JP2013210529A - Electrophoretic display device - Google Patents

Abstract

An electrophoretic display device manufacturing method that does not cause display unevenness or display failure.
When a display medium containing at least one kind of electrophoretic material is sealed between two opposing substrates, at least one of which is transparent, and a predetermined electric field is applied between the two substrates A method of manufacturing an electrophoretic display device in which the display medium displays predetermined information, a partition forming step of forming a partition in a predetermined pattern on one substrate, and each of the partitions partitioned by the partition In the other substrate bonding step, the method includes: a display medium arranging step of arranging the display medium with a region as a cell; and a second substrate bonding step of bonding the other substrate to a top surface of the partition wall of the one substrate. A hard roller is pressed from above the other substrate, and the other substrate is bonded to the other display medium while being pushed out.
[Selection] Figure 6

Description

  The present invention relates to an electrophoretic display device applied to electronic paper and the like.

  An electrophoretic display device is a device that displays information by using electrophoretic migration, ie, particle movement, of an electrophoretic body (usually electrophoretic particles) in air or in a solvent. In general, an electrophoretic state is controlled by applying an electric field between two substrates, thereby realizing a desired display.

  In recent years, the electrophoretic display device has attracted attention especially as an electronic paper. When applied as an electronic paper, it is possible to enjoy advantages such as visibility at the printed matter level (easy for eyes), ease of information rewriting, low power consumption, and light weight.

  However, in an electrophoretic display device, display defects, particularly a decrease in contrast, may occur due to particle sedimentation or uneven distribution. In order to prevent this phenomenon, it is employed to form partition walls between the upper and lower electrode substrates and divide the migration space of the electrophoretic particles, that is, the movement space into minute spaces. This minute space is called a cell or a pixel. In each cell, an ink (display medium) containing an electrophoretic material is enclosed. For example, Japanese Unexamined Patent Application Publication No. 2005-202245 discloses a conventional example of such an electrophoretic display device.

  Further, Patent Document 2 (Japanese Patent Laid-Open No. 2012-013790) by the applicant of the present application discloses a method in which an adhesive is applied only on the partition walls that partition the cells to ensure adhesion between the partition walls and the substrate. ing.

JP-A-2005-202245 JP 2012-013790 A

  The present inventor has obtained the following knowledge while earnestly researching the bonding state between the partition wall and the substrate.

  First, when the adhesion between the partition walls and the substrate is insufficient, the display medium moves between the cells when local pressure is applied from the outside, and so-called display unevenness (pressure marks) occurs. End up. Therefore, the bonding between the partition wall and the substrate needs to be performed to a desired level or more.

  In this connection, the present inventor, when an excessive amount of display medium is filled in the cell, pushes out the display medium to bring the display medium in the cell to an appropriate amount, and then adheres (seal). I found out that it was important. This is because if an excessive amount of display medium remains in the cell, adhesion between the partition walls and the substrate tends to be insufficient.

  However, on the other hand, even if the display medium in a certain cell is pushed too much and the amount of the display medium in the cell becomes uneven, display unevenness occurs. That is, it is important to extrude the display medium in the cell and make the display medium in the cell uniform to an appropriate amount.

  The present invention has been made based on such circumstances, and an object of the present invention is to provide a method of manufacturing an electrophoretic display device that does not cause display unevenness or display failure.

  In the present invention, when a display medium including at least one kind of electrophoretic body is sealed between two opposing substrates, at least one of which is transparent, and a predetermined electric field is applied between the two substrates. A method of manufacturing an electrophoretic display device in which the display medium displays predetermined information, a partition forming step of forming a partition in a predetermined pattern on one substrate, and each of the partitions partitioned by the partition In the other substrate bonding step, the method includes: a display medium arranging step of arranging the display medium with a region as a cell; and a second substrate bonding step of bonding the other substrate to a top surface of the partition wall of the one substrate. A method for manufacturing an electrophoretic display device, wherein a roller having a hardness of Shore D 80 degrees or more is pressed from above the other substrate to bond the other substrate.

  According to the present invention, when a roller having a hardness of Shore D 80 degrees or more is pressed from above the other substrate, the display medium in the cell is pushed out to have a uniform amount corresponding to the volume in the cell. Accordingly, the display medium in the cell becomes uniform in an appropriate amount, and display unevenness is prevented.

In addition, the JIS K 6253 durometer method was used for the measurement of Shore D in this specification.
The hardness of the roller is preferably as high as possible because the laminating pressure is dispersed and the display medium can be prevented from being excessively extruded by the pressure of the roller. Specifically, in the other substrate bonding step, it is preferable to use a roller having a hardness of Shore D 100 degrees or more.

  According to the present invention, when the hard roller is pressed from above the other substrate, the display medium in the cell is pushed out so as to have a uniform amount. Accordingly, the display medium in the cell becomes uniform in an appropriate amount, and display unevenness is prevented.

FIG. 1 is a flowchart schematically showing a method for manufacturing an electrophoretic display device according to an embodiment of the present invention. FIG. 2 is a diagram schematically showing an example of the partition wall forming step. FIG. 3 is a diagram schematically showing an example of the adhesive layer forming step. FIG. 4 is a diagram schematically showing an example of the display medium arranging step. FIG. 5 is a schematic view for explaining the function of the conductive paste. FIG. 6 is a diagram schematically showing an example of the other substrate bonding step.

  FIG. 1 is a flowchart schematically showing a method for manufacturing an electrophoretic display device according to an embodiment of the present invention. FIG. 2 is a diagram schematically showing an example of the partition wall forming step. As shown in FIG. 2, first, on the upper surface of one substrate 11 (backplane base material (BP)) generally placed in a horizontal direction, for example, photolithography (exposure by ultraviolet (UV) irradiation → development → development → The partition walls 12 having a predetermined pattern are formed by baking. The partition wall 12 is a member that defines lower surfaces and side surfaces of a plurality of cells to be described later. The thickness of the partition is 5 to 50 μm, preferably 8 to 30 μm. The cell size depends on the size of the display panel, but is 0.05 to 1 mm pitch, preferably 0.1 to 0.5 mm pitch.

  Next, an adhesive layer is formed on the partition wall 12 (adhesive layer forming step). FIG. 3 is a diagram schematically showing an example of the adhesive layer forming step. In the adhesive layer forming step shown in FIG. 3, first, a heat seal agent 22 (hereinafter also referred to as “adhesive layer”) is applied to a transfer film substrate 21 made of, for example, a polyethylene terephthalate (PET) film. A transfer film 20 is created. The heat sealing agent 22 is applied with a thickness of 1 to 100 μm. Preferably, it is applied with a thickness of 1 to 50 μm, particularly preferably with a thickness of 1 to 10 μm. As will be described later, the heat sealant 22 is made of a thermoplastic resin.

  Then, the surface of the transfer film 20 on the heat sealant side is placed on the partition wall 12, and the softening temperature is set while only the weight of the transfer film 20 is applied or while receiving a predetermined pressing force. It is heated to a temperature exceeding (heat bonding: thermal transfer). Thereafter, when the transfer film 20 is peeled off, the heat sealant 22 remains in a state of being thermally transferred onto the partition wall 12.

  In the present embodiment, the heat sealant 22 is thermally transferred to the entire top surface of the partition wall 12. The pressing force at the time of thermal transfer is preferably about 1 kPa, for example. When the pressing force is small, the transfer of the heat sealant from the transfer film is insufficient. On the other hand, if the pressing force is too large, the heat sealing agent may be crushed and enter the cell, or a heat sealing agent other than the partition wall pattern may be transferred. The heating temperature at the time of thermal transfer is preferably about 120 ° C.

  Returning to FIG. 1, after the adhesive layer (heat sealant) 22 is formed, the ink 13 as a display medium is disposed in each partition 12 or each region partitioned by the partition 12 and the adhesive layer 22 (display medium). Placement process). FIG. 4 is a diagram schematically showing an example of the display medium arranging step. Here, (1) the ink 13 is dropped from the dispenser 31 or the ink jet or die coat, (2) the ink 13 is applied by the central squeegee 32, the doctor blade, or the doctor knife so as to be in-plane uniform, and (3) Excess ink that protrudes is scraped off by the squeegees 33a and 33b at both ends, or by a doctor blade or doctor knife. (4) Finally, the excess ink collected on one side is wiped off by the wiper 34.

  Returning to FIG. 1, after the display medium arranging step, a conductive paste applying step is performed. FIG. 5 is a schematic view for explaining the function of the conductive paste. The conductive paste 14 is a metal paste such as a silver paste, and is applied to a predetermined position by, for example, a dispenser 41 or ink jet, tampo printing, pad printing, or stacking printing. As shown in FIG. 5, the conductive paste 14 functions as a wiring for applying a voltage to the other substrate 16 (front plane base material (FP)). When a predetermined electric field (voltage) is applied between the electrode pattern on one substrate 11 and the electrode pattern on the other substrate 16, the electrophoretic particles in the ink 13 which is a display medium are driven, and a predetermined pattern such as a character pattern is driven. Information is displayed. Thereafter, even if the electric field is no longer applied, the information display state is maintained until a new electric field is applied between the two substrates.

  Thereafter, the other substrate 16 facing the one substrate 11 is bonded onto the adhesive layer 22 on the partition wall 12 (the other substrate bonding step). Thereby, each upper surface of a some cell is prescribed | regulated and a display medium (ink 13) is sealed in each cell.

  In the other substrate bonding step, as shown in FIG. 6, the heat sealing agent 22 transferred as an adhesive layer is heated to obtain an adhesive force. Specifically, by applying a predetermined thermocompression bonding pressure, that is, a laminating pressure by the laminator 91, the heat sealant 22 is heated from the periphery to a temperature exceeding the softening temperature to be softened, whereby the partition wall 12 and the other of the partition walls 12 and the other. The substrate 16 is bonded.

  Here, in the present embodiment, a hard roller as the laminator 91 is pressed from above the other substrate 16, and the other substrate 16 is bonded onto the top surface of the partition wall 12 while the excess display medium is pushed out. The The hard roller is, for example, a roller having a hardness of Shore D 80 degrees or more. By using the hard roller as the laminator 91 in this way, the display medium (ink 13) in each cell is pushed out so as to have a uniform amount corresponding to the volume in the cell.

In the laminator 91, it is preferable that not only the upper roller but also the lower roller has a Shore D of 80 degrees or more, or the lower side is constituted by a stage. In the latter case, since the laminating pressure is dispersed, it is possible to prevent the display medium from being pushed out excessively by the pressure of the upper roller.
Further, in the present embodiment, after bonding by the laminator 91, a four-side thermocompression bonding process is performed in which the four sides (peripheral portions) of both the substrates 11 and 16 are further thermocompression bonded. Specifically, a hot plate 92 is laid under the four sides (peripheral parts) of both substrates 11 and 16, and the lamination pressure is applied to the four sides of both substrates 11 and 16 with metal pieces 93 from the inside to the outside. Will be implemented.

  Thereafter, as shown in FIG. 1, the sheet is cut into a predetermined size by a cutting device 51 such as a guillotine, an upper blade slide device, a laser cutting device, a laser cutter, etc., and further, an outer periphery sealing process is performed to obtain a desired electrical Manufacturing of the electrophoretic display device is completed.

  As described above, according to the present embodiment, by using the heat sealant 22 as an adhesive layer, the partition 12 for cell formation and the other substrate 16 are preferably bonded while being a simple process. it can. In addition, by using the transfer film 20 when the heat sealant 22 is thermally transferred, high-precision alignment on the partition wall 12 is unnecessary, and the heat seal agent 22 can be reliably thermally transferred only to the top surface of the partition wall 12.

  Further, when the heat sealant 22 thermally transferred as an adhesive layer is made of a thermoplastic material, the heat sealant 22 has no tack (stickiness) at room temperature, and is very convenient to handle. Further, since there is no tack (stickiness), the subsequent display medium arranging step is easy. Specifically, even when the display medium is arranged using a squeegee, a doctor blade, a doctor knife, or the like, the display medium (ink 13) does not adhere to the heat sealant 22.

  And according to this Embodiment, in the other board | substrate adhesion process (FIG. 6), when the hard roller as the laminator 91 is pressed from the upper side of the other board | substrate 16, the display medium (ink 13) in each cell is obtained. Extruded to a uniform amount that matches the volume in the cell. Accordingly, the display medium in each cell becomes uniform in an appropriate amount, and as a result, occurrence of display unevenness is prevented.

  Next, the materials and characteristics of each member of the electrophoretic display device as the manufacturing object of the present invention will be supplemented in more detail.

  As the substrate 11, a substrate in which an electrode is formed of a conductive material such as metal on the surface of a resin film, a resin plate, glass, epoxy glass (glass epoxy), ceramics, or the like can be used. Alternatively, a metal plate or a light transmissive substrate may be used. As an opaque base material, an opaque glass base material having a rough surface on the other surface different from the electrode surface, an opaque base material with a metal film deposited on the other surface different from the electrode surface, dyes and pigments An opaque resin base material kneaded with can be used.

  The thickness of one substrate 11 is preferably 10 μm to 2 mm. If it is thinner than 10 μm, the strength as a panel cannot be obtained and the risk of breakage increases. On the other hand, if it is thicker than 2 mm, the panel weight becomes too heavy and handling becomes inconvenient and the cost also increases. Because.

A suitable thickness range that is difficult to break and easy to handle is about 50 μm to 1000 μm.

  The surface of one substrate 11 may be subjected to an oxidation preventing process by a plating process. Further, a barrier layer may be provided on the back surface (outside) of one substrate 11. The function of the barrier layer is to prevent display deterioration caused by the ink adsorbing moisture. The barrier layer may be transparent on the upper substrate and transparent or opaque on the lower substrate, and can be obtained by depositing an inorganic film. Or the film in which the barrier layer was previously formed may be bonded together. The formation of the electrode pattern on one substrate 11 can be performed by a photolithography method, a laser drawing method, an ink jet method, a screen printing method, a flexographic printing method, or the like. A TFT substrate may be used as the one substrate 11.

  One substrate 11 can be applied in either a roll shape or a sheet shape.

  The partition wall 12 can be composed of an ultraviolet curable resin, a thermosetting resin, a room temperature curable resin, or the like, and is preferably formed to a thickness of 5 to 50 μm as described above. If the thickness is 5 μm or less, the amount of ink to be filled is small and sufficient display characteristics, in particular, contrast cannot be obtained. On the other hand, if the thickness is 100 μm or more, the panel is too thick and the drive voltage increases excessively. From the viewpoint that good display characteristics can be obtained at a low driving voltage, a thickness in the range of 10 to 50 μm is preferable.

  The pattern shape of the partition wall 12 is basically arbitrary such as a circle, a lattice, or a polygon. The aperture ratio is preferably 70% or more, and particularly preferably 90% or more. The higher the aperture ratio, the wider the displayable area, so that high contrast can be obtained.

  As a method for forming the partition wall 12, a mold transfer method such as embossing as well as a photolithography method may be employed. Furthermore, a method of manufacturing a mesh-processed structure as a partition and sticking the structure to one substrate 11 may be employed.

  The heat sealant 22 is preferably a material using a thermoplastic material, has a property of being softened by heating and solidifying upon cooling, and a material whose plasticity is reversibly maintained when cooling and heating are repeated. It is. When a heat sealant made of a thermoplastic material is used as the adhesive layer, the solidified heat sealant on the transfer film substrate is softened by heating it to a temperature exceeding its softening temperature, and the partition top The heat sealant can be reliably thermally transferred only to the surface. Further, since the heat sealant after the thermal transfer is cooled to room temperature and solidified again, tackiness (stickiness) is eliminated, and handling convenience is extremely good. Further, since there is no tack (stickiness), the display medium filled in the cell does not adhere to the heat sealant. Then, the heat sealing agent on the top surface of the partition wall is again heated to a temperature exceeding the softening temperature to be softened, and thus has a tack (stickiness), so that the other substrate is securely bonded. Since the heat sealant after bonding the other substrate does not have tack (stickiness) again at room temperature, the display medium is not bonded to the heat sealant, and there is no possibility of deterioration in display quality. Specifically, thermoplastic base polymers such as ethylene-vinyl acetate copolymer, polyester, polyamide, polyolefin, polyurethane, natural rubber, styrene-butadiene block copolymer, styrene-isoprene block copolymer, styrene-ethylene. A resin mainly composed of a thermoplastic elastomer such as a butylene-styrene block copolymer or a styrene-ethylene-propylene-styrene copolymer, and a tackifier resin or a plasticizer is mainly used.

  In order to increase the adhesion between the partition wall 12 and the heat sealant 22, the partition wall 12 may be subjected to a surface treatment by ultraviolet irradiation, plasma treatment, or the like, or a primer may be formed. Alternatively, a silane coupling agent may be added to the heat sealing agent 22.

  As the other substrate 16, a transparent film such as PE, PET, PES, PEN or the like provided with a transparent electrode such as ITO or ZnO can be typically used. The transparent electrode can be formed by a coating method, a vapor deposition method, or the like.

The thickness of the other substrate 16 is preferably 10 μm to 2 mm, similarly to the thickness of the one substrate 11. If it is thinner than 10 μm, the strength as a panel cannot be obtained and the risk of breakage increases. On the other hand, if it is thicker than 2 mm, the panel weight becomes too heavy and handling becomes inconvenient and the cost also increases. Because. A suitable thickness range that is difficult to break and easy to handle is about 50 μm to 500 μm. But the softness | flexibility thru | or thickness of the other board | substrate 16 in this invention needs to be a grade which the hardness of the roller as the laminator 91 is transmitted to the side of the partition 12 in the other board | substrate adhesion process. In such a case, the hard roller acts like a squeegee, and the display medium (ink 13) can be uniformly pushed out without the other substrate 16 undulating into the cell.
Further functional layers can be added to the other substrate 16. For example, a barrier film can be attached to the surface of the other substrate 16. Even if a transparent film in which a barrier layer of a transparent inorganic film is previously formed by vapor deposition or the like is employed as the other substrate 16, the same function as this can be exhibited. Alternatively, an ultraviolet cut film can be attached to the surface of the other substrate 16. Even if the other substrate 16 is subjected to other ultraviolet cut processing, the same function can be exhibited. As other surface coat layers, an AG layer (antiglare layer), an HC layer (scratch prevention layer), an AR layer (antireflection layer) and the like can be added.

  The other substrate 16 can be applied in either a roll shape or a sheet shape.

  The peripheral sealant can be constituted by a thermosetting resin, a room temperature curable resin, a heat seal resin, or the like in addition to the ultraviolet curable resin. They are applied to the periphery of both substrates 11, 16 by a dispenser, by various printing methods, or by thermocompression.

  Next, actual examples and comparative examples will be described.

<Example 1>
As one substrate 11, a non-alkali glass (OA-10G manufactured by Nippon Electric Glass Co., Ltd.) having a size of 150 mm × 150 mm × thickness 0.7 mm having a Cu electrode formed in a pattern was used. . The pattern formation of the Cu electrode was formed by a general etching method.

Next, a negative photosensitive resin material (DuPont MRC Dry Film Resistry Dry Film Resist) is laminated on the one substrate 11 to a thickness of 30 μm and heated at 100 ° C. for 1 minute. Then, exposure is performed using an exposure mask (exposure amount: 500 mJ / cm ² ), followed by development using a 1% KOH aqueous solution for 30 seconds, and baking at 200 ° C. for 60 minutes, so that the top surface line A grid-like partition wall 12 having a width of 10 μm, a cell pitch of 600 μm, and an aperture ratio of 90% was formed.

  A polyethylene terephthalate (PET) film (manufactured by Teijin DuPont) having a thickness of 50 μm is used as the transfer film substrate 21, and a heat sealant 22 (Byron UR1400 manufactured by Toyobo Co., Ltd.) having a thickness of 10 μm is applied by a die coater. And dried. Thus, a roll-shaped transfer film 20 having a 10 μm adhesive layer 22 was produced.

  Then, with the transfer film 20 placed on the upper surface of the partition wall 12, while further applying a pressing force of about 1 kPa, the periphery of the heat seal agent 22 is heated to a temperature exceeding its softening temperature, for example, about 120 ° C. As a result, the heat sealant 22 having a thickness of 5 μm was thermally transferred to the entire top surface of the partition wall 12. In this case, the thermal transfer rate is 5 μm / 10 μm = 50%.

  Subsequently, an ink 13 having the following components is used as a display medium, dropped from the dispenser 31, and squeezed with a central squeegee 32 (Neurong squeegee 1: made of urethane resin), and then in each cell. Filled. Excess ink that protruded in the substrate width direction was scraped off by another squeegee 33a, 33b (Nelogue Squeegee 2: made of urethane resin), and further wiped off by a roll wiper 34.

<Ink component>
・ Electrophoretic particles (titanium dioxide): 60 parts by weight ・ Dispersion liquid: 40 parts by weight Subsequently, silver paste (manufactured by Fujikura Kasei) is formed on a part of the outer periphery of the partition wall pattern (square area of 2 mm × 2 mm). Spot application was performed by the dispenser 41.

  Next, an indium tin oxide (ITO) vapor deposition film having a thickness of 0.2 μm is formed as a transparent electrode on the entire surface of one surface of a polyethylene terephthalate (PET) film (manufactured by Teijin DuPont) having a thickness of 100 μm as the other substrate 16. A provided substrate was prepared. The transparent electrode is formed by a general film formation method such as sputtering, vacuum evaporation, or CVD, and is also formed by zinc oxide (ZnO), tin oxide (SnO), etc. in addition to indium tin oxide (ITO). obtain.

  Then, in the atmosphere, the other substrate 16 is disposed on the adhesive layer 22 on the partition wall 12 of the one substrate 11, and the other substrate 16 is superposed and further applied with a certain thermocompression pressure by the laminator 91. The partition 12 of one substrate 11 and the other substrate 16 were brought into close contact with each other while extruding excess ink exceeding the inner cell volume (see FIG. 6). As the laminator 91, an ebonite rubber roller having a Shore D hardness of 80 degrees was used. The temperature during thermocompression bonding was 120 ° C. Moreover, the thermocompression bonding pressure was 0.1 MPa. The thermocompression bonding pressure is preferably 0.01 to 0.7 MPa, and particularly preferably 0.1 to 0.4 MPa.

Thereafter, the substrate is cut into a predetermined size, and a UV curable resin (LCB-610, manufactured by EACH Sea Co., Ltd.) is applied and sealed around both the substrates 11 and 16 using a dispenser (not shown). It was stopped and exposed to ultraviolet rays (exposure amount 700 mJ / cm ² ) and cured (peripheral sealing treatment). Thus, a display panel was produced.

  The display panel obtained as described above was set in a substantially horizontal state and the display contrast was evaluated. The display panel was uniform and extremely good. As a result of observing pixels from the other substrate (front plane base material) side with a microscope, one substrate (back plane base material) side was not visible. Since the ink filling amount was sufficient and the shielding property was high, the contrast was good.

<Example 2>
In contrast to Example 1, a metal rubber roller having a Shore D hardness of 100 degrees was used as the laminator 91 instead of an ebonite rubber roller having a Shore D hardness of 80 degrees. The other steps were the same process to produce a display panel.

  The display panel obtained as described above was set in a substantially horizontal state and the display contrast was evaluated. The display panel was uniform and extremely good. As a result of observing pixels from the other substrate (front plane base material) side with a microscope, one substrate (back plane base material) side was not visible. Since the ink filling amount was sufficient and the shielding property was high, the contrast was good.

<Comparative example>
In contrast to Example 1, as the laminator 91, a urethane rubber roller having a Shore D hardness of 60 degrees was used instead of an ebonite rubber roller having a Shore D hardness of 80 degrees. The other steps were the same process to produce a display panel.

  The display panel obtained as described above was set in a substantially horizontal state and the display contrast was evaluated. However, the display panel was inferior to the display panels of Example 1 and Example 2. As a result of observing the pixels from the other substrate (front plane base material) side with a microscope, one substrate (back plane base material) side was seen through. The ink filling amount was small and sufficient contrast could not be obtained.

11 One substrate (backplane base material)
12 Partition 13 Ink (display medium)
16 Other board (front plane base material)
20 Transfer film 21 Transfer film substrate 22 Heat seal agent (adhesive layer)
31 Dispenser 32 Central Squeegee (Squeegee 1)
33a, 33b Both-end squeegee (squeegee 2)
34 Roll wiper 41 Dispenser 51 Cutting device 91 Laminator 92 Hot plate 93 Metal piece

Claims (2)

A display medium including at least one kind of electrophoretic body is sealed between two opposing substrates, at least one of which is transparent, and the display medium is applied when a predetermined electric field is applied between the two substrates. Is a method of manufacturing an electrophoretic display device that displays predetermined information,
A partition formation step of forming a partition in a predetermined pattern on one substrate;
A display medium disposing step of disposing the display medium with each region partitioned by the partition as a cell,
The other substrate bonding step of bonding the other substrate to the top surface of the partition wall of the one substrate;
With
A method of manufacturing an electrophoretic display device, wherein, in the other substrate bonding step, a roller having a hardness of Shore D80 or higher is pressed from above the other substrate to bond the other substrate. The method of manufacturing an electrophoretic display device according to claim 1, wherein a roller having a hardness of Shore D 100 degrees or more is used in the other substrate bonding step.

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