JP2013210948A - Data carrier to be stuck on metal, sticking method of data carrier, and radio communication method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide: a data carrier to be stuck on metal, which can perform stable radio communication; a sticking method of the data carrier; and a radio communication method.SOLUTION: A data carrier 10 to be stuck on metal is a data carrier to be stuck on metal that is to be stuck on the metal, and comprises: a base sheet 11; an electronic circuit 21 formed on the base sheet 11; a resin layer 13 laminated on the base sheet 11 and including a magnetic powder which has a real part magnetic permeability μ' of 20 or more at a frequency of 1 MHz when a sheet of 50% content is fabricated; and a spacer layer 14 laminated on the resin layer 13. The content of the magnetic powder in the resin layer 13, and a distance from an interface between the resin layer 13 and the spacer layer to a metal surface satisfy a predetermined relation.

Description

  The present invention relates to a data carrier for attaching a metal body, a method for attaching a data carrier, and a wireless communication method.

  In recent years, a radio frequency identification (RFID) system has become widespread. An RFID system is a reader that reads and writes (reads / writes) information by transmitting and receiving radio waves by electromagnetic induction between the data carrier attached to a person or an article, etc., and accessing the internal memory of the data carrier. / Writer and an electronic computer that controls the reader / writer. The data carrier is called an RFID tag (non-contact IC tag), a non-contact IC card, or the like according to its shape, size, etc. (hereinafter collectively referred to as an IC tag).

  In the RFID system, a non-contact type IC tag attached to a person or an article is held over an information acquisition device such as a reader / writer that emits electromagnetic waves, and is stored in an IC chip built in the IC tag. Information can be obtained from the data. The RFID system can be used for information management of location of people and goods, product distribution, history of processing processes, etc. because it can identify people and goods, write additional information, etc. by information communication using electromagnetic waves. . For this reason, the RFID system can be used for, for example, commuter pass of various transportation facilities, management of people in / out of a company building, inventory management of goods, logistics management, etc. ing.

  When the IC tag is attached to a conductive member such as metal, an eddy current is generated in the metal of the object behind by an alternating magnetic field generated by electromagnetic waves for transmission and reception of the IC tag. In many cases, this eddy current generates a magnetic flux in a direction that cancels the transmission / reception magnetic flux, which attenuates the transmission / reception magnetic flux and makes communication difficult.

  Therefore, when a non-contact type IC tag is attached to a member made of a conductive material such as metal, the following has been proposed as a method for suppressing the transmission / reception magnetic flux from being attenuated and communication becoming difficult. (For example, refer to Patent Documents 1 and 2). For example, Patent Document 1 discloses a technique in which a soft magnetic magnetic sheet is disposed between a non-contact type IC tag and a conductive member. Further, Patent Document 2 discloses a technique for suppressing generation of eddy currents that occur when metal magnetic flux enters by sealing with magnetic resin and passing transmission / reception magnetic flux therethrough.

JP 2007-233508 A JP 2005-327245 A

  However, when attaching a non-contact type IC tag to a member made of a conductive material such as a metal, the methods described in Patent Documents 1 and 2 require a separately expensive magnetic sheet, and the existing IC tag In addition, since magnetic sheets must be laminated, the number of manufacturing processes may increase or new equipment may be required.

  The present invention has been made in view of the above problems, and an object thereof is to provide a data carrier for metal sticking, a sticking method thereof, and a wireless communication method that can be manufactured inexpensively and easily.

In order to solve the above-described problems and achieve the object, a data carrier for attaching a metal body according to the present invention is a data carrier for attaching a metal body to a metal body as an adherend, and a base sheet, An electronic circuit formed on the base sheet, and a magnetic powder having a real part permeability μ ′ of 20 or more at a frequency of 1 MHz when a sheet having a content of 50% is laminated on the base sheet. A resin layer, a spacer layer laminated on the resin layer, a content of the magnetic powder in the resin layer, an interface between the resin layer and the spacer layer, and a surface of the metal body The distance between and satisfies any one of the following relationships.
The content of the magnetic powder in the resin layer is 70% by mass or more and 80 g / m ² or more, and the distance between the interface between the resin layer and the spacer layer and the surface of the metal body is 20 μm or more (1)
The content of the magnetic powder in the resin layer is 60% by mass or more and 50 g / m ² or more, and the distance between the interface between the resin layer and the spacer layer and the metal surface is 50 μm or more (2)
The content of the magnetic powder in the resin layer is 75% by mass or more and 130 g / m ² or more, and the distance between the interface between the resin layer and the spacer layer and the metal surface is 10 μm or more (3)

  In the present invention, the magnetic powder is preferably an Fe-Al alloy.

Further, the data carrier attaching method according to the present invention is a data carrier attaching method for attaching a data carrier to a metal body as an adherend, and the content is contained in a base material sheet having an electronic circuit formed on the surface thereof. A data carrier obtained by laminating a resin layer containing a magnetic powder having a real part magnetic permeability μ ′ of 20 or more at a frequency of 1 MHz when a 50% sheet is created, and the content of the magnetic powder in the resin layer, It affixes to the said metal body so that the distance between the interface of the said resin layer and the said spacer layer and the said metal body surface may satisfy | fill either of the following relationships.
The content of the magnetic powder in the resin layer is 70% by mass or more and 80 g / m ² or more, and the distance between the interface between the resin layer and the spacer layer and the surface of the metal body is 20 μm or more (1)
The content of the magnetic powder in the resin layer is 60% by mass or more and 50 g / m ² or more, and the distance between the interface between the resin layer and the spacer layer and the metal surface is 50 μm or more (2)
The content of the magnetic powder in the resin layer is 75% by mass or more and 130 g / m ² or more, and the distance between the interface between the resin layer and the spacer layer and the metal surface is 10 μm or more (3)

The wireless communication method according to the present invention is a wireless communication method using a metal carrier for data sticking when performing wireless communication with a data carrier attached to a metal body with a reader / writer, wherein the data carrier for metal sticking is A resin layer containing magnetic powder having a real part permeability μ ′ at a frequency of 1 MHz when a sheet having a content of 50% is formed on one surface of the base sheet is 20 or more, and the resin layer The content of the magnetic powder in the inside and the distance between the interface between the resin layer and the spacer layer and the surface of the metal body satisfy one of the following relationships.
The content of the magnetic powder in the resin layer is 70% by mass or more and 80 g / m ² or more, and the distance between the interface between the resin layer and the spacer layer and the surface of the metal body is 20 μm or more (1)
The content of the magnetic powder in the resin layer is 60% by mass or more and 50 g / m ² or more, and the distance between the interface between the resin layer and the spacer layer and the metal surface is 50 μm or more (2)
The content of the magnetic powder in the resin layer is 75% by mass or more and 130 g / m ² or more, and the distance between the interface between the resin layer and the spacer layer and the metal surface is 10 μm or more (3)

  According to the present invention, the resin layer containing the magnetic powder so that the content of the magnetic powder in the resin layer and the distance between the metal body and the resin layer satisfy any of the above relationships. This eliminates the need for an additional configuration for containing the magnetic powder in the resin layer, and allows the existing equipment to be used as it is without increasing the number of steps required for the production of the data carrier. Can be manufactured.

FIG. 1 is a cross-sectional view schematically showing a data carrier for sticking metal according to an embodiment of the present invention. FIG. 2 is a cross-sectional view taken along the line AA of FIG. FIG. 3 is a plan view showing a state of an IC inlet in which a jumper wire is arranged between terminal portions and an IC chip is mounted.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out a metal carrier data carrier, a metal carrier data sticking method, and a wireless communication method according to the present invention (hereinafter referred to as embodiments) will be described in detail with reference to the drawings. In addition, this invention is not limited by the following embodiment. In addition, constituent elements in the following embodiments include those that can be easily assumed by those skilled in the art, those that are substantially the same, and those in a so-called equivalent range. Furthermore, the constituent elements disclosed in the following embodiments can be appropriately combined.

<Data carrier for metal sticking>
FIG. 1 is a plan view schematically showing a data carrier for sticking metal according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along line AA of FIG. As shown in FIGS. 1 and 2, a data carrier 10 for attaching a metal according to the present embodiment includes a base sheet 11, a non-contact data carrier element (IC inlet) 12 formed on one surface thereof, A resin layer 13 covering the IC inlet 12 and a spacer layer 14 covering the surface of the resin layer 13 are included. The metal sticking data carrier 10 is a metal sticking IC tag which is formed on a so-called adhesive label and is used by sticking to a metal body which is an adherend to be managed.

(Base material sheet)
The base sheet 11 functions as a support for holding the IC inlet 12 such as an electronic circuit and a terminal portion. The base material sheet 11 is not particularly limited as long as it has a function as a support capable of stably holding the IC inlet 12, and may be transparent or opaque. The base material sheet 11 is preferably paper such as fine paper, impregnated paper, glassine paper, coated paper, non-woven fabric, synthetic resin film or sheet. The resin material constituting the synthetic resin film or sheet is not particularly limited. For example, polyethylene, polypropylene, polyvinyl chloride, polystyrene, polyester such as polyethylene terephthalate and polyethylene naphthalate, polyvinyl acetate, polybutene, polyacrylic acid, Polymethacrylic acid, polyacrylic acid ester, polymethacrylic acid ester, polyvinyl alcohol, polybutylene terephthalate, polyarylate, polyvinyl formal, polyvinyl butyral, polyacrylonitrile, polyimide, polycarbonate, polyamide, ethylene-vinyl acetate copolymer, ethylene-acrylic Acid ester copolymer, polyvinyl acetal, ethyl cellulose, cellulose triacetate, hydroxypropyl cellulose, or acrylic Nitrile - butadiene - can include various resins such as styrene copolymer.

  The base sheet 11 may be uniaxially stretched or biaxially stretched. The base sheet 11 may be a single layer or a multilayer of two or more layers of the same type or different types. The base sheet 11 is preferably water resistant. If it is water resistant, it will not break even if it gets wet. In addition, the base sheet 11 is preferably concealed in order to make it difficult to visually recognize the electronic circuit. When the base sheet 11 is not concealed, a concealable sheet is pasted on the surface of the base sheet 11. It is preferable to combine them.

  Although the thickness of the base material sheet 11 is not specifically limited, What is necessary is just 3-500 micrometers, Preferably it is 5-200 micrometers, More preferably, it is 25-125 micrometers. When the thickness of the base sheet 11 is less than 3 μm, the mechanical strength (tensile, tearing, rupture, etc.) as a support is insufficient, or the base sheet 11 is thin and has no stiffness. May be inferior in handling property. Further, when the thickness of the substrate sheet 11 exceeds 500 μm, there is too much stiffness, which is not preferable from the viewpoints of handling properties and the size and thickness reduction of the data carrier 10 for attaching metal.

  In order to increase the adhesive force between the base material sheet 11 and the resin layer 13 to be laminated, the surface of the base material sheet 11 may be surface-treated. Examples of the surface treatment method include corona discharge treatment, chemical treatment, and resin coating.

(Electronic circuit)
FIG. 3 is a schematic plan view of the electronic circuit. As shown in FIG. 3, the electronic circuit is arranged with a space between the helical circuit line 23, the terminal part 24 and the terminal part 25 connected to the circuit line 23, and the terminal parts 24 and 25. Terminal portions 26 and 27 and lead wires 28 connecting the terminal portions 26 and 27 are provided.

  The IC inlet 12 can be constituted by an electronic circuit and an IC chip 22, but in addition to these, includes other electronic components such as a battery, a capacitor, a resistor, a coil, a diode, or a connection line. You can also.

  The terminal part 24 and the terminal part 27 are connected by a jumper wire 29. The terminal portion 24 is connected to the innermost end of the circuit line 23 and is a jumper terminal portion for connecting one end of the jumper wire 29. The terminal portion 25 is connected to the outermost end of the circuit line 23 and is an IC chip mounting terminal portion for mounting one end of the IC chip 22. The terminal portion 26 is a terminal that forms an IC chip mounting terminal portion together with the terminal portion 25 and is not connected to the circuit line 23. The terminal portion 27 is a jumper terminal portion that is provided on the outermost side of the circuit line 23 and connects one end of the jumper wire 29.

  The circuit wire 23, the terminal portions 24, 25, 26, 27, and the lead wire 28 are made of a conductive material. Examples of the conductive material include simple metals such as metal wires, metal foils, vapor deposition films, and thin films formed by sputtering. Gold, silver, nickel, copper, aluminum, etc. can be used as the metal simple substance. In addition, as other conductive materials, conductive paste or conductive ink in which metal particles such as gold, silver, nickel, and copper are dispersed in a binder or solvent can be used.

  The average particle diameter of the metal particles is preferably 0.001 μm to 15 μm, and particularly preferably 0.001 μm to 10 μm. Examples of the binder include polyester resin, polyurethane resin, epoxy resin, phenol resin, and the like.

  Solvents include alcohols such as hexanol, heptanol, octanol and cyclohexanol, long-chain alkanes such as hexane, heptane, octane and trimethylpentane, cyclic alkanes such as cyclohexane and cycloheptane, and aromatics such as benzene, toluene, xylene and trimethylbenzene. Group hydrocarbons, acetone, water and the like can be exemplified. These solvents may be used alone, or two or more kinds may be selected and used as a mixed solvent.

  An insulating layer 30 is provided on the upper surface portion of the circuit line 23 between the terminal portion 24 and the terminal portion 27. By providing the jumper wire 29 on the surface of the insulating layer 30, the terminal portion 24 and the terminal portion 27 are connected by the jumper wire 29.

  The conductive material for forming the jumper wire 29 can be formed using a conductive paste such as a silver paste or a conductive ink. A method of forming the jumper wire 29 is to form an insulating layer 30 by printing insulating ink on the upper surface portion of the spiral annular circuit wire 23 between the terminal portion 24 and the terminal portion 27 by screen printing or the like and drying it. Thereafter, a conductive paste is printed on the insulating layer 30 in a line shape by screen printing or the like, dried to form a jumper wire 29, and the terminal portion 24 and the terminal portion 27 are connected. As the conductive paste, the conductive paste exemplified as the conductive material can be used. Examples of the insulating ink include photocurable ink such as ultraviolet curable ink mainly composed of acrylic resin or urethane resin.

  The jumper wire 29 only needs to be able to electrically connect the terminal portions 24 and 27, and its shape and thickness are not particularly limited. For example, it may be a rectangular linear shape or a shape obtained by bending a rectangle as shown in FIG. 1 at a right angle. Further, the thickness of the jumper wire 29 is preferably 1 μm to 100 μm, particularly preferably 3 μm to 50 μm. When the thickness of the jumper wire 29 is less than 1 μm, the coating film strength is insufficient, cracking may occur, and conduction may be cut off. Moreover, when the thickness of the jumper wire 29 exceeds 100 μm, it takes a long time in the film-forming drying process, and it is not preferable from the viewpoint of thinning.

  As the insulating layer 30, an insulating resin such as an acrylic resin, a urethane resin, or an acrylic urethane resin can be used. The insulating layer 30 can be formed by a screen printing method so as to cover the upper surface of the circuit line 23 between the terminal portion 24 and the terminal portion 27. The insulating layer 30 only needs to have a thickness that allows the circuit line 23 and the upper surface of the insulating layer 30 to be electrically insulated, and is not particularly limited, but is preferably 1 μm to 100 μm, and particularly preferably 3 μm to 50 μm. When the thickness of the insulating layer 30 is less than 1 μm, there is a possibility that repelling may occur when an insulating resin is applied to form a film, and there may be a place where insulation cannot be achieved. On the other hand, when the thickness of the insulating layer 30 exceeds 100 μm, a long time is required in the drying / curing process of film formation, and it is not preferable from the viewpoint of thinning.

  In order to form the circuit wires 23, the terminal portions 24, 25, 26, 27, the lead wires 28, and the like on the base sheet 11, for example, a method of manufacturing by screen printing using a conductive paste or conductive ink The metal foil is bonded to the base material sheet 11 with an adhesive, and a resist pattern having a shape such as the circuit wire 23, the terminal portions 24, 25, 26, 27, and the lead wire 28 is printed by a screen printing method or the like. Is etched to remove the metal foil in portions other than the circuit wire 23, the terminal portions 24, 25, 26, 27, and the lead wires 28, and wash the resist, thereby cleaning the circuit wire 23 and the terminal portions 24, 25, 26. 27, a method of forming a lead wire 28, and the like, and various methods for manufacturing an ordinary electronic circuit. The etching process can be performed by a process similar to a normal etching process. Further, the formation of the circuit wires 23, terminal portions 24, 25, 26, 27, lead wires 28 and the like on the surface of the base sheet 11 is performed by using a conductive paste or conductive ink, a gravure method, a flexo method, an ink jet method, or the like. It can also be carried out by adhering to the shape of the circuit wire 23, the terminal portions 24, 25, 26, 27, the lead wire 28, etc. by means such as printing or coating.

  As a manufacturing method using a resist such as the circuit wire 23 and the terminal portions 24, 25, 26, 27, and the lead wire 28, specifically, on the copper foil surface of a laminate film obtained by bonding a copper foil and a polyethylene terephthalate film. Then, after printing a resist pattern for forming a helical ring circuit line, etc., the copper foil portion is etched to remove the unnecessary copper foil portion, and the circuit wire 23 and the terminal portions 24, 25, 26, 27, lead wires The method of forming 28 etc. is mentioned.

  The thickness of the conductive material forming the circuit line 23 and the terminal portions 24, 25, 26, 27, the lead wire 28, etc. is preferably 1 μm to 100 μm, and particularly preferably 3 μm to 50 μm. When the thickness of the conductive material is less than 1 μm, the mechanical strength may be insufficient or the handling properties in the manufacturing process may be inferior. On the other hand, when the thickness of the conductive material exceeds 100 μm, it is stiff and unfavorable in handling properties, and is not preferable from the viewpoint of weight reduction and thinning.

  The terminal portion 25 and the terminal portion 26 are connected by the IC chip 22. Examples of the method of connecting the IC chip 22 include a method of connecting the surface of the terminal portion 25 and the terminal portion 26 by a flip chip bonding method through an anisotropic conductive film or anisotropic conductive paste. In the flip chip bonding method, stud bumps are provided on the electrode portions of the IC chip 22, and the IC chip 22 is formed on the anisotropic conductive film or anisotropic conductive paste coated on the surfaces of the terminal portions 25 and 26. In this method, the surface with the stud bumps is pressed to enter the anisotropic conductive film or anisotropic conductive paste, and the terminal portions 25, the terminal portions 26, and the IC chip 22 are electrically connected. Thus, by connecting the IC chip 22 to the terminal portion 25 and the terminal portion 26, the IC chip 22 is connected and the IC inlet 12 can be created.

  In addition, the terminal part 24 and the terminal part 27 do not connect the top of the spiral annular circuit line 23 with the jumper wire 29, and lead the terminal part 24 and the terminal part 27 to the back surface of the base sheet 11 through the through-hole. 23 may be connected.

  Examples of the shape of the electronic circuit formed by the circuit lines 23 include those shown in FIG. In FIG. 3, a circuit wire 23 made of a single conductive material is arranged in a six-fold spiral shape from the outer periphery to the inside of a rectangular base sheet 11 at a predetermined interval, and functions as an antenna. A circuit is formed. As shown in FIG. 3, the electronic circuit may be arranged in a six-folded helical ring, but may be a single to five-folded helical ring, or may be a seven-fold or more helical ring. Further, the shape of the electronic circuit may not be a rectangular spiral ring as shown in FIG. 3. For example, any shape of a helical ring such as a polygonal circular ring other than a square, a circular helical ring, or an elliptical shape may be used. It may be. Further, the electronic circuit may not have a shape wound in a ring shape, and there is a broken portion in one straight or curved intermediate portion, and there is a set of IC chip mounting terminal portions in this broken portion. Shape may be sufficient. In other words, as the shape of the electronic circuit, any shape suitable for the resonance frequency of the radio wave may be selected.

  In this embodiment, the IC chip 22 is provided outside the spiral circuit line 23 of the electronic circuit. However, the IC chip 22 may be provided inside the electronic circuit of the spiral circuit line 23. You may provide in the middle of the electronic circuit of the cyclic | annular circuit line 23. FIG. When the IC chip 22 is provided inside the spiral ring of the electronic circuit, the terminal portion 24 may be provided outside, and the terminal portion 25 and the terminal portion 27 may be provided inside.

  In the above description, an example in which a pair of counter electrodes are formed has been described. However, the present invention is not limited to this, and a large number of counter electrodes are formed and these electrodes are connected to each part of the planar coil circuit unit. The coil inductance may be arbitrarily selected by the jumper wire 29, and the jumper wire 29 may be formed on the opposite surface of the insulating base material through a through hole formed in the insulating base material. Surface circuits may be formed on both sides of the substrate.

(Resin layer)
The resin layer 13 covers the IC inlet 12 formed on the base sheet 11 and the one surface 11a of the base sheet 11, and includes magnetic powder.

  The resin layer 13 is formed using an organic solvent-soluble adhesive, an organic solvent-dispersed adhesive, a water-dispersed adhesive, a water-soluble adhesive, or the like. Examples of the adhesive used for the resin layer 13 include a natural rubber-based adhesive, a synthetic rubber-based adhesive, an acrylic resin-based adhesive, a polyester resin-based adhesive, a polyvinyl ether resin-based adhesive, a urethane resin-based adhesive, Examples include silicone resin-based pressure-sensitive adhesives. Specific examples of the synthetic rubber pressure-sensitive adhesive include styrene-butadiene rubber, polyisobutylene rubber, isobutylene-isoprene rubber, isoprene rubber, styrene-isoprene block copolymer, styrene-butadiene block copolymer, styrene-ethylene-butylene block. Examples thereof include copolymers and ethylene-vinyl acetate thermoplastic elastomers. Specific examples of the acrylic resin-based adhesive include acrylic acid, methyl acrylate, ethyl acrylate, propyl acrylate, butyl acrylate, 2-ethylhexyl acrylate, methyl methacrylate, ethyl methacrylate, butyl methacrylate, acrylonitrile Homopolymers or copolymers such as The polyester resin-based adhesive is a copolymer of a polyhydric alcohol and a polybasic acid. Examples of the polyhydric alcohol include ethylene glycol, propylene glycol, and butanediol. Polybasic acids include terephthalic acid and adipic acid. And maleic acid. Specific examples of the polyvinyl ether resin pressure-sensitive adhesive include polyvinyl ether and polyvinyl isobutyl ether. Specific examples of the silicone resin-based pressure-sensitive adhesive include dimethylpolysiloxane. These pressure-sensitive adhesives can be used alone or in combination of two or more.

  Moreover, the resin layer 13 can be blended with a tackifier, a softener, an anti-aging agent, a filler, a colorant such as a dye or a pigment, if necessary. Examples of the tackifier include rosin resin, terpene phenol resin, terpene resin, aromatic hydrocarbon-modified terpene resin, petroleum resin, coumarone / indene resin, styrene resin, phenol resin, xylene resin and the like. Examples of the softener include process oil, liquid rubber, and plasticizer. Examples of the filler include silica, talc, clay, calcium carbonate and the like.

  The thickness of the resin layer 13 is not particularly limited, but is usually 1 μm to 200 μm, and preferably 3 μm to 100 μm. When the thickness of the resin layer 13 is less than 1 μm, the adhesiveness may be insufficient, or repelling may occur when the resin layer 13 is formed by applying an adhesive. In addition, when the thickness of the resin layer 13 exceeds 200 μm, it takes a long time to dry the resin layer 13 by applying an adhesive, or the adhesive protrudes from the end face. And is not preferable from the viewpoint of thinning.

  In addition, the resin layer 13 in this embodiment includes a double-sided tape type in which an adhesive is laminated on both sides of a sheet-like intermediate substrate. As an intermediate base material, it can select from what was mentioned as the base material sheet 11, and as an adhesive laminated | stacked on both sides of an intermediate base material, the adhesive illustrated above can be used.

  Moreover, the resin layer 13 contains magnetic powder. The magnetic powder contained in the resin layer 13 has a real part permeability μ ′ of 20 or more at a frequency of 1 MHz when a sheet having a content of 50% is prepared.

  In this specification, the real part permeability μ ′ is a value obtained by measuring a sheet in which various magnetic powders are blended with chlorinated polyethylene resin by 50% by volume with an impedance analyzer (part number E4991A) manufactured by Agilent Technologies. That means. The real part permeability μ ′ is preferably 30 or more, and more preferably 40 or more. If the real part permeability μ ′ is less than 20, the communication performance may not be exhibited when it is attached to a metal.

  Examples of magnetic powders include sendust and ferrite. Fe-Ni-Cr-Si alloys, Fe-Ni alloys, Fe-Si alloys, Fe-Co alloys, Fe-Al alloys, etc. Among them, an Fe—Al-based alloy is preferable. Examples of the Fe—Al alloy include an Fe—Al alloy, an Fe—Al—Cr alloy, and an Fe—Al—Si alloy. Magnetic powders may be used alone or in combination of two or more. The coercive force of the magnetic powder used in this embodiment is preferably 600 A / m or less, and more preferably 400 A / m or less. If it exceeds 600 A / m, the communication performance may not be exhibited when it is attached to a metal. The coercive force is a value measured using an automatic measurement coercivity meter (trade name “K-HC1000”, manufactured by Tohoku Special Steel Co., Ltd.).

  The average particle size of the magnetic powder is preferably 0.1 μm to 200 μm, more preferably 1 μm to 100 μm. If the average particle diameter of the magnetic powder is within the above range, the magnetic powder can be included in the resin layer 13 in a state having high dispersibility in the resin layer 13. The average particle diameter of the magnetic powder is a value measured with a laser measuring machine (trade name: “HELOS”) manufactured by Sympatec.

  It is preferable that magnetic powders having different particle sizes are used in combination. Thereby, the gap between large magnetic powders can be filled with small magnetic powders. For example, it is preferable to use those having a plurality of particle sizes such as 3 types of 5 μm to 15 μm, 20 μm to 30 μm, and 50 μm to 100 μm.

  The shape of the magnetic powder is not particularly limited, and examples thereof include a spherical shape, a cubic shape, a flat shape, a cylindrical shape, and a conical shape. Especially, it is preferable that the shape of a magnetic powder is a flat shape from a viewpoint of covering the plane in the resin layer 13 facing the metal body surface.

  As a method of forming the resin layer 13 on the surface of the base sheet 11 provided with the electronic circuit, for example, the base sheet 11, the IC chip 22, the circuit wire 23, the terminal portion 24 and the terminal portion 26, and the jumper wire 29 are used. There is a method of applying an adhesive to the surface so as to cover the surface. In addition, after the adhesive layer is applied to the release agent layer surface of the release sheet to form the resin layer 13, the base sheet 11, the circuit wire 23, the terminal portion 24 and the terminal portion 26, the IC chip 22, the jumper wire 29, etc. are covered. In addition, there is a method in which the resin layer 13 is formed by bonding to the surface. The resin layer 13 may be laminated on the opposite surface of the base sheet 11 on which the electronic circuit is provided. In this case, in order to protect the electronic circuit, it is preferable to provide a protective sheet, which will be described later, so as to cover the electronic circuit.

  Various methods can be used as the method for applying the adhesive without particular limitation. For example, an air knife coater, a blade coater, a bar coater, a gravure coater, a roll coater, a curtain coater, a die coater, a knife coater, a screen coater, Mayer bar coaters, kiss coaters and the like.

(Spacer layer)
The spacer layer 14 is formed on the surface 13 a opposite to the surface on which the electronic circuit of the resin layer 13 is laminated, and a predetermined interval is provided between the metal body as the adherend and the resin layer 13. It is provided to have. The spacer layer 14 only needs to be able to cover the surface 13a opposite to the surface on which the electronic circuit of the resin layer 13 is laminated. Specifically, for example, a polyethylene resin, a polypropylene resin, Sheets made of various resins such as polyolefin resins such as polymethyl-1-pentene / ethylene / cycloolefin copolymer, ethylene-vinyl acetate copolymer, and polyester resins such as polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate, etc. Is mentioned. In addition, materials such as paper and non-woven fabric exemplified for the base sheet 11 can be used, and a resin layer containing no magnetic powder can be used. The resin layer at this time can mention what was illustrated by the above-mentioned resin layer 13. FIG.

  The thickness of the spacer layer 14 depends on the amount of the magnetic powder contained in the resin layer 13, but the combined thickness of the spacer layer 14 and a coating layer 15 to be described later is 10 μm or more and 500 μm or less. Preferably, it is 10 μm or more and 200 μm or less. If the combined thickness of the spacer layer 14 and the coating layer 15 is less than 10 μm, sufficient communication performance may not be obtained when the spacer layer 14 and the coating layer 15 are attached to metal. Further, when the combined thickness of the spacer layer 14 and the covering layer 15 exceeds 500 μm, it is not preferable from the viewpoint of reducing the thickness of the data carrier 10 for attaching a metal according to the present embodiment.

(Coating layer)
The coating layer 15 covers the spacer layer 14 as necessary, and does not contain magnetic powder. When the spacer layer 14 does not have adhesiveness, the coating layer 15 plays a role for attaching to the adherend and a role as the second spacer layer. Since the material constituting the coating layer 15 is the same as that of the resin layer 13, the description thereof is omitted.

  As described above, the thickness of the covering layer 15 may be such that the combined thickness of the covering layer 15 and the spacer layer 14 is within a predetermined range.

(Peeling material)
The release material 31 is detachably attached to the upper surface of the spacer layer 14 or the coating layer 15. As the peeling material 31, the thing similar to the base material sheet 11 can be used, For example, papers, such as a quality paper, an impregnation paper, a glassine paper, a coated paper, a nonwoven fabric, a synthetic resin film, or a sheet | seat etc. are mentioned. A material obtained by subjecting the bonding surface of the release material 31 to the spacer layer 14 and the coating layer 15 of the release material 31 as a base material to a release treatment as necessary can be used. In this case, examples of the release treatment include a method of applying a release agent made of a silicone resin, a long chain alkyl resin, a fluorine resin, a butadiene resin, an isoprene resin, and the like to form a release agent layer.

  The thickness of the release agent layer is not particularly limited, and is preferably 0.01 μm to 5 μm, more preferably 0.1 μm to 3 μm. When the thickness of the release agent layer is less than 0.01 μm, the release performance may be insufficient or it may be difficult to obtain a uniform coating film. Moreover, when the thickness of the release agent layer exceeds 5 μm, it takes a long time in the drying process of the film formation, or the coating film has viscoelasticity and the release performance is lost, and conversely, it has adhesiveness. There is a case.

  As a method of applying the release agent, for example, a method of applying and drying with an air knife coater, blade coater, bar coater, gravure coater, roll coater, curtain coater, die coater, knife coater, screen coater, Meyer bar coater, kiss coater, etc. Is mentioned.

  The release material 31 is stacked by attaching the release material 31 to the surface of the spacer layer 14 or the coating layer 15. In addition, you may provide another resin layer in the surface of the base material sheet 11 in which the peeling material 31 is not laminated | stacked. As this resin layer, the same resin layer as that described above can be used. Further, the release material 31 may be laminated on the surface of the resin layer.

  Further, a protective sheet may be laminated on the surface opposite to the base material sheet 11 on which the resin layer 13 is laminated. The protective sheet should just protect the surface of IC inlet, and the same thing as the base material sheet 11 is mentioned. Specifically, for example, polyethylene resins, polypropylene resins, polyolefin resins such as polymethyl-1-pentene / ethylene / cycloolefin copolymer, ethylene-vinyl acetate copolymer, polyethylene terephthalate, polyethylene naphthalate, poly Examples thereof include sheets made of various resins such as polyester resins such as butylene terephthalate, and various paper materials such as polyethylene laminated paper, polypropylene laminated paper, clay coated paper, resin coated paper, glassine paper, and fine paper.

  The thickness of the protective sheet is not particularly limited, but is preferably 100 μm or less.

  When using the data carrier 10 for attaching a metal according to the present embodiment, first, the release material 31 is peeled off from the spacer layer 14 or the coating layer 15, and the metal adherend as a data management object is applied to the present embodiment. The data carrier 10 for attaching metal is attached as an IC tag. After the adherend circulates in this state, the data of the IC chip 22 is referred to and predetermined data management is performed. As a result, the role of the IC tag regarding data management is terminated.

The data carrier 10 for attaching a metal according to this embodiment includes the content of the magnetic powder in the resin layer 13, the surface of the metal body that is the adherend, the resin layer 13 containing the magnetic powder, and the spacer layer 14. The distance from the interface satisfies any of the following relationships. The content of the magnetic powder refers to a density (g / m ² ) expressed by mass% in the resin layer 13 and weight per fixed area.
The content of the magnetic powder in the resin layer is 70% by mass or more and 80 g / m ² or more, and the distance between the interface between the resin layer and the spacer layer and the surface of the metal body is 20 μm or more (1)
The content of the magnetic powder in the resin layer is 60% by mass or more and 50 g / m ² or more, and the distance between the interface between the resin layer and the spacer layer and the metal surface is 50 μm or more (2)
The content of the magnetic powder in the resin layer is 75% by mass or more and 130 g / m ² or more, and the distance between the interface between the resin layer and the spacer layer and the metal surface is 10 μm or more (3)

  That is, when the content of the magnetic powder in the resin layer 13 is equal to or greater than a certain mass and equal to or greater than a certain density, the data carrier 10 for attaching a metal according to the present embodiment is constant with the metal body that is the adherend. Since it is designed to maintain a distance of 1, it is possible to communicate even when pasted on a metal body.

  Therefore, according to the data carrier 10 for attaching a metal according to the present embodiment, the content of the magnetic powder in the resin layer 13 and the distance between the metal body and the resin layer 13 are any of the above relationships. By using the resin layer 13 containing magnetic powder so as to satisfy the requirements, an additional configuration such as a magnetic sheet is not required, and the number of steps required for producing the data carrier 10 for attaching a metal according to the present embodiment is increased. Since existing facilities can be used as they are, it can be manufactured inexpensively and easily.

<Wireless communication method>
Next, the radio | wireless communication method using the data carrier 10 for metal sticking which concerns on this embodiment is demonstrated. When using the data carrier 10 for attaching a metal according to the present embodiment, first, the release material 31 is peeled off from the resin layer 13, and the data for attaching the metal according to the present embodiment is applied to a metal adherend that is a data management object. The carrier 10 is attached as an IC tag. When the adherend circulates in this state, the data carrier 10 for attaching a metal and the reader / writer according to the present embodiment perform wireless communication. The resonance frequency of the radio wave transmitted and received between the metal sticking data carrier 10 and the reader / writer according to the present embodiment is 13.56 MHz band, for example, 13.56 MHz ± 7 kHz, 13.56 MHz ± 150 kHz, 13.56 MHz ± 450 kHz. Etc. The reader / writer reads information on the IC chip 22 provided in the data carrier 10 for attaching a metal. The read information is referred to and managed by the reader / writer. Thereby, the role regarding the information of this IC tag is completed.

  As described above, the data carrier 10 for attaching a metal according to the present embodiment is provided on the surface where the circuit wire 23 of the electronic circuit 21, the terminal portions 24, 25, 26, 27, the lead wire 28, the IC chip 22, and the like are provided. The resin layer 13, the spacer layer 14, the coating layer 15, and the release material 31 are laminated in this order. The resin layer 13 contains a predetermined amount or more of a predetermined magnetic powder, and the resin layer 13 is provided with a predetermined distance from the metal body via the spacer layer 14 and the coating layer 15. Therefore, the metal carrier data carrier 10 according to the present embodiment includes the content of the magnetic powder in the resin layer 13 even when a non-contact type IC tag is attached to a member made of a conductive material such as metal. Since the resin layer 13 containing the magnetic powder is used so that the distance between the metal body and the resin layer 13 satisfies any of the predetermined relationships, the resin layer 13 contains the magnetic powder. Therefore, the existing equipment can be used as it is without increasing the number of steps required for producing the data carrier 10 for attaching a metal according to the present embodiment. Therefore, if the data carrier 10 for metal sticking which concerns on this embodiment is used, it can communicate with the data carrier stuck to the metal body cheaply and easily.

  Therefore, the data carrier 10 for attaching a metal according to the present embodiment can be effectively used by attaching it as a data carrier to a metal surface as an adherend. For example, it can be used as a label for sticking to the surface of physical distribution goods, or it can be attached to the surface of metal cards, home appliances, electronic computers, etc., and used as a commuter pass for various transportation facilities, or an entrance / exit management card for various institutions or companies Can be used as

  In the present embodiment, the spacer layer 14 and the resin layer 13 containing magnetic powder are provided by being laminated on the electronic circuit forming side of the IC inlet, but provided on the opposite surface of the IC inlet on the electronic circuit 21 forming side. Also good. Further, the resin layer 13 containing magnetic powder may be provided on both sides of the IC inlet. At this time, the spacer layer 14 may be provided between the metal body as the adherend and the IC inlet.

  In addition, in this embodiment, although the case where magnetic powder was contained in the adhesive as the resin layer 13 was demonstrated, it is not limited to this, It contains in the various resin layers which can be used as a coating film. be able to. As resin used for these resin layers, the resin material enumerated by the insulating layer and the base material sheet 11 can be mentioned. Above all, if the resin used in the insulating layer is used, the raw material used when creating the data carrier can also be used, so it is preferable from the aspect of raw material management because it does not increase the type of raw material, and when the insulating layer is formed Since the equipment can be used as it is, there is no need for capital investment, which is preferable. The resin layer 13 containing these magnetic powders may be directly applied to the surface of the electronic circuit of the IC inlet or the opposite surface, or a film formed by coating on a release paper or release film. And may be provided.

  In the present embodiment, the case where the data carrier 10 for attaching a metal according to the present embodiment is a data carrier having an IC chip has been described. However, the present invention is not limited to this, and the metal carrier according to the present embodiment is used. The data carrier 10 can be similarly applied to a resonance type anti-theft tag that does not have an IC chip. The anti-theft tag is a closed circuit consisting only of a metal circuit that does not have an IC chip, and resonates with a radio wave from a reader / writer to return a reflected wave, and whether or not it exists The tag etc. which can be judged can be mentioned.

  Next, the present invention will be specifically described with reference to examples. However, the present invention is not limited by these examples.

[Example 1-1]
(Production of IC tag)
Screen printing method on the copper foil surface of a copper foil laminated sheet (trade name “Nikaflex F-10T50C-1”, manufactured by Nikkan Kogyo Co., Ltd.) obtained by bonding a copper foil (thickness 35 μm) and a polyethylene terephthalate sheet (thickness 50 μm). The resist pattern was printed in the shape of the circuit line 23, the terminal portions 24, 25, 26, 27, and the lead wire 28. This was etched to remove unnecessary copper foil portions, and an integrated wiring pattern shown in FIG. 3 was manufactured. The line width of the circuit line 23 was 130 μm. The length of the rectangular ring circuit line in the long side direction was 22.5 mm, and the length in the short side direction was 16 mm.

  The terminal portion 24 was connected at the end of the innermost circuit line 23, and the terminal portion 25 was connected at the end of the outermost circuit line 23.

  Next, an insulating resist ink (trade name “FR-100G-35”, manufactured by Toyobo Co., Ltd.) is printed between the terminal portion 24 and the terminal portion 27 by a screen method so as to cover the spiral annular circuit line, and then dried. An insulating layer 30 having a thickness of 25 μm was formed. Further, a silver paste (trade name “DW250L-1”, manufactured by Toyobo Co., Ltd.) is printed between the terminal portion 24 and the terminal portion 27 by a screen method and dried to form a jumper wire 29 having a thickness of 15 μm. The terminal part 24 and the terminal part 27 are connected by a jumper wire 29 to form an electronic circuit.

  An RFID-IC chip (manufactured by NXP, trade name “I-CODE SLI”) was mounted on the created electronic circuit. For the mounting, a flip chip mounting machine (trade name “FB30T-M” manufactured by Kyushu Matsushita Co., Ltd.) was used. An IC chip mounting electronic circuit (IC inlet) was created using an anisotropic conductive adhesive (trade name “TAP0402E” manufactured by Kyocera Chemical Co., Ltd.) as the bonding material.

Next, a magnetic material which is an Fe-Al alloy having a real part permeability of 40 μ 'and a coercive force of 400 A / m is applied to an adhesive (trade name “PA-T1”, manufactured by Lintec Corporation) formed using an acrylic resin. 71.4 wt% of the powder was contained, converted into a resin, and formed into a film with a coating amount of 257 g / m ² (thickness 50 μm) to form a resin layer 13. This resin layer 13 was bonded to the surface of the IC inlet on which the created IC chip mounting electronic circuit was formed. Thereafter, a polyethylene terephthalate film having a thickness of 15 μm as a spacer layer 14 is laminated on the surface of the resin layer 13 and further coated with an acrylic pressure-sensitive adhesive (trade name “PA-T1”, manufactured by Lintec Corporation) that does not contain magnetic powder. A coating layer 15 having an amount of 10 g / m ² (thickness 10 μm) was laminated to produce an IC tag. Twenty-two IC tags were created. The outer shape of the IC tag was 30 mm in the long side direction and 20 mm in the short side direction.

  Twenty-two IC tags thus obtained were affixed to a stainless steel plate, and a communication test and reading distance evaluation by a reader / writer were performed. As a reader / writer (reading device), a trade name “TR3-A401” (weak type) manufactured by Takaya Corporation was used.

  Regarding the communication distance of the communication test, an IC tag is affixed to the center of the stainless steel plate, the IC tag and the center of each reader / writer are brought into contact with each other, and then the reader / writer is gradually separated from each other in parallel. The average value of the maximum intervals at which the detection is detected was defined as the communication distance. Regarding the evaluation of the communication test of the IC tag, the case where the reader / writer detects the IC tag is indicated by ◯, and the case where it is not detected is indicated by ×.

(Examples 1-2 to 1-18, 2-1, 2-2, 3-1 to 3-6, Comparative Examples 1-1 to 1-8, 2-1, 2-2, 3-1 to 3 -8)
Hereinafter, as shown in Table 1, Table 2, and Table 3, the type of pressure-sensitive adhesive used in the resin layer, the type of magnetic powder, the amount of pressure-sensitive adhesive used in the resin layer, the magnetic powder in the resin layer Twenty-two IC tags were prepared in the same manner as in Example 1-1 by changing the blending amount and the distance between the resin layer blended with the magnetic powder and the metal body. The trade name “PV-2” (manufactured by Lintec Corporation) was used as an adhesive made of a synthetic rubber resin. The distance between the resin layer containing the magnetic powder and the metal body was adjusted by appropriately changing the thickness of the coating layer 15 not containing the magnetic powder.

Specifically, when the distance between the resin layer 13 containing the magnetic powder and the metal body is 25 μm, the spacer layer 14 is 15 μm, and the coating layer 15 not containing the magnetic powder is 10 μm. When the distance between the resin layer containing the magnetic powder and the metal body is 50 μm, the spacer layer 14 is 15 μm, and the coating layer 15 not containing the magnetic powder is 35 μm. Further, when the distance between the resin layer 13 containing magnetic powder and the metal body was 15 μm, the spacer layer 14 was 15 μm, and the coating layer 15 containing no magnetic powder was not provided. In the case where the coating layer 15 was not provided, the communication test was performed by placing the spacer layer 14 in contact with the surface of the metal body. In Comparative Example 1-1, no magnetic powder was blended in the resin layer 13. All of the magnetic powders used in Examples and Comparative Examples have a flat shape, and are blended with three types having the following average particle diameters having different sizes.
Average particle diameter of Fe—Al: 10 μm, 25 μm, 75 μm
Average particle diameter of Fe—Al—Cr: 10 μm, 25 μm, 75 μm
Average particle diameter of Fe—Al—Si: 18 μm, 55 μm, 100 μm
Average particle diameter of Sr—Cr: 10 μm, 25 μm, 50 μm

From Table 1, the content of the magnetic powder in the resin layer is 70% by mass or more, the density of the magnetic powder in the resin layer is 80 g / m ² or more, and the metal body and the resin layer which are adherends In the communication test, the reader / writer detected the IC tag up to a maximum of 20 mm (see Examples 1-1 to 1-18). On the other hand, the content of the magnetic powder in the resin layer is 70% by mass or more, the density of the magnetic powder in the resin layer is 80 g / m ² or more, and the metal body that is the adherend. In the case where the distance between the resin layer and the resin layer was not 20 μm or more, the reader / writer did not detect the IC tag in the communication test (see Comparative Examples 1-1 to 1-8).

Therefore, the metal carrier data carrier according to the present invention has a magnetic powder content in the resin layer of 70% by mass or more, a magnetic powder density in the resin layer of 80 g / m ² or more, In the communication test, it was confirmed that it could be detected by a reader / writer if the distance between the metal body and the resin layer, which is an adherend, was 20 μm or more.

Further, from Table 2, the content of the magnetic powder in the resin layer is 60% by mass or more, the density of the magnetic powder in the resin layer is 50 g / m ² or more, and the adhesion between the adherend and the resin layer When the interval was 50 μm or more, the reader / writer detected the IC tag up to 5 mm in the communication test (see Examples 2-1 and 2-2). On the other hand, the content of the magnetic powder in the resin layer is 60% by mass or more, the density of the magnetic powder in the resin layer is 50 g / m ² or more, and the metal body as the adherend. In the case where the distance between the resin layers was not more than 50 μm, the reader / writer did not detect the IC tag in the communication test (see Comparative Examples 2-1 and 2-2).

Therefore, the metal carrier data carrier according to the present invention has a magnetic powder content of 60% by mass or more in the resin layer, and the density of the magnetic powder in the resin layer is 50 g / m ² or more. In the communication test, it was confirmed that it can be detected by the reader / writer if the distance between the metal body as the adherend and the resin layer is 50 μm or more.

Further, from Table 3, the content of the magnetic powder in the resin layer is 75% by mass or more, the density of the magnetic powder in the resin layer is 130 g / m ² or more, and the adhesion between the adherend and the resin layer When the interval is 10 μm or more, the reader / writer detected the IC tag up to 12 mm in the communication test (see Examples 3-1 to 3-6). On the other hand, the content of the magnetic powder in the resin layer is 75% by mass or more, the density of the magnetic powder in the resin layer is 130 g / m ² or more, and the metal body that is the adherend. In the case where the distance between the resin layer and the resin layer was not 10 μm or more, the reader / writer did not detect the IC tag in the communication test (see Comparative Examples 3-1 to 3-8).

Therefore, the metal carrier data carrier according to the present invention has a magnetic powder content in the resin layer of 75% by mass or more, a density of the magnetic powder in the resin layer of 130 g / m ² or more, If the distance between the metal body and the resin layer is 10 μm or more, it was confirmed that it can be detected by the reader / writer in the communication test.

  Therefore, it can be said that the communication distance becomes longer as the content of the magnetic powder in the resin layer 13 is larger and the distance between the metal body as the adherend and the resin layer 13 is longer. Therefore, if the metal carrier data carrier 10 according to the present invention is used, a magnetic powder having a real part permeability μ ′ of 20 or more at a frequency of 1 MHz when a sheet having a content of 50% is produced is contained in the resin layer 13. If the distance from the metal body, which is an adherend, is kept above a certain level, the reading can be performed stably.

  As described above, the data carrier for sticking a metal body according to the present invention can be manufactured thinly and inexpensively even when a non-contact type IC tag is attached to a member made of a conductive material such as metal. It can be used effectively as a data carrier that is attached to the body.

10 Data carrier for attaching metal body 11 Base sheet 12 Non-contact data carrier element (IC inlet)
DESCRIPTION OF SYMBOLS 13 Resin layer 14 Spacer layer 22 IC chip 23 Circuit line 24, 25, 26, 27 Terminal part 28 Lead wire 29 Jumper line 30 Insulating layer 31 Release material

Claims (4)

A data carrier for attaching a metal body to a metal body as an adherend,
A base sheet;
An electronic circuit formed on the base sheet;
A resin layer containing magnetic powder laminated on the base material sheet and having a real part permeability μ ′ at a frequency of 1 MHz when a sheet having a content of 50% is created is 20 or more;
A spacer layer laminated on the resin layer;
Have
The metal body, wherein the content of the magnetic powder in the resin layer and the distance between the interface between the resin layer and the spacer layer and the surface of the metal body satisfy any of the following relationships: Data carrier for pasting.
The content of the magnetic powder in the resin layer is 70% by mass or more and 80 g / m ² or more, and the distance between the interface between the resin layer and the spacer layer and the surface of the metal body is 20 μm or more (1)
The content of the magnetic powder in the resin layer is 60% by mass or more and 50 g / m ² or more, and the distance between the interface between the resin layer and the spacer layer and the metal surface is 50 μm or more (2)
The content of the magnetic powder in the resin layer is 75% by mass or more and 130 g / m ² or more, and the distance between the interface between the resin layer and the spacer layer and the metal surface is 10 μm or more (3) In claim 1,
A data carrier for attaching metal, wherein the magnetic powder is an Fe-Al alloy. A data carrier attaching method for attaching a data carrier to a metal body as an adherend,
A data carrier obtained by laminating a resin sheet containing magnetic powder having a real part permeability μ ′ of 20 or more at a frequency of 1 MHz when a sheet having a content of 50% is formed on a base sheet having an electronic circuit formed on the surface The metal body so that the content of the magnetic powder in the resin layer and the distance between the interface between the resin layer and the spacer layer and the surface of the metal body satisfy any of the following relationships: A method for pasting a data carrier, characterized in that the data carrier is pasted.
The content of the magnetic powder in the resin layer is 70% by mass or more and 80 g / m ² or more, and the distance between the interface between the resin layer and the spacer layer and the surface of the metal body is 20 μm or more (1)
The content of the magnetic powder in the resin layer is 60% by mass or more and 50 g / m ² or more, and the distance between the interface between the resin layer and the spacer layer and the metal surface is 50 μm or more (2)
The content of the magnetic powder in the resin layer is 75% by mass or more and 130 g / m ² or more, and the distance between the interface between the resin layer and the spacer layer and the metal surface is 10 μm or more (3) A wireless communication method using a data carrier for attaching a metal when performing wireless communication with a data carrier attached to a metal body with a reader / writer,
The metal carrier for sticking a metal includes a resin layer containing a magnetic powder having a real part permeability μ ′ at a frequency of 1 MHz of 20 or more when a sheet having a content of 50% is formed on one surface of a base sheet. Laminated
The wireless communication characterized in that the content of the magnetic powder in the resin layer and the distance between the interface between the resin layer and the spacer layer and the surface of the metal body satisfy one of the following relationships: Method.
The content of the magnetic powder in the resin layer is 70% by mass or more and 80 g / m ² or more, and the distance between the interface between the resin layer and the spacer layer and the surface of the metal body is 20 μm or more (1)
The content of the magnetic powder in the resin layer is 60% by mass or more and 50 g / m ² or more, and the distance between the interface between the resin layer and the spacer layer and the metal surface is 50 μm or more (2)
The content of the magnetic powder in the resin layer is 75% by mass or more and 130 g / m ² or more, and the distance between the interface between the resin layer and the spacer layer and the metal surface is 10 μm or more (3)

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