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JP2014116148A - LED lamp - Google Patents

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JP2014116148A
JP2014116148A JP2012268447A JP2012268447A JP2014116148A JP 2014116148 A JP2014116148 A JP 2014116148A JP 2012268447 A JP2012268447 A JP 2012268447A JP 2012268447 A JP2012268447 A JP 2012268447A JP 2014116148 A JP2014116148 A JP 2014116148A
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led lamp
heat
led
insulating
insulating housing
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JP2014116148A5 (en
JP6171215B2 (en
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Hironori Waga
博憲 和賀
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Iris Ohyama Inc
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Iris Ohyama Inc
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Abstract

PROBLEM TO BE SOLVED: To provide an LED lamp that can be self-stood under a state in which a heat sink and a circuit storing member are integrally assembled and mechanical load for holding the heat sink is not applied to a connector.SOLUTION: A protruding cylinder 71 of an insulation casing 7 is protruded out of an inside of a heat radiator member 4 through an opening at the central part of a bottom wall 42, a bushing 9 is threadably engaged with a first threaded part 74 and the bottom wall 42 of the heat radiator member 4 is held by an abutment part 72 of the insulation casing 7 and a flange part 93 of the bushing 9. A connector member 10 is threadably engaged with a second threaded part 75. The connector member 10 and the bushing 9 are threadably engaged while being spaced apart from each other.

Description

本発明は、発光ダイオード等の固体発光素子を用いた電球代替可能なLEDランプに関する。   The present invention relates to an LED lamp capable of replacing a light bulb using a solid light emitting element such as a light emitting diode.

近年、環境意識の高まりから、省電力化に優れたLED素子を光源に使用した照明装置が盛んに用いられるようになってきた。特に最近は、白熱電球を用いた一般照明装置においても、そのまま置き換え可能なLEDランプが急速に普及してきている。 In recent years, due to an increase in environmental awareness, lighting devices using LED elements excellent in power saving as light sources have been actively used. Particularly recently, LED lamps that can be replaced as they are in a general lighting device using an incandescent light bulb are rapidly spreading.

特許第4755319号公報Japanese Patent No. 4755319

特許文献1に記載のLEDランプは、ヒートシンク(ケース)の底壁を回路格納部材である筒体と、口金とで挟持するもので、ヒートシンクの底壁と口金の間に、絶縁性材料からなる環状部材が介在している。   The LED lamp described in Patent Document 1 is configured such that a bottom wall of a heat sink (case) is sandwiched between a cylindrical body that is a circuit storage member and a base, and is made of an insulating material between the bottom wall of the heat sink and the base. An annular member is interposed.

特許文献1の形態では、組立て方法として、まず、ヒートシンクを回路格納部材である筒体と口金とで挟持する。口金は先端が丸みを帯びているので、組立てた時点で自立して置くことができなくなり、次工程以降の組立て作業では何らかの手段でヒートシンクを保持していなければならない。また、口金にはヒートシンクを挟持するために機械的負荷がかかっており、その歪みによる点灯回路に給電する給電線の接合部への影響が懸念される。 In the form of Patent Document 1, as an assembling method, first, a heat sink is sandwiched between a cylinder that is a circuit storage member and a base. Since the tip of the base is rounded, it cannot be placed independently at the time of assembly, and the heat sink must be held by some means in the assembly work after the next process. In addition, a mechanical load is applied to the base in order to sandwich the heat sink, and there is a concern about the influence on the joint portion of the power supply line that supplies power to the lighting circuit due to the distortion.

本発明は、このような点に鑑みなされたもので、LEDランプの組立て工程において、ヒートシンクと回路格納部材を一体に組立てた状態において、自立して置くことができ、尚且つ、口金には前記ヒートシンクを挟持するための機械的負荷をかけないLEDランプを提供することを目的とする。   The present invention has been made in view of the above points, and in the assembly process of the LED lamp, the heat sink and the circuit housing member can be placed independently in a state where they are assembled together. An object of the present invention is to provide an LED lamp that does not apply a mechanical load for sandwiching a heat sink.

請求項1に記載の発明にあたっては、LED素子が実装されたLED基板と、点灯回路基板を収納する筒状の絶縁筐体と、該絶縁筐体を収納する筒状の放熱部材を備えたLEDランプにおいて、前記絶縁筐体の下端部を前記放熱部材の底壁開口部から外部に突出させるとともに、該突出部に挟持部材を装着し、該挟持部材と前記絶縁筐体の下端部とで前記放熱部材の底壁部を挟持し、前記放熱部材と絶縁筐体を固定した状態で、絶縁筐体の下端部を底面にして自立して載置可能であることを特徴とするものである。 According to the first aspect of the present invention, an LED board including an LED board on which an LED element is mounted, a cylindrical insulating casing that houses a lighting circuit board, and a cylindrical heat dissipation member that stores the insulating casing. In the lamp, the lower end portion of the insulating casing protrudes outside from the bottom wall opening of the heat radiating member, and a clamping member is attached to the protruding portion, and the clamping member and the lower end portion of the insulating casing In a state where the bottom wall portion of the heat dissipating member is sandwiched and the heat dissipating member and the insulating housing are fixed, the heat dissipating member can be placed independently with the lower end portion of the insulating housing being the bottom surface.

請求項2に記載の発明にあたっては、前記絶縁筐体における前記放熱部材の底面側開口部からの突出部に、前記挟持部材と離間させて口金部材を装着したことを特徴とするものである。 The invention according to claim 2 is characterized in that a cap member is mounted on the protruding portion from the bottom surface side opening of the heat radiating member in the insulating casing so as to be separated from the clamping member.

請求項3に記載の発明にあたっては、前記挟持部材は環状をなし絶縁性材料からなることを特徴とするものである。   The invention according to claim 3 is characterized in that the clamping member is formed of an insulating material in an annular shape.

請求項4に記載の発明にあたっては、前記挟持部材は、前記絶縁筐体における前記放熱部材の底面側開口部からの突出部の外周に螺合していることを特徴とするものである。 In the invention described in claim 4, the clamping member is screwed to the outer periphery of the protruding portion from the bottom surface side opening of the heat radiating member in the insulating casing.

請求項5に記載の発明にあたっては、前記口金部材は、前記絶縁筐体における前記放熱部材の底面側開口部からの突出部の外周に前記挟持部材と離間させて螺合していることを特徴とするものである。   In the invention according to claim 5, the base member is screwed into the outer periphery of the protruding portion from the bottom surface side opening of the heat radiating member in the insulating casing, being separated from the clamping member. It is what.

本発明によれば、ヒートシンクと回路格納部材を一体に組立てる際に、口金とは異なる環状部材を使用するので、一体に組立てた状態において、自立して置くことができ、次工程以降の組立てがし易く尚且つ、前記環状部材と前記口金は独立しているので、口金に前記ヒートシンクを挟持するための機械的負荷がかからない。口金部材の、この負荷による歪みをなくしたので、歪みによる給電線の接合部への影響を排除して長期に亘り安定した給電が行えるLEDランプを提供することができる。   According to the present invention, when assembling the heat sink and the circuit housing member integrally, an annular member different from the base is used, so that the heat sink and the circuit storage member can be placed independently in an integrally assembled state, and the assembly after the next process can be performed. In addition, since the annular member and the base are independent, no mechanical load is applied to sandwich the heat sink in the base. Since the distortion of the base member due to this load is eliminated, it is possible to provide an LED lamp that can stably supply power over a long period of time by eliminating the influence of the distortion on the joint portion of the power supply line.

本実施形態のLEDランプを斜め上方から見た斜視図The perspective view which looked at the LED lamp of this embodiment from diagonally upward 本実施形態のLEDランプを斜め上方から見た分解斜視図The exploded perspective view which looked at the LED lamp of this embodiment from diagonally upward 本実施形態の点灯回路基板と回路基板ホルダの組立て方を説明するためのもので、(a)は組立て前の状態を斜め下方から見た斜視図、(b)は組立て後の状態を斜め下方から見た斜視図BRIEF DESCRIPTION OF THE DRAWINGS It is for demonstrating how to assemble the lighting circuit board of this embodiment, and a circuit board holder, (a) is the perspective view which looked at the state before an assembly from diagonally downward, (b) is diagonally below the state after an assembly. Perspective view 本実施形態の放熱部材を斜め下方から見た斜視図The perspective view which looked at the heat radiating member of this embodiment from diagonally downward 本実施形態のLEDランプの組立て方法を説明する図であり、(a)〜(d)は、その組立て手順を示す斜め上方から見た斜視図It is a figure explaining the assembly method of the LED lamp of this embodiment, (a)-(d) is the perspective view seen from diagonally upward which shows the assembly procedure. 本実施形態のLEDランプで透光性カバーを組立てる前の状態を示す図で、(a)は平面図、(b)は(a)のA−A断面図It is a figure which shows the state before assembling a translucent cover with the LED lamp of this embodiment, (a) is a top view, (b) is AA sectional drawing of (a). 本実施形態の透光性カバーの組立て方法を説明する図であり(a)は、軸長方向の断面図、(b)は(a)のB部拡大図It is a figure explaining the assembly method of the translucent cover of this embodiment, (a) is sectional drawing of an axial length direction, (b) is the B section enlarged view of (a). 本実施形態の放熱部材を絶縁部材とブッシュで挟持した状態と、ブッシュと口金部材の間隙を説明する軸長方向の断面図A sectional view in the axial direction for explaining a state in which the heat radiating member of this embodiment is sandwiched between an insulating member and a bush, and a gap between the bush and the base member

以下に本発明の好適な実施の形態について、図面を参照しながら説明する。なお本実施の形態は一例であり、これに限定されるものではない。   Preferred embodiments of the present invention will be described below with reference to the drawings. Note that this embodiment is merely an example, and the present invention is not limited to this.

図1は、本実施形態に係るLEDランプ1を斜め上方から見た斜視図で、図2は本実施形態に係るLEDランプを斜め上方から見た分解斜視図である。     FIG. 1 is a perspective view of an LED lamp 1 according to the present embodiment as viewed from obliquely above, and FIG. 2 is an exploded perspective view of the LED lamp according to the present embodiment as viewed from obliquely above.

LEDランプ1は図2に示すように、複数のLED素子21と、当該LED素子21を実装するLED基板2と、該LED基板2を載置する熱伝導載置部材3と、前記熱伝導載置部材3を他端に備える放熱部材4(ヒートシンク)と、前記LED基板2を覆う透光性カバー5と、複数の電子部品61を実装した点灯回路基板6と、前記点灯回路基板6を収納し、且つ前記放熱部材4内に配された絶縁筐体7(回路格納部材)と、前記点灯回路基板6を保持して、前記絶縁筐体7内に点灯回路基板6を格納する回路基板ホルダ8と、前記放熱部材4を前記絶縁筐体7と挟持して固定するブッシュ9と、口金部材10とを備える。   As shown in FIG. 2, the LED lamp 1 includes a plurality of LED elements 21, an LED substrate 2 on which the LED elements 21 are mounted, a heat conductive mounting member 3 on which the LED substrate 2 is mounted, and the heat conductive mount. A heat radiating member 4 (heat sink) having a mounting member 3 at the other end, a translucent cover 5 covering the LED board 2, a lighting circuit board 6 on which a plurality of electronic components 61 are mounted, and the lighting circuit board 6 are accommodated. And a circuit board holder for holding the lighting circuit board 6 in the insulating casing 7 by holding the lighting circuit board 6 and the insulating casing 7 (circuit housing member) disposed in the heat radiating member 4. 8, a bush 9 that clamps and fixes the heat dissipating member 4 with the insulating housing 7, and a base member 10.

LED基板2は基板22と当該基板22の主面に実装された複数のLED素子21で構成され、当該基板22は略円盤状のガラスエポキシ基板、金属基板、セラミック基板等のプリント基板であり、本実施形態では、電気絶縁樹脂で被覆された金属基板からなるプリント基板を用いた。LED素子21は本実施形態では照明用の白色光を発光する高輝度タイプを用いている。   The LED substrate 2 includes a substrate 22 and a plurality of LED elements 21 mounted on the main surface of the substrate 22, and the substrate 22 is a printed substrate such as a substantially disk-shaped glass epoxy substrate, a metal substrate, or a ceramic substrate. In this embodiment, a printed circuit board made of a metal substrate coated with an electrically insulating resin is used. In this embodiment, the LED element 21 is a high-luminance type that emits white light for illumination.

熱伝導載置部材3は熱伝導率の高い、例えばアルミニウム等の金属材料を材料とし、LED基板2を装着すると共に、両端が開口した略椀形円筒形状の放熱部材4の他端に内嵌される。熱伝導載置部材3は筒部31と載置部32とを有する有底筒状をなし、前記LED基板2の基板下面23が面接触する状態で、載置部32に取付けられる。   The heat conduction mounting member 3 is made of a metal material such as aluminum having a high heat conductivity, and is mounted on the other end of a substantially bowl-shaped cylindrical heat radiating member 4 having both ends opened while the LED substrate 2 is mounted. Is done. The heat conduction mounting member 3 has a bottomed cylindrical shape having a cylindrical portion 31 and a mounting portion 32 and is attached to the mounting portion 32 in a state where the substrate lower surface 23 of the LED substrate 2 is in surface contact.

熱伝導載置部材3は、厚み方向に貫通する複数のネジ止め用の貫通孔33と、点灯回路からの給電線を通すための貫通孔34が備えられている。また、筒部31には、透光性カバー5を係合するための位置決め用の切り欠き35が設けられ、筒部31の壁面には熱伝導載置部材4の軸心に向けて透光性カバー5の係合用の角孔36が穿設されている。   The heat conduction mounting member 3 is provided with a plurality of screwing through holes 33 penetrating in the thickness direction and a through hole 34 for passing a power supply line from the lighting circuit. Further, the cylindrical portion 31 is provided with a positioning notch 35 for engaging the translucent cover 5. The wall surface of the cylindrical portion 31 transmits light toward the axial center of the heat conduction mounting member 4. A square hole 36 for engaging the cover 5 is formed.

放熱部材4は、図2に示すように両端が開口した中空の椀形円筒形状に形成されており、外径が大きい他端に前記熱伝導載置部材4の筒部31外周面が内嵌され、一端は後述するように絶縁筐体7とブッシュ9(環状挟持部材)によって挟持固定される。放熱部材4は内部に絶縁筐体7を収納し、この絶縁筐体7内に点灯回路基板6が保持されている。   The heat radiating member 4 is formed in a hollow bowl-shaped cylindrical shape having both ends opened as shown in FIG. 2, and the outer peripheral surface of the cylindrical portion 31 of the heat conducting mounting member 4 is fitted in the other end having a large outer diameter. One end is clamped and fixed by an insulating casing 7 and a bush 9 (annular clamping member) as will be described later. The heat dissipating member 4 houses an insulating housing 7 inside, and a lighting circuit board 6 is held in the insulating housing 7.

放熱部材4は筒壁41と筒壁41の下端(底面部)には環状の底壁42(図4)が形成されており、前記底壁42の中央部は開口している。   The heat radiating member 4 has a cylindrical wall 41 and an annular bottom wall 42 (FIG. 4) formed at the lower end (bottom surface) of the cylindrical wall 41, and the central portion of the bottom wall 42 is open.

放熱部材4は、その円筒外殻に放射状に放熱フィン43が一体で複数形成され、LED素子21が点灯した際に発生する熱を、LED基板2の基板22から熱伝導載置部材3へ、熱伝導載置部材3からさらに放熱部材4に伝わり外気へと放熱する放熱機能を有する。   The heat radiating member 4 has a plurality of heat radiating fins 43 integrally formed radially on its cylindrical outer shell, and heat generated when the LED element 21 is lit is transferred from the substrate 22 of the LED substrate 2 to the heat conducting mounting member 3. It has a heat radiating function for transferring heat from the heat conduction mounting member 3 to the heat radiating member 4 and radiating heat to outside air.

絶縁筐体7は放熱部材4よりも熱伝導性の小さな汎用樹脂を使用して、中空の略円筒状に形成されている。本実施形態ではPBT樹脂を用いたが、これに限定されるものではなく、PET,PC、ポリイミド樹脂等公知の樹脂材料が使用できる。   The insulating casing 7 is formed in a hollow, substantially cylindrical shape using a general-purpose resin having a thermal conductivity smaller than that of the heat radiating member 4. In this embodiment, the PBT resin is used. However, the present invention is not limited to this, and a known resin material such as PET, PC, polyimide resin or the like can be used.

絶縁筐体7は図2に示すように、放熱部材4の内部から放熱部材の底壁42の開口部 を通って外部へと突出する突出筒部71と、放熱部材4の底壁42の内面に当接する当接部72(図6(b)) と、当接部72の外周縁から突出筒部の突出方向とは逆方向に延伸する円筒部73とを有し、円筒部73の開口が前記回路基板ホルダ8によって塞がれている。突出筒部71の外周面には、ブッシュ9の内径部に形成されたネジ部94と螺合する第一のネジ部74があり、先端側には口金部材10と螺合する第二のネジ部75が形成されている。 As shown in FIG. 2, the insulating housing 7 includes a projecting cylindrical portion 71 that protrudes from the inside of the heat radiating member 4 to the outside through the opening of the bottom wall 42 of the heat radiating member, and the inner surface of the bottom wall 42 of the heat radiating member 4. And a cylindrical portion 73 extending from the outer peripheral edge of the abutting portion 72 in the direction opposite to the protruding direction of the protruding cylindrical portion. Is closed by the circuit board holder 8. On the outer peripheral surface of the protruding cylindrical portion 71, there is a first screw portion 74 that is screwed with a screw portion 94 formed on the inner diameter portion of the bush 9, and a second screw that is screwed with the base member 10 on the tip side. A portion 75 is formed.

絶縁筐体7の円筒部内壁76には開口部側に向かって、ビス止め用の円筒形状のボス77を樹立しており、前記ボス77は回路基板ホルダ8、熱伝導載置部材3とLED基板2の組立ての際に位置決めになると共に、ネジを締めることによってLED基板2は熱伝導載置部材3の載置部32に固定される。 A cylindrical boss 77 for screwing is established on the inner wall 76 of the cylindrical portion of the insulating housing 7 toward the opening, and the boss 77 is connected to the circuit board holder 8, the heat conduction mounting member 3, and the LED. The LED board 2 is fixed to the mounting portion 32 of the heat conductive mounting member 3 by positioning when the board 2 is assembled and tightening the screws.

図3(a)に示すように、回路基板ホルダ8は、絶縁筐体7同様の熱伝導性の小さな汎用樹脂を使用して蓋部81と筒部82とを有する有底浅皿状に形成されており、底部83には点灯回路基板6を保持するための保持用爪部84と保持ガイドリブ85を備えている。   As shown in FIG. 3A, the circuit board holder 8 is formed in a bottomed shallow dish shape having a lid portion 81 and a cylindrical portion 82 by using a general-purpose resin having a small thermal conductivity similar to that of the insulating housing 7. The bottom 83 includes a holding claw 84 and a holding guide rib 85 for holding the lighting circuit board 6.

回路基板ホルダ8の筒部82の外周には絶縁筐体7の円筒部73に設けられた角孔78に係合する係合爪86が形成され、また、組立て時の円周方向の位置決めをする凸部88が径方向の外方に突設されている。   Engaging claws 86 are formed on the outer periphery of the cylindrical portion 82 of the circuit board holder 8 to engage with the square holes 78 provided in the cylindrical portion 73 of the insulating housing 7, and positioning in the circumferential direction during assembly is performed. The projecting portion 88 is projected outward in the radial direction.

図3(b)に示すように、複数の電子部品61が実装されている点灯回路基板6は、回路基板ホルダ8の保持用爪部84と保持ガイドリブ85により保持される。点灯回路基板6の基板62の外周に設けた角切り欠き部63を回路基板ホルダ8の保持用爪部84に位置を合わせて底部83側に押し込むと保持用爪部84が外方に拡がり、基板62の厚み全てが通過すると拡がりが解除され係止される。回路基板ホルダ8と点灯回路基板6間の係止状態でのスペースは、保持ガイドリブ85に設けた段差89によって規制される。   As shown in FIG. 3B, the lighting circuit board 6 on which the plurality of electronic components 61 are mounted is held by holding claws 84 and holding guide ribs 85 of the circuit board holder 8. When the corner notch 63 provided on the outer periphery of the substrate 62 of the lighting circuit board 6 is aligned with the holding claw 84 of the circuit board holder 8 and pushed toward the bottom 83, the holding claw 84 expands outward, When all the thickness of the substrate 62 passes, the expansion is released and locked. The space in the locked state between the circuit board holder 8 and the lighting circuit board 6 is regulated by the step 89 provided on the holding guide rib 85.

複数の電子部品61が実装されている反対側の基板62の面からはLED基板2に給電する図示しない給電線が回路基板ホルダ8の給電線用貫通孔11を通りLED基板2に接続される。回路基板ホルダ8の給電線用貫通孔11の周縁全周には一体で形成したリブ12が立設されており、金属材料である熱伝導載置部材3に給電線が触れないように保護している。   A power supply line (not shown) that feeds power to the LED board 2 is connected to the LED board 2 through the power supply line through hole 11 of the circuit board holder 8 from the opposite surface of the board 62 on which the plurality of electronic components 61 are mounted. . An integrally formed rib 12 is erected on the entire periphery of the feed line through hole 11 of the circuit board holder 8 to protect the feed line from touching the heat conduction mounting member 3 made of a metal material. ing.

ブッシュ9は絶縁筐体7同様の熱伝導性の小さな汎用樹脂を使用して成形され、筒部91と開口部92、開口部92の一端側から径方向の外方に延出する鍔部93を有しており、筒部内周には絶縁筐体7の突出筒部71外周面に形成された第一のネジ部74に螺合対応したネジ部94が形成されている。   The bush 9 is formed using a general-purpose resin having a small thermal conductivity similar to the insulating housing 7, and has a cylindrical portion 91, an opening portion 92, and a flange portion 93 that extends radially outward from one end side of the opening portion 92. A screw portion 94 corresponding to a first screw portion 74 formed on the outer peripheral surface of the protruding cylindrical portion 71 of the insulating housing 7 is formed on the inner periphery of the cylindrical portion.

口金部材10は照明器具のソケットにねじ込み、ソケットから給電を受けるためのもので、ネジ部101と先端部102とを有し絶縁筐体7の突出筒部71外周面に形成された第二のネジ部75と螺合する。   The base member 10 is for screwing into the socket of the lighting fixture and receiving power from the socket. The base member 10 has a screw portion 101 and a tip portion 102 and is formed on the outer peripheral surface of the protruding cylindrical portion 71 of the insulating housing 7. Screwed into the screw portion 75.

透光性カバー5は、拡散材を含有したポリカーボネイト樹脂を用いてドーム状に形成されている。この透光性カバー5の開口端部には環状延出部51が設けられており、前記環状延出部51には係合用の爪部52及び熱伝導載置部材3との係合位置決め用の凸部53を径方向外方へ突設している。熱伝導載置部材3に設けられた角孔36と、前記係合用の爪部52の係合と併せて、熱伝導載置部材3の筒部31内周と前記環状延出部51外周を接着剤によって固着する。   The translucent cover 5 is formed in a dome shape using a polycarbonate resin containing a diffusing material. An annular extending portion 51 is provided at the opening end of the translucent cover 5, and the annular extending portion 51 is for engaging and positioning with the engaging claw portion 52 and the heat conduction mounting member 3. The convex portion 53 protrudes radially outward. Along with the engagement of the square hole 36 provided in the heat conduction mounting member 3 and the engaging claw portion 52, the inner periphery of the cylindrical portion 31 and the outer periphery of the annular extension portion 51 of the heat conduction mounting member 3 are formed. Secure with adhesive.

図2、図3、図5で、本実施形態に係るLED電球の組立て方法を説明する。
まず始めに、図5(a)に示すように絶縁筐体7の突出筒部71を放熱部材4の内部から底壁42の中央部にある開口を介して外部へと張り出させ、ブッシュ9を第一のネジ部74に螺合させて絶縁筐体7の当接部72とブッシュ9の鍔部93で放熱部材4の底部42を挟持する。これにより絶縁筐体7と放熱部材4とブッシュ9が一体に組立てられる。この状態で絶縁筐体7の突出筒部71の先端側を底面76として自立させて置くことができるので、次工程以降の組み立てが容易になる。先端の面積が小さい口金部材を絶縁筐体の突出部にある第2のネジ部75に螺合してしまうと、自立させて置くことができなくなる。
The assembly method of the LED bulb according to the present embodiment will be described with reference to FIGS.
First, as shown in FIG. 5A, the protruding cylindrical portion 71 of the insulating housing 7 is projected from the inside of the heat radiating member 4 to the outside through the opening in the central portion of the bottom wall 42, and the bush 9 Is screwed into the first screw portion 74, and the bottom portion 42 of the heat radiating member 4 is sandwiched between the contact portion 72 of the insulating housing 7 and the flange portion 93 of the bush 9. Thereby, the insulation housing | casing 7, the thermal radiation member 4, and the bush 9 are assembled integrally. In this state, the tip end side of the protruding cylindrical portion 71 of the insulating housing 7 can be placed independently as the bottom surface 76, so that the assembly after the next step is facilitated. If a base member having a small tip area is screwed into the second screw portion 75 in the protruding portion of the insulating housing, it cannot be placed independently.

次に、点灯回路基板6を回路基板ホルダ8の保持用爪部84と保持ガイドリブ85により保持し(図3)、点灯回路基板6に実装されている複数の電子部品61側を下面として絶縁筐体7の円筒部73の開口側から挿入し、回路基板ホルダ8の筒部82の外周に形成した係合爪86が絶縁筐体7の円筒部73に設けられた角孔78に係合するまで押し込む。   Next, the lighting circuit board 6 is held by the holding claws 84 and the holding guide ribs 85 of the circuit board holder 8 (FIG. 3), and the plurality of electronic components 61 mounted on the lighting circuit board 6 are used as the lower surface. An engaging claw 86 inserted from the opening side of the cylindrical portion 73 of the body 7 and formed on the outer periphery of the cylindrical portion 82 of the circuit board holder 8 engages with a square hole 78 provided in the cylindrical portion 73 of the insulating housing 7. Push in.

回路基板ホルダ8の上部には、熱伝導載置部材3を組み込む。その際、絶縁筐体7のネジ止め用の円筒形状のボス77に熱伝導載置部材3のネジ止め用の貫通孔33を合わせて位置決めして押し込む。また、絶縁筐体7の円筒部73の開口側端面79(図5(a))がストッパとなっているので、熱伝導載置部材3が、その開口側端面79に当接するまで熱伝導載置部材3を放熱部材4の内部へ押し込む。   The heat conduction mounting member 3 is incorporated in the upper part of the circuit board holder 8. At that time, the screwing through-hole 33 of the heat conduction mounting member 3 is aligned and pushed into the cylindrical boss 77 for screwing of the insulating housing 7. Further, since the opening-side end surface 79 (FIG. 5A) of the cylindrical portion 73 of the insulating housing 7 serves as a stopper, the heat-conducting mounting member 3 is thermally conductive until the heat-conducting mounting member 3 contacts the opening-side end surface 79. The mounting member 3 is pushed into the heat radiating member 4.

放熱部材4の開口側端部の内径と、熱伝導載置部材3の外径の寸法は、嵌合状態となる関係で接着剤等は一切使用しない。熱伝導載置部材3からの熱を放熱部材4に効率よく伝えるためである。   The inner diameter of the opening side end portion of the heat dissipating member 4 and the outer diameter of the heat conducting mounting member 3 are in a fitting state, so that no adhesive or the like is used. This is because the heat from the heat conductive mounting member 3 is efficiently transmitted to the heat radiating member 4.

放熱部材4と熱伝導載置部材3の嵌合が完了すると、図5(b)に示すように、主面に複数のLED素子21を実装して構成されたLED基板2を熱伝導載置部材3の上に載置する。この際に絶縁筐体7のネジ止め用の円筒形状のボス77と、LED基板2の外周部に穿設されたネジ止め用の略半円状の切り欠き部24を位置合わせし、ネジ25を締め付けることによって、LED基板2の主面の反対側の基板下面23と熱伝導載置部材3を密着させて、LED素子21からの発熱を効率よく熱伝導載置部材3に伝えることができる。   When the fitting of the heat dissipating member 4 and the heat conducting placement member 3 is completed, as shown in FIG. 5B, the LED substrate 2 configured by mounting a plurality of LED elements 21 on the main surface is placed on the heat conducting plate. Place on the member 3. At this time, the cylindrical boss 77 for screwing the insulating housing 7 and the substantially semicircular cutout portion 24 for screwing formed in the outer peripheral portion of the LED substrate 2 are aligned, and the screw 25 By tightening, the substrate lower surface 23 opposite to the main surface of the LED substrate 2 and the heat conductive mounting member 3 can be brought into close contact with each other, and heat generated from the LED elements 21 can be efficiently transmitted to the heat conductive mounting member 3. .

LED基板2の取り付けが完了したら、熱伝導載置部材3の貫通孔34(図2)を通して上方へ導いた図示しない点灯回路からの給電線をLED基板2の端子部に電気的に接続する。   When the attachment of the LED board 2 is completed, a power supply line from a lighting circuit (not shown) guided upward through the through hole 34 (FIG. 2) of the heat conducting placement member 3 is electrically connected to the terminal portion of the LED board 2.

そして、図5(c)に示すように、口金部材10を絶縁筐体7の突出部71にある第二のネジ部75に螺合し、図示しない点灯回路へ給電するための給電線を半田付けにより口金部材10に接合し電気的に接続する。図8に示すように、絶縁筐体7の第二のネジ部75に螺合した口金部材10と第一のネジ部74に螺合されて絶縁筐体7の当接部72と共に放熱部材4を挟持するブッシュ9の間には、LEDランプ1の軸長方向に間隙eを設けている。これは、電気配線を伴う口金部材10に放熱部材4を挟持するための機械的な負荷がかからないようにするためであり、口金部材10のこの負荷による歪みをなくし、歪みによる給電線の接合部への影響を排除して長期に亘り安定した給電が行えるようにしている。 Then, as shown in FIG. 5C, the base member 10 is screwed into the second screw portion 75 in the projecting portion 71 of the insulating housing 7, and a power supply line for supplying power to a lighting circuit (not shown) is soldered. By joining, the base member 10 is joined and electrically connected. As shown in FIG. 8, the heat dissipation member 4 together with the base member 10 screwed into the second screw portion 75 of the insulating housing 7 and the first screw portion 74 and screwed into the contact portion 72 of the insulating housing 7. A gap e is provided in the axial length direction of the LED lamp 1 between the bushes 9 that sandwich the LED lamp 1. This is to prevent a mechanical load for sandwiching the heat radiating member 4 from the base member 10 with the electrical wiring, and to eliminate the distortion of the base member 10 due to this load and to join the feeder line due to the distortion. The power supply can be stably supplied over a long period of time.

次に、図5(d)、図7に示すように、透光性カバー5の環状延出部51に設けた係合用の爪部52を熱伝導載置部材3に設けられた角孔36に上方より押し込んで係合させる。この係合と併せて、熱伝導載置部材3の筒部内周と前記環状延出部51の外周を接着剤によって固着する。   Next, as shown in FIGS. 5 (d) and 7, the engaging claw portions 52 provided in the annular extending portion 51 of the translucent cover 5 are provided with the square holes 36 provided in the heat conductive mounting member 3. And is engaged from above. Along with this engagement, the inner periphery of the cylindrical portion of the heat conducting mounting member 3 and the outer periphery of the annular extending portion 51 are fixed by an adhesive.

これにより、透光性カバー5の装着が完了しLEDランプ1が完成する。   Thereby, the mounting of the translucent cover 5 is completed, and the LED lamp 1 is completed.

1 LEDランプ
2 LED基板
21 LED素子
22 基板
23 基板下面
24 切り欠き部
25 ネジ
3 熱伝導載置部材
31 筒部
32 載置部
33 貫通孔
34 貫通孔
35 切り欠き
36 角孔
4 放熱部材
41 筒壁
42 底壁
43 放熱フィン
5 透光性カバー
51 環状延出部
52 爪部
53 凸部
6 点灯回路基板
61 電子部品
62 基板
63 角切り欠き部
7 絶縁筐体
71 突出筒部
72 当接部
73 円筒部
74 第一のネジ部
75 第二のネジ部
76 円筒部内壁
77 ボス
78 角孔
79 開口側端面
8 回路基板ホルダ
81 蓋部
82 筒部
83 底部
84 保持用爪部
85 保持ガイドリブ
86 係合爪
88 凸部
89 段差
9 ブッシュ
91 筒部
92 開口部
93 鍔部
94 ネジ部
10 口金部材
11 給電線用貫通孔
12 給電線保護リブ
101 ネジ部
102 先端部

DESCRIPTION OF SYMBOLS 1 LED lamp 2 LED board 21 LED element 22 Board | substrate 23 Substrate lower surface 24 Notch part 25 Screw 3 Heat conduction mounting member 31 Tube part 32 Mounting part 33 Through hole 34 Through hole 35 Notch 36 Square hole 4 Heat radiating member 41 Tube Wall 42 Bottom wall 43 Radiating fin 5 Translucent cover 51 Ring extending portion 52 Claw portion 53 Protruding portion 6 Lighting circuit board 61 Electronic component 62 Substrate 63 Corner notch portion 7 Insulating housing 71 Projecting cylinder portion 72 Abutting portion 73 Cylindrical part 74 First threaded part 75 Second threaded part 76 Cylindrical part inner wall 77 Boss 78 Square hole 79 Open side end face 8 Circuit board holder 81 Cover part 82 Cylindrical part 83 Bottom part 84 Holding claw part 85 Holding guide rib 86 Engagement Claw 88 Protruding portion 89 Step 9 Bush 91 Tube portion 92 Opening portion 93 Hook portion 94 Screw portion 10 Base member 11 Feed wire through hole 12 Feed wire protection rib 101 Screw portion 102 Tip portion

Claims (5)

LED素子が実装されたLED基板と、
点灯回路基板を収納する筒状の絶縁筐体と、
該絶縁筐体を収納する筒状の放熱部材を備えたLEDランプにおいて、
前記絶縁筐体の下端部を前記放熱部材の底壁開口部から外部に突出させるとともに、
該突出部に挟持部材を装着し、
該挟持部材と前記絶縁筐体の下端部とで前記放熱部材の底壁部を挟持し、
前記放熱部材と絶縁筐体を固定した状態で、
絶縁筐体の下端部を底面にして自立して載置可能であることを特徴とするLEDランプ。
An LED substrate on which an LED element is mounted;
A cylindrical insulating housing that houses the lighting circuit board;
In an LED lamp provided with a cylindrical heat dissipation member that houses the insulating housing,
While projecting the lower end of the insulating housing from the bottom wall opening of the heat dissipation member,
A clamping member is attached to the protruding portion,
The bottom wall portion of the heat radiating member is sandwiched between the clamping member and the lower end portion of the insulating casing,
With the heat dissipation member and the insulating housing fixed,
An LED lamp characterized in that it can be placed independently with the lower end of the insulating casing as a bottom surface.
前記絶縁筐体における前記放熱部材の底面側開口部からの突出部に、
前記挟持部材と離間させて口金部材を装着したことを特徴とする請求項1に記載のLEDランプ。
In the protrusion from the bottom side opening of the heat dissipation member in the insulating housing,
The LED lamp according to claim 1, wherein a base member is mounted apart from the sandwiching member.
前記挟持部材は環状をなし絶縁性材料からなることを特徴とする請求項1ないし2に記載のLEDランプ。   The LED lamp according to claim 1, wherein the clamping member is formed in an annular shape and is made of an insulating material. 前記挟持部材は、前記絶縁筐体における前記放熱部材の底面側開口部からの突出部の外周に螺合していることを特徴とする請求項1ないし3に記載のLEDランプ。 4. The LED lamp according to claim 1, wherein the clamping member is screwed onto an outer periphery of a protruding portion from a bottom surface side opening of the heat radiating member in the insulating casing. 前記口金部材は、前記絶縁筐体における前記放熱部材の底面側開口部からの突出部の外周に前記挟持部材と離間させて螺合していることを特徴とする請求項1ないし4に記載のLEDランプ。











The said base member is spaced apart from the said clamping member, and is screwed together in the outer periphery of the protrusion part from the bottom face side opening part of the said heat radiating member in the said insulation housing | casing. LED lamp.











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Publication number Priority date Publication date Assignee Title
JP2022024123A (en) * 2016-05-10 2022-02-08 三菱電機株式会社 Lighting device

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Publication number Priority date Publication date Assignee Title
WO2010090012A1 (en) * 2009-02-04 2010-08-12 パナソニック株式会社 Bulb-shaped lamp and lighting device
JP3172019U (en) * 2011-01-31 2011-12-01 光碁科技股▲ふん▼有限公司 Non-disposable LED lamp with laminated heat dissipation structure

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010090012A1 (en) * 2009-02-04 2010-08-12 パナソニック株式会社 Bulb-shaped lamp and lighting device
JP3172019U (en) * 2011-01-31 2011-12-01 光碁科技股▲ふん▼有限公司 Non-disposable LED lamp with laminated heat dissipation structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022024123A (en) * 2016-05-10 2022-02-08 三菱電機株式会社 Lighting device
JP7203931B2 (en) 2016-05-10 2023-01-13 三菱電機株式会社 lighting equipment

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