JP2014203921A - Soldering device and soldering method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a soldering device for soldering a component to be mounted on a circuit board onto the circuit board by melting a solder while using a current which flows in the case where the component is operated, without using an external heat source.SOLUTION: A soldering device 10 is configured to solder a lead wire 5 of a component 1 which is operated by electrification, to a land part 4 provided on a circuit board 2. The soldering device 10 comprises: a conductive leg part 15 which is electrically connected with the land part 4; a lead wire contact part 16 including an insertion portion of the lead wire while being connected to the lead wire 5; a heating part 12 which is provided between the leg part 15 and the lead wire contact part 16 and generates heat during electrification; and a solder 8 which is provided in the vicinity of the heating part 12 and electrically connected to the lead wire contact part 16 around an outer peripheral surface of the lead wire 5. When a current flows through the land part 4 to the lead wire 5, the lead wire 5 and the land part 4 are soldered by the solder 8 which is melted by heat generated in the heating part 12.

Description

  The present invention relates to a soldering apparatus and a soldering method capable of soldering a component on a substrate by causing a current to flow and causing self-heating without using an external heat source.

  Conventionally, various electronic components, switches, components such as connectors, or wires are mounted on a circuit board built in an electronic device. When these components are mounted on a circuit board, generally, terminals and wires of the components are inserted into mounting holes provided in a circuit pattern on the circuit board and soldered. Many components previously inserted on the circuit board can be soldered once by passing the circuit board through a solder bath. However, when soldering a single item such as a retrofitting component onto a circuit board, soldering is performed by using a soldering iron to melt the solder or by local flow soldering in which molten solder is discharged from a nozzle. In these cases, melting of the solder is performed by a separately prepared external heat source (heater).

  For example, when a transformer is mounted on a mounting board, cream solder is provided on the conductive pattern on the mounting board, and thread solder is wound around the terminal fitting of the transformer and placed on the conductive pattern, which is then placed in a reflow oven and soldered. A method of melting is disclosed in Patent Document 1. Also, when the power pin is inserted into the power layer laminated on the circuit board, the signal pin is inserted into the signal layer and soldered and the connector is attached to the circuit board, only the power layer is heated using the Peltier effect. A mounting method in which heating is performed first is disclosed in Patent Document 2.

JP 2011-151727 A

Japanese Patent Laid-Open No. 2-237979

  However, in soldering using a soldering iron, the vicinity of the soldering point becomes an interference area of the soldering iron and solder ejection nozzle, so that electronic parts cannot be mounted on this part, and the mounting density of the parts is reduced. There is. Further, the soldering method disclosed in Patent Document 1 requires an external heat source, and the soldering method disclosed in Patent Document 2 has a problem that it cannot be performed unless a power supply layer is laminated on the substrate.

  In view of the above problems, the present invention melts solder by using a current that flows when a component is operated on a component to be mounted on a circuit board without using an external heat source, and solders the component onto the circuit board. It is possible to provide a soldering apparatus and a soldering method that can be used.

  The present invention for solving the above-mentioned problems is a soldering apparatus for soldering a lead wire (5) of a component (1) operated by energization to a power supply land portion (4) provided on a circuit board (2). The conductive lead wire engaging portion (16) having an insertion portion (11) through which the lead wire (5) can be inserted, and the lead wire engaging portion (16) are connected to the lead wire (5 ) Are provided on the trunk part (12, 13) and the trunk part (12, 13) extending to the land part (4) side with a space therebetween, and flows through the trunk part (12, 13). A high-resistance heat generating part (12) that generates heat due to an electric current and conductive leg parts (14) provided on the land part (4) side of the body parts (12, 13) and electrically connected to the land part (4). 15), and a lead wire (5) having solder (8) attached to the outer peripheral portion in the vicinity of the land portion (4). Then, the lead wire (5) is inserted into the lead wire engaging portion (16), the leg portions (14, 15) are placed on the land portion (4), and the body portion (12, 13) is placed in the space. When current is passed through the land (4) through the lead wire (5) in a state where the solder (8) is accommodated, the solder (8) is melted by the heat generated in the heat generating part (12), and the melted solder ( The soldering apparatus is characterized in that the lead wire (5) and the land portion (4) are soldered by 8).

  Further, the present invention for solving the above-described problems is to solder a lead wire (5) of a component (1) that operates by energization to a power supply land (4) provided on a circuit board (2). In addition to attaching the component (1) to the circuit board (2) and attaching the solder (8) in the vicinity of the soldered portion of the lead wire (5), the lead wire (5) and the land portion (4) are attached. Is connected by a conductive member (10) having a conductive path outside the solder (8), and a high-resistance heating part (12) that generates heat when energized is interposed in the middle of the conductive member (10). When a current is passed through the lead wire (5) through the land portion (4), the solder (8) is melted by the heat generated in the heat generating portion (12), and the lead wire (5) is fused with the melted solder (8). Soldering, characterized in that the land (4) is soldered It is a method.

  Thereby, there is no interference area of an external heat source such as a soldering iron or a local solder nozzle, and electronic components can be mounted on the circuit board with high density, and as a result, the board can be miniaturized. Further, by supplying power to the product and directly heating the parts, a heating device on the facility side becomes unnecessary. Furthermore, it can be used repeatedly by using a soldering apparatus as a jig.

  In addition, the code | symbol attached | subjected above is an example which shows a corresponding relationship with the specific embodiment as described in embodiment mentioned later.

(A) is a partially cutaway side view of a motor which is an example of an electronic apparatus in which the soldering apparatus of the present invention is used, and (b) is a partially enlarged sectional view of part A shown in (a). (A) is a perspective view which shows the structure of the 1st Example of the soldering apparatus of this invention, (b) is a fragmentary sectional view of the state in which the soldering apparatus shown to (a) was attached to the circuit board, (c) is the top view which looked at the state in which the lead wire of the component was inserted in the soldering apparatus shown to (b) from the B direction of (b). FIG. 3 shows a current flow when the first soldering portion is soldered in the connection between the motor winding of the motor shown in FIG. 1A and the motor driving control circuit formed on the circuit board. It is a circuit diagram. FIG. 3 shows a current flow when the second soldering portion is soldered in the connection between the motor winding of the motor shown in FIG. 1A and the motor driving control circuit formed on the circuit board. It is a circuit diagram. FIG. 3 shows a current flow when the third soldering portion is soldered in the connection between the motor winding of the motor shown in FIG. 1A and the motor driving control circuit formed on the circuit board. It is a circuit diagram. (A) is a partially cutaway side view of a motor to which the soldering device of the second embodiment of the soldering device of the present invention is attached, and (b) is a second embodiment of the motor lead wire shown in (a). The perspective view explaining the process of attaching the soldering apparatus of an example, (c) is a partial expanded sectional view which shows the state by which the soldering apparatus of 2nd Example was attached to the lead wire of the motor like (b). It is. It is a perspective view which shows the structure of the 3rd Example of the soldering apparatus of this invention. (A) is a top view which shows the hole shape of the 1st Example of the lead wire penetration hole provided in the soldering apparatus of this invention, (b) is the 1st of the lead wire penetration hole provided in the soldering apparatus of this invention. The top view which shows the hole shape of 2 Example, (c) is a top view which shows the hole shape of 3rd Example of the lead wire penetration hole provided in the soldering apparatus of this invention, (d) is this invention It is a top view which shows the hole shape of the 4th Example of the lead wire penetration hole provided in a soldering apparatus. (A) is a portion showing a configuration of another embodiment of a circuit board in which a soldering energization circuit is connected to a land portion of the circuit board to which the soldering apparatus of the first to third embodiments of the present invention is attached. FIG. 4B is an enlarged cross-sectional view, and FIG. 4B is a partially enlarged view illustrating a problem that may occur when there is no energization circuit for soldering in the land portion of the circuit board to which the soldering apparatus shown in FIG. It is sectional drawing. The partially expanded sectional view which shows the structure of the further another Example of the circuit board which has the electricity supply circuit for soldering connected to the land part of the circuit board which attaches the soldering apparatus of the 1st to 3rd Example of this invention It is. (A) is a partial enlarged sectional view showing the configuration of a fourth embodiment of the soldering apparatus of the present invention, (b) is a soldering of the lead wire to the circuit board by the operation of the soldering apparatus shown in (a). It is a partial expanded sectional view which shows the state made.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. Moreover, also about each embodiment, the same code | symbol is attached | subjected to the part of the same structure, and the description is abbreviate | omitted or simplified.

  FIG. 1A shows a three-phase AC motor 1 that is an example of a component that operates by energization, in which the soldering apparatus of the present invention can be used, with a part thereof cut away. A three-phase AC motor 1 shown in FIG. 1A is a motor used for electric power steering. The three-phase AC motor 1 has a motor part 1M and a circuit part 1C, and the lead wire 5 connected to the motor winding (see FIG. 3) in the motor part 1M is soldered to the circuit board 2 in the circuit part 1C. Connected by attaching. FIG. 1B is a partially enlarged view of part A shown in FIG. 1A, and a lead wire 5 for supplying power to the motor part 1M is inserted into a mounting hole 6 provided in the circuit board 2. FIG. After being done, it shows a state where it is connected to the land portion 4 of the circuit board 2 by the solder 8.

  When the lead wire 5 is connected to the land portion 4 of the circuit board 2 by the solder 8, when the soldering is performed by the soldering iron, the area A1 shown in FIG. An electronic component cannot be mounted on the part. When soldering is performed by a local solder nozzle, the area A2 shown in the figure is an interference area of the local solder nozzle, and an electronic component cannot be mounted on this area. Therefore, when the lead wire 5 is formed by a soldering iron or a local solder nozzle, high-density mounting cannot be performed on the circuit board 2 and it is difficult to reduce the size of the product.

  FIG. 2A shows the appearance of the soldering apparatus 10 according to the first embodiment of the present invention in which the lead wire 5 is soldered to the land portion 4 in the portion A shown in FIG. FIG. 2B shows a state in which the soldering apparatus 10 shown in FIG. 2A is attached to the land portion 4 of the circuit board 2, and FIG. 2C shows the state shown in FIG. The state in which the lead wire 5 is inserted into the soldering apparatus 10 shown in FIG. 2B is seen from the direction B in FIG. Solder 8 is attached in the vicinity of the land portion 4 of the lead wire 5 protruding from the attachment hole 6 of the land portion 4. In this case, the solder 8 is obtained by winding the thread solder around the outer periphery of the lead wire 5, and the thread solder is wound once in the figure, but the number of windings and the winding shape of the thread solder are particularly limited. is not.

  The soldering apparatus 10 of the first embodiment includes a taper portion 12 having a lead wire insertion hole 11 through which the lead wire 5 can be inserted at the top, and a cylindrical body portion 13 is formed below the taper portion 12. is there. Further, a skirt portion 14 having a gradually increasing diameter is provided below the trunk portion 13, and a flange portion 15 is provided at the lower end portion of the skirt portion 14 over the entire circumference. Is placed on a portion indicated by a two-dot chain line of the land portion 4. Furthermore, a lead wire contact portion 16 that is in electrical contact with the outer periphery of the lead wire 5 is provided inside the taper portion 12 and the body portion 13. Although the soldering apparatus 10 of the first embodiment is made of sheet metal, only the tapered portion 12 has a large resistance value, and when a current flows through this portion, the tapered portion 12 generates heat. That is, the taper portion 12 is a resistor portion, but this resistor portion may be located anywhere in the soldering apparatus 10, and the entire soldering apparatus may be the resistor portion.

  As shown in FIG. 2A, the soldering device 10 configured as described above has the flange portion 15 placed on the land portion 4 by passing the lead wire 5 through the lead wire contact portion 16, and the flange portion 15 The part 15 and the land part 4 are brought into electrical contact. In this state, as shown in FIG. 2B, the leading end portion of the lead wire contact portion 16 contacts the solder 8. In FIG. 2B, the solder 8 is depicted as a cylindrical object. Further, the lead wire insertion hole 11 of the soldering apparatus 10 and the inner peripheral surface of the lead wire contact portion 16 are serrated or zigzag to improve the contact with the lead wire 5 as shown in FIG. The shape unevenness may be provided.

  When a current flows through the land portion 4 through the power supply pattern 3, the current flows from the land portion 4 to the soldering device 10 through the flange portion 15, and through the skirt portion 14, the trunk portion 13, the taper portion 12, and the lead wire contact portion 16. It flows to the lead wire 5. At this time, the taper portion 12 generates heat due to the current flowing through the taper portion 12 and becomes high temperature. The heat generated in the taper portion 12 is transmitted to the lead wire contact portion 16 and the lead wire 5, and the solder 8 is melted by this heat and flows to the land portion 4 side, and the land portion 4 and the lead wire 5 around the mounting hole 6 are connected. Solder. As a result, the land portion 4 and the lead wire 5 are soldered by the solder 8 as shown in FIG. After the land portion 4 and the lead wire 5 are soldered, the soldering device 10 can be removed from the circuit board 2.

  In order for the taper portion 12 to generate heat due to the current flowing through the taper portion 12 and become high temperature, and the solder 8 is melted by this heat, a current equal to or less than the operating current of the motor 1 may be passed through the lead wire 5. An example of the relationship between the resistance value of the taper part 12 and the current for causing the taper part 12 to generate heat by the current flowing through the taper part 12 and melting the solder 8 is 0.118 (Ω), The energization time is 15 seconds at a current value of 17 (A).

  And as a resistor used for the taper part 12, a copper-nickel wire, a nickel-chromium wire, or an iron-chromium wire can be used. Moreover, as a shape of a resistor, it can be set as a coil shape, a bamboo shoot shape, a multipoint foot shape, and a wire.

  FIG. 3A is a connection between the motor windings U, V, W of the three-phase AC motor 1 shown in FIG. 1A and a motor driving control circuit (motor driver) 2C formed on the circuit board 2. FIG. 3 is a circuit diagram showing a flow of current when soldering the first soldering portion H1. The first soldering part H1 is hereinafter simply referred to as a soldering part H1. When soldering the soldering part H1, the terminals C2, C6, C9 are energized to turn on the transistors T2, T6, T9. In this case, a positive current of 100 (A) from the external power supply 9 to the soldering part H1 passes through the transistor T6 as shown by a thick line, reaches the soldering part H1, and is attached to the soldering part H1. 2) is heated.

  The current flowing through the soldering part H1 is divided into the motor windings U and W and flows through the second and third soldering parts H2 and H3. The second and third soldering portions H2 and H3 are hereinafter simply referred to as soldering portions H2 and H3. Since the current flowing through the soldering portions H2 and H3 is 50 (A), the temperature of the soldering apparatus 10 (see FIG. 2) attached to the soldering portions H2 and H3 does not reach the temperature at which the solder is melted, and the solder is preheated. Is done. The current flowing through the soldering part H2 returns to the external power supply 9 through the transistor T2, and the current flowing through the soldering part H3 returns to the external power supply 9 through the transistor T9.

  FIG. 3B shows the connection between the motor windings U, V, W of the three-phase AC motor 1 shown in FIG. 1A and a motor drive control circuit (motor driver) 2C formed on the circuit board 2. FIG. 3 is a circuit diagram showing a flow of current when soldering a soldering portion H2. When soldering the soldering portion H2, the terminals C4, C8, and C9 are energized to turn on the transistors T4, T8, and T9. In this case, the positive current of 100 (A) from the external power source 9 reaches the soldering part H2 through the transistor T4 as shown by the thick line in the soldering part H1, and the soldering device attached to the soldering part H2 is heated. To do.

  The current flowing through the soldering portion H2 is divided into motor windings U and V, and flows through the first and third soldering portions H1 and H3. Since the current flowing through the soldering portions H1 and H3 is 50 (A), the temperature of the soldering device attached to the soldering portions H1 and H3 does not reach the temperature at which the solder is melted, and the solder is preheated. The current flowing through the soldering part H1 returns to the external power supply 9 through the transistor T8, and the current flowing through the soldering part H3 returns to the external power supply 9 through the transistor T9.

  3C is a connection between the motor windings U, V, W of the three-phase AC motor 1 shown in FIG. 1A and a motor driving control circuit (motor driver) 2C formed on the circuit board 2. FIG. FIG. 3 is a circuit diagram showing a current flow when soldering a soldering portion H3. When the soldering part H3 is soldered, the terminals C2, C8, C11 are energized to turn on the transistors T2, T8, T11. In this case, a positive current of 100 (A) from the external power source 9 reaches the soldering part H3 through the transistor T11 as shown by a thick line in the soldering part H3, and the soldering device attached to the soldering part H3 is heated. To do.

  The current flowing through the soldering portion H3 is divided into the motor windings V and W and flows through the first and second soldering portions H1 and H2. Since the current flowing through the soldering portions H1 and H2 is 50 (A), the temperature of the soldering device attached to the soldering portions H1 and H2 does not reach the temperature at which the solder is melted, and the solder is preheated. The current flowing through the soldering portion H1 returns to the external power supply 9 through the transistor T8, and the current flowing through the soldering portion H2 returns to the external power supply 9 through the transistor T2.

  In the embodiment shown in FIGS. 3A to 3C, the three soldering portions H1 to H3 in the three-phase AC motor 1 are soldered one by one. However, PWM control and power source measurement current control are used in combination. Thus, the three soldering portions H1 to H3 can be soldered simultaneously. Moreover, although the example which applied the electric current from the external power supply 9 and soldered was demonstrated, it can also solder using the electric current generated with the motor by driving a motor with an external actuator. Is possible. Further, for a product without an energization circuit, current may be directly applied to the resistor of the soldering apparatus without energization from the circuit board.

  FIG. 4A shows the three-phase AC motor 1 to which the soldering device 20 of the second embodiment of the present invention is attached, with a part cut away. In this embodiment, the lead wire 5 does not protrude to the circuit part 1C side of the circuit board 2, and the circuit component 7 is mounted on the circuit part 1C side of the circuit board 2. In order to solder the lead wire 5 of the three-phase AC motor 1 having such a configuration to the circuit board 2, the soldering device 20 of the second embodiment has a lead exposed on the motor unit 1 </ b> M side of the circuit board 2. It can be attached to the line 5 from the side.

  FIG. 4B illustrates the structure of the soldering device 20 of the second embodiment and the process of attaching the soldering device 20 to the lead wire 5 of the three-phase AC motor 1 shown in FIG. 4A. is there. FIG. 4C shows a state in which the soldering device 20 is attached to the lead wire 5 as shown in FIG. The lead wire 5 is inserted into a hole 6 </ b> A provided in the land portion 4, but the tip portion 5 </ b> T is in the circuit board 2 and does not protrude to the opposite side of the circuit board 2. A solder 8 is attached in the vicinity of the hole 6 </ b> A of the lead wire 5. In this case, the solder 8 is obtained by winding the thread solder around the outer periphery of the lead wire 5, and the thread solder is wound once in the figure, but the number of windings and the winding shape of the thread solder are particularly limited. is not.

  The soldering apparatus 20 according to the second embodiment includes an upper bottom portion 23 having a lead wire contact portion 26 that contacts the lead wire 5, and a tapered skirt portion having a diameter gradually increasing on the lower side following the upper bottom portion 23. 24, and a flange portion 25 is provided at the lower end of the skirt portion 24. A high-resistance resistor 22 is provided in the middle of the skirt 24. The resistor portion 22 of this embodiment protrudes from the front side and the back side of the skirt portion 24, but may not protrude from the skirt portion 24 if a desired resistance value can be obtained. Furthermore, the soldering apparatus 20 of the second embodiment is provided with the lead wire 5 on the upper bottom portion 23, the skirt portion 24 including the resistor portion 22, and the flange portion 25 in order to be attached to the lead wire 5 from the lateral direction. A lead wire receiving notch 21 is provided for fitting into the.

  The soldering apparatus 20 of the second embodiment is also made of sheet metal, but only the resistor portion 22 has a large resistance value. When a current flows through this portion, the resistor portion 22 generates heat. The resistor 22 may be located anywhere on the soldering device 20, and the entire soldering device may be the resistor. The soldering device 20 configured as described above can be attached to the lead wire 5 from the lateral direction. That is, the lead wire 5 to which the solder 8 is attached is received from the lead wire receiving notch 21 and the soldering device 20 is pressed against the lead wire 5 so that the flange portion 25 reaches the land portion 4 to the position indicated by the two-dot chain line. And the state shown in FIG. Inside the circuit board 2 located below the hole 6A, there is a cavity 6B, and the tip 5T of the lead wire 5 is located in this cavity 6B.

  When a current is passed through the land portion 4 through the power supply pattern 3 in the state shown in FIG. 4C, the current flows from the land portion 4 through the flange portion 15 to the soldering device 20 and leads through the skirt portion 24 and the lead wire contact portion 26. Flows on line 5. At this time, the resistor portion 22 generates heat due to the current flowing through the resistor portion 22 and becomes high temperature. The heat generated in the resistor portion 22 is transmitted to the lead wire contact portion 26 and the lead wire 5, the solder 8 is melted by this heat and flows to the land portion 4 side, and the land portion 4 and the lead wire 5 around the hole 6 </ b> A are passed through. Solder. As a result, the land portion 4 and the lead wire 5 are soldered by the solder 8 as shown in FIG. After the land portion 4 and the lead wire 5 are soldered, the soldering device 10 can be pulled out in the lateral direction of the circuit board 2 and removed.

  In the embodiment described with reference to FIG. 4, the soldering device 10 is pulled out in the lateral direction of the circuit board 2 after soldering and removed. However, if there is no problem in product specifications, the soldering device after soldering is used. It is also possible to leave 10 without removing it. If the soldering device (resistor) 10 is a component part of the product and is not taken out after soldering, the notch is not required and soldering can be performed in a completely sealed state.

  FIG. 5 shows a configuration of a soldering apparatus 30 according to a third embodiment of the present invention. The soldering apparatus 30 of the third embodiment is similar to the soldering apparatus 10 of the first embodiment described above when the lead wire 5 of the motor 1 is inserted through the circuit board 2 and protrudes to the opposite side. Can be used. The soldering device 30 according to the third embodiment includes an upper bottom 33 having a lead wire insertion hole 31 through which the lead wire 5 is inserted, and a tapered skirt having a diameter gradually increasing on the lower side following the upper bottom 33. There is a multi-leg part 34 which is cut and cut. The front end portion of each multi-leg portion 34 is bent to form an attachment foot 35. The attachment foot 35 may be curved with respect to the multi-leg portion 34 to form a curled foot 35C. Further, a high-resistance resistor portion 32 is provided in the middle of each piece of the multi-leg portion 34. The resistor portion 32 of this embodiment is flush with the multi-leg portion 34. Further, the peripheral portion of the lead wire insertion hole 31 is a lead wire connecting portion 36 having a shape that bites into the lead wire 5. Since the usage of the soldering apparatus 30 of the third embodiment is the same as that of the soldering apparatus 10 of the first embodiment, the description thereof is omitted.

  As mentioned above, although the Example which shows the shape of some resistor parts was described, the shape of a resistor part can be various shapes other than the Example mentioned above. For example, other resistor portions may have a coil shape, a bamboo shoot shape, or the like, and one end may be connected to the lead wire and the other connected to the land portion of the substrate. Moreover, the cross section of the wire constituting the resistor portion may be round, square, or pipe-shaped.

  FIG. 6 shows an embodiment of the shape of the lead wire insertion holes 11 and 31 for inserting the lead wire 5 in the soldering apparatuses 10 and 30 of the present invention. The first embodiment of the lead wire insertion holes 11 and 31 shown in FIG. 6A is a simple circular hole. A second embodiment of the lead wire insertion holes 11 and 31 shown in FIG. 6B is a circular hole having a zigzag circumference. The third embodiment of the lead wire insertion holes 11 and 31 shown in FIG. 6C is a polygonal hole. In the third embodiment, it is a hexagonal hole, but it may be polygonal. The fourth embodiment of the lead wire insertion holes 11 and 31 shown in FIG. 6D is a cross slit-shaped hole. When the lead wire is inserted into the cross slit-shaped holes 11 and 31, the lead wire can be inserted by bending the periphery of the cross slit indicated by the symbol D along the lead wire.

  FIG. 7A shows a circuit in which a current-carrying circuit 43 for soldering is connected to the land portion 4 of the circuit board 2 to which the soldering apparatuses 10, 20, and 30 of the first to third embodiments of the present invention are attached. The structure of another Example of the board | substrate 2 is shown. FIG. 7A shows the soldering apparatus 10 of the first embodiment as a soldering apparatus. Since the structure of the soldering apparatus 10 of the first embodiment has already been described, the same reference numerals are given here and the description thereof is omitted. FIG. 7B shows the circuit board 2 shown in FIG. 2B for comparison. In the circuit board 2 shown in FIGS. 7A and 7B, the mounting hole 6 shown in FIG. 2B is a through hole 6T in which a copper foil is also provided on the inner peripheral surface. The portion 4 is electrically connected to the back surface pattern 4P provided on the back surface side of the circuit board 2.

  In the embodiment shown in FIG. 7A, the land portion 4 shown in FIG. 7B is divided into an inner land portion 4A and an outer land portion 4B, and the inner land portion 4A and the outer land portion 4B are circuitous. It is insulated by the insulating part 42 of the substrate 2. An inner land portion 4A shown in FIG. 7A corresponds to the land portion 4 shown in FIG. 7B and has the same function as the land portion 4. On the other hand, the land portion 4B is used only for soldering the land portion 4A and the lead wire 5, and the land portion 4B is connected to a soldering energizing circuit 43 provided inside the circuit board 2. Yes. Although not shown, the soldering energization circuit 43 is connected to a power supply terminal or pin somewhere on the circuit board 2.

  The flange portion 15 of the soldering apparatus 10 of the first embodiment is connected only to the outer land portion 4B, and is not connected to the inner land portion 4A. 7A and 7B, the solder 8 is described on the lead wire 5 as a truncated cone-like object. However, the solder 8 may be attached by winding the thread solder around the lead wire 5.

  In this embodiment, when a current is supplied to the outer land portion 4B through the soldering energization circuit 43, the current flows from the outer land portion 4B to the soldering device 10 through the flange portion 15, and the skirt portion 14, the trunk portion 13, and the taper portion. 12 and the lead wire contact portion 16 to the lead wire 5. At this time, the taper portion 12 generates heat due to the current flowing through the taper portion 12, and this heat is transmitted to the lead wire contact portion 16 and the lead wire 5, so that the solder 8 is melted and the inner land portion 4A and the lead wire 5 around the through hole 6T. And are soldered. After the inner land portion 4A and the lead wire 5 are soldered, the soldering device 10 can be removed from the outer land portion 4B.

  The reason why soldering is performed by flowing current from the outer land portion 4B to the soldering device 10 through the soldering energization circuit 43 during soldering will be described. As shown in FIG. 7B, when a current is passed from the land portion 4 to the soldering apparatus 10 and soldered, the solder 8 is detached from the lead wire 5 and falls onto the land portion 4 before the solder 8 is sufficiently melted. there is a possibility. In this case, since the solder 8 is not sufficiently melted, the land portion 4 and the lead wire 5 are not reliably soldered by the solder 8. However, the land portion 4 and the lead wire 5 are not sure, but are electrically connected by the solder 8, so that no current flows through the soldering device 10. As a result, a soldering failure occurs between the land portion 4 and the lead wire 5. When soldering a small product or a product having a large amount of solder, the soldering energization circuit 43 shown in FIG. 7A may be provided in the circuit board 2.

  FIG. 8A shows a circuit in which an energizing circuit 43 for soldering is connected to the land portion 4 of the circuit board 2 to which the soldering devices 10, 20, and 30 of the first to third embodiments of the present invention are attached. The structure of another Example of the board | substrate 2 is shown. FIG. 8A shows a soldering apparatus 10A as a modification of the soldering apparatus 10 of the first embodiment as a soldering apparatus. Since the structure of the soldering apparatus 10A of the modified example is the same as the structure of the soldering apparatus 10 of the first embodiment, the same reference numerals are given and description thereof is omitted.

  In the embodiment shown in FIG. 8A, a soldering land portion 44 is provided on the outside of the land portion 4, and the configuration of the land portion 4 is the same as in the previous embodiments. The soldering land portion 44 and the land portion 4 are insulated by the insulating portion 42 of the circuit board 2. The soldering land portion 44 is used only for soldering the land portion 4 and the lead wire 5, and the soldering land portion 44 is provided on the circuit board 2 and is not shown in FIG. Connected to the circuit. Similarly, the soldering energization circuit is connected to a power supply terminal or pin somewhere on the circuit board 2. The soldering apparatus 10 </ b> A is connected only to the soldering land portion 44 and is not connected to the land portion 4. The solder 8 is a thread solder wound around the lead wire 5. Since the operation of the embodiment shown in FIG. 8B is the same as that of the embodiment shown in FIG.

  FIG. 9A shows the configuration of a soldering apparatus 40 according to the fourth embodiment of the present invention. The soldering apparatus 40 of the fourth embodiment has a configuration in which the heat generating portion 41 is embedded in the circuit board 2. The heat generating portion 41 is disposed in the circuit board 2 in a state of being electrically connected to the land portion 4, and the land portion 4 is formed with a lead wire receiving recess 45 that is recessed toward the heat generating portion 41. Yes. One end of a power supply circuit 43 formed inside the circuit board 2 is connected to the heat generating portion 41, and the other end of the power supply circuit 43 is connected to an energization terminal provided somewhere on the circuit board 2. The leading end portion 5T of the lead wire 5 is placed in the lead wire receiving recess 45, and solder 8 is attached in the vicinity of the leading end portion 5T of the lead wire 5.

  As described above, when a current is passed from the power supply circuit 43 to the lead wire 5 through the heat generating portion 41 by energizing the energizing terminal with the tip portion 5T of the lead wire 5 connected to the lead wire receiving recess 45, the heat generating portion 41 generates heat. Then, the solder 8 is melted by the heat generated by the heat generating portion 41, and the lead wire 5 and the land portion 4 are soldered as shown in FIG. 9B.

DESCRIPTION OF SYMBOLS 1 Three-phase AC motor 2 Circuit board 4, 4A, 4B Land part 5 Lead wire 6 Mounting hole 6T Through hole 8 Solder 10, 20, 30, 40 Soldering device 12, 22, 32 Heat generating part

Claims (17)

A soldering device for soldering a lead wire (5) of a component (1) that operates by energization to a power supply land portion (4) provided on a circuit board (2),
A conductive lead wire engaging portion (16) having an insertion portion (11) through which the lead wire (5) can be inserted;
A body portion (12, 13) connected to the lead wire engaging portion (16) and extending toward the land portion (4) with a space between the lead wire (5);
A high resistance heat generating part (12) provided in the body part (12, 13) and generating heat by a current flowing through the body part (12, 13), and the land part (4) of the body part (12, 13). ) Side and provided with conductive legs (14, 15) electrically connected to the land (4),
The lead wire (5) is inserted into the lead wire engaging portion (16) with respect to the lead wire (5) to which the solder) 8) is attached to the outer peripheral portion in the vicinity of the land portion (4), The leg (14, 15) is placed on the land (4), and the solder (8) is accommodated in the space of the trunk (12, 13). When a current is passed through the land portion (4), the solder (8) is melted by the heat generated in the heat generating portion (12), and the lead wire (5) and the land portion are melted by the melted solder (8). (4) Soldering apparatus characterized by soldering.   The soldering device according to claim 1, wherein the legs (13, 14) are provided with skirt-shaped conductors (14).   The soldering device according to claim 1, wherein the legs (13, 14) are provided with a multi-leg conductor (34).   The said heat generating part (12) is provided in any one or both of the said trunk | drum (12,13) and the said leg part (14,15,24,34), The Claim 1 to 3 characterized by the above-mentioned. The soldering apparatus according to any one of the above.   5. The soldering device according to claim 1, wherein a current flowing through the lead wire (5) through the land portion (4) is equal to or less than an operating current of the component (1). . The component (1) is attached to the opposite side of the land portion (4) of the circuit board (2),
The soldering device according to any one of claims 1 to 5, wherein the land portion (4) is provided with a through hole (6) through which the lead wire (5) is inserted.   The soldering device according to claim 6, wherein the through hole (6) is a through hole (6T).   In the soldering apparatus, the lead wire engaging portion (16) is connected to the lead wire (5) from the free end side of the lead wire (5) in a state where the lead wire (5) is inserted through the through portion (6). 8. The device according to claim 6, wherein the lead wire is removed from the lead wire after being energized to the soldering device after being inserted into the land portion and placed on the land portion. Soldering device. The component (1) is attached to the land part (4) side of the circuit board (2),
The land (4) is provided with a hole (6A) that does not reach the back side of the circuit board (2).
In the component (1), the tip of the lead wire (5) is inserted into the hole (6A),
The insertion portion (26) through which the lead wire (5) can be inserted is a groove portion (21) having an opening,
In the soldering apparatus, the groove portion (21) extends from the lateral direction of the lead wire (5) to the lead wire (5) in a state where the leading end portion of the lead wire (5) is inserted into the hole (6A). 6. The device according to claim 1, wherein the lead wire is inserted and placed on the land portion (4), and is removed from the lead wire (5) after energization to the soldering device is completed. The soldering apparatus as described.   In the soldering apparatus, the lead wire engaging portion (16) is connected to the lead wire (5) from the free end side of the lead wire (5) in a state where the lead wire (5) is inserted through the through portion (6). 8. The device according to claim 6, wherein the device is inserted into the land portion (4) and placed on the land portion (4), and is left on the land portion (4) after energization to the soldering apparatus is finished. Soldering equipment. The component (1) is attached to the land part (4) side of the circuit board (2),
The land (4) is provided with a hole (6A) that does not reach the back side of the circuit board (2).
The component (1) is inserted into the hole (6A) after the tip of the lead wire (5) has passed through the insertion part (26) of the soldering device,
The soldering device is placed on the land portion (4) in a state where the lead wire (5) is inserted through the insertion portion (26), and after the energization to the soldering device is completed, the land portion ( 4) The soldering apparatus according to any one of claims 1 to 5, wherein the soldering apparatus is left on.   The energization to the land portion (4) for supplying current to the lead wire (5) is provided to the circuit board (2) from a constant current circuit (9) provided outside the circuit board (2). The soldering device according to claim 1, wherein the soldering device is performed through a power supply pattern (3).   The energization to the land portion (4) for supplying current to the lead wire (5) is provided to the circuit board (2) from a constant current circuit (9) provided outside the circuit board (2). 12. The soldering apparatus according to claim 1, wherein the soldering apparatus is provided through a dedicated circuit (43) provided separately from the power supply pattern (3) and connected to the land portion (4). .   The component (1) is a three-phase AC motor in which the lead wire (5) is soldered to the circuit board (2) at three locations, and the constant current circuit (43) has pulse width modulation control and power supply side The soldering apparatus according to claim 12 or 13, wherein the soldering is performed at the three locations simultaneously using constant current control. A soldering method for soldering a lead wire (5) of a component (1) operated by energization to a power supply land portion (4) provided on a circuit board (2),
Attaching the component (1) to the circuit board (2) and attaching a solder (8) in the vicinity of the soldering portion of the lead wire (5),
The lead wire (5) and the land portion (4) are connected by a conductive member (10) having a conductive path outside the solder (8),
In the middle of the conductive member (10), a high-resistance heating part (12) that generates heat when energized is interposed,
When a current is passed through the lead wire (5) through the land portion (4), the solder (8) is melted by the heat generated in the heat generating portion (12), and the lead wire is melted by the melted solder (8). (5) A soldering method, wherein the land portion (4) is soldered.   The conductive member (10) is connected to the conductive lead wire engaging portion (16) having an insertion portion (11) through which the lead wire (5) can be inserted, and the lead wire engaging portion (16). And the body (12, 13) extending toward the land (4) with a space between the lead wire (5) and the body (12, 13). A high resistance heat generating part (12) that generates heat by a current flowing through the body part (12, 13), and the land part (4) provided on the land part (4) side of the body part (12, 13). Soldering device according to claim 15, characterized in that it is a soldering device comprising conductive legs (14, 15) electrically connected to the lead wire (5). Method. The heat generating portion (41) is disposed in the circuit board (2) in a state of being electrically connected to the land portion (4), and the land portion (4) includes the heat generating portion ( 41) a recess (45) is formed on the side, and one end of a power circuit (43) formed inside the circuit board (2) is connected to the heat generating part (41), and a power circuit ( 43) is connected to the energizing terminal of the circuit board (2),
The lead wire (5) and the land portion (4) are soldered by energizing the energization terminal with the lead wire (5) connected to the recess (45). The soldering method according to claim 15, wherein:

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