JP2014171062A - Vibrator, oscillator, electronic device, and mobile - Google Patents

Abstract

An object of the present invention is to provide a vibrator, an oscillator, an electronic device, and a moving body having a configuration suitable for downsizing.
An oscillator 1 includes a first recess 21 provided in a central portion of an upper surface, a second recess 22 provided in a central portion of a lower surface, and first and second recesses 21 and 22. A thin-walled portion 29 formed by disposing a third concave portion 27 on the upper surface of a region surrounded by the through-holes 23 penetrating the central portions of the bottom surface and disposing a fourth concave portion 28 on the lower surface is integrated. The substrate 2 is formed in the first recess 21, and is connected to the conductive layer 52 provided on the edge of the bottom surface 211 of the first recess 21, so that one of the through holes 23 is joined. A plate-shaped first lid 31 having conductivity covering the opening and the conductive layer 62 located at the edge of the bottom surface 221 of the second concave portion 22 while being positioned in the second concave portion 22. And a plate-like second lid 32 having conductivity to cover the other opening of the through-hole 23. .
[Selection] Figure 1

Description

  The present invention relates to a vibrator, an oscillator, an electronic device, and a moving object.

  AT-cut quartz resonators have thickness shear vibration as the main vibration mode to be excited, and are suitable for miniaturization and higher frequency, and exhibit a cubic curve with excellent frequency temperature characteristics. Used in many ways. As such an AT-cut quartz crystal resonator, one in which a resonator element is housed in a package is widely known. For example, Patent Document 1 discloses an AT-cut crystal resonator that includes a crystal resonator element and a package, and the crystal resonator element is fixed to the package via two conductive adhesives.

  Here, with the recent miniaturization of AT-cut quartz crystal resonators, the conductive adhesive must be miniaturized. For this reason, the adhesive strength between the vibration element and the package cannot be sufficiently secured, and the vibration element may be peeled off. In addition, in order to prevent the vibration element from contacting the package inner wall, it is necessary to position the vibration element with high accuracy. As described above, the AT-cut quartz crystal resonator of Patent Document 1 has a problem that it cannot be easily downsized.

JP 2009-164824 A

  An object of the present invention is to provide a vibrator, an oscillator, an electronic device, and a moving body having a configuration suitable for downsizing.

SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following application examples.
[Application Example 1]
The vibrator according to the present invention has a plate shape, and includes a first concave portion provided in a central portion of one main surface of both main surfaces and a second concave portion provided in a central portion of the other main surface. And a through-hole penetrating through the central portions of the bottom surfaces of the first recess and the second recess, and a vibrating portion that is disposed in a region surrounded by the through-hole and is thinner than the height of the through-hole A substrate integrally formed with,
A plate-like first lid that is located in the first recess and joined to the bottom surface of the first recess and covers one opening of the through hole;
A plate-like second lid that is located in the second recess and is joined to the bottom surface of the second recess and covers the other opening of the through hole. .
Thereby, the size of the vibrator can be reduced.

[Application Example 2]
In the vibrator according to the aspect of the invention, the first concave portion is formed in a central portion excluding an edge portion of the one main surface,
The second concave portion is formed in a central portion excluding an edge portion of the other main surface,
It is preferable that the through hole is formed so as to penetrate through the central portions excluding the edge portions of the bottom surfaces of the first concave portion and the second concave portion.
Thereby, the recessed part for fitting the 1st, 2nd cover body in a board | substrate can be formed easily.

[Application Example 3]
In the vibrator according to the aspect of the invention, the first lid is bonded to the bottom surface of the first recess through an adhesive,
The second lid body is preferably bonded to the bottom surface of the second recess through an adhesive.
Thereby, a board | substrate and a 1st, 2nd cover body can be joined easily.

[Application Example 4]
In the vibrator of the present invention, a first metal layer formed across the substrate and the first lid so as to cover a boundary portion between the first recess and the first lid,
Preferably, it includes a second metal layer formed across the substrate and the second lid so as to cover a boundary portion between the second recess and the second lid. .
Thereby, the moisture resistance of the vibrator is improved.

[Application Example 5]
In the vibrator according to the aspect of the invention, it is preferable that an area surrounded by the through hole is hermetically sealed by the first lid and the second lid.
Thereby, the vibration characteristics of the vibrator are improved and stabilized.
[Application Example 6]
In the vibrator of the present invention, the thickness of the first lid is thinner than the depth of the first recess,
The thickness of the second lid is preferably thinner than the depth of the second recess.
Thus, the first and second lids can be prevented from protruding from the substrate.

[Application Example 7]
In the vibrator according to the present invention, the vibrator has a pair of excitation electrodes formed in the thin portion,
One of the excitation electrodes is drawn to the side surface of the substrate through the through hole and the first recess,
The other excitation electrode is preferably drawn out to the side surface of the substrate through the through hole and the second recess.
Thereby, a short circuit of a pair of excitation electrodes can be prevented.

[Application Example 8]
In the vibrator according to the aspect of the invention, it is preferable that the thin portion is connected to a side surface of the through hole via a beam.
Thereby, the vibration leakage of a thin part (vibration part) can be suppressed.
[Application Example 9]
In the vibrator according to the aspect of the invention, it is preferable that each of the first lid and the second lid is made of a metal material.
Thereby, the corrosion resistance of the vibrator is improved.

[Application Example 10]
The oscillator of the present invention includes the vibrator of the present invention,
And an oscillation circuit connected to the vibrator.
Thereby, a highly reliable oscillator can be obtained.
[Application Example 11]
An electronic apparatus according to the present invention includes the vibrator according to the present invention.
As a result, a highly reliable electronic device can be obtained.
[Application Example 12]
The moving body of the present invention includes the vibrator of the present invention.
Thereby, a mobile body with high reliability is obtained.

FIG. 3 is a cross-sectional view of the vibrator according to the first embodiment of the invention. It is a figure explaining the relationship between an AT cut quartz substrate and a crystal axis. FIG. 2 is a top view of a substrate included in the vibrator illustrated in FIG. 1. FIG. 2 is a bottom view of a substrate included in the vibrator illustrated in FIG. 1. It is sectional drawing of the vibrator | oscillator concerning 2nd Embodiment of this invention. It is sectional drawing of the vibrator | oscillator concerning 3rd Embodiment of this invention. FIG. 7 is a plan view (top view) of a substrate included in the vibrator shown in FIG. 6. It is a top view of the board | substrate which the vibrator | oscillator concerning 4th Embodiment of this invention has. It is a bottom view of the board | substrate shown in FIG. It is a top view of the board | substrate which the vibrator | oscillator concerning 5th Embodiment of this invention has. It is a bottom view of the board | substrate shown in FIG. It is sectional drawing which shows suitable embodiment of the oscillator of this invention. 1 is a perspective view illustrating a configuration of a mobile (or notebook) personal computer to which an electronic apparatus of the present invention is applied. It is a perspective view which shows the structure of the mobile telephone (PHS is also included) to which the electronic device of this invention is applied. It is a perspective view which shows the structure of the digital still camera to which the electronic device of this invention is applied. 1 is a perspective view schematically showing an automobile as an example of a moving object of the present invention.

Hereinafter, a vibrator, an oscillator, an electronic device, and a moving body of the present invention will be described in detail based on preferred embodiments shown in the drawings.
1. First, the vibrator according to the present invention will be described.
<First Embodiment>
1 is a cross-sectional view of a vibrator according to a first embodiment of the present invention, FIG. 2 is a diagram for explaining the relationship between an AT-cut quartz crystal substrate and a crystal axis, and FIG. 3 is provided in the vibrator shown in FIG. FIG. 4 is a bottom view of the substrate included in the vibrator shown in FIG. Hereinafter, for convenience of explanation, the upper side in FIG. 1 is referred to as “upper”, the lower side is referred to as “lower”, the right side is referred to as “right”, and the left side is referred to as “left”.
The vibrator 1 shown in FIG. 1 includes a substrate 2, a first lid 31, a second lid 32, a first metal layer 41, a second metal layer 42, and electrodes 5 and 6. Yes.

(substrate)
The substrate 2 is a plate-shaped quartz substrate. Here, the crystal that is the material of the piezoelectric substrate 2 belongs to the trigonal system, and has crystal axes X, Y, and Z orthogonal to each other as shown in FIG. The X axis, the Y axis, and the Z axis are referred to as an electric axis, a mechanical axis, and an optical axis, respectively. The substrate 2 of the present embodiment is composed of a rotated Y-cut quartz crystal substrate cut out along a plane obtained by rotating the XZ plane around the X axis by a predetermined angle θ. The substrate 2 of the present embodiment is an AT-cut quartz substrate, and the angle θ in this case is approximately 35 ° 15 ′.
Hereinafter, the Y axis and the Z axis rotated around the X axis corresponding to the angle θ are referred to as a Y ′ axis and a Z ′ axis. That is, the plate-like substrate 2 has a thickness in the Y′-axis direction and has a spread in the XZ ′ plane direction. The substrate 2 is not limited to an AT-cut piezoelectric substrate as long as it can excite thickness-shear vibration. For example, a BT-cut piezoelectric substrate may be used.

  As shown in FIGS. 1, 3, and 4, the substrate 2 has a plate shape (block shape), and includes a first recess 21 provided on the upper surface (one main surface) and a lower surface (the other surface). The second recess 22 provided in the main surface), the through hole 23 penetrating the bottom surfaces of the first and second recesses 21, 22 and the vibration substrate 24 disposed in the through hole 23, and vibration There are four beam portions 251, 252, 253, and 254 that connect the substrate 24 and the inner wall of the through hole 23. The substrate 2 having such a shape can be easily formed by patterning a plate-like quartz substrate using a photolithography technique and an etching technique.

  The first concave portion 21 is provided in the central portion excluding the edge portion of the upper surface of the substrate 2. The first recess 21 has a rectangular contour shape so as to correspond to the contour shape of the substrate 2. Accordingly, the upper surface of the substrate 2 has a frame shape in which the inner and outer contours are both rectangular. On the other hand, the second recess 22 is provided in the central portion excluding the edge portion of the lower surface of the substrate 2. The second recess 22 has a rectangular contour shape so as to correspond to the contour shape of the substrate 2. Therefore, the lower surface of the substrate 2 has a frame shape in which the inner and outer contours are both rectangular. The first and second recesses 21 and 22 are formed symmetrically with respect to the center of the substrate 2.

  The through hole 23 is formed so as to penetrate the central portion excluding the edge portion of the bottom surface 211 of the first recess 21 and the central portion excluding the edge portion of the bottom surface 221 of the second recess 22. The through-hole 23 has a rectangular contour shape so as to correspond to the contour shape of the first and second recesses 21 and 22. Therefore, the bottom surfaces 211 and 221 of the first and second recesses 21 and 22 each have a frame shape in which the inner and outer contours are both rectangular. In this way, by forming the through-hole 23 so as to exclude the entire circumference of the edge portions of the bottom surfaces 211 and 221, as will be described later, the first and second lids 31 and 32 can easily be used as the through-hole. 23 can be hermetically sealed.

  The vibration substrate 24 has a rectangular outline shape in plan view. In addition, the vibration substrate 24 is disposed inside the through hole 23 so as to be separated from the inner peripheral surface of the through hole 23. The vibration substrate 24 is thinner than the height of the through hole 23, and is disposed substantially at the center of the through hole 23 in the height direction. In other words, the upper surface of the vibration substrate 24 is located below the upper opening (bottom surface 211) of the through hole 23, and the lower surface of the vibration substrate 24 is located above the lower opening (bottom surface 221) of the through hole 23. positioned. By arranging the vibration substrate 24 in this way, the contact between the vibration substrate 24 and the first and second lids 31 and 32 can be prevented.

  Of the four beam portions 251 to 254, the beam portions 251 and 252 connect the vibration substrate 24 and the inner peripheral surface of the through hole 23 at one end of the vibration substrate 24, and the remaining beam portions 253 and 254 are vibrations. The vibration substrate 24 and the inner peripheral surface of the through hole 23 are connected to each other at the other end of the substrate 24. In this manner, the vibration substrate 24 is supported at both ends by the four beam portions 251 to 254, whereby the substrate 2 having high mechanical strength is obtained. Further, by connecting the vibration substrate 24 to the inner peripheral surface of the through hole 23 by the beam portions 251 to 254, vibration leakage of the vibration substrate 24 (the vibration element 8) can be effectively suppressed.

  In addition, the beam portions 251 to 254 have the same thickness as the vibration substrate 24 and are disposed on the same surface as the vibration substrate 24. The number of beam portions is not particularly limited as long as the vibration substrate 24 can be connected and fixed to the inner peripheral surface of the through hole 23. For example, the beam portions 253 and 254 may be omitted, the beam portions 251 and 252 may be omitted, or the beam portions 252 to 254 may be omitted. There may be.

The configuration of the substrate 2 has been described above. Here, in other words, the configuration of the substrate 2 is: “The substrate 2 has the third concave portion 27 disposed on the upper surface (one main surface) of the region surrounded by the through-hole 23, and the lower surface (the other main surface). It has a thin portion 29 lower than the height of the through hole 23 formed by arranging the fourth recess 28, and this thin portion 29 has a vibration substrate 24 and four beam portions 251 to 254. It can be said.
Such an outer peripheral portion (a portion surrounding the periphery of the vibration substrate 24) 26 of the substrate 2 constitutes a part (side wall) of the package 7.

(Electrodes 5, 6)
Electrodes 5 and 6 are formed on the surface of the substrate 2.
The electrode 5 includes an excitation electrode 51 formed on the upper surface of the vibration substrate 24, a frame-shaped electrode (conductive layer) 52 formed in a frame shape on almost the entire bottom surface 211 of the first recess 21, a beam portion 251, The wiring electrode 53 that electrically connects the excitation electrode 51 and the frame electrode 52 via the upper surface of 252, and the diagram of the substrate 2 through the side surface of the first recess 21 and the upper surface of the substrate 2 are connected to the frame electrode 52. 1 and an extraction electrode 54 to be drawn out to the left outer surface 261.

  On the other hand, the electrode 6 includes an excitation electrode 61 formed on the lower surface of the vibration substrate 24, a frame-shaped electrode (conductive layer) 62 formed in a frame shape on almost the entire bottom surface 221 of the second recess 22, and a beam portion. The wiring electrode 63 that electrically connects the excitation electrode 61 and the frame electrode 62 via the lower surfaces of 253 and 254, and the frame electrode 62 is connected to the substrate 2 via the side surface of the second recess 22 and the lower surface of the substrate 2. 1 to the right outer surface 262 in FIG.

  In this way, the electrode 5 is drawn to the outer surface 261 through the surface facing the upper side of the surface of the substrate 2, and the electrode 6 is pulled out to the outer surface 262 through the surface facing the lower side of the surface of the substrate 2. As a result, the contact between the electrodes 5 and 6 can be easily and reliably prevented. In particular, in the present embodiment, since the wiring electrodes 53 and 63 are formed in different beam portions as described above, the electrodes 5 and 6 at this portion (where the electrodes 5 and 6 are likely to come into contact) are formed. Contact can be reliably prevented.

The excitation electrodes 51 and 61 are formed to face each other via the vibration substrate 24. When an alternating voltage is applied between the excitation electrodes 51 and 61, the vibration substrate 24 vibrates at a predetermined frequency (thickness shear vibration). . That is, in the vibrator 1, it can be said that the vibration element 8 is configured by the vibration substrate 24 and the pair of excitation electrodes 51 and 61.
The configuration of the electrodes 5 and 6 is not particularly limited as long as it has conductivity. For example, nickel, gold, silver, copper, or the like is formed on a metallized layer (underlayer) such as chromium or tungsten. It can comprise with the metal film which laminated | stacked each film, such as.

(First lid, second lid)
The first lid 31 has a plate shape and is joined to the substrate 2 in a state of being disposed in the first recess 21. On the other hand, the second lid 32 has a plate shape and is joined to the substrate 2 in a state of being disposed in the second recess 22. The first and second lids 31 and 32 are each joined to the substrate 2 via an adhesive 9. As described above, by using the adhesive 9, the first and second lids 31 and 32 can be easily bonded to the substrate 2. Moreover, the choice of the constituent material of the 1st, 2nd lid | covers 31 and 32 increases, and the freedom degree of design of the vibrator | oscillator 1 increases. As the adhesive 9, it is preferable to use an insulating material. Thereby, it is possible to prevent an unintended short circuit from occurring through the adhesive 9.
In addition, as a joining method of the 1st, 2nd lid | covers 31 and 32 and the board | substrate 2, it is not limited to the method using the adhesive agent 9, For example, the method of joining through a metallization layer (metal joining), It may be a method of joining via a brazing material.

  The adhesive 9 is provided over the entire circumference of the bottom surfaces 211 and 221, and the through hole 23 is hermetically sealed by the first and second lids 31 and 32. Thereby, the internal space S of the through-hole 23 is stabilized, and the vibration characteristic of the vibration element 8 is stabilized. The internal space S may be in a reduced pressure state (preferably in a vacuum state) or may be in a gas filled state filled with an inert gas such as argon or helium. By setting the internal space S to such an environment, the vibration characteristics of the vibration element 8 are improved.

In the present embodiment, as described above, the frame-shaped electrodes 52 and 62 are formed on the bottom surfaces 211 and 221. Since these frame-shaped electrodes 52 and 62 are superior in bonding property to the adhesive 9 compared to the substrate 2 (quartz), the first and second lids 31 and 32 can be bonded to the substrate 2 more firmly. In addition, the through-hole 23 can be hermetically sealed more reliably.
The thickness of the first lid 31 is smaller than the depth of the first recess 21, and does not protrude from the upper surface of the substrate 2 (retracts inward) when bonded to the substrate 2. Similarly, the thickness of the second lid 32 is smaller than the depth of the second recess 22 and does not protrude from the lower surface of the substrate 2 (retracted inward) when bonded to the substrate 2. . Thus, the vibrator 1 can be reduced in size by preventing the first lid 31 from protruding from the upper surface of the substrate 2 and the second lid 32 from protruding from the lower surface of the substrate 2.

It does not specifically limit as a constituent material of the 1st, 2nd lid | covers 31 and 32, For example, various metal materials (of these, such as quartz, various glass materials, iron, copper, nickel, cobalt, aluminum, magnesium) Various resin materials such as an alloy containing at least one kind and an intermetallic compound), polyethylene, polypropylene, polyvinyl chloride, polystyrene, polyamide, polyimide, and acrylic resin can be used. For example, as an example, the first and second lids 31 and 32 are constituted by a surface of a stainless steel core material plated with Ni or a surface of an iron core material plated with Ni. Can do. As in this example, the first and second lids 31 and 32 are made of a metal material, so that the first and second lids 31 and 32 are inexpensive and have high weather resistance (corrosion resistance). Is obtained.
The first and second lids 31 and 32 have been described above. In the vibrator 1, it can be said that the first and second lids 31 and 32 and the outer peripheral portion 26 of the substrate 2 constitute a package 7 that houses the vibration element 8.

(First and second metal layers)
As shown in FIG. 1, the first metal layer 41 is provided across the first lid 31 and the substrate 2 so as to cover the boundary between the first recess 21 and the first lid 31. Yes. On the other hand, the second metal layer 42 is provided across the second lid 32 and the substrate 2 so as to cover the boundary between the second recess 22 and the second lid 32. The first and second metal layers 41 and 42 are provided so as not to contact each other. The first metal layer 41 is not in contact with the electrode 6, and the second metal layer 42 is not in contact with the electrode 5. By providing the first and second metal layers 41 and 42 as described above, the adhesive 9 can be sealed, and deterioration of the adhesive 9 over time can be effectively suppressed. Moreover, since moisture resistance improves, the airtightness of the through-hole 23 improves more. Further, the gas generated from the adhesive 9 can be effectively eliminated by heating when the first and second metal layers 41 and 42 are formed, and the reliability is improved.
The constituent material of the first and second metal layers 41 and 42 is not particularly limited as long as it is a metal material. For example, iron, copper, nickel, cobalt, aluminum, magnesium, titanium, etc., or at least of these An alloy containing one kind and an intermetallic compound can be used, and among these, it is particularly preferable to use a Ni-Ti alloy.

The vibrator 1 has been described in detail above. Since the vibrator 1 has a smaller number of parts than a conventional vibrator, the size can be reduced accordingly.
Further, according to the vibrator 1, since the vibration substrate 24 and the outer peripheral portion 26 forming the side wall portion of the package 7 are integrally formed in the substrate 2, the positioning of the package and the vibration element as in the related art is not required. . Conventionally, the package has been manufactured slightly larger in consideration of the displacement at the time of positioning of the vibration element. However, since the vibrator 1 does not have the fear of the positional displacement as described above, the package 7 is made smaller than the conventional one. Can be designed. Also from this point, the size of the vibrator 1 can be reduced.

Conventionally, since an adhesive is used to fix the vibration element to the package, there is a problem that the inside of the hermetic space is contaminated by a gas (outgas) generated from the adhesive. Such a problem does not occur. Therefore, the vibrator 1 can exhibit stable vibration characteristics for a long time.
Further, according to the vibrator 1, since both the extraction electrodes 54 and 64 are extracted to the side surface of the package 7 (the outer peripheral portion 26), electrical connection with an external component (for example, an IC chip 110 of the oscillator 100 described later) is achieved. Connection can be made easily.

Second Embodiment
Next, a second embodiment of the vibrator of the invention will be described.
FIG. 5 is a cross-sectional view of a vibrator according to the second embodiment of the present invention.
Hereinafter, the vibrator of the second embodiment will be described focusing on the differences from the first embodiment described above, and description of similar matters will be omitted.
The vibrator according to the second embodiment of the present invention is the same as that of the first embodiment described above except that a molding material is used instead of the first and second metal films. In addition, the same code | symbol is attached | subjected to the structure similar to 1st Embodiment mentioned above.

The vibrator 1 </ b> A illustrated in FIG. 5 includes a first mold material 43 that fills the first recess 21 and a second mold material 44 that fills the second recess 22. By providing such first and second molding materials 43 and 44, the adhesive 9 can be sealed, and deterioration of the adhesive 9 over time can be effectively suppressed. In addition, the airtightness of the through hole 23 can be further improved. In addition, it does not specifically limit as the 1st, 2nd molding materials 43 and 44, For example, the well-known thing comprised with various resin materials can be used.
Also according to the second embodiment, the same effects as those of the first embodiment described above can be exhibited.

<Third Embodiment>
Next, a third embodiment of the vibrator of the invention will be described.
FIG. 6 is a cross-sectional view of the vibrator according to the third embodiment of the present invention, and FIG. 7 is a plan view (top view) of a substrate included in the vibrator shown in FIG.
Hereinafter, the resonator according to the third embodiment will be described focusing on the differences from the first embodiment described above, and description of similar matters will be omitted.
The vibrator according to the third embodiment of the present invention is the same as that of the first embodiment described above except that the configuration of the substrate is different. In addition, the same code | symbol is attached | subjected to the structure similar to 1st Embodiment mentioned above.

In the substrate 2B of the vibrator 1B shown in FIGS. 6 and 7, the vibration substrate 24B is directly connected to the outer peripheral portion 26 (not through the beam portion). In other words, the entire outer periphery of the vibration substrate 24 </ b> B is connected to the inner surface of the outer peripheral portion 26.
Also according to the third embodiment, the same effects as those of the first embodiment described above can be exhibited.

<Fourth embodiment>
Next, a fourth embodiment of the vibrator of the invention will be described.
FIG. 8 is a top view of the substrate included in the vibrator according to the fourth embodiment of the present invention, and FIG. 9 is a bottom view of the substrate shown in FIG.
Hereinafter, the vibrator of the fourth embodiment will be described focusing on the differences from the first embodiment described above, and description of similar matters will be omitted.
The vibrator according to the fourth embodiment of the present invention is the same as that of the first embodiment described above except that the configuration of the substrate (vibration element) is different. In addition, the same code | symbol is attached | subjected to the structure similar to 1st Embodiment mentioned above.

  The substrate 2C shown in FIGS. 8 and 9 is formed of a Z-cut quartz crystal substrate cut out with the Z-axis as the thickness direction. In addition, the vibration substrate 24C included in the substrate 2C includes a pair of base portions 241C and 242C, and a pair of vibration arms 243C and 244C that are positioned side by side between the base portions 241C and 242C and connect them. In such a vibration substrate 24 </ b> C, the base portion 241 </ b> C is connected to the outer peripheral portion 26 by the beam portions 251 and 252, and the base portion 242 </ b> C is connected to the outer peripheral portion 26 by the beam portions 253 and 254.

Excitation electrodes 51 are formed on the upper and lower surfaces of the vibrating arm 243C and on both side surfaces of the vibrating arm 244C, respectively. These excitation electrodes 51 are collected on the upper surface of the base portion 241 </ b> C, and are connected to the frame-shaped electrode 52 via the wiring electrodes 53 formed on the upper surface of the beam portion 251. On the other hand, excitation electrodes 61 are formed on both side surfaces of the vibrating arm 243C and upper and lower surfaces of the vibrating arm 244C, respectively. These excitation electrodes 61 are collected on the lower surface of the base portion 242C, and are connected to the frame-shaped electrode 62 via the wiring electrodes 63 formed on the lower surface of the beam portion 254. When an alternating voltage is applied between the excitation electrodes 51 and 61, the vibrating arms 243C and 244C vibrate in the in-plane direction at a predetermined frequency so as to repeatedly approach and separate from each other.
According to the fourth embodiment, the same effect as that of the first embodiment described above can be exhibited.
In this embodiment, the vibrating substrate has two vibrating arms. However, the number of vibrating arms is not limited to two, and may be one or three or more. Also good.

<Fifth Embodiment>
Next, a fifth embodiment of the vibrator of the invention will be described.
FIG. 10 is a top view of the substrate included in the vibrator according to the fifth embodiment of the present invention, and FIG. 11 is a bottom view of the substrate shown in FIG.
Hereinafter, the resonator according to the fifth embodiment will be described focusing on the differences from the first embodiment described above, and description of similar matters will be omitted.
The vibrator according to the fifth embodiment of the present invention is the same as that of the first embodiment described above except that the configuration of the substrate (vibration element) is different. In addition, the same code | symbol is attached | subjected to the structure similar to 1st Embodiment mentioned above.

  A substrate 2D shown in FIGS. 10 and 11 is formed of a Z-cut quartz crystal substrate cut out with the Z-axis as the thickness direction. The vibration substrate 24D included in the substrate 2D includes a base portion 241D and a pair of vibration arms 243D and 244D extending from the base portion 241D in directions opposite to each other. In such a vibration substrate 24D, the base portion 241D is connected to the outer peripheral portion 26 by a pair of beam portions 251 and 252 provided to face each other via the base portion 241D.

Excitation electrodes 51 are formed on the upper and lower surfaces of the vibrating arm 243D and on both sides of the vibrating arm 244D, respectively. These excitation electrodes 51 are collected on the upper surface of the base portion 241D, and are connected to the frame-shaped electrode 52 via the wiring electrodes 53 formed on the upper surface of the beam portion 251. On the other hand, excitation electrodes 61 are formed on both side surfaces of the vibrating arm 243D and upper and lower surfaces of the vibrating arm 244C, respectively. These excitation electrodes 61 are collected on the lower surface of the base portion 241D, and are connected to the frame-shaped electrode 62 via the wiring electrodes 63 formed on the lower surface of the beam portion 252. When an alternating voltage is applied between the excitation electrodes 51 and 61, the vibrating arms 243D and 244D vibrate in the in-plane direction at a predetermined frequency in the same direction.
According to the fifth embodiment, the same effect as that of the first embodiment described above can be exhibited.

2. Next, an oscillator to which the vibrator of the present invention is applied (the oscillator of the present invention) will be described.
FIG. 12 is a cross-sectional view showing a preferred embodiment of the oscillator of the present invention.
An oscillator 100 illustrated in FIG. 12 includes a vibrator 1 and an IC chip 110 for driving the vibrator 1 (vibrating element 8), and these are mounted on a circuit board 120. The IC chip 110 is connected to the extraction electrodes 54 and 64 via wirings 121 and 122 formed on the circuit board 120. The IC chip 110 has an oscillation circuit for controlling the driving of the vibrator 1, and when the vibrator 1 is driven by the IC chip 110, a signal having a predetermined frequency can be taken out.

3. Next, an electronic device (an electronic device of the present invention) to which the vibrator of the present invention is applied will be described.
FIG. 13 is a perspective view showing a configuration of a mobile (or notebook) personal computer to which the electronic apparatus of the present invention is applied. In this figure, a personal computer 1100 includes a main body portion 1104 provided with a keyboard 1102 and a display unit 1106 provided with a display portion 2000. The display unit 1106 rotates with respect to the main body portion 1104 via a hinge structure portion. It is supported movably. Such a personal computer 1100 has a built-in vibrator 1 that functions as a filter, a resonator, a reference clock, and the like.

  FIG. 14 is a perspective view showing a configuration of a mobile phone (including PHS) to which the electronic apparatus of the invention is applied. In this figure, a cellular phone 1200 includes a plurality of operation buttons 1202, a earpiece 1204, and a mouthpiece 1206, and a display unit 2000 is disposed between the operation buttons 1202 and the earpiece 1204. Such a cellular phone 1200 incorporates the vibrator 1 that functions as a filter, a resonator, and the like.

  FIG. 15 is a perspective view showing the configuration of a digital still camera to which the electronic apparatus of the present invention is applied. In this figure, connection with an external device is also simply shown. Here, an ordinary camera sensitizes a silver halide photographic film with a light image of a subject, whereas a digital still camera 1300 photoelectrically converts a light image of a subject with an imaging device such as a CCD (Charge Coupled Device). An imaging signal (image signal) is generated.

  A display unit is provided on the back of a case (body) 1302 in the digital still camera 1300, and is configured to perform display based on an imaging signal from the CCD. The display unit is a finder that displays an object as an electronic image. Function. A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the back side in the drawing) of the case 1302.

  When the photographer confirms the subject image displayed on the display unit and presses the shutter button 1306, the CCD image pickup signal at that time is transferred and stored in the memory 1308. In the digital still camera 1300, a video signal output terminal 1312 and an input / output terminal 1314 for data communication are provided on the side surface of the case 1302. As shown in the figure, a television monitor 1430 is connected to the video signal output terminal 1312 and a personal computer 1440 is connected to the input / output terminal 1314 for data communication as necessary. Further, the imaging signal stored in the memory 1308 is output to the television monitor 1430 or the personal computer 1440 by a predetermined operation. Such a digital still camera 1300 incorporates a vibrator 1 that functions as a filter, a resonator, or the like.

  In addition to the personal computer (mobile personal computer) shown in FIG. 13, the mobile phone shown in FIG. 14, and the digital still camera shown in FIG. Inkjet printers), laptop personal computers, televisions, video cameras, video tape recorders, car navigation devices, pagers, electronic notebooks (including those with communication functions), electronic dictionaries, calculators, electronic game devices, word processors, workstations, televisions Telephone, crime prevention TV monitor, electronic binoculars, POS terminal, medical equipment (for example, electronic thermometer, blood pressure monitor, blood glucose meter, electrocardiogram measuring device, ultrasonic diagnostic device, electronic endoscope), fish detector, various measuring devices, instruments (E.g., vehicle, aircraft, Instruments of 舶), can be applied to a flight simulator or the like.

4). Next, a moving body (moving body of the present invention) to which the vibrator of the present invention is applied will be described.
FIG. 16 is a perspective view schematically showing an automobile as an example of the moving object of the present invention. A vibrator 1500 is mounted on the automobile 1500. The vibrator 1 is a keyless entry, immobilizer, car navigation system, car air conditioner, anti-lock brake system (ABS), air bag, tire pressure monitoring system (TPMS), engine control, hybrid car, The present invention can be widely applied to electronic control units (ECUs) such as battery monitors for electric vehicles, vehicle body posture control systems, and the like.

As described above, the vibrator, the oscillator, the electronic device, and the moving body of the present invention have been described based on the illustrated embodiment, but the present invention is not limited to this, and the configuration of each part has the same function. It can be replaced with one having any structure. In addition, any other component may be added to the present invention. Moreover, you may combine each embodiment mentioned above suitably.
In the above-described embodiment, the quartz substrate is used as the substrate, but instead, various piezoelectric substrates such as lithium niobate and lithium tantalate may be used.

  DESCRIPTION OF SYMBOLS 1, 1A, 1B ... Vibrator 2, 2B, 2C, 2D ... Board | substrate 21 ... 1st recessed part 211 ... Bottom 22 ... 2nd recessed part 221 ... Bottom 23 ... Through-hole 24, 24B, 24C, 24D ... Vibrating substrate 241C , 241D, 242C ... base 243C, 243D, 244C, 244D ... vibrating arm 251, 252, 253, 254 ... beam 26 ... outer periphery 261, 262 ... outer surface 27 ... third recess 28 ... fourth recess 29 ... Thin portion 31 ... first lid 32 ... second lid 41 ... first metal layer 42 ... second metal layer 43 ... first molding material 44 ... second molding material 5 ... electrode 51 ... excitation electrode 52 ... Frame electrode 53 ... Wiring electrode 54 ... Lead electrode 6 ... Electrode 61 ... Excitation electrode 62 ... Frame electrode 63 ... Wiring electrode 64 ... Lead electrode 7 ... Package 8 ... Oscillating element 9 ... Adhesive DESCRIPTION OF SYMBOLS 100 ... Oscillator 110 ... IC chip 120 ... Circuit board 121, 122 ... Wiring 1100 ... Personal computer 1102 ... Keyboard 1104 ... Main part 1106 ... Display unit 1200 ... Mobile phone 1202 ... Operation button 1204 ... Earpiece 1206 ... Mouthpiece 1300 ... Digital still camera 1302 ... Case 1304 ... Light receiving unit 1306 ... Shutter button 1308 ... Memory 1312 ... Video signal output terminal 1314 ... Input / output terminal 1430 ... TV monitor 1440 ... Personal computer 1500 ... Automobile 2000 ... Display section S ... Internal space

Claims (12)

1st recessed part which comprised plate shape and was provided in the center part of one main surface of both main surfaces, the 2nd recessed part provided in the center part of the other main surface, and said 1st recessed part And a through-hole penetrating through the center part of the bottom surface of the second recess, and a vibrating part that is disposed in a region surrounded by the through-hole and is thinner than the height of the through-hole is integrally formed. And a substrate
A plate-like first lid that is located in the first recess and joined to the bottom surface of the first recess and covers one opening of the through hole;
A plate-like second lid that is located in the second recess and is joined to the bottom surface of the second recess and covers the other opening of the through hole. Vibrator. The first concave portion is formed in a central portion excluding an edge portion of the one main surface,
The second concave portion is formed in a central portion excluding an edge portion of the other main surface,
2. The vibrator according to claim 1, wherein the through-hole is formed so as to penetrate through central portions excluding an edge portion of a bottom surface of the first concave portion and the second concave portion. The first lid is bonded to the bottom surface of the first recess through an adhesive,
The vibrator according to claim 1, wherein the second lid is joined to a bottom surface of the second recess through an adhesive. A first metal layer formed across the substrate and the first lid so as to cover a boundary portion between the first recess and the first lid;
2. A second metal layer formed across the substrate and the second lid so as to cover a boundary portion between the second recess and the second lid. 4. The vibrator according to any one of items 3 to 3.   5. The vibrator according to claim 1, wherein an area surrounded by the through hole is hermetically sealed by the first lid and the second lid. 6. The thickness of the first lid is thinner than the depth of the first recess,
The vibrator according to claim 1, wherein a thickness of the second lid is thinner than a depth of the second recess. Having a pair of excitation electrodes formed in the thin portion;
One of the excitation electrodes is drawn to the side surface of the substrate through the through hole and the first recess,
The vibrator according to claim 1, wherein the other excitation electrode is led out to a side surface of the substrate through the through hole and the second recess.   The vibrator according to claim 1, wherein the thin portion is connected to a side surface of the through hole via a beam.   The vibrator according to claim 1, wherein each of the first lid and the second lid is made of a metal material. The vibrator according to any one of claims 1 to 9,
And an oscillation circuit connected to the vibrator.   An electronic apparatus comprising the vibrator according to claim 1.   A moving body comprising the vibrator according to claim 1.

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