JP2013240846A - Polishing device and manufacturing method of semiconductor device - Google Patents

Abstract

While polishing an object to be polished, the progress of polishing is grasped efficiently with sufficient accuracy.
A polishing unit includes a holding unit that holds a polishing target and repeatedly moves a predetermined path in a first plane, and the polishing target held by the holding unit moves through the predetermined path by one cycle. In the meantime, the polishing pad 10 polishes the polishing target surface of the polishing target 40, then the cleaning pad 20 cleans the polishing target surface, and then the drying unit 50 dries the polishing target surface, and then the imaging device 60. Is a polishing apparatus for imaging the surface to be polished.
[Selection] Figure 1

Description

  The present invention relates to a polishing apparatus and a method for manufacturing a semiconductor device.

  At the time of manufacturing a semiconductor device or analyzing defects, some layers or parts of layers may be polished and removed by CMP (Chemical Mechanical Polishing). For example, in order to expose a desired layer during failure analysis of a semiconductor device composed of a plurality of layers, a layer located above the desired layer may be removed by CMP. Also, in the semiconductor device manufacturing process, for example, after a metal layer is formed on the insulating layer so as to fill the wiring groove formed in the insulating layer, a part of the metal layer is removed until the wiring pattern is exposed. There is a case.

  Such polishing needs to be stopped at a desired timing. For example, it is necessary to stop at a timing when a desired layer is removed or when a desired portion is removed. If the timing for stopping the polishing is wrong, the polishing will be excessive or insufficient. For this reason, it is necessary to grasp the progress of the polishing after the start of polishing and before the polishing is stopped at a desired timing after the completion of the desired polishing.

  Patent Document 1 discloses a CMP apparatus including a platen having a polishing pad provided on the surface and a wafer holding mechanism that rotates while holding the wafer so as to press the wafer against the rotating polishing pad. The polishing pad includes a groove extending at least from the vicinity of the center in the outer peripheral direction, and the groove is thinner than other portions of the polishing pad and is substantially light-transmitting. Further, at least a portion of the platen where the groove of the polishing pad is disposed is transparent. In the case of the CMP apparatus having such a configuration, it is described that the surface state of the wafer being polished can be detected almost in real time by observing the surface of the wafer through the groove portion of the polishing pad.

JP-A-2005-340718

  In the case of the technique described in Patent Document 1, the accuracy of observation of the wafer surface state deteriorates due to the slurry supplied onto the polishing pad. In addition, since the observation is through the groove portion, the region that can be observed at a time is limited. That is, the entire surface of the wafer cannot be observed at once.

  As means for solving the problems of the technique described in Patent Document 1, the following method can be considered.

  First, as shown in FIG. 11, a polishing target surface of a polishing target 4 using a platen 7 provided with a polishing pad 1 on the surface and a holding unit 3 that holds a polishing target (eg, semiconductor device, wafer) 4. To polish. Specifically, the polishing pad 1 is rotated by rotating the platen 7, and the polishing object 4 is rotated by rotating the holding unit 3. Then, slurry is supplied onto the polishing pad 1. In this state, the polishing target surface of the polishing target 4 is polished by pressing the polishing target surface of the polishing target 4 against the polishing pad 1.

  After the polishing is started, the polishing is stopped at an appropriate timing, and the holding unit 3 is removed from the apparatus while holding the polishing target 4. If this timing is delayed, it will be over-polished. Thereafter, the polishing target surface of the polishing target 4 held by the holding unit 3 is cleaned with the cleaning liquid 2, and then dried by applying dry air 5 to the polishing target surface. Thereafter, the progress of the polishing is grasped by observing the polishing target surface of the polishing target 4 using an observation device (eg, a metal microscope) 6.

  As a result of the observation, if the polishing is insufficient, the holding unit 3 holding the polishing object 4 is attached to the apparatus again, and the polishing object surface of the polishing object 4 is polished again. Then, the polishing is stopped at an appropriate timing, and the surface to be polished is observed in the same procedure. Such a process is repeated until the desired polishing is completed.

  In the case of this method, in order to check the progress of polishing, it is necessary to remove the holding unit 3 holding the polishing object 4 from the apparatus each time, which is troublesome. In order to specify the timing of stopping polishing more accurately, it is necessary to reduce the amount of polishing once and increase the number of times of observing the polishing target surface of the polishing target 4, which increases time and labor.

  Other problems and novel features will become apparent from the description of the specification and the accompanying drawings.

According to one embodiment,
A holding unit that holds an object to be polished and repeatedly moves along a predetermined path in the first plane;
A polishing pad that polishes the polishing target surface of the polishing target that is held by the holding unit and repeatedly moves along the predetermined path;
A cleaning pad for cleaning the polishing target surface of the polishing target that is held by the holding unit and repeatedly moves along the predetermined path;
A drying unit that dries the polishing target surface of the polishing target that is held by the holding unit and repeatedly moves along the predetermined path;
An imaging device that images the polishing target surface of the polishing target that is held by the holding unit and repeatedly moves along the predetermined path;
Have
The polishing pad polishes the polishing target surface of the polishing target while the polishing target held by the holding unit moves on the predetermined path by one cycle, and then the cleaning pad cleans the polishing target surface. Then, the drying unit dries the surface to be polished, and then a polishing apparatus is provided in which the imaging device images the surface to be polished.

According to other embodiments,
Provided is a method for manufacturing a semiconductor device, which includes a step of polishing a polishing target surface of a semiconductor device to be polished using the polishing apparatus.

  While polishing the object to be polished (after starting polishing, until the polishing is stopped at the desired timing after the completion of the desired polishing), the progress of the polishing is efficiently grasped with sufficient accuracy. It becomes possible.

It is a figure which shows an example of the whole schematic diagram of the grinding | polishing apparatus of this embodiment. It is a figure which shows an example of the upper surface schematic diagram of the grinding | polishing apparatus of this embodiment. It is the figure which extracted a part of polishing apparatus shown in FIG. It is an example of a functional block diagram of a data processor of this embodiment. It is an example of a functional block diagram of a data processor of this embodiment. It is a figure which shows an example of the upper surface schematic diagram of the grinding | polishing apparatus of this embodiment. It is an example of a functional block diagram of a data processor of this embodiment. It is a figure which shows an example of the side surface schematic diagram of the holding | maintenance part of this embodiment. It is a figure which shows an example of the upper surface schematic diagram of the grinding | polishing apparatus of this embodiment. It is a figure which shows an example of the whole schematic diagram of the grinding | polishing apparatus of this embodiment. It is an example of the process which grind | polishes a grinding | polishing target.

  Hereinafter, embodiments will be described with reference to the drawings.

  The apparatus according to the present embodiment includes an arbitrary computer CPU, memory, a program loaded in the memory, a storage unit such as a hard disk for storing the program, and an interface for network connection. Realized by combination. The programs include programs downloaded from a storage medium such as a CD or a server on the Internet in addition to programs stored in the memory from the stage of shipping the device in advance. It will be understood by those skilled in the art that there are various modifications to the implementation method and apparatus.

  In addition, the functional block diagram used in the description of the present embodiment shows a functional unit block, not a hardware unit configuration. In these drawings, each device is described as being realized by one device, but the means for realizing it is not limited to this. That is, it may be a physically separated configuration or a logically separated configuration.

<First Embodiment>
The polishing apparatus according to this embodiment includes a holding unit, a polishing pad, a cleaning pad, a drying unit, and an imaging device.

  The holding unit holds the object to be polished. The object to be polished is, for example, a semiconductor device or a wafer. For example, polishing of an object to be polished exposes a desired layer (eg, a wiring layer in which wiring is embedded in an insulating layer, a via layer in which vias are embedded in an insulating layer, etc.) during failure analysis of a semiconductor device composed of multiple layers. Therefore, the polishing may be performed by removing one or a plurality of layers located above the desired layer by CMP. Alternatively, in a semiconductor device manufacturing process, for example, after a metal layer is formed on the insulating layer so as to fill a wiring groove (or via hole) formed in the insulating layer, the wiring pattern (or via pattern) is exposed. Polishing may be performed to remove a part of the metal layer until it is completed. The means by which the holding unit holds the object to be polished is not particularly limited, and can be realized according to the prior art. The object to be polished is held in contact with the holding surface of the holding unit.

  The holding unit repeatedly moves along a predetermined path in the first plane while holding the polishing target. That is, the movement trajectory in which the holding unit repeatedly moves is parallel to the first plane. For example, the holding unit reciprocates between a first point and a second point in the first plane. That is, the holding unit moves from the first point to the second point in a first plane along a predetermined route, and then passes through the same route as the route from the second point to the first point. The returning operation may be repeated. The movement between the first point and the second point may be a linear movement or a curved movement. The holding unit moves from the first point to the second point in a first plane along a predetermined route, and then passes through a predetermined route different from the route to the first point from the second point. You may repeat the operation | movement which returns to a point. For example, the holding unit may repeatedly perform an operation of drawing a ring-shaped orbit such as a circular or elliptical orbit.

  The holding unit can repeatedly move along a predetermined path in the first plane without moving to another plane. In other words, the holding unit can continue to exist in the first plane while repeatedly moving along a predetermined path in the first plane. The holding unit may repeatedly perform only the movement while repeatedly moving along the predetermined path in the first plane. The holding unit is attached to the polishing apparatus such that a holding surface that holds the object to be polished (a surface in contact with the object to be polished) is substantially parallel to the first plane. For this reason, while the holding unit repeatedly moves along the predetermined path in the first plane, the holding surface of the holding unit is a predetermined plane parallel to the first plane (hereinafter, “second plane”). It continues to exist within the second plane and repeatedly moves along a predetermined path in the second plane.

  Means for realizing the operation of the holding unit is not particularly limited, and can be realized by using a conventional technique such as a motor or a guide mechanism.

  The polishing pad polishes the polishing target surface to be polished that is held by the holding portion and repeatedly moves along a predetermined path. The polishing pad can be configured according to the prior art. The polishing pad has a polishing pad surface that comes into contact with the polishing target surface to be polished. A polishing liquid such as slurry is supplied onto the polishing pad surface, and the polishing pad surface and the surface to be polished come into contact with each other in this state.

  As described above, while the holding unit repeatedly moves along a predetermined path in the first plane, the holding surface of the holding unit continues to exist in the second plane, and the predetermined surface in the second plane. The route will be moved repeatedly. The polishing pad is attached to the polishing apparatus such that the polishing pad surface and the polishing target surface to be polished held in contact with the holding surface existing in the second plane are in contact with each other. The polishing pad surface is attached to the polishing apparatus so as to be substantially parallel to the first plane.

  The cleaning pad cleans the polishing target surface to be polished that is held by the holding unit and repeatedly moves along a predetermined path. The cleaning pad can be configured according to the prior art. The cleaning pad has a cleaning pad surface that comes into contact with the surface to be polished. A cleaning liquid such as pure water is supplied onto the cleaning pad surface, and the cleaning pad surface and the surface to be polished come into contact with each other in this state.

  As described above, while the holding unit repeatedly moves along a predetermined path in the first plane, the holding surface of the holding unit continues to exist in the second plane, and the predetermined surface in the second plane. The route will be moved repeatedly. The cleaning pad is attached to the polishing apparatus so that the cleaning pad surface and the polishing target surface to be polished held in contact with the holding surface existing in the second plane come into contact with each other. The cleaning pad surface is attached to the polishing apparatus so as to be substantially parallel to the first plane.

  The drying unit dries the polishing target surface to be polished that is held by the holding unit and repeatedly moves along a predetermined path. The drying unit is configured to eject air, for example.

  As described above, while the holding unit repeatedly moves along a predetermined path in the first plane, the holding surface of the holding unit continues to exist in the second plane, and the predetermined surface in the second plane. The route will be moved repeatedly. The drying unit is attached to the polishing apparatus so that air can be applied to the surface to be polished that is held in contact with the holding surface that exists in the second plane.

  The imaging device captures an image of a part or all of the polishing target surface that is held by the holding unit and repeatedly moves along a predetermined path.

  As described above, while the holding unit repeatedly moves along a predetermined path in the first plane, the holding surface of the holding unit continues to exist in the second plane, and the predetermined surface in the second plane. The route will be moved repeatedly. The imaging device is attached to the polishing device so that the polishing target surface can be focused and focused on the polishing target surface held in contact with the holding surface existing in the second plane.

  The polishing pad, the cleaning pad, the drying unit, and the processing for the polishing target by the imaging device are all performed while the polishing target that is held by the holding unit and repeatedly moves along the predetermined path moves through the predetermined path for one cycle. To be done.

  Specifically, while the polishing target moves along a predetermined path by one cycle, first, the polishing pad surface of the polishing pad comes into contact with the polishing target surface to be polished to polish the polishing target surface. Thereafter, the cleaning pad surface of the cleaning pad contacts the surface to be polished to clean the surface to be polished, and then the drying unit dries the surface to be polished. Thereafter, the imaging device images the surface to be polished. Note that while the object to be polished is repeatedly moved along a predetermined path, the processing by the polishing pad, the cleaning pad, the drying unit, and the imaging device is repeatedly performed.

  In order to realize the processing in the order as described above, when the first plane is viewed in plan, the polishing pad, the cleaning pad, the drying unit, and the imaging device are arranged on a predetermined path along which the polishing object repeatedly moves. They are arranged in order.

  According to the polishing apparatus of this embodiment, each time the polishing target moves along a predetermined path by one cycle, the polishing target is polished by a predetermined amount, and then the polishing target surface is cleaned by the cleaning pad. Then, the surface to be polished can be dried by the drying unit, and then the surface to be polished can be imaged by the imaging device. For this reason, according to the polishing apparatus of this embodiment, the state of the surface to be polished can be confirmed each time the object to be polished is polished for one cycle. Then, by appropriately adjusting the amount polished in one cycle (polishing time in one cycle), it is possible to avoid the disadvantage of excessively polishing the surface to be polished.

  Moreover, according to the imaging device of this embodiment, before imaging a surface to be polished, the surface to be polished is cleaned with a cleaning pad and then dried by a drying unit. For this reason, during imaging, slurry, polishing debris, and the like are sufficiently removed from the surface to be polished. Further, the liquid such as the cleaning liquid is sufficiently removed. Therefore, the surface to be polished can be imaged with the foreign matter removed, and the accuracy of analysis and observation of the captured image is improved.

  Here, in order to suppress variation in the amount of polishing in the surface to be polished, it is necessary to keep the surface to be polished held by the holding portion parallel to the surface of the polishing pad. If the surface to be polished is not parallel to the surface of the polishing pad, polishing at a location close to the polishing pad surface within the surface to be polished proceeds and polishing at a location far from the surface of the polishing pad is delayed.

  In the case of the means described with reference to FIG. 11, as described above, it is necessary to repeatedly perform the work of removing and reattaching the holding unit 3 holding the polishing object 4 from the apparatus. The more times such operations are repeated, the more likely the parallelism between the polishing target surface to be polished and the polishing pad surface of the polishing pad is impaired.

  On the other hand, according to the imaging apparatus of the present embodiment, the surface to be polished is polished, cleaned, dried, and the holding surface of the holding unit is in a predetermined plane (second plane), and Imaging can be performed. For this reason, when the holding unit is attached to the polishing apparatus, if the holding surface of the holding unit is adjusted to be parallel to the polishing pad surface of the polishing pad, then the parallel state is not greatly impaired, Surface polishing, cleaning, drying, and imaging can be repeated. Therefore, it is possible to reduce inconvenience that the positional relationship (parallelism) between the polishing target surface to be polished and the polishing pad surface of the polishing pad is shifted due to cleaning, drying, imaging, and the like of the polishing target surface. . As a result, variation in the polishing amount in the surface to be polished can be suppressed.

  Next, a specific example of the polishing apparatus of this embodiment will be described. The polishing apparatus described below is merely an example, and the configuration of the polishing apparatus of the present embodiment is not limited to this. In addition, the part which overlaps with the said description is abbreviate | omitted suitably.

  In FIG. 1, an example of the whole schematic diagram of the polisher of this embodiment is shown. FIG. 2 shows an example of a schematic top view of the polishing apparatus of the present embodiment. FIG. 3 shows a diagram in which a part of the polishing apparatus shown in FIG. 1 is extracted. In each figure, a part of the configuration shown in the other figures is omitted.

  As shown in FIG. 1, the polishing apparatus of this embodiment has a platen unit 70. The shape of the platen part 70 is a ring shape in which a cavity exists in the center part. FIG. 1 shows a cross-sectional view of the platen unit 70 so that the inside of the cavity can be observed. The cavity penetrates from the upper surface side to the lower surface side of the platen portion 70. A polishing pad 10 and a cleaning pad 20 are provided on the upper surface side of the platen unit 70.

  The platen unit 70 receives a driving force from the rotation driving device 90 and rotates. In the example shown in FIGS. 1 and 2, the rotation driving device 90 includes a driving unit such as a motor and a rotating shaft that rotates by receiving the driving force of the driving unit. The rotation shaft is connected to the shaft portion 80 of the platen unit 70 via a belt mechanism, and transmits the rotational force to the shaft portion of the platen unit 70. The platen unit 70 performs a rotational motion using the force received from the rotary drive device 90 via the shaft unit 80.

  The platen unit 70 is a rotation axis perpendicular to the polishing pad surface of the polishing pad 10 (the surface shown in FIG. 2), and the platen unit 70 has the polishing pad surface in plan view (see FIG. 2). It rotates around a rotation axis located in the cavity (hereinafter referred to as “platen part rotation axis”).

  The polishing pad 10 is located on the upper surface side of the platen unit 70. As shown in FIG. 2, the planar shape of the polishing pad 10 is a ring shape in which a first cavity exists at the center. When the platen unit 70 rotates, the polishing pad 10 also rotates. The polishing pad 10 rotates about the platen portion rotation axis.

  As shown in FIG. 2, when the polishing pad surface (the surface shown in FIG. 2) of the polishing pad 10 is viewed in plan, the polishing is performed from the platen portion rotation axis (first rotation axis) into the first cavity. The imaging device 60, the drying unit 50, and the cleaning pad 20 are arranged in this order toward the pad surface.

  The cleaning pad 20 is located on the upper surface side of the platen unit 70. As shown in FIG. 2, the planar shape of the cleaning pad 20 is a ring shape in which a second cavity exists at the center. When the platen unit 70 rotates, the cleaning pad 20 also rotates. The cleaning pad 20 rotates around the platen part rotation axis.

  As shown in FIG. 2, when the cleaning pad surface (the surface shown in FIG. 2) of the cleaning pad 20 is viewed in plan, cleaning is performed from the platen portion rotation axis (second rotation axis) into the second cavity. The imaging device 60 and the drying unit 50 are arranged in this order toward the pad surface.

  The polishing pad surface of the polishing pad 10 and the cleaning pad surface of the cleaning pad 20 are on the same plane.

  As shown in FIG. 2, the polishing apparatus includes a polishing liquid supply mechanism 11 that supplies a polishing liquid such as a slurry to the polishing surface of the polishing pad 10. The polishing apparatus also includes a cleaning liquid supply mechanism 21 that supplies a cleaning liquid (eg, pure water) to the cleaning pad surface of the cleaning pad 20.

  The platen unit 70 has a discharge groove (not shown) for discharging the liquid between the polishing pad 10 and the cleaning pad 20. The cleaning liquid supplied onto the cleaning pad surface of the cleaning pad 20 moves in the outer circumferential direction, that is, in the direction of the polishing pad 10 due to the centrifugal force resulting from the rotational movement of the platen unit 70. However, before the cleaning liquid reaches the polishing pad 10, the cleaning liquid enters a discharge groove located in front of the polishing pad 10. The discharge groove is connected to the discharge path 15 (see FIG. 1), and the cleaning liquid that has entered the discharge groove is discharged to the outside through the discharge path 15. In FIG. 1, the outlet of the discharge path 15 is provided on the side surface of the platen unit 70, but this is only an example.

  In the central cavity of the platen unit 70, the drying unit 50 and the imaging device 60 are located. The drying unit 50 and the imaging device 60 do not receive the force of the rotational movement of the platen unit 70. That is, even if the platen unit 70 rotates, the drying unit 50 and the imaging device 60 do not rotate. For example, the platen unit 70 is not in contact with the drying unit 50, the imaging device 60, and the base unit that supports them.

  As illustrated in FIG. 2, the imaging device 60 is disposed, for example, at a position overlapping the platen unit rotation axis in plan view. The drying unit 50 is disposed so as to surround the imaging device 60. In FIG. 2, only the region where the drying unit 50 is arranged is schematically shown.

  The holding unit 30 repeatedly reciprocates on a straight line connecting the imaging device 60 and an arbitrary position on the polishing pad surface of the polishing pad 10 in a plan view (see FIG. 2) while holding the polishing target 40. Moving. The reciprocating movement is a movement parallel to the polishing pad surface of the polishing pad 10 and the cleaning pad surface of the cleaning pad 20. Moreover, the holding | maintenance part 30 is comprised so that it can rotate, performing such reciprocation.

  According to the polishing apparatus, as shown in FIG. 3, while the holding unit 30 that holds the polishing object 40 moves from an arbitrary position on the polishing pad surface of the polishing pad 10 onto the imaging device 60, the polishing object 40. The following processing is performed on First, the polishing pad 10 contacts the polishing target surface of the polishing target 40 to polish the polishing target surface. Thereafter, the cleaning pad 20 comes into contact with the surface to be polished to clean the surface to be polished, and then the drying unit 50 blows air onto the surface to be polished to dry it. Thereafter, the imaging device 60 images the surface to be polished. Then, while the object to be polished is repeatedly reciprocating, the processing by the polishing pad 10, the cleaning pad 20, the drying unit 50, and the imaging device 60 is repeatedly performed.

  The processing time of each of polishing, cleaning, drying, and imaging is a design matter. For example, polishing: about 10 seconds, cleaning: about 2 seconds, drying: about 1 second, imaging: about 2 seconds Can do. By adjusting the size of the planar shape of the polishing pad 10 and the cleaning pad 20, the size of the area where the drying unit 50 is disposed, and the moving speed of the holding unit 30, a desired processing time can be realized.

  In addition, when the imaging device 60 images the polishing target surface of the polishing target 40, it is preferable to stop the rotation of the holding unit 30. The rotation of the platen unit 70 may be stopped or may not be stopped. However, in consideration of processing efficiency, it is preferable to continue the rotation without stopping.

  Next, FIG. 4 shows an example of a functional block diagram of the data processing apparatus 100 shown in FIG. As illustrated, the data processing apparatus 100 includes an imaging data acquisition unit 101, a comparison data holding unit 102, a stop timing determination unit 103, and a polishing control unit 104.

  The imaging data acquisition unit 101 is configured to be able to communicate with the imaging device 60 in a wired or wireless manner. Then, the imaging data acquisition unit 101 acquires imaging data captured by the imaging device 60 (an image obtained by imaging the polishing target surface of the polishing target 40: hereinafter, “captured image”) in real time.

  The comparison data holding unit 102 holds comparison data for pattern matching of captured images. The comparison data is, for example, data indicating characteristics of a pattern (hereinafter, “target pattern”) exposed on the polishing target surface when predetermined polishing is completed on the polishing target 40. The target pattern is, for example, a wiring pattern or a via pattern.

  The stop timing determination unit 103 uses the imaging data acquired by the imaging data acquisition unit 101 and the comparison data held by the comparison data holding unit 102 to pattern match the captured image, and the target pattern appears on the polishing target surface. Judge whether or not.

  When it is determined that the target pattern appears on the surface to be polished, the stop timing determination unit 103 determines to stop polishing on the polishing target 40. Then, information (signal) indicating that fact is transmitted to the polishing control unit 104.

  On the other hand, when it is determined that the target pattern does not appear on the polishing target surface, the stop timing determination unit 103 determines to continue the polishing on the polishing target 40. When continuing, the holding | maintenance part 30 continues the repeated movement in a 1st plane. Then, polishing, cleaning, drying, and imaging processing on the polishing object 40 held by the holding unit 30 are continued.

  Note that the processing by the stop timing determination unit 103 is executed in real time when the imaging data acquisition unit 101 acquires imaging data.

  The polishing control unit 104 stops polishing the polishing target surface of the polishing target 40 according to the timing determined by the stop timing determination unit 103. That is, when the polishing control unit 104 receives information (signal) indicating that the polishing of the polishing target 40 from the stop timing determination unit 103 is stopped, the polishing control unit 104 stops the polishing of the polishing target surface of the polishing target 40 in real time. Execute.

  The process for stopping the polishing of the polishing target surface of the polishing target 40 is not particularly limited. For example, the following configuration is conceivable.

  The polishing control unit 104 and the holding unit 30 are configured to be able to communicate by wire or wirelessly. Then, the polishing control unit 104 transmits a command to stop polishing to the holding unit 30 as processing for stopping polishing. Then, in accordance with a command from the polishing control unit 104, the holding unit 30 moves away from the first plane, that is, moves to a position where it does not contact the polishing pad 10 and the cleaning pad 20. Such a configuration of the holding unit 30 can be realized according to the prior art.

  In addition, the following examples can be considered. The polishing control unit 104 and the rotation driving device 90 are configured to be able to communicate with each other by wire or wirelessly. Then, the polishing control unit 104 transmits a command to stop the polishing to the rotation driving device 90 as a process of stopping the polishing. Then, the rotation drive device 90 stops the drive unit in accordance with a command from the polishing control unit 104.

  According to the polishing apparatus of the present embodiment described above, in addition to the above-described effects, the polishing can be automatically stopped when a predetermined polishing for the polishing object 40 is completed. For this reason, an operator's effort can be saved and the efficiency of a grinding | polishing process can be improved more. In addition, since the computer determines the polishing stop timing, it is possible to reduce the variation in the polishing amount between the plurality of polishing objects 40 as compared with the case where the human determines, and as a result, the quality of the plurality of polishing objects 40 can be reduced. Blur can be reduced.

<Second Embodiment>
The polishing apparatus of the present embodiment is different from the first embodiment in the configuration of the data processing apparatus 100. Since other configurations are the same as those of the first embodiment, description thereof is omitted.

  FIG. 5 shows an example of a functional block diagram of the data processing apparatus 100. As illustrated, the data processing apparatus 100 includes an imaging data acquisition unit 101, a polishing control unit 104, a captured image display unit 105, and a stop input reception unit 106.

  The configuration of the imaging data acquisition unit 101 is the same as that of the first embodiment. Therefore, the description here is omitted.

  The captured image display unit 105 uses the imaging data acquired by the imaging data acquisition unit 101 to display a captured image captured by the imaging device 60 on a display. The captured image display unit 105 executes the display process in real time when the captured data acquisition unit 101 acquires captured data. Then, when the captured data acquisition unit 101 acquires new captured data while displaying one image, the captured image display unit 105 changes the captured image to be displayed to a new captured image using the captured data ( Update). The captured image display unit 105 uses a plurality of captured data acquired by the captured data acquisition unit 101 and displays a list of captured images in time series so that the order acquired by the captured data acquisition unit 101 can be grasped. May be.

  The stop input receiving unit 106 receives an input from a user (operator or the like) to stop polishing on a polishing target. The means by which the stop input receiving unit 106 receives input from the user is not particularly limited, and any input device such as a microphone, a mouse, a touch panel display, a keyboard, and operation buttons can be used.

  For example, the user monitors a captured image displayed by the captured image display unit 105. That is, the user monitors the change of the polishing target surface of the polishing target 40 in real time. When a target pattern (the same concept as the target pattern described in the first embodiment) appears on the surface to be polished, an input for stopping polishing on the polishing target 40 is performed.

  When the stop input receiving unit 106 receives an input to stop polishing, the polishing control unit 104 executes a process for stopping the polishing of the polishing target surface of the polishing target 40 by using it as a trigger, and stops the polishing. Since the process of stopping the polishing of the polishing target surface of the polishing target 40 is as described in the first embodiment, the description thereof is omitted here.

  According to the present embodiment, it is possible to achieve the same operational effects as the first embodiment.

  In the present embodiment, the user monitors the change of the polishing target surface of the polishing target 40 and inputs to stop polishing. For this reason, a user's effort increases compared with 1st Embodiment. However, even if an unexpected inconvenience that cannot be detected by the computer occurs, it is possible to detect the inconvenience immediately by human observation.

<Third Embodiment>
The polishing apparatus according to this embodiment is different from the first and second embodiments in the configuration of the holding unit 30. Other configurations are the same as those in the first embodiment or the second embodiment, and thus description thereof is omitted here.

  FIG. 6 shows an example of a top view of the polishing apparatus of the present embodiment. In FIG. 6, the polishing liquid supply mechanism 11, the cleaning liquid supply mechanism 21, the rotation drive device 90, and the data processing device 100 are omitted.

  As shown in FIG. 6, the polishing apparatus according to the present embodiment includes a plurality of holding units 30. In the figure, the polishing apparatus has four holding portions 30, but the number is not limited to this.

  When the polishing apparatus is viewed in plan (the state shown in FIG. 6), each of the plurality of holding units 30 repeatedly reciprocates on a straight line connecting the imaging device 60 and the polishing pad surface of the polishing pad 10. . The paths along which each of the plurality of holding units 30 moves are different from each other. The path along which each of the plurality of holding units 30 moves overlaps on the imaging device 60, but the position on the other end side of the reciprocating movement (position on the polishing pad surface) is different from each other. The paths of the plurality of holding units 30 do not cross each other.

  The plurality of holding units 30 reciprocate so that the timings of returning to the imaging device 60 are different from each other (the timing of returning to the imaging device 60 is shifted).

  Although not shown, when the predetermined path is a ring-shaped orbit such as a circular or elliptical orbit in the first plane of the holding unit 30, the plurality of holding units 30 move along the same path. Also good. Naturally, the movement speeds and movement directions of the plurality of holding units 30 are the same, and the intervals between the plurality of holding units 30 are adjusted to be kept constant.

  In the case of this embodiment, the imaging device 60 sequentially and repeatedly images the polishing target surfaces of the plurality of polishing targets 40. That is, as shown in FIG. 6, when there are four holding units 30, the imaging device 60 is held by the second holding unit 30 after imaging the polishing object 40 held by the first holding unit 30. The polishing object 40 is imaged, and then the polishing object 40 held by the third holding unit 30 is imaged, and then the polishing object 40 held by the fourth holding unit 30 is imaged. Thereafter, the imaging device 60 captures the polishing object 40 held by the first holding unit 30 again, and repeats the above imaging.

  The data processing apparatus 100 of the present embodiment may be configured to identify a captured image of each of the plurality of polishing objects 40 and execute a predetermined process.

  For example, in the present embodiment, when the data processing apparatus 100 is configured as shown in FIG. 4, the stop timing determination unit 103 may perform the following processing. First, the stop timing determination unit 103 sequentially acquires M image data obtained by sequentially imaging the M polishing objects 40 held in the M holding units 30 in the order in which the imaging data acquisition unit 101 acquires the M groups. Sort out. Then, for each group, it may be determined whether the target pattern appears on the polishing target surface of the polishing target 40. Then, when the target pattern appears on the polishing target surface of the polishing target 40 in at least one group, or when the target pattern appears on the polishing target surface of the polishing target 40 in all groups, the polishing is decided to be stopped. May be.

  In addition, in the present embodiment, when the data processing apparatus 100 has the configuration illustrated in FIG. 5, the captured image display unit 105 sequentially captures the M polishing objects 40 held in the M holding units 30. The captured image data may be sorted into M groups in the order acquired by the imaging data acquisition unit 101, and the captured image may be displayed so that each group can be identified. For example, the latest captured images of M groups may be displayed as a list on the screen.

  According to the present embodiment, it is possible to achieve the same effects as the first embodiment and the second embodiment. Moreover, according to this embodiment, since the grinding | polishing to the some grinding | polishing object 40 can be performed in parallel, processing efficiency becomes good.

<Fourth Embodiment>
The polishing apparatus of the present embodiment is different from the first to third embodiments in the configurations of the holding unit 30, the imaging device 60, and the data processing apparatus 100. Other configurations are the same as those of the first embodiment, the second embodiment, or the third embodiment, and thus the description thereof is omitted here.

  FIG. 7 shows an example of a functional block diagram of the data processing apparatus 100. As illustrated, the data processing apparatus 100 includes an imaging data acquisition unit 101, a comparison data holding unit 102, a stop timing determination unit 103, a polishing control unit 104, a polishing state determination unit 107, and a holding surface control unit 108. And have. Instead of having the comparison data holding unit 102 and the stop timing determining unit 103, a captured image display unit 105 and a stop input receiving unit 106 can be provided.

  The configurations of the imaging data acquisition unit 101, the comparison data holding unit 102, the stop timing determination unit 103, the polishing control unit 104, the captured image display unit 105, and the stop input reception unit 106 are the first to third embodiments. Since it is the same as that of a form, description here is abbreviate | omitted.

  The polishing state determination unit 107 uses the imaging data acquired by the imaging data acquisition unit 101 (data of the captured image captured by the imaging device 60), and the polishing state (polishing amount) within the polishing target surface of the polishing target 40. It is determined whether or not there is a variation in. That is, it is determined whether or not there is a variation such as a certain point in the surface to be polished being polished or delayed compared to other portions. Hereinafter, an example of processing for determining whether or not there is variation in the polishing state (polishing amount) will be described.

  Here, a desired layer (a wiring layer in which wiring is embedded in an insulating layer, a via layer in which vias are embedded in an insulating layer, or the like) is exposed during failure analysis of a semiconductor device including a plurality of layers. An example in which polishing is performed to remove one or a plurality of layers positioned in an upper layer by CMP will be described.

  For example, an alignment mark is attached to the holding surface side of the holding unit 30. The alignment mark is provided at a position that is reflected in the captured image when the imaging device 60 captures the polishing target surface of the polishing target 40. When the imaging data acquisition unit 101 acquires a plurality of imaging data in time series, the polishing state determination unit 107 includes an alignment mark that is reflected in the captured image every time the imaging data acquisition unit 101 acquires one imaging data. Are used to determine a plurality of observation points at predetermined positions on the surface to be polished. The plurality of observation points can be determined at predetermined intervals along the outer periphery of the surface to be polished, for example. Each of the plurality of observation points is identified from each other using a relative positional relationship from the alignment mark.

  Then, the polishing state determination unit 107 monitors the polishing state at each observation point. Specifically, the polishing state determination unit 107 identifies the number of layers exposed at each observation point by sequentially observing a plurality of imaging data acquired in time series. . For example, the polishing state determination unit 107 may determine that the layer has changed when the color at each observation point changes by a predetermined amount. Alternatively, a pattern (local pattern) of each layer at the observation location of each observation point may be obtained in advance, and the currently exposed layer may be determined from the pattern shape. The pattern information may be via or wiring pattern information obtained from layout data, or the state after polishing of each layer may be observed in advance with another sample and compared as data, and the layer may be determined when the same state is recognized.

  Then, the polishing state determination unit 107 determines that there is a variation in the polishing state (polishing amount) when there is a deviation in the exposed layer between a plurality of observation points. For example, in the polishing state determination unit 107, the layer exposed at a certain observation point is the first layer, and the layer exposed at the other observation point is exposed when the first layer is removed 2. In the case of the first layer, it can be determined that the polishing amount at the former observation point is smaller than the polishing amount at the latter observation point.

  The holding surface control unit 108 changes the inclination of the holding surface of the holding unit 30 according to the determination of the polishing state determination unit 107.

  The variation of the polishing amount in the polishing target surface of the polishing target 40 may occur when the holding surface of the holding unit 30 and the polishing pad surface of the polishing pad 10 are not parallel. In such a case, the amount of polishing at a portion where the distance to the polishing pad surface on the polishing target surface of the polishing target 40 is small increases, and the amount of polishing at a portion where the distance to the polishing pad surface is large decreases.

  Therefore, the holding surface control unit 108 moves away from the polishing pad surface where the polishing amount is large (location where polishing is progressing), while approaching the polishing pad surface where the polishing amount is small (location where polishing is delayed). As described above, the inclination of the holding surface of the holding unit 30 is changed. The holding surface control unit 108 uses the alignment mark provided on the holding surface side of the holding unit 30 to determine the position on the holding surface that is close to the polishing pad surface and the position on the holding surface that is away from the polishing pad surface. Can be identified.

  The holding unit 30 is configured to be able to change the inclination of the holding surface that holds the polishing object 40 by computer control. The means for changing the inclination of the holding surface is not particularly limited, but an example will be described below.

  In FIG. 8, an example of the side surface schematic diagram of the holding | maintenance part 30 of this embodiment is shown. The illustrated holding unit 30 holds the polishing target 40. The communication with the data processing apparatus 100 is possible.

  The holding unit 30 is configured such that the plurality of support layers 33 and 34 stacked in the direction perpendicular to the holding surface and the plurality of support layers 33 and 34 are joined to each other, and the tightening degree can be individually changed by computer control. A plurality of adjusting screws 31 and 32. Then, the holding surface control unit 108 changes the inclination of the holding surface of the holding unit 30 by changing the tightening degree of the plurality of adjusting screws 31 and 32 individually. Note that the number of support layers and the number of adjusting screws are design matters.

  Note that the imaging apparatus 60 of the present embodiment may be configured to be movable in parallel with the first plane in which the holding unit 30 is repeatedly moving along a predetermined path. And you may be able to image the grinding | polishing target surface of the grinding | polishing target 40 in each position after a movement.

  For example, as illustrated in FIG. 9, the imaging device 60 may be disposed on a movable stage 111 that can move in the illustrated x and y directions. The moving stage 111 moves on the xy plane according to the control of the imaging position control device 110.

  If comprised in this way, it can focus on the outer peripheral part of the grinding | polishing target surface of the grinding | polishing target 40, and can image the outer peripheral part of a grinding | polishing target surface with higher precision. That is, the state of the plurality of observation points set by the holding surface control unit 108 can be imaged with high accuracy. As a result, it is possible to accurately specify the variation in the polishing amount in the surface to be polished.

  According to the present embodiment, it is possible to achieve the same operational effects as those of the first to third embodiments. Moreover, according to this embodiment, the dispersion | variation in the grinding | polishing amount in a grinding | polishing target surface can be reduced.

<Fifth Embodiment>
The polishing apparatus of the present embodiment is different from the first to fourth embodiments in the arrangement method of the polishing pad 10, the cleaning pad 20, the drying unit 50, and the imaging device 60.

  FIG. 10 shows an example of an overall schematic diagram of the polishing apparatus of the present embodiment. In FIG. 10, the polishing liquid supply mechanism 11, the cleaning liquid supply mechanism 21, the rotation drive device 90, and the data processing device 100 are omitted. Hereinafter, a different part from other embodiment is demonstrated.

  Unlike the first embodiment, the platen unit 70 of the present embodiment does not have a cavity at the center. The planar shape of the polishing pad 10 provided on the upper surface side of the platen unit 70 is, for example, a circle. The planar shape of the cleaning pad 20 provided on the upper surface side of the platen portion 70 is a ring shape and surrounds the outer periphery of the polishing pad 10. The drying unit 50 and the imaging device 60 are arranged at positions away from the platen unit 70.

  Also in this embodiment, the holding unit 30 that holds the polishing target 40 repeatedly reciprocates on a straight line connecting the imaging device 60 and an arbitrary position on the polishing pad surface of the polishing pad 10. When the first plane is viewed in plan, the polishing pad 10, the cleaning pad 20, the drying unit 50, and the imaging device 60 are arranged in this order on a predetermined path along which the polishing target 40 repeatedly moves. Yes.

  For this reason, also in the present embodiment, while the polishing target 40 held by the holding unit 30 and repeatedly moving along the predetermined path moves through the predetermined path for one cycle, the following process is performed. To be done. First, the polishing pad surface of the polishing pad 10 contacts the polishing target surface of the polishing target 40 to polish the polishing target surface. Thereafter, the cleaning pad surface of the cleaning pad 20 comes into contact with the surface to be polished to clean the surface to be polished, and then the drying unit 50 dries the surface to be polished. Thereafter, the imaging device 60 images the surface to be polished. Such processing is repeatedly performed.

  According to the present embodiment, it is possible to achieve the same operational effects as those of the first to fourth embodiments.

  As mentioned above, the invention made by the present inventor has been specifically described based on the embodiment. However, the present invention is not limited to the embodiment, and various modifications can be made without departing from the scope of the invention. Needless to say.

DESCRIPTION OF SYMBOLS 10 Polishing pad 11 Polishing liquid supply mechanism 15 Discharge path 20 Cleaning pad 21 Cleaning liquid supply mechanism 30 Holding part 31 Adjustment screw 32 Adjustment screw 33 Support layer 34 Support layer 40 Polishing object 50 Drying part 60 Imaging device 70 Platen part 80 Shaft part 90 Rotation Driving device 100 Data processing device 101 Imaging data acquisition unit 102 Comparison data holding unit 103 Stop timing determination unit 104 Polishing control unit 105 Captured image display unit 106 Stop input reception unit 107 Polishing state determination unit 108 Holding surface control unit 110 Imaging position control device 111 Moving stage

Claims (16)

A holding unit that holds an object to be polished and repeatedly moves along a predetermined path in the first plane;
A polishing pad that polishes the polishing target surface of the polishing target that is held by the holding unit and repeatedly moves along the predetermined path;
A cleaning pad for cleaning the polishing target surface of the polishing target that is held by the holding unit and repeatedly moves along the predetermined path;
A drying unit that dries the polishing target surface of the polishing target that is held by the holding unit and repeatedly moves along the predetermined path;
An imaging device that images the polishing target surface of the polishing target that is held by the holding unit and repeatedly moves along the predetermined path;
Have
The polishing pad polishes the polishing target surface of the polishing target while the polishing target held by the holding unit moves on the predetermined path by one cycle, and then the cleaning pad cleans the polishing target surface. A polishing apparatus in which the drying unit dries the surface to be polished, and then the imaging device images the surface to be polished. The polishing apparatus according to claim 1, wherein
A polishing apparatus in which the polishing pad, the cleaning pad, the drying unit, and the imaging device are arranged in this order on the predetermined path when the first plane is viewed in plan. The polishing apparatus according to claim 1, wherein
The polishing pad has a polishing pad surface that contacts the polishing target surface of the polishing target that is held by the holding portion and repeatedly moves along the predetermined path, and polishes the polishing target surface.
The cleaning pad has a cleaning pad surface that cleans the polishing target surface in contact with the polishing target surface of the polishing target that is held by the holding unit and repeatedly moves along the predetermined path;
The polishing apparatus wherein the polishing pad surface and the cleaning pad surface are on the same plane. The polishing apparatus according to claim 3, wherein
A polishing apparatus in which a discharge groove for discharging a liquid exists between the polishing pad surface and the cleaning pad surface. The polishing apparatus according to claim 1, wherein
The said drying part is a grinding | polishing apparatus comprised so that air may be sprayed on the said grinding | polishing target surface of the said grinding | polishing target currently hold | maintained at the said holding | maintenance part and is moving the said predetermined path | route repeatedly. The polishing apparatus according to claim 1, wherein
The polishing pad has a polishing pad surface that contacts the polishing target surface of the polishing target that is held by the holding portion and repeatedly moves along the predetermined path, and polishes the polishing target surface.
The planar shape of the polishing pad surface is a ring shape in which a first cavity is present at the center,
The polishing pad has a rotation axis perpendicular to the polishing pad surface, and is configured to be rotatable around a first rotation axis located in the first cavity when the polishing pad surface is viewed in plan. Has been
When the polishing pad surface is viewed in plan, the imaging device, the drying unit, and the cleaning pad are arranged in this order in the first cavity from the first rotating shaft toward the polishing pad surface. Polishing device arranged in. The polishing apparatus according to claim 6, wherein
The cleaning pad has a cleaning pad surface that cleans the polishing target surface in contact with the polishing target surface of the polishing target that is held by the holding unit and repeatedly moves along the predetermined path;
The planar shape of the cleaning pad surface is a ring shape having a second cavity in the center,
The cleaning pad has a rotation axis perpendicular to the cleaning pad surface, and is configured to be rotatable around a second rotation axis located in the second cavity when the cleaning pad surface is viewed in plan view. Has been
When the cleaning pad surface is viewed in plan, the imaging device and the drying unit are arranged in this order in the second cavity from the second rotating shaft toward the cleaning pad surface. Polishing equipment. The polishing apparatus according to claim 6 or 7,
When the first plane is viewed in plan, the holding unit reciprocates on a straight line connecting the imaging device and an arbitrary position on the polishing pad surface. The polishing apparatus according to claim 8, wherein
There are a plurality of the holding parts,
When the first plane is viewed in plan, each of the plurality of holding units is reciprocatingly moved on a straight line connecting the imaging device and different positions on the polishing pad surface. The polishing apparatus according to claim 9, wherein
When the first plane is viewed in plan, the plurality of holding units are reciprocatingly moved so that the timing of returning to the imaging device is different from each other. The polishing apparatus according to claim 1, wherein
Using a captured image captured by the imaging device, a stop timing determination unit that determines a timing to stop polishing on the polishing target;
In accordance with the timing determined by the stop timing determination unit, a polishing control unit that stops polishing the polishing target surface of the polishing target;
A polishing apparatus further comprising: The polishing apparatus according to claim 1, wherein
A captured image display unit that displays a captured image captured by the imaging device on a display; a stop input reception unit that receives an input to stop polishing from the user to the polishing target;
When the stop input receiving unit receives an input to stop polishing, a polishing control unit that uses the trigger as a trigger to stop polishing on the polishing target surface of the polishing target;
A polishing apparatus further comprising: The polishing apparatus according to claim 1, wherein
The holding unit is configured to be able to change the inclination of the holding surface holding the object to be polished by computer control,
Using a captured image captured by the imaging device, a polishing state determination unit that determines whether there is a variation in the polishing state in the surface to be polished,
A holding surface control unit that changes the inclination of the holding surface of the holding unit according to the determination of the polishing state determination unit;
A polishing apparatus further comprising: The polishing apparatus according to claim 13, wherein
The holding unit is configured to join a plurality of support layers stacked in a direction perpendicular to the holding surface and the plurality of support layers to each other, and a plurality of support layers can be individually changed by computer control. An adjustment screw,
The said holding surface control part is a grinding | polishing apparatus which changes the inclination of the said holding surface of the said holding part by changing the tightening degree of these adjustment screws. The polishing apparatus according to claim 13, wherein
The polishing apparatus is capable of moving in parallel with the first plane, and can image the polishing target surface of the polishing target at each position after the movement.   A method for manufacturing a semiconductor device, comprising a step of polishing a surface to be polished of a semiconductor device to be polished using the polishing apparatus according to claim 1.

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