on a peripheral portion on one surface of the transparent surface material;
A second light-shielding part formed on the first light-shielding part so as to surround the outside of the inner edge of the first light-shielding part;
An adhesive layer formed in a region surrounded by the second light-shielding portion on the one surface;
A peelable protective film stuck on the adhesive layer;
A transparent surface material with an adhesive layer.   The said 2nd light-shielding part is a transparent surface material with the adhesion layer of Claim 11 which has liquid repellency.

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