JP2013220706A - Heat medium heating device, and vehicle air conditioner equipped with the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat medium heating device that allows easy connection between electrode plates of PTC heaters and a control substrate by surely positioning terminals of the electrode plates while ensuring insulation properties, and a vehicle air conditioner equipped with the same.SOLUTION: A heat medium heating device 10 is configured as follows. A heat exchange element 20, in which a plurality of flat heat exchange tubes 21 and a plurality of sets of PTC heaters 26 are alternately laminated in a multi-layered manner, is fastened and fixed to one surface side of a partition wall 12 of a casing 11. A control substrate 33 is placed on the other surface side. Terminals 29 extended from electrode plates of the PTC heaters 26 are configured to be connectable to a terminal block 42 provided on the control substrate 33 while penetrating through an opening of the partition wall 12. The terminals 29 are made to penetrate through to the control substrate 33 side through positioning holes 41 provided in a terminal cover 39 provided on the control substrate 33 side and fitted and placed to the opening, thereby allowing the positioning to the terminal block 42.

Description

  The present invention relates to a heat medium heating device that heats a heat medium using a PTC heater, and a vehicle air conditioner including the heat medium heating device.

  In a vehicle air conditioner applied to an electric vehicle, a hybrid vehicle, or the like, a positive temperature coefficient thermistor element (hereinafter referred to as “Positive Temperature Coefficient”; hereinafter) A device using a PTC heater having a heat generating element as a PTC element) is known. In such a heat medium heating device, Patent Document 1 provides a plurality of partition walls that divide the inside of a housing having a heat medium outlet / inlet passage into a heating chamber and a heat medium circulation chamber, and the partition walls are provided on the heating chamber side. A PTC heater is inserted and installed in contact with the heating chamber to heat the heat medium flowing through the circulation chamber side, and a PTC heater control board is disposed at the upper position.

  Further, Patent Document 2 discloses a laminated structure heat medium in which a pair of heat medium circulation portions are stacked on both sides of a PTC heater and a substrate housing portion for housing a control substrate is provided on one surface side thereof. A heating device is disclosed. Furthermore, in Patent Document 3, a heat exchanging portion in which a large number of flat heat exchange tubes are provided between a pair of headers is provided in a casing having a heat medium outlet / inlet passage, and between the flat heat exchange tubes. A heat medium heating device is disclosed in which PTC heaters are installed and a control substrate for the PTC heaters is disposed at the upper position thereof.

  However, in Patent Documents 1 and 3, it is difficult to make the PTC heater and the partition wall or the flat heat exchanger tube serving as a heat transfer surface adhere to each other, the contact heat resistance between them increases, and the heat transfer efficiency decreases. have. On the other hand, since the thing of patent document 2 can laminate | stack and fix a PTC heater and a heat-medium distribution | circulation part, it can raise adhesiveness and can reduce contact thermal resistance, However, PTC heater is arrange | positioned in multiple layers. It is difficult to reduce the size and weight and the cost.

  Under such circumstances, a heat exchange tube with a flat structure is used, and the flat heat exchange tube and the PTC heater are alternately laminated in multiple layers to form a heat exchange element, which is then clamped and fixed in the casing. Thus, development of a heat medium heating device that reduces the contact thermal resistance between the flat heat exchanger tube and the PTC heater, improves the heat transfer efficiency, and achieves a reduction in size and weight and cost.

JP 2008-7106 A JP 2011-16489 A JP 2011-79344 A

  As described above, in the heat medium heating device in which the heat exchange element having the configuration in which the flat heat exchange tubes and the PTC heaters are alternately stacked in layers is pressed and fixed in the casing, the heat exchange element is interposed between the flat heat exchange tubes and the PTC heaters. Therefore, the heat medium heating device can be reduced in size and performance. However, the PTC heater is constructed by joining electrode plates to both sides of a PTC element, and is laminated between flat heat exchanger tubes with an insulating film and a heat conductive sheet interposed on both sides. When the tube and the PTC heater are laminated and fixed in multiple layers, the PTC heater may be displaced.

  In the case of a configuration in which the electrode plate and the control board are connected by a harness, as described above, the electrode plate and the control board can be electrically connected even if the PTC heater is slightly displaced. However, when the terminal extended from the electrode plate is directly screwed and connected to the terminal block provided on the control board side, the PTC heater is incorporated in a state of being slightly displaced, When screwing the terminal of the board to the terminal block, there is a problem that the hole position is not aligned and the connection cannot be made.

  Therefore, when pressing and fixing the heat exchange element to the casing, it is necessary to position and incorporate a plurality of electrode plates constituting a plurality of sets of PTC heaters, but depending on the structure for fixing the heat exchange element to the casing, In some cases, it is not possible to position the electrode plate using the casing, and how to position the terminal of the electrode plate with respect to the terminal block on the control board side while ensuring insulation is an issue .

  The present invention has been made in view of such circumstances, and includes a heat exchange element in which flat heat exchange tubes and PTC heaters are alternately laminated in a multilayer structure, and a gap between an electrode plate of the PTC heater and a control board. An object of the present invention is to provide a heat medium heating device and a vehicle air conditioner equipped with the heat medium heating device that can reliably connect the terminals of the electrode plate while ensuring insulation.

In order to solve the above-described problems, the heat medium heating device of the present invention and the vehicle air conditioner including the same employ the following means.
That is, in the heat medium heating device according to the present invention, a casing in which a partition wall is provided, a plurality of flat heat exchanger tubes through which the heat medium flows and a plurality of sets of PTC heaters are alternately stacked in multiple layers, A heat exchange element that is fastened and fixed to one side of the partition wall, a control circuit that controls energization of the PTC heater, and a control board that is installed on the other side of the partition wall, and A terminal extended from the electrode plate of the PTC heater can be connected to a terminal block provided on the control board through the opening of the partition wall, and the terminal is connected to the control board side. It is possible to position relative to the terminal block by penetrating to the control board side through a positioning hole provided in a terminal cover fitted and installed in the opening. And said that you are.

  According to the present invention, in the casing provided with the partition wall, the heat exchange element is fastened and fixed on one surface side of the partition wall, the control board is installed on the other surface side, and the PTC heater on the heat exchange element side The terminal extended from the electrode plate can be connected to a terminal block provided on the control board through the opening of the partition wall, and the terminal is provided on the control board. Since it can be positioned with respect to the terminal block by penetrating to the control board side through the positioning hole of the terminal cover fitted and installed in the part, heat is applied to one side of the casing across the partition wall. Even if the replacement element is tightened and fixed, and the control board is installed on the other side, the terminal extended from the electrode plate of the PTC heater is connected to the terminal cover provided on the control board side. By penetrating the control board side through the positioning hole of over always in a state of being positioned at a predetermined connecting position, the control board and the heat exchange element can be assembled to the casing with respect to the terminal block of the control board side. Therefore, flat heat exchanger tubes and PTC heaters stacked alternately in multiple layers are fastened and fixed to the partition wall, reducing the contact thermal resistance between them and improving the heat transfer efficiency, thereby improving the performance of the heat medium heating device. Can be In addition, the electrical connection between the PTC heater and the control board can be simplified and facilitated, their assemblability can be improved, and the insulation distance of each electrode plate is kept constant to ensure insulation performance. Can do.

  Furthermore, the heat medium heating device of the present invention is the above-described heat medium heating device, wherein the terminals of the plurality of electrode plates of the plurality of sets of PTC heaters are arranged in a single line with a predetermined interval on each side. The plurality of terminals are directly arranged on the terminal block arranged in series on one side of the control board through the plurality of positioning holes arranged in series on the terminal cover. It is characterized in that it can be screwed.

  According to the present invention, a plurality of electrode plates of a plurality of sets of PTC heaters are provided with terminals arranged in a line in a line at a predetermined interval on each side, and the plurality of terminals are terminals. Screws can be directly screwed to the terminal block arranged in series on one side of the control board through a plurality of positioning holes arranged in series in the cover. A plurality of terminals extending from one electrode plate (two electrode plates are used for one set of PTC heaters) are arranged in series in a single line, and the terminals are arranged in series in a terminal cover. By positioning each of the plurality of terminal blocks arranged in series on the control board through the holes, the terminals can be screwed to the terminal block. Therefore, a plurality of terminals can be screwed on a straight line, and the connection work between the control board and the electrode plate of the PTC heater can be performed efficiently.

  Furthermore, the heat medium heating device of the present invention is the above heat medium heating device, wherein a work window having a detachable lid is provided on one side of the casing, and the terminal block is provided through the work window. And the terminal can be screwed.

  According to the present invention, a work window having a detachable lid is provided on one side of the casing, and the terminal can be screwed to the terminal block through the work window. The terminal can be screwed to the terminal block from the side surface of the casing with the work window opened. Therefore, it is not necessary to secure a space for screwing in the casing, and a terminal block or terminal may be arranged at the very inner surface, and the casing and, consequently, the heat medium heating device can be downsized to improve its mountability. can do.

  Furthermore, in the heat medium heating device according to the present invention, in any one of the heat medium heating devices described above, the terminal cover is a molded product made of an insulating resin material and is fixed to the back surface side of the control board. It is characterized by being installed.

  According to the present invention, since the terminal cover is a molded product made of an insulating resin material and is fixedly installed on the back side of the control board, the terminal cover is integrated with the control board and the opening of the partition wall. Each terminal is positioned with respect to the terminal board on the control board side by penetrating a plurality of terminals to the control board side through a plurality of positioning holes arranged in series in the terminal cover. At the same time, each terminal can be insulated from the partition wall. Therefore, along with the positioning of each terminal, the insulation distance of each electrode plate can be kept constant, and the insulation performance can be ensured.

  Furthermore, in the heat medium heating device according to the present invention, in any one of the heat medium heating devices described above, an insulating sheet is fixed to the back surface of the control board via the terminal cover, and the control is performed via the insulating sheet. The heat of the power control semiconductor switching element provided on the substrate can be transmitted to the partition wall.

  According to the present invention, the insulating sheet is fixed to the back side of the control board via the terminal cover, and the heat of the semiconductor switching element for power control provided on the control board via the insulating sheet is applied to the partition wall. Since it is possible to transmit, the insulating sheet interposed between the partition wall and the control board can be fixed via a terminal cover fixedly installed on the back surface of the control board and assembled in a pre-positioned state. it can. Therefore, the insulating sheet can be positioned without providing mutual positioning holes, protrusions, etc. between the partition wall, the control board and the insulating sheet, and the semiconductor switching element on the control board can reliably generate heat through the insulating sheet. Can be transmitted to the partition wall to dissipate heat. Further, when designing the control board, the space can be effectively used because there are no holes or protrusions.

  Furthermore, the heat medium heating device of the present invention is the above heat medium heating device, wherein the semiconductor switching element is mounted on the front surface side of the control board, and on the control board, on the back surface side corresponding to the mounting position. A heat penetration part that penetrates is provided.

  According to the present invention, the semiconductor switching element is mounted on the front surface side of the control board, and the control board is provided with the heat penetration portion penetrating the back surface side corresponding to the mounting position. Heat generated by the mounted semiconductor switching element can be transmitted to the back side of the control board via the heat penetration part, and can be radiated to the partition wall via the insulating sheet interposed on the back side. Therefore, even when a control board on which a semiconductor switching element is surface-mounted is used, the cooling performance for the element can be sufficiently secured and the operation of the control circuit can be stabilized.

  Furthermore, in the heat medium heating device according to the present invention, in the heat medium heating device, the insulating sheet is provided with an opening corresponding to the position of the heat penetration portion, and the heat penetration portion and the A heat conductive insulator such as a heat conductive liquid gap material is interposed between the partition wall and the partition wall.

  According to the present invention, the insulating sheet is provided with an opening corresponding to the position of the heat penetration part, and the heat conduction insulation such as a heat conductive liquid gap material is provided between the heat penetration part and the partition wall through the opening. Since the body is interposed, even if there is a manufacturing variation in the state of penetration to the back side of the heat penetration part in the control board, such as a thermally conductive liquid gap material interposed in the opening Absorbed by the heat conductive insulator, the heat generated by the semiconductor switching element can be reliably transferred to the partition wall and radiated. Therefore, the heat dissipation and insulation of the control board on which the semiconductor switching element is surface-mounted can be secured, and the quality of the heat medium heating device can be stabilized and improved. In this case, the insulating sheet does not necessarily have thermal conductivity.

  Furthermore, in the heat medium heating device of the present invention, in any one of the heat medium heating devices described above, a discrete type power control semiconductor switching element is provided on the other surface side of the partition wall via a heat conductive insulating sheet. It is installed and the said control board is installed in the upper part, It is characterized by the above-mentioned.

  According to the present invention, the discrete type power control semiconductor switching element is installed on the other surface side of the partition wall via the heat conductive insulating sheet, and the control board is installed on the upper part thereof. Even when a discrete type semiconductor switching element is used, the semiconductor switching element is installed on the partition wall via a thermally conductive insulating sheet to ensure heat dissipation and insulation, and above it. A control circuit can be configured together with the installed control board to control energization to the PTC heater. Therefore, the specifications of the control board can be diversified, the degree of freedom in designing the heat medium heating device can be increased, and the cooling performance of the semiconductor switching element can be further stabilized.

  Furthermore, the vehicle air conditioner according to the present invention is configured such that the heat medium heated by the heat medium heating device can be circulated with respect to the radiator disposed in the air flow passage. The heat medium heating device is any one of the above-described heat medium heating devices.

  According to the present invention, in a vehicle air conditioner configured such that the heat medium heated by the heat medium heating device can be circulated with respect to the radiator disposed in the air flow passage, the heat medium heating device Is any one of the above-described heat medium heating devices, the heat medium supplied to the radiator disposed in the air flow passage can be easily assembled, and the above-described heat medium can be easily reduced in size and performance. It can be heated and fed by a medium heating device. Therefore, it is possible to improve the mountability of the air conditioner on the vehicle, and to improve the air conditioning performance of the vehicle air conditioner, particularly the heating performance.

  According to the heat medium heating device of the present invention, even if the heat exchange element is fastened and fixed on one side of the casing with the partition wall in between and the control board is installed on the other side, it is extended from the electrode plate of the PTC heater. The control board in a state where it is always positioned at a predetermined connection position with respect to the terminal board on the control board side by penetrating the terminal to the control board side through the positioning hole of the terminal cover provided on the control board side. Since the heat exchange element and the casing can be assembled to the casing, flat heat exchanger tubes and PTC heaters, which are alternately stacked in multiple layers, are fastened to the partition wall to reduce the contact thermal resistance between them. The heat efficiency can be improved and the heat medium heating device can be improved. In addition, the electrical connection between the PTC heater and the control board can be simplified and facilitated, their assemblability can be improved, and the insulation distance of each electrode plate is kept constant to ensure insulation performance. Can do.

  In addition, according to the vehicle air conditioner of the present invention, the heat medium supplied to the radiator disposed in the air flow passage is easily assembled and is small and high performance by the above-described heat medium heating apparatus. Since it can be heated and supplied, it is possible to improve the mountability of the air conditioner to the vehicle, and to improve the air conditioning performance of the vehicle air conditioner, particularly the heating performance.

It is a schematic block diagram of the vehicle air conditioner provided with the heat-medium heating device which concerns on 1st Embodiment of this invention. It is a disassembled perspective view of the heat carrier heating apparatus shown in FIG. It is a longitudinal cross-sectional view in the position which passes along the heat-medium exit / inlet path of the heat-medium heating device shown in FIG. It is a longitudinal cross-sectional view in the one side position which performs the terminal connection between the control board and electrode plate of the heat carrier heating apparatus shown in FIG. It is a top view of the state which removed the upper plate of the heat carrier heating apparatus shown in FIG. FIG. 6 is an exploded perspective view of a state in which a control board and a terminal cover of the heat medium heating device shown in FIG. 5 are assembled. It is a perspective view of the back surface side of the control board and terminal cover shown in FIG. It is a fragmentary longitudinal cross-sectional view in the position corresponding to the semiconductor switching element for electric power control of the state which installed the control board shown in FIG. 7 on the partition wall. It is a top view of the state which removed the upper plate of the heat carrier heating apparatus which concerns on 2nd Embodiment of this invention. FIG. 10 is an exploded perspective view of a state in which the control board and the terminal cover of the heat medium heating device shown in FIG. 9 are assembled. It is a fragmentary longitudinal cross-sectional view of the state which installed the semiconductor switching element for electric power control shown in FIG. 10 on the partition wall.

Embodiments according to the present invention will be described below with reference to the drawings.
[First Embodiment]
Hereinafter, a first embodiment of the present invention will be described with reference to FIGS.
FIG. 1 shows a schematic configuration diagram of a vehicle air conditioner including a heat medium heating device according to the first embodiment of the present invention.
The vehicle air conditioner 1 is provided with a casing 3 that forms an air flow passage 2 for taking outside air or vehicle interior air and adjusting the temperature thereof, and then guiding it to the vehicle interior.

  Inside the casing 3, a blower 4 that sucks and pressurizes outside air or passenger compartment air in order from the upstream side to the downstream side of the air flow passage 2 and pumps it to the downstream side, and is pumped by the blower 4. The flow rate ratio of the cooler 5 that cools the air to be cooled, the radiator 6 that heats the air that has passed through the cooler 5, and the amount of air that passes through the radiator 6 and the amount of air that bypasses the radiator 6 And an air mix damper 7 that adjusts the temperature of the temperature-controlled air by installing the air mix on the downstream side thereof.

The downstream side of the casing 3 is connected to a plurality of outlets for blowing out temperature-controlled air into the vehicle compartment via an outlet mode switching damper and a duct (not shown).
The cooler 5 constitutes a refrigerant circuit together with a compressor, a condenser, an expansion valve, etc., not shown, and cools the air passing therethrough by evaporating the refrigerant adiabatically expanded by the expansion valve. . The radiator 6 constitutes a heat medium circulation circuit 10A together with the tank 8, the pump 9, and the heat medium heating device 10, and a heat medium (for example, antifreeze liquid or hot water) heated to a high temperature by the heat medium heating device 10 is used. By circulating through the pump 9, the air passing therethrough is heated.

2 is an exploded perspective view of the heat medium heating device 10 shown in FIG. 1, FIG. 3 is a longitudinal sectional view at a position passing through the heat medium outlet / inlet passage, and FIG. A longitudinal sectional view at one side side position for performing terminal connection between the control board and the electrode plate is shown.
The heat medium heating device 10 includes a casing 11 made of an aluminum die-cast having a quadrangular shape with a bottom surface and an upper surface opened and a partition wall 12 provided therein. The bottom surface of the casing 11 is sealed by a bottom plate 13 that is screw-coupled, and the upper surface is sealed by an upper plate 14 that is screw-coupled.

  The casing 11 is integrally formed with a pair of heat medium inlet passage 15 and heat medium outlet passage 16 that protrude upward from the upper surface side (other surface side) of the partition wall 12 and then extend laterally. The heat medium outlet / inlet passages 15 and 16 pass through the partition wall 12 and are opened on the bottom surface side (one surface side) of the partition wall 12. The partition wall 12 is provided with openings 17 (see FIGS. 4 and 5) for penetrating a plurality of terminals 29 to be described later along one side. The boss portion 18 is integrally formed. The boss portion 18 is for fastening and fixing a heat exchanger pressing member 32 described later. Further, mounting brackets 19 for the heat medium heating device 10 are provided on both sides of the outer peripheral surface of the casing 11.

  A heat exchange element 20 is incorporated on the bottom surface side (one surface side) of the partition wall 12 of the casing 11. The heat exchange element 20 is configured by alternately laminating a plurality of flat heat exchange tubes 21 and a plurality of sets of PTC heaters 26 in multiple layers, and is fastened and fixed to the boss portion 18 via screws 31. The flat heat exchanger tube 21 and the PTC heater 26 are installed so as to be in close contact with each other by being pressed against the partition wall 12 by a plate-like heat exchanger pressing member 32.

  The flat heat exchanger tube 21 is a tube having a thickness of several millimeters obtained by superposing and brazing a pair of molded plates obtained by press-molding aluminum alloy thin plates, and an inlet header portion 22 and an outlet header portion 23 are provided on one end side. The flat tube portion 24 that extends from the inlet header portion 22, makes a U-turn on the other end side, and forms a U-turn flow path to the outlet header portion 23 is provided. A corrugated inner fin (not shown) is inserted into the U-turn flow path of the flat tube portion 24. The inlet / outlet header portions 22 and 23 are provided with communication holes that communicate the outlet / inlet header portions 22 and 23 of the adjacent flat heat exchanger tubes 21 with seals such as O-rings around the communication holes. The material 25 is sealed.

  The PTC heater 26 is composed of a PTC element 27 and a pair of electrode plates 28 bonded to both surfaces thereof. The PTC heater 26 is formed in a square plate shape, and the flat tube portion 24 of the flat heat exchanger tube 21. It is comprised so that it may laminate | stack in the shape of a sandwich between them. Each electrode plate 28 is provided with a plurality of terminals 29 extending from one side thereof and bent upward in an L-shape and arranged in series in a single line at a predetermined interval. The terminal 29 is configured to extend upward through the opening 17 of the partition wall 12. Moreover, the PTC heater 26 is laminated | stacked between the flat tube parts 24 via an insulating film, the heat conductive sheet 30, etc. FIG.

  The heat exchange element 20 has a heat medium outlet / inlet passage in which the inlet / outlet header portions 22 and 23 of the flat heat exchanger tube 21 pass through the partition wall 12 and are opened on the bottom surface side (one surface side) of the partition wall 12. 15 and 16 are incorporated by interposing a sealing material 25 such as an O-ring at the connection part. The opening on the bottom side of the casing 11 is sealed by the bottom plate 13 after the heat exchange element 20 is assembled.

  On the upper surface side (other surface side) of the partition wall 12 is fixedly installed a control board 33 for controlling energization of the PTC heater 26 using the side space (dead space) of the heat medium outlet / inlet passages 15 and 16. Has been. The control board 33 has a plurality of power control semiconductor switching elements (hereinafter also referred to as a semiconductor switching element 34) such as an IGBT for controlling energization to the PTC heater 26 and a control circuit mounted on the surface. 12 is fastened and fixed by screws 36 via a heat conductive insulating sheet 35 or the like incorporated as will be described later.

  The plurality of semiconductor switching elements 34 on the control board 33 are heat generating components, and can be cooled by using the partition wall 12 in contact with the flat heat exchanger tube 21 of the heat exchange element 20 as a heat sink. The partition wall 12 here is made of an aluminum alloy. Since the semiconductor switching element 34 is mounted on the front surface side of the control board 33 and the heat generated is dissipated to the partition wall 12 on the back surface side to cool down, as shown in FIG. 3 and FIGS. The configuration is adopted.

  Corresponding to the part where the semiconductor switching element 34 of the control board 33 is installed, a heat penetration part 37 made of a high thermal conductivity material such as copper or aluminum is provided so as to penetrate from the front side to the back side. Heat generated by the semiconductor switching element 34 is transferred to the back side of the control board 33 via the part 37. However, since the amount of retraction and protrusion of the heat penetration part 37 from the back surface of the control board 33 has manufacturing variations, the heat penetration part 37 is normally attached to the partition wall 12 and the heat conductive insulating sheet 35. There is no guarantee that they are in contact with each other, and in this case, heat dissipation and electrical insulation of the control board 33 are not ensured.

  Therefore, as shown in FIG. 8, a plurality of openings 35A are provided in a portion corresponding to the heat penetration portion 37 of the insulating sheet 35, and a heat conductive liquid gap material (heat) made of an insulating heat conductive material is provided in the openings 35A. By interposing the conductive insulator 38, the manufacturing variation of the heat penetration part 37 is absorbed, and the heat penetration part 37 and the partition wall 12 are reliably thermally connected while maintaining electrical insulation. A heat transfer path is formed. The thermally conductive liquid gap material 38 is a thermally conductive silicone elastomer, which uses silicone as a base resin, and uses fiberglass, alumina, etc. as a core material and a filler. What is cured is known. The thermally conductive liquid gap material 38 functions as a shape following elastic body.

  In the present embodiment, on the premise that the thermally conductive liquid gap material 38 that is cured from a liquid is used, an opening 35A is provided in the insulating sheet 35, and the area of the opening 35A is larger than the area of the heat penetration portion 37. By increasing the size, even if the partition wall 12, the control board 33, the insulating sheet 35, etc. are relatively displaced due to the accumulation of dimensional tolerances, the thermally conductive liquid gap material 38 interposed in the opening 35A and the heat penetration The part 37 is made to correspond reliably. In this case, the insulating sheet 35 is not necessarily required to have thermal conductivity, and a high-hardness sheet such as a polyimide film dedicated to insulation having electrical insulation can be used.

  Further, as described above, the control board 33 is fastened and fixed to the upper surface side of the partition wall 12 with the plurality of screws 36 via the insulating sheet 35. The insulating sheet 35 is desirably positioned and incorporated with respect to the upper surfaces of the control board 33 and the partition wall 12 and is usually positioned by providing positioning protrusions and holes, but in this embodiment, the control board 33 is positioned. The terminal cover 39 fixed on the back surface of the control board 33 is used, and the sheet presser 40 provided on the terminal cover 39 allows the insulating sheet 35 to be positioned and installed in a predetermined position on the back surface of the control board 33 in advance. Yes. As a result, the position of the heat penetration part 37 on the control board 33 side and the position of the opening 35A for interposing the heat conductive liquid gap material 38 on the insulating sheet 35 side can be assembled in a reliable manner.

  The terminal cover 39 is fixedly installed on the back surface of the control board 33, and a plurality of terminals 29 extending from the electrode plate 28 of the PTC heater 26 are arranged in series on one side of the back surface of the control board 33. The control board 33 is fitted and installed in the opening 17 of the partition wall 12 by being fastened and fixed to the upper surface of the partition wall 12 with screws 36. It has become so. This terminal cover 39 is an integrally molded product made of, for example, an insulating resin material such as PBT, and a plurality of slit-like positioning holes 41 through which the plurality of terminals 29 pass are aligned in a portion fitted to the opening 17. Arranged in series.

  That is, the heat exchange element 20 configured by laminating the electrode plate 28, that is, the PTC heater 26 and the flat heat exchanger tube 21 in a state where the terminal 29 is passed through the positioning hole 41 of the terminal cover 39. Then, the PTC heater 26 and the electrode plate 28 are assembled so as not to be displaced by being fastened and fixed to one side of the partition wall 12, and the terminal 29 extended from the electrode plate 28 is connected to the terminal block 42 of the control board 33. It is set as the structure which can be positioned with respect to. In addition, the part in which the positioning holes 41 of the terminal cover 39 are arranged in series is formed in a wave shape in order to ensure strength.

  The control board 33 is provided with a plurality of terminal blocks 42 arranged in series on one side, to which the terminals 29 integrated with the electrode plate 28 are directly connected via the screws 43 as described above. A plurality of PN terminal blocks 44 to which the PN terminals 46 of a bifurcated power supply HV harness (High-Voltage harness) 45 are connected via screws 47 are provided adjacent to the terminal block 42. In addition, an LV connector (not shown) to which a connector 49 on the control LV harness (Low-Voltage harness) 48 side can be connected is provided.

  As shown in FIGS. 2 and 6, on one side of the casing 11, when the terminal 29 of the electrode plate 28 is screwed to the terminal block 42 via the screw 43, and the HV harness 45 for power supply A work window 50 is opened when the PN terminal 46 is screwed to the PN terminal block 44 via screws 47. The work window 50 is sized so that the screws 43 and 47 can be tightened. A lid 51 is detachably attached to the work window 50 via screws or the like.

  The opening on the upper surface side of the casing 11 is connected to the terminal board 42 of the control board 33 by screwing a terminal 29 extended from the electrode plate 28 while installing the control board 33 on the upper surface of the partition wall 12. After that, the upper plate 14 can be sealed. The upper plate 14 is configured to be hermetically attached to the casing 11 via a sealing material such as a liquid gasket. When the upper plate 14 is mounted, the PN terminal 46 of the HV harness 45 provided on the upper plate 14 side is connected to the PN terminal block 44 on the control board 33 side as described above. The connector 49 on the control LV harness 48 side is connected to the LV connector on the control board 33 side.

  The upper plate 14 is provided with connecting portions 53 and 54 for the power supply HV harness 45 and the control LV harness 48 in a space on the upper surface opposite to the direction in which the heat medium outlet / inlet passages 15 and 16 are extended. A cable or a harness (not shown) from the power source (battery) and the host control unit (ECU) can be connected. The electric power or signal input through the connection parts 53 and 54 is input to the control board 33 through the HV harness 45 and the LV harness 48, and the semiconductor switching element 34 and the control circuit on the control board 33 are controlled by the control signal. Thus, electric power is applied to the PTC heater 26.

  In the heat medium heating device 10 described above, the heat medium flowing from the heat medium inlet passage 15 of the casing 11 forms the inlet header portion 22 with respect to the plurality of flat heat exchanger tubes 21 constituting the heat exchange element 20. After passing through the flat tube portion 24 and passing through the U-turn flow path of the flat tube portion 24, the PTC heater 26 heats and heats up, flows out to the outlet header portion 23, and from there to the heat medium outlet path 16 is configured to circulate in a flow passage that is sent to the outside through 16. The heat medium flowing out from the heat medium heating device 10 is supplied to the radiator 6 through the heat medium circulation circuit 10A (see FIG. 1) and is used for heating.

  On the other hand, power from the power supply HV harness 45 connected to the connection portion 53 of the upper plate 14 is applied to the PTC heater 26 via the control board 33. A control signal is input to the control board 33 via the control LV harness 48 connected to the connection portion 54, and a plurality of sets of PTC heaters 26 are connected via the semiconductor switching element 34 and the control circuit. The amount of heating is controlled by controlling the power applied to the. At this time, the heat generated in the semiconductor switching element 34 is thermally conducted to the partition wall 12 of the casing 11 made of aluminum die cast, and a heat medium flowing in the flat heat exchanger tube 21 is formed by using the partition wall 12 as a heat sink. It is cooled as a cold source.

  More specifically, the heat generated in the semiconductor switching element 34 that is surface-mounted on the control board 33 is transferred to the back side of the control board 33 via the heat penetration part 37 and is brought into contact with the heat penetration part 37. The semiconductor switching element 34 is dissipated in the flat heat exchanger tube 21 by radiating heat to the partition wall 12 which is a heat sink through the heat conductive insulator such as the heat conductive liquid gap material 38 and the heat conductive insulating sheet 35. It is possible to cool the heat medium flowing through the heat source as a cold heat source.

  Thus, the heat generated by the PTC heater 26 is transferred to the plurality of flat heat exchanger tubes 21 via the heat conductive sheet 30 and the like, and is used for heating the heat medium flowing through the inside. Here, the flat heat exchanger tubes 21 and the PTC heaters 26 that are alternately stacked and assembled to constitute the heat exchange element 20 are pressed against the partition wall 12 via the heat exchanger pressing member 32 and fastened and fixed. Therefore, the contact thermal resistance therebetween is reduced and the heat transfer efficiency is improved. Therefore, the heat medium can be efficiently heated, and the heat medium heating device 10 can be improved in performance and reduced in size and size.

  Further, by tightening the heat exchanger pressing member 32, the sealing material 25 such as an O-ring interposed around the communication holes of the outlet / inlet header portions 22 and 23 of each flat heat exchanger tube 21 can be securely adhered. it can. For this reason, the sealing performance around the inlet / outlet header portions 22 and 23 of each flat heat exchanger tube 21 can be secured, and the leakage of the heat medium can be surely prevented, whereby the heat medium of the heat medium heating device 10 can be prevented. Reliability for preventing leakage can be increased.

  Further, in the present embodiment, in the casing 11, the heat exchange element 20 is fastened and fixed on one surface side of the partition wall 12, the control board 33 is installed on the other surface side, and the PTC heater 26 on the heat exchange element 20 side. The terminal 29 extended from the electrode plate 28 can be connected to a terminal block 42 provided on the control board 33 through the opening 17 of the partition wall 12, and the terminal 29 is provided on the control board 33. It is possible to position relative to the terminal block 42 by penetrating through the positioning hole 41 of the terminal cover 39 fitted and installed in the opening 17 of the partition wall 12 to the control board 33 side.

  For this reason, even if the heat exchange element 20 is clamped and fixed on one side of the casing 11 with the partition wall 12 in between, and the control board 33 is installed on the other side, it is extended from the electrode plate 28 of the PTC heater 26. The terminal 29 is always positioned at a predetermined connection position with respect to the terminal block 42 on the control board 33 side by penetrating the control board 33 side through the positioning hole 41 of the terminal cover 39 provided on the control board 33 side. In this state, the control board 33 and the heat exchange element 20 can be assembled to the casing 11. Therefore, the electrical connection between the PTC heater 26 and the control board 33 can be simplified and facilitated, the assemblability thereof can be improved, the insulation distance of each electrode plate 28 is kept constant, and the insulation performance is improved. Can be secured.

  The plurality of electrode plates 28 of the plurality of sets of PTC heaters 26 are provided with terminals 29 arranged in a line in a line at predetermined intervals on each side, and the plurality of terminals 29 are arranged in the above-described manner. The terminal block 42 provided in series on one side of the control board 33 through a plurality of positioning holes 41 arranged in series on the terminal cover 39 can be directly screwed via screws 43. Yes.

  Thus, a plurality of terminals 29 extending from a plurality of electrode plates 28 of the plurality of sets of PTC heaters 26 (two electrode plates 28 are used for one set of PTC heaters 26) are arranged in a line in series. The terminals 29 are respectively positioned with respect to the plurality of terminal blocks 42 arranged in series on the control board 33 through the plurality of positioning holes 41 arranged in series on the terminal cover 39. The terminal block 42 can be screwed. Therefore, the plurality of terminals 29 can be screwed on a straight line, and the connection work between the control board 33 and the electrode plate 28 of the PTC heater 26 can be performed efficiently.

  Furthermore, in this embodiment, a work window 50 having a detachable lid 51 is provided on one side surface of the casing 11, and the terminal 29 can be screwed to the terminal block 42 through the work window 50. ing. For this reason, the lid 51 can be removed from the casing 11 and the terminal 29 can be screwed to the terminal block 42 from the side surface side of the casing 11 with the work window 50 opened. Accordingly, it is not necessary to secure a work space for screwing in the casing 11, and the terminal block 42 and the terminal 29 may be disposed at the very inner surface, and the casing 11, and thus the heat medium heating device 10 may be disposed. The size can be reduced and the mountability can be improved.

  Further, since the terminal cover 39 is a molded product made of an insulating resin material and is fixedly installed on the back surface of the control board 33, the terminal cover 39 is integrated with the control board 33 to form the partition wall 12. Each terminal 39 is inserted into the control board 33 by being fitted in the opening 17 and penetrating the plurality of terminals 29 to the control board 33 side through the plurality of positioning holes 41 arranged in series with the terminal cover 39. At the same time as positioning with respect to the terminal block 42 on the side, each terminal 29 can be insulated from the partition wall 12. Therefore, the positioning of each terminal 29, the insulation distance of each electrode plate 28 can be kept constant, and the insulation performance can be ensured.

  In the present embodiment, an insulating sheet 35 is fixed to the back side of the control board 33 via a terminal cover 39, and a semiconductor switching element such as an IGBT provided on the control board 33 via the insulating sheet 35. Since the heat of 34 can be transmitted to the partition wall 12, an insulating sheet 35 interposed between the partition wall 12 and the control board 33 is provided with a terminal cover 39 fixedly installed on the back surface of the control board 33. And can be assembled in a pre-positioned state. Accordingly, the insulating sheet 35 can be positioned without providing mutual positioning holes, protrusions, or the like between the partition wall 12, the control board 33, and the insulating sheet 35. The heat generated by the semiconductor switching element 34 can be reliably transmitted to the partition wall 12 and radiated. Further, when designing the control board 33, it is possible to design the space effectively using a space free from holes or protrusions.

  Further, the semiconductor switching element 34 is mounted on the front surface side of the control board 33, and the control board 33 is provided with a heat penetration part 37 penetrating the back surface side corresponding to the position thereof. Heat generated by the surface-mounted semiconductor switching element 34 is transmitted to the back side of the control board 33 via the heat penetration part 37 and radiated to the partition wall 12 via the insulating sheet 35 interposed on the back side. be able to. Therefore, even if the control board 33 on which the semiconductor switching element 34 is surface-mounted is used, the cooling performance for the element 34 can be ensured and the operation of the control circuit can be stabilized.

  Further, in the present embodiment, the insulating sheet 35 is provided with an opening 35A corresponding to the position of the heat penetration portion 37, and a heat conductive liquid gap is provided between the heat penetration portion 37 and the partition wall 12 through the opening 35A. A heat conductive insulator such as a material 28 is interposed. For this reason, even if there is a manufacturing variation in the penetration state of the heat penetration part 37 to the back side of the control board 33, the heat conduction of the thermally conductive liquid gap material 28 and the like interposed in the opening 35A. Absorbed by the insulator, the heat generated by the semiconductor switching element 34 can be reliably transferred to the partition wall 12 and radiated. Therefore, heat dissipation and insulation of the control board 33 on which the semiconductor switching element 34 is surface-mounted can be ensured, and the quality of the heat medium heating device 10 can be stabilized and improved.

  Moreover, according to the vehicle air conditioner 1 which concerns on this embodiment, the heat medium supplied to the heat radiator 6 arrange | positioned in the airflow path 2 is easy to assemble, and the above-mentioned small size and high performance were carried out. It can be heated and supplied by the heat medium heating device 10. For this reason, while being able to improve the mounting property of the air conditioner 1 with respect to a vehicle, the air conditioning performance of the vehicle air conditioner 1, especially heating performance can be improved.

[Second Embodiment]
Next, a second embodiment of the present invention will be described with reference to FIGS.
The present embodiment differs from the first embodiment described above in the configuration of the control board 33A and the semiconductor switching element 34A. Since other points are the same as those in the first embodiment, description thereof will be omitted.
In the present embodiment, a discrete type power control semiconductor switching element (IGBT) 34A is used, and the semiconductor switching element 34A is formed on the surface of the partition wall 12 with a screw 56 via a thermally conductive insulating sheet 55 such as a silicon sheet. The control board 33A is fixedly installed, and the control board 33A connected to the semiconductor switching element 34A is installed on the upper part.

  As described above, a discrete type power control semiconductor switching element (IGBT) 34A may be used, and may be installed on the surface of the partition wall 12 with the heat conductive insulating sheet 55 interposed therebetween. By installing the element 34A directly on the partition wall 12 via the heat conductive insulating sheet 54, the heat dissipation and insulation can be ensured, and together with the control board 33A installed on the upper part thereof By configuring the control circuit, energization to the PTC heater 26 can be controlled. Therefore, the specifications of the control board 33A can be diversified, the degree of freedom in designing the heat medium heating device 10 can be increased, and the cooling performance of the semiconductor switching element 34A can be further stabilized.

  In addition, this invention is not limited to the invention concerning the said embodiment, In the range which does not deviate from the summary, it can change suitably. For example, in the above-described embodiment, a plurality of flat heat exchanger tubes 21 are laminated in multiple layers, and a plurality of sets of PTC heaters 26 are incorporated between each. However, the flat heat exchanger tubes 21 and the PTC heaters 26 are included. Needless to say, the number is appropriately increased or decreased in accordance with the capability of the heat medium heating device 10.

  Further, the flat heat exchanger tube 21 may be a flat heat exchanger tube provided with an inlet header portion on one end side and an outlet header portion on the other end side. In this case, the heat medium outlet / inlet passage provided on the casing 11 side. 15 and 16 are also provided separately to the left and right in correspondence with the outlet / inlet header portions.

  Furthermore, in the above-described embodiment, an example in which the casing 11 is made of aluminum die casting has been described. However, the casing 11 may be made of a resin material such as PPS. In this case, with respect to the partition wall 12, at least a portion constituting the heat sink may be constituted by an aluminum alloy plate or the like.

DESCRIPTION OF SYMBOLS 1 Vehicle air conditioner 2 Air flow path 6 Radiator 10 Heat medium heating apparatus 10A Heat medium circulation circuit 11 Casing 12 Partition wall 17 Opening part 20 Heat exchange element 21 Flat heat exchanger tube 26 PTC heater 28 Electrode plate 29 Terminal 32 Heat exchange Holding members 33, 33A Control boards 34, 34A Semiconductor switching element 35 Insulating sheet 35A Opening 37 Thermal penetration 38 Thermally conductive liquid gap material (thermally conductive insulator)
39 Terminal cover 40 Sheet presser 41 Positioning hole 42 Terminal block 43 Screw 50 Work window 51 Lid 55 Thermally conductive insulating sheet

Claims (9)

A casing provided with a partition wall inside;
A plurality of flat heat exchanger tubes and a plurality of sets of PTC heaters through which a heat medium circulates are alternately laminated in multiple layers, and a heat exchange element that is fastened and fixed to one side of the partition wall;
A control circuit that controls energization of the PTC heater is mounted, and includes a control board installed on the other side of the partition wall,
The terminal extended from the electrode plate of the PTC heater is connectable to a terminal block provided on the control board through the opening of the partition wall,
The terminal can be positioned with respect to the terminal block by being penetrated to the control board side through a positioning hole provided in the terminal cover provided on the control board side and fitted and installed in the opening. A heating medium heating device, characterized in that The plurality of electrode plates of the plurality of sets of PTC heaters are provided with terminals arranged in series in a single line at a predetermined interval on each side,
The plurality of terminals can be screwed directly to the terminal block arranged in series on one side of the control board through the plurality of positioning holes arranged in series on the terminal cover. The heating medium heating device according to claim 1.   3. A work window having a detachable lid is provided on one side of the casing, and the terminal can be screwed to the terminal block through the work window. The heating medium heating device according to 1.   The heat medium according to any one of claims 1 to 3, wherein the terminal cover is a molded product made of a resin material having an insulating property, and is fixedly installed on a back surface side of the control board. Heating device.   An insulating sheet is fixed to the back surface of the control board via the terminal cover, and heat of the semiconductor switching element for power control provided on the control board can be transmitted to the partition wall via the insulating sheet. The heating medium heating device according to claim 1, wherein the heating medium heating device is provided.   6. The semiconductor switching element is mounted on a front surface side of the control board, and a thermal penetration portion penetrating the back surface side is provided in the control board corresponding to the mounting position. The heating medium heating device described.   The insulating sheet is provided with an opening corresponding to the position of the heat penetration part, and a heat conduction insulator such as a heat conductive liquid gap material is provided between the heat penetration part and the partition wall through the opening. The heat medium heating device according to claim 6, wherein   2. A discrete type power control semiconductor switching element is installed on the other surface side of the partition wall via a heat conductive insulating sheet, and the control board is installed on the upper side. 5. The heat medium heating device according to any one of 4 to 4. In the vehicle air conditioner configured such that the heat medium heated by the heat medium heating device can be circulated with respect to the radiator disposed in the air flow passage,
The vehicle air conditioner, wherein the heat medium heating device is the heat medium heating device according to any one of claims 1 to 8.

Images