JP2014165227A - Electronic control device - Google Patents
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- JP2014165227A JP2014165227A JP2013032725A JP2013032725A JP2014165227A JP 2014165227 A JP2014165227 A JP 2014165227A JP 2013032725 A JP2013032725 A JP 2013032725A JP 2013032725 A JP2013032725 A JP 2013032725A JP 2014165227 A JP2014165227 A JP 2014165227A
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- 230000005855 radiation Effects 0.000 claims abstract description 21
- 239000000758 substrate Substances 0.000 claims description 34
- 238000010438 heat treatment Methods 0.000 claims description 6
- 238000001816 cooling Methods 0.000 abstract description 47
- 230000017525 heat dissipation Effects 0.000 abstract description 23
- 230000020169 heat generation Effects 0.000 abstract description 8
- 230000000694 effects Effects 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000004734 Polyphenylene sulfide Substances 0.000 description 3
- 229920001707 polybutylene terephthalate Polymers 0.000 description 3
- 229920000069 polyphenylene sulfide Polymers 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000004512 die casting Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- -1 polybutylene terephthalate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
本発明は、電子制御装置に関し、特に車載用電子制御装置に関する。 The present invention relates to an electronic control device, and more particularly to an on-vehicle electronic control device.
近年、自動車では、車室内スペースの確保やエンジンルーム内の部品点数増加の為、エンジンルームの小型・狭小化が進んでいる。 In recent years, in an automobile, the engine room has been reduced in size and size in order to secure a vehicle interior space and increase the number of parts in the engine room.
そこで、エンジンコントロールユニット等の車載用電子制御装置は、高密度化したエンジンルーム内へ搭載しなくてはならず、搭載スペースが限られる為、更なる小型化への対応が求められる。 Therefore, an in-vehicle electronic control device such as an engine control unit must be mounted in a high-density engine room, and the mounting space is limited, so that further downsizing is required.
製品サイズを小さくする為には、基板サイズを小さくする必要があるが、基板サイズは、電子部品の数量や搭載密度等によって決まってしまうことから、電子部品の高密度実装化やICへの集約化を行うことで更なる小型化が進められている。 In order to reduce the product size, it is necessary to reduce the board size, but the board size is determined by the quantity and mounting density of electronic components. Further downsizing is being promoted by making it easier.
しかし、電子部品の高密度実装や集約化が進むことで、今までは、部品の発熱が分散され、筐体全体での放熱を行っていたのに対し、発熱部が一箇所に集中してしまう為、筐体全体を放熱に有効活用することが出来ず、放熱性能が低下し、ICのチップの温度が保証温度を超えてしまうことが問題となる。 However, with the progress of high-density mounting and integration of electronic components, heat generation of the components has been dispersed until now, and heat is dissipated in the entire housing. As a result, the entire housing cannot be effectively used for heat dissipation, heat dissipation performance is degraded, and the temperature of the IC chip exceeds the guaranteed temperature.
それに加え、エンジンルーム内の狭小化が進むことで、発熱体であるエンジンや他の車載部品から発せられる熱が高密度化し、エンジンルーム内の温度は更に高温化する。 In addition, as the inside of the engine room becomes narrower, the heat generated from the engine, which is a heating element, and other in-vehicle components is increased in density, and the temperature in the engine room is further increased.
また、電子制御装置の放熱性能を改善するには、冷却風を増加することで改善できるが、エンジンルーム内は、高密度に収納された部品や配線により、電子制御装置周囲の冷却風は妨げられる為、十分な風量や流速が得られ難い環境となっている。 In order to improve the heat dissipation performance of the electronic control unit, it can be improved by increasing the cooling air. However, the cooling air around the electronic control unit is hindered in the engine room by the components and wiring stored at high density. Therefore, it is difficult to obtain a sufficient air volume and flow velocity.
そこで、電子制御装置では、周囲に流れる僅かな冷却風を効率良く利用し、冷却性能を改善することが求められている。 Therefore, the electronic control device is required to improve the cooling performance by efficiently using a small amount of cooling air flowing around.
冷却風の流れを効率良く発熱部に流し、放熱性能を向上させる手段としては、特許文献１や２に記載の様に、フィンにより冷却風をガイドし、発熱部の流路断面積を小さくすることで流速を上げ、放熱性能を向上させる手段が用いられている。 As described in Patent Documents 1 and 2, as a means for efficiently flowing the cooling air flow to the heat generating part and improving the heat dissipation performance, the cooling air is guided by fins to reduce the flow passage cross section of the heat generating part. Thus, means for increasing the flow rate and improving the heat dissipation performance is used.
しかしながら、特許文献１や２の構造では、フィンと平行方向に冷却風が流れた場合には、放熱性能は向上するが、フィンと垂直方向や斜め方向から冷却風が流れた場合には、放熱性能は大幅に低下してしまう。冷却風の方向により放熱性能が変わってしまうと、電子制御装置自体や、周囲に搭載される車載部品の配置にも制限が生じてしまうことから、エンジルーム内の部品レイアウトが困難となる。また、冷却方向が一方向に決まってしまう場合、筐体構造は、車種毎に専用構造となり、高コストな構造となってしまう。 However, in the structures of Patent Documents 1 and 2, the heat dissipation performance is improved when the cooling air flows in the direction parallel to the fins. However, when the cooling air flows from the direction perpendicular to or oblique to the fins, the heat dissipation performance is improved. Performance will be significantly reduced. If the heat dissipation performance changes depending on the direction of the cooling air, the electronic control device itself and the arrangement of on-vehicle components mounted in the surrounding area are also limited, so that it is difficult to lay out the components in the engine room. Further, when the cooling direction is determined in one direction, the housing structure is a dedicated structure for each vehicle type, resulting in an expensive structure.
そこで、冷却風がどの方向から流れた場合においても安定した放熱性能が得られる構造にする必要がある。 Therefore, it is necessary to have a structure in which stable heat dissipation performance can be obtained no matter which direction the cooling air flows.
上記課題を解決するために、本発明に係る電子制御装置は、電子回路を構成する発熱部品と、前記発熱部品を搭載する基板と、前記基板を支持するベースと、を備え、前記ベースは、前記基板の前記発熱部品の搭載部に向かって突出する突出部と、当該突出部が設けられた面とは反対側に設けられる複数のリブと、を有し、前記突出部は、前記基板と熱的に接触し、前記複数のリブは、前記ベースに設けられる放射中心から、当該放射中心を挟んで放射状に形成される第１リブ及び第２リブを含んで構成され、前記放射中心に近い側の前記第１リブの第１側壁先端部と前記放射中心に近い側の前記第２リブの第２側壁先端部を結ぶ線分を第１線分と定義し、前記基板の前記発熱部品の搭載面の垂直方向から投影した場合に、前記突出部は、当該突出部の射影部が前記第１線分の射影部と重なるように形成され、前記発熱部品は、当該発熱部品の射影部が前記突出部の前記射影部と重なるように配置される。 In order to solve the above problems, an electronic control device according to the present invention includes a heat generating component constituting an electronic circuit, a substrate on which the heat generating component is mounted, and a base that supports the substrate. And a plurality of ribs provided on a side opposite to the surface on which the protrusion is provided, the protrusion protruding toward the mounting portion of the heat generating component of the substrate, and the protrusion includes the substrate and The plurality of ribs are in thermal contact with each other and include a first rib and a second rib formed radially from the radiation center provided on the base with the radiation center interposed therebetween, and are close to the radiation center. A line segment connecting a first side wall tip of the first rib on the side and a second side wall tip of the second rib on the side close to the radiation center is defined as a first line segment, and the heating component of the substrate When projected from the direction perpendicular to the mounting surface, the protrusions Projection of the projecting portion is formed so as to overlap with the projection portion of the first line, the heat generating component, the projection portion of the heat generating component is disposed so as to overlap with the projection portion of the projecting portion.
本発明では、発熱部を中心に放射状に伸びた冷却風のガイドリブが発熱部品の搭載部近傍で分割されていることにより、冷却風がどの方向から吹いても、発熱部へ冷却風をガイドし、流速を向上することが出来る為、十分な冷却風が得られない場合においても安定した放熱性能が得られる。 In the present invention, the cooling air guide ribs extending radially around the heat generating portion are divided in the vicinity of the heat generating component mounting portion, so that the cooling air is guided to the heat generating portion no matter which direction the cooling air blows. Since the flow rate can be improved, stable heat dissipation performance can be obtained even when sufficient cooling air cannot be obtained.
また、冷却風の方向による取り付け制限が無くなることから、エンジンルーム内での電子制御装置の取り付けレイアウト性が向上し、且つ、車種毎に専用の筐体構造とする必要性が無くなることから、汎用性が向上する。 In addition, since there is no mounting restriction depending on the direction of the cooling air, the mounting layout of the electronic control device in the engine room is improved, and there is no need for a dedicated housing structure for each vehicle type. Improves.
図1ないし図3に本発明の第1実施形態による車両用電子制御装置を示す。本実施例では、特に、エンジンルーム内に搭載される車両用電子制御装置であるECU(エンジンコントロールユニット)について説明する。図１は、本実施形態における車両用電子制御装置の下面図である。図２は、図１の面Ａの矢印方向から見た車両用電子制御装置の下面図である。 1 to 3 show a vehicle electronic control device according to a first embodiment of the present invention. In the present embodiment, an ECU (engine control unit) that is an electronic vehicle control device mounted in an engine room will be described. FIG. 1 is a bottom view of the vehicle electronic control device according to the present embodiment. FIG. 2 is a bottom view of the vehicle electronic control device viewed from the direction of the arrow on the surface A in FIG.
本実施形態における車両用電子制御装置1は、ベース2と、基板6と、カバー5と、コネクタ3と複数の電子部品4により構成されている。 The vehicle electronic control device 1 according to the present embodiment includes a base 2, a substrate 6, a cover 5, a connector 3, and a plurality of electronic components 4.
基板6は、ガラスクロスにエポキシ樹脂を含浸させた基材を主材料とし、銅による配線層が多層構造で構成されている。基板6の両面には、複数の電子部品4が半田7により接続され、前記銅配線により電気回路を構成している。電子部品4は、基板6の片面のみに搭載されている場合でも良い。電子部品4としては、抵抗、コンデンサ、コイル、クリスタル、ダイオード、IC、MOSFET、トランジスタ等がある。 The substrate 6 is mainly composed of a base material obtained by impregnating a glass cloth with an epoxy resin, and a wiring layer made of copper has a multilayer structure. A plurality of electronic components 4 are connected to both surfaces of the substrate 6 by solder 7, and an electric circuit is constituted by the copper wiring. The electronic component 4 may be mounted only on one side of the substrate 6. Examples of the electronic component 4 include a resistor, a capacitor, a coil, a crystal, a diode, an IC, a MOSFET, and a transistor.
電子部品4のうち、特に発熱を伴う発熱部品41が接続されている前記基板の銅導体には、基板を貫通する放熱ビア（図示せず）が複数設けられており、発熱部品41により発生した熱はこの放熱ビアを介し基板裏面へと伝わる。また、発熱部品が接続されている基板の裏面側には、放熱材8が塗布されており、ベース2と密着していることで、基板裏面へ伝わった熱は、ベース2へと伝わり大気中へと放熱される。発熱部品41を含む電子部品4は、はんだ7を介して基板6に固定される。 Among the electronic components 4, the copper conductor of the substrate to which the heat generating component 41 accompanied by heat generation is connected is particularly provided with a plurality of heat dissipation vias (not shown) penetrating the substrate. Heat is transferred to the back surface of the substrate through the heat dissipation via. In addition, the heat dissipation material 8 is applied to the back side of the board to which the heat-generating components are connected, and the heat transferred to the back side of the board is transferred to the base 2 because it is in close contact with the base 2. The heat is dissipated. The electronic component 4 including the heat generating component 41 is fixed to the substrate 6 via the solder 7.
ここで放熱材8はフィラーを多く配合したシリコン系やエポキシ系の接着剤やシートやグリスが好ましい。また、発熱素子41は、複数の発熱部品を集約化したICや、ダイオード、MOSFET、トランジスタ等を示す。 Here, the heat radiating material 8 is preferably a silicon-based or epoxy-based adhesive, a sheet, or grease containing a large amount of filler. Further, the heating element 41 is an IC, a diode, a MOSFET, a transistor, or the like in which a plurality of heating parts are integrated.
ベース2は、基板6上の発熱部品41から発生する発熱を放熱させ、且つ、車両用電子制御装置1を車両側に固定することを目的として用いられる。材料としては、アルミ、鉄、銅等を主成分とした金属が使用される。製法としては、アルミダイカストや板金等により成形されている。図２に示されるように、ベース2は、基板6の発熱部品41の搭載部に向かって突出する突出部22を有する。突出部22は、放熱材8を介して基板6と熱的に接触する。 The base 2 is used for the purpose of dissipating heat generated from the heat generating component 41 on the substrate 6 and fixing the vehicle electronic control device 1 to the vehicle side. As a material, a metal mainly composed of aluminum, iron, copper, or the like is used. As a manufacturing method, it is formed by aluminum die casting, sheet metal or the like. As shown in FIG. 2, the base 2 has a protruding portion 22 that protrudes toward the mounting portion of the heat generating component 41 of the substrate 6. The protrusion 22 is in thermal contact with the substrate 6 via the heat dissipation material 8.
コネクタ3は、基板6に半田付けにより固定されている。コネクタ3は、端子32を基板に挿入し、半田付けされる基板挿入型のタイプを図示しているが、基板表面に面実装する面付けタイプのものでも良い。コネクタ3は、特に防水コネクタであり、コネクタ形状をPBT(ポリブチレンテレフタレート)やPPS(ポリフェニレンサルファイド)の樹脂筐体31で形成している。コネクタ3内部には、基板6に構成された電子回路と外部回路とを電気的に接続する為の端子32を有している。 The connector 3 is fixed to the substrate 6 by soldering. The connector 3 is of a board insertion type in which the terminals 32 are inserted into the board and soldered, but may be of a surface mounting type that is surface-mounted on the board surface. The connector 3 is particularly a waterproof connector, and the connector shape is formed of a resin housing 31 of PBT (polybutylene terephthalate) or PPS (polyphenylene sulfide). Inside the connector 3, a terminal 32 is provided for electrically connecting an electronic circuit formed on the substrate 6 and an external circuit.
カバー5は、ベース2と防水シール（図示せず）により接着固定されており、内部に電子部品4が搭載された基板6を収納している。内部空間は、気密性が保たれた閉空間をとなっている。カバー5はPBTやPPS等の樹脂や、アルミ、鉄、銅等を主成分とした金属で構成されている。 The cover 5 is bonded and fixed by a base 2 and a waterproof seal (not shown), and houses a substrate 6 on which an electronic component 4 is mounted. The internal space is a closed space where airtightness is maintained. The cover 5 is made of a resin such as PBT or PPS, or a metal mainly composed of aluminum, iron, copper or the like.
本実施形態は、以上のエンジンルーム内に搭載される電子制御装置1の発熱部品41の放熱効率を向上させることを目的とする。そこで、ベース２の外面側には、複数のガイドリブ21Ａないし21Ｄが形成されており、そのガイドリブ21Ａないし21Ｄは、発熱部品41が搭載されている部分に冷却風9をガイドする様に形成される。これにより、発熱部品41での冷却風の風速を高めることが出来る為、ベース表面の熱伝達率が上がり、放熱性能が向上する。 The object of the present embodiment is to improve the heat dissipation efficiency of the heat generating component 41 of the electronic control device 1 mounted in the engine room. Therefore, a plurality of guide ribs 21A to 21D are formed on the outer surface side of the base 2, and the guide ribs 21A to 21D are formed so as to guide the cooling air 9 to the portion where the heat generating component 41 is mounted. . Thereby, since the wind speed of the cooling air in the heat-generating component 41 can be increased, the heat transfer coefficient of the base surface is increased and the heat radiation performance is improved.
またガイドリブ21Ａないし21Ｄは発熱部品41の搭載部で分割されていることで、冷却風9は縦方向、横方向何れの方向から吹いた場合でも同様に発熱部に冷却風を集約することが出来る。 Further, since the guide ribs 21A to 21D are divided by the mounting portion of the heat generating component 41, the cooling air can be concentrated in the heat generating portion in the same manner when the cooling air 9 blows from either the vertical direction or the horizontal direction. .
具体的には図１に示されるように、複数のガイドリブ21Ａないし21Ｄは、ベース2に設けられる放射中心23から、この放射中心23を挟んで、放射状に又は対向する方向に形成される第１ガイドリブ21Ａ及び第２ガイドリブ21Ｃを含んで構成される。 Specifically, as shown in FIG. 1, the plurality of guide ribs 21 </ b> A to 21 </ b> D are formed from a radial center 23 provided on the base 2 in a radial or opposite direction across the radial center 23. The guide rib 21A and the second guide rib 21C are included.
そして放射中心23に近い側の第１ガイドリブ21Ａの第１側壁先端部24Ａと放射中心23に近い側の第２ガイドリブ21Ｃの第２側壁先端部24Ｃを結ぶ線分を第１線分25と定義する。 A line segment connecting the first side wall tip 24A of the first guide rib 21A near the radiation center 23 and the second side wall tip 24C of the second guide rib 21C near the radiation center 23 is defined as a first line segment 25. To do.
基板6の発熱部品41の搭載面の垂直方向Ｂ（図２参照）から投影した場合に、突出部22は、図１に示されるように、突出部22の射影部26が第１線分25の射影部27と重なるように形成される。さらに発熱部品41は、発熱部品41の射影部28が突出部22の射影部26と重なるように配置される。これにより、発熱部品41の冷却性能を向上させることが出来る。 When projected from the vertical direction B (see FIG. 2) of the mounting surface of the heat generating component 41 of the substrate 6, the projection 22 has the first line segment 25 as shown in FIG. It is formed so as to overlap with the projected portion 27 of. Furthermore, the heat generating component 41 is arranged such that the projection part 28 of the heat generation component 41 overlaps the projection part 26 of the protrusion 22. Thereby, the cooling performance of the heat generating component 41 can be improved.
図３に示すように、ベース２は、このベース２を支持する脚部29を有する。固定部29はネジ11を介して脚部29を固定する。固定部29は、ベース2の縁辺201と脚部29と固定部10とにより構成される開口部202が複数のガイドリブ（
図３においてはガイドリブ21Ｃ及び21Ｄ)と向き合うように、ベース2を挟んで基板6と対向して配置される。開口部202は、電子制御装置1の他の面に形成されていても良く、複数面に形成されていても良い。
As shown in FIG. 3, the base 2 has legs 29 that support the base 2. The fixing portion 29 fixes the leg portion 29 via the screw 11. The fixing portion 29 has an opening 202 constituted by the edge 201 of the base 2, the leg portion 29, and the fixing portion 10, and a plurality of guide ribs (
In FIG. 3, it is arranged to face the substrate 6 across the base 2 so as to face the guide ribs 21C and 21D). The opening 202 may be formed on the other surface of the electronic control device 1, or may be formed on a plurality of surfaces.
これにより、固定部10とベース2との間に冷却風流路が形成され、その冷却風流路の中に、複数のガイドリブ21Ａないし21Ｄが形成されることになる。固定部10が無い場合、冷却風は、ベース2の面から剥離方向に流れてしまう為、冷却風による放熱効果は、ベース2の後方に行くにつれて低下してしまうが、固定部10があることで、冷却風の剥離を抑え、ベース2の後方まで安定して冷却風を流すことが可能となる。そこで、本実施形態の複数のガイドリブ21Ａないし21Ｄによる冷却風の集約効果もより大きくなり、放熱効果も非常に大きくなる。ここで、固定部10は、アルミや鋼板、樹脂などにより形成されている。 As a result, a cooling air flow path is formed between the fixing portion 10 and the base 2, and a plurality of guide ribs 21A to 21D are formed in the cooling air flow path. When there is no fixed part 10, the cooling air flows in the peeling direction from the surface of the base 2, so the heat dissipation effect by the cooling air decreases as it goes to the rear of the base 2, but there is a fixed part 10. Thus, it is possible to suppress the separation of the cooling air and to flow the cooling air stably to the rear of the base 2. Therefore, the cooling air concentration effect by the plurality of guide ribs 21A to 21D of the present embodiment is further increased, and the heat dissipation effect is also greatly increased. Here, the fixing portion 10 is formed of aluminum, a steel plate, a resin, or the like.
ガイドリブ21Ａないし21Ｄは、ベース2とアルミダイカストや板金等により一体成形で形成された場合、冷却風を発熱部にガイドする効果の他に、冷却フィンとしての効果も得られる。 When the guide ribs 21A to 21D are formed by integral molding with the base 2 and aluminum die casting, sheet metal or the like, the effect as a cooling fin can be obtained in addition to the effect of guiding the cooling air to the heat generating portion.
図4に本発明の第2実施形態による車両用電子制御装置1を示す。第2実施形態の様に、第１実施形態でのガイドリブ21Ａないし21Ｄのうち隣り合う２つのガイドリブの間に、複数本のガイドリブ30を放射状に追加した形状とすることで、冷却風が、縦・横方向以外の斜め方向から吹いた場合においても同様に発熱部に冷却風を集約することが可能となる。また、追加したガイドリブ30は、冷却風の流れ方向に形成されている為、冷却フィンとしての放熱効果も向上出来る。 FIG. 4 shows a vehicle electronic control device 1 according to a second embodiment of the present invention. As in the second embodiment, the cooling air is longitudinally formed by adding a plurality of guide ribs 30 radially between two adjacent guide ribs 21A to 21D in the first embodiment. Even when blown from an oblique direction other than the horizontal direction, the cooling air can be concentrated in the heat generating portion in the same manner. Further, since the added guide rib 30 is formed in the flow direction of the cooling air, the heat radiation effect as the cooling fin can be improved.
また、ベース2の放射中心23の周辺、特に発熱部品41と対向する位置に、複数のピンフィン（不図示）を形成してもよい。ガイドリブ21Ａないし21Ｄにより冷却風の流速が向上した部分に複数のピンフィンを配置することで、より効果的に放熱性能を向上出来る。また、発熱部にはピンフィンを使用することで、様々な方向から冷却風が吹いた場合でも同様な放熱性能が得られる。ここで、発熱部に立てるピンフィンは、円柱の他に四角や五角柱等の多角形のものでも良い。 Further, a plurality of pin fins (not shown) may be formed around the radiation center 23 of the base 2, particularly at a position facing the heat generating component 41. By disposing a plurality of pin fins in the portion where the flow velocity of the cooling air is improved by the guide ribs 21A to 21D, the heat radiation performance can be improved more effectively. Further, by using pin fins for the heat generating portion, the same heat dissipation performance can be obtained even when cooling air is blown from various directions. Here, the pin fin standing on the heat generating portion may be a polygonal shape such as a quadrangular or pentagonal prism in addition to a cylindrical shape.
図5に、本発明の第3実施形態による車両用電子制御装置を示す。第１及び2実施形態では、発熱部品41が車両用電子制御装置1の中心に配置された場合を示しているが、第3実施形態の様に中心からずれた位置に配置された場合においても、発熱部品41へ冷却風をガイドする様にガイドリブ21Ａないし21Ｄを配置することで、放熱性能の向上が可能となる。 FIG. 5 shows an electronic control device for a vehicle according to a third embodiment of the present invention. In the first and second embodiments, the case where the heat generating component 41 is arranged at the center of the vehicle electronic control device 1 is shown, but even in the case where it is arranged at a position shifted from the center as in the third embodiment. By disposing the guide ribs 21A to 21D so as to guide the cooling air to the heat generating component 41, the heat radiation performance can be improved.
この構造では、基板上での発熱部品41のレイアウトの制限が無くなることから、レイアウトしやすい位置に発熱部品41を搭載出来る。なお、22はピンフィンであり、これにより冷却性能を向上させる。 In this structure, since there is no restriction on the layout of the heat generating component 41 on the substrate, the heat generating component 41 can be mounted at a position where layout is easy. Reference numeral 22 denotes a pin fin, which improves the cooling performance.
図6に、本発明の第4実施形態による車両用電子制御装置を示す。 FIG. 6 shows a vehicle electronic control device according to a fourth embodiment of the present invention.
本発明の第１ないし4実施形態では、発熱部品41が配置された箇所が１箇所の場合を示しているが、２箇所の場合においても発熱部品41毎に冷却風のガイドリブ21を配置することで、同様の放熱効果が得られる。また、発熱部品41が2箇所以上の場合においても、それぞれの発熱部に対し、冷却風のガイドリブ21を用いることで、同様の放熱効果が得られる。 In the first to fourth embodiments of the present invention, there is shown a case where the heat generating component 41 is disposed at one location, but the cooling air guide rib 21 is disposed for each heat generating component 41 even in the case of two locations. Thus, the same heat dissipation effect can be obtained. Further, even when the number of the heat generating components 41 is two or more, the same heat dissipation effect can be obtained by using the cooling rib guide ribs 21 for the respective heat generating portions.
図7に、本発明の第5実施形態による車両用電子制御装置を示す。 FIG. 7 shows a vehicle electronic control device according to a fifth embodiment of the present invention.
本実施例では、ガイドリブ21Ａないし21Ｄを車両用電子制御装置1の外部まで伸ばした構造である。例えばガイドリブ21Ｃ、第２側壁先端部24Ｃとは反対側の先端部33がベース2の縁辺34から遠ざかる方向に突出するように形成される。この構造とすることで、より広範囲から冷却風を集められる為、発熱部での風速を更に速めることが可能となる。 In this embodiment, the guide ribs 21A to 21D are extended to the outside of the vehicle electronic control device 1. For example, the guide rib 21 </ b> C and the distal end portion 33 opposite to the second sidewall distal end portion 24 </ b> C are formed so as to protrude in a direction away from the edge 34 of the base 2. With this structure, the cooling air can be collected from a wider range, so that the air speed at the heat generating portion can be further increased.
図8及び9に、本発明の第6実施形態による車両用電子制御装置1を示す。 8 and 9 show a vehicle electronic control device 1 according to a sixth embodiment of the present invention.
この構造では、車両用電子制御装置1の車両側の固定部10に、冷却風のガイドリブ101を設けた構造である。この構造とすることでも冷却風を発熱部にガイドし流速を上げることが可能となる為、放熱効果を向上させることが可能となる。 In this structure, a cooling rib guide rib 101 is provided in the vehicle-side fixing portion 10 of the vehicle electronic control device 1. Even with this structure, it is possible to guide the cooling air to the heat generating portion and increase the flow velocity, so that the heat dissipation effect can be improved.
また、この構造では、ベース側にリブを設ける必要が無い為、ベースは単純な板形状で良く、ベースを安価に製造することが可能となる。 Further, in this structure, since it is not necessary to provide a rib on the base side, the base may be a simple plate shape, and the base can be manufactured at low cost.
ここで、固定部10側の冷却風のガイドリブ101は、アルミや鋼板、樹脂等により形成されている。 Here, the guide rib 101 of the cooling air on the fixed portion 10 side is formed of aluminum, a steel plate, a resin, or the like.
1…車両用電子制御装置、2…ベース、3…コネクタ、4…電子部品、5…カバー、6…基板、7…はんだ、8…放熱材、9…冷却風、10…固定部、11…ネジ、21Ａ…ガイドリブ、21Ｂ…ガイドリブ、21Ｃ…ガイドリブ、21Ｄ…ガイドリブ、22…ピンフィン、31…樹脂筐体、32…端子、41…発熱部品、101…ガイドリブ DESCRIPTION OF SYMBOLS 1 ... Electronic control apparatus for vehicles, 2 ... Base, 3 ... Connector, 4 ... Electronic component, 5 ... Cover, 6 ... Board, 7 ... Solder, 8 ... Heat dissipation material, 9 ... Cooling air, 10 ... Fixing part, 11 ... Screws, 21A ... guide ribs, 21B ... guide ribs, 21C ... guide ribs, 21D ... guide ribs, 22 ... pin fins, 31 ... resin casing, 32 ... terminals, 41 ... heat-generating parts, 101 ... guide ribs
Claims (5)
前記発熱部品を搭載する基板と、
前記基板を支持するベースと、を備え、
前記ベースは、前記基板の前記発熱部品の搭載部に向かって突出する突出部と、当該突出部が設けられた面とは反対側に設けられる複数のリブと、を有し、
前記突出部は、前記基板と熱的に接触し、
前記複数のリブは、前記ベースに設けられる放射中心から、当該放射中心を挟んで放射状に形成される第１リブ及び第２リブを含んで構成され、
前記放射中心に近い側の前記第１リブの第１側壁先端部と前記放射中心に近い側の前記第２リブの第２側壁先端部を結ぶ線分を第１線分と定義し、
前記基板の前記発熱部品の搭載面の垂直方向から投影した場合に、
前記突出部は、当該突出部の射影部が前記第１線分の射影部と重なるように形成され、
前記発熱部品は、当該発熱部品の射影部が前記突出部の前記射影部と重なるように配置される電子制御装置。 A heat-generating component constituting an electronic circuit;
A substrate on which the heat generating component is mounted;
A base for supporting the substrate,
The base has a protruding portion that protrudes toward the mounting portion of the heat generating component of the substrate, and a plurality of ribs that are provided on the opposite side of the surface on which the protruding portion is provided,
The protrusion is in thermal contact with the substrate;
The plurality of ribs are configured to include a first rib and a second rib that are formed radially from the radiation center provided on the base with the radiation center interposed therebetween.
A line segment connecting the first side wall tip of the first rib near the radiation center and the second side wall tip of the second rib near the radiation center is defined as a first line segment,
When projected from the vertical direction of the mounting surface of the heating component of the substrate,
The projecting portion is formed such that the projected portion of the projecting portion overlaps the projected portion of the first line segment,
The heat generating component is an electronic control device arranged such that a projected portion of the heat generating component overlaps the projected portion of the protruding portion.
前記ベースを支持する脚部と、
前記脚部を固定する固定部と、を備え、
前記固定部は、前記ベースの縁辺と前記脚部と前記固定部とにより構成される開口部が前記第１リブと前記第２リブと向き合うように、前記ベースを挟んで前記基板と対向して配置される電子制御装置。 The electronic control device according to claim 1,
Legs supporting the base;
A fixing part for fixing the leg part,
The fixing portion is opposed to the substrate with the base interposed therebetween so that an opening formed by an edge of the base, the leg portion, and the fixing portion faces the first rib and the second rib. Electronic control device to be arranged.
前記第１リブは、前記第１側壁先端部とは反対側の先端部が前記ベースの縁辺から遠ざかる方向に突出するように形成される電子制御装置。 The electronic control device according to claim 1 or 2,
The first rib is an electronic control device formed such that a tip portion opposite to the tip portion of the first side wall protrudes in a direction away from the edge of the base.
前記ベースに形成されるピンフィンを備え、
前記ピンフィンは、当該ピンフィンの射影部が前記突出部の前記射影部と重なるように配置される電子制御装置。 The electronic control device according to any one of claims 1 to 3,
Comprising pin fins formed on the base;
The said pin fin is an electronic control apparatus arrange | positioned so that the projection part of the said pin fin may overlap with the said projection part of the said protrusion part.
前記発熱部品を搭載する基板と、
前記基板を支持するベースと、
前記ベースを支持する脚部と、
前記脚部を固定する固定部と、を備え、
前記固定部は、前記ベースを挟んで前記基板と対向して配置され、
さらに前記固定部は、前記ベースに近い面に設けられる複数のリブを有し、
前記ベースは、前記基板の前記発熱部品の搭載部に向かって突出する突出部を有し、
前記突出部は、前記基板と熱的に接触し、
前記複数のリブは、前記固定部に設けられる放射中心から放射状に形成される第１リブ及び第２リブを含んで構成され、
前記放射中心に近い側の前記第１リブの第１側壁先端部と前記放射中心に近い側の前記第２リブの第２側壁先端部を結ぶ線分を第１線分と定義し、
前記基板の前記発熱部品の搭載面の垂直方向から投影した場合に、
前記突出部は、当該突出部の射影部が前記第１線分の射影部と重なるように形成され、
前記発熱部品は、当該発熱部品の射影部が前記突出部の前記射影部と重なるように配置される電子制御装置。 A heat-generating component constituting an electronic circuit;
A substrate on which the heat generating component is mounted;
A base that supports the substrate;
Legs supporting the base;
A fixing part for fixing the leg part,
The fixing portion is disposed to face the substrate across the base,
Furthermore, the fixing portion has a plurality of ribs provided on a surface close to the base,
The base has a protruding portion that protrudes toward the mounting portion of the heat generating component of the substrate,
The protrusion is in thermal contact with the substrate;
The plurality of ribs include a first rib and a second rib that are formed radially from a radiation center provided in the fixed portion,
A line segment connecting the first side wall tip of the first rib near the radiation center and the second side wall tip of the second rib near the radiation center is defined as a first line segment,
When projected from the vertical direction of the mounting surface of the heating component of the substrate,
The projecting portion is formed such that the projected portion of the projecting portion overlaps the projected portion of the first line segment,
The heat generating component is an electronic control device arranged such that a projected portion of the heat generating component overlaps the projected portion of the protruding portion.
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