JP2014145701A - Electronic device manufacturing method, electronic device, electronic apparatus and movable body - Google Patents

Abstract

An electronic device manufacturing method and an electronic device capable of easily performing deaeration and sealing in a cavity are provided.
An electronic device manufacturing method for joining a base (91) and a lid (92) while forming an internal space (14) in which the gyro element (2) is accommodated between the base (91) and the lid (92). The groove 94 is provided on the surface to be joined to the base 91, and the inner surface 14 is not joined to the base 91 so that the inner space 14 and the outside communicate with each other. The joining step of joining the lid 92 and the base 91 so that 94 is positioned in the vicinity of the recess 89 provided on the side surface of the base 91, and the communicating portion of the lid 92 by irradiating the lid 92 with laser light 98 And a sealing step for closing the electronic device.
[Selection] Figure 5

Description

  The present invention relates to an electronic device manufacturing method, an electronic device, an electronic apparatus, and a moving body.

  In recent years, portable electronic devices have been widely used, and accordingly, demands for reducing the size and weight of electronic devices and reducing the cost have increased. For this reason, there is an increasing demand for miniaturization and cost reduction while maintaining high accuracy in electronic components used in electronic devices. In particular, in a vibration device in which a vibration element is housed in a package, vibration characteristics are maintained by maintaining a space in which the vibration element is housed in an airtight manner, and therefore various proposals have been made for its sealing technology.

  For example, in the joining methods disclosed in Patent Document 1 and Patent Document 2, the lid that covers the opening of the space in which the vibration device element (vibration element) is accommodated and the periphery of the opening are welded after leaving a part thereof. Care is taken, and then the lid and the peripheral edge of the opening are sealed. In addition, in the small crystal resonator disclosed in Patent Document 3, a notch is formed on the package surface to be joined to the lid (lid), and the metal brazing material is melted leaving a part other than the notch. Then, the lid and the package are joined and deaerated. Thereafter, the metal brazing material in the notched portion is remelted to seal the lid and the package.

JP 2000-223604 A JP 2002-359111 A Japanese Patent Laid-Open No. 1-151813

  However, in the joining method shown in Patent Document 1 and Patent Document 2 described above, the lid and the periphery of the opening portion are welded leaving a part, and the unwelded portion is welded after deaeration. It is difficult to stably manage the dimensions and the like, and the deaeration takes place from a slight gap in the unwelded part, so the deaeration time becomes long and the number of sealing steps increases. Moreover, in the structure shown by patent document 3, in order to deaerate while fuse | melting a metal brazing material, management of a molten state is required, and stable deaeration and sealing cannot be performed. The vibration characteristics may not be stable.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 An electronic device manufacturing method according to this application example is an electronic device that joins the base and the lid while forming an internal space in which an electronic component is stored between the base and the lid. In the manufacturing method, the lid is provided with a groove on a surface to be joined to the base, and the groove is positioned in the vicinity of the recess provided on the side surface of the base. It has the joining process which joins the said cover body and the said base, and the sealing process which plugs up the said groove | channel by energy beam welding, It is characterized by the above-mentioned.

According to such a method for manufacturing an electronic device, the lid and the base are joined so that the internal space and the outside are in communication with each other through the groove provided in the lid. As described above, the groove that communicates the internal space with the outside can easily reduce the internal space to a reduced pressure or inert gas atmosphere. And the internal space which became pressure reduction or the inert gas atmosphere can be sealed by plugging the groove | channel of a communication part by energy beam welding. Thereby, the sealing after removing the gas generated at the time of joining the lid from the inside of the package becomes possible, and a high-quality hermetic sealing can be realized.
Furthermore, since the lid and the base are joined so that the groove is located in the vicinity of the recess provided on the side surface of the base, the energy rays irradiated to close the communicating portion are coupled with the lid of the communicating portion. The recess is irradiated and the base is not directly irradiated. As a result, it is possible to prevent the occurrence of damage to the base (for example, melting, microcracks, etc.) due to the irradiation with energy rays.
Further, since the conventional through-hole and sealing material are not required, the manufacturing process is simplified and the package can be reduced in size.

  Application Example 2 In the electronic device manufacturing method according to the application example described above, the concave portion is a surface of the base opposite to the bonding surface from a bonding surface that is a surface to which the lid body is bonded. It is preferable that the cover body and the base are joined so that the groove is positioned in the vicinity of the opening on the joining surface side of the recess.

  In this way, the recesses are provided from the bonding surface, which is the surface on the side where the lid of the base is bonded, to the base surface, which is the surface opposite to the bonding surface, thereby irradiating the energy beam to the base. Can be prevented more reliably.

  Application Example 3 In the electronic device manufacturing method according to the application example described above, a bonding material is provided between the base and the lid, and in the bonding step, at least a part of the concave portion is seen in a plan view. It is preferable that the base and the lid are bonded by the bonding material so that the bonding material overlaps.

  In this way, the base and the lid are joined so that the joining material overlaps at least a part of the recess in plan view, so that the joining material serves as a protective material for energy rays, and irradiation of the energy rays to the base is more reliably performed. Can be prevented.

  Application Example 4 In the method of manufacturing an electronic device according to the application example, the joining step includes the base so that at least a part of the groove is positioned between the internal space and the recess in a plan view. It is preferable to join the lid.

  In this way, in the direction along the linear side portion in which the groove is provided in the outer periphery of the lid, at least a part of the position where the opening in the outer periphery of the groove exists in the lid has a recess. Since the lid body and the base are joined so as to overlap with the position to be applied, the energy rays irradiated to close the communicating portion are irradiated to the communicating portion and the concave portion of the lid body and are not directly irradiated to the base. As a result, it is possible to prevent the occurrence of damage to the base (for example, melting, microcracks, etc.) due to the irradiation with energy rays.

  Application Example 5 An electronic device according to this application example includes an internal space in which an electronic component is stored between a base and a lid, and the base and the lid are joined to each other. In the lid body, a groove on a surface to be joined with the bonding material is closed by a melted portion in which a part of the lid body is melted, and the melted portion is provided on a side surface of the base. It is located in the vicinity of the recessed part.

According to such an electronic device, the lid and the base are joined so that the internal space and the outside are in communication with each other through the groove provided in the lid. As described above, the groove that communicates the internal space with the outside can easily reduce the internal space to a reduced pressure or inert gas atmosphere. Then, by irradiating the communication portion with an energy ray and closing the communication portion with a melted portion, the internal space in a reduced pressure or inert gas atmosphere can be sealed. As a result, it is possible to perform sealing after removing the gas generated at the time of joining the lid from the package, thereby preventing the influence of the internal gas and realizing an electronic device in which the hermetic sealing is reliably performed. .
Further, since the lid body and the base are joined so that the melted portion is located in the vicinity of the concave portion provided on the side surface of the base, the energy rays irradiated to close the communicating portion are connected to the lid body. The part and the concave part are irradiated, and the base is not directly irradiated. As a result, it is possible to prevent the occurrence of damage to the base (for example, melting, microcracks, etc.) due to the irradiation with energy rays.
In addition, since a conventional through hole and sealing material are not required, the manufacturing process is simplified and the electronic device can be miniaturized.

  Application Example 6 In the electronic device according to the application example described above, the concave portion extends from a bonding surface, which is a surface of the base, to which the bonding material is bonded, to a base surface, which is a surface opposite to the bonding surface. It is preferable to be provided.

  As described above, the recesses are provided from the bonding surface, which is the surface on the side where the bonding material of the base is bonded, to the base surface, which is the surface on the opposite side of the bonding surface, so Can be prevented more reliably.

  Application Example 7 In the electronic device according to the application example described above, a bonding material is provided between the base and the lid, and the bonding material overlaps at least a part of the concave portion in plan view. The base and the lid are preferably joined by the joining material.

  In this way, since the base and the lid are bonded so that the bonding material overlaps at least a part of the concave portion in plan view, the bonding material serves as an energy ray protection material, and the energy beam base is irradiated. It can prevent more reliably.

  Application Example 8 In the electronic device according to the application example described above, it is preferable that the melting portion is located between the internal space and the concave portion in plan view.

  Thus, in the direction along the linear side part provided with the groove in the outer periphery of the lid body, the lid is arranged such that at least a part of the position where the melted part exists overlaps the position where the recessed part exists. Since the body and the base are joined, the energy rays irradiated to close the communication portion are irradiated to the communication portion and the concave portion of the lid, and are not directly irradiated to the base. As a result, it is possible to prevent the occurrence of damage to the base (for example, melting, microcracks, etc.) due to the irradiation with energy rays.

  Application Example 9 The electronic apparatus described in this application example includes the electronic device described in the application example.

  According to such an electronic device, the reliability can be improved.

  Application Example 10 A moving object described in this application example includes the electronic device described in the application example.

  According to such a moving body, the reliability can be improved.

1 is a perspective view showing an outline of a vibrator as a first embodiment of an electronic device. It is the schematic which shows the vibrator | oscillator as 1st Embodiment of an electronic device, (a) is a top view, (b) is a front sectional view. The top view which shows the gyro element as an electronic component used for an electronic device. An example of the lid (lid) used for an electronic device is shown, (a) is a top view, (b) is a front sectional view, (c) is a QQ sectional view of (a). (A)-(d) is a front sectional view which shows the outline of the manufacturing process of the vibrator | oscillator as an electronic device. It is a figure which shows a sealing process, (a) is a top view which shows the correlation with a groove | channel and an energy beam, (b) is a front view of (a), (c) is a top view of a sealing part, (d) FIG. 3 is a front sectional view of (c). The perspective view which shows the modification of a recessed part. It is the schematic which shows the other structure of the vibrator | oscillator as 1st Embodiment, (a) is a top view (part), (b) is front sectional drawing (part). The front view which shows the modification of the opening shape of a groove | channel. The perspective view for demonstrating the other arrangement example of a recessed part and a groove | channel. The front sectional view showing the outline of the gyro sensor as a second embodiment of the electronic device. The perspective view which shows the structure of the mobile type personal computer as an example of an electronic device. The perspective view which shows the structure of the mobile telephone as an example of an electronic device. The perspective view which shows the structure of the digital still camera as an example of an electronic device. The perspective view which shows the structure of the motor vehicle as an example of a mobile body.

  Hereinafter, an electronic device manufacturing method of the present invention will be described in detail with reference to the accompanying drawings.

[First Embodiment of Electronic Device]
First, an embodiment of a vibrator will be described as a first embodiment of an electronic device manufactured by applying an electronic device manufacturing method according to the present invention.

  FIG. 1 is a schematic perspective view showing a vibrator as a first embodiment of an electronic device according to the invention. 2A and 2B schematically show a vibrator as a first embodiment of an electronic device according to the present invention, wherein FIG. 2A is a plan view and FIG. 2B is a front sectional view. FIG. 3 is a plan view showing a gyro element as an electronic component included in the vibrator shown in FIG. In the following, as shown in FIG. 2, the three axes orthogonal to each other are defined as an x-axis, a y-axis, and a z-axis, and the z-axis coincides with the thickness direction of the vibrator. A direction parallel to the x-axis is referred to as an “x-axis direction (second direction)”, a direction parallel to the y-axis is referred to as a “y-axis direction (first direction)”, and a direction parallel to the z-axis is “ z-axis direction ".

  A vibrator 1 as an example of the electronic device shown in FIGS. 1 and 2 includes a gyro element (vibration element) 2 as an electronic component, and a package 9 that houses the gyro element 2. Hereinafter, the gyro element 2 and the package 9 will be sequentially described in detail. 1 includes a base 91, a seam ring 93 as a bonding material, and a lid 92 as a lid. In the figure, a groove 94 provided in the lid 92 is shown, but a state in which sealing (sealing step) described later is not performed is shown.

(Gyro element)
FIG. 3 is a plan view of the gyro element viewed from the upper side (the lid 92 side described later and the z-axis direction in FIG. 2). The gyro element includes a detection signal electrode, a detection signal wiring, a detection signal terminal, a detection ground electrode, a detection ground wiring, a detection ground terminal, a drive signal electrode, a drive signal wiring, a drive signal terminal, a drive ground electrode, and a drive ground wiring. In addition, a driving ground terminal and the like are provided, but are omitted in the figure.

  The gyro element 2 is an “out-of-plane detection type” sensor that detects an angular velocity around the z-axis. Although not shown, the gyro element 2 includes a base material and a plurality of electrodes, wires, and terminals provided on the surface of the base material. It consists of The gyro element 2 can be made of a piezoelectric material such as quartz, lithium tantalate, or lithium niobate. Among these, it is preferable that the gyro element 2 is made of quartz. Thereby, the gyro element 2 which can exhibit the outstanding vibration characteristic (frequency characteristic) is obtained.

  Such a gyro element 2 includes a so-called double T-shaped vibrating body 4, a first supporting portion 51 and a second supporting portion 52 as supporting portions for supporting the vibrating body 4, the vibrating body 4, the first and first 2 It has the 1st beam 61, the 2nd beam 62, the 3rd beam 63, and the 4th beam 64 as a beam which connects the support parts 51 and 52.

  The vibrating body 4 has an extension in the xy plane and has a thickness in the z-axis direction. Such a vibrating body 4 includes a base 41 located at the center, a first detection vibrating arm 421 and a second detection vibrating arm 422 extending from the base 41 to both sides along the y-axis direction, and an x from the base 41. A first connecting arm 431 and a second connecting arm 432 that extend to both sides along the axial direction, and a vibrating arm that extends from the tip of the first connecting arm 431 to both sides along the y-axis direction. A first driving vibrating arm 441, a second driving vibrating arm 442, a third driving vibrating arm 443 as a vibrating arm extending from the tip of the second connecting arm 432 to both sides along the y-axis direction, and a fourth driving arm 443; And a drive vibrating arm 444. The distal ends of the first and second detection vibrating arms 421 and 422 and the first, second, third, and fourth driving vibrating arms 441, 442, 443, and 444 are substantially larger in width than the base end side, respectively. Weight portions (hammer heads) 425, 426, 445, 446, 447, and 448 as rectangular wide portions are provided. By providing such weight parts 425, 426, 445, 446, 447, 448, the sensitivity of detecting the angular velocity of the gyro element 2 is improved.

  Further, the first and second support portions 51 and 52 respectively extend along the x-axis direction, and the vibrating body 4 is located between the first and second support portions 51 and 52. . In other words, the first and second support portions 51 and 52 are disposed so as to face each other along the y-axis direction with the vibrating body 4 interposed therebetween. The first support 51 is connected to the base 41 via the first beam 61 and the second beam 62, and the second support 52 is connected to the base 41 via the third beam 63 and the fourth beam 64. It is connected with.

  The first beam 61 passes between the first detection vibrating arm 421 and the first drive vibrating arm 441 to connect the first support portion 51 and the base 41, and the second beam 62 is connected to the first detection vibrating arm 421. The first support part 51 and the base part 41 are connected to each other through the third drive vibration arm 443, and the third beam 63 passes between the second detection vibration arm 422 and the second drive vibration arm 442. The second support portion 52 and the base portion 41 are connected, and the fourth beam 64 connects the second support portion 52 and the base portion 41 through the space between the second detection vibration arm 422 and the fourth drive vibration arm 444.

  Each beam 61, 62, 63, 64 is formed in an elongated shape having a meandering portion extending along the y-axis direction while reciprocating along the x-axis direction, and therefore has elasticity in all directions. Yes. Therefore, even if an impact is applied from the outside, each beam 61, 62, 63, 64 has an action of absorbing the impact, so that detection noise caused by this can be reduced or suppressed.

  The gyro element 2 having such a configuration detects the angular velocity ω around the z-axis as follows. When an electric field is generated between the drive signal electrode (not shown) and the drive ground electrode (not shown) in a state where the angular velocity ω is not applied, the gyro element 2 causes the drive vibrating arms 441, 442, 443, 444 to Bending vibration is performed in the x-axis direction. At this time, the first and second drive vibrating arms 441 and 442 and the third and fourth drive vibrating arms 443 and 444 perform plane-symmetric vibration with respect to the yz plane passing through the center point (center of gravity). The base 41, the first and second connecting arms 431 and 432, and the first and second detection vibrating arms 421 and 422 hardly vibrate.

  When an angular velocity ω is applied to the gyro element 2 around the z-axis in the state where the drive vibration is performed, the Coriolis force in the y-axis direction is applied to the drive vibration arms 441, 442, 443, 444 and the connection arms 431, 432. In response to this vibration in the y-axis direction, the detected vibration in the x-axis direction is excited. Then, the detection signal electrode (not shown) and the detection ground electrode (not shown) detect the distortion of the detection vibrating arms 421 and 422 generated by this vibration, and the angular velocity ω is obtained.

(package)
The package 9 stores the gyro element 2. The package 9 may contain an IC chip or the like for driving the gyro element 2 in addition to the gyro element 2 as in an electronic device described later. Such a package 9 has a substantially rectangular shape in plan view (xy plan view).

  As shown in FIGS. 1 and 2, the package 9 includes a base 91 having a recess opened on the upper surface and a lid joined to the base via a seam ring 93 as a joining material so as to close the opening of the recess. And a lid 92 as a body. The base 91 has a plate-like bottom plate 911 and a frame-like side wall 912 provided on the peripheral edge of the upper surface of the bottom plate 911. The frame-shaped side wall 912 is provided in a substantially rectangular circumferential shape. In other words, the opening shape opened on the upper surface of the recess is substantially rectangular. A recess surrounded by the plate-like bottom plate 911 and the frame-like side wall 912 becomes an internal space (storage space) 14 for storing the gyro element 2 as an electronic component. On the upper surface of the frame-shaped side wall 912, a seam ring 93 made of an alloy such as Kovar is provided. The seam ring 93 has a function as a bonding material between the lid 92 and the side wall 912, and is provided in a frame shape (substantially rectangular circumferential shape) along the upper surface of the side wall 912.

  The lid 92 has a substantially rectangular outer shape, and a bottomed groove 94 is provided on the back surface 92b from the outer periphery toward the center. The configuration of the lid 92 will be described in detail later. The groove 94 is arranged so that the groove 94 covers the internal space 14 when the lid 92 is placed on the seam ring 93. In the side wall 912, a recess 89 is provided at a position facing the groove 94 of the lid 92 placed on the seam ring 93. The concave portion 89 has a concave shape that is recessed inward from the outer surface of the side wall 912. An inner wall surface 89a (the x-axis direction in the drawing) that is the bottom surface of the recess 89 viewed from the outer surface direction of the side wall 912 is formed with a depth that substantially overlaps the outer edge of the lid 92 that is placed. Further, the bottom surface 89 b (in the z-axis direction in the drawing) of the recess 89 viewed from the lid 92 side is formed with a depth similar to the thickness of the side wall 912.

  Such a package 9 has an internal space 14 inside thereof, and the gyro element 2 is housed and installed in the internal space 14 in an airtight manner. In the internal space 14 in which the gyro element 2 is accommodated, after the exhaust (deaeration) is performed from the groove 94, the lid 92 remaining in the communication portion where the groove 94 is formed is replaced with an energy ray (for example, , A sealing portion 95 as a melting portion solidified after being melted by a laser beam, that is, a sealing portion 95 by energy beam welding. The sealing portion 95 as a melting portion is formed by melting and solidifying the outer end of the groove 94, that is, the portion including the outer peripheral surface 92 c (see FIG. 4) of the lid 92.

  The constituent material of the base 91 is not particularly limited, but various ceramics such as aluminum oxide can be used. The constituent material of the lid 92 is not particularly limited, but may be a member whose linear expansion coefficient approximates that of the constituent material of the base 91. For example, when the constituent material of the base 91 is ceramic as described above, an alloy such as Kovar is preferable.

  The gyro element 2 has conductive properties such as solder, silver paste, and conductive adhesive (adhesive in which conductive fillers such as metal particles are dispersed in a resin material) at the first and second support portions 51 and 52. It is fixed to the upper surface of the bottom plate 911 via a fixing member 8. Since the first and second support portions 51 and 52 are located at both ends of the gyro element 2 in the y-axis direction, the vibrating body 4 of the gyro element 2 can be held at both ends by fixing such portions to the bottom plate 911. The gyro element 2 is supported and can be stably fixed to the bottom plate 911. Therefore, unnecessary vibration (vibration other than detection vibration) of the gyro element 2 is suppressed, and the detection accuracy of the angular velocity ω by the gyro element 2 is improved.

  The conductive fixing member 8 corresponds to two detection signal terminals 714, two detection ground terminals 724, a drive signal terminal 734, and a drive ground terminal 744 provided in the first and second support portions 51 and 52 ( 6) in contact with each other and spaced apart from each other. Further, six connection pads 10 corresponding to the two detection signal terminals 714, the two detection ground terminals 724, the drive signal terminal 734, and the drive ground terminal 744 are provided on the upper surface of the bottom plate 911, and a conductive fixing member is provided. These connection pads 10 and any one of the corresponding terminals are electrically connected via 8.

(Lid as lid)
Here, the lid 92 as a lid will be described with reference to FIG. FIG. 4 shows an example of a lid as a lid according to the present invention, in which (a) is a plan view, (b) is a front sectional view, and (c) is a QQ sectional view of (a).

  The lid 92 serving as a lid closes the opening of the recess opening on the upper surface of the package 9 and is joined around the opening of the recess using, for example, a seam welding method. More specifically, the lid 92 is a plate-like member having a front surface 92a and a back surface 92b that are in a front-back relationship, and an outer peripheral surface 92c that connects the front surface 92a and the back surface 92b. Since the lid 92 of this example is plate-shaped, it is easy to form and the shape is also stable. In particular, a groove 94 described later is an extremely small groove, but this formation can be easily performed. The lid 92 of this example uses a Kovar plate material. By using a Kovar plate for the lid 92, when sealing, the seam ring 93 and the lid 92 formed of Kovar are melted in the same molten state, and further easily alloyed so that sealing is easy. And reliably. The lid 92 may be made of a plate material of other materials instead of Kovar. For example, a metal material such as 42 alloy or stainless steel, or the same material as the side wall 912 of the package 9 can be used.

  When the lid 92 is viewed in plan from the front surface 92a side, a bottomed groove 94 extending from one side of the outer peripheral surface 92c toward the central portion of the lid 92 is provided on the back surface 92b side. The groove 94 is provided with a wedge shape (for example, a triangle having two vertices on the back surface 92b side) as viewed from the outer peripheral surface 92c side, and is positioned at the approximate center of one side portion in plan view. Yes. The groove 94 is provided from the outer peripheral surface 92c of the lid 92 toward the center so as to have a portion that overlaps with the opening of the concave portion that opens on the upper surface of the package 9 so as to close the opening. It has been. In other words, the groove 94 has one end 94 a that opens to the outer peripheral surface 92 c and the other end 94 b on the center side, and the other end 94 b on the center side is the upper surface of the bottom plate 911 that constitutes the base 91. It is provided so as to reach the inner side (center side in the plan view of the package) than the inner wall of the frame-shaped side wall 912 provided at the peripheral edge. Thus, by providing the groove 94, it is possible to exhaust air from the internal space 14 of the package 9. Further, since the groove 94 is provided with the other end 94b on the center side of the lid 92, the exhaust can be performed in one direction. That is, sealing can be performed by performing welding at one place (welding for closing) in one groove.

  In the present embodiment, an example in which the groove 94 is positioned at the approximate center of one side that is a long side in a plan view has been described, but the present invention is not limited to this, and the groove 94 is provided in any one of at least one side. What is necessary is just to be provided. Moreover, the groove | channel 94 may be provided in one side part which becomes a short side by planar view. By providing the groove 94 on the short side in plan view, the following effects can be obtained. In the package 9, the deformation in the thickness direction (z-axis direction) is likely to be larger in the long side direction than in the short side direction. For this reason, the lid 92 joined to the package 9 has a larger residual stress in the long side direction than in the short side direction. If the groove 94 is sealed (described later) with a large residual stress, the residual stress is applied to the sealed portion and the sealing reliability may be impaired. Therefore, the groove 94 is formed on the short side having a relatively small residual stress. By providing, it becomes possible to reduce the influence of the residual stress on the sealed portion.

  The width of the groove 94 is not particularly limited, but is preferably about 1 μm or more and 200 μm or less. The depth of the groove 94 is not particularly limited, but is preferably about 5 μm or more and 30 μm or less.

  Further, seam welding may be performed after a metal layer (not shown) that can be melted by seam welding is formed on each of the base 91 and the lid 92 at the joint portion between the base 91 and the lid 92. In this case, the depth of the groove 94 is preferably larger than the sum of the thicknesses of the two metal layers (the metal layer provided on the base 91 and the metal layer provided on the lid 92). Thereby, in the joining process mentioned later, the lid 92 and the base 91 can be firmly joined by seam welding without closing the groove 94 formed on the joint surface of the lid 92 with the base 91.

  Then, after the recess (internal space 14) is exhausted from the gap between the package 9 and the lid 92 formed by the groove 94, the lid 92 and / or the seam ring 93 at the communication portion where the groove 94 is provided. Is melted with an energy beam such as a laser beam. In this way, the groove 94 is closed by the sealing portion 95 as a melting portion formed by the melted lid 92 and / or the seam ring 93, and the internal space 14 is hermetically sealed.

  In this embodiment, an example in which one groove 94 is provided in the lid 92 has been described. However, the number and arrangement of the grooves are not limited to this, and a plurality of grooves may be provided. The structure provided in the surface 92a of 92 and the back surface 92b may be sufficient.

  Moreover, the cross-sectional shape of the wall surface of the groove | channel 94 shown in FIG.4 (c) will not ask | require the shape, if it has a function as an exhaust hole, such as rectangular shape, curved shape, and semicircle shape (arc shape).

(Manufacturing method of vibrator)
Next, a method for manufacturing a vibrator as an electronic device according to the present invention will be described with reference to FIGS. FIG. 5A to FIG. 5D are front sectional views showing an outline of a manufacturing process of the vibrator as the electronic device shown in FIG. 1 and FIG. 6A and 6B are diagrams showing a sealing process, in which FIG. 6A is a plan view showing the correlation between the groove and the energy beam (laser light), and FIG. 6B is a front sectional view of FIG. 6A. 6 (c) is a plan view of the sealing portion, and FIG. 6 (d) is a front sectional view of FIG. 6 (c).

  First, a process of housing the gyro element 2 as an electronic component in the internal space 14 of the base 91 will be described. As shown in FIG. 5 (a), it has a plate-like bottom plate 911 and a frame-like side wall 912 provided on the peripheral edge of the upper surface of the bottom plate 911, and is surrounded by the bottom plate 911 and the inner wall of the side wall 912. A base 91 having a concave internal space 14 opened on the upper surface is prepared. In the base 91, a seam ring 93 is formed on the upper surface of the frame-shaped side wall 912, and the connection pad 10 is formed on the upper surface of the bottom plate 911. The side wall 912 is provided with a recess 89 dug from the side surface on the side surface that is the outer side (outer side) when viewed from the internal space 14, with a length substantially equal to the thickness of the side wall 912 from the upper surface of the side wall 912. ing. Further, the gyro element 2 described above is prepared. Then, the connection pad 10 and the gyro element 2 are electrically connected and fixed. For this connection, a conductive fixing member 8 such as solder, silver paste, or conductive adhesive (adhesive in which conductive fillers such as metal particles are dispersed in a resin material) can be used. At this time, the gyro element 2 has a gap with the upper surface of the bottom plate 911 depending on the thickness of the conductive fixing member 8.

  Next, a process of placing the lid 92 as a lid in the internal space 14 will be described. As shown in FIG. 5B, the lid 92 as the lid body described above is placed on the seam ring 93 in order to keep the gyro element 2 housed in the internal space 14 airtight. A groove 94 is provided on the back surface 92 b of the lid 92. The lid 92 is located in the vicinity of the concave portion 89 provided on the side wall 912, more specifically, the concave portion 89 is positioned on an extended line toward the outside of the groove 94 in a plan view (when viewed from the lid 92 side). Arrange. More specifically, the lid 92 is disposed so that at least a part of the groove 94 of the lid 92 is located between the internal space 14 and the recess 89 in plan view. More specifically, the lid 92 is disposed so that one end 94a opened to the outer peripheral surface 92c of the groove 94 of the lid 92 is located between the internal space 14 and the recess 89 in a plan view. Further, when the lid 92 is placed on the seam ring 93, the groove 94 extends so as to cover the internal space 14. That is, a local gap is formed between the lid 92 after the step of placing the lid 92 and the seam ring 93 as a communicating portion that communicates the interior space 14 and the outside of the base 91 by the groove 94.

  Next, a joining process for joining the lid 92 to the base 91 by the seam ring 93 will be described. As shown in FIG. 5C, seam welding is performed by using a roller electrode 97 of a seam welder on the frame-shaped side wall 912 where the lid 92 and the seam ring 93 face each other in a rectangular shape. And the seam ring 93 are joined. That is, the lid 92 is joined to the base 91. The roller electrode 97 is brought into pressure contact with the lid 92 from the side opposite to the base 91 by a pressure mechanism (not shown). The roller electrode 97 travels at a predetermined speed along the outer periphery in the plan view of the lid 92 while rotating around the axis. At this time, by passing an electric current between the roller electrode 97 through the lid 92 and the seam ring 93, the seam ring 93 or the joining metal is melted by Joule heat, and the lid 92 and the seam ring 93 are joined.

  At this time, the lid 92 in the portion where the groove 94 is provided is not welded because the lid 92 and the seam ring 93 are not in contact with each other by the groove 94 and is in an unwelded state. In other words, since the inner surface of the groove 94 is not in contact with the seam ring 93, seam welding is not performed. In other words, in the joining step, the part excluding the part corresponding to the groove 94 in the part to be joined between the base 91 and the lid 92 is joined by seam welding. Since the groove 94 communicates the internal space 14 and the outside of the base 91, this unwelded space functions as an exhaust hole in the next sealing step.

  Next, a process of exhausting from the internal space 14 using the groove 94 (exhaust hole) will be described. In the present embodiment, as shown in FIG. 5 (d), the groove 94 that is not welded during the seam welding described above is extended as a communicating portion that reaches the internal space 14. Accordingly, the gas in the internal space 14 can be exhausted as indicated by the arrow shown in FIG. In the present embodiment, the example in which the gas in the internal space 14 is exhausted, that is, sealed under a reduced pressure has been described. However, the present invention is not limited to the reduced pressure, but in an inert gas atmosphere in which an inert gas or the like is introduced after the exhaust. It is also possible to seal with.

  Next, a sealing process for hermetically sealing the internal space 14 after exhausting will be described with reference to FIGS. 6 (a) to 6 (d). As shown in FIGS. 6A and 6B, in the state where the exhaust of the internal space 14 is completed, energy rays (for example, laser light) are applied to a portion (communication portion) corresponding to the groove 94 used as the exhaust hole. , Electron beam). In this embodiment, the laser beam 98 is irradiated as an energy beam, and the remaining metal (Kovar) is melted. At this time, the laser beam 98 is irradiated with the laser beam 98 arranged so as to include the outer end of the groove 94, that is, one end 94 a of the groove 94 including the outer peripheral surface 92 c of the lid 92 in the spot of the laser beam 98. Then, as shown in FIGS. 6C and 6D, the groove upper portion 92d on the surface 92a side of the lid 92 in the portion provided with the groove 94 is melted and melted by the thermal energy by the irradiation of the laser beam 98. The metal flows on the seam ring 93 while filling the groove 94. When the irradiation of the laser beam 98 is stopped when the molten metal sufficiently flows, the molten metal is solidified, and the solidified molten metal becomes a sealing portion (melting portion) 95 to seal the groove 94 in an airtight manner. Stop (close). As a result, the sealing portion (melting portion) 95 of the lid 92 is located between the internal space 14 and the concave portion 89 in plan view.

  As described above, the laser beam 98 is arranged and irradiated so as to include the outer end of the groove 94 in the spot, that is, the end portion of the groove 94 including the outer peripheral surface 92c of the lid 92. When the lid groove upper portion 92d including the end portion 94 is melted, the fluidity of the molten metal is improved. Thus, the groove | channel 94 can be sealed reliably by the fluidity | liquidity of a molten metal improving.

  At this time, since the lid 92 is disposed so that the concave portion 89 is located on the extended line toward the outside of the groove 94 in a plan view (when viewed from the lid 92 side), the lid 92 extends from the lid 92 to the concave portion 89. A laser beam 98 is emitted to the outside. That is, the laser beam 98 is not directly applied to the upper surface 912a of the side wall 912 by providing the recess 89. Thereby, damage to the base (side wall 912) due to irradiation with the laser beam 98 (for example, melting of the side wall 912, occurrence of micro cracks generated on the side wall 912) can be prevented.

  By using the method for manufacturing the vibrator 1 as an electronic device having such a process, the influence of the laser beam 98 on the side wall 912 constituting the base 91 is prevented, and the fluidity of the molten metal by the laser beam 98 is increased. Therefore, it is possible to reliably form the sealing portion 95 as the molten portion. Therefore, the groove 94 can be surely sealed, and the vibrator 1 as an electronic device with improved airtight reliability can be manufactured. Further, since the groove 94 becomes an exhaust hole as it is, it is not necessary to manage the dimensions of an unjoined portion (exhaust hole) used for exhaust as in the prior art, and stable exhaust and joining (sealing) can be achieved. Therefore, even when the vibrator 1 is heated at a high temperature after bonding (sealing), the generated gas can be suppressed. In addition, stable exhaust and bonding (sealing) can prevent characteristic deterioration of the gyro element 2 as an electronic component housed in the package 9 due to the influence of residual gas and the like. The vibrator 1 as a device can be provided.

  In the above description, an example in which one exhaust hole (groove 94) is used has been described, but a plurality of exhaust holes may be provided. As described above, when a plurality of exhaust holes are used, the exhaust speed is increased, but a plurality of sealing portions are required.

(Modification of joining process and joining structure)
In the above-described first embodiment, a seam ring 93 that is a ring-shaped metal frame is used as a joining material for joining the base 91 and the lid 92, and a joining method in which seam welding is performed by the roller electrode 97 of the seam welding machine has been described. However, other joining methods can be applied. That is, as another joining method, a brazing material such as a silver brazing material is disposed as a joining material on the upper surface of the frame-like side wall 912 of the base 91 or the surface of the lid 92, and the brazing material is transferred by the roller electrode 97 of the seam welding machine. A joining method (so-called direct seam method) in which the lid 92 and the base 91 are joined with a molten metal brazing material can be applied. In that case, the metal brazing material may be melted by an energy beam such as a laser or an electron beam. As another joining method, instead of joining the lid 92 and the base 91 via the joining material, a part of the lid is melted, and the lid 92 and the base 91 are directly connected by the melted lid member. A joining method for joining can be applied. According to these joining methods, since the seam ring 93 is unnecessary, the electronic device can be reduced in size and cost.

(Modification of groove arrangement in joining process)
In the first embodiment described above, as shown in FIG. 6A, when the lid 92 is placed on the seam ring 93 and joined to the base 91, the groove 94 extends from the outer peripheral surface 92 c of the lid 92. By extending so as to cover the internal space 14, a communication portion that connects the internal space 14 and the outside of the base 91 is formed by the groove 94. However, the groove 94 extends to the internal space 14. It does not have to be. That is, the groove 94 may not be overlapped with the internal space 14 in a plan view and may exist in a region between the inner periphery of the seam ring 93 and the outer periphery of the lid 92. In this case, the groove 94 does not communicate with the internal space 14. However, the area adjacent to the groove 94 and adjacent to the inner space 14 in a plan view on the surface (back surface 92b) on the side where the groove 94 of the lid 92 is provided is not welded to the seam ring 93. Thus, a region that overlaps the seam ring excluding the non-weld region is welded by a seam welder, so that the above-described removal is performed through a slight gap between the non-weld region of the lid 92 and the seam ring 93. I can do it.

(Modified example of recess)
Next, a modified example of the recess will be described with reference to FIG. FIG. 7 is a perspective view showing a modified example of the recess. Since the present modification is the same as the first embodiment except that the configuration of the recesses is different, in the following description, the same components are denoted by the same reference numerals, the description thereof is omitted, and different configurations are provided. Will be described.

  7 includes a base 91, a seam ring 93 as a bonding material, and a lid 92 as a lid. In the same figure, although the groove | channel 94 provided in the lid 92 is shown, the state which is not sealed is shown.

  The recess 89c extends from the upper surface 912a of the side wall 912 (see FIG. 6), which is a surface to which the lid 92 is bonded, to the base surface 911a of the bottom plate, which is the surface opposite to the upper surface 912a. It is provided through. In other words, the concave portion 89c is provided in a concave shape opening on three surfaces of the outer peripheral surface of the base 91, the upper surface 912a, and the base surface 911a.

  By providing the concave portion 89c having such a configuration, the length of the concave portion 89c in the laser light irradiation direction is long and penetrates, so that irradiation of the laser beam as an energy beam in the sealing process described above to the base is performed. Can be prevented more reliably.

(Other configurations of vibrator)
Next, another configuration of the vibrator according to the first embodiment will be described with reference to FIG. FIG. 8 is a schematic diagram illustrating another configuration of the vibrator according to the first embodiment. FIG. 8A is a partial plan view showing a part of the structure of the vibrator, and FIG. It is sectional drawing. In the following description, the same components as those in the first embodiment may be denoted by the same reference numerals and description thereof may be omitted.

  8A and 8B, the vibrator is bonded to the base (side wall 912) via a seam ring 93 as a bonding material so as to close the opening of the internal space (storage space) 14. And a lid 92 as a lid. On the upper surface of the frame-shaped side wall 912, a seam ring 93 made of an alloy such as Kovar is provided. The seam ring 93 has a function as a bonding material between the lid 92 and the side wall 912, and is provided in a frame shape (substantially rectangular circumferential shape) along the upper surface of the side wall 912. Further, the seam ring 93 is provided so that the seam ring 93 overlaps a part of a later-described recess 89 in a plan view as viewed from the lid 92 side.

  The lid 92 has a substantially rectangular outer shape, and a bottomed groove 94 is provided on the back surface 92b from the outer periphery toward the center. Note that the configuration of the lid 92 is the same as that of the above-described embodiment, and thus the description thereof is omitted. The groove 94 is arranged so that the groove 94 covers the internal space 14 when the lid 92 is placed on the seam ring 93. In the side wall 912, a recess 89 is provided at a position overlapping the extension line of the groove 94 of the lid 92 placed on the seam ring 93 to the outside. The concave portion 89 has a concave shape that is recessed inward from the outer surface of the side wall 912.

  In the vibrator of this configuration, in a state where the exhaust of the internal space 14 is finished, the laser beam 98 is irradiated to the portion (communication portion) corresponding to the groove 94 used as the exhaust hole, and the remaining portion of the metal (Kovar) ) Is melted. At this time, the laser beam 98 is irradiated with the laser beam 98 arranged so as to include the outer end of the groove 94, that is, one end 94 a of the groove 94 including the outer peripheral surface 92 c of the lid 92 in the spot of the laser beam 98. Although not shown, the groove upper portion 92d on the surface 92a side of the lid 92 in the portion where the groove 94 is provided melts due to the thermal energy of the laser beam 98, and the seam ring 93 fills the groove 94 while the molten metal fills the groove 94. Flow up. When the irradiation of the laser beam 98 is stopped when the molten metal flows, the molten metal is solidified, and the solidified molten metal becomes a sealing portion (melting portion) (not shown) so that the groove 94 is hermetically sealed. (Closed).

  In the vibrator of this configuration, a concave portion 89 is provided in the vicinity of the position where the laser beam 98 is irradiated, and so as to overlap the concave portion 89 in a plan view, in other words, so as to overhang the concave portion 89. A seam ring 93 is provided. As a result, the laser beam 98 applied to the outside of the lid 92 is applied to the recess 89 and the seam ring 93. That is, by providing the recess 89 and the seam ring 93 projecting from the recess 89, the laser beam 98 is not directly irradiated onto the upper surface 912 a of the side wall 912. Thereby, damage to the base (side wall 912) due to irradiation with the laser beam 98 (for example, melting of the side wall 912, occurrence of micro cracks generated on the side wall 912) can be prevented.

(Modification example of groove)
Here, the opening shape of the groove 94 provided in the lid 92 will be described with reference to FIG. FIG. 9 is a front view showing a modification of the opening shape of the groove. In the embodiment described above, the opening shape of the groove 94 provided in the lid 92 has been described as a wedge shape (for example, a triangle having two vertices on the back surface 92b side) as shown in FIG. The opening shape of the groove 94 is more preferably a wedge shape, and the moldability with a molding tool (for example, a molding die) when the groove 94 is formed can be improved. That is, since the tip of the forming tool is tapered, the forming tool can be easily pressed. The opening shape of the groove 94 may be another tapered shape. For example, as shown in FIG. 9B, a wedge-shaped tip 94f having a circular arc shape, or a wedge-shaped tip 94h as shown in FIG. 9C is narrow. It may be a so-called trapezoidal groove 94g formed by a straight portion. In the grooves 94e and 94g having such a shape, the same effect as the groove 94 can be obtained.

(Other arrangement examples of recesses and grooves)
Here, with reference to FIG. 10, another arrangement example of the recesses and the grooves will be described. FIG. 10 is a perspective view for explaining another arrangement example of the recesses and the grooves.

  As shown in FIG. 10, the recess 89 d and the groove 94 c according to this arrangement example are provided in the vicinity of one end of one side of the base 91 and the lid 92 constituting the package 9. Details will be described below.

  When the base 91 is joined to the lid 92 and seam welding via the seam ring 93, the seam welding roller moves along the edge of each side as indicated by the trajectories S1, S2, S3, and S4. In this way, the seam welding roller moves. Therefore, at the four corners, the seam welding roller passes twice. Therefore, if the groove 94c is provided in the regions R1, R2, R3, and R4 through which the seam welding roller passes twice, the seam welding is performed twice, and the groove 94c is easily blocked.

  In addition, the deformation in the thickness direction is likely to be larger in the vicinity of the central portion of each side of the base 91 and the lid 92 than in the vicinity of the end portion. For this reason, there is a large residual stress in the vicinity of the center of each side of the lid 92 joined to the package 9 as compared with the vicinity of the end. If the groove 94c is sealed by melting with a large residual stress, residual stress may be applied to the sealed portion and the sealing reliability may be impaired. In order to avoid this, it is possible to reduce the influence of the residual stress on the sealing portion by providing the groove 94c in the vicinity of the end of each side having a relatively small residual stress.

  Thus, by providing the recess 89d and the groove 94c near one end of one side of the lid 92 that avoids the regions R1, R2, R3, and R4 through which the seam welding roller passes twice, the more stable groove 94c is formed. Formation and sealing with improved reliability can be performed.

  According to the vibrator 1 of the first embodiment described above, the groove 94 (94c, 94e, 94g) provided in the lid 92 is in a state where the internal space 14 and the outside communicate with each other, and the groove The lid 92 and the base 91 are joined so that 94 is positioned in the vicinity of the recess 89 (89c, 89d) provided on the side surface of the side wall 912 as the base 91. Thus, the internal space 14 can be easily reduced in pressure or in an inert gas atmosphere by the groove 94 communicating the internal space 14 with the outside. Then, by irradiating the communicating portion with the laser beam 98 to close the communicating portion, the internal space 14 in a reduced pressure or inert gas atmosphere can be easily sealed. Thereby, sealing after removing the gas generated at the time of joining of the lid 92 from the inside of the package 9 becomes possible, and the vibrator 1 realizing high quality hermetic sealing can be provided.

  Further, according to the vibrator 1 of the first embodiment described above, since the concave portion 89 is provided in the vicinity of the groove 94 at the position where the laser beam 98 is irradiated, the concave portion 89 is irradiated outside the lid 92. The laser beam 98 is irradiated. That is, the laser beam 98 is not directly applied to the upper surface 912a of the side wall 912 by providing the recess 89. Accordingly, it is possible to provide the vibrator 1 that prevents damage to the base (side wall 912) (for example, melting of the side wall 912, occurrence of micro cracks generated on the side wall 912) due to irradiation with the laser beam 98.

[Second Embodiment of Electronic Device]
Next, as a second embodiment of the electronic device, an embodiment of a gyro sensor will be described with reference to FIG. 11 is a front sectional view showing an outline of the gyro sensor. In the present embodiment, the same components as those in the first embodiment described above may be denoted by the same reference numerals and description thereof may be omitted.

  The gyro sensor 200 includes a gyro element 2 as an electronic component, an IC 112 as a circuit element, a package (base) 111 as a container, and a lid 92 as a lid. A package 111 made of ceramic or the like includes a stacked third substrate 125c, second substrate 125b, and first substrate 125a, and a frame-shaped side wall 115 provided on the peripheral surface of the first substrate 125a, And a frame-like side wall 120 provided at the peripheral edge of the surface of the third substrate 125c.

  On the upper surface of the frame-shaped side wall 115, a seam ring 117 as a bonding material formed of an alloy such as Kovar is formed. The seam ring 117 has a function as a bonding material with the lid 92, and is provided in a frame shape (circumferential shape) along the upper surface of the side wall 115. The lid 92 is provided with a groove 94 at an end portion of the back surface 92 b that is a surface facing the seam ring 117. The configuration of the lid 92 is the same as that of the first embodiment described above. When the lid 92 is placed on the seam ring 117, the groove 94 is formed so as to cover the internal space 114. Here, the space surrounded by the surface of the first substrate 125a and the inner wall of the frame-shaped side wall 115 becomes the inner space 114 of the gyro element 2, and the space surrounded by the third substrate 125c and the inner wall of the frame-shaped side wall 120. Is a housing portion of the IC 112. The internal space 114 in which the gyro element 2 is accommodated is sealed after the lid 92 remaining in the portion where the groove 94 is melted after being exhausted (degassed) from the groove 94. It is sealed by a stop portion 95. A plurality of external terminals 122 are provided on the surface (the lower surface in the drawing) of the frame-shaped side wall 120. The side wall 115 is provided with a recess 89 at a position facing the groove 94 of the lid 92 placed on the seam ring 117. The concave portion 89 has a concave shape that is recessed inward from the outer surface of the side wall 115.

  A connection pad 110 is formed on the surface of the first substrate 125 a located in the internal space 114 of the gyro element 2, and the gyro element 2 is fixed by being electrically connected to the connection pad 110. For this connection, a conductive fixing member 127 such as solder, silver paste, or conductive adhesive (adhesive in which conductive fillers such as metal particles are dispersed in a resin material) can be used. At this time, the gyro element 2 has a gap with the surface of the first substrate 125 a depending on the thickness of the conductive fixing member 127.

  The opening of the internal space 114 in which the gyro element 2 is accommodated is closed with a lid 92 as a lid body and hermetically sealed. Since the lid 92 has the same configuration as the lid 92 described in the first embodiment, a detailed description thereof will be omitted and the outline will be described. The lid 92 closes the opening of the internal space 114 opened to the upper surface of the package 111, and the periphery of the opening is joined using, for example, a seam welding method. The lid 92 is made of a Kovar plate material and has a front surface 92a and a back surface 92b in a front-back relationship. Similar to the first embodiment described above, the lid 92 is provided with a bottomed groove 94 provided on the back surface 92b side from the outer peripheral surface 92c of the lid 92 toward the central portion. Then, after exhausting the internal space 114 from the groove 94, which is a gap between the seam ring 117 and the lid 92, the portion including the end of the groove 94 is melted with a laser beam or the like and solidified. Sealing is performed.

  On the other hand, a connection electrode 118 is formed on the surface of the third substrate 125c located in the housing portion of the IC 112, and the connection electrode 118 and the IC 112 are electrically connected by bonding with gold (Au) bumps 124 or the like. Is fixed. The gap between the IC 112 and the surface of the third substrate 125c is filled with an underfill 131 such as resin. Note that the resin may be provided so as to cover the IC 112. Note that each of the connection pad 110, the connection electrode 118, the external terminal 122, and the like is connected by an internal wiring or the like, but description in the present invention is omitted including illustration.

(Gyro sensor manufacturing method)
Next, a method for manufacturing the gyro sensor 200 will be described, but a description of steps similar to those described in the method for manufacturing the vibrator 1 will be omitted. The steps to be omitted include the step of accommodating the gyro element 2 in the internal space 14 of the package 111, the step of placing the lid 92 in the internal space 114, the step of bonding the lid 92 to the package 111, and the exhausting process. This is a sealing step for hermetically sealing the internal space 114.

  In addition to the above-described steps, in manufacturing the gyro sensor 200, the IC 112 is housed in the housing portion of the IC 112 surrounded by the frame-shaped side wall 120 provided at the peripheral edge of the surface of the third substrate 125c. The IC 112 uses a gold (Au) bump 124 for connection electrodes 118 provided on the surface of the third substrate 125c, and is fixed by electrical connection. A gap between the IC 112 and the surface of the third substrate 125c is filled with an underfill 131 such as a resin to fill the gap. The gyro sensor 200 is completed through the above steps.

  According to the second embodiment described above, the fluidity of the molten metal (lid 92) by laser light is good as in the first embodiment, and the sealing portion 95 can be reliably formed. Therefore, the groove 94 can be reliably sealed, and the gyro sensor 200 as an electronic device with improved airtight reliability can be manufactured. Further, since the groove 94 becomes an exhaust hole as it is, it is not necessary to manage the dimensions of an unjoined portion (exhaust hole) used for exhaust as in the prior art, and stable exhaust and joining (sealing) can be achieved. Therefore, even when the gyro sensor 200 is heated at a high temperature after bonding (sealing), the generated gas can be suppressed. In addition, stable exhaust and bonding (sealing) can prevent characteristic deterioration of the gyro element 2 as an electronic component housed in the package 111 due to the influence of residual gas and the like. A gyro sensor 200 as a device can be provided.

  Similarly to the first embodiment, since the recess 89 is provided in the vicinity of the groove 94 where the laser beam is irradiated, the laser beam 98 irradiated outside the lid 92 is irradiated in the recess 89. The That is, since the recess 89 is provided, the upper surface of the side wall 115 is not directly irradiated with the laser beam 98. Thus, it is possible to provide the gyro sensor 200 that prevents damage to the base (side wall 115) (for example, melting of the side wall 115, occurrence of micro cracks generated on the side wall 115) due to irradiation with the laser beam 98.

  In the above description of the electronic device, the vibrator 1 and the gyro sensor 200 using the so-called double T-type gyro element 2 as an electronic component have been described as an example. However, the present invention is not limited to this. Can be applied to devices. Other electronic devices include, for example, a gyro sensor using an H-type or tuning-fork type gyro element as an electronic component, a timing device (vibrator, oscillator, etc.) using a vibration element, a pressure sensor using a pressure-sensitive element, A semiconductor device using a semiconductor element may be used.

  As the vibration element, a piezoelectric vibration element such as a MEMS element using a piezoelectric body, or a crystal vibration piece that performs bending vibration such as a tuning fork type crystal vibration piece using quartz as a material, a longitudinal vibration type crystal vibration piece, a thickness A sliding crystal vibrating piece or the like can be suitably used.

[Electronics]
Next, an electronic apparatus to which the vibrator 1 as an electronic device or the gyro sensor 200 as an electronic device according to an embodiment of the present invention is applied will be described in detail with reference to FIGS. In the description, an example in which the vibrator 1 using the gyro element 2 is applied is shown.

  FIG. 12 is a perspective view schematically illustrating a configuration of a mobile (or notebook) personal computer as an electronic apparatus including the vibrator 1 as an electronic device according to an embodiment of the present invention. In this figure, a personal computer 1100 includes a main body portion 1104 provided with a keyboard 1102 and a display unit 1106 provided with a display portion 100. The display unit 1106 is rotated with respect to the main body portion 1104 via a hinge structure portion. It is supported movably. Such a personal computer 1100 has a built-in vibrator 1 using a gyro element 2 having a function of detecting angular velocity.

  FIG. 13 is a perspective view schematically illustrating a configuration of a mobile phone (including PHS) as an electronic apparatus including the vibrator 1 as an electronic device according to an embodiment of the invention. In this figure, a cellular phone 1200 includes a plurality of operation buttons 1202, an earpiece 1204, and a mouthpiece 1206, and the display unit 100 is disposed between the operation buttons 1202 and the earpiece 1204. Such a cellular phone 1200 incorporates a vibrator 1 using a gyro element 2 that functions as an angular velocity sensor or the like.

  FIG. 14 is a perspective view schematically illustrating a configuration of a digital still camera as an electronic apparatus including the vibrator 1 as an electronic device according to an embodiment of the present invention. In this figure, connection with an external device is also simply shown. Here, an ordinary camera sensitizes a silver halide photographic film with a light image of a subject, whereas a digital still camera 1300 photoelectrically converts a light image of a subject with an image sensor such as a CCD (Charge Coupled Device). An imaging signal (image signal) is generated.

  A display unit 100 is provided on the back of a case (body) 1302 in the digital still camera 1300, and is configured to display based on an imaging signal from the CCD. The display unit 100 displays an object as an electronic image. Functions as a viewfinder. A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the back side in the drawing) of the case 1302.

  When the photographer confirms the subject image displayed on the display unit 100 and presses the shutter button 1306, the CCD image pickup signal at that time is transferred and stored in the memory 1308. In the digital still camera 1300, a video signal output terminal 1312 and an input / output terminal 1314 for data communication are provided on the side surface of the case 1302. As shown in the figure, a television monitor 1430 is connected to the video signal output terminal 1312 and a personal computer 1440 is connected to the input / output terminal 1314 for data communication as necessary. Further, the imaging signal stored in the memory 1308 is output to the television monitor 1430 or the personal computer 1440 by a predetermined operation. Such a digital still camera 1300 incorporates a vibrator 1 using a gyro element 2 that functions as an angular velocity sensor or the like.

  The vibrator 1 according to the embodiment of the present invention includes, for example, an ink jet type ejection device in addition to the personal computer (mobile personal computer) in FIG. 12, the mobile phone in FIG. 13, and the digital still camera in FIG. (For example, inkjet printers), laptop personal computers, televisions, video cameras, video tape recorders, car navigation devices, pagers, electronic notebooks (including those with communication functions), electronic dictionaries, calculators, electronic game devices, word processors, workstations , Video phone, crime prevention TV monitor, electronic binoculars, POS terminal, medical equipment (eg, electronic thermometer, blood pressure monitor, blood glucose meter, electrocardiogram measuring device, ultrasonic diagnostic device, electronic endoscope), fish detector, various measuring devices , Instruments (eg, vehicles, aviation , Gauges of a ship), can be applied to electronic equipment such as a flight simulator.

[Moving object]
FIG. 15 is a perspective view schematically showing an automobile as an example of a moving body. The automobile 106 is equipped with the vibrator 1 as an electronic device according to the present invention. For example, as shown in the figure, an automobile 106 as a moving body includes an electronic control unit 108 that includes a vibrator 1 using a gyro element 2 and controls a tire 109 and the like. The vibrator 1 also includes keyless entry, immobilizer, car navigation system, car air conditioner, anti-lock brake system (ABS), air bag, tire pressure monitoring system (TPMS), engine The present invention can be widely applied to electronic control units (ECUs) such as controls, battery monitors for hybrid vehicles and electric vehicles, and vehicle body attitude control systems.

  DESCRIPTION OF SYMBOLS 1 ... Vibrator as an electronic device, 2 ... Gyro element as an electronic component, 4 ... Vibrating body, 8 ... Conductive fixing member (silver paste), 9 ... Package, 10 ... Connection pad, 14 ... Internal space (storage space) , 41 ... Base, 51 ... First support, 52 ... Second support, 61 ... First beam, 62 ... Second beam, 63 ... Third beam, 64 ... Fourth beam, 89, 89c ... Recess, 89a ... Inner wall surface of recess, 89b ... Bottom surface of recess, 91 ... Base, 92 ... Lid as lid, 92a ... Front surface, 92b ... Back surface, 92c ... Outer peripheral surface, 92d ... Upper part of groove, 93 ... Seam ring, 94, 94c, 94e, 94g ... groove, 94a ... one end of the groove, 94b ... the other end of the groove, 95 ... sealed portion as a melting portion, 97 ... roller electrode of a seam welder, 98 ... laser light as an energy beam, 106: automobile as a moving body, 1 DESCRIPTION OF SYMBOLS 0 ... Connection pad 111 ... Package (base), 112 ... IC, 114 ... Internal space, 115, 120 ... Side wall, 117 ... Seam ring, 118 ... Connection electrode, 122 ... External terminal, 124 ... Gold bump, 125a ... No. DESCRIPTION OF SYMBOLS 1 board | substrate, 125b ... 2nd board | substrate, 125c ... 3rd board | substrate, 127 ... Conductive fixing member, 131 ... Underfill, 200 ... Gyro sensor as an electronic device, 421 ... 1st detection vibration arm, 422 ... 2nd detection vibration Arm, 425, 426, 445, 446, 447, 448 ... weight part (hammer head), 431 ... first connecting arm, 432 ... second connecting arm, 441 ... first driving vibrating arm, 442 ... second driving vibrating arm 443 ... third drive vibration arm, 444 ... fourth drive vibration arm, 714 ... detection signal terminal, 724 ... detection ground terminal, 734 ... drive signal terminal, 744 ... drive Ground terminal, 911 ... bottom plate, 911a ... base surface of bottom plate, 912 ... side wall, 912a ... top surface of side wall, 1100 ... mobile personal computer as electronic equipment, 1200 ... mobile phone as electronic equipment, 1300 ... as electronic equipment Digital still camera.

Claims (10)

An electronic device manufacturing method for joining the base and the lid while forming an internal space in which an electronic component is stored between the base and the lid,
The lid is provided with a groove on the surface to be joined to the base, and the lid and the base are positioned so that the groove is located in the vicinity of the recess provided on the side surface of the base. A bonding process for bonding
A sealing step of closing the groove by energy beam welding;
The manufacturing method of the electronic device characterized by having. The concave portion is provided from a joint surface of the base, which is a surface on the side where the lid is joined, to a base surface which is a surface on the opposite side of the joint surface,
2. The electronic device manufacturing according to claim 1, wherein, in the bonding step, the lid and the base are bonded so that the groove is positioned in the vicinity of the opening on the bonding surface side of the concave portion. Method. A bonding material is provided between the base and the lid,
In the joining step, the base and the lid body are joined by the joining material such that the joining material overlaps at least a part of the concave portion in plan view. The manufacturing method of the electronic device of description.   The said joining process joins the said base and the said cover body so that at least one part of the said groove | channel may be located between the said interior space and the said recessed part by planar view. The manufacturing method of the electronic device as described in any one of Claims 3. An electronic device comprising an internal space for storing electronic components between a base and a lid, wherein the base and the lid are joined,
In the lid, the groove on the surface to be joined with the bonding material is closed by a melted part in which a part of the lid is melted,
The electronic device is characterized in that the melting portion is located in the vicinity of a recess provided on a side surface of the base.   The said recessed part is provided from the joining surface which is the surface by which the said joining material of the said base is joined to the base surface which is the surface on the opposite side of the said joining surface. The electronic device described. A bonding material is provided between the base and the lid,
The base and the lid body are bonded by the bonding material so that the bonding material overlaps at least a part of the concave portion in a plan view. Electronic devices.   The electronic device according to any one of claims 5 to 7, wherein the melted portion is located between the internal space and the concave portion in a plan view.   An electronic apparatus comprising the electronic device according to any one of claims 5 to 8.   A moving body comprising the electronic device according to any one of claims 5 to 8.

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