JP2014011277A - Device manufacturing apparatus and manufacturing method of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To move a wafer holder from a processing position of the wafer holder, in which the water holder is currently placed, to another processing position even when a robot does not bring up the wafer holder.SOLUTION: A manufacturing apparatus manufacturing a device includes: a first placement area where a wafer holder transferred by the device manufacturing apparatus is placed; and a transfer path on which the wafer holder rolls thereby being transferred from the first placement area to a second placement area which is different from the first placement area.

Description

  The present invention relates to a device manufacturing apparatus and a manufacturing method thereof.

In the process of manufacturing a semiconductor device, in order to perform cleaning processing, drying processing, and film formation processing on a wafer, the wafer is generally held in a wafer carrier and transferred.
The following techniques are disclosed regarding a method for transporting a wafer carrier that is transported in a semiconductor manufacturing apparatus.
Prior art document 1 discloses a technique for sequentially transporting wafer cassettes in an inclined state in a cleaning apparatus in order to suppress the generation of watermarks during the cleaning process.

Japanese Patent Laid-Open No. 6-314677

  However, in order to automatically transfer the wafer holder to a predetermined position in the manufacturing apparatus as in the prior art, the robot is generally lifted and transported by a robot. As the number of robots increases, the manufacturing cost of the robots to transfer increases, and the mechanism to solve the problem of pressing costs necessary for main functions other than the transfer of wafer holders Not disclosed.

  The present invention provides a mechanism that allows a robot to move from a processing position of a currently held wafer holder to another processing position without lifting the wafer holder.

The present invention is a manufacturing apparatus for manufacturing a device, wherein the wafer holder includes: a first mounting area on which a wafer holder transported by the device manufacturing apparatus is mounted; and the first mounting area. It is characterized by comprising the first placement area by rolling and a transport path for transporting the wafer holder to a different second placement area.
The wafer holder is transported to the second placement area by rotating and rolling the wafer holder.
In addition, when both ends of the transfer path are not horizontal, a wafer holder is self-propelled and rolls on the transfer path.
Further, when the mounting area for mounting the wafer holder is not horizontal, the wafer holder is self-propelled and rolls on the mounting area.
In addition, at least the transfer path is provided with a pair of rails or a pair of grooves for contacting and transferring a portion where the wafer holder rolls.
The apparatus further includes a stop stopper that stops the wafer holder that rolls on the transfer path, and a drive mechanism that drives the stop stopper.
Further, the driving mechanism restarts the conveyance of the wafer holder stopped by the stop stopper by driving the stop stopper.

  A first placement area for placing a wafer holder to be transported by the device manufacturing apparatus; a second placement area different from the first placement area; the first placement area; A device manufacturing method in a device manufacturing apparatus comprising: a transport path that connects to a second placement area, wherein the wafer holder rolls on the transport path, whereby the first placement area The wafer holder is transferred to the second placement area.

  According to the present invention, it is possible to provide a mechanism that allows a robot to move from a processing position of a currently held wafer holder to another processing position without lifting the wafer holder.

It is a figure which shows one example of the wafer carrier of this invention. It is a figure which shows one example of the wafer carrier of this invention. It is a figure which shows one example of the wafer carrier of this invention. It is a figure which shows one example of the device manufacturing apparatus (front view) of this invention. It is a figure which shows one example of the device manufacturing apparatus (front view) of this invention. It is a figure which shows one example of the device manufacturing apparatus (top view) of this invention. It is a figure which shows one example of the device manufacturing apparatus (side view) of this invention. It is a figure which shows one example of the device manufacturing apparatus (front view) of this invention. It is a figure which shows one example of the device manufacturing apparatus (front view) of this invention. It is a figure which shows one example of the device manufacturing apparatus (front view) of this invention. It is a figure which shows one example of the device manufacturing apparatus (top view) of this invention.

Referring to FIG.
FIG. 1 is a diagram showing a schematic diagram of a configuration of a wafer holder transported by the device manufacturing apparatus of the present invention, and shows a view of the wafer holder viewed from the side.
1 is a view showing an example of a wafer holder according to the present invention.
A wafer holder for a solar cell wafer will be described as an example.
The material of the wafer holder is preferably a fluororesin. A material having properties such as chemical resistance is preferred.
101 is a crystalline (single crystal or polycrystal) silicon wafer of a semiconductor or a solar cell.

Reference numeral 102 denotes a base portion of the wafer holder. The wafer holder can be mounted on the mounting surface (horizontal surface) by the base portion. The base portion 102 is connected to the support portion 104.
The number of base parts is not limited to two as shown in FIG.
The pair of (both wheels) wheel portions are connected to the base portion.

  Reference numeral 103 denotes a lock portion of the wafer 101. The lock unit is accommodated (stored) in the support unit 104 so that the wafer does not come off from the support unit 104 when the lock unit rotates and rolls on the mounting surface on which the wafer holder is mounted. This is for fixing the wafer. Further, in order to accommodate (insert / remove) the wafer in / from the support portion 104, a mechanism for releasing the fixing (not shown) is provided. For example, a mechanism that allows the lock unit 103 to be attached to and detached from the wafer holder 1 or a mechanism that slides the lock unit in a predetermined direction may be used.

Reference numeral 104 denotes a support portion for the wafer 101. By supporting (holding) each of the wafers 101 accommodated by the support unit, the wafers can be arranged and accommodated at substantially equal intervals.
The support portion 104 is processed with a notch portion and a partition portion (not shown) so that a plurality of (for example, 25) wafers 101 can be evenly arranged at equal intervals.

Reference numeral 105 denotes a wheel portion. The wheel part 105 is connected to the base part 102. As a pair of (both wheels) wheels are aligned and rotate in the same rotational direction, the wafer holder 1 rolls on the mounting surface (horizontal surface), and the mounting surface (horizontal surface) Plane).
Thus, when the pair of (both wheels) wheel portions are aligned and rotate in the same rotation direction, the wafer 101 accommodated also rotates in the same rotation direction as the wheel portion 105.

Furthermore, by making the inner diameters of the pair (both wheels) equal, the wafer holder 1 can be moved straight on the mounting surface (horizontal surface) with the rotation of the pair of wheels (both wheels).
The shape of the wheel portion may be a tire shape with a cavity as shown in FIG. 2 or a disk shape without a cavity.

Furthermore, as shown in FIG. 7, the shape of the wheel portion is such that the portion where the wheel portion comes into contact with the placement surface is tapered so that the portion where the wheel portion comes into contact with the placement surface does not come into surface contact (there is a gradient). To). As shown in FIG. 11, when the traveling direction of the wafer holder 1 by rotation is not limited to a straight line but is to be changed in a different direction (cornering), the effective radius of both wheels is changed by centrifugal force. Thus, there is an effect that cornering can be facilitated without the wheel portion 105 derailing from the rail 108. Furthermore, since the contact portion between the wheel portion and the rail 108 is not in surface contact, the contact resistance is also low, so that deterioration and breakage due to wear of the contact portions can be reduced.
FIG. 2 will be described.

  As shown in FIG. 2, when the mounting surface on which the wafer holder 1 is placed is not horizontal (inclined) as shown in FIG. 2, the wafer holder 1 is placed by gravity. It is possible to roll on the surface. That is, when the mounting surface is not horizontal as shown in FIG. 2, the wafer holder 1 is transferred to a different position by gravity without requiring any power (electric power) or mechanism for running the wafer holder 1 outside. There is an effect that can be.

Further, by forming a mounting surface on which the wafer holder 1 that is not horizontal is placed in the main body of the semiconductor manufacturing apparatus 2, it is possible to transfer the wafer holder 1 into the main body of the semiconductor manufacturing apparatus 2 as well. Since a conventional transfer robot need not be installed, the manufacturing cost of the semiconductor manufacturing apparatus 2 can be reduced.
FIG. 3 will be described.

FIG. 3 is a diagram showing a schematic diagram of a configuration of a wafer holder conveyed by the semiconductor (solar cell) manufacturing apparatus of the present invention, and shows a view of the wafer holder as viewed from the front. Here, FIG. 3 shows a cross-sectional view of a cross section at the center of the wafer holder of FIG.
Here, an example is shown in which a rectangular wafer 101 that is a substrate for a solar cell is stored in the wafer holder 1.
The number of support portions 104 is not limited to six (six) as shown in FIG. 3, but may be any number that can support the wafers to be accommodated so as to be fixed.
In addition, the base part may also serve as the wheel part by processing the base part itself like the wheel part 105.

As shown in FIG. 1, it is preferable that the wheel portion is a pair (both wheels). However, the entire shape of the wafer holding portion is cylindrical (roll shape), and both wheels (not shown) are integrated wheels (ie, at least One wheel). The wafer holder 1 only needs to roll on the mounting surface (horizontal surface) on which it is mounted.
Moreover, although the number of wheel parts may be further added from a pair (both wheels), the number of parts increases and the cost increases.
FIG. 4 will be described.
FIG. 4 is a diagram showing a schematic diagram of the device configuration of the device manufacturing apparatus of the present invention. The figure which looked at the device manufacturing apparatus from the front is shown.
A solar cell manufacturing apparatus will be described as an example.

Reference numeral 1 denotes a wafer holder that accommodates a plurality of (for example, about 50) wafers, which are silicon wafers for solar cells, and is transported and processed together with the wafers in a solar cell manufacturing apparatus.
2 is a solar cell manufacturing apparatus.

  Reference numeral 3 denotes an operator (operator) who operates the solar cell manufacturing apparatus. The wafer holder is loaded into the solar cell manufacturing apparatus or the wafer holder is recovered from the solar cell manufacturing apparatus, and various processes are performed by the solar cell manufacturing apparatus. Let

Reference numeral 106 denotes a conveyance path. As shown in FIG. 4, the wafer holder 1 can be transferred from the first placement area 201 to the second placement area 202 different from the first placement area by rolling the wafer holder 1.
As the wafer holder 1 rotates on the transfer path 106 and rolls, the wafer holder in the first mounting area is transferred to the second mounting area.

  Further, when the both ends of the transfer path 106 are not horizontal (when the transfer path is inclined), the wafer holder is moved on the transfer path by gravity by itself, so that the wafer holder is placed in the mounting area. To different loading areas.

  Furthermore, even when the mounting area for mounting the wafer holder itself is not horizontal, the wafer holder can be moved and rolled over the mounting area to transfer the wafer holder to a different position in the mounting area. It is also possible to let them.

  Reference numeral 107 denotes a stop stopper that stops (stops) the wafer holder rolling on the transfer path at a predetermined position. Further, a drive mechanism for driving a stop stopper (not shown) is provided.

After the drive mechanism is stopped by the stop stopper 107, it is reversely driven in the direction to release the stop, whereby the conveyance (self-running) of the wafer holder stopped by the stop stopper is resumed.
Similarly, the wafer holder 1 can be transferred from the second placement area 202 to the third placement area 202 by rolling the wafer holder 1.
Similarly, the wafer holder 1 can be transferred from the third placement area 202 to the fourth placement area 202 by rolling the wafer holder 1.
Reference numeral 201 denotes a loading unit for loading a wafer holder into the solar cell manufacturing apparatus 2.
The loading unit 201 is a first placement area for placing a wafer holder to be transported.
A processing unit 202 transfers the wafer and the wafer holder, immerses them in the processing liquid 402 and the processing liquid 502, and performs wet processing.
The processing unit 202 is a second placement area for placing a wafer holder to be transported.
A drying chamber 203 dries the wafer wet with the processing liquid 502 and the wafer holder.
The drying chamber 203 is a third placement area for placing a wafer holder to be transferred.
A discharge unit 204 discharges the wafer holder from the solar cell manufacturing apparatus 2.
Alternatively, the discharge unit 204 is a fourth placement area for placing the wafer holder to be transported.
401 is a reaction tank. By immersing the wafer and the wafer holder in a reaction vessel, the substance on the wafer surface is subjected to chemical treatment (process treatment A) with a reaction solution.
Reference numeral 402 denotes a reaction solution, for example, a reaction solution for forming an oxide film on the surface of the wafer.

The kind of reaction liquid is a mixed solution of nitric acid (HNO3) and water. The type of reaction solution for forming a chemical oxide film on the surface of the wafer is not limited to a mixed solution of nitric acid and water. Any oxidizing solution such as a mixed solution of hydrogen peroxide and water may be used.
The concentration of nitric acid in the reaction solution in which the reaction solution is a mixed solution of nitric acid and water is 60 wt% or more, and preferably 68 wt%.
The liquid temperature of the reaction solution, which is a mixed solution of nitric acid and water, is preferably from room temperature (25 ° C.) to around the azeotropic temperature (120 ° C.) of nitric acid and water.

  By immersing the wafer in a reaction tank filled with a mixed solution of nitric acid and water for about 1 to 10 minutes, the front surface (or back surface) of the wafer from which silicon is exposed is coated to cover the surface of the wafer. A silicon oxide film having a thickness of about 1.5 nm is formed.

The other reaction liquid is, for example, a reaction liquid that removes the natural oxide film from the surface of the wafer and cleans it, and the reaction liquid is a mixed solution of boiling acid (HF) and water.
Reference numeral 403 denotes a heater (heater unit) for heating the atmosphere inside the drying chamber 203.
The rinse liquid adhering to the wafer and the wafer holder is evaporated by heating, and the wafer and the wafer holder are dried.

Reference numeral 501 denotes a rinse treatment tank. By immersing the wafer and the wafer holder in a reaction vessel, the substance on the wafer surface is subjected to chemical treatment (process treatment B) with a reaction solution. Here, the reaction liquid adhering to the wafer and the wafer holder is dissolved in the rinse liquid to wash away the components of the reaction liquid.
502 is a rinse liquid, for example, pure water.
FIG. 5 will be described.
FIG. 5 is a schematic diagram of the treatment tanks 401 and 501. The figure which looked at the device manufacturing apparatus of this invention from the front is shown.

  Reference numeral 301 denotes an expansion / contraction control mechanism (four) for individually controlling the length (extension / contraction) of the four ropes 302 one by one. By individually controlling the lengths of the ropes 302, the inclination angle can be adjusted to a desired angle so that the placement surface of the stacking plate can be inclined rather than horizontal.

  Reference numeral 302 denotes four ropes connected to the four corners of the loading plate, and the loading plate on which the wafer holder is placed is lowered so as to be immersed in the reaction tank (A) or held while being immersed in the reaction tank. (B), which is lifted from the reaction vessel after immersion (C).

Furthermore, in the case of (A), in order to stop the traveling of the traveling wafer holder and place the wafer holder at an appropriate position on the loading plate, the wafer holder is loaded in the traveling direction. It is possible to stand by inclining the mounting surface of the stacking plate so that the mounting surfaces of the plates face each other, not horizontally as in the case of (B).
Further, in the case of (C), by raising the side opposite to that in the case of (A), the mounting surface can be inclined and the running of the stationary wafer holder can be started again.
Reference numeral 303 denotes a loading plate on which the wafer holder is placed and the wafer holder is immersed in the reaction tank while the wafer holder is placed.
FIG. 6 will be described.
FIG. 6 is a diagram showing a schematic diagram of the device configuration of the device manufacturing apparatus of the present invention. The figure which looked at the device manufacturing apparatus from the upper surface is shown.

As shown in FIG. 6, at least on the transfer path 106, the wafer holder 1 contacts the part (a pair of wheel portions) on which the wafer holder 1 rolls in order to guide the route along which the wafer holder travels on the transfer path. A pair of guide paths (for example, rails or grooves) may be installed.
FIG. 7 will be described.
FIG. 7 is a diagram showing a schematic diagram of the processing tanks 401 and 501. The figure which looked at the device manufacturing apparatus of this invention from the side is shown.
FIG. 8 will be described.
FIG. 8 is a diagram showing a schematic diagram of the device configuration of the device manufacturing apparatus of the present invention. The figure which looked at the device manufacturing apparatus from the front is shown.

  When the wafer holder rotates and moves on the transfer path 106, the reaction liquid adhering (residual) to the wafer holder and the surface of the wafer due to immersion is scattered by the centrifugal force due to the rotation and is moved on the transfer path 106. Fall into.

Further, since the transport path 106 is inclined, the scattered reaction liquid can be easily recovered by providing the recovery port 405 for the scattered reaction liquid downstream (low position) of the transport path.
Furthermore, the reaction liquid 402 recovered from the recovery port is recovered in the reaction tank 402 through the recovery path 404, and the taken-out reaction liquid can be recovered without waste.
FIG. 9 will be described.
FIG. 9 is a diagram showing a schematic diagram of the device configuration of the device manufacturing apparatus of the present invention. The figure which looked at the device manufacturing apparatus from the front is shown.

Reference numeral 406 denotes a rotating roller unit that rotates the wafer holder. It has a structure on which the wafer holder 1 is mounted, and the wafer holder 1 can be rotated at the same position as the wafer holder 1 rolls. When the wafer holder 1 is immersed in the processing tank 401 and placed on the rotating roller unit, and the rotating roller unit rotates, the wafer holder also rotates (rotates together) due to contact resistance with the rotating roller unit. Since the wafer 101 can be easily rotated in the processing liquid 402 by the rotating roller portion, there is an effect of improving the uniformity of the reaction within the wafer surface. In addition, since the rotation of the wafer also has an effect of promoting the surface reaction, a desired reaction result can be obtained even if the reaction processing time is short. ) Can be shortened.
FIG. 10 will be described.
FIG. 10 is a diagram showing a modification of the device configuration of the device manufacturing apparatus of the present invention. The figure which looked at the device manufacturing apparatus from the front is shown.

  As shown in 106A, a footprint (installation area) is halved by providing a folding transfer path 106A (for example, a pair of rails) in the manufacturing apparatus for folding the wafer holder from the forward path to the return path. It can be a manufacturing device. In other words, since no external power (transport robot) is required for transport, a compact design can be achieved.

  As shown in FIG. 10, a discharge unit 204 for discharging the wafer holder from the solar cell manufacturing apparatus 2 can be arranged in the same unit as the input unit 201 for supplying the wafer holder to the solar cell manufacturing apparatus 2. .

  By inclining the transfer path 106, the wafer holder can be transferred in the horizontal direction without the need for external power, and by providing the return transfer path 106A, the wafer holder can be moved in the vertical direction without the need for external power. It can also be conveyed in the direction of gravity.

Further, when the drying chamber 203 is provided in the conveyance path 106 after the folding, the manufacturing apparatus of the present invention can be designed to have a two-layered laminated structure in which the reaction tank 401 and the drying chamber 203 are arranged vertically.
FIG. 11 will be described.
FIG. 11 shows a view of the device manufacturing apparatus as viewed from above.

As shown in FIG. 11, in the transport path 106 of the first solar cell manufacturing apparatus 2, a part (a pair of rolls) of the wafer holder 1 is guided to guide a route along which the wafer holder travels on the transport path. A pair of rails 108 (or a pair of grooves) for contacting and transporting the wheels) may be installed. Similarly, in the conveyance path 106 of the second solar cell manufacturing apparatus 4, in order to guide a route along which the wafer holder travels on the conveyance path, a portion (a pair of wheel portions) on which the wafer holder 1 rolls is provided. A pair of rails 108 (or a pair of grooves) for contacting and carrying are provided.
With this rail 108, the wafer holder 1 can be transported by rolling the wafer holder 1 from the first solar cell manufacturing apparatus 2 to the second solar cell manufacturing apparatus 4.
Further, by guiding the rail 108 to the solar cell manufacturing apparatus in another direction, the wafer holder can be transported to other solar cell manufacturing apparatuses.

  The shape of the wafer accommodated in the wafer carrier of the present invention is not limited to a polygonal wafer that is a square or octagon like a solar cell, but a memory, LSI, power device, CMOS sensor, acceleration sensor, liquid crystal, Even if it is a disk-shaped wafer like the electronic device formed on semiconductor substrates, such as LED, or a glass substrate, it has the said effect.

  The shape of the wafer manufactured by the device manufacturing apparatus of the present invention is not limited to a polygonal wafer that is a quadrangle or octagon like a solar cell, but a memory, LSI, power device, CMOS sensor, acceleration sensor, Even if it is a disk-shaped wafer like the electronic device formed on semiconductor substrates, such as a liquid crystal and LED, or a glass substrate, it has the said effect.

  The wafers accommodated in the wafer carrier of the present invention are not limited to silicon wafers, but are SiC (silicon carbide) wafers, sapphire glass wafers, compound semiconductor wafers such as GaP (gallium phosphide) wafers, GaAs (arsenic arsenide). Even the gallium wafer, InP (indium phosphide) wafer, and GaN (gallium nitride) wafer have the above-described effects.

  The wafer manufactured by the device manufacturing apparatus of the present invention is not limited to a silicon wafer, but a SiC (silicon carbide) wafer, a sapphire glass wafer, a compound semiconductor wafer, a GaP (gallium phosphide) wafer, GaAs ( Even the gallium arsenide wafer, InP (indium phosphide) wafer, and GaN (gallium nitride) wafer have the above effects.

1 Wafer holder (wafer carrier)
2 Semiconductor manufacturing equipment 3 Operator (operator)
101 Wafer (semiconductor or glass)
201 Wafer Holder Input Unit 202 Wafer Process Processing A Unit 203 Wafer Process Processing B Unit 201 Wafer Holder Discharge Unit 401 Processing Tank (Reaction Tank)
203 treatment room (drying room)
501 Treatment tank (cleaning tank)

Claims (8)

A manufacturing apparatus for manufacturing a device,
A first placement area for placing a wafer holder transported by the device manufacturing apparatus;
A transfer path for transferring the wafer holder from the first placement area to the second placement area different from the first placement area by rolling the wafer holder;
A device manufacturing apparatus comprising:   The device manufacturing apparatus according to claim 1, wherein the wafer holder in the first placement area is transported to the second placement area by rotating and rolling the wafer holder.   3. The device manufacturing apparatus according to claim 1, wherein when both ends of the transfer path are not horizontal, a wafer holder is self-propelled and rolls on the transfer path.   4. The wafer holder according to any one of claims 1 to 3, wherein when the placement area for placing the wafer holder is not horizontal, the wafer holder rolls on the placement area. The device manufacturing apparatus according to item 1.   5. A pair of rails or a pair of grooves are provided at least on the transfer path so as to contact and transfer a portion where the wafer holder rolls. The device manufacturing apparatus according to item. A stop stopper for stopping the wafer holder rolling on the transfer path;
A drive mechanism for driving the stop stopper;
The device manufacturing apparatus according to claim 1, further comprising:   The device manufacturing apparatus according to claim 6, wherein the driving mechanism restarts the conveyance of the wafer holder stopped by the stop stopper by driving the stop stopper. A first placement area for placing a wafer holder carried by the device manufacturing apparatus; a second placement area different from the first placement area; the first placement area; and the second placement area. A method of manufacturing a device in a device manufacturing apparatus comprising: a transport path that connects between the mounting areas of
A manufacturing method, wherein the wafer holder is transferred from the first placement area to the second placement area by rolling the wafer holder along the transfer path.

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