JP2014060253A - Substrate holding jig - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate holding jig which can suppress deformation of a circuit substrate by holding the circuit substrate in a manufacturing process of the circuit substrate so as to obtain a desired circuit substrate.SOLUTION: A substrate holding jig 1 includes: a first plate 2 which is formed by a magnetic material; a second plate 3 which has a housing hole 3a for housing a magnet 6 and is placed on the first plate 2; a spacer 4 which has predetermined thickness, has an opening 4a for housing a circuit substrate 10, and is placed on the second plate 3; a third plate 5 which is formed by the magnetic material, has an opening 5a for exposing a region 10a in which predetermined processing is performed on the circuit substrate 10, and is placed on the first plate 2 via the spacer 4; and the magnet 6 which is housed in the housing hole 3a. The circuit substrate 10 is housed in the opening 4a of the spacer 4 and held by the first plate 2 and the third plate 5 attracted with magnetic force of the magnet 6.

Description

  The present invention relates to a substrate holding jig for holding a circuit board in a circuit board manufacturing process.

  Circuit board manufacturing involves various processes such as pattern formation, electronic component mounting, and reflow. Therefore, the circuit board is transported to the line where each process is performed, and the circuit board is fixed in each process. It is necessary to do. As a substrate holding jig for holding a substrate used for such an application, for example, one disclosed in Patent Document 1 is known.

  The substrate holding jig includes a flat carrier formed of a magnesium material or an aluminum material, and a magnetic stainless steel frame-shaped pressing plate. In the center of the carrier, a recess having substantially the same shape as the outer shape of the printed board or the element-embedded board is formed. A plurality of magnets are buried in the outer periphery of the carrier outside the recess. The pressing plate is provided with a plurality of elastically deforming portions extending inward from the frame-shaped base. The base of the pressing plate is attracted to the carrier by the magnet while the substrate is placed in the concave portion of the carrier. Thereby, the edge part of the board | substrate placed in the recessed part is pressed by the elastic deformation part, and a board | substrate is hold | maintained by an elastic deformation part and a recessed part.

JP 2010-232414 A

  In the substrate holding jig according to the above-described patent document, the circuit board is fixed by an elastic deformation portion that presses the end portion. A jig used for manufacturing a printed wiring board is exposed to a high temperature or immersed in a chemical solution. Therefore, the flexibility of the elastically deformable portion may be deteriorated.

  The objective of this invention is providing the board | substrate holding jig which can suppress a deformation | transformation which arises in a circuit board and can obtain a required circuit board.

The substrate holding jig according to the present invention is:
A first plate made of a magnetic material;
A second plate having a receiving hole for receiving a magnet and placed on the first plate;
A spacer having a predetermined thickness, having an opening for receiving a circuit board, and being placed on the second plate;
A third plate made of a magnetic material, having an opening for exposing the circuit board, and disposed on the first plate via the spacer;
The magnet, which is housed in the housing hole of the second plate, for fixing the first plate and the third plate;
Have
The circuit board is held by the third plate and the first plate, or by the third plate and the second plate.

  According to this substrate holding jig, the second plate is placed on the first plate made of a magnetic material, and the magnet is accommodated in the accommodation hole provided in the second plate. The first plate is attracted by this magnet. A spacer having a predetermined thickness is placed on the second plate, and the circuit board is accommodated in an opening provided in the spacer. Further, when the spacer and the circuit board have the same thickness, a third plate made of a magnetic material is placed on the spacer and the circuit board. When the thickness of the spacer and the thickness of the circuit board are different, the third plate made of a magnetic material is placed on the larger thickness of the spacer and the circuit board. By pulling the third plate by the magnet in the housing hole, at least one of the second plate, the spacer, and the circuit board is held by the first and third plates.

  In addition, an opening is formed in the third plate, and the circuit board is exposed from this opening. The circuit board is processed by the area of the circuit board exposed through the opening while being held by the board holding jig.

  According to the above configuration, the circuit board is securely held between the first and third plates fixed to each other by the magnetic force of the magnet in a state exposed from the opening of the third plate. Therefore, the processing can be stably performed on the circuit board.

  In addition, by adjusting the thickness of the spacer, one or both of the circuit board and the spacer are held by the second and third plates. Thereby, the fixing state of the circuit board by the board holding jig can be selected. That is, the case where the circuit board is held and securely fixed by the second and third plates and the case where a gap is provided between the second and third plates and the circuit board can be selected. As described above, when a process in which the circuit board is exposed to a high temperature is executed, the amount of deformation such as warpage generated in the circuit board can be adjusted according to the specifications required for the circuit board.

  In addition, since the substrate holding jig is a component in which the components of the substrate holding jig such as the first to third plates are integrally assembled by the magnetic force of the magnet, the substrate holding jig can be easily disassembled and assembled. The substrate holding jig can be easily attached to and detached from the circuit board.

  According to a second aspect of the present invention, in the substrate holding jig according to the first aspect, the second plate 3 and the spacer 4 are made of a nonmagnetic material.

  According to this substrate holding jig, since the second plate and the spacer arranged between the first and third plates are formed of a non-magnetic material, the attractive force due to the magnet is influenced by the second plate and the spacer. Without acting, it acts only between the first and third plates made of magnetic material. Thereby, since at least one of the second plate, the spacer, and the circuit board is securely held by the first and third plates, the circuit board can be more reliably held.

  According to a third aspect of the present invention, in the substrate holding jig according to the first or second aspect, the second plate has a plurality of the accommodation holes, and the magnet has the plurality of the accommodation holes. It is accommodated in at least one.

  According to this substrate holding jig, the second plate is provided with a plurality of accommodation holes, and the first and third magnets are magnetized by at least one accommodation hole among the plurality of accommodation holes. A circuit board or the like is held between the plates. Thereby, the attractive force acting between the first and third plates, that is, the force for holding the circuit board between the first and second plates can be adjusted according to the number of magnets arranged in the accommodation hole. This makes it possible to arbitrarily and easily adjust the holding force of the circuit board by the board holding jig simply by changing the number of magnets according to the type of circuit board or the specifications required for the circuit board. For example, it is preferable to accommodate the magnet in a housing hole of 1/2 or more. Thereby, the first and third plates are fixed by an appropriate magnetic force.

  According to a fourth aspect of the present invention, in the substrate holding jig according to any one of the first to third aspects, the thickness of the spacer is smaller than the thickness of the circuit board.

  According to this board holding jig, the circuit board is pressed by the third plate. Therefore, even when the circuit board is exposed to a high temperature, for example, in a reflow process, the circuit board is unlikely to be warped or deformed.

  According to a fifth aspect of the present invention, in the substrate holding jig according to any one of the first to fourth aspects, the opening of the third plate partially exposes the circuit board, and the third plate A predetermined process is performed on the circuit board through the opening.

  According to the substrate holding jig, the circuit board is partially exposed from the opening of the circuit board, and a predetermined process is performed only on the exposed part through the opening. Therefore, a predetermined process can be stably performed on an arbitrary portion of the circuit board corresponding to the shape and size of the opening. Further, the circuit board is reliably pressed by the third plate.

The perspective view shown in the state which decomposed | disassembled the board | substrate holding jig and circuit board which concern on embodiment of this invention. The top view which shows the board | substrate holding jig and circuit board which concern on embodiment. FIG. 3 is a cross-sectional view taken along line AA in FIG. 2. The top view which shows a 1st plate and a magnet. The top view which shows a 2nd plate. The top view which shows a spacer. The top view which shows a 3rd plate. The top view which shows the board | substrate holding jig and circuit board which concern on a modification.

  Hereinafter, a substrate holding jig according to an embodiment of the present invention will be described with reference to the drawings. As shown in FIG. 1, the substrate holding jig 1 according to the present embodiment includes a first plate 2, a second plate 3, a spacer 4, a third plate 5, and a magnet 6. The substrate holding jig 1 according to this embodiment is used in, for example, a reflow process.

  The circuit board 10 is formed into a rectangular thin plate as a whole, and is formed of a plurality of products. Each product has the same plurality of conductor circuits. These are divided in a later process. A pad for connecting to an electronic component or the like is provided on one surface of the circuit board 10, and a substantially square area including the pad is set for each product as a processing area 10a to be subjected to reflow processing. ing. On the circuit board 10, a plurality of processing regions 10a (5 × 5 processing regions 10a in FIG. 2) arranged in a lattice shape are formed. One processing region group is formed by the predetermined number of processing regions 10a. In FIG. 2, three processing region groups are arranged side by side.

  The first plate 2 is made of a metal magnetic material such as stainless steel having ferromagnetism, for example, and is formed in a rectangular thin plate shape and a size larger than the circuit board 10. As shown in FIGS. 1 and 4, a square opening 2 a is formed in the center of the first plate 2 that is substantially the same size as the circuit board 10 and penetrates the first plate 2 in the thickness direction. Thereby, the 1st plate 2 is formed in frame shape. The first plate 2 may be a flat plate. When the first plate 2 has the opening 2a, the heat capacity of the first plate 2 is reduced. Such a substrate holding jig 1 is suitable for heat treatment.

  A large number of small magnets 6 are arranged in a staggered pattern on the long side surface of the first plate 2. Each magnet 6 is formed in a cylindrical shape and is fixed on the first plate 2.

  The second plate 3 is formed of a non-magnetic metal into a thin plate shape and has substantially the same outer shape and size as the first plate 2. As shown in FIGS. 1 and 5, a large number of circular accommodation holes 3 a for accommodating the magnets 6 are formed in the outer edge portion of the second plate 3 in the long side direction. These are arranged in a staggered manner and penetrate the second plate 3 in the thickness direction.

  The second plate 3 is placed on the first plate 2 with the position in the plane direction aligned so as to overlap with one surface of the first plate 2 without deviation. The magnet 6 described above is smaller than the diameter of the accommodation hole 3a, and the height of each magnet 6 is set to be equal to or less than the thickness of the second plate 3. In a state of being placed on the plate 2, it is arranged in each of the accommodation holes 3 a. Thereby, the magnet 6 which adsorb | sucks the 1st plate 2 is each accommodated in the accommodation hole 3a. The magnet 6 may not be accommodated in all the accommodation holes 3a.

  The spacer 4 is also formed in a thin plate shape using a non-magnetic metal and has substantially the same outer shape and size as the first and second plates 2 and 3. The spacer 4 has a predetermined thickness, and specifically, is formed to be slightly thinner than the thickness of the circuit board 10. An opening 4a for accommodating the circuit board 10 is formed in the center of the spacer 4, and this opening 4a penetrates the spacer 4 in the thickness direction, so that the spacer 4 has a frame shape. ing. The planar shape of the opening 4 a is substantially the same as that of the circuit board 10, and the size thereof is set to be slightly larger than the size of the circuit board 4.

  The spacer 4 is placed on the second plate 3, and the second plate 3 is located between the spacer 4 and the first plate 2. In addition, a large number of receiving holes 3 a of the second plate 3 are closed by outer edges of the spacer 4 in the long side direction. In addition, the circuit board 10 is disposed in the opening 4 a so that the surface opposite to the processing region 10 a faces the second plate 3 inside the opening 4 a of the spacer 4.

  Similar to the first plate 2, the third plate 5 is formed in a rectangular thin plate shape by a metal magnetic material such as stainless steel having ferromagnetism, and is formed in a slightly smaller size than the spacer 4 or the like. Thereby, the length in the long side direction and the short side direction of the third plate 5 are both shorter than the spacer 4 or the like. The third plate 5 has a plurality of openings 5a penetrating in the thickness direction. These openings 5 a are arranged in a lattice shape according to the arrangement of the plurality of processing regions 10 a of the circuit board 10. Each opening 5a is formed in the same square and the same size as the processing region 10a. Moreover, as FIG. 1 and FIG. 7 show, the three opening groups each comprised by the some opening 5a arrange | positioned at the grid | lattice form are arranged in parallel.

  The third plate 5 is placed on the circuit board 10. As described above, since the third plate 5 is made of a magnetic material, the third plate 5 is attracted by the magnetic force of the magnet 6 accommodated in each of the numerous accommodation holes 3a. As a result, the second plate 3 and the circuit board 10 disposed between the first and third plates 2 and 5 are held by the both 2 and 5. As described above, since the thickness of the spacer 4 is set to be thinner than the thickness of the circuit board 10, almost the entire area other than the processing area 10 a is the third plate on the surface of the circuit board 10 on the processing area 10 a side. 5, and the entire surface of the surface opposite to the processing region 10 a is in close contact with the second plate 3. In this state, the circuit board 10 is held by the board holding jig 1. The circuit board 10 thus held is placed in the processing region 10a with solder, and is then transported together with the substrate holding jig 1 and passed through a reflow furnace, whereby each processing region 10a is subjected to a reflow process.

  As described above, according to the substrate holding jig 1 according to the present embodiment, the circuit board 10 has the magnet 6 in a state where the processing region 10a to be reflowed is exposed from the opening 5a of the third plate 5. It is securely held between the first and third plates 2 and 5 that are attracted to each other by the magnetic force. Therefore, the reflow process can be stably performed on each processing region 10a of the circuit board 10.

  Further, the spacer 4 is formed so that the thickness of the spacer 4 is thinner than the thickness of the circuit board 10, and the opening 5 a of the third plate 5 has only the processing region 10 a depending on the processing region 10 a to which the reflow process is performed. It is formed to be exposed. Therefore, the third plate 5 is in contact with almost the entire surface other than the processing region 10a on the surface of the circuit board 10 on the processing region 10a side, and the entire surface of the circuit board 10 on the surface opposite to the processing region 10a is The circuit board 10 is held by the second and third plates 5 in contact with the two plates 3. Thus, by maximizing the contact area with the second and third plates 3 and 5 that hold the circuit board 10, even if the circuit board 10 is exposed to a high temperature in the reflow process, the circuit board 10 is warped. It is possible to suppress the occurrence of such deformation.

  Further, since the second plate 3 and the spacer 4 arranged between the first and third plates 2 and 5 are made of a non-magnetic material, the attractive force by the magnet 6 is influenced by the second plate 3 and the spacer 4. Without being affected, it acts only between the first and third plates 2 and 5 made of a magnetic material. Further, the magnets 6 are accommodated in all the accommodation holes 3 a formed in the second plate 3. Accordingly, the attractive force acting between the first and third plates 2, 5, that is, the force that holds the circuit board 10 between the second and third plates 3, 5 is maximized. And the circuit board 10 are securely held by the first and third plates 2 and 5, the circuit board 10 can be reliably held by the board holding jig 1.

  Further, since the substrate holding jig 1 is simply assembled integrally by the magnetic force of the magnet 6, the substrate holding jig 1 can be easily disassembled and assembled, and the substrate holding jig 1 can be attached to the circuit board 10. It can be easily attached and detached.

  In the above-described embodiment, the magnet 6 is described as being disposed in all of the large number of receiving holes 3a. However, the present invention is not limited thereto, and an arbitrary number of magnets 6 may be disposed. . When the magnets 6 are arranged in all the accommodation holes 3a, the maximum attractive force acts between the first and third plates 2 and 5, whereas the number of the magnets 6 is reduced, and both The attractive force between them, that is, the force that holds the circuit board 10 between the second and third plates 3 and 5 can be easily adjusted. Moreover, you may adjust the attractive force between the 1st and 3rd plates 2 and 5 using the magnet 6 with a stronger magnetic force, and a weaker magnet as the magnet 6. FIG. The attractive force between the two plates 2 and 5 may be adjusted by changing the thickness between the second plate 3 and the spacer 4 and changing the distance between the first and third plates 2 and 5.

  The spacer 4 may be held by the second and third plates 3 and 5 by making the thickness of the spacer 4 larger than the thickness of the circuit board 10. Accordingly, a gap is generated between the circuit board 10 and the second and third plates 3 and 5, and the deformation amount of the circuit board 10 accompanying the reflow process can be adjusted according to the size of the gap. . Further, the thickness of the spacer 4 may be set to be the same as the thickness of the circuit board 10, and both of them may be held by the second and third plates 3 and 5.

  In the above-described embodiment, the opening 5a of the third plate 5 is formed in a square shape and arranged in a lattice shape so as to match the arrangement and size of the processing region 10a of the circuit board 10. The opening of the three plates may be arbitrarily changed according to the processing area on the circuit board side.

  FIG. 8 shows a modification of the substrate holding jig 1 according to the above-described embodiment. The substrate holding jig 1a according to this modification is for holding a circuit board 20 that is larger than the circuit board 10 described above. Like the substrate holding jig 1 of the embodiment, the substrate holding jig 1a is first to third. Plates, spacers and magnets are provided.

  As shown in the figure, the circuit board 20 is formed in a substantially square shape, and more processing region groups are provided than the circuit board 10 including a plurality of processing regions 20a to be subjected to reflow processing. Yes. The substrate holding jig 1a is basically configured in the same manner as the substrate holding jig 1 of the embodiment, and includes a first plate and a second plate (both not shown) placed thereon, and a second plate. A spacer 14 placed on the plate and a third plate 15 placed on the circuit board 20 in a state where the circuit board 20 is disposed in the opening 14a of the spacer 14 are provided. These components are larger and have a substantially square planar shape according to the shape and size of the circuit board 20.

  Further, the second plate and the circuit board are generated by the attractive force generated between the first plate and the third plate 15 of the magnetic material by the magnets (none of which are shown) accommodated in the plurality of accommodation holes of the second plate. 20 is held between the first plate and the third plate 15. Further, the plurality of processing regions 20 a are exposed from the plurality of openings 15 a formed in the third plate 15 according to the plurality of processing regions 20 a of the circuit board 20. Other configurations are the same as those of the above-described embodiment.

  In the substrate holding jig 1a as described above, each component is configured in accordance with the shape and size of the circuit board 20, so that almost the entire surface other than the processing area 20a is formed on the surface of the circuit board 20 on the processing area 20a side. In addition, the circuit board 20 is held in a state where the entire surface opposite to the processing region 20a is in close contact with the second plate and the third plate 15, respectively. Therefore, even with a larger circuit board 20, deformation associated with the reflow process can be suppressed.

  According to the holding jig of the embodiment, the second plate having the accommodation hole for accommodating the magnet and the spacer having the opening for accommodating the circuit board are formed with the first plate and the third plate made of a magnetic material. It is sandwiched between plates. And the magnet is accommodated in the accommodation hole of the 2nd plate. The circuit board is accommodated in the opening of the spacer. The circuit board is sandwiched between the third plate and the first plate, or between the third plate and the second plate. Since the first plate and the third plate are attracted to each other by the magnet in the accommodation hole of the second plate, the circuit board is held by the board holding jig of the embodiment.

  In the above-described modification, the substrate holding jig 1a has been described as one for holding the larger circuit board 20, but a plurality of smaller circuit boards such as the circuit board 10 are held side by side in the openings 14a. You may make it do. In addition, it is possible to appropriately change the detailed configuration within the scope of the gist of the present invention.

DESCRIPTION OF SYMBOLS 1, 1a Board | substrate holding jig 2 1st plate 3 2nd plate 3a accommodation hole 4 Spacer 4a opening 5 3rd plate 5a opening 6 Magnet 10 Circuit board 14 Spacer 14a opening 15 3rd plate 15a opening 20 Circuit board

Claims (5)

A first plate made of a magnetic material;
A second plate having a receiving hole for receiving a magnet and placed on the first plate;
A spacer having a predetermined thickness, having an opening for receiving a circuit board, and being placed on the second plate;
A third plate made of a magnetic material, having an opening for exposing the circuit board, and disposed on the first plate via the spacer;
The magnet, which is housed in the housing hole of the second plate, for fixing the first plate and the third plate;
A substrate holding jig having
The circuit board is held by the third plate and the first plate, or by the third plate and the second plate.   The substrate holding jig according to claim 1, wherein the second plate and the spacer are formed of a nonmagnetic material.   3. The substrate holding jig according to claim 1, wherein the second plate has a plurality of the accommodation holes, and the magnet is accommodated in at least one of the plurality of accommodation holes. .   4. The substrate holding jig according to claim 1, wherein a thickness of the spacer is thinner than a thickness of the circuit board.   5. The substrate holding jig according to claim 1, wherein the opening of the third plate partially exposes the circuit board, and the circuit is opened through the opening of the third plate. A predetermined process is performed on the substrate.

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