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JP2013211331A - Surface mount multiphase inductor and manufacturing method therefor - Google Patents

Surface mount multiphase inductor and manufacturing method therefor Download PDF

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JP2013211331A
JP2013211331A JP2012079240A JP2012079240A JP2013211331A JP 2013211331 A JP2013211331 A JP 2013211331A JP 2012079240 A JP2012079240 A JP 2012079240A JP 2012079240 A JP2012079240 A JP 2012079240A JP 2013211331 A JP2013211331 A JP 2013211331A
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coil
core
tablet
coils
multiphase inductor
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JP5740339B2 (en
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Koichi Saito
公一 齋藤
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Toko Inc
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Priority to KR1020130028486A priority patent/KR102009696B1/en
Priority to CN201310108783.0A priority patent/CN103366946B/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/2847Sheets; Strips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/29Terminals; Tapping arrangements for signal inductances
    • H01F27/292Surface mounted devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/2847Sheets; Strips
    • H01F2027/2857Coil formed from wound foil conductor

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Dc-Dc Converters (AREA)

Abstract

【課題】実装性に優れた面実装マルチフェーズインダクタとその製造方法を提供する。
【解決手段】面実装マルチフェーズインダクタは、導線を巻回し、両端部が扁平な形状の複数のコイルを有する。そして、主として磁性粉末と結合材とからなる複数のコイルを内包するコアを有する。コアの1つの表面に形成された外部電極とを有する。コイルの導線の端部の両方がの最外周となるようにする。コイルの巻軸が外部電極の形成されるコアの表面に対して平行となるように複数のコイルをコアに内包する。
【選択図】図8
A surface-mount multiphase inductor excellent in mountability and a method for manufacturing the same are provided.
A surface-mount multi-phase inductor has a plurality of coils wound with a conductive wire and flat at both ends. And it has the core which includes the some coil which consists mainly of magnetic powder and a binder. An external electrode formed on one surface of the core. Both ends of the coil lead wires are set to the outermost periphery. A plurality of coils are included in the core so that the winding axis of the coil is parallel to the surface of the core on which the external electrode is formed.
[Selection] Figure 8

Description

本発明は面実装マルチフェーズインダクタ及びその製造方法に関する。   The present invention relates to a surface mount multiphase inductor and a method for manufacturing the same.

近年、デジタル機器等の小型・薄型化に伴う高密度実装化が進んでおり、電子部品の小型化や低背化への要求が強まっている。そこで出願人は、先に出願した特許文献1や特許文献2において、平角導線をその端部の両方が外周に引き出されるように渦巻き状に巻回したコイルと予備成形されたタブレットを用いた小型の面実装インダクタとその製造方法を提案した。   In recent years, high-density mounting is progressing along with miniaturization and thinning of digital devices and the like, and there is an increasing demand for miniaturization and low profile of electronic components. Therefore, in the patent documents 1 and 2 previously filed by the applicant, the applicant uses a small coil using a coil and a pre-formed tablet in which a rectangular conductor is wound in a spiral shape so that both ends thereof are drawn to the outer periphery. A surface mount inductor and its manufacturing method were proposed.

特開2010−245473JP 2010-245473 A 特願2011−017581Japanese Patent Application No. 2011-017581 特開2000−036414JP2000-036414

回路基板上に同特性のインダクタが複数個並列に実装できるような回路パターンになっている場合、単品を複数個実装するよりも複数個が1パッケージに内設される方が実装効率を高めることができる。そのため、複数個のインダクタが1パッケージ化された面実装マルチフェーズインダクタが求められている。   When the circuit pattern is such that a plurality of inductors with the same characteristics can be mounted in parallel on the circuit board, mounting efficiency is improved by installing a plurality of inductors in one package rather than mounting a plurality of single products. Can do. Therefore, there is a demand for a surface mount multiphase inductor in which a plurality of inductors are packaged.

面実装マルチフェーズインダクタの従来の技術としては、たとえば特許文献3に示されるような磁性シート上に巻芯に導体を巻回したコイルを複数並べ、さらに湿式プレス用の磁性セラミックスラリーを金型に充填して成型して、複数のコイルを封止する技術などがある。この方法の場合、1つの磁性シート上に複数のコイルを並べ上に流動性の高い磁性セラミックスラリーを充填して封止するため、コイルの位置ズレや端部の位置ズレが懸念される。そしてこの方法の場合、コイルを同方向に並列させた配列構造でのみ実現が可能であり、コイルの数が増えれば増えるほど、特に4つ以上のコイルを用いて面実装マルチフェーズインダクタを作成すると、アスペクト比の大きいチップ部品となってしまう。チップ部品において、アスペクト比の大きい形状であると、回路基板上への実装スペースが問題となる可能性や、たわみ応力に対して製品強度が問題となる懸念がある。   As a conventional technique of the surface mount multiphase inductor, for example, a plurality of coils in which a conductor is wound around a winding core are arranged on a magnetic sheet as shown in Patent Document 3, and magnetic ceramic slurry for wet pressing is used as a mold. There is a technique of filling and molding and sealing a plurality of coils. In the case of this method, since a plurality of coils are arranged on one magnetic sheet and sealed with a highly fluid magnetic ceramic slurry, there is a concern about displacement of coils and displacement of ends. And this method can be realized only with an array structure in which coils are arranged in parallel in the same direction. When the number of coils increases, especially when a surface mount multiphase inductor is created using four or more coils. It becomes a chip component with a large aspect ratio. If the chip component has a shape with a large aspect ratio, there is a possibility that the mounting space on the circuit board becomes a problem, and there is a concern that the product strength becomes a problem with respect to the bending stress.

そこで本発明では、実装性に優れた製品強度の高い面実装マルチフェーズインダクタとその製造方法を提供することを目的とする。   Accordingly, an object of the present invention is to provide a surface-mount multiphase inductor with excellent productability and high product strength, and a method for manufacturing the same.

上記課題を解決するために、本発明の面実装マルチフェーズインダクタは、導線を巻回し、両端部が扁平な形状の複数のコイルを有する。そして、主として磁性粉末と結合材とからなる複数のコイルを内包するコアを有する。コアの1つの表面に形成された外部電極とを有する。コイルの導線の端部の両方がの最外周となるようにする。コイルの巻軸が外部電極の形成されるコアの表面に対して平行となるように複数のコイルをコアに内包することを特徴とする。   In order to solve the above-described problems, a surface-mounted multiphase inductor according to the present invention has a plurality of coils wound around a conductive wire and flat at both ends. And it has the core which includes the some coil which consists mainly of magnetic powder and a binder. An external electrode formed on one surface of the core. Both ends of the coil lead wires are set to the outermost periphery. A plurality of coils are included in the core so that the winding axis of the coil is parallel to the surface of the core on which the external electrode is formed.

本発明の面実装マルチフェーズインダクタでは、外部電極をコアの1つの表面に形成するため、底面電極構造となり面実装マルチフェーズインダクタの低背化が可能となる。そして、複数のコイルを1パッケージ化しているので実装効率を高めることができる。   In the surface mount multiphase inductor according to the present invention, since the external electrode is formed on one surface of the core, a bottom electrode structure is formed, and the height of the surface mount multiphase inductor can be reduced. Since a plurality of coils are packaged in one package, the mounting efficiency can be increased.

本発明の面実装マルチフェーズインダクタの製造方法では、タブレットを用いてそれぞれのコイルおよびその端部の位置だしが容易となる。そのため、コイルおよびその端部の位置ズレを防止する。そして、コイルとそれに対応するタブレットを複数用いることによって、コイルの個数、配置などの設計変更に柔軟に対応することができる。   In the method for manufacturing a surface-mounted multiphase inductor according to the present invention, it is easy to position each coil and its end using a tablet. Therefore, displacement of the coil and its end is prevented. By using a plurality of coils and tablets corresponding to the coils, it is possible to flexibly cope with design changes such as the number and arrangement of coils.

本発明の面実装マルチフェーズインダクタの製造方法は、容易にコア部の1つの表面にコイルの端部を露出させることが出来るため、容易に底面電極構造を有する面実装マルチフェーズインダクタを作成することができる。コア部の1つの表面にコイルの端部が露出しているため、コイルを形成する導線の絶縁皮膜の除去作業や外部電極形成が煩雑化せずに製造コストの低減が見込める。   Since the manufacturing method of the surface mount multiphase inductor of the present invention can easily expose the end portion of the coil on one surface of the core portion, it is easy to create the surface mount multiphase inductor having the bottom electrode structure. Can do. Since the end portion of the coil is exposed on one surface of the core portion, it is possible to reduce the manufacturing cost without complicating the operation of removing the insulating film from the conductive wire forming the coil and the formation of the external electrode.

本発明の第1の実施例で用いるコイルとタブレットの斜視図。The perspective view of the coil and tablet used in the 1st example of the present invention. 本発明の第1の実施例のコイルとタブレットを組み合わせた状態を説明する斜視図。The perspective view explaining the state which combined the coil and tablet of the 1st Example of this invention. 本発明の第1の実施例で用いる成型金型を説明する斜視図。The perspective view explaining the molding die used in the 1st example of the present invention. 本発明の第1の実施例のコイルとタブレットの成型金型での配置を示す上面図。The top view which shows arrangement | positioning with the shaping die of the coil and tablet of 1st Example of this invention. 本発明の第1の実施例の面実装マルチフェーズインダクタの製造工程の一部を説明する図4のA−A断面に対応する断面図。Sectional drawing corresponding to the AA cross section of FIG. 4 explaining a part of manufacturing process of the surface-mount multiphase inductor of 1st Example of this invention. 本発明の第1の実施例の面実装マルチフェーズインダクタの製造工程の一部を説明する図4のA−A断面に対応する断面図。Sectional drawing corresponding to the AA cross section of FIG. 4 explaining a part of manufacturing process of the surface-mount multiphase inductor of 1st Example of this invention. 本発明の第1の実施例のコア部の斜視図。The perspective view of the core part of the 1st Example of this invention. 本発明の第1の実施例の面実装マルチフェーズインダクタの斜視図。1 is a perspective view of a surface-mount multiphase inductor according to a first embodiment of the present invention. FIG. 本発明の第2の実施例で用いるコイルとタブレットの斜視図。The perspective view of the coil and tablet used in the 2nd Example of this invention. 本発明の第2の実施例で用いる成型金型を説明する斜視図。The perspective view explaining the molding die used in the 2nd example of the present invention. 本発明の第2の実施例のコイルとタブレットの成型金型での配置を示す上面図。The top view which shows arrangement | positioning with the shaping die of the coil and tablet of 2nd Example of this invention. 本発明の第2の実施例の面実装マルチフェーズインダクタの製造工程の一部を説明する図11のA−B−C−D組合せ断面に対応する断面図。Sectional drawing corresponding to the ABCD combined cross section of FIG. 11 explaining a part of manufacturing process of the surface mount multiphase inductor of 2nd Example of this invention. 本発明の第2の実施例の面実装マルチフェーズインダクタの製造工程の一部を説明する図11のA−B−C−D組合せ断面に対応する断面図。Sectional drawing corresponding to the ABCD combined cross section of FIG. 11 explaining a part of manufacturing process of the surface mount multiphase inductor of 2nd Example of this invention. 本発明の第2の実施例のコア部の斜視図。The perspective view of the core part of the 2nd Example of this invention. 本発明の第2の実施例の面実装マルチフェーズインダクタの斜視図。The perspective view of the surface-mount multiphase inductor of the 2nd Example of this invention.

以下に、図面を参照しながら本発明の面実装マルチフェーズインダクタとその製造方法について説明する。   Hereinafter, a surface-mount multiphase inductor and a manufacturing method thereof according to the present invention will be described with reference to the drawings.

(第1の実施例)
図1〜図9を参照しながら、本発明の第1の実施例の面実装マルチフェーズインダクタの製造方法について説明する。まず、本発明の実施例で用いるコイルとタブレットについて説明する。図1に本発明の実施例で用いるコイルとタブレットの斜視図を示す。図1に示すように、断面が楕円の巻き芯を用いて平角線を両端部1bが最外周となるように2段の外外巻きに巻回して巻回部1aを形成してコイル1を得る。このとき、コイル1の両端部1bが同じ側面側に引き出されるようにする。
(First embodiment)
A method for manufacturing the surface-mounted multiphase inductor according to the first embodiment of the present invention will be described with reference to FIGS. First, the coil and tablet used in the embodiment of the present invention will be described. FIG. 1 shows a perspective view of a coil and a tablet used in an embodiment of the present invention. As shown in FIG. 1, using a winding core having an elliptical cross section, a rectangular wire is wound around two outer and outer windings so that both end portions 1b are at the outermost periphery to form a winding portion 1a to form a coil 1. obtain. At this time, both end portions 1b of the coil 1 are drawn out to the same side surface side.

次に、本発明の実施例で用いるタブレットについて説明する。本実施例では封止材として、鉄系金属磁性粉末とエポキシ樹脂とを混合して粉末状に造粒したものを用いる。本実施例では封止材の透磁率が25となるように鉄系金属磁性粉末の充填量を調整した。この封止材を用いてタブレットを作成する。図1に示すようにタブレット2と板状タブレット3は加圧成型で作成する。本実施例ではタブレット2の強度を高めるために、さらに熱処理をして封止材を半硬化状態とした。図1に示すように、タブレット2はコイル1を囲うように平面部の周縁に2つの柱状凸部2aとコイル1の空芯に対応する楕円状の位置だし用の凸部2bを有する形状に形成する。図2に示すように、コイル1をタブレット2と板状タブレット3に挟むように組み合わせる。このとき、コイル1の両端部1bは柱状凸部2aの外側側面に沿うように配置する。   Next, the tablet used in the embodiment of the present invention will be described. In this embodiment, a sealing material obtained by mixing iron-based metal magnetic powder and an epoxy resin and granulating the powder is used. In this example, the filling amount of the iron-based metal magnetic powder was adjusted so that the permeability of the sealing material was 25. A tablet is produced using this sealing material. As shown in FIG. 1, the tablet 2 and the plate-like tablet 3 are formed by pressure molding. In this example, in order to increase the strength of the tablet 2, the heat treatment was further performed to make the sealing material semi-cured. As shown in FIG. 1, the tablet 2 has a shape having two columnar convex portions 2 a and an elliptical positioning convex portion 2 b corresponding to the air core of the coil 1 on the periphery of the flat portion so as to surround the coil 1. Form. As shown in FIG. 2, the coil 1 is combined so as to be sandwiched between the tablet 2 and the plate-like tablet 3. At this time, both end portions 1b of the coil 1 are arranged along the outer side surface of the columnar convex portion 2a.

次に、第1の実施例で用いる成型金型と成型金型におけるコイルとタブレットの配置にについて説明する。図3に第1の実施例で用いる成型金型を説明する斜視図を示し、図4にコイルとタブレットの成型金型での配置を説明する上面図を示す。図3、図4に示すように、割型4aと割型4bとからなる上型4と下型5とパンチ6を有する成型金型を用いる。上型4と下型5を組み合わせることによってキャビティ7が形成される。キャビティ7に図2に示したコイル1とタブレット2と板状タブレット3を組み合わせたものを6つ装填した。このとき、すべてのコイルの端部1bが成型金型の開口部側となるように配置する。   Next, the molding die used in the first embodiment and the arrangement of coils and tablets in the molding die will be described. FIG. 3 shows a perspective view for explaining the molding die used in the first embodiment, and FIG. 4 shows a top view for explaining the arrangement of the coil and the tablet in the molding die. As shown in FIG. 3 and FIG. 4, a molding die having an upper die 4, a lower die 5, and a punch 6 composed of a split die 4 a and a split die 4 b is used. A cavity 7 is formed by combining the upper mold 4 and the lower mold 5. Six cavities 7 in which the coil 1, the tablet 2 and the plate tablet 3 shown in FIG. At this time, it arrange | positions so that the edge part 1b of all the coils may become the opening part side of a shaping die.

次に、コア部の形成について説明する。図5、図6に第1の実施例の面実装マルチフェーズインダクタの製造工程の一部を説明する図4のA−A断面に対応する断面図を示す。図5に示すように、パンチ6をセットして成型金型を予熱する。このとき、コイル1の端部1bはタブレット2の柱状凸部2aとパンチ6との間に挟まれる状態にする。本実施例では成型金型を封止材の軟化温度以上に予熱しており、タブレット2と板状タブレット3は軟化状態となるようにした。   Next, formation of a core part is demonstrated. 5 and 6 are cross-sectional views corresponding to the AA cross section of FIG. 4 for explaining a part of the manufacturing process of the surface mount multiphase inductor of the first embodiment. As shown in FIG. 5, the punch 6 is set and the mold is preheated. At this time, the end portion 1 b of the coil 1 is put between the columnar convex portion 2 a of the tablet 2 and the punch 6. In this embodiment, the molding die is preheated to a temperature higher than the softening temperature of the sealing material, and the tablet 2 and the plate-like tablet 3 are in a softened state.

図6に示すように、パンチ7を用いて加圧して6つのタブレット2と6つの板状タブレット3を一体化させ、封止材を硬化させる。このとき、タブレット2と板状タブレット3は軟化状態であり、容易に6つのコイル1を封止するように一体化する。そして、コイル1の両端部1bは位置ズレすることなく、少なくともその一部が封止材中に埋没した状態で封止される。そして封止材を硬化させて得たコア部7を成型金型から取り出す。図7に示すようにコア部8の1つの表面にコイル1のすべての端部1bの平面が露出した状態となる。   As shown in FIG. 6, the six tablets 2 and the six plate-like tablets 3 are integrated by applying pressure using the punch 7, and the sealing material is cured. At this time, the tablet 2 and the plate-like tablet 3 are in a softened state, and are integrated so as to easily seal the six coils 1. And the both ends 1b of the coil 1 are sealed in a state where at least a part thereof is buried in the sealing material without being displaced. And the core part 7 obtained by hardening a sealing material is taken out from a shaping die. As shown in FIG. 7, the plane of all end portions 1 b of the coil 1 is exposed on one surface of the core portion 8.

次に、サンドブラスト処理を行いバリ取りしと露出する両端部1bの表面の皮膜を除去し、コア部8のコイルの端部1bが露出する表面に導電性ペーストを印刷法で塗布し硬化させる。これにより導電性ペーストと内部のコイル1は導通する。最後に、めっき処理を行い導電性ペーストの表面上に外部電極9を形成し、図8に示すような面実装マルチフェーズインダクタを得る。なお、めっき処理によって形成される電極は、Ni、Sn、Cu、Au、Pdなどから1つもしくは複数を適宜選択して形成すれば良い。   Next, sandblasting is performed to remove the deburred and exposed coating on the surface of both ends 1b, and a conductive paste is applied to the surface of the core 8 where the coil end 1b is exposed by a printing method and cured. As a result, the conductive paste and the internal coil 1 are conducted. Finally, plating is performed to form the external electrode 9 on the surface of the conductive paste, and a surface-mount multiphase inductor as shown in FIG. 8 is obtained. Note that the electrode formed by plating may be formed by appropriately selecting one or a plurality of electrodes such as Ni, Sn, Cu, Au, and Pd.

(第2の実施例)
図9〜図15を参照しながら、本発明の面実装マルチフェーズインダクタの第2実施例を説明する。第2の実施例では、第1の実施例と同一組成の封止材と、同様の成形金型を用いてコイルを3つ内包した面実装マルチフェーズインダクタを作成する。なお、第1実施例と重複する部分の説明は割愛する。
(Second embodiment)
A second embodiment of the surface mount multiphase inductor according to the present invention will be described with reference to FIGS. In the second embodiment, a surface mount multiphase inductor including three coils is produced using a sealing material having the same composition as that of the first embodiment and a similar molding die. In addition, description of the part which overlaps with 1st Example is omitted.

まず、第2の実施例で用いるコイルとタブレットについて説明する。図9に本発明の実施例で用いるコイルとタブレットの斜視図を示す。図9に示すように、断面が楕円の巻き芯を用いて平角線を両端部11bが最外周となるように2段の外外巻きに巻回して巻回部11aを形成してコイル11を得る。このとき、コイル11の両端部11bは巻回部12aを挟んで対向するように1度引き出され、さらに同じ側面側に引き出されるように折り曲げ加工する。   First, the coil and tablet used in the second embodiment will be described. FIG. 9 shows a perspective view of the coil and tablet used in the embodiment of the present invention. As shown in FIG. 9, using a winding core having an elliptical cross section, a rectangular wire is wound around two outer and outer windings so that both ends 11b are at the outermost periphery to form a winding portion 11a to form a coil 11. obtain. At this time, both end portions 11b of the coil 11 are drawn once so as to face each other with the winding portion 12a interposed therebetween, and further bent so as to be drawn to the same side surface side.

次に、第1の実施例で用いた同一組成の封止材を用いてタブレットを作成する。第1のタブレット12と第2のタブレット13は加圧成型で作成する。本実施例では第1のタブレット12と第2のタブレット13の強度を高めるために、さらに熱処理をして封止材を半硬化状態とした。図9に示すように、第1のタブレット12はコイル11を囲うように平面部の周縁に2つの柱状凸部12aを有する形状に形成する。コイル11の両端部11bは柱状凸部2aの外側側面に沿うように配置する。第2のタブレット13はコイル11の空芯に対応する楕円状の位置だし用の凸部13aを有する形状に形成する。コイル11を第1のタブレット12と第2のタブレット13に挟むように組み合わせる。   Next, a tablet is produced using the sealing material of the same composition used in the first embodiment. The first tablet 12 and the second tablet 13 are created by pressure molding. In this embodiment, in order to increase the strength of the first tablet 12 and the second tablet 13, heat treatment was further performed to make the sealing material semi-cured. As shown in FIG. 9, the 1st tablet 12 is formed in the shape which has the two columnar convex parts 12a in the periphery of a plane part so that the coil 11 may be enclosed. Both end portions 11b of the coil 11 are arranged along the outer side surface of the columnar convex portion 2a. The 2nd tablet 13 is formed in the shape which has the convex part 13a for an elliptical position corresponding to the air core of the coil 11. FIG. The coil 11 is combined so as to be sandwiched between the first tablet 12 and the second tablet 13.

次に、第2の実施例で用いる成型金型とコア部の形成について説明する。図10に第2の実施例で用いる成型金型を説明する斜視図を示す。図11にコイルとタブレットの成型金型での配置を説明する上面図を示す。図12、図13に第2の実施例の面実装マルチフェーズインダクタの製造工程の一部を説明する図11のA−B−C−D断面に対応する断面図を示す。図14は第2の実施例のコア部を説明する斜視図である。図10、図11に示すように、割型14aと割型14bとからなる上型14と下型15とパンチ16を有する成型金型を用いる。上型14と下型15を組み合わせることによってキャビティ17が形成される。図11、図12に示すように、キャビティ17にコイル11と第1のタブレット12と第2のタブレット13を組み合わせたものを3つ装填した。このようにコイル11と第1のタブレット12と第2のタブレット13を配置すれば、コイル11の端部11bは、第1のタブレット12の柱状凸部12aと割型ダイ14bの内壁面で挟まれた状態となり、コイル11の両端部11bが適正な位置で固定される。そして、図13に示すように、パンチ16を用いて圧粉成形法で第1のタブレットと第2のタブレットの界面がなくなるように加圧して一体化してコア部18を形成する。このとき、第2のタブレット13の位置だし用凸部13aがコイル11の空芯にあるため、圧粉成形法のような大きな成形加圧をかけてもコイル11が変形することなくコア部18を成形することができる。そして、コア部18を熱硬化して図14に示すコア部18を得た。   Next, formation of a molding die and a core part used in the second embodiment will be described. FIG. 10 is a perspective view for explaining a molding die used in the second embodiment. FIG. 11 shows a top view for explaining the arrangement of the coil and the tablet in the molding die. 12 and 13 are cross-sectional views corresponding to the cross section A-B-C-D in FIG. 11 for explaining a part of the manufacturing process of the surface mount multiphase inductor of the second embodiment. FIG. 14 is a perspective view for explaining the core part of the second embodiment. As shown in FIGS. 10 and 11, a molding die having an upper die 14, a lower die 15, and a punch 16 including a split die 14 a and a split die 14 b is used. A cavity 17 is formed by combining the upper mold 14 and the lower mold 15. As shown in FIGS. 11 and 12, three combinations of the coil 11, the first tablet 12, and the second tablet 13 were loaded in the cavity 17. If the coil 11, the first tablet 12, and the second tablet 13 are arranged in this way, the end 11b of the coil 11 is sandwiched between the columnar convex portion 12a of the first tablet 12 and the inner wall surface of the split die 14b. Thus, both ends 11b of the coil 11 are fixed at appropriate positions. Then, as shown in FIG. 13, the core portion 18 is formed by pressing and integrating the punch 16 so as to eliminate the interface between the first tablet and the second tablet by a compacting method. At this time, since the projecting portion 13a for positioning the second tablet 13 is in the air core of the coil 11, the core portion 18 is not deformed even when a large molding pressure is applied as in the compacting method. Can be molded. And the core part 18 was thermosetted and the core part 18 shown in FIG. 14 was obtained.

次に、サンドブラスト処理を行いバリ取りと露出する両端部11bの表面の皮膜を除去し、コア部18のコイルの端部11bが露出する表面に導電性ペーストを印刷法で塗布し硬化させる。これにより導電性ペーストと内部のコイル11は導通する。最後に、めっき処理を行い導電性ペーストの表面上に外部電極19を形成し、図15に示すような面実装マルチフェーズインダクタを得る。   Next, sandblasting is performed to remove the film on the surface of both end portions 11b exposed to deburring, and a conductive paste is applied to the surface on which the end portion 11b of the coil of the core portion 18 is exposed by a printing method and cured. As a result, the conductive paste and the internal coil 11 are conducted. Finally, plating is performed to form external electrodes 19 on the surface of the conductive paste, and a surface-mount multiphase inductor as shown in FIG. 15 is obtained.

上記実施例では、封止材として磁性粉末に鉄系金属磁性粉末、樹脂にエポキシ樹脂を混合し、透磁率が25となるように調製したものを用いた。しかしながら、これに限らず例えば、磁性粉末としてフェライト系磁性粉末などや、絶縁皮膜形成や表面酸化などの表面改質を行った磁性粉末を用いても良い。また、ガラス粉末などの無機物を加えても良い。そして、樹脂としてポリイミド樹脂やフェノール樹脂などの熱硬化性樹脂やポリエチレン樹脂やポリアミド樹脂などの熱可塑性樹脂を用いても良い。   In the above-described example, a sealing material prepared by mixing magnetic powder with iron-based metal magnetic powder and resin with epoxy resin and having a magnetic permeability of 25 was used. However, the present invention is not limited thereto, and for example, ferrite magnetic powder or the like as magnetic powder, or magnetic powder subjected to surface modification such as insulation film formation or surface oxidation may be used. In addition, an inorganic substance such as glass powder may be added. Further, a thermosetting resin such as a polyimide resin or a phenol resin, or a thermoplastic resin such as a polyethylene resin or a polyamide resin may be used as the resin.

上記実施例では、コイルとして楕円形状に2段の渦巻き状に巻回したものを用いたが、これに限らず例えば、段数が多いものや、例えば円形、矩形、扇形、半円状、台形や多角形状、若しくはそれらを組み合わせた形状のコイルを用いてもよい。コイルの形状は、成形時におけるコイルの回転防止の観点でみれば定幅図形を除く形状が好ましい。   In the above-described embodiment, an elliptical coil wound in two stages is used. However, the present invention is not limited to this, for example, a coil having a large number of stages, for example, a circle, a rectangle, a fan, a semicircle, a trapezoid, A coil having a polygonal shape or a combination of them may be used. The shape of the coil is preferably a shape excluding a constant width figure from the viewpoint of preventing the rotation of the coil during molding.

上記実施例では、外部電極形成法として導電性ペーストの塗布とめっき処理を用いたが、これに限らず例えば、はんだ等を用いても良い。導電性ペーストの塗布方法についても、ポッティング法などの方法でも良い。   In the above embodiment, the application of the conductive paste and the plating process are used as the external electrode forming method. However, the present invention is not limited thereto, and for example, solder or the like may be used. The method for applying the conductive paste may also be a potting method or the like.

上記実施例では、コイルの端部表面の皮膜を剥離する方法としてサンドブラスト処理を用いたが、これに限らず機械剥離等の剥離方法を用いても可能である。また、コア部を形成する前に予め端部の皮膜を剥離してもよい。   In the above embodiment, the sandblasting process is used as a method for peeling the coating on the end surface of the coil. However, the present invention is not limited to this, and a peeling method such as mechanical peeling may be used. Moreover, you may peel the coating | film | coat of an edge part previously before forming a core part.

上記の実施例において、タブレットとしてE型コアと板状コアの組み合わせ、U型コアとT型コアの組み合わせを例示したが、これに限らず2つのE型コアを組み合わせるなどの組み合わせでも良い。また、未硬化状態ではなく半硬化状態でも良い。そして、その成形方法も加圧成形法やシート状成形物から切り出すなど用途に合わせて適宜選択すれば良い。   In the above embodiment, the combination of the E-shaped core and the plate-shaped core and the combination of the U-shaped core and the T-shaped core are exemplified as the tablet. However, the present invention is not limited to this, and a combination of two E-shaped cores may be used. Moreover, not a non-hardened state but a semi-hardened state may be sufficient. The molding method may be appropriately selected according to the application such as a pressure molding method or cutting out from a sheet-like molded product.

1:コイル(1a:巻回部、1b:端部)
2:タブレット(2a:柱状凸部、2b:位置だし用の凸部)
3:板状タブレット
4:上型(4a、4b:割型)
5:下型
6:パンチ
7:キャビティ
8:コア部
9:外部電極
11:コイル(11a:巻回部、11b:端部)
12:第1のタブレット(12a:柱状凸部)
13:第2のタブレット(13a:位置だし用の凸部)
14:上型(14a、14b:割型)
15:下型
16:パンチ
17:キャビティ
18:コア部
19:外部電極
1: Coil (1a: winding part, 1b: end part)
2: Tablet (2a: columnar convex part, 2b: convex part for positioning)
3: Plate-shaped tablet 4: Upper mold (4a, 4b: Split mold)
5: Lower mold 6: Punch 7: Cavity 8: Core part 9: External electrode 11: Coil (11a: Winding part, 11b: End part)
12: 1st tablet (12a: columnar convex part)
13: Second tablet (13a: convex portion for positioning)
14: Upper mold (14a, 14b: Split mold)
15: Lower mold 16: Punch 17: Cavity 18: Core part 19: External electrode

Claims (5)

導線を巻回し、両端部が扁平な形状の複数のコイルと、
主として磁性粉末と結合材とからなる該複数のコイルを内包するコアと、
該コアの1つの表面に形成された外部電極と、を有し、
該コイルの導線の端部の両方がの最外周となるようにし、
該コイルの巻軸が該外部電極の形成されるコアの表面に対して平行となるように該複数のコイルを該コアに内包する
ことを特徴とする面実装マルチフェーズインダクタ。
Winding a conducting wire, and a plurality of coils whose ends are flat,
A core containing the plurality of coils mainly composed of magnetic powder and a binder;
An external electrode formed on one surface of the core,
So that both ends of the conductive wire of the coil are the outermost periphery,
A surface-mount multiphase inductor, wherein the plurality of coils are included in the core such that a winding axis of the coil is parallel to a surface of the core on which the external electrode is formed.
前記コイルが平角導線を用いて定幅図形を除く形状に形成されていることを特徴とする請求項1記載の面実装マルチフェーズインダクタ。   2. The surface-mount multiphase inductor according to claim 1, wherein the coil is formed in a shape excluding a fixed width figure using a flat wire. 成型金型を用いて主に樹脂と磁性粉末とからなる封止材で複数のコイルを封止した面実装マルチフェーズインダクタの製造方法において、
該封止材を平板形状の周縁部に柱状凸部を有する形状に予備成形してタブレットを複数形成し、
両端部が扁平な形状の導線を巻き芯を用いて該両端部が最外周になるように巻回してなるコイルを複数形成し、
該タブレットに該コイルを載置し、該コイルの両端部を該タブレットの柱状凸部の外側側面に沿わせたものを該成型金型内の1つのキャビティに対して複数配置し、
樹脂成形法もしくは圧粉成形法を用いて該封止材で該複数のコイルを封止してコアを形成し、なお、該複数のコイルの両端部が該コアの1つの表面上に露出し、且つ、該端部が露出する表面に対して該コイルの巻軸が平行となるように封止する、
該端部の露出する該コアの表面に外部電極を形成する
ことを特徴とする面実装マルチフェーズインダクタの製造方法。
In a method for manufacturing a surface mount multiphase inductor in which a plurality of coils are sealed with a sealing material mainly made of resin and magnetic powder using a molding die,
A plurality of tablets are formed by pre-molding the sealing material into a shape having a columnar convex portion at the peripheral edge of the flat plate shape,
A plurality of coils are formed by winding a conductive wire having a flat shape at both ends so that both ends are at the outermost periphery using a winding core,
The coil is placed on the tablet, and a plurality of the coils having both end portions along the outer side surface of the columnar convex portion of the tablet are arranged with respect to one cavity in the molding die,
The core is formed by sealing the plurality of coils with the sealing material using a resin molding method or a powder molding method, and both ends of the plurality of coils are exposed on one surface of the core. And sealing so that the winding axis of the coil is parallel to the surface from which the end is exposed.
An external electrode is formed on the surface of the core exposed at the end. A method for manufacturing a surface-mount multiphase inductor.
前記タブレットがさらに前記コイルの位置だし用の凸部を有する形状に成形されることを特徴とする請求項3に記載の面実装マルチフェーズインダクタの製造方法。   4. The method of manufacturing a surface-mount multiphase inductor according to claim 3, wherein the tablet is further formed into a shape having a convex portion for positioning the coil. 前記コアを形成する工程において、
前記コイルの端部が前記タブレットの柱状凸部と、前記キャビティの内壁面もしくはパンチとの間に挟まれた状態で該コイルと前記封止材を一体化させてコア部を形成することを特徴とする請求項3または請求項4に記載の面実装マルチフェーズインダクタの製造方法。
In the step of forming the core,
The coil and the sealing material are integrated to form a core portion in a state where the end of the coil is sandwiched between the columnar convex portion of the tablet and the inner wall surface or punch of the cavity. A method for manufacturing a surface-mounted multiphase inductor according to claim 3 or 4.
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