JP2014118167A - Tape carrier for electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a tape carrier for an electronic component, which can prevent the displacement and fall of the electronic component in a recess for component storage.SOLUTION: A tape carrier 10 for an electronic component includes a carrier tape 12. The carrier tape 12 has a recess 14 for component storage, which houses the electronic component 100. The recess 14 for component storage is covered with a cover tape 20. A protrusion 24 for pinching the electronic component 100 housed in the recess 14 for component storage is formed in the cover tape 20.

Description

  The present invention relates to a tape carrier for electronic components, and more particularly, to a tape carrier for electronic components used for storing and transporting electronic components such as capacitors and coils.

  Japanese Patent Application Laid-Open No. 6-32367 (Patent Document 1) describes a tape carrier having a storage portion for storing a semiconductor component. The tape carrier is composed of two tapes, a carrier tape and a cover tape. The carrier tape is formed with a recess for housing a semiconductor component, and the cover tape is disposed so as to cover the recess. In this tape carrier, the recess is formed slightly larger than the semiconductor component to be stored so that the semiconductor component is securely stored in the semiconductor component storing step.

JP-A-6-32367

However, in the conventional tape carrier disclosed in Patent Document 1, since the recess is formed larger than the semiconductor component to be mounted, the semiconductor component is inclined in the recess when the tape carrier is transported and transported. Or flip it over. In such a state, when a semiconductor component is mounted on a mounter and an attempt is made to mount the semiconductor component on a mounting substrate or the like, a semiconductor component that cannot be adsorbed with the mounting surface of the semiconductor component facing the mounting substrate side occurs, In the mounting process, there was a problem that a mounting failure occurred.
Further, in the conventional tape carrier disclosed in Patent Document 1, there is a problem that the semiconductor component hits the side surface or the top surface of the tape carrier, so that the surface of the semiconductor component is damaged or the semiconductor component is damaged. there were.
Furthermore, in the conventional tape carrier disclosed in Patent Document 1, a semiconductor component may be stored in a state where it is mounted on a rewiring board called an interposer board. In that case, a recess is formed in accordance with the size of the interposer board. Therefore, there is a higher possibility that the above-described problems will occur.

  Therefore, a main object of the present invention is to provide an electronic component tape carrier that can prevent the electronic component from moving or overturning in the component housing recess.

An electronic component tape carrier according to the present invention is an electronic component tape carrier including a carrier tape having a component storage recess for storing an electronic component, and a cover tape arranged to cover the component storage recess. An electronic component tape carrier in which a protrusion for sandwiching an electronic component housed in the component housing recess is formed on at least one of the carrier tape and the cover tape.
In the electronic component tape carrier according to the present invention, the electronic component housed in the component housing recess includes, for example, a substrate and an electronic component element mounted on the substrate.
In the tape carrier for electronic parts according to the present invention, it is preferable that the protrusion is formed so as to have flexibility.
In the electronic component tape carrier according to the present invention, for example, the electronic component has a rectangular main surface, and the protrusion is sandwiched from both sides when the electronic component stored in the component storing recess is viewed in plan view. It is formed along two opposing sides of the electronic component so as to be able to.
In the electronic component tape carrier according to the present invention, the electronic component has a rectangular main surface, and the protrusion is sandwiched from four directions when the electronic component stored in the concave portion for storing the component is viewed in plan view. It is preferable to form along the four sides of the electronic component so that the
In the tape carrier for electronic parts according to the present invention, the protrusion is preferably formed so as to come into contact with the electronic part accommodated in the concave part for accommodating parts.

In the electronic component tape carrier according to the present invention, the movement and the overturn of the electronic component in the concave portion for component storage can be prevented by the protrusion. Therefore, it is possible to prevent mounting failure of the electronic component, prevent damage to the electronic component, and reduce appearance defects of the electronic component.
In the electronic component tape carrier according to the present invention, the electronic component housed in the component housing recess may include, for example, a substrate and an electronic component element mounted on the substrate.
In the electronic component tape carrier according to the present invention, when the protrusion is formed of a flexible material such as gas or liquid so as to be flexible, the electronic component stored in the concave portion for component storage is provided. The damage can be further prevented, and the appearance defect of the electronic component can be further reduced.
In the tape carrier for an electronic component according to the present invention, the electronic component has a rectangular main surface, and the protrusion can be sandwiched from both sides when the electronic component stored in the component storage recess is viewed in plan view. When formed along two opposing sides of the electronic component, the electronic component housed in the component housing recess is sandwiched by the protrusions from both sides.
In the electronic component tape carrier according to the present invention, the electronic component has a rectangular main surface, and the protrusion is sandwiched from four directions when the electronic component stored in the component storing concave portion is viewed in plan view. When formed along the four sides of the electronic component as possible, the electronic component stored in the component storage recess is sandwiched from the four sides by the protrusion. Therefore, it is possible to further prevent the electronic component from moving or overturning in the component housing recess.
In the electronic component tape carrier according to the present invention, when the protrusion is formed so as to contact the electronic component stored in the component storing recess, the electronic component is reliably prevented from moving or falling in the component storing recess. be able to.

  According to the present invention, an electronic component tape carrier that can prevent the electronic component from moving or overturning in the component housing recess is obtained.

  The above-described object, other objects, features, and advantages of the present invention will become more apparent from the following description of embodiments for carrying out the invention with reference to the drawings.

It is a perspective view which shows an example of the tape carrier for electronic components concerning this invention. It is a front view solution figure of the tape carrier for electronic components shown in FIG. It is a side view solution figure of the tape carrier for electronic components shown in FIG. FIG. 2 is an illustrative plan view of the electronic component tape carrier shown in FIG. 1. It is an illustration figure which shows an example of the projection part used for the tape carrier for electronic components shown in FIG. It is an illustration figure which shows the other example of the projection part used for the tape carrier for electronic components shown in FIG. It is a side view solution figure which shows the other example of the tape carrier for electronic components concerning this invention. It is a side view solution figure which shows the further another example of the tape carrier for electronic components concerning this invention. FIG. 9 is an illustrative plan view of the electronic component tape carrier shown in FIG. 8.

  FIG. 1 is a perspective view showing an example of a tape carrier for electronic components according to the present invention, FIG. 2 is a front view of the tape carrier for electronic components, and FIG. 3 is a diagram of the tape carrier for electronic components. FIG. 4 is a side view, and FIG. 4 is a plan view of the electronic component tape carrier.

  An electronic component tape carrier 10 shown in FIG. 1 includes a belt-like carrier tape 12. Examples of the material of the carrier tape 12 include polymer materials such as conductive polystyrene, conductive polycarbonate, and polyethylene terephthalate. The carrier tape 12 has a large number of recesses 14 for storing components. A large number of component housing recesses 14 are formed at predetermined intervals in the longitudinal direction of the carrier tape 12. Each of these component housing recesses 14 is for housing the electronic component 100.

Here, the electronic component 100 to be stored will be described.
Examples of the electronic component 100 include those having passive component elements such as capacitor elements and coil elements, and semiconductor chips.
In this case, for example, there is a noise countermeasure capacitor in which a capacitor element is mounted on a printed circuit board.
Particularly in the case of a semiconductor chip, a plurality of electrodes called BGA (Ball Grid Array) are often formed on the back surface of the chip at a narrow pitch as external terminal electrodes, which are mounted on a mounting board such as a printed circuit board. When trying to do so, the process accuracy of the mounting substrate is not so high, and thus the mounting electrodes and wiring electrodes having a narrow pitch may not be formed on the mounting substrate. In such a case, mounting electrodes and wiring electrodes may be formed on an alumina substrate or LTCC substrate with high process accuracy to increase the pitch of the mounting electrodes. A substrate used for widening the wiring or inter-electrode pitch is called an interposer substrate.
Therefore, electronic component 100 includes, for example, substrate 102 and electronic component element 104 such as a capacitor element, a coil element, and a semiconductor chip mounted on substrate 102. Moreover, the electronic component 100 has a rectangular main surface, for example.

  On both sides of the carrier tape 12 in the width direction, fitting recesses 16 are formed as shown in FIG. These fitting recesses 16, 16 are used for fitting the fitting protrusions 22, 22 formed on both sides in the width direction of the cover tape 20 when the component housing recess 14 is covered with a cover tape 20 described later. Is.

  Furthermore, on one side in the width direction of the carrier tape 12, as shown in FIGS. 1 and 2, a large number of sprocket holes 18 are formed at predetermined intervals in the longitudinal direction of the carrier tape 12 on the outside of the fitting recess 16. Is done. These sprocket holes 18 are used when the electronic component tape carrier 10 is fed in the longitudinal direction thereof.

  The electronic component tape carrier 10 further includes a belt-like cover tape 20. Examples of the material of the cover tape 20 include polymer materials such as conductive polystyrene, conductive polycarbonate, and polyethylene terephthalate. The cover tape 20 is disposed so as to cover the component housing recess 14 of the carrier tape 12.

  As shown in FIG. 2, fitting convex portions 22 are respectively formed on the lower surfaces on both sides in the width direction of the cover tape 20. The fitting convex portions 22 and 22 are fitted into fitting concave portions 16 and 16 formed on both sides in the width direction of the carrier tape 12 when the component storing concave portion 14 of the carrier tape 12 is covered with the cover tape 20. Is. The cover tape 20 and the carrier tape 12 may be bonded to each other by thermocompression bonding other than the fitting concave portion and the fitting convex portion.

  Further, a plurality of flexible protrusions 24 are formed on the lower surface in the width direction of the cover tape 20 at predetermined intervals in the longitudinal direction of the cover tape 20. As shown in FIGS. 3 and 4, these protrusions 24 are for sandwiching from both sides when the electronic component element 104 of the electronic component 100 accommodated in the component accommodating recess 14 of the carrier tape 12 is viewed in plan view. It is. Therefore, these protrusions 24 face the electronic component element 104 of the electronic component 100 so that the electronic component element 104 of the electronic component 100 accommodated in the component accommodating recess 14 can be sandwiched from both sides when viewed in plan. Formed along two sides. Further, these protrusions 24 are formed so as to contact the electronic component element 104 of the electronic component 100 housed in the component housing recess 14.

For example, as shown in FIG. 5, the above-described protruding portion 24 is configured by two layers of films 20 a and 20 b laminated with a cover tape 20, and a flexible material 24 a is provided between the two layers of films 20 a and 20 b. It is formed by enclosing air, a gas such as N ₂ , a volatile liquid such as alcohol, or other liquid such as water.

  For example, as shown in FIG. 6, the above-described protrusion 24 is made of a cover tape 20 made of a single layer film, and the bottom surface of the film is made of a flexible material such as a soft synthetic resin. You may form so that it may have.

  In the electronic component tape carrier 10 shown in FIG. 1, the electronic component 100 is accommodated in the component accommodating recess 14. In this case, the electronic component 100 is accommodated such that the substrate 102 is downward and the electronic component element 104 is upward. Further, the electronic component element 104 of the electronic component 100 is sandwiched by the protrusion 24 from both sides. Therefore, in this tape carrier 10 for electronic components, the protrusion 24 can prevent the electronic component 100 from moving or overturning in the component housing recess 14. Therefore, the mounting failure of the electronic component 100 can be prevented, the damage of the electronic component 100 can be prevented, and the appearance defect of the electronic component 100 can be reduced.

Moreover, in the tape carrier 10 for electronic components shown in FIG. 1, since the projection part 24 is formed so as to be flexible with a flexible material such as gas or liquid, it is accommodated in the concave portion 14 for accommodating components. Damage to the electronic component 100 can be further prevented, and appearance defects of the electronic component 100 can be further reduced.
Furthermore, since the protrusion 24 has flexibility, the impact when the electronic component 100 comes into contact with the protrusion 24 is mitigated, so that appearance defects of the electronic component 100 can be prevented.
Further, since the protrusion 24 has flexibility, it absorbs variations in the processing accuracy of the component storage recess 14 and the stored electronic component 100, and reduces the gap between the electronic component tape carrier 10 and the electronic component 100, Risks such as rollover of the electronic component 100 can be reduced.
Furthermore, the size of the protrusion 24 can be made with a dimension designed for the gap design, and the variation can be absorbed by changing the amount of gas or liquid to be sealed.
In addition, by enclosing a volatile liquid as the liquid to be sealed in the protrusion 24, if the protrusion 24 ruptures, the abnormal characteristic or appearance of the electronic component 100 due to the liquid adhering to the electronic component 100 should be avoided. Defects can be prevented.

  Further, in the electronic component tape carrier 10, the protrusion 24 is formed so as to contact the electronic component element 104 of the electronic component 100 accommodated in the component accommodating recess 14. 100 can be reliably prevented from moving or falling.

  FIG. 7 is an illustrative side view showing another example of a tape carrier for electronic parts according to the present invention.

The electronic component tape carrier 10 shown in FIG. 7 is different from the electronic component tape carrier 10 shown in FIG. 1 in that the protrusion 24 is not formed on the cover tape 20, but the component storage recess of the carrier tape 12. 14 is formed at the bottom.
In the electronic product tape carrier 10 shown in FIG. 7, the electronic component 100 is stored in the component storing recess 14 so that the electronic component element 104 of the electronic component 100 faces downward and the substrate 102 faces upward. In this case, the electronic component element 104 of the electronic component 100 is sandwiched by the protrusion 24 from both sides.
Therefore, the electronic component tape carrier 10 shown in FIG. 7 has the same effect as the electronic component tape carrier 10 shown in FIG.

  FIG. 8 is a side view solution view showing still another example of the electronic component tape carrier according to the present invention, and FIG. 9 is a plan view solution view of the electronic component tape carrier.

  In the electronic component tape carrier 10 shown in FIG. 8, the projecting portion 24 can be sandwiched from four directions when the electronic component element 104 of the electronic component 100 accommodated in the component accommodating recess 14 is viewed in plan view. It is formed along the four sides of the electronic component element 104 of the component 100.

  In the tape carrier 10 for an electronic component shown in FIG. 8, the projections 24 are formed on the four sides of the electronic component 100 so that the projection 24 can be sandwiched from four directions when the electronic component 100 accommodated in the component accommodating recess 14 is viewed in plan view. Accordingly, the electronic component 100 housed in the component housing recess 14 is sandwiched from the four sides by the protrusion 24. Therefore, it is possible to prevent the electronic component 100 from moving or toppling in the component housing recess 14 in two directions orthogonal to each other, that is, to further prevent the electronic component 100 from moving or toppling in the component housing recess 14.

  In each of the electronic component tape carriers 10 described above, the protrusions 24 are formed on the side surface side of the electronic component 100, but the protrusions 24 are also formed on the top surface side and the bottom surface side of the electronic component 100. May be.

  Further, in each of the electronic component tape carriers 10 described above, the protrusions 24 are individually formed along each side, but may be formed in a concave cross section along two opposing sides.

  Further, in each of the electronic component tape carriers 10 described above, the gas or liquid sealed in the protrusion 24 may be colored. By coloring in this way, it becomes easy to detect leakage of the enclosed gas or liquid.

  Further, when the top surface shape of the electronic component 100 is a rectangle, the protrusion 24 may sandwich the electronic component 100 from either the long side direction or the short side direction.

  The tape carrier for electronic parts according to the present invention is suitably used particularly for storing and transporting electronic parts such as capacitors and coils.

DESCRIPTION OF SYMBOLS 10 Electronic component tape carrier 12 Carrier tape 14 Component storage recessed part 16 Fitting recessed part 18 Sprocket hole 20 Cover tape 22 Fitting convex part 24 Protrusion part 100 Electronic component 102 Board | substrate 104 Electronic component element

Claims (6)

An electronic component tape carrier comprising: a carrier tape having a component storage recess for storing an electronic component; and a cover tape arranged to cover the component storage recess,
A tape carrier for electronic parts, wherein at least one of the carrier tape and the cover tape is formed with a protrusion for sandwiching an electronic part housed in the part housing recess.   2. The electronic component tape carrier according to claim 1, wherein the electronic component housed in the component housing recess includes a substrate and an electronic component element mounted on the substrate.   The tape carrier for electronic components according to claim 1, wherein the protrusion is formed to have flexibility. The electronic component has a rectangular main surface,
The said protrusion part was formed along two sides which the said electronic component opposes so that it can be pinched | interposed from both sides when the said electronic component accommodated in the said recessed part for component accommodation is planarly viewed. The tape carrier for electronic components according to claim 3. The electronic component has a rectangular main surface,
The said protrusion part was formed along 4 sides of the said electronic component so that it can pinch | interpose from 4 directions when the said electronic component accommodated in the said recessed part for component accommodation is planarly viewed. Item 4. The electronic component tape carrier according to Item 3.   6. The electronic component tape carrier according to claim 1, wherein the protruding portion is formed so as to contact the electronic component housed in the component housing recess.

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