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JP2014002897A - Lamp with ferrule and lighting fixture - Google Patents

Lamp with ferrule and lighting fixture Download PDF

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Publication number
JP2014002897A
JP2014002897A JP2012136891A JP2012136891A JP2014002897A JP 2014002897 A JP2014002897 A JP 2014002897A JP 2012136891 A JP2012136891 A JP 2012136891A JP 2012136891 A JP2012136891 A JP 2012136891A JP 2014002897 A JP2014002897 A JP 2014002897A
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Prior art keywords
insulating case
main body
lamp
circuit board
cap
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Japanese (ja)
Inventor
Takushi Takenaga
拓志 武長
Takuro Hiramatsu
拓朗 平松
Tomoaki Shimizu
智章 清水
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Toshiba Lighting and Technology Corp
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Toshiba Lighting and Technology Corp
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Priority to JP2012136891A priority Critical patent/JP2014002897A/en
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Abstract

【課題】点灯装置から発生する熱を効率よく放熱させることが可能な口金付ランプおよびこの口金付ランプを用いた照明器具を提供する。
【解決手段】口金付ランプ10は、熱伝導性を有する本体12、電気絶縁性を有する絶縁ケース13、回路基板14a、口金部材16を具備する。本体12は、一端部側に固体発光素子11が配設され、内周面が2面以上の平面部f、fを有する筒状の収納部12cを内部に形成する。絶縁ケース13は、前記収納部内に収納され、外周面が収納部の平面部と接する2面以上の平面部f´、f´を有する筒体で構成される。回路基板14aは、固体発光素子の点灯装置14を構成する電子部品が配設され、絶縁ケースの内部に配設される。口金部材16は、本体の他端部側に配設される。
【選択図】 図1
A lamp with a cap capable of efficiently dissipating heat generated from a lighting device, and a lighting fixture using the lamp with the cap.
A lamp with a cap 10 includes a main body 12 having thermal conductivity, an insulating case 13 having electrical insulation, a circuit board 14a, and a cap member 16. The main body 12 is provided with a solid light emitting element 11 on one end portion side, and has a cylindrical storage portion 12c having two or more plane portions f and f having an inner peripheral surface. The insulating case 13 is housed in the housing portion, and is configured by a cylindrical body having two or more plane portions f ′ and f ′ whose outer peripheral surface is in contact with the plane portion of the housing portion. The circuit board 14a is provided with electronic components constituting the lighting device 14 for a solid state light emitting device, and is provided inside the insulating case. The base member 16 is disposed on the other end side of the main body.
[Selection] Figure 1

Description

本発明の実施形態は、発光ダイオード等の固体発光素子を光源とする口金付ランプおよび照明器具に関する。   Embodiments described herein relate generally to a lamp with a base and a lighting fixture that use a solid light emitting element such as a light emitting diode as a light source.

従来、固体発光素子である発光ダイオード(以下「LED」と称す)を光源とした電球形LEDランプ等の口金付ランプにおいては、LEDの発光効率を向上させるため、点灯時に発生する熱を金属筐体からなる本体から外部に放熱させることが行われている。また同時に、LEDを点灯制御するための点灯装置においては、点灯回路を構成する電子部品の温度が点灯時に上昇して部品の劣化等が生じ信頼性を損なう恐れがあり、点灯装置から発生する熱を本体から放熱させることが行われている。   Conventionally, in a lamp with a cap such as a light bulb shaped LED lamp that uses a light emitting diode (hereinafter referred to as “LED”) as a solid light emitting element as a light source, in order to improve the light emission efficiency of the LED, Heat is dissipated from the body, which is a body, to the outside. At the same time, in the lighting device for controlling the lighting of the LED, the temperature of the electronic components constituting the lighting circuit may rise during lighting, causing deterioration of the components and the like, which may impair reliability, and heat generated from the lighting device. Heat is released from the main body.

特開2010−129414号公報JP 2010-129414 A

しかしながら、点灯装置を金属筐体である本体内に収納するためには、点灯装置との電気絶縁を図るため、本体に樹脂製の絶縁ケースを収納し、この絶縁ケース内に点灯装置を収納する必要がある。一般的には、図3(b)に示すように、本体12の内部に円筒状の孔からなる収納部12cを形成し、この収納部内に同じく円筒体からなる絶縁ケース13を挿入して嵌合し、この絶縁ケース内に点灯装置14の回路基板14aを収納している。そして、回路基板14aと絶縁ケース13の内面とを熱伝導部材15によって熱的に連結し、点灯装置14から発生する熱を絶縁ケース13から本体12に熱伝導させ、外部に放熱させている。   However, in order to store the lighting device in the main body which is a metal casing, in order to achieve electrical insulation from the lighting device, a resin insulating case is stored in the main body, and the lighting device is stored in the insulating case. There is a need. In general, as shown in FIG. 3 (b), a housing portion 12c made of a cylindrical hole is formed inside the main body 12, and an insulating case 13 made of a cylindrical body is inserted into the housing portion. The circuit board 14a of the lighting device 14 is accommodated in the insulating case. And the circuit board 14a and the inner surface of the insulating case 13 are thermally connected by the heat conducting member 15, and the heat generated from the lighting device 14 is conducted from the insulating case 13 to the main body 12 and radiated to the outside.

しかしながら、絶縁ケース13と収納部12cは円筒体で構成されているために、平板からなる回路基板14aと円筒体からなる絶縁ケース13および収納部12cとの距離寸法が長くなる。このため、回路基板14aと絶縁ケース13の内面とを熱的に連結するための熱伝導部材15の使用量が多く必要となる。特に熱伝導部材は、熱伝導性に優れた高価なシリコーン樹脂製の接着剤を用いることが多く、コストアップの要因になっていた。このため、この種の固体発光素子を光源とする口金付ランプにおいては、回路基板14aと絶縁ケース13および収納部12cとの距離寸法を如何にして短く構成し、熱伝導部材の使用量を減少させるかが重要な課題となっている。   However, since the insulating case 13 and the storage portion 12c are formed of a cylindrical body, the distance between the flat circuit board 14a and the cylindrical insulating body 13 and the storage portion 12c is increased. For this reason, the usage-amount of the heat conductive member 15 for thermally connecting the circuit board 14a and the inner surface of the insulating case 13 is needed. In particular, the heat conductive member often uses an expensive silicone resin adhesive having excellent heat conductivity, which has been a factor in increasing costs. For this reason, in a lamp with a base that uses this type of solid light-emitting element as a light source, the distance between the circuit board 14a, the insulating case 13 and the storage portion 12c can be made short to reduce the amount of heat conduction member used. It has become an important issue.

本発明は、上記の課題に鑑みてなされたもので、回路基板と絶縁ケースおよび収納部との距離寸法を短く構成することが可能な口金付ランプおよびこの口金付ランプを用いた照明器具を提供しようとするものである。   The present invention has been made in view of the above problems, and provides a lamp with a base capable of reducing the distance between a circuit board, an insulating case, and a storage portion, and a lighting fixture using the lamp with the base. It is something to try.

本発明の実施形態における口金付ランプは、熱伝導性を有する本体、電気絶縁性を有する絶縁ケース、回路基板、口金部材を具備する。本体は、一端部側に固体発光素子が配設され、内周面が2面以上の平面部を有する筒状の収納部を内部に形成する。絶縁ケースは、前記収納部内に収納され、外周面が収納部の平面部と接する2面以上の平面部を有する筒体で構成される。回路基板は、固体発光素子の点灯装置を構成する電子部品が配設され、絶縁ケースの内部に配設される。口金部材は、本体の他端部側に配設される。   The lamp with a cap in the embodiment of the present invention includes a main body having thermal conductivity, an insulating case having electrical insulation, a circuit board, and a cap member. The main body includes a solid-state light emitting element on one end side, and forms a cylindrical storage portion having an inner peripheral surface having two or more plane portions inside. The insulating case is configured by a cylindrical body that is housed in the housing portion and that has two or more plane portions whose outer peripheral surfaces are in contact with the plane portion of the housing portion. The circuit board is provided with electronic components constituting a lighting device for a solid state light emitting device, and is provided inside the insulating case. The base member is disposed on the other end side of the main body.

本実施形態によれば、回路基板と絶縁ケースおよび収納部との距離寸法を短く構成することが可能な口金付ランプおよびこの口金付ランプを用いた照明器具を提供することが可能になる。   According to the present embodiment, it is possible to provide a lamp with a base capable of reducing the distance between the circuit board, the insulating case, and the storage portion, and a lighting fixture using the lamp with the base.

本発明の実施形態である口金付ランプの縦断面図。The longitudinal cross-sectional view of the lamp | ramp with a base which is embodiment of this invention. 同じく口金付ランプを示し、(a)は絶縁ケースの斜視図、(b)は絶縁ケースと収納部との接触状態を、一部を断面して示す斜視図。なお、本図2(b)において、本体外周部の放熱フィンは省略して示した。The lamp | ramp with a nozzle | cap | die is similarly shown, (a) is a perspective view of an insulation case, (b) is a perspective view which partially shows the contact state of an insulation case and a storage part. In FIG. 2B, the heat dissipating fins on the outer periphery of the main body are omitted. 同じく口金付ランプを示し、(a)は図1のa−a線に沿う断面図、(b)は本(a)図に相当する部分の従来例を示す図。なお、本図3(a)(b)において、本体外周部の放熱フィンは省略して示した。The lamp | ramp with a nozzle | cap | die is similarly shown, (a) is sectional drawing which follows the aa line | wire of FIG. 1, (b) is a figure which shows the prior art example of the part corresponded to this (a) figure. In FIGS. 3A and 3B, the heat dissipating fins on the outer periphery of the main body are omitted. 同じく口金付ランプを光源とした照明器具を概略的に示す縦断面図。The longitudinal cross-sectional view which shows roughly the lighting fixture which similarly used the lamp | ramp with a base as a light source. 同じく口金付ランプの変形例を示し、(a)は第1の変形例を示す図2(b)に相当する斜視図、(b)は第2の変形例を示す図3(a)に相当する断面図、(c)は第3の変形例を示す図3(a)に相当する断面図。なお、本図5(a)(b)(c)において、本体外周部の放熱フィンは省略して示した。Similarly, a modification of the lamp with cap is shown, (a) is a perspective view corresponding to FIG. 2 (b) showing the first modification, and (b) is equivalent to FIG. 3 (a) showing the second modification. (C) is sectional drawing equivalent to FIG. 3 (a) which shows the 3rd modification. 5A, 5B, and 5C, the heat dissipating fins on the outer periphery of the main body are omitted.

以下、本発明に係る口金付ランプおよびこの口金付ランプを用いた照明器具の実施形態について説明する。先ず口金付ランプの構成につき説明する。   Hereinafter, embodiments of a lamp with a cap and a lighting fixture using the lamp with a cap according to the present invention will be described. First, the structure of the lamp with cap is described.

本実施形態の口金付ランプは、LEDを光源とする定格電圧100V用で、既存の一般白熱電球に代替が可能な口金付ランプを構成するもので、図1に示すように、口金付ランプ10は、一端部側に固体発光素子11が配設され、収納部12cを内部に形成した本体12、本体の収納部内に収納される絶縁ケース13、固体発光素子11の点灯装置14を構成する電子部品が配設され、絶縁ケース13の内部に配設される回路基板14a、本体12の他端部側に配設される口金部材16、本体12の光源部Aを覆うようにして設けられるグローブ17等で構成する。   The lamp with cap of this embodiment is for a rated voltage of 100 V using an LED as a light source, and constitutes a lamp with a cap that can be replaced with an existing general incandescent lamp. As shown in FIG. The solid light-emitting element 11 is disposed on one end side, the main body 12 in which the storage part 12c is formed, the insulating case 13 stored in the storage part of the main body, and the electrons constituting the lighting device 14 of the solid light-emitting element 11 A globe provided with parts to cover the circuit board 14a disposed inside the insulating case 13, the base member 16 disposed on the other end side of the main body 12, and the light source portion A of the main body 12. 17 etc.

固体発光素子11は、本実施形態では、同一性能を有する複数個のLEDで構成する。本実施形態では、4個の青色LEDチップと黄色蛍光体からなる高輝度・高出力のSMD(Surface Mount Device)タイプの白色を発光するLEDからなる。このLED11は、黄色蛍光体に対し青色LEDチップから放射される青色光の一部が透過されるとともに、黄色蛍光体によって青色光を黄色光に変換し、透過した青色光と黄色光が混光して白色の光を放射する。なお、LED11は、複数のLEDチップによって構成したCOB(Chip on Board)タイプであってもよい。   In the present embodiment, the solid light emitting element 11 is composed of a plurality of LEDs having the same performance. In the present embodiment, it is composed of a high-luminance, high-power SMD (Surface Mount Device) type white LED that includes four blue LED chips and a yellow phosphor. The LED 11 transmits part of the blue light emitted from the blue LED chip to the yellow phosphor, converts the blue light into yellow light by the yellow phosphor, and the transmitted blue light and yellow light are mixed. And emits white light. The LED 11 may be a COB (Chip on Board) type constituted by a plurality of LED chips.

各LED11は、基板11aに実装されて構成される。基板11aは、熱伝導性の良好な金属、本実施形態では略円板状をなすアルミニウムで構成され、その表面(図1における上方の面)にシリコーン樹脂等の電気絶縁層を介して銅箔等からなる配線パターンが形成され、この配線パターン上に4個のLED11が略同心円状をなすように略等間隔に実装して配設される。   Each LED 11 is configured by being mounted on a substrate 11a. The substrate 11a is made of a metal having good thermal conductivity, which is substantially disk-shaped aluminum in the present embodiment, and a copper foil with an electric insulating layer such as a silicone resin on the surface (upper surface in FIG. 1). A wiring pattern made up of, for example, is formed, and four LEDs 11 are mounted and arranged on the wiring pattern at substantially equal intervals so as to form a substantially concentric circle shape.

また、基板11aには、配線パターンおよび電気絶縁層を貫通する貫通孔11bを形成する。この貫通孔は、各LED11へ電力を供給するための電線wを基板11aの裏面から表面に向けて挿通させ、コネクタ11cに接続させるための貫通した孔である。なお、基板11aの裏面には電気絶縁層が形成されている。上記のように、各LED11を実装した基板11aは、円形基板の中心軸に光軸xを有する光源体として構成され、本体12の一端部側に配設される。   Further, the substrate 11a is formed with a through hole 11b penetrating the wiring pattern and the electrical insulating layer. This through hole is a through hole through which an electric wire w for supplying power to each LED 11 is inserted from the back surface of the substrate 11a toward the front surface and connected to the connector 11c. An electrical insulating layer is formed on the back surface of the substrate 11a. As described above, the substrate 11 a on which each LED 11 is mounted is configured as a light source body having the optical axis x on the central axis of the circular substrate, and is disposed on one end side of the main body 12.

本体12は、熱伝導性の良好な部材、本実施形態ではアルミニウムで構成され、軸心y−yに対する横断面形状が略円形をなし、一端部側が径大になるようにして閉塞され、その閉塞された表面側に凹嵌部からなり、基板11aを支持するための平坦な面を有する支持部12aが形成される。他端部側は、径小になるようにして開口部12bが形成される。そして、本体12の外周面は、径大な一端部側から径小な他端部側に向かい順次直径が小さくなる略円錐状のテーパー面をなし、外観が一般白熱電球におけるネック部のシルエットに近似させた形状に構成される。   The main body 12 is composed of a member having good thermal conductivity, which is aluminum in this embodiment, and has a substantially circular cross-sectional shape with respect to the axis yy, and is closed so that one end side has a large diameter. A support portion 12a having a flat surface for supporting the substrate 11a is formed on the closed surface side. The opening 12b is formed on the other end side so as to have a small diameter. And the outer peripheral surface of the main body 12 has a substantially conical tapered surface, the diameter of which gradually decreases from one large end to the other small end, and the appearance is a silhouette of a neck portion of a general incandescent light bulb. It is configured in an approximated shape.

また、本体12の内部には、一端部側の支持部12aと他端部側の開口部12bにわたって筒状の孔からなる収納部12cが一体に形成される。収納部12cは、内周面が2面以上の平面部f、fを有する筒状をなす孔、本実施形態では、図2(b)に示すように、長手方向に沿い角cで連続した2つの平面部f、fで構成され、筒状をなす孔の横断面形状が2等分した半矩形と半円とが連続した略扇形をなす形状に構成される。なお、収納部12cを構成する筒状の孔の軸心は、本体12の軸心y−yと略一致するように形成される。   Further, inside the main body 12, a storage portion 12c formed of a cylindrical hole is integrally formed across the support portion 12a on one end side and the opening portion 12b on the other end side. The storage portion 12c is a cylindrical hole having two or more plane portions f and f whose inner peripheral surface is two or more. In this embodiment, as shown in FIG. 2B, the storage portion 12c is continuous at an angle c along the longitudinal direction. It is composed of two flat portions f and f, and is formed into a substantially fan-shaped shape in which a semirectangular shape and a semicircular shape in which a cross-sectional shape of a cylindrical hole is equally divided into two. In addition, the axial center of the cylindrical hole which comprises the accommodating part 12c is formed so that it may correspond with the axial center yy of the main body 12 substantially.

これら構成の本体12は、その外周面にアクリル焼付け塗装がなされ、メタリックシルバー色または白色等の外観を有して構成される。なお、本体12は、LED11から発生する熱を放熱させるための金属筐体としての機能を有することから、外周面に多数の放熱フィンや多数の凹凸部を一体に形成したり、さらには、梨地加工等を施して、外表面の面積を大となすように構成するとよい。本実施形態においては、外周面の一端から他端に向かい放射状に突出する多数の放熱フィン12dを一体に形成した。   The main body 12 having these configurations is configured such that the outer peripheral surface thereof is baked with acrylic and has an appearance such as metallic silver or white. The main body 12 has a function as a metal casing for dissipating the heat generated from the LED 11, so that a large number of heat radiation fins and a large number of uneven portions are integrally formed on the outer peripheral surface. It is good to comprise so that an area of an outer surface may be enlarged by giving a process etc. In the present embodiment, a large number of radiating fins 12d that project radially from one end of the outer peripheral surface to the other end are integrally formed.

上記構成の本体12は、例えば、鋳造、鍛造または切削加工等で加工され、内部に空洞のない熱容量の大きい肉厚の金属筐体となるように構成される。この際、収納部12cは、その平坦な平面部f、fが、後述する絶縁ケース13の平坦な平面部f´、f´と接触する伝熱面となるもので、伝熱面が平面で構成されることから後述する回路基板14aと絶縁ケース13および収納部12cとの距離寸法を短く構成することが可能になる。また同時に、この伝熱面を直線(平面)で形成できることから設計が容易になり、さらに、切削等の加工で伝熱面の平坦度を容易に向上させることができ、伝熱面の接触部分における伝熱性能を向上させることが可能になる。   The main body 12 having the above-described configuration is processed, for example, by casting, forging, cutting, or the like, and is configured to be a thick metal casing having no internal cavity and a large heat capacity. At this time, the storage portion 12c is such that the flat plane portions f and f serve as heat transfer surfaces that come into contact with flat plane portions f ′ and f ′ of the insulating case 13 described later, and the heat transfer surfaces are flat. Since it is configured, it is possible to shorten the distance between a circuit board 14a, which will be described later, and the insulating case 13 and the storage portion 12c. At the same time, since this heat transfer surface can be formed in a straight line (planar), the design becomes easy, and the flatness of the heat transfer surface can be easily improved by machining such as cutting, and the contact portion of the heat transfer surface It becomes possible to improve the heat transfer performance in.

上記に構成された本体12は、一端部側に形成された平坦な支持部12aに対し、各LED11を実装した基板11aが配設される。すなわち、基板11aの裏面側を平坦な支持部12aに対し、熱伝導性を有し電気絶縁性を有するシリコーン樹脂やエポキシ樹脂等からなる絶縁シートまたは接着剤等を介して密着させネジ等の固定手段によって支持する。これにより、各LED11と基板11aからなる光源体の光軸xが、本体12の軸心y−yに略合致し、全体として平面視で略円形の発光面を有する光源部Aが構成される。   In the main body 12 configured as described above, a substrate 11a on which each LED 11 is mounted is disposed on a flat support portion 12a formed on one end side. That is, the back side of the substrate 11a is brought into close contact with the flat support portion 12a through an insulating sheet or adhesive made of a silicone resin or an epoxy resin having thermal conductivity and electrical insulation, and fixing screws or the like. Support by means. Thereby, the optical axis x of the light source body consisting of each LED 11 and the substrate 11a substantially coincides with the axis yy of the main body 12, and the light source unit A having a substantially circular light emitting surface in plan view as a whole is configured. .

また、支持部12aの中央部分から収納部12cに向け軸心y−y方向に略沿って貫通する挿通孔12dを形成する。この挿通孔12dは、給電用の電線wを挿通させるために、基板11aに形成された貫通孔11bと連通するように形成する。そして、本体12には、その収納部12c内に絶縁ケース13が挿入されて嵌め込まれる。   Further, an insertion hole 12d is formed that penetrates substantially along the axis yy direction from the central portion of the support portion 12a toward the storage portion 12c. The insertion hole 12d is formed so as to communicate with the through hole 11b formed in the substrate 11a in order to insert the power supply wire w. Then, the insulating case 13 is inserted and fitted into the main body 12 in the storage portion 12c.

絶縁ケース13は、本体12の収納部12c内に収納されて、後述する点灯装置14の回路基板14aとアルミニウム製本体12との間の電気絶縁を図るために設けられるもので、PBT(ポリブチレンテレフタレート)などの耐熱性で電気絶縁性を有する合成樹脂で、外周面が収納部12cの平面部f、fと接する2面以上の平面部f´、f´を有する筒体、本実施形態では、図2(a)(b)に示すように、長手方向に沿い角c´で連続した2つの平面部f´、f´で構成され、筒体の横断面形状が2等分した半矩形と半円とが連続した略扇形をなす形状、すなわち、本体12の収納部12cの内面形状に対し、合致する形状に構成される。なお、絶縁ケース13を構成する筒体の軸心z−zは、収納部12cの軸心、すなわち本体12の軸心y−yと略一致するように形成される。   The insulating case 13 is housed in the housing portion 12c of the main body 12 and is provided for electrical insulation between a circuit board 14a of the lighting device 14 described later and the aluminum main body 12, and is made of PBT (polybutylene). A cylindrical body having two or more plane portions f ′ and f ′ whose outer peripheral surface is in contact with the plane portions f and f of the storage portion 12c. As shown in FIGS. 2 (a) and 2 (b), a semi-rectangular shape which is composed of two plane portions f 'and f' which are continuous along the longitudinal direction at an angle c ', and the cross-sectional shape of the cylindrical body is divided into two equal parts. And a semicircular shape that is substantially continuous, that is, a shape that matches a shape of the inner surface of the storage portion 12 c of the main body 12. In addition, the axial center zz of the cylindrical body constituting the insulating case 13 is formed so as to substantially coincide with the axial center of the storage portion 12c, that is, the axial center yy of the main body 12.

上記に構成された絶縁ケース13は、図2(b)、図3(a)に示すように、筒体の略扇形をなす形状を、収納部12cの略扇形をなす形状に合致させ、本体12の下方の開口部12bから収納部12c内に挿入して嵌合させる。絶縁ケース13と収納部12cは、ネジs1(図1)によって本体12の支持部12aの内面に固定される。なお、絶縁ケース13は接着剤等の固定手段によって収納部12c内に固定するようにしてもよい。   As shown in FIGS. 2 (b) and 3 (a), the insulating case 13 configured as described above matches the shape of the cylindrical body that is substantially fan-shaped with the shape of the housing portion 12c that is substantially fan-shaped. 12 is inserted into the storage portion 12c from the opening 12b below and fitted. The insulating case 13 and the storage portion 12c are fixed to the inner surface of the support portion 12a of the main body 12 by screws s1 (FIG. 1). The insulating case 13 may be fixed in the storage portion 12c by a fixing means such as an adhesive.

この際、絶縁ケース13の角c´および平坦な平面部f´、f´は、本体12の収納部12cの角cおよび平坦な平面部f、fと密に接触する伝熱面となるもので、伝熱面が平面で構成されることから回路基板14aと絶縁ケース13および収納部12cとの距離寸法を短く構成することが可能になる。これにより、後述する熱伝導部材15の使用量を少なくすることが可能になる。また同時に、この伝熱面を直線(平面)で形成できることから設計が容易になり、さらに、絶縁ケース13における樹脂成形等の加工で伝熱面の平坦度を容易に向上させることができ、伝熱面の接触部分における伝熱性能を向上させることが可能になる。これにより、収納部12c内に絶縁ケース13を挿入し嵌合させることによって、収納部12cの平坦な平面部f、fからなる内面に対し、絶縁ケース13の平坦な平面部f´、f´からなる外面が一層密着して接触し、良好な伝熱作用を奏することが可能になる。   At this time, the corner c ′ and the flat plane portions f ′ and f ′ of the insulating case 13 become heat transfer surfaces that come into close contact with the corner c and the flat plane portions f and f of the storage portion 12 c of the main body 12. Thus, since the heat transfer surface is a flat surface, the distance between the circuit board 14a, the insulating case 13 and the storage portion 12c can be shortened. Thereby, it becomes possible to reduce the usage-amount of the heat conductive member 15 mentioned later. At the same time, since the heat transfer surface can be formed in a straight line (planar), the design is facilitated, and the flatness of the heat transfer surface can be easily improved by processing such as resin molding in the insulating case 13. It becomes possible to improve the heat transfer performance in the contact part of a hot surface. As a result, by inserting and fitting the insulating case 13 into the storage portion 12c, the flat planar portions f ′ and f ′ of the insulating case 13 with respect to the inner surface composed of the flat planar portions f and f of the storage portion 12c. The outer surface made of the material comes into close contact with each other and can exhibit a good heat transfer effect.

この場合、熱伝導性、電気絶縁性および耐熱性の良好なシリコーン樹脂やエポキシ樹脂等からなる接着剤を、絶縁ケース13の外面と収納部12cの内面に予め塗布し嵌合して固着するようにすれば、絶縁ケース13の外面と収納部12cの内面とが、熱伝導性の良好な接着剤を介して固着されるので、より一層密着して両者を接合させることが可能になる。   In this case, an adhesive made of silicone resin, epoxy resin or the like having good thermal conductivity, electrical insulation, and heat resistance is applied in advance to the outer surface of the insulating case 13 and the inner surface of the storage portion 12c so as to be fixed. By doing so, since the outer surface of the insulating case 13 and the inner surface of the storage portion 12c are fixed via an adhesive having good thermal conductivity, it becomes possible to more closely bond them together.

また同時に、収納部12c内に絶縁ケース13を挿入し嵌合させることによって、収納部12cの平坦な平面部f、fからなる内面と、絶縁ケース13の平坦な平面部f´、f´からなる外面とが合致して係合することにより、絶縁ケース13の挿入時における位置決めおよび収納部12cに対する絶縁ケース13の回り止めが行われる。   At the same time, by inserting and fitting the insulating case 13 into the storage portion 12c, the inner surface of the storage portion 12c consisting of the flat plane portions f and f and the flat plane portions f ′ and f ′ of the insulation case 13 When the insulation case 13 is inserted and aligned, positioning when the insulation case 13 is inserted and rotation of the insulation case 13 with respect to the storage portion 12c are performed.

因みに、図3(b)に示す、従来のように、収納部12cおよび絶縁ケース13が、ともに円筒体で構成された場合には、別個の格別な位置決めおよび回り止め構造を設けなければならない。これに対し、本実施形態によれば、回路基板14aと絶縁ケース13および収納部12cとの距離寸法を短くする構成、すなわち、伝熱面を平面で構成し、収納部12cおよび絶縁ケース13の横断面形状が、ともに略扇形をなしている形状を利用して、位置決めおよび回り止めを行わせることが可能になり、構成の簡素化およびコストダウンを図ることが可能になる。   Incidentally, as shown in FIG. 3B, when the storage portion 12c and the insulating case 13 are both formed of a cylindrical body as in the prior art, separate special positioning and rotation prevention structures must be provided. On the other hand, according to the present embodiment, the distance between the circuit board 14a, the insulating case 13 and the storage portion 12c is shortened, that is, the heat transfer surface is configured as a plane, and the storage portion 12c and the insulating case 13 It becomes possible to perform positioning and rotation prevention by utilizing a shape in which the cross-sectional shapes are both substantially fan-shaped, so that the configuration can be simplified and the cost can be reduced.

また、絶縁ケース13は、図1に示すように、その外周面の下方部分に位置してリング状の鍔をなすように突出した係止部13aを一体に形成する。この係止部から下方に突出する部分には、外周を段状になして口金取付部13bを一体に形成する。さらに、絶縁ケース13の内面には、円筒の軸心方向に沿ってガイド溝13cが一体に形成され(図3(a))、このガイド溝に後述する点灯装置14の回路基板14aが縦方向、すなわち、本体12の軸心y−y方向に略沿って嵌合され支持される。ガイド溝13cは筒体をなす絶縁ケース13の軸線z−z、換言すれば、本体12の軸心y−yから片側、本実施形態では、絶縁ケース13の角c´および平坦な平面部f´、f´側に片寄って形成され、この片寄って形成されたガイド溝13cに回路基板14aが縦方向に嵌合される。これにより、回路基板14aの広い板面が絶縁ケース13の角c´および平坦な平面部f´、f´に向けて位置して支持される。   In addition, as shown in FIG. 1, the insulating case 13 is integrally formed with a locking portion 13a that is located at a lower portion of the outer peripheral surface and protrudes so as to form a ring-shaped ridge. A portion that protrudes downward from the engaging portion is formed with a base attaching portion 13b integrally with the outer periphery being stepped. Further, a guide groove 13c is integrally formed on the inner surface of the insulating case 13 along the axial direction of the cylinder (FIG. 3A), and a circuit board 14a of the lighting device 14 to be described later is provided in the guide groove in the vertical direction. That is, it is fitted and supported substantially along the axis yy direction of the main body 12. The guide groove 13c is an axis zz of the insulating case 13 forming a cylindrical body, in other words, one side from the axis yy of the main body 12, in this embodiment, the corner c 'of the insulating case 13 and the flat plane portion f. The circuit board 14a is fitted in the longitudinal direction in the guide groove 13c formed so as to be offset toward the ′ and f ′ sides. As a result, the wide plate surface of the circuit board 14a is positioned and supported toward the corner c ′ and the flat plane portions f ′ and f ′ of the insulating case 13.

回路基板14aは、図1に示すように、各LED11の点灯装置14を構成するもので、ガラスエポキシ材からなり、点灯回路を構成する電子部品が実装され、電解コンデンサ等の比較的大きな部品14bを片側の面に集中して配置し、小さいチップ部品やトランジスタ等で比較的発熱を伴う部品14cを他方の面に実装する。そして、電子部品14b、14cを実装した回路基板14aは、絶縁ケース13のガイド溝13cに縦方向にして挿入される。この際、狭い空間、すなわち、絶縁ケース13の角c´および平坦な平面部f´、f´がある側の空間に、チップ部品やトランジスタ等で比較的発熱を伴う部品14cが位置し、他方の広い空間に大きな部品14bが位置するようにして挿入する。なお、電子部品を回路基板14aに実装する際に、トランジスタ等で比較的発熱を伴う部品14cが絶縁ケース13の角c´および平面部f´、f´側に面するように、あらかじめ位置させて実装しておく。   As shown in FIG. 1, the circuit board 14a constitutes the lighting device 14 for each LED 11. The circuit board 14a is made of a glass epoxy material, is mounted with electronic components constituting the lighting circuit, and is a relatively large component 14b such as an electrolytic capacitor. Are concentrated on one surface, and a component 14c that generates heat relatively by a small chip component or a transistor is mounted on the other surface. The circuit board 14a on which the electronic components 14b and 14c are mounted is inserted into the guide groove 13c of the insulating case 13 in the vertical direction. At this time, the component 14c that generates heat relatively by a chip component, a transistor, or the like is located in a narrow space, that is, a space on the side where the corner c ′ of the insulating case 13 and the flat plane portions f ′ and f ′ exist, The large part 14b is inserted in a large space. When mounting the electronic component on the circuit board 14a, the component 14c, which is relatively heat generated by a transistor or the like, is positioned in advance so as to face the corner c ′ and the plane portions f ′ and f ′ of the insulating case 13. And implement it.

これによって、回路基板14aを絶縁ケース13内に収納すると、絶縁ケース13によってアルミニウムからなる本体12と回路基板14aとの間の電気的な絶縁がなされると同時に、自動的に発熱を伴う部品14cが、絶縁ケース13の角c´および平坦な平面部f´、f´に対向して位置される。この発熱を伴う部品14cと絶縁ケース13の角c´および平面部f´、f´とが対向した状態で、回路基板14aの発熱を伴う部品14cを含んだ板面と、絶縁ケース13の角c´および平面部f´、f´との間に熱伝導部材15を充填する(図3(a))。本実施形態では熱伝導性、電気絶縁性および耐熱性を有するシリコーン樹脂製の接着剤を充填した。   Thus, when the circuit board 14a is housed in the insulating case 13, the insulating case 13 provides electrical insulation between the body 12 made of aluminum and the circuit board 14a, and at the same time, the component 14c automatically generates heat. Is positioned to face the corner c ′ of the insulating case 13 and the flat planar portions f ′ and f ′. In a state where the component 14c with heat generation and the corner c ′ and the plane portions f ′ and f ′ of the insulating case 13 face each other, the plate surface including the component 14c with heat generation of the circuit board 14a and the corner of the insulating case 13 The heat conducting member 15 is filled between c ′ and the plane portions f ′ and f ′ (FIG. 3A). In this embodiment, an adhesive made of silicone resin having thermal conductivity, electrical insulation and heat resistance is filled.

この際、熱伝導部材15は、絶縁ケース13の角c´および平坦な平面部f´、f´に向けて充填すればよい。すなわち、回路基板14aと絶縁ケース13および収納部12cとの距離寸法が短く構成された部分に充填すればよく、高価なシリコーン樹脂等の接着剤の使用量を少なくすることが可能になり、コスト的にも有利となる。因みに、従来は、図3(b)に示すように、絶縁ケース13と収納部12cは、ともに円筒体で構成されているため、平板からなる回路基板14aと円筒体からなる絶縁ケース13および収納部12cとの距離寸法が長くなり、絶縁ケース13の円筒の奥(図中、中央部に位置する斜線部分)まで接着剤を充填しなければならず、接着剤の使用量が多くなる。   At this time, the heat conducting member 15 may be filled toward the corner c ′ of the insulating case 13 and the flat plane portions f ′ and f ′. That is, what is necessary is just to fill the portion where the distance dimension between the circuit board 14a and the insulating case 13 and the storage portion 12c is short, and it is possible to reduce the amount of the adhesive such as expensive silicone resin used. This is also advantageous. Incidentally, conventionally, as shown in FIG. 3B, since the insulating case 13 and the storage portion 12c are both formed of a cylindrical body, the circuit board 14a made of a flat plate, the insulating case 13 made of a cylindrical body, and the storage case. The distance dimension with the part 12c becomes long, and it is necessary to fill the adhesive up to the back of the cylinder of the insulating case 13 (in the figure, the hatched portion located in the center), which increases the amount of adhesive used.

さらに、点灯装置14の回路基板14aは、縦方向でしかも片寄って配設され、絶縁ケース13の角c´および平面部f´、f´に対し、より接近した位置に支持されるので、接着剤の使用量をより一層少なくすることが可能になる。同時に、回路基板14aと絶縁ケース13および収納部12cとの距離寸法が短くなることにより熱伝導経路も短縮され、点灯装置14の熱を、より一層効果的に本体12側に伝達させることが可能になる。   Further, the circuit board 14a of the lighting device 14 is disposed in the vertical direction and offset, and is supported at a position closer to the corner c 'and the plane portions f' and f 'of the insulating case 13, so that the bonding is performed. The amount of the agent used can be further reduced. At the same time, the distance between the circuit board 14a, the insulating case 13 and the storage portion 12c is shortened so that the heat conduction path is shortened, and the heat of the lighting device 14 can be more effectively transmitted to the main body 12 side. become.

これにより、シリコーン樹脂からなる熱伝導部材15によって、回路基板14a、特に発熱を伴う部品14cと、絶縁ケース13の角c´および平坦な平面部f´、f´とが熱的に連結されると共に、回路基板14a自体も絶縁ケース13に対して接着剤により強固に固着され、電気的に安全で、かつ信頼性も高く、さらに振動等に対しても強固な口金付ランプを提供することが可能になる。   Accordingly, the circuit board 14a, in particular, the component 14c that generates heat, and the corner c ′ and the flat plane portions f ′ and f ′ of the insulating case 13 are thermally connected by the heat conducting member 15 made of silicone resin. At the same time, the circuit board 14a itself is firmly fixed to the insulating case 13 with an adhesive to provide a lamp with a base that is electrically safe, highly reliable, and strong against vibrations. It becomes possible.

さらに、絶縁ケース13は、図1に示すように、本体12の他端部側の径小の開口部12bから突出した口金取付部13bに対し、その外周面に口金部材16が嵌め込まれ、カシメ若しくはシリコーン樹脂やエポキシ樹脂等の耐熱性を有する接着剤を用いて固着する。これにより、本体12から口金部材16にわたる外周面の外観形状が一般白熱電球におけるネック部のシルエットに近似させた形状に構成される。なお、回路基板14aの出力端子にはLED給電用の電線wが接続され、入力端子には入力線(図示省略)が接続される。また、回路基板14aに構成される点灯回路は、交流電圧を直流電圧に変換して各LED11に定電流の直流電流を供給するように構成される。   Further, as shown in FIG. 1, the insulating case 13 has a base member 16 fitted on the outer peripheral surface of the base attaching portion 13 b protruding from the small-diameter opening 12 b on the other end side of the main body 12. Alternatively, it is fixed using a heat-resistant adhesive such as silicone resin or epoxy resin. Thereby, the external shape of the outer peripheral surface extending from the main body 12 to the base member 16 is configured to approximate a neck silhouette in a general incandescent lamp. In addition, the electric wire w for LED electric power feeding is connected to the output terminal of the circuit board 14a, and an input line (illustration omitted) is connected to an input terminal. The lighting circuit configured on the circuit board 14 a is configured to convert an AC voltage into a DC voltage and supply a constant DC current to each LED 11.

口金部材16は、エジソンタイプのE26形で、ねじ山を備えた筒状のシェル部16aとこのシェル部の下端の頂部に絶縁部16bを介して設けられたアイレット部16cを備えている。シェル部16aの開口部が絶縁ケース13の口金取付部13bに嵌め込まれ接着やカシメなどにより固着される。これにより、アルミニウムからなる本体12と口金部材16との電気絶縁が絶縁ケース13によってなされる。そして、口金部材16のシェル部16aおよびアイレット部16cには、回路基板14aの入力端子から導出された入力線が接続される。   The base member 16 is an Edison type E26 type, and includes a cylindrical shell portion 16a having a thread and an eyelet portion 16c provided on the top of the lower end of the shell portion via an insulating portion 16b. The opening portion of the shell portion 16a is fitted into the base attachment portion 13b of the insulating case 13 and is fixed by adhesion or caulking. As a result, the insulation case 13 provides electrical insulation between the main body 12 made of aluminum and the base member 16. An input line derived from an input terminal of the circuit board 14a is connected to the shell portion 16a and the eyelet portion 16c of the base member 16.

グローブ17は、図1に示すように、透光性を有し、例えば、厚さが薄いガラスやポリカーボネート等の合成樹脂などの材質で構成され、透明または光拡散性を有する乳白色など、ここでは乳白色として、端部に開口17aを有する一般白熱電球のボール部分のシルエットに近似させた滑らかな球面状に形成する。このグローブ17は、本体12の光源部Aにおける発光面を覆うようにして、開口17aの開口端部を本体12の支持部12aの周囲に形成した段部に嵌め込み、例えば、シリコーン樹脂やエポキシ樹脂などの接着剤により固定する。これにより、各LED11やその充電部が覆われて保護されると共に、本体12の外周面形状がグローブ17の外周面形状に一体的に略連続した外観形状になり、全体形状として、より一層一般白熱電球全体のシルエットに近似させた電球形の口金付ランプ10として構成される。   As shown in FIG. 1, the globe 17 has translucency, for example, is composed of a material such as a thin resin such as glass or polycarbonate, and is transparent or light diffusive, such as milky white. As milky white, it is formed in a smooth spherical shape approximating the silhouette of the ball portion of a general incandescent bulb having an opening 17a at its end. The globe 17 is fitted with a stepped portion formed around the support portion 12a of the main body 12 so that the light emitting surface of the light source portion A of the main body 12 is covered, for example, a silicone resin or an epoxy resin. Fix with adhesive. As a result, each LED 11 and its charging part are covered and protected, and the outer peripheral surface shape of the main body 12 becomes an external shape that is substantially continuous integrally with the outer peripheral surface shape of the globe 17. The lamp is configured as a lamp 10 with a cap shape that approximates the silhouette of the entire incandescent bulb.

次に、上記に構成される口金付ランプ10の組立手順につき説明する。先ず、絶縁ケース13の略扇形をなす形状を、収納部12cの略扇形をなす形状に合致させて位置決めをし、絶縁ケース13を本体12の収納部12c内に挿入して嵌め込み、ネジs1によって本体12に固定する。これにより、絶縁ケース13の角c´および平坦な平面部f´、f´と、収納部12cの角cおよび平坦な平面f、fとが密に接触して嵌合される。   Next, an assembly procedure of the lamp with cap 10 configured as described above will be described. First, the substantially fan-shaped shape of the insulating case 13 is positioned so as to match the substantially fan-shaped shape of the storage portion 12c, and the insulating case 13 is inserted and fitted into the storage portion 12c of the main body 12, and the screw s1 is used. Secure to the body 12. As a result, the corner c ′ and the flat plane portions f ′ and f ′ of the insulating case 13 and the corner c and the flat planes f and f of the storage portion 12c are in close contact with each other and fitted.

次に、回路基板14aの出力端子にあらかじめ接続された電線wを絶縁ケース13の上端部側の開口から本体12の支持部12aに形成された挿通孔12dに向けて通しながら、回路基板14aを縦にして絶縁ケース13内に挿入し、ガイド溝13cに沿って嵌合させて支持する。この際、回路基板14aは発熱を伴う部品14cが絶縁ケース13の角c´および平面部f´、f´に面する向きにして挿入する。このとき、本体12の挿通孔12dから引き出された電線wの先端を、LED11を実装した基板11aの貫通孔11bから引き出しておく。   Next, while passing the electric wire w pre-connected to the output terminal of the circuit board 14a from the opening on the upper end side of the insulating case 13 toward the insertion hole 12d formed in the support part 12a of the main body 12, the circuit board 14a is passed through. It is inserted vertically into the insulating case 13, and is fitted and supported along the guide groove 13c. At this time, the circuit board 14a is inserted in such a direction that the component 14c that generates heat faces the corner c ′ and the flat portions f ′ and f ′ of the insulating case 13. At this time, the tip end of the electric wire w drawn out from the insertion hole 12d of the main body 12 is drawn out from the through hole 11b of the substrate 11a on which the LED 11 is mounted.

次に、絶縁ケース13内の回路基板14aと絶縁ケース13の角c´および平面部f´、f´との間に接着剤からなる熱伝導部材15を注入して充填する。これにより、回路基板14aに実装された発熱を伴う部品14cを含めて回路基板14aの板面と絶縁ケース13の角c´および平面部f´、f´とが熱伝導部材15で連結される。この際、熱伝導部材15を構成する接着剤は、上述したように、使用量を少なくして連結することができる。   Next, a heat conductive member 15 made of an adhesive is injected and filled between the circuit board 14a in the insulating case 13 and the corners c ′ and the flat portions f ′ and f ′ of the insulating case 13. As a result, the plate surface of the circuit board 14a, including the component 14c with heat generation mounted on the circuit board 14a, and the corner c 'and the plane portions f' and f 'of the insulating case 13 are connected by the heat conducting member 15. . At this time, as described above, the adhesive constituting the heat conducting member 15 can be connected with a reduced amount of use.

次に、LED11を実装した基板11aを本体12の支持部12a上に載置して密着させ、上面側(表面側)から周囲4箇所程度をねじ等の固定手段を用いて固定する。この際、基板11aの貫通孔11bと本体12の挿通孔12dを位置合わせして固定する。これにより、基板11aの裏面と支持部12aの平坦な面が密着して固定される。次に、基板11aの貫通孔11bから、一端引き出された電線wを、基板11aの表面側に折り曲げてコネクタ11cに接続する。   Next, the substrate 11a on which the LED 11 is mounted is placed on and closely adhered to the support portion 12a of the main body 12, and the surrounding area from the upper surface side (surface side) is fixed by using fixing means such as screws. At this time, the through hole 11b of the substrate 11a and the insertion hole 12d of the main body 12 are aligned and fixed. Thereby, the back surface of the board | substrate 11a and the flat surface of the support part 12a are closely_contact | adhered and fixed. Next, the electric wire w pulled out from the through hole 11b of the substrate 11a is bent to the surface side of the substrate 11a and connected to the connector 11c.

次に、点灯装置14の回路基板14aの入力端子から導出された入力線を、口金部材16のシェル部16aおよびアイレット部16cに接続し、接続した状態でシェル部16aの開口部を絶縁ケース13の口金取付部13bに嵌め込み接着剤で固着する。   Next, the input line led out from the input terminal of the circuit board 14a of the lighting device 14 is connected to the shell portion 16a and the eyelet portion 16c of the base member 16, and the opening of the shell portion 16a is connected to the insulating case 13 in the connected state. Is fitted into the base attachment portion 13b and fixed with an adhesive.

次に、グローブ17を用意し、本体12の光源部Aを覆うようにしてグローブの開口端部17aを本体12の支持部12aに形成した段部に嵌め込み接着剤により固定する。   Next, the glove 17 is prepared, and the opening end 17a of the glove is fitted into the step formed on the support part 12a of the main body 12 so as to cover the light source part A of the main body 12, and fixed with an adhesive.

これにより、一端部側にグローブ有し他端部側にE26形の口金が設けられ、全体の外観形状が一般白熱電球のシルエットに近似した電球形の口金付ランプ10が構成される。なお、口金付ランプ10の組み立て手順は、上記に限らず別の組み立て手順であってもよい。   As a result, there is a bulb-type lamp 10 having a globe on one end side and an E26-type base on the other end side, and having an overall appearance similar to a silhouette of a general incandescent bulb. In addition, the assembly procedure of the lamp | ramp 10 with a nozzle | cap | die is not restricted above, Another assembly procedure may be sufficient.

次に、上記のように構成された電球形の口金付ランプ10を光源とする照明器具の構成を説明する。図4に示すように、20は店舗等の天井面Xに埋め込み設置され、E26形の口金を有する一般白熱電球を光源としたダウンライト式の既存の照明器具で、下面に開口部21aを有する金属製の箱状をなした器具本体21と、開口部21aに嵌合される金属製の反射体22と、一般白熱電球のE26形の口金をねじ込むことが可能なソケット23で構成されている。反射体22は、例えばステンレス等の金属板で構成し、反射体22の上面板の中央部にソケット23が設置される。   Next, the structure of the lighting fixture which uses the light bulb-shaped lamp 10 with the cap configured as described above as a light source will be described. As shown in FIG. 4, reference numeral 20 denotes an existing downlight type lighting fixture that is embedded in a ceiling surface X of a store or the like and uses a general incandescent bulb having an E26-type base as a light source, and has an opening 21a on the lower surface. It comprises a metal box-like instrument body 21, a metal reflector 22 fitted into the opening 21a, and a socket 23 into which an E26-type base of a general incandescent bulb can be screwed. . The reflector 22 is made of, for example, a metal plate such as stainless steel, and a socket 23 is installed at the center of the top plate of the reflector 22.

上記に構成された一般白熱電球用の既存の照明器具20において、省エネや長寿命化などのために白熱電球に替えて、上述したLED11を光源とする電球形の口金付ランプ10を使用する。すなわち、電球形の口金付ランプは口金部材16をE26形に構成してあるので、上記照明器具の一般白熱電球用のソケット23にそのまま差し込むことができる。この際、電球形の口金付ランプ10の本体12が略円錐状のテーパー面をなすようにして、外観が白熱電球におけるネック部のシルエットに近似させた形状に構成されているので、ネック部がソケット周辺の反射体22等に当たることなくスムーズに差し込むことができ、電球形の口金付ランプ10における既存照明器具への適用率が向上する。これにより、LED11を光源とし電球形の口金付ランプが設置された省エネ形のダウンライトが構成される。勿論、上記と同様にして新規なダウンライトを構成するようにしてもよい。   In the existing lighting fixture 20 for a general incandescent bulb configured as described above, a bulb-type cap lamp 10 using the LED 11 as a light source is used instead of the incandescent bulb in order to save energy and prolong the life. That is, since the bulb-shaped lamp with the cap has the cap member 16 formed in the E26 shape, it can be directly inserted into the socket 23 for a general incandescent bulb of the lighting fixture. At this time, the main body 12 of the bulb-shaped lamp with cap 10 has a substantially conical tapered surface, and the appearance is configured to approximate the silhouette of the neck portion of the incandescent bulb. It can be smoothly inserted without hitting the reflector 22 and the like around the socket, and the application rate of the light bulb-shaped lamp with cap 10 to the existing lighting fixture is improved. As a result, an energy-saving downlight in which a light bulb-shaped lamp with a cap is installed using the LED 11 as a light source is configured. Of course, a new downlight may be configured in the same manner as described above.

上記に構成されたダウンライトに電源を投入すると、ソケット23から口金付ランプ10の口金部材16を介して電源が供給され、点灯装置14が動作し直流電圧が出力される。この直流電圧は点灯装置14からLED11に印加され、定電流の直流電流が供給されて点灯する。これにより、全てのLED11が同時に点灯して白色の光が放射される。   When power is applied to the downlight configured as described above, power is supplied from the socket 23 through the base member 16 of the lamp with base 10, the lighting device 14 is operated, and a DC voltage is output. This DC voltage is applied from the lighting device 14 to the LED 11, and a constant DC current is supplied to light the LED. Thereby, all the LEDs 11 are turned on simultaneously, and white light is emitted.

この際、基板11a表面に4個のLED11が略同心円状をなすように略等間隔に実装して配設されているので、各LED11から放射される光は、グローブ17の内面全体に向かって略均等に放射され、乳白色のグローブで光が拡散され、一般白熱電球に近似した配光特性をもった照明を行うことができる。   At this time, since the four LEDs 11 are mounted on the surface of the substrate 11a at substantially equal intervals so as to be substantially concentric, light emitted from each LED 11 is directed toward the entire inner surface of the globe 17. Light is emitted almost uniformly and light is diffused by a milky white glove, and illumination with light distribution characteristics similar to those of a general incandescent bulb can be performed.

特に、光源となる電球形の口金付ランプ10の配光が一般白熱電球の配光に近づくことで、照明器具20内に配置されたソケット23近傍の反射体22への光の照射量が増大し、一般白熱電球用として構成された反射体22の光学設計通りの器具特性を略得ることが可能となる。   In particular, when the light distribution of the bulb-shaped lamp with cap 10 serving as the light source approaches the light distribution of a general incandescent light bulb, the amount of light irradiated to the reflector 22 in the vicinity of the socket 23 arranged in the lighting fixture 20 increases. In addition, it is possible to obtain substantially the appliance characteristics as the optical design of the reflector 22 configured for a general incandescent bulb.

また、口金付ランプ10が点灯されると、点灯装置14の電子部品、特にトランジスタ等の部品14cが発熱する。発生した熱はシリコーン樹脂からなる熱伝導部材15を介して、絶縁ケース13の角c´および平面部f´、f´に伝達され、さらに、絶縁ケース13の角c´および平坦な平面部f´、f´に密着して接触している収納部12cの角cおよび平坦な平面f、f伝達され、アルミニウムからなる肉厚の本体12から放熱フィン12dを介して外部に放熱される。   Further, when the lamp with cap 10 is turned on, the electronic components of the lighting device 14, particularly the components 14c such as transistors, generate heat. The generated heat is transmitted to the corner c ′ and the flat portions f ′ and f ′ of the insulating case 13 through the heat conducting member 15 made of silicone resin, and further, the corner c ′ and the flat flat portion f of the insulating case 13. The corners c and the flat planes f and f of the storage portion 12c that are in close contact with and contact 'and f' are transmitted, and are radiated to the outside from the thick main body 12 made of aluminum through the radiation fins 12d.

この際、絶縁ケース13と収納部12cとの伝熱面は、平坦な平面状をなす形状、すなわち、絶縁ケース13の角c´および平坦な平面部f´、f´と、本体12の収納部12cの角cおよび平坦な平面f、fによって構成され、回路基板14aと絶縁ケース13および収納部12cとの距離寸法が短くなり、熱伝導部材15の使用量を少なくして、回路基板14a側の熱を絶縁ケース13および本体12側に効果的に伝達させることができる。  At this time, the heat transfer surfaces of the insulating case 13 and the storage portion 12c are formed into a flat planar shape, that is, the corner c ′ of the insulating case 13 and the flat flat portions f ′ and f ′ and the storage of the main body 12. The circuit board 14a is configured by the corner c of the part 12c and the flat planes f and f, the distance between the circuit board 14a and the insulating case 13 and the storage part 12c is shortened, and the amount of use of the heat conducting member 15 is reduced. Side heat can be effectively transmitted to the insulating case 13 and the main body 12 side.

さらに、点灯装置14の回路基板14aは、縦方向で、しかも片寄って配設され、絶縁ケース13の角c´および平面部f´、f´に対し、より接近して位置しているので、回路基板14a側の熱を、より熱伝導ロスを少なくして絶縁ケース13および本体12側に伝達することができる。同時に、伝熱面を直線で形成することでの設計の容易性と加工が容易となる作用が相まって、両者の伝熱面を隙間なく確実に密着して接触させることが可能となり、熱伝導ロスを少なくして、さらに効率よく効果的に放熱させることができる。   Further, the circuit board 14a of the lighting device 14 is disposed in the vertical direction and offset, and is located closer to the corner c ′ and the plane portions f ′ and f ′ of the insulating case 13, The heat on the circuit board 14a side can be transmitted to the insulating case 13 and the main body 12 side with less heat conduction loss. At the same time, the design of the heat transfer surface formed in a straight line is combined with the ease of design and processing, making it possible to ensure that both heat transfer surfaces are in close contact with each other without any gaps, resulting in heat transfer loss. The heat can be dissipated more efficiently and effectively.

これらの作用によって、点灯装置14における電子部品の温度上昇を抑制することができ、回路故障等の要因が除かれることから信頼性がより高くなるとともに、寿命の低下が抑制された口金付ランプおよび照明器具を提供することが可能になる。   With these actions, the temperature rise of the electronic components in the lighting device 14 can be suppressed, and factors such as a circuit failure are removed, so that the reliability is further improved, and the lamp with the cap whose lifetime is suppressed is reduced. It becomes possible to provide a lighting fixture.

また同時に、各LED11の温度も上昇し熱が発生する。その熱は、アルミニウムからなる円板状の基板11aから、基板11aが密着して固着された支持部12aに伝達されアルミニウムからなる本体12から放熱フィン12dを介して外部に放熱される。この際、基板11aおよび本体12を熱伝導性の良好なアルミニウムで構成したので、LED11で発生する熱を、伝導ロスを少なくして効果的に放熱させることができる。これにより、LED11の温度上昇および温度むらが防止され、発光効率の低下が抑制され、光束低下による照度の低下を防止することができ、同時にLEDの長寿命化を図ることができる。また、アルミニウムによって軽量化することが可能になる。   At the same time, the temperature of each LED 11 rises and heat is generated. The heat is transmitted from the disk-shaped substrate 11a made of aluminum to the support portion 12a to which the substrate 11a is adhered and fixed, and is radiated to the outside from the main body 12 made of aluminum through the radiation fins 12d. At this time, since the substrate 11a and the main body 12 are made of aluminum having good thermal conductivity, heat generated by the LED 11 can be effectively radiated with reduced conduction loss. Thereby, the temperature rise and temperature unevenness of the LED 11 are prevented, the decrease in light emission efficiency is suppressed, the decrease in illuminance due to the decrease in luminous flux can be prevented, and at the same time, the life of the LED can be extended. Further, the weight can be reduced by aluminum.

以上、本実施形態において、絶縁ケース13の平坦な平面部f´、f´と、収納部12cの平坦な平面部f、fとを密着して接触させるように構成したが、図5(a)に示すように、絶縁ケース13の平面部f´、f´と収納部12cの平面部f、fに対し、それぞれ縦方向、すなわち、型の引き抜き方向に列をなす凸条部18と凹条部19を一体に形成し、この凸条部18と凹条部19を互いに嵌合させるようにして、絶縁ケース13と収納部12cとの接触面積を増大させるようにして、より効率のよい放熱作用が行えるように構成してもよい。   As described above, in the present embodiment, the flat planar portions f ′ and f ′ of the insulating case 13 and the flat planar portions f and f of the storage portion 12c are in close contact with each other. ) With respect to the flat portions f ′ and f ′ of the insulating case 13 and the flat portions f and f of the storage portion 12c, respectively, the protruding strip portions 18 and the concave portions that are arranged in the vertical direction, that is, in the mold drawing direction, respectively. The strip portion 19 is formed integrally, and the convex strip portion 18 and the concave strip portion 19 are fitted to each other, so that the contact area between the insulating case 13 and the storage portion 12c is increased, and more efficient. You may comprise so that a thermal radiation effect | action can be performed.

また、絶縁ケース13および収納部12cの横断面形状を角c、c´を有する略扇形になるように構成したが、図5(b)に示すように、角をR形状にしてそれぞれの平面部f´、f´およびf、fをR形状により連続させて構成してもよい。さらには、図5(c)に示すように、全体を矩形状の横断面形状に構成してもよい。これによれば、絶縁ケース13と収納部12cとが、略全周囲にわたって平坦な平面部によって接触させることができ、より一層効率のよい放熱作用を行えるようにすることが可能になる。   Moreover, although the cross-sectional shape of the insulating case 13 and the accommodating part 12c was comprised so that it might become a substantially sector shape which has the angle | corners c and c ', as shown to FIG. The parts f ′, f ′ and f, f may be configured continuously by an R shape. Furthermore, as shown in FIG.5 (c), you may comprise the whole in the rectangular cross-sectional shape. According to this, the insulating case 13 and the storage part 12c can be brought into contact with each other by a flat plane part over substantially the entire periphery, and it becomes possible to perform a more efficient heat dissipation action.

また、本実施形態において、口金付ランプ10は、一般白熱電球の形状に近似させた電球形(A形またはPS形)、ボール形(G形)、円筒形(T形)、レフ形(R形)、さらには、GX53口金を用いたフラットな薄型構造のランプなどに構成してもよい。また既存の白熱電球の形状に近似させた口金付ランプに限らず、その他各種の外観形状、用途をなす口金付ランプに適用することができる。さらに、グローブレスの電球形の口金付ランプを構成するものであってもよい。   Further, in the present embodiment, the lamp with cap 10 is a light bulb shape (A shape or PS shape), a ball shape (G shape), a cylindrical shape (T shape), a reflex shape (R) that approximates the shape of a general incandescent light bulb. Shape), or a flat thin lamp using a GX53 base. Further, the present invention is not limited to a lamp with a cap approximated to the shape of an existing incandescent bulb, but can be applied to lamps with a cap having various other external shapes and uses. Furthermore, a globeless bulb-type lamp with a cap may be configured.

固体発光素子11は、LEDに限らず、有機ELまたは半導体レーザなどを発光源とした固体発光素子が許容される。固体発光素子は、白色で発光するように構成することが好ましいが、使用される照明器具の用途に応じ、赤色、青色、緑色等でも、さらには各種の色を組み合わせて構成してもよい。   The solid light-emitting element 11 is not limited to an LED, and a solid light-emitting element using an organic EL or a semiconductor laser as a light source is allowed. The solid light-emitting element is preferably configured to emit white light, but may be configured to be red, blue, green, or a combination of various colors depending on the use of the luminaire used.

基板11aは、熱伝導性および導電性を有する金属、本実施形態では、アルミニウムで構成したが、導電性を有しないガラスエポキシ樹脂やセラミックス等で構成したものであってもよい。この場合、基板11aの一面側に電気絶縁層を形成することを省略して配線パターンを形成し、LED11を直接実装することが可能になり、よりコスト的に有利な口金付ランプを提供することが可能になる。また、基板11aの形状は、円板状に形成したが、四角形、六角形などの多角形状、さらには楕円形状等をなすものであってもよく、目的とする配光特性を得るための全ての形状が許容される。   The substrate 11a is made of a metal having thermal conductivity and conductivity. In this embodiment, the substrate 11a is made of aluminum. However, the substrate 11a may be made of glass epoxy resin, ceramics, or the like that has no conductivity. In this case, it is possible to form the wiring pattern by omitting the formation of the electrical insulating layer on the one surface side of the substrate 11a, and to directly mount the LED 11, and to provide a lamp with a base that is more advantageous in terms of cost. Is possible. Further, the substrate 11a is formed in a disc shape, but may be a polygonal shape such as a quadrangle or a hexagon, or an elliptical shape, and all of them for obtaining a desired light distribution characteristic. Is acceptable.

さらに、本実施形態において、固体発光素子11は、基板11aを介して本体12の支持部12aに配設したが、基板11aを省略して、直接固体発光素子を、電気絶縁を図って支持部12aに支持し配設するように構成してもよい。この構成によれば、固体発光素子11から発生する熱を直接、支持部12a、すなわち本体11に伝達することができ、より効果的な放熱作用を行うことが可能になる。さらに基板11aの省略によりコスト的に有利な口金付ランプを提供することが可能になる。   Further, in the present embodiment, the solid light emitting element 11 is disposed on the support portion 12a of the main body 12 via the substrate 11a. However, the substrate 11a is omitted, and the solid light emitting element is directly insulated from the support portion. You may comprise so that it may be supported and arrange | positioned by 12a. According to this configuration, the heat generated from the solid state light emitting device 11 can be directly transmitted to the support portion 12a, that is, the main body 11, and a more effective heat dissipation operation can be performed. Furthermore, it is possible to provide a lamp with a cap that is advantageous in terms of cost by omitting the substrate 11a.

本体12は、熱伝導性の良好なアルミニウム(Al)、銅(Cu)、鉄(Fe)、ニッケル(Ni)の少なくとも一種を含む金属で形成するのが好ましい。この他に、窒化アルミニウム(AlN)、シリコーンカーバイト(SiC)などの工業材料で構成しても、さらには高熱伝導樹脂等の合成樹脂で構成してもよい。外観形状は、一端部から他端部に向けて直径が順次少なくなるような、一般白熱電球におけるネック部分のシルエットに近似させた形状に形成することが、既存照明器具への適用率が向上して好ましいが、ここでは、一般白熱電球に近似させることは条件でなく、限られた特定の外観形状には限定されない。   The main body 12 is preferably formed of a metal including at least one of aluminum (Al), copper (Cu), iron (Fe), and nickel (Ni) having good thermal conductivity. In addition, it may be made of an industrial material such as aluminum nitride (AlN) or silicone carbide (SiC), or may be made of a synthetic resin such as a high thermal conductive resin. Appearance shape can be applied to existing lighting fixtures by forming a shape that approximates the silhouette of the neck part of a general incandescent bulb so that the diameter gradually decreases from one end to the other. In this case, it is not a condition to approximate a general incandescent lamp, and the shape is not limited to a specific shape.

絶縁ケース13は、例えば、PBTが好適であるが、他のアクリルやABS等の合成樹脂で構成してもよい。また筒体の形状は、例えば、両端を開口した筒体や有底の筒体をなしていても、材料費節減や放熱効果向上等のために電気絶縁を損なわない範囲で、例えば、格子状等、他の開口を設けた筒体で構成されたものであってもよい。   The insulating case 13 is preferably PBT, for example, but may be composed of another synthetic resin such as acrylic or ABS. In addition, the shape of the cylindrical body is, for example, a lattice shape as long as it does not impair the electrical insulation in order to reduce material costs or improve the heat dissipation effect even if it has a cylindrical body with both ends opened or a bottomed cylindrical body. For example, it may be configured by a cylinder provided with other openings.

点灯装置14を構成する回路基板14aは、ガラスエポキシ材、紙フェノール材、ガラスコンポジット等、非金属性の部材で構成することが好ましいが、放熱性を高めるために、アルミニウム等の熱伝導性の良好な金属で構成しても、さらには、セラミックスで構成されたものであってもよい。回路基板14aは、本体12の軸心y−y方向に略沿って収納部12cに配設されることが、小形化を達成するためには好ましいが、ここでは、軸心y−yと直交する方向であっても、斜めに傾斜させて配設されたものでもよい。回路基板14aが絶縁ケース13に配設される内部の状態は、気密にしても、また放熱や圧力抜きのための空気孔等を形成し外部と連通させたものであってもよい。また、点灯装置14は、例えば、交流電圧100Vを直流電圧24V程度に変換して発光素子に供給する点灯回路を構成するものが許容される。さらに、固体発光素子11を調光するための調光機能や調色機能等を有するものであってもよい。また、回路基板14aは、絶縁ケース13内に全てが収納されたものでも、口金部材16内に一部が収納されるものであってもよい。   The circuit board 14a constituting the lighting device 14 is preferably made of a non-metallic member such as a glass epoxy material, a paper phenol material, or a glass composite. However, in order to improve heat dissipation, a heat conductive material such as aluminum is used. It may be composed of a good metal or may be composed of ceramics. The circuit board 14a is preferably disposed in the housing portion 12c substantially along the axis yy direction of the main body 12 in order to achieve miniaturization, but here, the circuit board 14a is orthogonal to the axis yy. Even if it is a direction to do, it may be inclined and arranged. The internal state in which the circuit board 14a is disposed in the insulating case 13 may be airtight, or may be in communication with the outside by forming air holes or the like for heat dissipation or pressure relief. Further, the lighting device 14 may be configured to constitute a lighting circuit that converts an alternating voltage of 100 V into a direct voltage of about 24 V and supplies the converted light to the light emitting element. Furthermore, you may have the light control function for adjusting the solid light emitting element 11, a color control function, etc. Further, the circuit board 14 a may be entirely stored in the insulating case 13 or may be partially stored in the base member 16.

熱伝導部材15は、点灯装置14の回路基板14aと絶縁ケース13の角c´と平面部f´、f´との間に充填したが、この部分および大きな部品14bを実装した裏面側を含めて、全体に充填するようにしてもよく、要は、回路基板14aの少なくとも一部が、熱伝導部材15によって絶縁ケース13の平面部f´、f´と熱的に連結されていればよい。また、熱伝導部材15は例えば、熱伝導性が良好で電気絶縁性を有する耐熱性のシリコーン樹脂、エポキシ樹脂やウレタン樹脂等の合成樹脂製の接着剤で構成することが好ましいが、材質は、これら合成樹脂に限らずアルミニウムや銅などの熱伝導性の良好な金属を回路基板14aと絶縁ケース13との間に介在させて連結するようにしても、さらに、これら金属と合成樹脂製の接着剤を組み合わせて連結するようにしてもよい。   The heat conducting member 15 is filled between the circuit board 14a of the lighting device 14 and the corner c 'of the insulating case 13 and the plane portions f' and f ', including this portion and the back side where the large component 14b is mounted. The circuit board 14a may be at least partially filled with the flat portions f ′ and f ′ of the insulating case 13 by the heat conducting member 15. . The heat conducting member 15 is preferably composed of, for example, an adhesive made of a synthetic resin such as a heat-resistant silicone resin, an epoxy resin or a urethane resin having a good thermal conductivity and electrical insulation. Not only these synthetic resins but also metals having good thermal conductivity such as aluminum and copper may be interposed between the circuit board 14a and the insulating case 13 and connected to each other. You may make it connect combining an agent.

口金部材16は、一般的に最も普及しているエジソンタイプのE26形やE17形等の口金が好適である。また、材質は口金全体が金属で構成されたものが好適であるが、一部を合成樹脂で構成した樹脂製の口金であってもよい。さらに、フラットな薄型構造のランプに用いられるGX53口金でも、蛍光ランプに使用されるピン形の端子を有する口金でも、引掛シーリングに使用されるL字形の端子を有する口金でもよく、特定の口金には限定されない。   The base member 16 is preferably an Edison type E26 type, E17 type or the like which is most commonly used. In addition, the material is preferably made of metal as a whole, but it may be a resin base partially made of synthetic resin. Further, it may be a GX53 base used for a flat thin structure lamp, a base having a pin-shaped terminal used for a fluorescent lamp, or a base having an L-shaped terminal used for hook sealing. Is not limited.

グローブ17は、白熱電球など一般照明用電球のバルブと同じ外観形状を有するA形、PS形などの通常涙滴形と呼ばれている形状やG形の球形をなすバルブと、さらにはT形、R形をなすバルブと同形、ないしは略同形をなす類似形状のグローブで構成してもよい。また、グローブ17は、本体12の一端部側に接着剤で固定したが、ネジ締め等の手段によって着脱が可能になるように構成してもよい。また、グローブ17は、発光部を実質的に密閉する外囲器を構成することが好ましいが、完全に密閉することが条件ではなく光学的に密閉していればよく、例えば、一部に小さな通気用の孔等を形成したものであってもよい。   The globe 17 is a bulb having a G-shaped spherical shape, such as an A-shaped shape, a PS-shaped shape, or the like, which has the same external shape as a bulb for a general lighting bulb, such as an incandescent bulb, and a T-shape. , A globe having the same shape as the R-shaped valve or a similar shape that is substantially the same shape may be used. Further, the glove 17 is fixed to the one end side of the main body 12 with an adhesive, but may be configured to be detachable by means such as screw tightening. In addition, the globe 17 preferably constitutes an envelope that substantially seals the light-emitting portion. However, it is only necessary that the globe 17 be optically sealed rather than a condition that it is completely sealed. What formed the hole for ventilation etc. may be used.

また、照明器具20は、天井埋込形、直付形、吊下形、さらには壁面取付形等が許容され、器具本体に制光体としてグローブ、セード、反射体などが取付けられるものであっても光源となる口金付ランプが露出するものであってもよい。また、器具本体に1個の口金付ランプを取付けたものに限らず、複数個が配設されるものであってもよい。さらに、オフィス等、施設・業務用の大型の屋内外の照明器具などを構成してもよい。   The lighting fixture 20 can be embedded in the ceiling, directly attached, suspended, or wall-mounted, and can be attached to the fixture body with a glove, shade, reflector, or the like as a light control body. Alternatively, a lamp with a cap serving as a light source may be exposed. Moreover, not only what attached the lamp | ramp with one nozzle | cap | die to the instrument main body, A plurality may be arrange | positioned. Furthermore, a large indoor / outdoor lighting apparatus for facilities / businesses such as an office may be configured.

なお、従来例を示す図3(b)には、図3(a)と同一部分に同一符号を付し、また変形例を示す図5には、図1〜図4と同一部分に同一符号を付し、詳細な説明は省略した。以上、本発明の好適な実施形態を説明したが、本発明は上述の実施形態に限定されることなく、本発明の要旨を逸脱しない範囲内において、種々の設計変更を行うことができる。   In FIG. 3 (b) showing the conventional example, the same parts as in FIG. 3 (a) are given the same reference numerals, and in FIG. 5 showing the modification, the same parts as those in FIGS. The detailed explanation was omitted. The preferred embodiment of the present invention has been described above, but the present invention is not limited to the above-described embodiment, and various design changes can be made without departing from the scope of the present invention.

10 口金付ランプ
11 固体発光素子
12 本体
12c 収納部
f、f 平面部
13 絶縁ケース
f´、f´ 平面部
14 点灯装置
14a 回路基板
14b、14c 電子部品
15 熱伝導部材
16 口金部材
20 照明器具
21 器具本体
23 ソケット
DESCRIPTION OF SYMBOLS 10 Lamp with a base 11 Solid light emitting element 12 Main body 12c Storage part f, f Plane part 13 Insulating case f ', f' Plane part 14 Lighting device 14a Circuit board 14b, 14c Electronic component 15 Thermal conduction member 16 Base member 20 Lighting fixture 21 Instrument body 23 Socket

Claims (3)

一端部側に固体発光素子が配設され、内周面が2面以上の平面部を有する筒状の収納部を内部に形成した熱伝導性を有する本体と;
前記収納部内に収納され、外周面が収納部の平面部と接する2面以上の平面部を有する筒体で構成された電気絶縁性を有する絶縁ケースと;
固体発光素子の点灯装置を構成する電子部品が配設され、絶縁ケースの内部に配設された回路基板と;
本体の他端部側に配設された口金部材と;
を具備していることを特徴とする口金付ランプ。
A thermally conductive main body in which a solid-state light emitting element is disposed on one end side and a cylindrical housing portion having an inner peripheral surface having two or more plane portions is formed inside;
An insulating case having an electrical insulation property, which is housed in the housing portion and is formed of a cylindrical body having two or more plane portions whose outer peripheral surfaces are in contact with the plane portion of the housing portion;
A circuit board on which electronic components constituting a lighting device for a solid state light emitting device are disposed and disposed in an insulating case;
A base member disposed on the other end side of the main body;
A lamp with a base, characterized by comprising:
前記本体と前記絶縁ケースとは、平面部において熱的に連結され、前記回路基板の少なくとも一部は、熱伝導部材によって絶縁ケースの平面部と熱的に連結されたことを特徴とする請求項1に記載の口金付ランプ。 The said main body and the said insulation case are thermally connected in the plane part, At least one part of the said circuit board is thermally connected with the plane part of the insulation case by the heat conductive member. A lamp with a cap according to 1. ソケットが設けられた器具本体と;
器具本体のソケットに装着された請求項1または2に記載の口金付ランプと;
を具備していることを特徴とする照明器具。
An instrument body provided with a socket;
A lamp with a cap according to claim 1 or 2 attached to a socket of the instrument body;
The lighting fixture characterized by comprising.
JP2012136891A 2012-06-18 2012-06-18 Lamp with ferrule and lighting fixture Pending JP2014002897A (en)

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Country Link
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014129661A1 (en) * 2013-02-25 2014-08-28 横浜ゴム株式会社 Rubber composition for tire tread, and pneumatic tire using same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014129661A1 (en) * 2013-02-25 2014-08-28 横浜ゴム株式会社 Rubber composition for tire tread, and pneumatic tire using same

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