JP2014075400A - Electronic component mounting system and electronic component mounting method - Google Patents

Abstract

An electronic component mounting system and an electronic component mounting method capable of mounting a shield component with a correct height and sufficient joint strength are provided.
After mounting an electronic component 21 on a first solder part S1 for joining an electronic part and before mounting a shield part 22 on a second solder part S2 for joining the shield part, the shield part after mounting An inspection process for inspecting the presence / absence of foreign matter in the region 23 where the wall portion 22 is located is provided, and the substrate 3 determined to have no foreign matter in the inspection process prior to the second electronic component mounting process for mounting the shield component 22. The work process is set so that the shield part 22 is mounted on the. As a result, it is possible to prevent the solder joint from being executed in a state where foreign matter is present, and to mount the shield component 22 with a correct height.
[Selection] Figure 5

Description

  The present invention relates to an electronic component mounting system and an electronic component mounting method for manufacturing a mounting substrate by mounting electronic components on a substrate.

  An electronic component mounting system that manufactures a mounting board by mounting electronic components on a substrate is mainly an electronic component mounting line configured by connecting a plurality of component mounting facilities such as a solder printing device and an electronic component mounting device. By mounting the substrate to be mounted on the electronic component mounting line from the upstream side to the downstream side, component mounting operations such as solder printing and component mounting are sequentially performed on the substrate. Here, when the mounting board to be produced requires electromagnetic shielding, the shield part is mounted so as to cover a predetermined area where the electronic component is mounted on the mounting surface of the board, and is fixed to the board by soldering. (See Patent Documents 1 and 2).

Japanese Unexamined Patent Application Publication No. 2009-212412 JP 2010-171333 A

  However, including the above-described patent document examples, the conventional techniques have the following problems with respect to mounting quality by solder jointing of shield parts. In other words, on the mounting surface of the board that requires electromagnetic shielding, a shield electrode for joining shield components is formed separately from the component electrodes for joining general electronic components, and screen printing is performed in the solder supply process. The solder is collectively supplied to the component electrode and the shield electrode by such a method. Then, after the mounting of all the electronic components located in the shield region on the mounting surface is completed, the shield component is mounted so as to cover the shield region, and the substrate on which all the components are mounted is sent to the reflow process and heated. Thereby, the solder joining including the electronic component and the shield component is completed at once.

  Regarding the mounting quality of such a shield component, it is required that the shield component is correctly aligned on the mounting surface and that no gap is generated between the wall of the shield component and the shield electrode. Such a gap occurs when a shield part is mounted with foreign matter such as a falling part remaining on the shield electrode. The height of the shield component does not conform to the specified dimension, and a problem that causes interference with other components occurs when the substrate is mounted on the housing. Such defects have increased in frequency with the reduction in size and thickness of electronic devices such as mobile devices, and effective countermeasures have been demanded.

  Therefore, an object of the present invention is to provide an electronic component mounting system and an electronic component mounting method capable of mounting a shield component with a correct height dimension.

  The electronic component mounting system according to the present invention includes an electronic component mounting line including a plurality of facilities having a transporting means for transporting a substrate, and a shield component for covering the electronic component and the electronic component mounted on the substrate on the substrate. An electronic component mounting system to be mounted, wherein the electronic component mounting line forms a first solder portion and a second solder portion by printing solder on a substrate, and the first solder portion Including a first electronic component mounting apparatus for mounting an electronic component and a second electronic component mounting apparatus for mounting a shield component on at least the second solder part, and further, the electronic component is mounted on the first solder part. After mounting, before mounting the shield part on the second solder part, there is provided inspection means for inspecting the presence or absence of foreign matter in the region where the wall part of the shield part after mounting is located If it is determined that there is no foreign matter by said checking means, said second electronic component mounting apparatus for mounting the shielding member on the substrate.

  An electronic component mounting method according to the present invention includes a solder printing apparatus that includes a plurality of facilities having a conveying unit that conveys a substrate, and forms a first solder portion and a second solder portion by printing solder on the substrate. By an electronic component mounting line including a first electronic component mounting device for mounting an electronic component on the first solder portion and a second electronic component mounting device for mounting a shield component on at least the second solder portion. An electronic component mounting method for mounting an electronic component on a substrate and a shield component for covering the electronic component mounted on the substrate, wherein the first solder portion and the second solder portion are printed by printing solder on the substrate. A solder printing step for forming a first electronic component mounting step for mounting an electronic component on the first solder portion, and a second electronic portion for mounting a shield component on at least the second solder portion Before mounting the shield component on the second solder portion after mounting the electronic component on the first solder portion and before mounting the shield component on the first solder portion, the presence or absence of foreign matter in the region where the wall portion of the shield component after mounting is located An inspection step for inspecting, and in the second electronic component mounting step, a shield component is mounted on the substrate determined to have no foreign matter in the inspection step.

  According to the present invention, after the electronic component is mounted on the first solder portion for joining the electronic component, before the shield component is mounted on the second solder portion for joining the shield component, the wall of the shield component after mounting is mounted. An inspection process for inspecting the presence or absence of foreign matter in the region where the part is located is provided, and the shield component is mounted on the board determined to have no foreign matter in the inspection step prior to the second electronic component mounting process for mounting the shield component. By setting the work process as described above, it is possible to prevent the solder joint from being executed in a state where the foreign matter is interposed, and to mount the shield component with the correct height dimension.

Structure explanatory drawing of the electronic component mounting system of one embodiment of this invention The top view of the electronic component mounting apparatus and mounting state inspection apparatus which are used for the electronic component mounting system of one embodiment of this invention The perspective view of the mounting substrate manufactured by the electronic component mounting system of one embodiment of the present invention The block diagram which shows the structure of the control system of the electronic component mounting system of one embodiment of this invention Process explanatory drawing of the electronic component mounting method of one embodiment of this invention The top view of the electronic component mounting apparatus used for the electronic component mounting system of one embodiment of this invention The top view of the electronic component mounting apparatus used for the electronic component mounting system of one embodiment of this invention

  Next, embodiments of the present invention will be described with reference to the drawings. First, the configuration of the electronic component mounting system 1 will be described with reference to FIGS. In FIG. 1, an electronic component mounting system 1 includes an electronic component mounted on a substrate and the electronic component mounting line 1a including a plurality of facilities (substrate supply device M1 to substrate recovery device M9) each having a transfer means for transferring a substrate. It has a function of mounting a shield component for covering the electronic component mounted on the substrate. FIG. 2 shows a detailed configuration of the first electronic component mounting apparatus M5, the mounting state inspection apparatus M6, and the second electronic component mounting apparatus M7.

  The electronic component mounting line 1a includes a substrate supply device M1, a solder printing device M2, first electronic component mounting devices M3 to M5, a mounting state inspection device M6, a second electronic component mounting device M7, a reflow device M8, and a substrate recovery device. M9 is connected in series. The substrate supply device M1 sequentially supplies the work target substrate 3 (see FIG. 2) stored in a magazine or the like to the downstream device. The solder printing apparatus M2 prints paste-like solder for component joining on the substrate 3 carried in from the upstream side. As a result, a first solder portion S1 for joining electronic components and a second solder portion S2 (see FIGS. 3 and 5) for joining shield components are formed on the substrate 3. The first electronic component mounting apparatuses M <b> 3 to M <b> 5 have the same configuration, and electronic components are mounted on the first solder part S <b> 1 formed on the substrate 3.

  The mounting state inspection apparatus M6 includes an inspection unit that images the substrate 3 with a camera and performs a predetermined inspection, and targets the substrate 3 after the electronic component is mounted on the region where the shield component is bonded. Check for presence. If it is determined here that there is no foreign matter, the board 3 is sent to the second electronic component mounting apparatus M7, where the shield component is mounted on the second solder portion S2. The reflow device M8 heats the substrate 3 on which the electronic component and the shield component are mounted, thereby melting and solidifying the solder to perform solder bonding. The board collection device M9 receives and collects the board 3 after the component mounting work is completed.

  Here, the substrate 3 to be worked will be described with reference to FIG. FIG. 3A shows the substrate 3 before the shield component 22 is mounted. That is, a first solder portion S1 and a second solder portion S2 are formed in advance on the mounting surface 3a of the substrate 3 by screen printing by a solder printing apparatus M2, and a plurality of types of solder are formed on the first solder portion S1. An electronic component 21 is mounted. In order to electromagnetically shield these electronic components 21 on the mounting surface 3a, a shield component 22 is mounted so as to cover a shield target range where the electronic components 21 are mounted.

  The shield component 22 has a reverse box shape in which the wall portion 22a extends downward from the outer edge of the ceiling portion 22b having a shape corresponding to the shield target range, and the mounting surface 3a has a planar shape of the joint portion 22c of the wall portion 22a. Correspondingly, a region 23 where the joint portion 22c of the wall portion 22a lands in the mounted state is set. In the region 23, a second solder portion S2 for soldering the shield component 22 is formed by screen printing. As shown in FIG. 3B, the substrate 3 is sent to the reflow device M8 in a state where the shield component 22 is mounted on the mounting surface 3a.

  Next, the configuration of the first electronic component mounting apparatus M5, the mounting state inspection apparatus M6, and the second electronic component mounting apparatus M7 will be described. The first electronic component mounting apparatuses M3 to M5 have the same configuration, and in the process in which the substrate 3 after screen printing is transported through the first electronic component mounting apparatuses M3 to M5, each has a plurality of electronic components. It is sequentially mounted on the substrate 3. The configuration of the first electronic component mounting apparatus M5 will be described. In FIG. 2, the substrate 1A is provided with a substrate transport mechanism 2A in the X direction (substrate transport direction), and the substrate transport mechanism 2A transports the substrate 3 to be mounted with components and holds it at the mounting work position. . On both sides of the substrate transport mechanism 2A, a component supply unit 4 in which a plurality of tape feeders 5 are arranged in parallel is arranged. The tape feeder 5 feeds the electronic component to a pickup position by a component mounting mechanism described below by pitch-feeding the carrier tape holding the electronic component to be mounted.

  Y-axis tables 6A and 6B are disposed at both ends in the X direction of the base 1A. The X-axis tables 7A and 7B are installed on the Y-axis tables 6A and 6B so as to be horizontally movable in the Y direction. Has been. Further, the mounting head 8 is slidably mounted in the X direction on the X-axis tables 7A and 7B. The mounting head 8 is electronically moved from the pickup position of the tape feeder 5 by a suction nozzle (not shown) mounted at the lower end. The components are taken out and transferred and mounted on the substrate 3. The Y-axis tables 6A and 6B, the X-axis tables 7A and 7B, and the mounting head 8 constitute a component mounting mechanism. A component recognition camera 9 is disposed between each component supply unit 4 and the board transport mechanism 2A, and the mounting head 8 that has taken out the electronic component from the component supply unit 4 moves above the component recognition camera 9. As a result, the component recognition camera 9 captures and recognizes the electronic component held by the mounting head 8.

  A configuration of the mounting state inspection apparatus M6 will be described. The base 1B is provided with a substrate transport mechanism 2B in the X direction (substrate transport direction). The substrate transport mechanism 2B transports the substrate 3 to be inspected for mounting and positions it at the inspection work position. Y-axis tables 10A and 10B are disposed at both end portions in the X direction of the base 1B. An X-axis table 11 is installed on the Y-axis tables 10A and 10B so as to be horizontally movable in the Y direction. Yes. An inspection head 12 is mounted on the X-axis table 11 so as to be horizontally movable in the X direction via a mounting base portion 11a.

  The inspection head 12 incorporates a camera 32 that acquires an image for inspection. The Y-axis table 10A and the X-axis table 11 constituting the inspection head moving mechanism are driven to move the inspection head 12 onto the substrate 3 held by the substrate transport mechanism 2C, so that the camera 32 is operated after the upstream apparatus is operated. The board | substrate 3 is imaged and the image for inspecting the predetermined item prescribed | regulated previously is acquired. Here, as predetermined items, the presence or absence of foreign matter on the region 23, the component mounting state of the electronic component 21 mounted on the board 3 by the first electronic component mounting apparatuses M3 to M5, and the second formed by the solder printing apparatus M2 Inspection of the solder application state in the solder part S2 is prescribed.

  The configuration of the second electronic component mounting apparatus M7 will be described. A substrate transport mechanism 2C is disposed on the base 1C in the X direction (substrate transport direction), and the substrate transport mechanism 2C transports the substrate 3 on which components are to be mounted and positions and holds it at the mounting work position. Component supply units 14A and 14B are arranged on both sides of the board transport mechanism 2C, respectively. A plurality (two in this case) of tray feeders 15 are juxtaposed in the component supply unit 14A, and the tray feeder 15 serves as a component mounting mechanism described below for a tray 15a that stores a plurality of shield components in a planar arrangement. Supply. In addition, a plurality (three in this case) of parts feeders 16 are provided side by side in the component supply unit 14B, and the parts feeder 16 similarly supplies shield components to the component mounting mechanism.

  Y-axis tables 17A and 17B are disposed at both end portions in the X direction of the base 1C, and an X-axis table 18 is installed on the Y-axis tables 17A and 17B so as to be horizontally movable in the Y direction. Yes. Further, a mounting head 19 is mounted on the X-axis table 18 so as to be slidable in the X direction. The mounting head 19 is removed from the pickup position of the tray 15a or the parts feeder 16 by a suction nozzle (not shown) mounted at the lower end. The shield component is taken out and mounted on the substrate 3. The Y-axis tables 17A and 17B, the X-axis table 18, and the mounting head 19 constitute a component mounting mechanism. A component recognition camera 20 is disposed between the component supply units 14A and 14B and the board transport mechanism 2C, and the mounting head 19 that takes out the shield component from the component supply units 14A and 14B is located above the component recognition camera 20. By moving, the component recognition camera 20 captures and recognizes the shield component held by the mounting head 19.

  Next, the configuration of the control system will be described with reference to FIG. In FIG. 4A, each of the substrate supply device M1 to the substrate collection device M9 constituting the electronic component mounting line 1a is connected to each other and to the host system 30 via the communication network 31. Thereby, signal transmission / reception between the host system 30 and each device is possible. FIG. 4B shows a control system of the mounting state inspection apparatus M6. The control unit 40 has a function of controlling the inspection operation by the inspection head 12 by controlling the camera 32 and the inspection head moving mechanism (10A, 11), and exchange of signals with other devices via the communication unit 33. I do.

  The control unit 40 further includes a foreign matter inspection unit 41, a component mounting state inspection unit 42, and a solder application state inspection unit 43 as internal control functions. The foreign matter inspection unit 41 is mounted on the basis of an image of the substrate 3 captured by the camera 32 and before the shield component 22 is mounted on the second solder portion S2 after the electronic component 21 is mounted on the first solder portion S1. Processing for inspecting the presence / absence of foreign matter in the region 23 where the wall portion 22a of the subsequent shield component 22 is located is performed.

  Similarly, the component mounting state inspection unit 42 inspects the mounting state of the electronic component 21 mounted on the first solder unit S1, based on the image obtained by imaging the substrate 3 by the camera 32, that is, the electronic component 21 to be mounted. A process for determining pass / fail is performed by detecting the presence / absence, a positional deviation from the regular mounting position, and the like. Similarly, the solder application state inspection unit 43 performs a process of recognizing the quality of the second solder part S2 by recognizing the shape of the second solder part S2 based on an image obtained by imaging the substrate 3 by the camera 32.

  In the above configuration, the electronic component mounting line 1a shown in the present embodiment includes the solder printing apparatus M2 that forms the first solder portion S1 and the second solder portion S2 by printing solder on the substrate 3, and the first A first electronic component mounting device M3 to M5 for mounting the electronic component 21 on the solder portion S1 and a second electronic component mounting device M7 for mounting the shield component 22 on at least the second solder portion S2. It has become.

  Further, after the electronic component 21 is mounted on the first solder portion S1, and before the shield component 22 is mounted on the second solder portion S2, the foreign matter in the region 23 where the wall portion 22a of the shield component 22 after mounting is located. The presence or absence is inspected by the inspection means. If the inspection means determines that there is no foreign matter, then the substrate 3 is sent to the second electronic component mounting device M7, and the second electronic component mounting device M7 mounts the shield component 22 on the substrate 3.

  In the electronic component mounting line 1a shown in the present embodiment, the mounting state inspection device M6 disposed between the first electronic component mounting device M5 and the second electronic component mounting device M7 has the above-described inspection means. It corresponds to. And this inspection part inspects the mounting state of the electronic component 21 mounted on the first solder part S1 together with the inspection of the presence or absence of foreign matter in the region 23.

  Next, referring to FIG. 5, the electronic component mounting method for mounting the electronic component 21 on the substrate 3 and the shield component 22 for covering the electronic component 21 mounted on the substrate 3 by the electronic component mounting line 1a having the above-described configuration. explain. First, the substrate 3 supplied from the substrate supply device M1 is carried into the solder printing device M2, where solder is printed on the substrate 3. Thereby, as shown in FIG. 5A, the first solder portion S1 is formed on the mounting surface 3a of the substrate 3 corresponding to the electronic component 21 to be mounted, and the region 23 (see FIG. 3). The second solder portion S2 is formed in (solder printing process). The print pattern for the second solder part S2 is determined after appropriately selecting the print width and the print interval according to the thickness and shape of the wall part 22a of the shield part 22.

  Next, the board 3 is sequentially sent to the first electronic component mounting apparatuses M3 to M5, and as shown in FIG. 5B, the electronic component 21 is mounted on the first solder portion S1 (first electronic component mounting). Process). When the substrate 3 on which the electronic component 21 is mounted is carried into the mounting state inspection apparatus M6, first, the inspection unit having the above-described configuration is inspected for the presence of foreign matter in the region 23 (inspection process). In this inspection step, the mounting state of the electronic component 21 mounted on the first solder part S1 is also checked.

  In this inspection step, if it is determined that there is a foreign object that prevents normal mounting of the shield component 22 in the region 23, a notification to that effect is given. If it is determined that there is no such foreign matter, the board 3 is carried into the second electronic component mounting apparatus M7, and as shown in FIG. 6C, the region where the second solder portion S2 is formed. 23, the wall 22a is positioned and the shield component 22 is mounted on the substrate 3 (second electronic component mounting step).

  That is, in the electronic component mounting method shown in the present embodiment, the solder printing process for forming the first solder portion S1 and the second solder portion S2 by printing solder on the substrate 3, and the first solder portion S1. A first electronic component mounting process for mounting the electronic component 21, a second electronic component mounting process for mounting the shield component 22 on at least the second solder portion S2, and the electronic component 21 mounted on the first solder portion S1 And after the mounting, before mounting the shield part 22 on the second solder part S2, the inspection process for inspecting the presence / absence of foreign matter in the region 23 where the wall part 22a of the mounted shield part 22 is located is provided. Yes. In the second electronic component mounting step, the shield component 22 is mounted on the substrate 3 that is determined to have no foreign matter in the inspection step. Thereby, it is possible to prevent the solder component 22 and the substrate 3 from being soldered while the foreign material is present in the region 23, and to mount the shield component 22 with the correct height.

  In the above-described embodiment, the configuration in which the mounting state inspection device M6 as the inspection means for inspecting the presence or absence of the foreign matter in the region 23 is arranged is shown. However, the present invention is not limited to this configuration. You may make it allocate the function of a means to another apparatus. For example, as shown in FIG. 6, the succeeding device of the first electronic component mounting device M5 is a first electronic component mounting device M6A having the same configuration as the first electronic component mounting device M5, and is arranged on the downstream side of the shield. You may make it arrange | position the test | inspection part which has a function of the said test | inspection means in the 2nd electronic component mounting apparatus M7A which mounts the component 22. FIG.

  The second electronic component mounting apparatus M7A has a configuration in which an inspection head 19B mounted on the X-axis table 18B and moving in the X direction is added to the second electronic component mounting apparatus M7 shown in FIG. The inspection head 18B has a built-in camera 32 like the inspection head 12, and the second electronic component mounting device M7A has an inspection control function shown in FIG. In the inspection process shown in FIG. 5, the inspection unit disposed in the second electronic component mounting apparatus M7A inspects the presence or absence of foreign matter in the region 23.

  Further, as shown in FIG. 7, the first electronic component mounting device having a configuration in which the succeeding device of the first electronic component mounting device M5 includes a mounting head 8A for mounting the electronic component 21 only on one side of the front and rear. The apparatus M6B may be used, and the first electronic component mounting apparatus M6B may be provided with an inspection unit having the function of the above-described inspection means. In this example, one of the two mounting heads 8 provided in the first electronic component mounting apparatus M5 is replaced with an inspection head 8B. The inspection head 8B has a built-in camera 32 like the inspection head 12, and the first electronic component mounting apparatus M6B has an inspection control function shown in FIG. In the inspection process shown in FIG. 5, the inspection unit disposed in the first electronic component mounting apparatus M6B is inspected for the presence of foreign matter in the region 23.

  The electronic component mounting system and the electronic component mounting method of the present invention have the effect that the shield component can be mounted with the correct height and sufficient bonding strength, and the electronic component mounted on the substrate and the electronic component mounted on the substrate. This is useful in an electronic component mounting operation in which a shield component for covering the component is mounted.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting system 1a Electronic component mounting line 3 Board | substrate 21 Electronic component 22 Shield component 23 Area | region S1 1st solder part S2 2nd solder part M1 Board supply device M2 Solder printer M3, M4, M5, M6A, M6B 1st 1 electronic component mounting device M6 mounting state inspection device M7, M7A second electronic component mounting device M8 reflow device M9 substrate recovery device

Claims (10)

An electronic component mounting system for mounting an electronic component on a substrate and a shield component for covering the electronic component mounted on the substrate by an electronic component mounting line composed of a plurality of facilities having a transport means for transporting the substrate. ,
The electronic component mounting line forms a first solder portion and a second solder portion by printing solder on a substrate, and a first electronic device that mounts an electronic component on the first solder portion A component mounting device; and a second electronic component mounting device that mounts a shield component on at least the second solder portion;
Further, after the electronic component is mounted on the first solder portion and before the shield component is mounted on the second solder portion, the presence or absence of foreign matter is inspected in the region where the wall portion of the shield component after mounting is located. With inspection means,
If it is determined by the inspection means that there is no foreign matter, the second electronic component mounting apparatus mounts a shield component on a substrate.   The electronic component mounting system according to claim 1, wherein the inspection unit is an inspection device disposed between the first electronic component mounting device and the second electronic component mounting device.   2. The electronic component mounting system according to claim 1, wherein the inspection unit is an inspection unit arranged in the second electronic component mounting apparatus.   The electronic component mounting system according to claim 1, wherein the inspection unit is an inspection unit disposed in the first electronic component mounting apparatus.   The electronic component mounting system according to claim 1, wherein the inspection unit inspects a mounting state of the electronic component mounted on the first solder portion. A solder printing apparatus that includes a plurality of facilities having a transporting means for transporting a board, and forms a first solder part and a second solder part by printing solder on the board, and an electronic device on the first solder part. An electronic component mounting line including a first electronic component mounting device for mounting a component and a second electronic component mounting device for mounting a shield component on at least the second solder portion. An electronic component mounting method for mounting a shield component for covering a mounted electronic component,
A solder printing step of forming a first solder portion and a second solder portion by printing solder on a substrate; a first electronic component mounting step of mounting an electronic component on the first solder portion; A second electronic component mounting step of mounting a shield component on the second solder portion, and mounting after mounting the electronic component on the first solder portion and before mounting the shield component on the second solder portion Including an inspection process for inspecting the presence or absence of foreign matter in the region where the wall portion of the subsequent shield part is located,
In the second electronic component mounting step, a shield component is mounted on a substrate that is determined to have no foreign matter in the inspection step.   The electronic component mounting method according to claim 6, wherein in the inspection step, the inspection is performed by an inspection device disposed between the first electronic component mounting device and the second electronic component mounting device.   The electronic component mounting method according to claim 6, wherein in the inspection step, the inspection is performed by an inspection unit arranged in the second electronic component mounting apparatus.   The electronic component mounting method according to claim 6, wherein in the inspection step, the inspection is performed by an inspection unit disposed in the first electronic component mounting apparatus.   The electronic component mounting method according to claim 6, wherein in the inspection step, an inspection of a mounting state of the electronic component mounted on the first solder portion is also performed.

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