JP2013216049A - Woody board and manufacturing method thereof - Google Patents
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- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 239000002023 wood Substances 0.000 claims abstract description 120
- 239000002344 surface layer Substances 0.000 claims abstract description 8
- 239000011093 chipboard Substances 0.000 claims description 20
- 238000004040 coloring Methods 0.000 claims description 12
- 241000894007 species Species 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 8
- 241000218691 Cupressaceae Species 0.000 claims description 6
- 235000010099 Fagus sylvatica Nutrition 0.000 claims description 6
- 235000018185 Betula X alpestris Nutrition 0.000 claims description 5
- 235000018212 Betula X uliginosa Nutrition 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 235000016976 Quercus macrolepis Nutrition 0.000 claims description 4
- 241001070947 Fagus Species 0.000 claims 2
- 239000003973 paint Substances 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 14
- 238000005520 cutting process Methods 0.000 abstract description 4
- 238000010030 laminating Methods 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 244000305267 Quercus macrolepis Species 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 239000002699 waste material Substances 0.000 description 5
- 240000000731 Fagus sylvatica Species 0.000 description 4
- 240000007594 Oryza sativa Species 0.000 description 4
- 235000007164 Oryza sativa Nutrition 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000010422 painting Methods 0.000 description 4
- 235000009566 rice Nutrition 0.000 description 4
- 238000003855 Adhesive Lamination Methods 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 241000218645 Cedrus Species 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 2
- 241000018646 Pinus brutia Species 0.000 description 2
- 235000011613 Pinus brutia Nutrition 0.000 description 2
- 241000736892 Thujopsis dolabrata Species 0.000 description 2
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000012805 post-processing Methods 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 241000422842 Chamaecyparis pisifera Species 0.000 description 1
- 241000226709 Hesperocyparis arizonica Species 0.000 description 1
- 241000282821 Hippopotamus Species 0.000 description 1
- 240000007182 Ochroma pyramidale Species 0.000 description 1
- 244000055346 Paulownia Species 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 241000218657 Picea Species 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 244000186561 Swietenia macrophylla Species 0.000 description 1
- 240000002871 Tectona grandis Species 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 241000190021 Zelkova Species 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 description 1
- 229910052921 ammonium sulfate Inorganic materials 0.000 description 1
- 235000011130 ammonium sulphate Nutrition 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- -1 etc. Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000011094 fiberboard Substances 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- PJVWKTKQMONHTI-UHFFFAOYSA-N warfarin Chemical compound OC=1C2=CC=CC=C2OC(=O)C=1C(CC(=O)C)C1=CC=CC=C1 PJVWKTKQMONHTI-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Dry Formation Of Fiberboard And The Like (AREA)
- Panels For Use In Building Construction (AREA)
- Laminated Bodies (AREA)
- Chemical And Physical Treatments For Wood And The Like (AREA)
Abstract
【課題】 木削片板を用いた木質ボードにおいて、製材の廃材(端材)の使用を促し、かつ、木材の部位による違和感のある色違いの問題を解消し、木質感を良好とする。
【解決手段】 木削片板の複数が接着積層化されて板状成形された木質ボードであって、少くともその表層部分には熱着色された木削片板が接着積層されたものとする。
【選択図】なしPROBLEM TO BE SOLVED: To improve the wood texture by urging the use of sawn timber (end material) in a wood board using a wood cutting board and solving a problem of color difference due to a part of wood.
SOLUTION: A wood board in which a plurality of wood chip plates are bonded and laminated and formed into a plate shape, and at least a thermo-colored wood chip plate is bonded and stacked on the surface layer portion thereof. .
[Selection figure] None
Description
本発明は木質ボードとその製造方法に関するものである。 The present invention relates to a wooden board and a manufacturing method thereof.
木材は、床、壁、天井等の内装材や、ドア、造作、収納等の建具をはじめ住宅設備用材としてさまざまに多用されている。ただ、高品位な外観を有する木材は、高価であるにもかかわらず、原木からの製材時におよそ70〜80%が廃棄されている。 Wood is widely used as a material for housing equipment including interior materials such as floors, walls, and ceilings, and doors, construction, storage, and other fittings. However, although wood having a high-grade appearance is expensive, approximately 70 to 80% is discarded when sawing from raw wood.
このような経済性の問題点と、木材が本来有している節等の存在による欠点とを解消するために、製材時の廃材、さらには間伐材あるいは小径木等を細分化し、接着剤等で一体化したパーティクルボードや中密度繊維板(MDF)等が開発されている。 In order to eliminate such problems of economic efficiency and defects due to the existence of knots, etc. inherent to wood, subdivided waste materials from lumber, thinned wood or small diameter wood, etc., and adhesives etc. Particle boards, medium density fiberboards (MDF), etc. that have been integrated in the past have been developed.
しかしながら、これらの再構成材の場合には、木質感が得られにくく、物性が極端に異なる細片部位が混ざることになり、塗装、特に素地着色塗装で違和感がある。このため、結局のところ、高品位な外観が得られにくい。 However, in the case of these reconstructed materials, it is difficult to obtain a wood texture, and strip portions having extremely different physical properties are mixed, and there is a sense of incongruity in painting, particularly, base color painting. For this reason, after all, it is difficult to obtain a high-quality appearance.
また、強度性能が低く、構造部材として必ずしも適切でないという問題点がある。 Moreover, there exists a problem that strength performance is low and it is not necessarily suitable as a structural member.
一方、例えばウエハライザーやフレーカー等で木材を薄片化した木削片板を接着して多層化した木質ボードが知られている。例えば、配向性ストランドボード、ウェハーボード、フレークボード等である(例えば特許文献1〜3)。 On the other hand, for example, a wood board in which a wood chip board obtained by slicing wood with a wafer riser or a flaker is bonded to form a multilayer is known. For example, it is an oriented strand board, a wafer board, a flake board, etc. (for example, patent documents 1-3).
しかしながら、木質感や、強度等の性能においても比較的良好なこれら木質ボードにおいても、木材の部位による木削片の違和感のある色違いを塗装等によって低減することは容易ではなく、不均一な材料を木質感を保ったまま均一化することは難しいのが実状であった。 However, even with these wood boards, which are relatively good in terms of performance such as wood texture and strength, it is not easy to reduce the discoloration of the wood chips due to the wood parts by painting, etc. Actually, it is difficult to make the material uniform while maintaining the wood texture.
このため、製材の廃材(端材)の有効利用による原木歩留まりを向上させることが望まれていた。 For this reason, it has been desired to improve the log yield due to the effective use of sawmill waste.
本発明は、以上のことから、木削片の接着積層化による木質ボードにおいて、製材の廃材(端材)の使用を促進して原木歩留まりを向上させ、かつ、木材の部位による違和感のある色違いの問題を解消し、木質感を良好とすることを課題としている。 As described above, the present invention promotes the use of lumber waste (end material) to improve the wood yield in the wood board by bonding and laminating wood chips, and the color with a sense of incongruity due to the wood part. The problem is to solve the difference problem and to improve the wood texture.
上記の課題を解決するために、本発明の木質ボードは、木削片板の複数が接着積層化されて板状成形された木質ボードであって、少くともその表層部分には熱着色された木削片板が接着積層されていることを特徴とする。 In order to solve the above-mentioned problems, the wood board of the present invention is a wood board formed by laminating a plurality of wood chipboards by bonding and laminating, and at least the surface layer portion is thermally colored. It is characterized in that the wood chip plates are bonded and laminated.
前記の木質ボードにおいては、熱着色の着色度合の異なる木削片板が接着積層されていることや、異樹種の木削片板が接着積層されていることも考慮される。 In the above-mentioned wood board, it is also considered that wood chip plates having different coloring degrees of thermal coloring are bonded and laminated, and that wood chip plates of different species are bonded and laminated.
そして、前記の木質ボードにおいては、木削片板が、ナラ、ブナ、カバおよびヒノキの樹種のうちの少くとも一種であることが好ましい。 In the wood board, the wood chipboard is preferably at least one of oak, beech, birch and cypress.
また、この木質ボードでは、表面に光透過性の塗装またはシート接着が施されていることが好ましい。 Moreover, it is preferable that the light-transmitting coating or sheet bonding is applied to the surface of the wooden board.
そして、本発明の木質ボードの製造方法は、木削片板の複数を接着積層化して板状成形する木質ボードの製造方法であって、少くともその表層部分には、高圧水蒸気による加熱で熱着色処理した木削片板を接着積層することを特徴としている。 The wood board manufacturing method of the present invention is a wood board manufacturing method in which a plurality of wood chip plates are bonded and laminated to form a plate, and at least the surface layer portion is heated by heating with high-pressure steam. It is characterized by adhering and laminating colored wood chipboards.
前記の製造方法では、熱着色処理の処理度の異なる木削片板を接着積層することも考慮される。 In the manufacturing method described above, it is also considered to bond and laminate wood chip pieces having different degrees of thermal coloring treatment.
また、異樹種の木削片板を接着積層することも考慮される。 It is also considered to bond and laminate wood chips from different species.
以上の木質ボードの製造方法では、木削片板が、ナラ、ブナ、カバおよびヒノキの樹種のうちの少くとも一種であることが好ましい。 In the wood board manufacturing method described above, it is preferable that the wood chipboard is at least one of oak, beech, birch and cypress tree species.
さらに前記木質ボードの製造方法では、表面に光透過性の塗装またはシート接着を施すことが好ましい。 Further, in the wood board manufacturing method, it is preferable to apply light transmissive coating or sheet bonding to the surface.
本発明の木質ボードによれば、木材の部位による違和感のある色違いの問題が解消され、木材の持つ風合いを残した木質感が良好となる。そして、製材の廃材(端材)の使用が促進されて原木の歩留まりが向上する。 According to the woody board of the present invention, the problem of color difference that causes a sense of incongruity due to the part of wood is solved, and the wood texture that leaves the texture of wood is good. And the use of the sawn timber (endwood) is promoted, and the yield of raw wood is improved.
本発明の木質ボードは、前記のとおり、木削片板の複数が接着積層されて板状成形されたものである。ここで、木削片板としては、製材時の廃材(端材)や間伐材、小径木等を、切断、切削、割裂等の公知の手段で薄片状としたものが使用される。 As described above, the wood board of the present invention is formed by laminating and laminating a plurality of wood chip plates. Here, as the wood cut piece board, a piece of waste wood (endwood), thinned wood, small-diameter wood, etc., produced at the time of sawing is made into a thin piece shape by a known means such as cutting, cutting, splitting or the like.
例えばウエハライザーやフレーカー等のスライサーにより作成したものであってよい。より好ましくは、廃材(端材)が使用されるストランドであり、このストランドは所定方向に配向されて用いられる。 For example, it may be prepared by a slicer such as a wafer riser or a flaker. More preferably, it is a strand in which waste material (end material) is used, and this strand is used by being oriented in a predetermined direction.
本発明の木質ボードにおいては、木削片板を形成するための原木としては各種の樹種から選択されてよい。 In the wood board of the present invention, the raw wood for forming the wood chipboard may be selected from various tree species.
例えば、ナラ、ブナ、カバ、ヒノキ、さわら、ヒバ、カヤ、桐、松、杉、カシ、モミ、ケヤキ等が挙げられる。また、海外材としては、米松、米杉、米ヒバ、米モミ、スプルース、ワラン、メランチ、ジュンコン、カメレレ、カランパヤン、チーク、バルサ、マホガニー、セドロ等の各種のものが挙げられる。 Examples include oak, beech, hippopotamus, cypress, sawara, hiba, kayak, paulownia, pine, cedar, oak, fir, zelkova and the like. Examples of overseas materials include rice pine, rice cedar, rice hiba, rice fir, spruce, waran, meranti, Junkong, chamelele, karampayan, teak, balsa, mahogany, and cedro.
なかでも、従来より内装材、家具等において表面材として使用され、風合いのある質感のナラ(オーク)、ブナ(ビーチ)、カバ(バーチ)、ヒノキ等の樹種からの木削片板が好適な例として挙げられる。 Of these, wood chips from wood species such as oak, beech (beach), hippo (birch), and cypress that are conventionally used as surface materials in interior materials, furniture, etc. are preferred. Take as an example.
木削片板の大きさ、厚みは、その形成方法をはじめ、木質ボードの所要の寸法や用途、そして接着積層加工の形態等を考慮して適宜とすることができる。 The size and thickness of the wood chipboard can be appropriately determined in consideration of the forming method, the required dimensions and use of the wood board, the form of adhesive lamination processing, and the like.
例えば配向性ストランドボードのためのスライサーによるストランド加工では、幅5mm〜40mm、長さ10mm〜80mm、厚み0.1mm〜0.5mmの範囲のものが例示される。 For example, in strand processing by a slicer for an oriented strand board, a width of 5 mm to 40 mm, a length of 10 mm to 80 mm, and a thickness of 0.1 mm to 0.5 mm are exemplified.
本発明の木質ボードは、これらの木削片板の複数が接着積層されて板状成形されたものであるが、少くともその表層部には、熱着色された木削片板が接着積層されている。ここでの熱着色は、高圧水蒸気による加熱により行われる。 The wood board of the present invention is formed by laminating and laminating a plurality of these wood chip plates, and at least the surface layer portion is bonded and laminated with a heat-colored wood chip plate. ing. The thermal coloring here is performed by heating with high-pressure steam.
この熱着色のための高圧水蒸気による加熱の方法は各種であってよい。例えば、密閉容器や、密閉金型の圧縮板や側板に蒸気供給孔を設け、外部から蒸気供給孔を通して木削片板に蒸気を供給する方法、または木削片板を加熱して含有する水分を蒸発させる方法等がある。 There are various methods of heating with high-pressure steam for the thermal coloring. For example, a steam supply hole is provided in a sealed container or a compression plate or side plate of a sealed mold, and steam is supplied to the wood chip board from the outside through the steam supply hole, or moisture contained by heating the wood chip board There is a method of evaporating the water.
高圧水蒸気による加熱は、一般的には、例えば、圧力容器内で、120℃〜200℃、0.3MP〜0.8MPa、10〜30分間の条件を目安とすることができる。 In general, the heating with high-pressure steam can be performed under the conditions of, for example, 120 ° C. to 200 ° C., 0.3 MP to 0.8 MPa, and 10 to 30 minutes in a pressure vessel.
木削片板の樹種、大きさ、厚み、含水率、所要の着色(濃色)度合等を考慮して、湿度、圧力、水分条件等を設定することができる。 Humidity, pressure, moisture conditions, etc. can be set in consideration of the tree species, size, thickness, moisture content, required coloring (dark color) degree, etc. of the wood chipboard.
木材は薄片化して木削片板にすると、高圧高温の水蒸気処理でもクラック発生の心配はなく、高温処理(濃色処理)が可能となる。均一に熱着色された木削片板が得られる。 If the wood is cut into thin pieces to form a wood chip, there is no risk of cracking even with high-pressure and high-temperature steam treatment, and high-temperature treatment (dark color treatment) is possible. A uniformly machined wood chip board is obtained.
本発明の木質ボードでは、以上のような熱着色した木削片板が、少くとも木削ボード片板の表層部分に配置されて接着積層される。 In the wood board of the present invention, the above-mentioned heat-colored wood chip pieces are disposed and bonded and laminated on at least the surface layer portion of the wood board pieces.
この場合、熱着色された木削片板は、木質ボードの表層部分だけに配置され、熱着色されていない木削片板と多層成形されていてもよいし、全て熱着色された木削片板が多層成形されていてもよい。 In this case, the heat-colored wood chip is disposed only on the surface layer portion of the wood board, and may be multilayer-formed with the wood chip not heat-colored, or may be all heat-colored wood chips. The plate may be multilayer molded.
木材の持つ風合いの残る木質感のあるボードが実現される。従来は塗装、特に素地着色塗装でも難しく、違和感のあった木材の部位による色違いの問題は、本発明の木質ボードにおいては解消される。 A board with a wood texture that retains the texture of wood is realized. Conventionally, it is difficult even with painting, in particular, coloring with a base material, and the problem of color difference due to an uncomfortable wood part is solved in the wood board of the present invention.
前記の高圧水蒸気による加熱での熱着色処理では、処理条件、例えば処理温度を調整すると、色の濃度を下げる等の調整が可能となる。 In the thermal coloring process by heating with the high-pressure steam described above, adjustments such as lowering the color density are possible by adjusting the processing conditions, for example, the processing temperature.
そこで、処理度の異なる、つまり色の濃さの度合の異なる木削片板を混ぜて接着積層して多層化することで、ユニークな新しい風合いの外観が表現される。 Therefore, the appearance of a unique new texture can be expressed by mixing and stacking wood chipboards with different degrees of processing, that is, with different levels of color intensity.
また、異なる樹種の熱着色された木削片板を用いてもよい。外観性に新規な効果をもたらす。 Moreover, you may use the heat-colored wood chip board of a different tree type. Brings a new effect on appearance.
木質ボードの成形のための接着積層では各種の接着剤が樹種との親和性や強度等を考慮して選択使用されてよい。例えば、フェノール系、レゾルシノール系、ユリア系、メラミン、マレイン酸系、イソシアネート系等の接着剤が挙げられる。 In the adhesive lamination for forming a wooden board, various adhesives may be selected and used in consideration of affinity with tree species, strength, and the like. Examples thereof include phenol-based, resorcinol-based, urea-based, melamine, maleic acid-based, and isocyanate-based adhesives.
接着剤層による板状成形は加熱加圧成形として行うことができる。公知の方法、装置が使用されてよい。例えば、熱板プレスや、マイクロ波、高周波誘電等の加熱によるバッチ式あるいは連続式プレス成形法等が挙げられる。 The plate-shaped molding by the adhesive layer can be performed as heat and pressure molding. Known methods and devices may be used. Examples thereof include a hot plate press, a batch type or a continuous press molding method by heating such as microwaves and high frequency dielectrics.
木削片板の樹種やその性質、木質ボードの厚み、接着剤の種類、所要の接着性能等を考慮して成形条件を設定してよい。例えば、160℃〜220℃、0.2MPa〜0.8MPa、2分〜15分間での熱板プレスによる5mm〜15mm厚の木質ボードの接着積層成形が例示される。 The molding conditions may be set in consideration of the wood species and properties of the wood chipboard, the thickness of the wood board, the type of adhesive, the required adhesion performance, and the like. For example, adhesion lamination molding of a 5 mm to 15 mm thick wood board by hot plate pressing at 160 ° C. to 220 ° C., 0.2 MPa to 0.8 MPa, 2 minutes to 15 minutes is exemplified.
接着積層成形の後には、木質ボード表面の研磨や切削等の後加工が適宜に行われてよい。このような後加工によれば、木削片板の境界形状が自然にばらつき、外観が向上することも期待される。 After the adhesive lamination molding, post-processing such as polishing or cutting of the surface of the wooden board may be appropriately performed. According to such post-processing, it is expected that the boundary shape of the wood chip piece naturally varies and the appearance is improved.
また木質ボード表面に塗装を施してもよい。特に光透過性の塗装を施すことが考慮される。あるいは光透過性の樹脂製等のシートを表面に接着してもよい。 The wood board surface may be painted. In particular, it is considered to apply a light-transmitting coating. Or you may adhere | attach the sheet | seat made from resin of light transmittance etc. on the surface.
このような光透過製の塗装やシート接着を施すことで、表面の損傷の防止や耐水性の向上、木質感の向上も期待される。 By applying such light-transmitting coating or sheet bonding, it is expected to prevent surface damage, improve water resistance, and improve the wood texture.
本発明の木質ボードは、そのまま所定の寸法に調整した後に内装材や家具等の部材として使用してもよいし、あるいは木材や、パーティクルボード、MDF等の面構成材からなる基材の表面に貼着させて使用してもよい。 The wood board of the present invention may be used as a member such as an interior material or furniture after being adjusted to a predetermined size as it is, or on the surface of a base material made of a surface constituent material such as wood, particle board, or MDF. You may stick and use.
以下に本発明の実施例と比較例とを説明する。
(実施例)
次の条件により、木削片板としてのストランドを用いて木質ボードを製造した。
Examples of the present invention and comparative examples will be described below.
(Example)
Under the following conditions, a wood board was manufactured using a strand as a wood chipboard.
ストランド:原材料 ナラ材フリッチをスライサーを使ってストランド加工。
セット 厚み 0.25mm 巾 15mm 長さ 45mm
高温高圧水蒸気処理:圧力容器内で飽和水蒸気処理160℃(0.52MPa)保持20分
Strand: Raw material Nara flitch is processed into a strand using a slicer.
Set Thickness 0.25mm Width 15mm Length 45mm
High-temperature high-pressure steam treatment: saturated steam treatment in a pressure vessel maintained at 160 ° C. (0.52 MPa) for 20 minutes
接着剤:上記ストランドに対して下記接着剤を質量比率11%でスプレー塗布
メラミン接着剤(オーシカ株式会社 M−310 100、硫酸アンモニウム3)
熱プレス:盤面温度200℃ 0.5MPa 保持5分 厚み9mmに製版
仕上げ:サンダー仕上げ♯240
Adhesive: Spray application of the following adhesive to the strand at a mass ratio of 11% Melamine adhesive (Oshika Corporation M-310 100, ammonium sulfate 3)
Hot press: Board surface temperature 200 ° C 0.5 MPa Holding 5 minutes Plate making to 9 mm thickness Finish: Thunder finish # 240
(比較例1)
上記実施例の中の高温高圧水蒸気処理を省く。他は実施例1と同様。
(Comparative Example 1)
The high temperature and high pressure steam treatment in the above embodiment is omitted. Others are the same as Example 1.
(比較例2)
上記実施例のストランドを破砕木に置き換える。他は実施例1と同様。この破砕木はリングフレーカーを用い木材エレメント形状は厚み0.7〜2.8mm 巾2〜5.5mm 長さ9〜38mmの針形状に近いものとなった。
(Comparative Example 2)
The strand in the above example is replaced with crushed wood. Others are the same as Example 1. The crushed wood used a ring flaker, and the shape of the wood element was close to a needle shape having a thickness of 0.7 to 2.8 mm, a width of 2 to 5.5 mm, and a length of 9 to 38 mm.
(評価)
以上の実施例並びに比較例1および2により得られた木質ボードについて、木質感(目視)、バラツキ(色調の均一、不均一性)、歩留まり(原木歩留まり)について評価した。また、総合評価も行った。その結果を表1に示した。
表中の○×の符号は次のことを示している。
(Evaluation)
About the wood board obtained by the above Example and Comparative Examples 1 and 2, wood texture (visual observation), variation (uniformity of color tone, nonuniformity), and yield (rawwood yield) were evaluated. A comprehensive evaluation was also conducted. The results are shown in Table 1.
The symbol “X” in the table indicates the following.
<木質感>
○:木材としての風合いが残り木質感が良好
×:上記以外で木質感が欠如
<Wood texture>
○: The texture as wood remains, and the wood texture is good.
<バラツキ>
○:ΔE2未満
×:ΔE2以上
<Dispersion>
○: Less than ΔE2 ×: ΔE2 or more
<歩留り>
○:90%以上
<Yield>
○: 90% or more
<総合評価>
○:製材の廃材(端材)を使用した場合でも木材の部位による違和感のある色違いが低減され、原木歩留まりが良好。価値が木削片板を用いた木質ボードとして高い。
×:上記以外で木削片板を用いた木質ボードとして価値が低い。
<Comprehensive evaluation>
○: Even when using sawn timber (endwood), uncomfortable color differences due to the wood parts are reduced, and the log yield is good. The value is high as a wood board using wood chipboard.
X: Other than the above, the value is low as a wood board using a wood chipboard.
Claims (8)
The method for producing a wooden board according to any one of claims 5 to 7, wherein a light-transmitting coating or sheet bonding is applied to the surface.
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