JP2014192221A - Electronic component and manufacturing method of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component capable of reducing the size and thickness of the electronic component while favorably sealing the space of the electronic component.
A first wiring board 3, a second wiring board 4 having a second conductor layer 4b,
An electronic element comprising a functional body 2b provided on the element substrate 2a, a wiring 2c extending from the functional body 2b to the outer peripheral side of the element substrate 2a, and an element pad 2d provided at a position corresponding to the second conductor layer 4b 2, the electronic element 2 includes an insulating layer 5 provided so as to expose a part of the element pad 2 and surround the functional body 2 b, and an element pad 2 exposed from the insulating layer 5. The conductive bonding material 6 is provided above, and the conductive bonding material 6 and the second conductor layer 2b are electrically connected.
[Selection] Figure 3

Description

The present invention relates to a surface acoustic wave (SAW) element, a piezoelectric thin film resonator (F).
The present invention relates to an electronic component including an electronic element such as BAR (Film Bulk Acoustic Resonator) and a method for manufacturing the same.

  In a conventional electronic component, an electronic element is mounted on a wiring board through a space that accommodates a functional body, and in order to completely seal this space, the side of this space is surrounded from the surface of the electronic element. A sealing resin layer was provided over the surface of the wiring board. In recent years, there has been a demand for miniaturization of electronic components, and a structure in which an insulating layer is provided on each of an electronic element and a wiring board to form a space for accommodating a functional body and is sealed is known. An example of such an electronic component is disclosed in Patent Document 1.

JP 2003-37471 A

  However, since an insulating layer is provided on each of the electronic element and the wiring board, it is difficult to reduce the thickness of the electronic component, and since the wiring board has a single-layer structure, the routing of the wiring is limited and the design of the wiring pattern is limited. There was a problem that the degree of freedom was low and it was difficult to miniaturize electronic components.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to provide an electronic component that can be suitably sealed with respect to the space of the electronic component and can be reduced in size and thickness using a multilayer wiring board. Is to provide.

An electronic component according to an aspect of the present invention includes a first through conductor, a first wiring board having a first conductor layer provided on the first through conductor, and the first wiring board. Laminated in the thickness direction,
A second conductor layer having a second through conductor located on the first conductor layer and having a second conductor layer electrically connected to the first conductor layer via the second through conductor; A wiring substrate; an element substrate; a functional body provided on the element substrate; a wiring extending from the functional body to an outer peripheral side of the element substrate; and the second conductor layer electrically connected to the wiring And an electronic element comprising an element pad provided at a position corresponding to the insulating element, wherein the electronic element exposes at least a part of the element pad and surrounds the functional body; and A conductive bonding material provided on the element pad exposed from the insulating layer, and the conductive bonding material and the second conductor layer are electrically connected to each other. Is.

The electronic component manufacturing method according to an aspect of the present invention is an electronic component manufacturing method including an electronic element and a multilayer wiring board, and is provided on the first through conductor and the first through conductor. A first wiring board having a first conductor layer, and a second through conductor that is laminated in the thickness direction of the first wiring board and located on the first conductor layer, and A wiring mother board provided with a plurality of the multilayer wiring boards comprising a second wiring board having a second conductor layer electrically connected to the first conductor layer through a through conductor of An element substrate, a functional body provided on the element substrate, a wiring extending from the functional body to the outer peripheral side of the element substrate, and the second conductor layer electrically connected to the wiring A plurality of the electronic elements including element pads provided at positions corresponding to And a step of providing an element mother substrate, a step of exposing at least a part of the element pad to the element mother substrate and providing an insulating layer so as to surround the functional body, and a step of exposing from the insulating layer. A step of providing a conductive bonding material on the element pad; and the second conductive layer of the wiring mother board and the conductive bonding material of the element mother board are bonded to face each other and bonded to each other. And a step of electrically bonding the conductive bonding material and a step of simultaneously cutting the bonded wiring motherboard and the element motherboard to separate them into a plurality of the electronic components. To do.

  According to the electronic component of the present invention, it is possible to make the sealing property for the space of the electronic component suitable and to reduce the size and thickness by using the multilayer wiring board.

(A) And (b) is a perspective view which shows the external appearance of the electronic component which concerns on embodiment of this invention. It is a disassembled perspective view of the electronic component shown in FIG. It is sectional drawing in AA of the electronic component shown to Fig.1 (a). (A) is a top view of the electronic element of the electronic component shown in FIG. 1, (b) is an enlarged view of B area | region shown to (a). FIG. 2 is a plan view of an element substrate of the electronic component shown in FIG. 1 and a cross-sectional view corresponding thereto. (A)-(c) is explanatory drawing for demonstrating the formation area of the insulating layer provided in an element substrate. It is sectional drawing of the electronic component which shows the other example of embodiment of this invention. It is sectional drawing of the electronic component which shows the other example of embodiment of this invention. (A)-(e) is sectional drawing for demonstrating the manufacturing method of an electronic element. (A) is sectional drawing of the 1st wiring board of the electronic component shown in FIG. 1, (b) is a top view for demonstrating the circuit pattern provided on the 1st wiring board. It is sectional drawing for demonstrating the manufacturing method of the electronic component shown in FIG. It is explanatory drawing for demonstrating the element mother board of an electronic element. It is explanatory drawing for demonstrating the wiring mother board of a wiring board. It is explanatory drawing for demonstrating the manufacturing method of the electronic component manufactured from an element mother board and a wiring mother board. It is sectional drawing for demonstrating the manufacturing method of the electronic component shown in FIG. It is explanatory drawing for demonstrating the wiring mother board of a wiring board. It is explanatory drawing for demonstrating the manufacturing method of the electronic component manufactured from an element mother board and a wiring mother board.

  Hereinafter, an electronic component according to an embodiment of the present invention will be described with reference to the drawings. Note that the drawings used in the following description are schematic, and the dimensional ratios and the like on the drawings do not necessarily match the actual ones.

In the description of the embodiments and the like, components that are the same as or similar to those already described may be denoted by the same reference numerals and description thereof may be omitted.
<Embodiment>
Hereinafter, an electronic component according to an embodiment of the present invention will be described with reference to FIGS. 1 to 7.

The electronic component 1 according to the embodiment is configured as shown in FIGS. 1 to 3, and includes a first through conductor 3c and a first conductor layer 3b provided on the first through conductor 3c. 1 wiring board 3
And the first conductor layer 3b that is laminated in the thickness direction of the first wiring board 3 and that is located on the first conductor layer 3b and that is located via the second through conductor 4c. A second wiring substrate 4 having a second conductor layer 4b electrically connected to the element substrate 2a, a functional body 2b provided on the element substrate 2a, and an outer peripheral side of the element substrate 2a from the functional body 2b. And an electronic element 2 comprising an element pad 2d electrically connected to the wiring 2c and provided at a position corresponding to the second conductor layer 4b. An insulating layer 5 provided to expose at least a part of 2d and surround the functional body 2, and a conductive bonding material 6 provided on the element pad 2d exposed from the insulating layer 5, The conductive bonding material 6 and the second conductor layer 4 are electrically connected. Are those connected.

  FIG. 1 is a schematic perspective view showing an external appearance of an electronic component 1 according to an embodiment of the present invention. FIG. 1A is a perspective view of the external appearance of the electronic component 1 as viewed from the upper surface 1a side. FIG. 1B is a perspective view of the external appearance of the electronic component 1 as viewed from the lower surface 1b side. FIG. 2 is an exploded perspective view of the electronic component 1 and shows the electronic element 2, the first wiring board 3, and the second wiring board 4, respectively. FIG. 3 is a cross-sectional view taken along line AA of the electronic component 1 shown in FIG.

  The electronic component 1 may have either direction upward or downward. For convenience of explanation, the electronic component 1 defines an orthogonal coordinate system XYZ, and uses the word “upper surface” or “lower surface” with the positive side in the Z direction upward. To do.

  As shown in FIG. 1, the electronic component 1 is formed in a substantially rectangular parallelepiped shape, for example, and a plurality of external terminals 12 are provided in an appropriate shape and an appropriate number on the lower surface 1 b. The external terminal 12 is exposed from the lower surface 1b. The number, position, role, and the like of the plurality of external terminals 12 may be appropriately set according to the internal configuration of the electronic component 1. For example, the plurality of external terminals 12 are provided in a square shape, but may be provided in a circular shape. In the present embodiment, the case where the four external terminals 12 are provided at the four corners of the lower surface 1b of the electronic component 1 is illustrated. The lower surface 1b of the electronic component 1 and the lower surface 3ab of the first wiring board 3 are the same surface.

  Moreover, the electronic component 1 has, for example, a length of one side of 1.1 (mm) to 1.5 (mm), and the size can be set appropriately.

  The electronic component 1 is disposed with the lower surface 1b facing a mounting board (not shown), and connection pads (not shown) provided on the mounting board and a plurality of external terminals 12 are connected via solder bumps or the like. Then, it is mounted on the mounting substrate by being electrically joined.

  The electronic component 1 receives a signal, for example, via any of the plurality of external terminals 12, performs a predetermined process on the input signal, and outputs the signal from any of the plurality of external terminals 12.

  As shown in FIG. 1, the electronic component 1 includes a first wiring board 3 and a second wiring board 4, and an electronic element 2 mounted on the second wiring board 4. In addition, as shown in FIGS. 2 and 3, in the electronic component 1, the electronic element 2 is bonded onto the second wiring substrate 4 via a space S that houses the functional body 2 b.

  Here, the first wiring board 3 and the second wiring board 4 will be described below.

As shown in FIG. 3, the first wiring board 3 includes a first insulator 3a, a first conductor layer 3b formed on the upper surface 3aa of the first insulator 3a, and a first insulator 3a. A first through conductor 3c penetrating in the vertical direction, and a third conductor layer 3d formed on the lower surface 3ab of the first insulator 3a and electrically connected to the first through conductor 3c. doing. Furthermore, an external terminal 12 is provided on the third conductor layer 3d formed on the lower surface 3ab of the first insulator 3a.

  Further, as shown in FIG. 3, the second wiring board 4 includes a second insulator 4a, a second conductor layer 4b formed on the upper surface 4aa of the second insulator 4a, and a second insulation. It has the 2nd penetration conductor 4c which penetrates body 4a in the up-and-down direction. The first conductor layer 3b and the second conductor layer 4b are electrically joined via the second through conductor 4c.

  Therefore, the electronic component 1 is composed of two wiring boards composed of the first wiring board 3 and the second wiring board 4, that is, so-called multilayer wiring boards. The electronic component 1 may further be configured by a multilayer wiring board in which three or more wiring boards are stacked. In the present embodiment, the case where the electronic component 1 is configured by a two-layer wiring board including a first wiring board 3 and a second wiring board 4 is illustrated. A multilayer wiring board composed of the first wiring board 3 and the second wiring board 4 is referred to as a multilayer wiring board ML. The multilayer wiring board ML may be composed of three or more layers of wiring boards.

  In the first wiring board 3, a circuit pattern 8 is provided on the upper surface 3aa of the first insulator 3a. The circuit pattern 8 is provided continuously from the first conductor layer 3b and is integrated with the first conductor layer 3b. That is, the circuit pattern 8 is provided so as to be incorporated between the first insulator 3a and the second insulator 4a. The circuit pattern 8 will be described later.

  As shown in FIG. 2, the first insulator 3a and the second insulator 4a are formed, for example, in a generally thin rectangular parallelepiped shape. Moreover, the 1st insulator 3a and the 2nd insulator 4a are formed including the inorganic material of resin, a ceramic, and / or an amorphous state, for example. The first insulator 3a and the second insulator 4a may be made of a single material, or may be made of a composite material such as a substrate in which a base material is impregnated with a resin. Good. The first insulator 3a and the second insulator 4a may be provided with a fiber layer having excellent rigidity inside the resin.

  In the first wiring board 3 and the second wiring board 4, the first insulator 3a and the second insulator 4a are specifically made of an aluminum oxide sintered body or an aluminum nitride sintered body. A ceramic material such as a mullite sintered body, a silicon carbide sintered body, or a glass ceramic sintered body is used. An organic resin material such as polyimide resin, cyanate resin, epoxy resin, or polyphenylene ether resin is used. Furthermore, a composite material obtained by mixing an inorganic material such as ceramic or glass with an organic resin material such as an epoxy resin can also be used.

  The multilayer wiring board ML is a conductor in which the first wiring board 3 and the second wiring board 4 are formed by patterning a copper foil on an insulator obtained by impregnating and curing an organic resin on a base material made of glass fiber, for example. A layer may be formed and an insulator and a conductor layer may be alternately laminated.

  The multilayer wiring board ML includes a first wiring board 3 and a second wiring board 4 in which, for example, an insulator (insulating layer) and a conductor layer are stacked on a support substrate (core substrate) 13; Alternatively, a structure of a so-called coreless substrate in which the core substrate is removed after laminating the insulator (insulating layer) and the conductor layer by a build-up method may be used. Note that the number of stacked layers by the build-up method can be appropriately set according to the internal configuration of the electronic component 1 or the like. By adopting the coreless substrate, the multilayer wiring substrate ML can be made thin as the first wiring substrate 3 and the second wiring substrate 4 are thinned as a whole.

The first conductor layer 3b, the second conductor layer 4b, and the third conductor layer 3d are formed of a metal material such as copper, tungsten, or molybdenum. Similarly, the first through conductor 3c and the second through conductor 4c are formed of a metal material such as copper, tungsten, or molybdenum. The second conductor layer 4b formed on the upper surface 4aa of the second insulator 4a may have a plating layer on the surface in order to improve the bondability with the conductive bonding material 6. The plating layer is formed, for example, by performing chromium plating, nickel plating, and gold plating on the surface of the second conductor layer 4b.

  Here, an example of the circuit pattern 8 will be described with reference to FIG.

  As shown in FIG. 10, the circuit pattern 8 is provided on the upper surface 3 aa of the first insulator 3 a of the first wiring board 3. That is, the circuit pattern 8 is provided between the first insulator 3a and the second insulator 4a. In FIG. 10B, the position where the second through conductor 4c is provided is indicated on the circuit pattern 8 by a broken line.

  As shown in FIG. 10, the circuit pattern 8 is formed on the first insulator 3a at the same time as the first conductor layer 3b, and is electrically connected to the first conductor layer 3b. That is, the circuit pattern 8 is continuously provided from the first conductor layer 3b on the same plane on the first insulator 3a. The circuit pattern 8 is electrically connected to the element pad 2a of the electronic element 2 through the second through conductor 4c, the second conductor layer 4b, and the conductive bonding material 6.

  The circuit pattern 8 is, for example, a capacitance pattern 8a and a spiral line-shaped inductor pattern 8b. The inductor pattern 8b forms an inductor, and the capacitor pattern 8a forms a capacitor.

  When the electronic component 1 constitutes a peripheral circuit used in combination with the electronic element 2, the peripheral circuit is constituted by a combination of an inductor element for an inductor, a capacitive element for a capacitor, a resistive element for a resistor, or the like. Is done. The peripheral circuit is, for example, a matching element or an LC filter.

  In the circuit pattern 8, for example, a GND pattern 8A is formed on the lower surface 3ab of the first wiring board 3 so as to face the capacitance pattern 8a, and a capacitance is formed between the GND pattern 8A and the capacitance pattern 8a. Can do.

  In this way, the electronic component 1 can form an LC filter composed of an inductor and a capacitor with the circuit pattern 8 on the first insulator 3a, for example, so that the LC filter is provided in combination with the functional body 2b. be able to. Further, the circuit pattern 8 is not limited to the capacitance pattern 8a or the inductor pattern 8b. For example, a resistance pattern or the like may be provided on the upper surface 3aa of the first insulator 3a.

  Therefore, in the electronic component 1, since the circuit pattern 8 is provided on the same plane between the first insulator 3a and the second insulator 4a to form a capacitor or an inductor, No capacitor or inductor is required. Therefore, the electronic component 1 can be prevented from increasing in size, and can be reduced in size and thickness. Further, since the circuit pattern 8 is provided so as to be built in between the first insulator 3a and the second insulator 4a, the electronic component 1 has a planar direction as before the circuit pattern 8 is provided. Since the size of (XY plane) is maintained, an increase in size is suppressed.

  Moreover, since the electronic component 1 can provide the circuit pattern 8 between the 1st insulator 3a and the 2nd insulator 4a by using the multilayer wiring board ML, freedom of design of the circuit pattern 8 is possible. The degree becomes higher.

  Further, the electronic component 1 can be formed with a capacitance or an inductor inside the electronic component 1 as compared with the case where an external component is used, so that the wiring length is shortened, and an unnecessary capacitance component or an unnecessary inductor component is formed. Can be suppressed. Thus, the electronic component 1 can be reduced in size and thickness, and can be improved in performance.

  The multilayer wiring board ML including the first wiring board 3 and the second wiring board 4 is manufactured by stacking the first wiring board 3 and the second wiring board 4 by using, for example, a build-up method. Is done. Moreover, the manufacturing method of the 1st wiring board 3 and the 2nd wiring board 4 may be the same as the manufacturing method of a general wiring board. In addition, the method of manufacturing the wiring mother board 3A or the wiring mother board 3A1 which becomes the multilayer wiring board ML by being divided is the same as the manufacturing method of a general wiring board.

  An example of a method for manufacturing the multilayer wiring board ML is shown below.

  First, in the first insulator 3a, the third conductor layer 3d is formed on the lower surface 3ab by a known photolithography method or the like. And as for this 1st insulator 3a, the through-hole which penetrates the 1st insulator 3a from the upper surface 3aa using a laser or a drill is formed on the 3rd conductor layer 3d. Next, after the first insulator 3a is provided with a metal material such as copper on the upper surface 3aa, the first through conductor 3c is formed in the through hole by using a well-known photolithography method or the like and the upper surface 3aa A first conductor layer 3b is formed on 3aa. In this way, the first wiring board 3 is obtained.

  Further, after laminating the second insulator 4a on the first wiring board 3, the second wiring board 4 includes the second through conductor 4c and the second conductor layer 4b in the same manner. It is formed. Thereby, the multilayer wiring board ML in which the second wiring board 4 is laminated on the first wiring board 3 is manufactured.

  In this way, the first wiring board 3 moves the first insulator 3a, the first conductor layer 3b formed on the upper surface 3aa of the first insulator 3a, and the first insulator 3a up and down. A first through conductor 3c penetrating in the direction, and a third conductor layer 3d formed on the lower surface 3ab of the first insulator 3a and electrically connected to the first through conductor 3c. Become.

  The second wiring board 4 on the first wiring board 3 includes the first wiring board 3, the second insulator 4 a, and the second insulator 4 a on the first wiring board 3. It has the 2nd conductor layer 4b formed in the upper surface 4aa, and the 2nd penetration conductor 4c which penetrates the 2nd insulator 4a to an up-down direction. In this way, a multilayer wiring board ML composed of the first wiring board 3 and the second wiring board 4 can be prepared.

  Further, through the above-described process, a plurality of multilayer wiring boards ML in which the first wiring board 3 and the second wiring board 4 are laminated are provided on the wiring mother board 3A as shown in FIG. Can do. Similarly, as shown in FIG. 16, a plurality of multilayer wiring boards ML in which the first wiring board 3 and the second wiring board 4 are laminated are provided on the wiring mother board 3A1 as support boards (core boards). 13 on both sides.

  Next, the electronic element 2 will be described below.

As shown in FIG. 3, the electronic element 2 includes an element substrate 2a and a functional body 2b provided on a lower surface 2aa of the element substrate 2a (a surface facing the second insulator 4a of the second wiring substrate 4). The wiring 2c extends from the functional body 2b to the outer peripheral side of the element substrate 2a, and the element pad 2d is electrically connected to the wiring 2c. Furthermore, the electronic element 2 includes an insulating layer 5 provided so as to expose at least a part of the element pad 2d and surround the functional body 2b, and a conductive junction provided on the element pad 2d exposed from the insulating layer 5. A material 6 is provided.

  In addition, the electronic element 2 may have an appropriate member such as an electrode and / or a protective layer that covers the upper surface 2ab of the element substrate 2a.

  The electronic element 2 is, for example, a surface acoustic wave element or a piezoelectric thin film resonator. In the present embodiment, the case of a surface acoustic wave element (SWA element) is illustrated.

  The element substrate 2a of the electronic element 2 is a piezoelectric substrate, and is formed in, for example, a generally thin rectangular parallelepiped shape as shown in FIGS. The element substrate 2a is composed of a single crystal substrate having piezoelectricity such as a lithium tantalate single crystal or a lithium niobate single crystal. The shape of the element substrate 2a may be set as appropriate, but is, for example, a rectangular shape. The size of the element substrate 2a may be set as appropriate. For example, the thickness is 0.2 (mm) to 0.5 (mm), and the length of one side is 0.5 (mm). ~ 2 (mm).

  FIG. 4A is a plan view of the element substrate 2a viewed from the lower surface 2aa side, and FIG. 4B is a schematic enlarged view in which a region B in FIG. 4A is enlarged. In FIG. 4A, the functional body 2b is hatched.

  As shown in FIGS. 2 and 3, the functional body 2b is provided on the lower surface 2aa of the element substrate 2a. As shown in FIG. 4, the functional body 2b is, for example, one or a plurality of (a plurality in this embodiment) SAW resonators, and the SAW resonators have an appropriate configuration and number according to various purposes. And may be provided in an arrangement. In the present embodiment, the functional body 2b is a SAW resonator, and a case where a ladder-type SAW filter is configured by a plurality of SAW resonators is illustrated. Moreover, in this embodiment, the electronic element 2 has illustrated the case where the seven functional bodies 2b are provided in the lower surface 2aa of the element substrate 2a.

The functional body 2b is a SAW resonator, and the SAW resonator has an IDT (InterDigital transducer) 10 and two reflectors 11 sandwiching the IDT 10 from both sides, as shown in FIG. 4B. .

Further, as shown in FIG. 4B, the IDT 10 has a pair of comb electrodes arranged so as to mesh with each other (a plurality of electrode fingers 10b cross each other). Each comb electrode of the IDT 10 includes a bus bar 10a and a plurality of electrode fingers 10b extending from the bus bar 10a in a direction perpendicular to the longitudinal direction of the bus bar 10a. The pitch of the plurality of electrode fingers 10b is substantially constant. In practice, the IDT 10 may be provided with a plurality of pairs of comb electrodes having more electrode fingers 10b.

  As shown in FIG. 4B, the reflector 11 is provided so as to sandwich the IDT 10 from both sides, and a pair of bus bars 11a and a plurality of electrode fingers 11b extending between the pair of bus bars 11a. have. The pitch of the plurality of electrode fingers 11b is substantially constant and is substantially the same as the pitch of the plurality of electrode fingers 10a2 of the IDT 10. The distance between the IDT 10 and the reflector 11 is substantially the same as the pitch between the electrode fingers 10b and 11b.

The electric signal input to one bus bar 10a of the pair of comb electrodes is converted into SAW (surface acoustic wave) and propagates in a direction orthogonal to the plurality of electrode fingers 10b. This SAW (surface acoustic wave) is converted again into an electrical signal and output from the other bus bar 10a of the pair of comb-teeth electrodes. In this process, the frequency component outside the pass band of the electrical signal is attenuated. The pass band corresponds to a SAW (surface acoustic wave) frequency band in which the pitch of the plurality of electrode fingers 10b is approximately a half wavelength.

  As shown in FIG. 4A, the element substrate 2a is provided with wiring 2c extending from the functional body 2 to the outer peripheral side of the element substrate 2a. The element pad 2d is provided on the wiring 2c and is electrically connected to the wiring 2c. That is, the wiring 2c electrically connects the functional body 2b and the element pad 2d. The wiring 2c basically connects the bus bar 10a and the element pad 2d electrically. The wiring 2c extends from the functional body 2 to the outer peripheral side of the element substrate 2a. The element substrate 2 a is provided with an intermediate wiring for connecting the functional bodies 2 (SAW resonators) to each other or the IDT 10 and the reflector 11.

  The wiring 2c may extend linearly or curvedly on the outer peripheral side, or may be bent. Further, the wiring 2c may extend with a certain width, may gradually change in width, or may change in width stepwise. Therefore, the wiring 2c is appropriately set according to the arrangement of the functional body 2b provided on the element substrate 2a or the arrangement of the element pads.

  The element pad 2d is for supplying electric power to the IDT 10, and is provided on the wiring 2c so as to be electrically connected to the wiring 2c. In the present embodiment, four element pads 2d are provided at the four corners of the peripheral portion of the lower surface 2aa of the element substrate 2a. The size of the element pad 2d is appropriately set according to the configuration of the functional body 2b.

  The functional body 2b and the wiring 2c can be formed of the same material, for example. Further, the functional body 2b and the wiring 2c can be formed simultaneously. As for functional body 2b and wiring 2c, all are Al or Al alloy (for example, Al-Cu system or Al-Ti system), Cu or Cu alloy (for example, Cu-Mg system, Cu-Ti system, or Cu-Rd system) 9. It can be formed of a metal material such as Ag or an Ag alloy (for example, Ag—Mg, Ag—Ti, or Ag—Rd), etc. The functional body 2b and the wiring 2c are partially different materials. May be formed.

  The element pad 2d is formed of, for example, Al or Al alloy (for example, Al-Cu system or Al-Ti system), Cu or Cu alloy (for example, Cu-Mg system, Cu-Ti system, or Cu-Rd system 9, It can be formed of a metal material such as Ag or an Ag alloy (eg, Ag—Mg, Ag—Ti, or Ag—Rd).

  The element pad 2d is preferably formed with a plating layer on the surface for the purpose of improving the bonding property with the corresponding conductive bonding material 6 or the like. The plating layer is formed, for example, by performing chromium plating, nickel plating, and gold plating on the surface of the element pad 2d. The conductive bonding material 6 will be described later.

  Further, as shown in FIG. 7, the electronic component 1 may be provided with a protective film 2e so as to cover the functional body 2b of the element substrate 2a. The protective film 2e contributes to preventing the functional body 2b from being oxidized. Moreover, the protective film 2e can suppress the short circuit which generate | occur | produces when an electroconductive foreign material adheres between the electrode fingers of IDT10 and the reflector 11. FIG.

The protective film 2e is made of an insulating material such as silicon oxide, aluminum oxide, titanium oxide, silicon nitride, or silicon. The thickness of the protective film 2e is, for example, 8 (nm) to 15 (nm). The protective film 2e may be provided over substantially the entire lower surface 2aa of the element substrate 2a so as to cover the functional body 2b and the wiring 2c and to expose only the region where the element pad 2d is formed. That is, the protective film 2e may be provided over almost the entire lower surface 2aa of the element substrate 2a except for the region where the element pad 2d is provided. In this case, after the protective film 2e is provided so as to cover the functional body 2b and the wiring 2c, the element pad 2d is provided on the wiring 2c on which the protective film 2e of the element substrate 2a is not provided.

  As shown in FIG. 5, the insulating layer 5 includes the functional body 2 b in order to form a space S between the functional body 2 b and the upper surface 4 aa of the second insulator 4 a (surface facing the functional body 2 b). It is provided on the element substrate 2a so as to surround it. Therefore, a region where the insulating layer 5 is not provided becomes a recess, and this recess is formed between the functional body 2b and the second insulator 4a when the element substrate 2a and the second insulator 4a are joined. Space S to be generated. In FIG. 5, in order to show the positional relationship between the insulating layer 5 and the functional body 2b, the position of the functional body 2b is shown on the lower surface 2aa of the element substrate 2a. Thus, the insulating layer 5 is provided on the element substrate 2a so as to surround the functional body 2b.

  The insulating layer 5 is provided so that at least a part of the element pad 2d is exposed. That is, the insulating layer 5 is provided so that at least a part of the element pad 2d in the region where the conductive bonding material 6 is provided is exposed. FIG. 5 is a cross-sectional view taken along line B-B of the element substrate 2a.

  Therefore, the insulating layer 5 forms an opening on the element pad 2d so that at least a part of the element pad 2d is exposed.

  Therefore, the insulating layer 5 can secure the space S between the functional body 2b and the second insulator 4a, and can protect and hermetically seal the functional body 2b surrounded by the insulating layer 5. Moreover, in order to ensure the space S for vibration on the functional body 2b and to hermetically seal the functional body 2b, the insulating layer 5 has a thickness of, for example, 5 (μm) to 10 (μm).

  Thus, in order to obtain the electronic component 1 having excellent durability, the insulating layer 5 is provided on the element substrate 2a so as to surround the functional body 2b.

  The conductive bonding material 6 is provided so as to fill the opening of the insulating layer 5 on the element pad 2d. That is, the conductive bonding material 6 is provided on the element pad 2d exposed from the insulating layer 5, and is interposed between the element pad 2d and the second conductor layer 4b to electrically bond them. It is. As shown in FIG. 3, the second conductor layer 4b and the conductive bonding material 6 are provided at positions corresponding to each other. Then, the second conductor layer 4 b is bonded onto the conductive bonding material 6, whereby the element pad 2 d of the element substrate 2 a and the second conductive layer of the second wiring substrate 4 are interposed via the conductive bonding material 6. 4b is electrically joined. The conductive bonding material 6 is made of a conductive material such as Ag paste, for example.

  The adhesive layer 7 is provided on the insulating layer 5 in order to join the element substrate 2a and the multilayer wiring board ML. Further, when the adhesive layer 7 is provided so as to overlap the conductive bonding material 6, it affects the electric bonding between the second conductor layer 4 b and the conductive bonding material 6. It is provided on the insulating layer 5 so as not to overlap. Therefore, in the electronic component 1, since the electronic element 2 and the second wiring board 4 are bonded via the conductive bonding material 6 and the adhesive layer 7, the sealing performance is improved.

  That is, the adhesive layer 7 is positioned on the insulating layer 5 by using, for example, a printing method so that the conductive bonding material 6 is aligned so that the conductive bonding material 6 is exposed and does not overlap the conductive bonding material 6. The adhesive layer 7 is made of an insulating material such as an epoxy resin, for example.

  In addition, as shown in FIG. 8, the electronic component 1 gives the insulating layer 5 an adhesive function with the multilayer wiring board ML, whereby the element substrate 2 a of the electronic element 2 and the multilayer wiring board ML (second wiring board 4). ). Thereby, the electronic component 1 can reduce the manufacturing process for providing the adhesive material layer 7 on the insulating layer 5, and is excellent in mass productivity and productivity.

  In addition, the electronic component 1 can easily align the element substrate 2a and the second wiring substrate 4 by providing the insulating layer 5 with an adhesive function.

  Moreover, the electronic component 1 can provide the conductive bonding material 6 and the adhesive layer 7 with one anisotropic conductive resin by using an anisotropic conductive resin as the adhesive layer 7. Thus, the electronic component 1 can use an anisotropic conductive resin as the conductive bonding material 6 and can also use an anisotropic conductive resin as the adhesive layer 7. That is, the electronic component 1 can use a so-called anisotropic conductive resin including conductive particles in an organic resin, instead of the conductive bonding material 6 and the adhesive material 7. Thereby, the electronic component 1 can reduce a manufacturing process, and productivity is improved.

  Thus, the anisotropic conductive resin combines the functions of the conductive bonding material 6 and the adhesive layer 7, that is, the function of electrically bonding in the vertical direction and the function of mechanical bonding. Therefore, electrical connection with the second conductor layer 4b and mechanical connection with the multilayer wiring board ML are possible.

  Here, the formation region of the insulating layer 5 provided on the lower surface 2aa of the element substrate 2a will be described below with reference to FIG. In FIG. 6, the adhesive layer 7 on the insulating layer 5 is omitted. In FIG. 6, the formation region of the insulating layer 5 provided on the element substrate 2a and the position of the functional body 2b of the element substrate 2a are shown on the lower surface 2aa of the element substrate 2a.

  In FIG. 6A, the insulating layer 5 is provided on the element substrate 2a so as to surround the seven functional bodies 2b in one space S. The insulating layer 5 is provided on the element substrate 2a so that one space S is formed. In FIG. 6B, the insulating layer 5 is provided on the element substrate 2a so as to surround the seven functional bodies 2b with one space S along the outer peripheral portion of the element substrate 2a. In this case, the insulating layer 5 may be provided so as to overlap a part of the element pad 2d in a plan view, or may be positioned outside the element pad 2d so as not to overlap the element pad 2d. It may be provided.

  Further, in FIG. 6B, as in FIG. 6A, the insulating layer 5 is provided on the element substrate 2a so that one space S is formed. Furthermore, in FIG.6 (c), the insulating layer 5 is provided on the element substrate 2a so that the function body 2b may be enclosed individually by the space S corresponding to each of the seven function bodies 2b. That is, the insulating layer 5 is provided on the element substrate 2a so as to form seven spaces S corresponding to the seven functional bodies 2b.

  As described above, the adhesiveness to the multilayer wiring board ML or the hermetic sealing property of the functional body 2b depends on the region where the insulating layer 5 is provided, as shown in FIG. 6 (b) <FIG. 6 (a) <FIG. It improves in order, moisture resistance improves, and reliability increases.

  Further, since the insulating layer 5 is interposed between the element substrate 2a and the second insulator 4a, a space S is formed between the lower surface 2aa of the element substrate 2a and the upper surface 4aa of the second insulator substrate 4a. Is done. Accordingly, in the electronic component 1, a vibration space is formed by the space S formed by the insulating layer 5, so that the propagation of the SAW (surface acoustic wave) is facilitated and the loss of the SAW (surface acoustic wave) is suppressed. can do.

Moreover, since the insulating layer 5 is provided on the element substrate 2a so as to surround the functional body 2b, the space S can be reliably formed between the functional body 2b and the second wiring substrate 4. Furthermore, since the electronic component 1 is provided so that the insulating layer 5 surrounds the functional body 2b and is bonded via the adhesive layer 7, the functional body 2b can be hermetically sealed, and the space S can be sealed. The deterioration of the electrical characteristics of the functional body 2b due to the penetration of moisture or the like is suppressed. In other words, the airtight sealing property of the electronic component 1 is improved.

  Therefore, the electronic component 1 has a functional body as compared with a structure in which a sealing resin layer is provided from the surface of the electronic element to the surface of the wiring board or a structure in which an insulating layer is provided on each of the electronic element and the wiring board. Since the insulating layer 5 is provided so as to surround 2b and the space S is formed between the element substrate 2a and the second insulator 4a, the sealing performance of the functional body 2b is improved and the size and thickness are reduced. can do.

  Here, a method for manufacturing the electronic element 2 will be described below.

  FIG. 9A to FIG. 9E are views for explaining a method of manufacturing the electronic element 2 and are cross-sectional views corresponding to the electronic element 2 shown in FIG. In FIG. 9, the lower surface 2aa of the element substrate 2a is on the upper side.

  In addition, the manufacturing process of the electronic element 2 is performed on the element mother board 2A that becomes the electronic element 2 by being divided, but in FIG. 9A to FIG. Only the corresponding parts are shown. 9A to 9E, a plurality of electronic elements 2 are provided on the element mother board 2A as shown in FIG.

  As shown in FIG. 9, the electronic element 2 is subjected to the steps of FIGS. 9A to 9E, so that the functional body 2b, the wiring 2c, and the element 2b are formed on the lower surface 2aa of the piezoelectric substrate of the element substrate 2a. Element pad 2d is formed.

In the formation of the functional body 2b and the wiring 2c, specifically, first, a thin film forming method such as sputtering, vapor deposition, or CVD (Chemical Vapor Deposition) is used.
), A metal layer is formed on the lower surface 2aa of the element substrate 2a. Next, this metal layer is patterned using a known photolithography method or the like. By patterning, as shown in FIG. 9B, the functional body 2b and the wiring 2c are formed on the element substrate 2a. The functional body 2b is the IDT 10 and the reflector 11 (SAW resonator), and these are formed on the element substrate 2a.

  Furthermore, when the functional body 2b and the wiring 2c are formed on the element substrate 2a, as shown in FIG. 9B, the functional body 2b and the wiring are formed using a thin film forming method such as sputtering, vapor deposition, or CVD. A metal layer is formed on the element substrate 2a so as to cover 2c. Then, patterning is performed on the metal layer using a known photolithography method or the like. The element pad 2d is formed on the wiring 2c by patterning.

  Next, an insulating material is formed over the lower surface 2aa of the element substrate 2a so as to cover the functional body 2b, the wiring 2c, and the element pad 2d, for example. The insulating layer 5 is made of this insulating material. The insulating material (insulating layer 5) is formed using, for example, a coating method, a printing method, a vapor deposition method, or a thin film forming method such as CVD.

  When an insulating material is formed on the element substrate 2a on which the functional body 2b, the wiring 2c, and the element pad 2d are formed, the insulating material is patterned by using a well-known photolithography method or the like. An insulating material is formed on the element substrate 2a. As shown in FIG. 9C, the patterning is performed so that the element pad 2d in the region where the conductive bonding material 6 is provided is exposed, and an opening is formed on the element pad 2d. In this way, the insulating layer 5 is formed on the lower surface 2aa of the element substrate 2a.

  The conductive bonding material 6 is an Ag paste, for example, and is provided on the element pad 2d exposed from the insulating layer 5 as shown in FIG. That is, the conductive bonding material 6 is provided so as to fill the opening of the insulating layer 5 on the element pad 2d. The conductive bonding material 6 is formed on the element pad 2d by using, for example, a printing method or a dispensing method.

  As shown in FIG. 9 (e), the adhesive layer 7 is formed on the insulating layer 5 except for the region where the conductive bonding material 6 is provided. The adhesive layer 7 is formed on the insulating layer 5 using, for example, a printing method or a photolithography method. The adhesive layer 7 is, for example, an epoxy resin.

  Here, an example of the formation of the insulating layer 5 on the element substrate 2a is shown below.

  The insulating layer 5 is, for example, a photosensitive resin, and is provided by sticking a photosensitive resin film made of a photosensitive resin on the element substrate 2a on which the functional body 2b, the wiring 2c, and the element pad 2d are formed. . Next, the photosensitive resin film is irradiated with ultraviolet rays through a photomask using a known photolithography method or the like. The photosensitive resin film is exposed so that the photosensitive resin is formed only in the region where the insulating layer 5 is to be provided. Thus, the patterned photosensitive resin is provided on the element substrate 2a. In this way, the insulating layer 5 is provided on the element substrate 2a.

  The insulating layer 5 is formed by applying a liquid photosensitive resin such as a photosensitive polyimide resin on the element substrate 2a using a spin coating method or the like, and similarly using a well-known photolithography method or the like. It may be formed. The photosensitive resin is, for example, a urethane acrylate resin, a polyester acrylate resin, an epoxy acrylate resin, or the like.

  In this way, the electronic device 2 is manufactured through the steps of FIGS. 9A to 9E.

  Next, joining of the electronic element 2 and the multilayer wiring board ML will be described.

  As shown in FIG. 11, the electronic element 2 is bonded to the second wiring board 4 of the multilayer wiring board ML via an adhesive layer 7 on the insulating layer 5. In addition, the electronic element 2 is bonded to the second wiring substrate 4 through the space S that houses the functional body 2b. In this case, the electronic component 1 can be electrically bonded by closely contacting and bonding the conductive bonding material 6 of the element substrate 2a and the second conductor layer 4b of the second insulator 4a. It is done. That is, in the electronic component 1, the element pad 2 d of the element substrate 2 a and the second conductor layer 4 b of the second wiring substrate 4 are electrically bonded via the conductive bonding material 6. In FIG. 11, only a portion corresponding to one electronic component 1 is illustrated.

  The multilayer wiring board ML and the electronic element 2 are bonded by, for example, heat curing at 150 (° C.) for 60 (min) while applying pressure. Note that the electrical bonding by the conductive bonding material 6 and the bonding by the adhesive layer 7 are simultaneously performed by, for example, a heat treatment at 150 (° C.) and 60 (min) while applying pressure.

  In this way, the electronic element 2 is bonded to the multilayer wiring board ML composed of the first wiring board 3 and the second wiring board 4, and the electronic component 1 shown in FIG. 3 is manufactured.

  Here, manufacturing of the electronic component 1 including the multilayer wiring substrate ML including the first wiring substrate 3 and the second wiring substrate 4 and the electronic element 2 will be described below.

  First, the case where the electronic component 1 is manufactured by dividing the electronic element 2 from the element mother board 2A or by dividing the multilayer wiring board ML from the wiring mother board 3A will be described.

  The element mother board 2A provided with the plurality of electronic elements 2 is cut to separate the electronic elements 2 into pieces. Similarly, the wiring mother board 3A provided with a plurality of multilayer wiring boards ML is cut to separate the multilayer wiring boards ML. And the electronic component 2 shown in FIG. 1 is manufactured by joining the separated electronic element 2 and the multilayer wiring board ML.

  In addition, the electronic element 2 is separated from the element mother board 2A, and the separated electronic element 2 is joined to the multilayer wiring board ML of the wiring mother board 3A, and then the wiring mother board 3A to which the electronic element 2 is joined. The electronic component 1 can also be manufactured by cutting into pieces.

  Next, a case will be described in which the electronic component 1 is manufactured by bonding the element mother board 2A and the wiring mother board 3A and then simultaneously cutting the bonded element mother board 2A and the wiring mother board 3A.

  The element mother board 2A is provided with a plurality of electronic elements 2 as shown in FIG. Therefore, the element mother board 2A is an aggregate in which a plurality of electronic elements 2 are provided, and is provided so that the plurality of electronic elements 2 are arranged vertically and horizontally. FIG. 12 shows an enlarged cross-sectional view of one of the plurality of electronic elements 2 provided on the element mother board 2A. In FIG. 12, the element mother board 2 </ b> A has a circular shape in plan view, but is not limited thereto, and may be a square shape, and the shape is appropriately set. The element mother board 2A has a diameter of, for example, 70 (mm) to 130 (mm) when the shape in plan view is circular.

  As described above, the element mother substrate 2A is formed on the element substrate 2a by performing the manufacturing steps shown in FIGS. 9A to 9E on the element substrate 2a. Is provided. As a result, the element mother board 2 </ b> A becomes an aggregate of a plurality of electronic elements 2. Here, the element substrate 2a has such a size that a plurality of electronic elements 2 can be provided.

  Further, the wiring mother board 3A is provided with a plurality of multilayer wiring boards ML as shown in FIG. Therefore, the wiring mother board 3A is an assembly in which a plurality of multilayer wiring boards ML are provided, and the plurality of multilayer wiring boards ML are arranged in rows and columns. FIG. 13 shows an enlarged cross-sectional view of one of a plurality of multilayer wiring boards ML provided on the wiring motherboard 3A. In FIG. 13, the wiring mother board 2 has a square shape in plan view, but is not limited thereto, and may be a circular shape, and the shape is appropriately set. The wiring mother board 3A has a side length of, for example, 100 (mm) to 150 (mm) when the shape in plan view is a quadrangular shape.

  The bonding between the element mother board 2A and the wiring mother board 3A will be described. FIG. 14 is a plan view showing a state in which the element mother board 2A and the wiring mother board 3A are joined. Moreover, in FIG. 14, sectional drawing which expanded three of the some electronic components 1 provided in 1 A of bonding substrates is shown.

  As shown in FIG. 14, the bonding substrate 1A is obtained by bonding and bonding the element mother substrate 2A and the wiring mother substrate 3A.

  In addition, the bonding substrate 1A is bonded by positioning the element mother substrate 2A with respect to the wiring mother substrate 3A. Further, the bonding substrate 1A may be bonded by positioning the wiring mother board 3A with respect to the element mother board 2A.

As shown in FIG. 14, the multilayer wiring board ML of the wiring mother board 3A is bonded to the electronic element 2 of the element mother board 2A via the adhesive layer 7. That is, each multilayer wiring board ML of the wiring mother board 3A is bonded to each electronic element 2 of the corresponding element mother board 2A via the adhesive layer 7 on the insulating layer 5 of the electronic element 2. As a result, the multilayer wiring board ML is bonded to the corresponding electronic elements 2 via the adhesive layer 7. The electronic element 2 is joined via the space S that houses the functional body 2b. Further, in this case, the electronic component 1 is bonded in close contact with the conductive bonding material 6 of the plurality of electronic elements 2 on the element mother board 2A and the plurality of second conductor layers 4b on the wiring mother board 3A. By doing so, electrical connection can be obtained.

  Therefore, as shown in FIG. 14, the bonded substrate 1 </ b> A is an aggregate provided with a plurality of electronic components 1, and the plurality of electronic components 1 are arranged vertically and horizontally. Moreover, as shown in FIG. 14, the bonding substrate 1 </ b> A is provided with a cutting line 9 for separating the electronic component 1 from the bonding substrate 1 </ b> A according to the shape of the electronic component 1. That is, in FIG. 14, the bonding substrate 1A illustrates the case where the cutting line 9 is provided on the wiring mother board 3A that is slightly larger than the element mother board 2A.

  Further, the bonding substrate 1A may be provided with an element mother board 2A that is slightly larger than the wiring mother board 3A, and the cutting line 9 may be provided on the element mother board 2A. The cutting line 9 is appropriately provided on the element mother board 2A and / or the wiring mother board 3A in consideration of the size of the element mother board 2A or the wiring mother board 3A. Moreover, the cutting method of 1 A of bonded substrates is not restricted to this. For the cutting method, for example, markers indicating the start and end points of a virtual cutting line are provided on the element mother board 2A or the wiring mother board 3A, or both, and for example, a dicing blade of a dicing apparatus or the like is provided in accordance with these markers. The method of using and cutting 1A of bonding board | substrates may be sufficient. The thickness of the dicing blade is selected as appropriate. Moreover, the cutting method of bonding board | substrate 1A can select suitably a well-known technique in consideration of the magnitude | size etc. of bonding board | substrate 1A.

  And as shown in FIG. 14, 1 A of bonded substrates are cut | disconnected along the cutting line 9 shown with the broken line, and the some electronic component 1 is separated into pieces, respectively. That is, by cutting the bonded substrate 1A, the individual electronic components 1 are separated from the bonded substrate 1A. For example, as shown in FIG. 14, the three electronic components 1 arranged side by side are cut into pieces from the bonded substrate 1 </ b> A by cutting along the cutting line 9, and three electronic components 1 can be obtained. . In addition, cutting | disconnection of 1 A of bonded substrates is performed using a dicing apparatus etc., for example.

  That is, the electronic element 2 is separated from the element mother board 2A, and the multilayer wiring board ML is further separated from the wiring mother board 3A, and the separated electronic element 2 and the multilayer wiring board ML are joined. Compared with the case where the electronic component 1 is manufactured, when the electronic component 1 is manufactured from the bonded substrate 1A, a large amount of the electronic component 1 can be manufactured at a time. To do. That is, the bonded substrate 1A can manufacture a large number of individual electronic components 1 at a time, and thus improves the productivity of the electronic components 1 with the improvement of the productivity of the cutting process.

  The sizes of the element mother board 2A and the wiring mother board 3A are set in consideration of the number of electronic components 1 obtained from the bonded substrate 1A, that is, the number of electronic components 1 from the bonded substrate 1A.

  Moreover, in the bonding substrate 1A, the bonded element mother board 2A and the wiring mother board 3A are simultaneously cut, so that the side surface of the electronic element 2 and the side surface of the multilayer wiring board ML are flush with each other. That is, they are on the same plane. In this way, the side surface of the electronic element 2 and the side surface of the multilayer wiring board ML are aligned, and the side surfaces (XZ plane and YZ plane) of the electronic component 1 are located in the same plane. Accordingly, the electronic component 1 can have the same side surface, that is, the side surfaces of the electronic element 2 and the multilayer wiring board ML can be aligned with each other. When mounting on the board, mounting accuracy is improved and higher-density mounting becomes possible.

In addition, when the element mother board 2A and the wiring mother board 3A are cut simultaneously, the bonding board 1A may be cut from the element mother board 2A side or from the wiring mother board 3A side. Moreover, you may cut | disconnect simultaneously from the element motherboard 2A side and the wiring motherboard 3A side. The cutting method is appropriately set in consideration of the size of the bonded substrate 1A and the like.

  The joining of the electronic element 2 and the double-sided multilayer wiring board ML1 will be described.

  As shown in FIG. 15, a multilayer wiring board ML including a first wiring board 3 and a second wiring board 4 is provided on both sides of a support substrate (core substrate) 13, and this is a double-sided multilayer wiring board ML1. . Such a double-sided multilayer wiring board ML1 can be manufactured by applying a known multilayer wiring board manufacturing method.

  As shown in FIG. 15, the electronic element 2 is bonded to the double-sided multilayer wiring board ML <b> 1 through the adhesive layer 7 on the insulating layer 5. Moreover, the electronic element 2 is joined via the space S that accommodates the functional body 2b. In this case, the electronic component 1 can be electrically bonded by closely contacting and bonding the conductive bonding material 6 of the element substrate 2a and the second conductor layer 4b of the second insulator 4a. It is done. That is, in the electronic component 1, the element pad 2 d of the element substrate 2 a and the second conductor layer 4 b of the second wiring substrate 4 are electrically bonded via the conductive bonding material 6. In FIG. 15, only a portion corresponding to one electronic component 1 is illustrated.

  The double-sided multilayer wiring board ML1 and the element substrate 2a are bonded by, for example, heat curing at 150 (° C.) for 60 (min) while applying pressure. Note that the electrical bonding by the conductive bonding material 6 and the bonding by the adhesive layer 7 are simultaneously performed by, for example, a heat treatment of 150 (° C.) and 60 (min) while applying pressure. Further, the heat curing process is performed on both sides of the upper surface and the lower surface of the double-sided multilayer wiring board ML1, and as shown in FIG. 15, the electronic element 2 is bonded to the upper surface and the lower surface of the double-sided multilayer wiring board ML1.

  Thus, the electronic element 2 is bonded to both sides of the upper surface and the lower surface of the double-sided multilayer wiring board ML1, and the electronic component 1 shown in FIG. 3 is manufactured. Then, by removing the support substrate (core substrate) 13 provided on the double-sided multilayer wiring board ML1, two electronic components 1 can be obtained simultaneously.

  As shown in FIG. 16, the wiring mother board 3 </ b> A <b> 1 includes a plurality of double-sided multilayer wiring boards ML <b> 1, and the double-sided multilayer wiring board ML <b> 1 is provided with multilayer wiring boards ML on both sides of a support board (core board) 13. That is, as shown in FIG. 16, the wiring mother board 3A1 is an assembly provided with a plurality of double-sided multilayer wiring boards ML1, and the plurality of double-sided multilayer wiring boards ML1 are arranged vertically and horizontally. Moreover, the manufacturing method of the double-sided multilayer wiring board ML1 may be the same as the known manufacturing method of the multilayer wiring board.

  The bonding between the element mother board 2A and the wiring mother board 3A1 will be described. FIG. 17 is a plan view showing a state in which the element mother board 2A and the wiring mother board 3A1 are joined. 14 is different from FIG. 14 in that the electronic mother board 2A is bonded to both sides of the wiring mother board 3A1.

  As shown in FIG. 17, the bonding substrate 1B is obtained by bonding and bonding the element mother board 2A of the electronic element 2 to both sides of the wiring mother board 3A1. Moreover, in FIG. 17, sectional drawing which expanded six of the some electronic components 1 provided in the bonding board | substrate 1B is shown. As described above, the plurality of electronic components 1 are respectively provided on the upper surface and the lower surface of the double-sided multilayer wiring board ML1.

  The bonding substrate 1B is bonded by aligning the element mother board 2A located on the upper surface and the lower surface with respect to the wiring mother board 3A1. In addition, the bonding substrate 1B may be bonded to the element mother substrate 2A in which the wiring mother substrate 3A1 is positioned on the upper surface and the lower surface.

  As shown in FIG. 17, the plurality of double-sided multilayer wiring boards ML1 of the wiring mother board 3A1 are bonded to the electronic elements 2 of the element mother board 2A via the adhesive layer 7. That is, each double-sided multilayer wiring board ML1 of the wiring mother board 3A1 is bonded to each electronic element 2 of the corresponding element mother board 2A via the adhesive layer 7 of the electronic element 2. Further, in this case, the electronic component 1 opposes the conductive bonding material 6 of the plurality of electronic elements 2 on the element mother board 2A and the second conductor layer 4b of the plurality of double-sided multilayer wiring boards ML1 on the wiring mother board 3A1. Thus, electrical bonding can be obtained by bonding closely.

  Therefore, the bonding substrate 1B is an aggregate provided with a plurality of electronic components 1 as shown in FIG. 17, and is arranged so that the plurality of electronic components 1 are arranged vertically and horizontally.

  And as shown in FIG. 17, the bonding board | substrate 1B is cut | disconnected along the cutting line 9 shown with the broken line, and the some electronic component 1 is each separated. That is, by cutting the bonded substrate 1B, the individual electronic components 1 are separated from the bonded substrate 1A. For example, as shown in FIG. 17, two electronic components 1 are arranged in the vertical direction and three in the horizontal direction, and are cut along the cutting line 9 and removed by removing the support substrate (core substrate) 13. Separated from the composite substrate 1B. In this case, six electronic components 1 are obtained.

  Thus, when manufacturing the electronic component 1 from the bonding board | substrate 1B, since a lot of electronic components 1 can be manufactured at once, the productivity of the electronic component 1 further improves. That is, since the bonding substrate 1B can manufacture a large number of individual electronic components 1 at a time, the productivity of the electronic component 1 is further improved as the productivity of the cutting process of the electronic component 1 increases. .

  Further, in the bonded substrate board 1B, the bonded element mother board 2A and wiring mother board 3A1 are simultaneously cut in the same manner as the bonded substrate board 1A. The side surfaces of the substrate ML1 are flush with each other, that is, the same plane. Thus, since the electronic component 1 can make each side | surface into the same plane, when mounting the electronic component 1 on the mounting board | substrate of an electronic device, mounting precision improves and it mounts more densely Is possible.

  Further, when the bonding substrate 1B cuts the element mother board 2A, the wiring mother board 3A1 and the element mother board 2A at the same time, even if the bonding substrate 1B is cut from the upper element mother board 2A side, You may cut | disconnect from the board | substrate 2A side. Further, it may be simultaneously cut from the element mother board 2A side located on the upper side and the element mother board 2A side located on the lower side. The cutting method is appropriately set in consideration of the size of the bonded substrate 1B and the like.

  The present invention is not particularly limited to the above-described embodiments, and various changes and improvements can be made within the scope of the present invention.

  The electronic component is not limited to a SAW element. That is, the electronic element is not limited to a SAW element. The electronic element may not use an elastic wave. Moreover, you may utilize elastic waves other than SAW, such as a piezoelectric thin film resonator.

  Further, the wiring board is not limited to the one that mediates the electronic element and the mounting board. The wiring board may function as a mother board (main board, main board) of an electronic device such as a portable device, for example. The wiring board may be one on which a plurality of electronic elements are mounted.

  Further, the functional body may be formed of a conductor or may be formed of a semiconductor.

DESCRIPTION OF SYMBOLS 1 Electronic component 2 Electronic element 2a Element board | substrate 2b Functional body 2c Wiring 2d Element pad 3 1st wiring board 3a 1st insulator 3b 1st conductor layer 3c 1st penetration conductor 3d 3rd conductor layer 4 2nd Wiring board 4a Second insulator 4b Second conductor layer 4c Second through conductor 5 Insulating layer 6 Conductive bonding material 7 Adhesive layer 8 Circuit pattern 9 Cutting line 10 IDT
11 Reflector 12 External terminal 13 Support substrate (core substrate)
S space ML multilayer wiring board ML1 double-sided multilayer wiring board 1A, 1B bonding board 2A element mother board 3A, 3A1 wiring mother board

Claims (2)

A first wiring board having a first through conductor and a first conductor layer provided on the first through conductor;
A second through conductor, which is laminated on the first conductor layer and is stacked in the thickness direction of the first wiring board, is electrically connected to the first conductor layer via the second through conductor. A second wiring board having a second conductor layer connected to
An element substrate; a functional body provided on the element substrate; a wiring extending from the functional body to an outer peripheral side of the element substrate; and a position electrically connected to the wiring and corresponding to the second conductor layer And an electronic element comprising an element pad provided in
The electronic element includes an insulating layer provided to expose at least a part of the element pad and surround the functional body, and a conductive bonding material provided on the element pad exposed from the insulating layer. An electronic component comprising: the conductive bonding material and the second conductor layer electrically connected to each other. An electronic component manufacturing method comprising an electronic element and a multilayer wiring board,
A first wiring board having a first through conductor and a first conductor layer provided on the first through conductor; and the first conductor laminated in the thickness direction of the first wiring board. And a second wiring board having a second through conductor located on the layer and having a second conductor layer electrically connected to the first conductor layer through the second through conductor. Preparing a wiring mother board provided with a plurality of the multilayer wiring boards;
An element substrate; a functional body provided on the element substrate; a wiring extending from the functional body to an outer peripheral side of the element substrate; and a position electrically connected to the wiring and corresponding to the second conductor layer A step of preparing an element mother board provided with a plurality of the electronic elements comprising element pads provided on
Providing an insulating layer on the element mother substrate to expose at least a part of the element pad and surround the functional body;
Providing a conductive bonding material on the element pad exposed from the insulating layer;
The second conductor layer of the wiring mother board and the conductive bonding material of the element mother board are bonded to face each other and the second conductor layer and the conductive bonding material are electrically bonded. When,
And a step of simultaneously cutting the bonded wiring mother board and the element mother board to separate them into a plurality of the electronic parts.

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