JP2013195677A - Display device - Google Patents

Abstract

Disclosed is a heat dissipation structure for a display device capable of reducing display unevenness and driving display means within an allowable temperature range.
A display module of an image display device illuminates with a backlight disposed on the back side of a liquid crystal panel. A flexible wiring board 13 on which a driver IC 14 is mounted is connected to the peripheral portion of the liquid crystal panel 11. The peripheral edge of the liquid crystal panel 11 is covered with a panel case 15 from the front side. The panel case 15 has a side wall 15a extending from the front side to the back side, an opening hole 15b is formed at a position facing the driver IC 14, and a folded portion 15c that covers the opening hole 15b from the outside is formed. Have. The driver IC 14 is in thermal contact with the folded portion 15c through the heat transfer member 21 disposed in the opening hole 15b, so that the heat of the driver IC 14 is dissipated to the back side of the image display device.
[Selection] Figure 3

Description

  The present invention relates to a heat dissipation structure for a display device.

In recent years, there are a liquid crystal panel, an organic EL panel, and the like as a display panel used in an image display device, and a driver IC (integrated circuit) has been downsized for thinning and narrowing the frame. The image display device is used for various purposes, and for example, high definition is required in the fields of medical and printing industries. For this reason, the power consumption and heat generation density of the driver IC of the display panel are increased, and measures against temperature rise are necessary. That is, when the driver IC exceeds the specified temperature during driving of the display panel, an appropriate heat dissipation structure is required so as not to cause an operational problem.
As a structure of a conventional image display device, Patent Document 1 discloses a thermally conductive member containing a filler having high thermal conductivity between a wiring board on which a driver IC is mounted and a bezel that holds a liquid crystal panel. A structure in which is interposed is disclosed. By conducting the heat generated by the driver IC to the bezel through the heat conductive member, the temperature rise of the driver IC can be suppressed.

Japanese Patent Laid-Open No. 2007-222068

However, in the conventional technology, heat generated in the driver IC is transferred to a member such as a bezel to dissipate heat. Therefore, when the temperature of the member becomes high, the heat is transferred to an adjacent display panel, and its peripheral portion is It can become hot. In this case, since the display panel may overheat, display unevenness such as brightness unevenness or color unevenness may occur or the display panel may exceed the usable temperature.
An object of the present invention is to provide a heat dissipation structure for a display device that can reduce display unevenness and can drive display means within an allowable temperature range.

  In order to solve the above-described problems, an apparatus according to the present invention includes a display device including a display unit disposed on a front surface, a drive circuit unit that drives the display unit, and a case member that covers the display unit from the front side. The case member has a side wall portion extending from the front side to the back side of the display device, and a folded portion folded back from the side wall portion to the front side, and is formed on the side wall portion of the case member. The drive circuit portion is in thermal contact with the folded portion through the opening hole.

  According to the present invention, display unevenness can be reduced and the display means can be driven within an allowable temperature range.

FIG. 4 is an exploded perspective view illustrating a display device in order to explain the first embodiment of the present invention together with FIG. 2 and FIG. 3. It is a disassembled perspective view which shows the structural example of a display module. It is sectional drawing of a display module. It is sectional drawing which illustrates the structure of the display apparatus which concerns on 2nd Embodiment of this invention. FIG. 7 is an exploded perspective view illustrating a display device for explaining a third embodiment of the present invention together with FIG. 6. It is a top view which shows the holding structure inside a display apparatus, and shows the state (A) which removed the bezel, and the state (B) which attached the bezel.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, although the structure using the display panel which is a display means and a surface light source device is illustrated and demonstrated as a display apparatus, this invention is widely applicable to the display apparatus provided only with the display means.

[First Embodiment]
FIG. 1 shows a configuration example of a display device according to the first embodiment of the present invention. In the following, the top and bottom surfaces, and the right and left surfaces when viewed from the user are defined with the display surface of the apparatus as the front.
The image display device 1 includes a display module 10 that displays an image on a display surface, and has a structure in which the display module 10 is held on the back side by a chassis member 40 (hereinafter simply referred to as a chassis) on which a circuit board 30 is mounted. . The bezel 2 disposed on the front side of the display module 10 and the rear cover 3 disposed on the back side are exterior members that house each component in the apparatus. The circuit board 30 includes a system board that performs image processing related to an image input signal and outputs the processed signal to the display module 10, and a power supply board that supplies a power supply voltage to the display module 10, the system board, and the like. The display unit of the image display device 1 is held by the stand 60 from the back side.

Next, the structure of the display module 10 according to the present embodiment will be described with reference to FIG. FIG. 2 is an exploded perspective view of the display module 10, and has a structure in which a backlight is disposed on the back side of the liquid crystal panel 11 for illumination.
The liquid crystal panel 11 includes a pair of glass substrates composed of a thin film transistor (TFT) substrate and a color filter (CF) substrate, which are arranged to face each other in parallel at a predetermined interval, and a liquid crystal is filled in a gap portion. It has become. On the glass substrate on the TFT substrate side, electrode wiring such as gate wiring and source wiring for driving the liquid crystal is formed. The liquid crystal panel 11 includes a drain substrate 12, a flexible wiring substrate 13, and a driver IC 14 constituting a drive circuit unit, and details thereof will be described later.
The panel case 15 is a case member that covers the periphery of the liquid crystal panel 11 from the front side. The panel holder 16 is a holding member that holds the peripheral edge of the liquid crystal panel 11 from the back side. The liquid crystal panel 11 is sandwiched between a panel case 15 and a panel holder 16. On the back side of the panel holder 16, a backlight substrate 18 constituting a backlight device is disposed, and a light source such as a light emitting diode (LED) is mounted. Further, a backlight case 19 for holding the backlight substrate 18 is disposed on the back side.

Next, the heat dissipation structure of the driver IC of this embodiment will be described with reference to FIG. FIG. 3 is a cross-sectional view showing a main part of the display module 10.
An optical member 20 such as a diffusing plate or a prism sheet is disposed between the liquid crystal panel 11 and the backlight substrate 18, and light emitted from the light source of the backlight substrate 18 is uniformly applied to the liquid crystal panel 11. A drain substrate 12 for applying a voltage to the source wiring is connected to the peripheral portion of the liquid crystal panel 11. The drain substrate 12 is fixed to the panel holder 16 with a fastening member such as a screw. A flexible wiring board 13 having flexibility is used for electrical connection between the drain substrate 12 and the source wiring. A driver IC (integrated circuit) 14 for driving the liquid crystal panel 11 is mounted on the inner surface side (the side facing the bottom surface in FIG. 3) of the flexible wiring board 13 by a method such as COF (Chip On Film). Between the liquid crystal panel 11, the panel case 15 and the panel holder 16, a plurality of buffer materials 17 are respectively provided so that excessive stress is not generated in the liquid crystal panel 11.
The flexible wiring board 13 and the driver IC 14 connected to the liquid crystal panel 11 are disposed between the panel case 15 and the panel holder 16. The panel case 15 is made of a metal plate, and is formed in a box shape having a side wall portion 15a by bending and processing four sides from the front side to the back side. An opening hole 15b is formed at a position facing the driver IC 14 in the side wall part 15a, and a folded part 15c that covers the opening hole 15b from the outside is formed. The folded portion 15c is a portion bent by folding the side wall portion 15a from the back side end to the front side. A heat transfer member 21 having thermal conductivity is disposed in the opening hole 15b of the side wall 15a, and the driver IC 14 is in contact with the inner surface of the folded portion 15c via the heat transfer member 21.

With the above configuration, the heat generated in the driver IC 14 is transmitted to the folded portion 15c of the panel case 15 via the heat transfer member 21, and is mainly radiated to the back side of the apparatus. Therefore, since the amount of heat transfer from the panel case 15 to the liquid crystal panel 11 is reduced, high temperature and overheating can be prevented, display unevenness can be reduced, and the display panel can be driven within the usable temperature range.
In the first embodiment, by ensuring a path for heat transfer from the drive circuit section of the display panel to the back side of the apparatus, it is possible to suppress a decrease in performance of the display panel due to heat transfer.
Instead of using the heat transfer member 21, the arrangement of the driver IC 14 may be changed to the top surface side so as to contact the folded portion 15 c of the panel case 15 and directly transmit the heat. Any form may be used as long as a heat transfer path can be secured.

[Second Embodiment]
Next, a second embodiment of the present invention will be described.
FIG. 4 is a cross-sectional view of a main part illustrating a configuration example of a display device according to the second embodiment. Since the outline of the present embodiment is the same as that of the first embodiment, detailed description of each part is omitted by using the reference numerals already used for similar components. In the following, differences will be mainly described. The way of omitting such description is the same in the embodiments described later.
The flexible wiring board 13 and the driver IC 14 connected to the liquid crystal panel 11 are disposed between the panel case 15 and the panel holder 16. The panel case 15 made of a metal plate is a box-shaped case member having a side wall portion 15a extending rearward from the front side portion, and an opening hole portion at a position facing the driver IC 14 in the side wall portion 15a. 15b is formed. The chassis 40 is made of a metal plate and is a box-shaped member having side walls 40a by bending four sides from the back side to the front side. The front end portion of the side wall portion 40a is disposed so as to cover the opening hole portion 15b of the panel case 15 from the outside. A circuit board 30 is attached to the rear side of the chassis 40.
The driver IC 14 is in thermal contact with the side wall portion 40 a of the chassis 40 through the heat transfer member 21 disposed in the opening hole portion 15 b of the panel case 15. Therefore, the heat generated by the driver IC 14 is transmitted to the chassis 40 via the heat transfer member 21 and is radiated to the back side of the image display device. For this reason, since the amount of heat transfer to the liquid crystal panel 11 is reduced, high temperature and overheating can be prevented, display unevenness can be reduced, and the display panel can be driven within a usable temperature range.

[Third Embodiment]
Next, a third embodiment of the present invention will be described with reference to FIGS. FIG. 5 is an exploded perspective view showing a display unit of the image display device. FIG. 6 is a top view showing a holding structure inside the image display apparatus. 6A shows a state where the bezel is removed, and FIG. 6B shows a state where the bezel is attached. Since the outline of the image display apparatus according to the present embodiment is the same as that of the second embodiment, differences will be mainly described.
In the image display device 1, the display module 10 is attached to the chassis 40 by fixing its side surface portion to the side wall portion 40 a of the chassis 40 with a plurality of screws 50. The bezel 2 is formed with a plurality of guide ribs 2a on its inner side surface. The pair of guide ribs 2a are formed in parallel with each other with a predetermined length from the front side to the back side of the bezel 2, and the guide ribs 2a are positioned with respect to the side wall portion 40a of the chassis 40. Claw portions 2b projecting inward from the bezel 2 are formed between the paired guide ribs 2a and engaged with the chassis 40. That is, the side wall portion 40a of the chassis 40 is formed with attachment holes 40b corresponding to the claw portions 2b, and the bezel 2 is held by the chassis 40 by engaging the claw portions 2b with the attachment holes 40b. The A pair of slits 40 c are formed in parallel on the side wall portion 40 a of the chassis 40 by cutting out a part thereof from the front side to the back side. The interval between the slits 40c in the left-right direction is set larger than the interval between the paired guide ribs 2a. Between the pair of slits 40c, the fixing screw 50 of the display module 10 and the mounting hole 40b corresponding to the claw portion 2b are located. As shown in FIG. 6B, when the bezel 2 is held by the chassis 40, the guide rib 2a is located between the position of the slit 40c and the position of the fixing screw 50 and the mounting hole 40b on the left and right sides. Are placed close together.

  With the above configuration, the heat generated in the driver IC 14 is transmitted to the chassis 40 via the heat transfer member 21 as in the case of the second embodiment. The chassis 40 holds the bezel 2, and the guide rib 2a and the claw portion 2b constituting the holding structure are close to each other. In view of this, the side wall 40a of the chassis 40 is formed with a notch that blocks a path for heat transfer from the driver IC 14 to the exterior member. That is, each slit 40c is located between the attachment position of the heat transfer member 21 and the position where the guide rib 2a of the bezel 2 is close. For this reason, it becomes difficult for the heat of the driver IC 14 to be transferred from the chassis 40 to the bezel 2, and the heat is radiated mainly from the chassis 40 to the back side of the apparatus. Therefore, there is no problem even if the operator touches the bezel 2 that is an exterior member of the apparatus. For example, in the case where the stand 60 is an image display device including a movable mechanism, the operator can touch the bezel 2 to change the posture of the display unit. At that time, by taking heat dissipation measures so that the bezel 2 does not become high temperature, the operator can operate without feeling uncomfortable.

The present embodiment has a structure in which the heat of the driver IC 14 is transferred to the chassis 40 and radiated to the back side of the image display device 1. However, the present invention is not limited to this, and the same effect can be obtained with the following structure even when heat is transferred to the panel case 15 as in the first embodiment. That is, a holding structure with the chassis 40 is provided in the folded portion 15 c provided with the heat transfer member 21 in the panel case 15. A plurality of slits 40 c are formed in the side wall portion 40 a of the chassis 40 as cutout portions that block heat transfer to the bezel 2 from the front side to the back side. The slit 40 c is formed between a position facing the folded portion 15 c of the panel case 15, a position facing the guide rib 2 a of the bezel 2, and a position of the mounting hole 2 b.
In each of the above-described embodiments, the configuration in which the driver IC is disposed on the top surface portion of the apparatus has been described. However, the driver IC may be disposed on the bottom surface portion or the side surface portion. Moreover, about the heat-transfer member which transmits the heat | fever of driver IC, it is preferable to use the member which has elasticity in order to reduce the load concerning driver IC and to improve contact property. Various embodiments are possible, such as a configuration in which the panel case is divided into a plurality of parts.

DESCRIPTION OF SYMBOLS 1 Image display apparatus 2 Bezel 10 Display module 11 Liquid crystal panel 14 Driver IC
15 Panel case 15a Side wall part 15b Opening hole part 15c Folding part 21 Heat transfer member 40 Chassis 40c Slit

Claims (8)

A display device including a display unit disposed on the front surface, a drive circuit unit that drives the display unit, and a case member that covers the display unit from the front side,
The case member has a side wall portion extending from the front side to the back side of the display device, and a folded portion folded back from the side wall portion to the front side.
The display device, wherein the drive circuit portion is in thermal contact with the folded portion through an opening hole formed in a side wall portion of the case member.   The display device according to claim 1, wherein a heat transfer member is disposed in the opening hole, and the heat transfer member is in thermal contact with the folded portion and the drive circuit portion. An exterior member covering the display means from the front side;
A chassis member disposed on the back side of the display means to hold the exterior member and the case member;
The chassis member has a side wall portion extending from the back side to the front side of the display device, and the drive circuit portion is transferred from the drive circuit portion to the exterior member at a portion that holds the exterior member and the case member at the side wall portion. The display device according to claim 1, wherein a notch that blocks a heat transfer path is formed.   The notch is a slit formed between a position holding the exterior member and a position facing the folded portion of the case member and extending from the front side to the back side of the display device. The display device according to claim 3. Display means arranged on the front surface, a drive circuit section for driving the display means, a case member that covers the display means from the front side, and a chassis member that holds the display means and the case member from the back side of the display device A display device comprising:
The case member has a side wall portion extending from the front side to the back side of the display device, and an opening hole is formed in the side wall portion,
The display device, wherein the drive circuit portion is in thermal contact with the chassis member through the opening hole.   The display device according to claim 5, wherein a heat transfer member is disposed in the opening hole, and the heat transfer member is in thermal contact with the chassis member and the drive circuit unit. An exterior member covering the display means from the front side;
The chassis member has a side wall portion extending from the back side to the front side of the display device, and the drive circuit portion is transferred from the drive circuit portion to the exterior member at a portion that holds the exterior member and the case member at the side wall portion. The display device according to claim 6, wherein a notch for blocking a heat transfer path is formed. The notch is a slit formed between a position where the exterior member is held and a position where the heat transfer member contacts the case member and extends from the front side to the back side of the display device. The display device according to claim 7, wherein the display device is characterized.

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