JP2013207218A - Wiring board assembly, semiconductor device, solar cell module, and connection member - Google Patents

Abstract

In a wiring board assembly, electrodes can be satisfactorily connected to each other even when the distance between electrodes provided on wiring boards arranged opposite to each other is large.
A wiring board 100A having an electrode 2A, a wiring board 100B arranged opposite to the wiring board 100A, and arranged between the electrodes 2A and 2B to electrically connect the electrodes 2A and 2B. A wiring board assembly 110 including a connecting portion 10 connected to the metal layer 4 that forms the surface on the electrode 2A side and the surface on the electrode 2B side, and the electrode 2A side of the metal layer 4 A conductive resin layer 3A that connects the surface and the electrode 2A, a surface of the metal layer 4 on the electrode 2B side, and a conductive resin layer 3B that connects the electrode 2B are provided.
[Selection] Figure 1

Description

  The present invention relates to a wiring board assembly, a semiconductor device, a solar cell module, and a connection member.

Conventionally, electricity generated in solar cells is concentrated through a bus bar stretched around the surface (see Patent Document 1). However, since this bus bar covers and hides part of the surface of the solar battery cell, there is a problem that the power generation efficiency is lowered.
In order to solve this problem, for example, Patent Document 2 proposes a back contact solar cell in which both the positive electrode and the negative electrode of the solar cell are installed on the back surface of the cell. Solar cells of this system can be connected on the back surface of the cell and can prevent a decrease in power generation efficiency without covering the cell surface.
In such a solar cell module, a laminated body in which a metal foil having a wiring pattern is attached to the back surface of a solar cell is used as an alternative circuit for a bus bar, and these metals are generally used from the viewpoint of their conductivity. Copper is used.
However, since copper is expensive, it has also been proposed to use aluminum which is cheaper than copper for wiring.
However, when joining solar cells and wiring, silver paste is conventionally used, and the resistance value becomes larger than copper due to the oxide film generated on the surface by using aluminum. Since the potential difference between the aluminum and silver electrochemical columns is very large, there is a problem that the aluminum corrodes and is insulated in the worst case.
Moreover, even if this is solved, enormous cost of using more expensive silver is required.
As a method for solving these problems, a method has been proposed in which solar cells and wiring are connected using a conductive material containing metal particles (see Patent Document 3).

JP 2005-011869 A JP 2009-111122 A JP 2009-302327 A

However, the prior art as described above has the following problems.
In the technique described in Patent Document 3, since the back contact solar cells are connected using a conductive material containing metal particles, it is easy to electrically connect even an aluminum wiring. However, the connection using such a conductive material has a problem that it is necessary to reduce the distance between the circuit board and the solar battery cell.
Therefore, for example, when it is necessary to increase the distance between the electrodes between the solar battery cell and the circuit board by using an arrangement such as a solder resist provided on the surface of the circuit board of the back contact type solar battery module. However, there is a problem that it cannot respond.

  The present invention has been made in view of the above-described problems, and even when the interelectrode distance between the electrodes provided on the wiring boards arranged opposite to each other is large, the electrodes can be satisfactorily connected to each other. An object of the present invention is to provide a wiring board assembly, a semiconductor device, a solar cell module, and a connecting member.

  In order to solve the above-mentioned problem, in the invention according to claim 1, a first wiring substrate having a first electrode, a second electrode disposed to face the first wiring substrate, and A wiring board comprising: a second wiring board; and a connection part that is disposed between the first electrode and the second electrode and electrically connects the first electrode and the second electrode. In the assembly, the connection portion includes a connection portion main body in which a surface on the first electrode side and a surface on the second electrode side are formed of a metal layer, and the first electrode of the connection portion main body. A first conductive resin layer that connects the surface on the side, the first electrode, a surface on the second electrode side of the connection portion body, and a second electrode that connects the second electrode. And a conductive resin layer.

  According to a second aspect of the present invention, in the wiring board assembly according to the first aspect, the metal layer is made of aluminum or an aluminum alloy.

  According to a third aspect of the present invention, in the wiring board assembly according to the first or second aspect, the connection portion main body includes a metal layer that forms a surface on the first electrode side, and the second electrode side. And two or more metal layers including a metal layer that forms the surface of each other are laminated via a third conductive resin layer.

  According to a fourth aspect of the present invention, in the wiring board assembly according to any one of the first to third aspects, the connecting portion main body has an outer shape in a direction orthogonal to a connecting direction, and the first electrode and The configuration is smaller than any outer shape of the second electrode.

  According to a fifth aspect of the present invention, in the wiring board assembly according to any one of the first to fourth aspects, at least one of the first electrode and the second electrode is formed of an aluminum foil. The configuration is as follows.

  In a sixth aspect of the present invention, the semiconductor device includes the wiring board assembly according to any one of the first to fifth aspects, and at least one of the first wiring board and the second wiring board. Is a semiconductor element.

According to a seventh aspect of the present invention, a solar cell module includes the wiring board assembly according to any one of the first to fifth aspects, wherein at least one of the first wiring board and the second wiring board. One side is configured to be a solar battery cell.
The method.

  According to an eighth aspect of the present invention, a first wiring board having a first electrode, a second wiring board having a second electrode disposed opposite to the first wiring board, and the first electrode A connection member for electrically connecting one electrode and the second electrode, wherein one or more metal layers and one or more conductive resin layers are alternately stacked and connected, The conductive resin is arranged on at least one end side in the direction.

  According to the wiring board assembly, the semiconductor device, the solar cell module, and the connecting member of the present invention, since the connecting portion has the connecting portion main body including the metal layer, the electrodes provided respectively on the facing wiring substrates Even when the distance between the electrodes is large, there is an effect that the electrodes can be well connected.

It is typical sectional drawing which shows the structure of the wiring board assembly of the 1st Embodiment of this invention and a 1st modification. It is typical sectional drawing which shows the structure of the connection member of the 1st Embodiment of this invention and a 1st modification. It is a schematic diagram explaining the effect | action of the wiring board assembly of the 1st Embodiment of this invention. It is a schematic diagram of the comparative example for demonstrating the effect | action of the wiring board assembly of the 1st Embodiment of this invention. It is a schematic diagram explaining the effect | action at the time of the deformation | transformation of the wiring board assembly of the 1st Embodiment of this invention. It is typical sectional drawing which shows the structure of the wiring board assembly of the 2nd modification of the 1st Embodiment of this invention. It is typical sectional drawing which shows the structure of the solar cell module of the 2nd Embodiment of this invention.

  Embodiments of the present invention will be described below with reference to the accompanying drawings. In all the drawings, even if the embodiments are different, the same or corresponding members are denoted by the same reference numerals, and common description is omitted.

[First Embodiment]
A wiring board assembly according to a first embodiment of the present invention will be described.
FIG. 1A is a schematic cross-sectional view showing the configuration of the wiring board assembly according to the first embodiment of the present invention. 2A and 2B are schematic cross-sectional views showing the configuration of the connecting member according to the first embodiment of the present invention. In addition, since each drawing is a schematic diagram, the shape and dimensions are exaggerated so as to be easy to see (the same applies to the following drawings).

As shown in FIG. 1A, a wiring board assembly 110 of the present embodiment includes a wiring board 100A (first wiring board), a connection unit 10, and a wiring board 100B (second wiring board). The wiring boards 100 </ b> A and 100 </ b> B that are provided and stacked so as to face each other are electrically connected via the connection unit 10. Note that a configuration in which a sealing material or the like is filled between the wiring boards 100A and 100B as necessary is also possible.
Hereinafter, the facing direction of the wiring boards 100A and 100B is referred to as a connection direction. Further, in order to avoid repetition of sentences, in the sentences having the same description for other codes, the corresponding other codes are written in parentheses.

The wiring board 100A (100B) is a member in which circuits and wirings (not shown) are formed on the insulating substrate 1A (1B). Although not shown in the drawings, these circuits and wirings may be electrically connected with appropriate semiconductor elements, semiconductor devices, electrical components, electronic components, connectors, and the like as necessary. Further, the wiring substrate 100A (100B) may be simply a configuration of the substrate, or may be a substrate portion constituting a part of the semiconductor device, for example.
On the surface portion on the side facing the wiring boards 100A and 100B, an electrode 2A (first electrode) and an electrode 2B (second electrode) are electrically connected to a connecting portion 10 described later. One or more pairs are provided so as to face each other.
Since FIG. 1A is a schematic diagram, two electrodes 2A (2B) are drawn, but the number of electrodes 2A (2B) is an appropriate number necessary for electrical connection with the wiring board 100B (100A) of the connection partner. Is provided.

The electrode 2A (2B) is electrically connected to a circuit and wiring not shown in the wiring board 100A (100B).
The shape of the electrode 2A (2B) in plan view can be an appropriate shape, for example, a circle, an ellipse, a rectangle, or a polygon. The size of the electrode 2A is, for example, the width w _2A (w _2B ) in the cross section shown in FIG. In the present embodiment, a circle is adopted as an example of the shape of the electrode 2A (2B).
The material of the electrode 2A (2B) can be, for example, copper or aluminum, but is not limited thereto, and an appropriate metal or alloy having good conductivity can be used.

  FIG. 1A is a schematic diagram, and an example in which the electrode 2A (2B) protrudes from the substrate 1A (1B) is illustrated, but the outer edge portion of the electrode 2A (2B) is appropriately It is good also as a structure coat | covered with insulating materials (For example, the below-mentioned solder resist 5 etc. in FIG. 3). In this case, the shape and size of the electrode 2A (2B) described above correspond to an exposed portion from an insulating material that can function as a connection electrode.

  The connecting portion 10 is formed in order from the electrode 2A side along the connecting direction, the conductive resin layer 3A (first conductive resin layer), the metal layer 4 (connecting portion main body), and the conductive resin layer 3B (second The conductive resin layer) is laminated.

The conductive resin layer 3A connects the surface of the metal layer 4 on the electrode 2A side and the electrode 2A, and a conductive adhesive or a conductive adhesive film used for element mounting can be used.
As an example of the conductive resin layer 3A, there may be mentioned a configuration in which conductive particles are contained in a thermosetting resin such as urethane, acrylic, epoxy, polyimide, olefin, or a curable adhesive obtained by copolymerizing these. it can.
Examples of the conductive particles include copper particles, zinc particles, silver particles, gold particles, nickel particles, or particles obtained by performing metal plating similar to these on the surface of polymer particles.
In order to reduce the cost of the conductive resin layer 3A, it is desirable to contain inexpensive zinc particles, nickel particles, or both.
In particular, when the conductive resin layer 3A contains silver particles, zinc particles, and nickel particles, the respective rigidity is high. For example, when pressed against aluminum or copper, oxide films formed on these surfaces Is broken through. For this reason, even if an oxide film is formed, electrical connection can be easily made.

As the shape of the conductive resin layer 3 </ b> A in plan view, a shape covering the surface of the metal layer 4 or a shape covering the surface of the electrode 2 </ b> A can be adopted as necessary in the manufacturing process.
In the example shown in FIG. 1A, as an example, the surface of the metal layer 4 is covered and drawn in a shape that matches the outer shape of the metal layer 4. It is an example in the case of being formed.
On the other hand, it is good also as a shape which covers the surface of electrode 2A and corresponds to the external shape of electrode 2A (refer FIG. 3). This is a preferable form when the conductive resin layer 3A is first formed on the electrode 2A at the time of manufacture.
The thickness t _3A of the conductive resin layer 3A is set to a thickness that allows good electrical connection to the electrode 2A and the metal layer 4. The thickness suitable for such electrical connection is roughly determined by the particle size of the conductive particles contained. That is, when the particle size of the conductive particles containing the thickness of the conductive resin layer 3A is larger than the conductive particles, the conductive particles are not in contact with both the surfaces of the metal layer 4 and the electrode 2A. I can't get it.
For this reason, there is very little freedom to change the thickness of the connecting portion 10 in the stacking direction by changing the thickness of the conductive resin layer 3A. For example, the possible thickness of the conductive resin layer 3A is about 1 μm to 10 μm.

The metal layer 4 has an outer shape in a direction orthogonal to the connection direction (vertical direction in FIG. 1A) smaller than the outer shape of the electrodes 2A and 2B in plan view.
That is, in the metal layer 4, the width w ₄ in the direction orthogonal to the connection direction is the same not only in the cross section shown in FIG. 1A but also in any cross section passing through the center of the metal layer 4 along the connection direction. It is smaller than the width w _2A (w _2B ) of the cross-sectional electrode 2A (2B).
This is because if the metal layer 4 has a width larger than the width of the electrode 2A (2B), the material of the portion that is not connected is wasted. Further, if the width of the metal layer 4 is made smaller than the width of the electrode 2A (2B), even if a positional shift occurs at the time of connection, it is possible to short-circuit with other adjacent electrodes that protrude from the electrodes 2A and 2B. This is also because the property can be reduced.
For this reason, the shape and size of the outer shape in the direction orthogonal to the connection direction of the metal layer 4 are the shape and size of the electrode 2A (2B) and the size of the positional deviation in the direction orthogonal to the connection direction that may occur during connection. It is decided in advance according to.
In the present embodiment, as an example, a disk-shaped member having a diameter w ₄ (where w ₄ <w _2A ) is used in correspondence with the electrode 2A having a circular shape having a diameter w _2A . As will be described later, there is also a relationship of w ₄ <w _2B corresponding to the electrode 2B having a circular shape with a diameter w _2B .
However, for example, when there is no possibility of contacting an adjacent electrode, w ₄ ≦ w _2A or w ₄ ≦ w _2B may be set.

The metal layer 4 can be formed by cutting a metal foil sheet or a plate material. When the required thickness cannot be obtained with the ready-made member, the thickness may be adjusted by cutting, rolling, or forming a film on the ready-made member.
Further, the thickness may be adjusted by joining a plurality of pieces by soldering or the like.
Further, a sheet material having a necessary thickness may be formed by film formation.
Since the metal layer 4 is comprised only of a metal or an alloy, even if it increases thickness, electroconductivity does not deteriorate.
Thus, the thickness of the metal layer 4 is not particularly limited and can be easily changed.

The material of the metal layer 4 is not particularly limited as long as it is a metal or an alloy that can obtain conductivity. For example, a metal selected from gold, silver, copper, aluminum, iron, or the like, or an alloy containing these as a main component Can be adopted. However, it is more preferable to use copper, aluminum, or an aluminum alloy from the viewpoint of low cost and conductivity.
In the present embodiment, as an example, it employs an aluminum foil having a thickness of t _4.

The conductive resin layer 3B connects the surface of the metal layer 4 on the electrode 2B side and the electrode 2B. Similarly to the conductive resin layer 3A, the conductive resin layer 3B is a conductive adhesive or conductive material used for element mounting. An adhesive film can be used. That is, a material suitable for the conductive resin layer 3A exemplified above can also be used for the conductive resin layer 3B.
The materials of the conductive resin layers 3A and 3B may be the same, but considering the ease of electrical connection with the electrodes 2A and 2B, durability, etc., as long as the electrical connection performance with the metal layer 4 is not impaired. Different materials may be used.
For example, when the materials of the electrodes 2A and 2B are different, or when the temperature conditions of the connection portions with the electrodes 2A and 2B are different, the materials of the conductive resin layers 3A and 3B depending on the conditions of the connection portions. Can be changed.

The shape of the conductive resin layer 3B in a plan view can be a shape that allows good electrical connection to the connection partner electrode 2B and the metal layer 4, and is different from the conductive resin layer 3A. Also good. In the present embodiment, as an example, as shown in FIG. 1A, the outer shape of the metal layer 4 in the connection portion with the metal layer 4 is matched. However, it is the same as that of the conductive resin layer 3A that the shape may coincide with the outer shape of the electrode 2B.
The thickness t _3B of the conductive resin layer 3B is set to a thickness that allows good electrical connection to the electrode 2B and the metal layer 4.

In the wiring board assembly 110 having such a configuration, after manufacturing the wiring boards 100A and 100B, appropriate connecting members are arranged on the electrodes 2A of the wiring board 100A, and the connecting members are connected to the electrodes 2B of the wiring board 100B. And can be manufactured by pressing in the connecting direction.
As an example of the connection member of the present embodiment, as shown in FIG. 2A, a connection member 14, a metal layer 4 and a conductive resin layer 3A in which a metal layer 4 and a conductive resin layer 3B are laminated in advance are provided in advance. As shown in FIG. 2B, the connection member 15 laminated, or the connection member in which the conductive resin layer 3A, the metal layer 4, and the conductive resin layer 3B are laminated in this order in the same manner as the connection portion 10. 16 can be adopted.
The connection members 14, 15, and 16 can be manufactured by, for example, a method in which a film-like conductive resin is bonded to the metal layer 4 by roll lamination. Also, for example, a method of laminating a liquid conductive resin by a method such as applying by screen printing or the like, and then punching it into a required shape using a punch device, or cutting it out using a cutting machine Can be manufactured.

For example, in order to manufacture the wiring board assembly 110 using the connection member 14 (15), the conductive resin layer 3B (3A) of the connection member 14 (15) is attached to each electrode 2B of the wiring board 100B (100A). Affix to (2A).
Further, the conductive resin layer 3A (3B) is applied on each electrode 2A (2B) of the wiring board 100A (100B).
Next, the wiring board 100B (100A) to which the connection member 14 (15) is attached is opposed to the electrode 2A (2B) side of the wiring board 100A (100B), and the connection member 14 (15) is sandwiched between the wiring board 100B (100A) in the opposite direction. Press in a certain connection direction.
As a result, the conductive particles contained in the conductive resin layers 3A and 3B are pressed against the surfaces of the electrodes 2A and 2B and the metal layer 4 at the contact portions with the electrodes 2A and 2B and the metal layer 4, respectively. 2B and penetrate through the surface of the metal layer 4 and penetrate into the inside.
As a result, even when a non-conductive layer film such as an oxide film is formed on the surfaces of the electrodes 2A and 2B and the metal layer 4, a portion having a conductivity under the layer film by breaking through such a layer film A conductive portion is formed in contact with
In addition, the electrode 2A and the metal layer 4, and the metal layer 4 and the electrode 2B are joined by the adhesive force of the conductive resin layers 3A and 3B.
In this way, the wiring board assembly 110 can be manufactured.

In order to manufacture the wiring board assembly 110 using the connection member 16, the conductive resin layer 3B (3A) of the connection member 16 is attached to the wiring board 100B (100A), and then the connection member 16 is attached. The attached wiring board 100B (100A) is replaced with the wiring board 100A (100B).
And facing the electrode 2A (2B) side, the connecting member 16 is sandwiched and pressed in the connecting direction.
In this way, the wiring board assembly 110 can be manufactured.

  In addition, the wiring board assembly 110 applies the conductive resin layers 3A and 3B to the electrodes 2A and 2B of the wiring boards 100A and 100B, respectively, places the metal layer 4 in contact with each other, and then contacts the conductive layers. It is also possible to manufacture by sandwiching the metal layer 4 between the conductive resin layers 3A and 3B and pressing in the connecting direction.

In each manufacturing method described above, in this embodiment, the outer shape in the direction orthogonal to the connection direction of the metal layer 4 is smaller than the outer shape of the electrodes 2A and 2B in plan view.
For this reason, when the metal layer 4 and the electrode 2A (2B) are bonded together, the positional deviation in the direction orthogonal to the connection direction between the metal layer 4 and the electrode 2A (2B) is changed to the outer shape of the metal layer 4 and the electrode 2A. By staying within the range of the difference from the outer shape of (2B), bonding can be performed so that the metal layer 4 does not protrude from the electrode 2A (2B).
Therefore, it is possible to prevent the metal layer 4 from protruding and shorting with the other adjacent electrode 2A (2B).

According to the wiring board assembly 110 of the present embodiment, the connecting portion 10, by using the metal layer 4 made of an aluminum foil having a thickness of t _4, the electrodes 2A, the inter-electrode distance between 2B, the h ₁₀ ing. That is, the inter-electrode distance _{h 10,} the conductive resin layer 3A, 3B, the thicknesses _t 3A of the metal layer _4, t 3B, the sum of _{t 4.}
Therefore, by changing the thickness t ₄ of the metal layer 4 can be varied as required size of the inter-electrode distance h _10.
At this time, since it is not necessary to change the thickness of the conductive resin layers 3A and 3B, the conductivity between the electrode 2A and the metal layer 4a and the conductivity between the electrode 2B and the metal layer 4 are not changed. . Further, since the metal layer 4 is the unchanged conductivity even by changing the thickness, oppositely disposed wiring board 100A, the electrode 2A respectively provided 100B, depending on the size of the inter-electrode distance h ₁₀ of 2B The electrodes 2A and 2B can be connected well.

The size of the required interelectrode distance h ₁₀ also varies depending on the type of device that the wiring board assembly 110 constitutes. For example, when used in a device such as a solar cell module, the wiring board assembly 110 can be modified as the wiring board assembly 112 shown in FIG.
The wiring board assembly 112 is, for example, that the surface of the wiring board 100A excluding the region on the electrode 2A necessary for electrical connection is painted black with the solder resist 5 for design and the like. 110 and different.
In this case, assuming that the thickness of the solder resist 5 is h ₅ , the thickness h ₅ is larger than the thickness of the electrode 2 </ b> A, so that the electrode 2 </ b> A is disposed deeper than the surface of the solder resist 5. Accordingly, the depth _{h 7 (although,} h 7 _{<h 5)} between the electrode 2A and the solder resist 5 of the surface recessed hole portions 7 having is formed.

At this time, according to the present embodiment, since the thickness of the metal layer 4 can be set appropriately so that h ₁₀ > h ₇ , the surface between the surface of the solder resist 5 and the electrode 2B (h ₁₀ -h ₇₎ can only form a gap. The gap (h ₁₀ -h ₇ ) is always a positive value in consideration of variations in the thickness of the solder resist 5.
Thereby, even when the soldering resist 5 is provided on the board | substrate 1A, the electrodes 2A and 2B can be connected favorably.

On the other hand, as in the comparative example shown in FIG. 4, when the electrode 2B of the wiring substrate 100B is connected to the electrode 2A only by the conductive resin layer 6, the thickness t6 of the conductive resin layer ₆ is If thinner than the depth h ₇ of the recessed hole portions 7, the size of the gap (h 7 _{-t 6)} between the conductive resin layer 6 and the electrode 2A remains. For this reason, the electrodes 2A and 2B cannot be connected, and mounting becomes impossible.

As in the wiring board assembly 112, if the recessed hole portions 7 on the electrode 2A is formed, as in this embodiment, as compared with the electrodes 2A diameter (width) w _2A metal layer 4 diameter By making (width) w ₄ smaller, it becomes easier to insert the metal layer 4 into the recessed hole portion 7 when the metal layer 4 and the electrode 2A are bonded together, and the metal layer 4 becomes the recessed hole portion 7. It is possible to suppress the possibility of the occurrence of bonding failure due to overhanging.

[First Modification]
Next, a wiring board assembly and a connection member according to a first modification of the present embodiment will be described.
FIG.1 (b) is typical sectional drawing which shows the structure of the wiring board assembly of the 1st modification of the 1st Embodiment of this invention. FIGS. 2C and 2D are schematic cross-sectional views showing the configuration of the connection member of the first modified example of the first embodiment of the present invention.

As shown in FIG. 1B, a wiring board assembly 111 according to the present modification includes a connecting portion 11 instead of the connecting portion 10 of the wiring board assembly 110 according to the first embodiment.
Hereinafter, a description will be given centering on differences from the first embodiment.

The connection part 11 is replaced with the metal layer 4 of the connection part 10 of the first embodiment, in order from the conductive resin layer 3A side, the metal layer 4a, the conductive resin layer 3C (third conductive resin layer). , And a connecting portion main body 13 in which the metal layer 4b is laminated.
Therefore, the surface on the conductive resin layer 3A side of the connection portion main body 13 is formed by the metal layer 4a, and the surface on the conductive resin layer 3B side of the connection portion main body 13 is formed by the metal layer 4b.

The shape and material of the metal layers 4a and 4b can be the same shape and material as the shape and material suitable for the metal layer 4 in the first embodiment. That is, the metal layers 4 a and 4 b may have the same shape and material as the metal layer 4 in the first embodiment, or may have a shape and material different from the metal layer 4.
For example, when the metal layers 4a and 4b are formed in a circular disk shape in plan view, like the metal layer 4, the diameters w _4a and w _4b and the thicknesses t _4a and t _4b are w ₄ , It may be t ₄ the same or different dimensions. Moreover, it is possible to make the shape and material of each other the same or change between the metal layers 4a and 4b.
When changing the shape and material of each other, for example, the metal layer 4a depends on the shape and material of the conductive resin layer 3A and the electrode 2A, and the metal layer 4b depends on the shape and material of the conductive resin layer 3B and the electrode 2B. These can be changed to suitable shapes and materials.

The conductive resin layer 3C electrically connects the metal layers 4a and 4b, and an appropriate conductive adhesive or conductive adhesive film can be used depending on the material of the metal layers 4a and 4b. For example, it can be selected from the materials listed as materials suitable for the conductive resin layers 3A and 3B in the first embodiment. The thickness t _3C of the conductive resin layer 3C is preferably about the same as the thickness of the conductive resin layers 3A and 3B.

The wiring board assembly 111 having such a configuration is manufactured in the same manner as in the first embodiment by the connection members 17 and 18 shown in FIG. 2C or the connection member 19 shown in FIG. can do.
Here, the connection members 17 and 18 are provided with the connection part main body 13 instead of the metal layer 4 of the connection members 14 and 15 of the first embodiment. Moreover, the connection member 19 is provided with the connection part main body 13 instead of the metal layer 4 of the connection member 16 of the first embodiment.

As described above, in the wiring board assembly 111 of this modification, the connection portion 11 in which the metal layer 4a, the conductive resin layer 3C, and the metal layer 4b are stacked is connected to the conductive resin layer 3A and the conductive resin layer 3B. Since they are electrically connected, the electrodes 2A and 2B are electrically connected as in the first embodiment.
At that time, the inter-electrode distance _{h 11,} the conductive resin layer 3A, 3B, the connecting portion is a sum of the thickness of the body 13, changes in thickness easy metal layers 4a, 4b of the thickness _{t 4a,} by changing at least one of t _4b, the inter-electrode distance h ₁₁ can be easily changed.
Further, in the wiring board assembly 111 of this modification, as an example, the case where the metal layer of the connecting portion 11 has two layers has been described, but three or more metal layers are stacked via the conductive resin layer 3C. May be. Thus, the interelectrode distance can be changed by changing the number of metal layers.

Moreover, when the metal layers 4a and 4b are laminated via the conductive resin layer 3C as in the connection portion 11 of the present modification, the conductive resin layer between the metal layers 4a and 4b when receiving external force. Since 3C is easily deformed, the rigidity of the connecting portion 11 can be reduced as a whole.
For this reason, compared with the case where the connection part of the same thickness is comprised with the single metal layer 4 like the said 1st Embodiment, the connection part 11 richer in flexibility can be comprised. As a result, the wiring board assembly 111 can be given flexibility. Further, durability when the wiring board assembly 111 is bent can be improved.
Such flexibility increases as the number of metal layers stacked increases.

For example, when there is a large difference in the thermal expansion coefficient between the wiring boards 100A and 100B, when the deformation is caused by the temperature rise, the relative deformation amount between the wiring boards 100A and 100B is greatly different. , 100B may cause insulation.
In this modification, the deformation is dispersed by each of the conductive resin layers 3A, 3B, and 3C in this modification, so that the connection portion 11 as a whole absorbs the relative deformation amount between the wiring boards 100A and 100B. This is because it becomes possible to follow this relative deformation.

For example, as shown in FIG. 5A, conductive particles 8 are dispersed in the conductive resin layers 3A, 3B, and 3C (hereinafter referred to as the conductive resin layer 3A and the like). 8 is contained at an appropriate interval. Each conductive particle 8 is in contact with the electrode 2A, the metal layers 4a and 4b, and the electrode 2B adjacent to the conductive resin layer 3A and the like, respectively.
Accordingly, when an external force is applied to the wiring board assembly 111, the conductive resin layer 3A or the like where the conductive particles 8 are not present can be deformed following the external force according to the rigidity of the resin. is there. Thereby, the stress by external force is relieved.
Further, in a portion where the conductive particles 8 are present, external force is transmitted through the conductive particles 8 having higher rigidity than the conductive resin layer 3A and the like. At this time, on the back surface side of the conductive particles 8, the other conductive particles 8 are hardly present at the same position, and the other conductive resin layer 3A and the like are positioned. For this reason, as shown in FIG. 5 (b), the metal layers 4a and 4b in contact with the conductive particles 8 are deformed toward the conductive resin layer 3A on the back surface side to form the conductive particles 8. It is possible to follow (see the deformed portion 9 in FIG. 5B).
As described above, the wiring board assembly 111 can have followability in deformation when subjected to an external force, and can have flexibility.

In addition, although the effect | action regarding such a deformation | transformation becomes so remarkable that the laminated structure of a conductive resin, a metal layer, and a conductive resin layer becomes multilayer like this modification, it understands also from the above description. It is obtained because the conductive resin layer is located on the back surface of the metal layer in contact with the conductive particles 8. For this reason, if there is at least two conductive resin layers sandwiching the metal layer, such an effect can be obtained.
Therefore, even in the configuration of the connecting portion 10 of the first embodiment, the followability to external force is increased and the flexibility is improved compared to the case where the electrodes are connected by, for example, soldering or silver paste. is there.

[Second Modification]
Next, a wiring board assembly according to a second modification of the present embodiment will be described.
FIG. 6 is a schematic cross-sectional view showing a configuration of a wiring board assembly of a second modified example of the first embodiment of the present invention.

The wiring board assembly 113 of this modification is a multilayer wiring board having three or more layers in which other wiring boards are arranged between the wiring boards 100A and 100B of the wiring board assembly 110 of the first embodiment. For example, in the case of a three-layer configuration, as shown in FIG. 6, the wiring board 100C is arranged between the wiring boards 100A and 100B.
Hereinafter, a description will be given centering on differences from the first embodiment.

The wiring substrate 100C is a member in which a circuit and wiring (not shown) are formed on the insulating substrate 1C.
A plurality of electrodes 2C (2D) electrically connected to circuits and wirings (not shown) in the wiring substrate 100C are provided on the surface of the substrate 1C facing the wiring substrate 100A (100B).
The electrode 2C (2D) is provided at a position facing the electrode 2A (2B), and the electrode 2C (2D) and the electrode 2A (2B) facing each other are electrically connected to each other via the connection portion 10C (10D). It is connected to the.
The electrodes 2C and 2D are directly electrically connected by a conductive member penetrating the substrate 1C or through a circuit or wiring (not shown) provided on the front and back surfaces of the substrate 1C and connected to each other by the conductive member. It is indirectly electrically connected.
Therefore, FIG. 6 shows an example in which the electrodes 2C and 2D are arranged in a positional relationship facing each other with the substrate 1C interposed therebetween. However, the electrodes 2C and 2D are not necessarily opposed to each other with the substrate 1C interposed therebetween. It does not have to be arranged in a positional relationship. Thereby, the electrodes 2A and 2B in the present modification need not necessarily be arranged at positions facing each other.

  The connecting portion 10C (10D) includes a conductive resin layer 3C (3D) instead of the conductive resin layer 3B (3A) of the connecting portion 10 of the first embodiment. The conductive resin layer 3C (3D) connects the surface of the metal layer 4 on the electrode 2C (2D) side and the electrode 2C (2D), and is used for element mounting as with the conductive resin layer 3A. Conductive adhesives or conductive adhesive films can be used. That is, the material of the conductive resin layer 3C (3D) is suitable according to, for example, the material of the electrode 2C (2D) among the materials suitable for the conductive resin layer 3A exemplified in the first embodiment. Can be selected and used.

  According to the wiring board assembly 113 having such a configuration, since the wiring boards 100A, 100C, and 100B are connected by the connection portion 10C (10D), the first wiring board can be used even if it is a three-layer multilayer wiring board. Similarly to the embodiment, even when the inter-electrode distance between the electrodes respectively provided on the wiring substrates arranged to face each other is large, the electrodes can be connected to each other satisfactorily.

[Second Embodiment]
Next, the solar cell module which is the semiconductor device of the 2nd Embodiment of this invention is demonstrated.
FIG. 7 is a schematic cross-sectional view showing the configuration of the solar cell module according to the second embodiment of the present invention.

As shown in FIG. 7, the solar cell module 50 (wiring board assembly, semiconductor device) of this embodiment is an example in which the wiring board assembly 110 of the first embodiment constitutes a semiconductor device. Instead of the substrate 1A and the substrate 1B of the first embodiment, a substrate unit 55 (first wiring substrate) and solar cells 20 (second wiring substrate, semiconductor elements) are provided.
That is, the schematic configuration of the solar cell module 50 is a solar cell 20 in which a plurality of wiring connection electrodes 20a (second electrodes) are provided on the back surface 20c opposite to the light receiving surface 20b that receives light for power generation. And the substrate part 55 for wiring the solar battery cell 20, the connection part 10 for electrically connecting the substrate part 55 and the solar battery cell 20, and the solar battery cell 20 stacked on the substrate part 55 and the solar battery cell 20. The sealing material 30 which seals and the translucent board | substrate 40 laminated | stacked on the sealing material 30 are provided.

The solar battery cell 20 is a semiconductor element that generates electricity by photoelectrically converting light incident from the light receiving surface 20b. As a method of the solar battery cell 20, an appropriate method can be adopted as long as it is a so-called back contact type solar battery cell in which the connection electrode 20 a is provided on the back surface 20 c. Although FIG. 7 is a schematic diagram, the illustration is simplified. However, the number of connection electrodes 20a can be appropriately set to two or more as necessary.
The connection electrode 20a is formed in a circular shape with a diameter w _20a , for example, and the material is made of, for example, a baked silver paste.
Moreover, as the planar view shape of the solar battery cell 20, for example, an appropriate shape such as a rectangular shape in plan view can be adopted. A plurality of solar cells 20 are arranged adjacent to each other with a gap in the horizontal direction in the figure and in the depth direction in the figure, and are thereby arranged in a lattice shape in plan view.

  As shown in FIG. 7, the substrate portion 55 of the present embodiment includes a back sheet 54, a base material 51, an insulating adhesive layer 52, an aluminum electrode 53 (first electrode), and a solder resist 5 stacked in this order. It has been done.

The back sheet 54 constitutes one outer surface in the stacking direction of the substrate portion 55 to suppress moisture, oxygen, and the like from entering the inside of the substrate portion 55 and the inside of the solar cell module 50. It is a sheet-like member. For this reason, the back sheet 54 has a barrier function as a shield material.
As a material of the back sheet 54, an appropriate resin material having excellent barrier property against moisture and oxygen, an aluminum foil, or a composite laminated film of an aluminum foil and an appropriate resin can be used.

The base material 51 is a member formed by laminating on the back sheet 54, and is a member that supports the aluminum electrode 53 via the insulating adhesive layer 52. In this embodiment, the base material 51 is composed of a flexible sheet-like member. Is done. Moreover, it is preferable that the base material 51 consists of a material excellent in electrical insulation.
For example, the base material 51 can employ a resin material formed into a sheet shape or a film shape.
As a material of the base material 51, for example, a resin material such as acrylic, polycarbonate, polyethylene terephthalate, polyethylene naphthalate, polyimide, urethane, epoxy, melamine, styrene, or a resin material obtained by copolymerizing them can be used. .
Moreover, the material of the base material 51 can also use the material which mixed the organic filler or the inorganic filler etc. as needed for control of heat insulation, elasticity, or an optical characteristic.
The base material 51 can also employ a laminated film in which a plurality of the above resin materials are laminated or a composite laminated film in which a layer of the above resin material and a metal foil such as an aluminum foil are laminated. is there.
Also, for example, when the above-mentioned composite laminated film is used, the back sheet 54 is deleted when the base material 51 has the necessary strength and moisture or oxygen barrier properties as the outer surface of the solar cell module 50. However, the base material 51 may serve as the function of the back sheet 54.

  The insulating adhesive layer 52 is a layered portion for fixing the aluminum electrode 53 to the surface of the base material 51. For example, urethane, acrylic, epoxy, polyimide, olefin, which is a curable resin, or a copolymer thereof. It is formed by curing the cured curable adhesive. The kind of curable adhesive is not specifically limited, For example, a thermosetting adhesive, a UV curable adhesive, etc. can be employ | adopted suitably. Further, as the insulating adhesive layer 52, an adhesive layer that is not a step-curing type may be used.

The aluminum electrode 53 forms a wiring pattern for wiring the solar battery cells 20. The aluminum electrode 53 has an appropriate plan view shape according to the arrangement of the connection electrodes 20 a of the solar battery cells 20, and has an insulating adhesive layer 52 interposed therebetween. And laminated on the base material 51 and integrally joined to the base material 51.
As an example of the wiring pattern of the aluminum electrode 53, a pattern in which comb-like patterns corresponding to the plus electrode and the minus electrode are arranged so as to penetrate between the respective comb teeth is adopted in this embodiment. ing. That is, the aluminum electrode 53 extends in the shape of an elongated line in the depth direction in FIG. 7, and a plus electrode and a minus electrode are alternately arranged adjacent to each other in the left-right direction in FIG. Hereinafter, the illustrated depth direction is referred to as the length direction of the aluminum electrode 53, and the illustrated left-right direction is referred to as the width direction.

The solder resist 5 of the present embodiment is black coated so as to cover the gaps between the aluminum electrodes 53 and both ends in the width direction on the aluminum electrodes 53. As a result, a recessed hole portion 7 similar to the wiring board assembly 112 of the first embodiment is formed at a position that can face the connection electrode 20a of the solar battery cell 20, and aluminum is formed at the hole bottom of the recessed hole portion 7. The electrode 53 is partially exposed.
In the present embodiment, the concave hole portion 7 is, for example, a rectangular hole portion in plan view extending in the depth direction with a depth h ₇ and a width w ₅₃ (where w ₅₃ > w _20a ). Thereby, the aluminum electrode 53 is exposed at the hole bottom of the recessed hole portion 7 with the width w ₅₃ in the illustrated depth direction.

The connection part 10 of this embodiment is the same as the connection part 10 of the said 1st Embodiment shown to Fig.1 (a) toward the connection electrode 20a from the aluminum electrode 53, 3 A of conductive resin layers, the metal layer 4 And the conductive resin layer 3B are laminated in this order. Thereby, the aluminum electrode 53 and the connection electrode 20a are electrically connected to each other.
In the present embodiment, the outer diameter w ₄ of the metal layer 4 of the connecting portion 10 is set to w ₅₃ > w ₄ > w _20a as an example.
However, w ₄ ≦ w ₅₃ or w ₄ ≦ w _20a may be set if there is no problem in assembly and there is no possibility of short-circuiting. The relationship of w ₅₃ > w _20a is also an example, and the relationship of w ₅₃ ≦ w _20a may be used.
If the solder resist 5 is formed on the aluminum electrode 53, w ₄ <w ₅₃ , and if the solder resist 5 is not in contact with the aluminum electrode 53, the relationship of w ₄ ≦ w ₅₃ is satisfied. Also good.
Further, by previously adjusting the thickness t ₄ of the metal layer 4, the inter-electrode distance h ₁₀ has to be a size larger than the depth t ₇ of the recessed hole portions 7.
For this reason, for example, after connecting the connection member 14 (16) in the first embodiment to the connection electrode 20a, each connection member 14 (16) of the solar battery cell 20 is placed on each concave hole portion 7. It arrange | positions so that it may be located, and the photovoltaic cell 20 and the board | substrate part 55 can be connected by pressing toward the board | substrate part 55. FIG.

If the sealing material 30 can seal and insulate the photovoltaic cell 20 on the aluminum electrode 53 and the insulating adhesive layer 52 of the board | substrate part 55, it can be comprised from an appropriate material. Examples of suitable materials for the sealing material 30 include an ethylene / vinyl acetate copolymer (EVA) film.
When the sealing material 30 is composed of an EVA film, the sealing material 30 may be formed by laminating two or more EVA films so as to sandwich the solar battery cell 20.

  The translucent substrate 40 is a member that guides incident light to the light receiving surface 20 b of the solar battery cell 20 and forms an outer surface opposite to the back sheet 54 in the solar battery module 50. In this embodiment, the structure which adhere | attached the glass panel on the surface of the sealing material 30 is employ | adopted.

According to such a solar cell module 50, since the solar cell 20 and the board | substrate part 55 are connected by the connection part 10 of the said 1st Embodiment, the wiring board assembly of the said 1st Embodiment. The same action as 110 is provided.
For example, when the solar battery cell 20 and the substrate part 55 are electrically connected, conduction with a small electrical resistance can be obtained without using solder or silver paste that has been conventionally used.
In addition, since an oxide film is formed on the surface of the aluminum electrode 53, special processing is required for soldering or the like, whereas in this embodiment, the conductive resin layers 3A and 3B are used to remove the oxide film. Therefore, the electrical connection can be performed satisfactorily without performing surface treatment or the like. For this reason, the process of electrical connection is simplified.
Further, the distance between the electrodes can be easily adjusted by the metal layer 4. For this reason, for example, even when the distance between the electrodes needs to be increased by the solder resist 5 or the like, the assembly can be easily performed.
Moreover, since the connection part 10 employ | adopts the laminated structure which pinches | interposes the metal layer 4 with conductive resin layer 3A, 3B, joining with a softness | flexibility can be performed. For this reason, the deformation | transformation by the thermal expansion between the board | substrates by the heat | fever of sunlight can be absorbed, and it becomes possible to prevent a failure | damage.

  In the description of each of the embodiments and the modifications described above, an example in which the connection portion main body is composed of one metal layer or two metal layers has been described. However, the connection portion main body includes three or more metal layers. It can be set as the structure provided.

Moreover, in the said 2nd Embodiment, although the photovoltaic cell 20 which is a semiconductor element demonstrated as comprising a 2nd wiring board, since there is no distinction in particular with a 1st wiring board and a 2nd wiring board. The first wiring board may be the solar battery cell 20.
For example, in the description of the wiring board assembly 113 of the second modified example of the first embodiment, the wiring boards 100A and 100B are described as the first wiring board and the second wiring board, respectively. The wiring boards 100A (100B) and 100C to be used may be the first wiring board and the second wiring board.

Moreover, in the said 2nd Embodiment, although the example in case the photovoltaic cell 20 which is a semiconductor element comprises a 2nd wiring board as an example of a semiconductor device, in semiconductor devices other than a solar cell module, The first wiring board and the second wiring board can constitute a semiconductor device.
Moreover, even if it is a solar cell module, it is set as a wiring board assembly which has a wiring board of 3 layers or more like the 2nd modification of the said 1st Embodiment, for example, and it is a solar cell cell on the front and back both sides It is possible to form a solar cell module comprising

  In the second embodiment, the example in which the aluminum electrode 53 is formed with a comb-like wiring pattern having an elongated linear portion has been described. On such an aluminum electrode 53, for example, The connection electrode may be formed in a region narrower than the aluminum electrode 53 at a position facing the connection electrode 20a by attaching another metal foil such as a copper foil.

Moreover, all the components described above can be implemented by appropriately changing or deleting the combination within the scope of the technical idea of the present invention.
For example, as shown in FIG. 7, in the solar cell module 50 of the second embodiment, instead of the connection portion 10, the connection portion 11 of the first modification of the first embodiment can be provided. is there.

1A, 1B, 1C Substrate 2A Electrode (first electrode)
2B electrode (second electrode)
2C, 2D electrode 3A, 3D conductive resin layer (first conductive resin layer)
3B, 3C conductive resin layer (second conductive resin layer)
3C conductive resin layer (third conductive resin layer)
4, 4a, 4b Metal layer 5 Solder resist 8 Conductive particle 9 Deformation part 10, 10C, 10D, 11 Connection part 13 Connection part body 14, 15, 16, 17, 18, 19 Connection member 20 Solar cell 20a Connection electrode (Second electrode)
50 Solar cell module (wiring board assembly, semiconductor device)
51 Base material 52 Insulating adhesive layer 53 Aluminum electrode (first electrode)
55 Board part (second wiring board)
100A wiring board (first wiring board)
100B wiring board (second wiring board)
100C wiring board 110, 111, 112, 113 wiring board assembly

Claims (8)

A first wiring board having a first electrode; a second wiring board disposed opposite to the first wiring board and having a second electrode; the first electrode and the second electrode; A wiring board assembly comprising a connection portion disposed between and electrically connecting the first electrode and the second electrode,
The connecting portion is
A connection portion main body in which the surface on the first electrode side and the surface on the second electrode side are formed of a metal layer;
A first conductive resin layer that connects the first electrode side surface of the connection body and the first electrode;
A second conductive resin layer that connects the second electrode side surface of the connection body and the second electrode;
A wiring board assembly comprising: The wiring board assembly according to claim 1, wherein the metal layer is made of aluminum or an aluminum alloy. The connection body is
Two or more metal layers including a metal layer that forms a surface on the first electrode side and a metal layer that forms a surface on the second electrode side are stacked via a third conductive resin layer. The wiring board assembly according to claim 1, wherein the wiring board assembly is provided. The external shape of the said connection part main body in the direction orthogonal to a connection direction is smaller than any external shape of a said 1st electrode and a said 2nd electrode, The any one of Claims 1-3 characterized by the above-mentioned. The wiring board assembly according to the description. 5. The wiring board assembly according to claim 1, wherein at least one of the first electrode and the second electrode is formed of an aluminum foil. The wiring board assembly according to any one of claims 1 to 5,
A semiconductor device, wherein at least one of the first wiring board and the second wiring board is a semiconductor element. The wiring board assembly according to any one of claims 1 to 5,
At least one of said 1st wiring board and said 2nd wiring board is a photovoltaic cell, The solar cell module characterized by the above-mentioned. A first wiring board having a first electrode; a second wiring board disposed opposite to the first wiring board and having a second electrode; the first electrode and the second electrode; A connection member for electrically connecting
One or more metal layers and one or more conductive resin layers are alternately stacked and connected,
A connecting member, wherein a conductive resin is disposed on at least one end side in the laminating direction.

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