JP2013170987A - Component mounted circuit board production apparatus and three-dimensional shape measurement apparatus - Google Patents

Abstract

To provide a component mounting board production apparatus and a three-dimensional shape measuring apparatus capable of achieving both measurement of a three-dimensional shape using a phase shift method and miniaturization.
The component mounting apparatus includes an imaging unit, a light projecting unit that emits luminance changing light, and a luminance distribution of the luminance changing light on the surface of the measurement object relatively moved in the second direction. A lens group 150 that is disposed at a position between the head 100, the imaging unit and the measurement object in the third direction, and that forms an image of the measurement object in the imaging unit, and is emitted from the light projecting unit 130. A reflection unit 180 that irradiates the measurement object at a predetermined angle with respect to the imaging optical axis A1 by reflecting the luminance change light that has passed through the lens group space 151 in which the lens 150 is disposed. The unit 130 is arranged such that the light projection axis A2 and the imaging optical axis A1 intersect in the lens group space 151.
[Selection] Figure 3

Description

  The present invention relates to a three-dimensional shape measuring apparatus that three-dimensionally measures the shape of an object such as a component, and a component mounting board production apparatus that produces a component mounting board using the measurement result.

  A mounting board production system for producing a mounting board on which components are mounted includes various mounting board production apparatuses such as a component mounting apparatus for mounting parts on a board and an inspection apparatus for inspecting components mounted on the board. I have.

  For example, in a component mounting apparatus, in order to improve component mounting accuracy, the shape of a component in a state of being sucked by a nozzle is measured before mounting the component. The component mounting apparatus corrects the descending distance of the nozzle when the component is mounted on the substrate, for example, using the measurement result. As a result, the component is mounted on the substrate accurately and reliably.

  That is, in order to produce a component mounting board with high accuracy in a component mounting board production apparatus such as a component mounting apparatus, it is necessary to accurately measure the shapes of these components.

  Therefore, as a conventional technique, a phase shift method is proposed in which a plurality of sinusoidal fringe pattern lights having different phases are projected onto an object, the object is imaged with a camera, and the shape of the object is measured.

  In the phase shift method, sinusoidal fringe pattern light that can represent a luminance change as a sine wave is projected onto an object from a direction oblique to the imaging optical axis. More specifically, the sine wave fringe pattern light is projected onto the object a plurality of times while shifting the phase of the sine wave, and the object is imaged each time the sine wave fringe pattern light having the phase shifted is projected.

  From the image data of a plurality of objects imaged in this way, for each coordinate, a sine wave indicated by a luminance change pattern that would be observed when no object exists, and the image data of the actually observed object The phase shift from the sine wave indicated by the luminance change pattern is calculated. The shape of the object is measured from the phase shift amount calculated for each coordinate.

  A technique for efficiently performing three-dimensional shape measurement by such a phase shift method is also disclosed.

  For example, according to the technique described in Patent Literature 1, sinusoidal fringe pattern lights having different wavelength components and having different relative phase relationships between the respective wavelength components are irradiated obliquely upward on the object. Furthermore, the reflected light from the object irradiated with such sinusoidal fringe pattern light is separated for each light component by the CCD camera disposed above the object and imaged at once.

  The technique described in Patent Document 1 intends to shorten the time required for three-dimensional shape measurement using the phase shift method by performing the above-described processing.

JP 2002-48523 A

  Here, in the measurement of a three-dimensional shape using the phase shift method, a lens group constituting an optical system for imaging an object and an optical system for irradiating the object with sinusoidal fringe pattern light as parallel light are configured. A lens group is used.

  Further, as described above, when the object to be imaged is irradiated with sinusoidal fringe pattern light, the object must be irradiated from an oblique direction with respect to the imaging optical axis.

  Therefore, for example, a sine composed of a plurality of lenses arranged in a direction inclined with respect to the vertical direction on the side of a lens group for imaging, which is composed of a plurality of lenses arranged in the vertical direction. A lens group for irradiating the wave pattern light is disposed.

  In other words, when measuring the three-dimensional shape of an object using the phase shift method, the apparatus configuration for that purpose has to be relatively large, and as a result, the conventional three-dimensional shape measurement device that employs the phase shift method can be used. There is a problem that miniaturization is difficult.

  Miniaturization of the three-dimensional shape measuring apparatus is an important matter from the viewpoint of realizing miniaturization of a mounting board production apparatus including the apparatus.

  In consideration of the above-described conventional problems, the present invention is a component mounting board production device and a three-dimensional shape measuring device, which can achieve both a three-dimensional shape measurement using a phase shift method and downsizing. An object is to provide a substrate production apparatus and a three-dimensional shape measurement apparatus.

  In order to achieve the above object, a component mounting board production apparatus according to an aspect of the present invention is a component mounting board production apparatus for producing a component mounting board on which components are mounted. In the imaging units arranged in a matrix and the imaging target area of the imaging unit, the luminance is uniform along the first direction, and the luminance is periodically changed according to the position in the second direction intersecting the first direction. A light projecting unit that emits luminance change light, which is light having a changing luminance distribution, and the luminance distribution of the luminance change light on the surface of the measurement object while maintaining the luminance period of the luminance change light; A lens group that includes a moving unit that moves relative to the object in the second direction, and a plurality of lenses that are arranged in a third direction that intersects both the first direction and the second direction. In the third direction A lens group that is disposed at a position between the imaging unit and the measurement target and that forms an image of the measurement target in the imaging unit, and is emitted from the light projecting unit, and the lens group is disposed. A reflection unit that irradiates the object to be measured at a predetermined angle with respect to the imaging optical axis of the imaging unit by reflecting the luminance change light that has passed through the lens group space. The light unit is arranged so that a light projecting axis that is an optical axis of the luminance change light emitted from the light projecting unit and the imaging optical axis intersect in the lens group space.

  According to this configuration, the three-dimensional shape of the measurement object (specifically, by the phase shift method) while moving the luminance distribution of light on the surface of the measurement object such as a component relative to the measurement object. The measurement in the third direction (Z-axis direction position) of each part of the surface of the measurement object is performed.

  In addition, the light projecting unit that emits the luminance change light irradiated on the measurement object is arranged so that the light projecting axis and the imaging optical axis intersect in the lens group space. Further, the luminance change light that has passed through the lens group space is reflected by the reflection unit, and thereby the luminance change light is irradiated onto the measurement object at a predetermined angle with respect to the imaging optical axis.

  That is, in the component mounting board production apparatus of this aspect, simply speaking, the optical system (lens group) used for imaging the measurement object is also used for irradiating the luminance change light from the oblique direction to the measurement object. . In other words, the imaging-side and projection-side optical systems (lens groups) used for the three-dimensional shape measurement by the phase shift method are shared. Therefore, the apparatus configuration for performing the measurement can be reduced in size.

  Thus, according to the component mounting board production apparatus of this aspect, it is possible to achieve both measurement of a three-dimensional shape using the phase shift method and miniaturization.

  Further, in the component mounting board production apparatus according to one aspect of the present invention, the plurality of lenses include a first lens disposed at a position closest to the imaging unit in the third direction, and the light projecting unit includes: The first projection region passes through a first peripheral region which is a first peripheral region of the first lens and is a peripheral region of the first main region through which light imaged in the imaging unit passes. It may be arranged.

  According to this configuration, the luminance change light is applied to the measurement object via the first peripheral region of the first lens closest to the imaging unit in the lens group.

  That is, the component mounting board production apparatus can be downsized by using the peripheral area of the light passing area formed by the imaging unit in the first lens to irradiate the measurement object with the luminance change light. It is done.

  Moreover, in the component mounting board production apparatus according to an aspect of the present invention, the lens group includes a second lens arranged at a position closest to the measurement object in the third direction among the plurality of lenses. The light projecting unit is a second peripheral region of the second lens, the second peripheral region being a peripheral region of the second main region through which light imaged in the imaging unit passes, It is good also as arrange | positioning so that the said light projection axis which passed the 1st peripheral region may pass.

  According to this configuration, the luminance change light is irradiated to the measurement object via the second peripheral area of the second lens closest to the measurement object in the lens group in addition to the first peripheral area of the first lens.

  In other words, component mounting board production is achieved by using the peripheral region of the light passing region imaged by the imaging unit in each of the first lens and the second lens for irradiation of the measurement object of the luminance change light. The apparatus can be reduced in size.

  Further, the three-dimensional shape measuring apparatus according to one aspect of the present invention has an imaging unit in which pixels for imaging are arranged in a matrix, and the luminance is aligned along the first direction in the imaging target region of the imaging unit, And a light projecting unit that emits luminance change light that has a luminance distribution in which luminance periodically changes according to a position in a second direction intersecting the first direction, and a luminance period in the luminance change light. A moving unit that moves the luminance distribution of the luminance change light on the surface of the measurement object relative to the measurement object in the second direction, and the first direction and the second direction A lens group composed of a plurality of lenses arranged side by side in a third direction intersecting the both, arranged at a position between the imaging unit and the measurement object in the third direction, and the measurement Forms an image of the object in the imaging unit And reflecting the luminance change light emitted from the light projecting unit and passing through the lens group space in which the lens group is arranged, so that the luminance change light is reflected with respect to the imaging optical axis of the imaging unit. A reflection unit that irradiates the measurement object at a predetermined angle, and the light projecting unit includes a light projecting axis that is an optical axis of the luminance change light emitted from the light projecting unit, and the imaging optical axis. Are arranged so as to intersect in the lens group space.

  The present invention can also be realized as a component mounting board production method and a three-dimensional shape measurement method including a characteristic process executed by the component mounting board production device or the three-dimensional shape measurement device according to any one of the above aspects. .

  It can also be realized as a program to be executed by a computer, including characteristic processing included in the component mounting board production method or the three-dimensional shape measurement method. Such a program can be distributed via a recording medium such as a CD-ROM and a transmission medium such as the Internet.

  Furthermore, it can also be realized as an integrated circuit that controls characteristic processing of the component mounting board production apparatus and the three-dimensional shape measurement apparatus according to any one of the above aspects.

  According to the present invention, a component mounting board production apparatus and a three-dimensional shape measurement apparatus, which can achieve both a measurement of a three-dimensional shape using a phase shift method and a miniaturization, and a three-dimensional A shape measuring device can be provided.

FIG. 1 is an external view showing a configuration of a component mounting apparatus according to an embodiment. FIG. 2 is a plan view showing a main configuration inside the component mounting apparatus according to the embodiment. FIG. 3 is a diagram schematically showing the structural appearance of the three-dimensional shape measuring apparatus according to the embodiment. FIG. 4 is a side view showing a schematic configuration of the three-dimensional shape measuring apparatus according to the embodiment. FIG. 5A is a side view illustrating a first main region and a first peripheral region of the first lens according to the embodiment. FIG. 5B is a top view illustrating a first main region and a first peripheral region of the first lens according to the embodiment. FIG. 6A is a side view illustrating a second main region and a second peripheral region of the second lens according to the embodiment. FIG. 6B is a top view illustrating the second main region and the second peripheral region according to the embodiment. FIG. 7 is a diagram illustrating a schematic configuration of a light projecting unit having a reflecting member and a light source. FIG. 8 is a diagram showing an outline of the configuration of a three-dimensional shape measuring apparatus having a configuration capable of irradiating brightness changing light from two directions onto a component that is a measurement object.

  Hereinafter, a component mounting apparatus and a three-dimensional shape measuring apparatus according to an embodiment of the present invention will be described with reference to the drawings. Each figure is a schematic diagram and is not necessarily illustrated exactly.

  In the embodiment described below, a preferred specific example of the present invention is shown. The numerical values, shapes, components, arrangement of components, connection forms, and the like shown in the embodiments and supplements thereof are merely examples, and are not intended to limit the present invention. The invention is specified by the claims. Therefore, among the constituent elements in the following embodiments and supplements thereof, constituent elements not described in the independent claims are not necessarily required to achieve the objects of the present invention, but constitute more preferable forms. Described as an element.

  FIG. 1 is an external view showing a configuration of a component mounting apparatus 20 in the embodiment.

  FIG. 2 is a plan view showing a main configuration inside the component mounting apparatus 20 according to the embodiment.

  The component mounting apparatus 20 is an example of a component mounting board production apparatus, and is an apparatus for mounting the component 40 on the board 30 as shown in FIG.

  In addition, the component mounting apparatus 20 includes two mounting units for mounting the component 40 on the substrate 30 as shown in FIG. The two mounting units cooperate with each other to perform mounting work on one board 30. The mounting unit includes a head 100, an imaging unit 200, a component supply unit 300, and the like.

  The component supply unit 300 includes, for example, an array of a plurality of component cassettes 310 that store component tapes. The component tape is, for example, a plurality of components 40 of the same component type arranged evenly on a tape (carrier tape) and supplied in a state of being wound around a reel or the like. The component 40 arranged on the component tape is, for example, a BGA (Ball Grid Array) or a chip component.

  The head 100 includes a plurality of nozzles 110, sucks the component 40 of the component tape accommodated in the component cassette 310 with the nozzle 110, conveys the sucked component 40 onto the substrate 30, and applies the component 30 to the substrate 30. The component 40 is mounted.

  In addition, the component mounting apparatus 20 includes the three-dimensional shape measuring apparatus 10 that measures the three-dimensional shape of the component 40 held by the nozzle 110 of the head 100.

  The three-dimensional shape measurement apparatus 10 measures the three-dimensional shape of the component 40 based on data obtained by the imaging unit 200 imaging the component 40 held by the nozzle 110 of the head 100 from below. .

  Further, at the time of this imaging, the component 40 is irradiated with luminance change light from the light projecting unit 130 included in the three-dimensional shape measuring apparatus 10.

  FIG. 3 is a diagram schematically illustrating the structural appearance of the three-dimensional shape measuring apparatus 10 according to the embodiment. In addition, illustration about the housing | casing of the three-dimensional shape measuring apparatus 10 is abbreviate | omitted. The same applies to other figures such as FIG.

  FIG. 4 is a side view illustrating a schematic configuration of the three-dimensional shape measuring apparatus 10 according to the embodiment.

  As shown in FIG. 3, the head 100 includes a plurality of nozzles 110 that hold the component 40. In the present embodiment, the nozzle 110 holds the component 40 by vacuum suction. The head 100 also has a mechanism for moving the nozzles 110 up and down independently in the Z-axis direction, and has a function of holding and transporting the component 40 and mounting the component 40 on the substrate 30.

  In other words, the head 100 causes the component 40 arranged in the component supply unit 300 to be sucked and held by the nozzle 110 and moves so that the nozzle 110 passes above the imaging unit 200. Then, the imaging unit 200 recognizes the positions of the nozzle 110 and the component 40 by imaging the nozzle 110 and the component 40 held by the nozzle 110.

  Thereafter, the head 100 moves the nozzle 110 holding the component 40 to the mounting position of the substrate 30, corrects the position of the component 40 held by the nozzle 110 using the imaging result of the imaging unit 200, and the substrate 30. The component 40 is mounted on

  In addition, when the imaging unit 200 captures an image of the component 40 adsorbed by the nozzle 110, the luminance change light emitted from the light projecting unit 130 is reflected by a reflecting unit 180 described later, and thus has a predetermined value with respect to the Z axis. The component 40 is irradiated from a direction inclined by an angle (θ).

  Specifically, as shown in FIG. 4, the light projecting unit 130 has the same brightness B along the first direction (Y-axis direction) in the imaging target region C of the imaging unit 200 and intersects the first direction. Luminance change light that is a light having a luminance distribution in which the luminance B periodically changes according to the position in the second direction (X-axis direction) is emitted.

  In the case of the present embodiment, the change in the brightness B of the brightness change light forms a sine wave. In addition, the wavelength of the sine wave which shows the change of the brightness | luminance B shown in the figure is typically shown for description, and is shown with the different scale with respect to the imaging object area | region C. FIG.

  Here, the head 100 maintains the luminance cycle of the luminance change light, and distributes the luminance distribution of light on the surface of the measurement object (in the present embodiment, the component 40, the same applies hereinafter) to the measurement object. It also has a function as a moving unit that relatively moves in the second direction (X-axis direction).

  That is, in the present embodiment, the head 100 in a state where the component 40 is held by the nozzle 110 with respect to the imaging unit 200 and the light projecting unit 130 of the three-dimensional shape measuring apparatus 10 stationary in the component mounting apparatus 20 is the first. Move in two directions (X-axis direction).

  Accordingly, the luminance distribution of the luminance change light on the surface of the component 40 that is the measurement object is maintained in the second direction (X-axis direction) relative to the component 40 while maintaining the luminance cycle of the luminance change light. Can be moved.

  A drive unit (not shown) that drives the movement of the head 100 includes an encoder, and can output information such as the moving speed and position of the head 100.

  In the imaging unit 200, pixels 211 for imaging are arranged in a matrix. In the present embodiment, the imaging unit 200 is an area image sensor in which pixels 211 for imaging are arranged in a matrix in a first direction (Y-axis direction) and a second direction (X-axis direction) intersecting the first direction. 210.

  The area image sensor 210 is an image recognition device in which, for example, about 4000 pixels 211 are arranged in the first direction (Y-axis direction) and about 3000 pixels 211 are arranged in the second direction (X-axis direction). In the present embodiment, a CMOS (complementary metal-oxide semiconductor) image sensor is employed as the area image sensor 210.

  The CMOS image sensor is a monochrome or color image sensor that outputs the overall intensity of light irradiated to the pixel 211 as digital data. This CMOS image sensor can acquire digital data of only the pixels 211 included in an arbitrary region among the pixels 211 arranged in a matrix.

  Further, in the CMOS image sensor, the region can be provided at a plurality of locations in the CMOS image sensor, and the location required for the measurement (for example, see L1 in FIG. 3) without acquiring data from the pixels 211 other than the region. Only data from the group of pixels 211 corresponding to the image can be acquired at high speed.

  That is, the imaging unit 200 according to the present embodiment has a rectangular imaging target region C corresponding to the area image sensor 210 within a predetermined depth of focus, and the imaging target region C viewed from the imaging unit 200 side. Only the digital data of the necessary part of the image of the placed object can be output.

  In the case of the present embodiment, a linear imaging region corresponding to a portion necessary for the measurement formed in a straight line is referred to as a line. For example, the line 1 (denoted as “L1” in the figure) shown in FIG. 3 is formed by a group of pixels 211 arranged in the first direction (Y-axis direction). In the present embodiment, a plurality of such lines are set side by side in the second direction (X-axis direction). One line may be formed by a group of pixels 211 in a plurality of columns.

  In addition to the CMOS image sensor, a CCD (Charge Coupled Device) image sensor that can acquire an image on a necessary row or column can be used as the area image sensor 210.

  Further, instead of the area image sensor 210 capable of forming a line-shaped imaging region, a line image sensor corresponding to each line is arranged in the second direction (X direction) with pixels arranged in at least one column in the first direction (Y-axis direction). A line sensor camera (not shown) having a configuration arranged side by side in the axial direction can also be used as the imaging unit 200.

  In addition, the three-dimensional shape measuring apparatus 10 includes a lens group 150 that forms an image of the measurement object in the imaging unit 200.

  The lens group 150 includes a plurality of lenses arranged side by side in a third direction (Z-axis direction) intersecting both the first direction (Y-axis direction) and the second direction (X-axis direction). The lens group 150 is disposed at a position between the imaging unit 200 and the measurement object in the third direction (Z-axis direction).

  In the present embodiment, the lens group 150 includes a first lens 153, an intermediate lens group 160, and a second lens 154, as shown in FIG.

  The first lens 153 is a lens arranged at a position closest to the imaging unit 200 in the third direction (Z-axis direction) among the plurality of lenses included in the lens group 150.

  The first lens 153 is called, for example, a condenser lens, and has a function of causing the imaging unit 200 to form an image of reflected light from the component 40 that has passed through the intermediate lens group 160 in the present embodiment.

  The second lens 154 is a lens arranged at a position closest to the measurement object in the third direction (Z-axis direction) among the plurality of lenses included in the lens group 150.

  The second lens 154 is called an objective lens, for example, and has a function of guiding the reflected light from the component 40 to the intermediate lens group 160 in the present embodiment.

  The intermediate lens group 160 includes relay lenses 164a, 164b, 164c, and a diaphragm unit 166.

  Light that has passed through the second lens 154 and entered the intermediate lens group 160 is guided to the aperture 166 by the relay lens 164a.

  The stop 166 is an optical member that adjusts the brightness and focus of incident light. The diaphragm unit 166 may be configured by, for example, an aperture diaphragm mechanism (not shown) that mechanically changes the lens magnification or the aperture amount of the diaphragm. The configuration of the diaphragm unit 166 is not limited to such a configuration, and may be any configuration.

  The light that has passed through the aperture 166 is guided to the first lens 153 by the relay lens 164b and the relay lens 164c.

  The lens group 150 in the present embodiment specifically constitutes a double-sided telecentric optical system.

  That is, the lens group 150 makes the reflected light from the measurement object incident from the second lens 154 enter the imaging unit 200 as parallel light from the first lens 153. The lens group 150 further has a function of irradiating the measurement target object with the luminance changing light from the light projecting unit 130 incident from the first lens 153 as parallel light from the second lens 154 via the reflecting unit 180. Yes.

  In other words, the luminance change light from the light projecting unit 130 incident from the first lens 153 is guided to the relay lens 164c and the relay lens 164b and passes through the aperture unit 166 as shown in FIG. The luminance change light that has passed through the diaphragm 166 is guided to the second lens 154 by the relay lens 164a.

  The luminance change light guided to the second lens 154 travels in the direction of the reflection unit 180 as parallel light and is reflected by the reflection unit 180. Thereby, the brightness change light which is parallel light is irradiated to a measuring object.

  The lens configuration of the lens group 150 shown in FIG. 4 is an example. The lens diameter, the radius of curvature and the number of lenses, the distance between the lenses, and the like adopted by the lens group 150 are, for example, the size of the component 40 that can be a measurement object, the size of the area image sensor 210 of the imaging unit 200, and the three-dimensional shape. What is necessary is just to determine according to the restriction | limiting of the size about the measuring apparatus 10, etc.

  Further, for example, a condenser lens group (focusing lens) is a generic term for lenses (in this embodiment, the relay lens 164b, the relay lens 164c, and the first lens 153) from the aperture stop position in the diaphragm unit 166 to the imaging surface in the imaging unit 200. Sometimes called a lens group).

  In addition, the lens from the aperture stop position to the subject surface (in this embodiment, the relay lens 164a and the second lens 154) may be collectively referred to as an objective lens group (objective lens group).

  Here, as shown in FIG. 4, the light projecting unit 130 has a change in luminance from the imaging optical axis A <b> 1 of the imaging unit 200 and the luminance from the light projecting unit 130 in the lens group space 151 where the lens group 150 is arranged. It arrange | positions so that the light projection axis | shaft A2 which is an optical axis of light may cross | intersect.

  Further, the reflection unit 180 reflects the luminance change light that has passed through the lens group space 151, and thereby irradiates the measurement target object with the luminance change light at a predetermined angle with respect to the imaging optical axis A1 of the imaging unit 200. The reflection unit 180 is realized by, for example, a metal plate or a mirror in which a metal such as aluminum is deposited on a glass plate.

  In the present embodiment, for example, the reflection unit 180 is provided so that the component 40 is irradiated with the luminance change light at an angle of θ = 30 ° with respect to the imaging optical axis A1.

  Specifically, in the present embodiment, the imaging optical axis A1 is set in parallel to the third direction (Z-axis direction), and the reflecting unit 180 projects the projected light axes A2 and Z of the reflected luminance change light. The angle formed with the axis is set to 30 °.

  More specifically, the luminance change light emitted from the light projecting unit 130 passes through the peripheral region of the first lens 153, the intermediate lens group 160, and the peripheral region of the second lens 154, and is reflected as parallel light. Reflected at 180.

  The peripheral areas of the first lens 153 and the second lens 154 will be described later with reference to FIGS. 5A to 6B.

  In this way, the reflected light from the component 40 that moves in the second direction (X-axis direction) while the luminance change light is applied obliquely enters the imaging unit 200 via the lens group 150. Thereby, imaging data for measuring the three-dimensional shape of the component 40 by the phase shift method is acquired by the imaging unit 200.

  Thus, the lens group 150 is used not only as an optical system for imaging the measurement object, but also as an optical system for irradiating the measurement object with luminance change light from an oblique direction.

  This eliminates the need to separately provide a lens group for imaging the measurement target and a lens group for obliquely irradiating the luminance change light to the measurement target.

  As a result, for example, the lateral width of the three-dimensional shape measuring apparatus 10 (the width in the X-axis direction in the present embodiment) can be made smaller than that of the conventional three-dimensional shape measuring apparatus.

  In addition, the total number of lenses used for imaging the measurement object and irradiating the brightness change light can be made smaller than that of a conventional three-dimensional shape measuring apparatus. Therefore, for example, it is possible to relatively increase the production cost per lens such as the first lens 153 by reducing the total number of lenses. In this case, for example, each lens can be further downsized. It becomes possible. As a result, the three-dimensional shape measuring apparatus 10 can be further downsized.

  FIG. 5A is a side view showing the first main region 153a and the first peripheral region 153b of the first lens 153 of the embodiment, and FIG. 5B shows the first main region 153a and the first peripheral region 153b. It is a top view.

  As shown in FIGS. 5A and 5B, the first lens 153 includes a first main region 153a through which light imaged in the imaging unit 200 passes, and a first peripheral region 153b that is a peripheral region of the first main region 153a. And have.

  In FIG. 5B, the first main area 153a is indicated by dots and the first peripheral area 153b is hatched so that the first main area 153a and the first peripheral area 153b can be easily identified. Yes.

  That is, the first main region 153a and the first peripheral region 153b may not be clearly distinguished by a line attached to the first lens 153, a shape of the first lens 153, or the like.

  The first main region 153 a is defined as a region through which light that forms an image in the imaging unit 200 passes through the first lens 153. The first peripheral area 153b is defined as an area outside the first main area 153a in the first lens 153.

  The diameter of the circle formed by the first main region 153a is also called, for example, “effective light beam diameter”. The same applies to a second main region 154a of the second lens 154, which will be described later.

  The luminance change light emitted from the light projecting unit 130 passes through the first peripheral region 153b of the first lens 153 defined as described above. In other words, the light projecting unit 130 is disposed so that the light projecting axis A2 passes through the first peripheral region 153b in the region outside the first main region 153a.

  Here, the first peripheral region 153b is a region that does not need to exist in the first lens 153 unless considering that the luminance change light emitted from the light projecting unit 130 passes.

  That is, in the three-dimensional shape measuring apparatus 10 of the present embodiment, in order to share the optical system (lens group) on the imaging side and the light projecting side, the aperture of the first lens 153 is shared with the optical system. It can be said that it is larger than the case where it does not.

  However, as described above, the sharing of the imaging-side and light-projecting-side optical systems (lens groups) greatly contributes to the downsizing of the three-dimensional shape measuring apparatus 10. In other words, the influence of the increase in the diameter of the first lens 153 due to the sharing on the size of the three-dimensional shape measuring apparatus 10 is sufficiently smaller than the contribution to miniaturization due to the sharing. Therefore, even when the first lens 153 has the first peripheral region 153b, the three-dimensional shape measuring apparatus 10 can be downsized.

  In addition, when a lens corresponding to the first lens 153 is manufactured without considering that the luminance change light passes, actually, an area of the lens used for imaging by the imaging unit 200 (the first lens 153). In general, it is produced through a step of scraping off the peripheral edge of the first main region.

  That is, the first peripheral region 153b in the first lens 153 can be provided in the first lens 153 by omitting the step of scraping off the peripheral portion. Therefore, it is possible to manufacture the first lens 153 with fewer steps than the conventional condenser lens.

  In the three-dimensional shape measuring apparatus 10 of the present embodiment, the luminance change light that has passed through the first peripheral region 153b of the first lens 153 further passes through the second peripheral region 154b of the second lens 154 and is reflected. Incident on the portion 180.

  6A is a side view showing the second main region 154a and the second peripheral region 154b of the second lens 154 of the embodiment, and FIG. 6B shows the second main region 154a and the second peripheral region 154b. It is a top view.

  As illustrated in FIGS. 6A and 6B, the second lens 154 includes a second main region 154a through which light imaged in the imaging unit 200 passes, and a second peripheral region 154b that is a peripheral region of the second main region 154a. And have.

  In FIG. 6B, the second main region 154a is indicated by dots and the second peripheral region 154b is hatched so that the second main region 154a and the second peripheral region 154b can be easily identified. Yes.

  Note that the second main region 154a and the second peripheral region 154b are defined in the same manner as the first lens 153 described above.

  That is, the second main region 154a is defined as a region through which the light imaged in the imaging unit 200 passes through the second lens 154, and the second peripheral region 154b is defined as a region outside the second main region 154a. The

  The luminance change light emitted from the light projecting unit 130 passes through the second peripheral region 154b of the second lens 154 defined in this way. In other words, the light projecting unit 130 is arranged so that the light projection axis A2 passes through the second peripheral region 154b in the region outside the second main region 154a.

  As described above, in the three-dimensional shape measuring apparatus 10 of the present embodiment, when the luminance change light from the light projecting unit 130 passes through the lens group space 151 (see FIG. 4), the first lens 153 and the second lens 153. Each lens 154 passes through the outside of the region used for imaging by the imaging unit 200.

  Note that the second lens 154 can also be said to have a larger aperture in order to share the optical system (lens group) on the imaging side and the light projecting side, similarly to the first lens 153. However, since the influence on the size of the three-dimensional shape measuring apparatus 10 by increasing the diameter of the second lens 154 is sufficiently smaller than the contribution to downsizing by the common use of the optical system, the three-dimensional shape Miniaturization of the measuring apparatus 10 is realized.

  Also, the second lens 154 may be manufactured by omitting the peripheral area scraping off process performed in the conventional lens manufacturing process corresponding to the second lens 154, similarly to the first lens 153. Is possible.

  The three-dimensional shape measuring apparatus 10 uses the lens group 150 described above to execute irradiation and imaging of luminance change light on the component 40 that is a measurement target, and based on the luminance value indicated in the imaging data, the component Forty three-dimensional shapes can be obtained.

  Below, the outline | summary of the calculation method of the three-dimensional shape of the component 40 which is a measuring object by the three-dimensional shape measuring apparatus 10 in this Embodiment is demonstrated.

  The three-dimensional shape measuring apparatus 10 captures an image of a part of the component 40 moving in the X-axis direction with each of at least three lines of the area image sensor 210 of the imaging unit 200 while shifting the imaging timing.

  For example, the imaging target area C is relatively moved in the second direction (X-axis direction) on each of a plurality of (for example, four) lines (not shown) arranged in the second direction (X-axis direction) of the area image sensor 210. The measurement site K (see FIG. 4) which is a part of the component 40 to be imaged is sequentially imaged. As a result, four luminance values at the measurement site K having different imaging timings can be obtained.

  The three-dimensional shape measurement apparatus 10 uses these four luminance values and is a waveform used for calculating the position of the measurement site K in the third direction (Z-axis direction) by the phase shift method, and the four luminance values Create a waveform corresponding to.

  In the present embodiment, since the change in luminance in the luminance change light irradiated to the component 40 forms a sine wave as described above, the waveform obtained from the four luminance values is also a sine wave. . That is, a sine wave that connects the four luminance values is obtained as a waveform corresponding to the four luminance values.

  The three-dimensional shape measuring apparatus 10 obtains the phase difference between the waveform created in this way and the reference waveform.

  The reference waveform is an image picked up from each line of the area image sensor 210 of the image pickup unit 200 in a virtual plane as a reference of the height position in the Z-axis direction when the component 40 is not picked up by the nozzle 110. It is a waveform (sine wave) which shows the luminance distribution shown by data.

  The virtual plane is a plane that passes through the position (height position) in the Z-axis direction of the tip surface of the nozzle 110 that holds the component 40 by suction and is parallel to both the X-axis direction and the Y-axis direction.

  From the phase difference thus determined, the distance from the virtual plane, that is, the tip surface of the nozzle 110, of the measurement site K of the component 40 is determined.

  In this way, the three-dimensional shape measuring apparatus 10 calculates information indicating the position in the third direction (Z-axis direction) of each part of the component 40 by the phase shift method. The three-dimensional shape measuring apparatus 10 further outputs the measurement results indicating the three-dimensional shape of the component 40 by collecting these calculation results.

  Note that the above-described processing for calculating the information indicating the three-dimensional shape of the component 40 using the reference waveform or the like may be executed by an information processing device such as a computer connected to the three-dimensional shape measuring device 10. That is, the three-dimensional shape measuring apparatus 10 may be provided in a component mounting board production apparatus such as the component mounting apparatus 20 as an apparatus that outputs imaging data used for the phase shift method to the information processing apparatus.

  As described above, the component mounting apparatus 20 according to the present embodiment includes the three-dimensional shape measuring apparatus 10. The three-dimensional shape measuring apparatus 10 shares an optical system (lens group 150) used for three-dimensional shape measurement by the phase shift method on the imaging side and the light projecting side.

  Thereby, the component mounting apparatus 20 and the three-dimensional shape measuring apparatus 10 that can achieve both the measurement of the three-dimensional shape using the phase shift method and the miniaturization are realized.

  In the present embodiment, the luminance change light emitted from the light projecting unit 130 is luminance change light whose luminance change forms a sine wave. However, the light projecting unit 130 may emit, for example, luminance change light that forms a sawtooth wave or a triangular wave whose luminance changes periodically according to the position in the second direction (X-axis direction).

  Moreover, there is no particular limitation on the method of generating the luminance change light by the light projecting unit 130. For example, the light projecting unit 130 includes a filter whose light transmittance periodically changes according to the position in the second direction (X-axis direction), and a light source that makes light incident on the filter. Luminance change light may be emitted.

  In addition, for example, a luminance change light is provided by including a reflection member whose light reflectance is periodically changed according to a position in the second direction (X-axis direction) and a light source that makes light incident on the reflection member. May be issued.

  FIG. 7 is a diagram illustrating an outline of the configuration of the light projecting unit 130 including the reflecting member 136 and the light source 135.

  For example, the reflecting member 136 and the light source 135 are provided so that the light projection axis A2 passes through a predetermined position of the first peripheral region 153b of the first lens 153 at a predetermined angle. As the reflecting member 136, for example, a reflective liquid crystal is employed.

  In the light projecting unit 130 illustrated in FIG. 7, the light source 135 is disposed on the lens group 150 side when viewed from the reflecting member 136. Therefore, for example, a method in which the height of the three-dimensional shape measuring apparatus 10 (the length in the Z-axis direction in the present embodiment) is generated by the light projecting unit 130 using the light transmitted through the above-described filter. It is possible to make it shorter than the height when it is adopted.

  In the present embodiment, it is assumed that the three-dimensional shape measuring apparatus 10 irradiates the component 40 that is the measurement object with the luminance change light from one direction. However, the three-dimensional shape measuring apparatus 10 may have a configuration capable of irradiating the component 40 that is the measurement object with the luminance change light from a plurality of directions.

  FIG. 8 is a diagram showing an outline of the configuration of the three-dimensional shape measuring apparatus 10 having a configuration capable of irradiating luminance changing light from two directions onto the component 40 that is a measurement object.

  The three-dimensional shape measuring apparatus 10 shown in FIG. 8 includes a light projecting unit 131 and a reflecting unit 181 in addition to the light projecting unit 130 and the reflecting unit 180 described above as a configuration for irradiating the component 40 with luminance change light.

  The light projecting unit 131 has a function of emitting luminance change light, similar to the light projecting unit 130. Similarly to the reflector 180, the reflector 181 has a function of irradiating the component 40 with incident luminance change light at a predetermined angle with respect to the imaging optical axis A1.

  The light projecting unit 131 is disposed such that the light projection axis A3 and the imaging optical axis A1 intersect in the lens group space 151. Specifically, in the light projecting unit 131, the light projecting axis A3 that is the optical axis of the luminance change light emitted from the light projecting unit 131 is different from the light projecting axis A2 from the light projecting unit 130 and the imaging optical axis A1. They are arranged in a line-symmetric relationship with the center.

  The projection axis A3 includes the first peripheral region 153b (see FIGS. 5A and 5B) of the first lens 153, the intermediate lens group 160, and the second peripheral region 154b of the second lens 154 (FIGS. 6A and 6B). ) And reach the reflecting portion 181.

  That is, the luminance change light from the light projecting unit 131 passes through the lens group 150, is output from the lens group 150 as parallel light, and is reflected by the reflecting unit 181, thereby being reflected on the component 40 that is the measurement target. Irradiated.

  Further, the reflection unit 181 is provided so that the luminance change light from the light projecting unit 131 is irradiated to the component 40 at the same angle θ (for example, 30 °) as the angle θ of the light projecting axis A2 with respect to the imaging optical axis A1. ing.

  As described above, the three-dimensional shape measuring apparatus 10 has a configuration capable of irradiating the measurement object with the luminance change light from both sides in the second direction (X-axis direction) with the imaging optical axis A1 as the center. It is possible to obtain imaging data under the irradiation of the luminance changing light by the light unit 130 and imaging data under the irradiation of the luminance changing light by the light projecting unit 130.

  As a result, for example, while removing the influence of the shadow generated on the surface of the measurement object by irradiating the measurement object with the luminance change light from an oblique direction, the high speed of the three-dimensional shape of the measurement object by the phase shift method In addition, highly accurate measurement is possible.

  As described above, the component mounting board production apparatus and the three-dimensional shape measurement apparatus of the present invention have been described based on the embodiment and its supplement. However, the present invention is not limited to the embodiment and its supplement. Without departing from the gist of the present invention, various modifications conceived by those skilled in the art can be applied to the present embodiment and its supplements, or forms constructed by combining a plurality of constituent elements described above. It is included in the range.

  For example, the imaging unit 200, the light projecting unit 130, the lens group 150, and the reflecting unit 180 may be moved with respect to the measurement object (component 40) whose position is fixed by stopping the head 100. Even in this way, the luminance distribution of the light on the surface of the measurement target is maintained with respect to the measurement target while maintaining the luminance cycle of the luminance change light whose luminance changes in the second direction (X-axis direction). Can be relatively moved in the second direction (X-axis direction).

  In addition, the physical position of the light projecting unit 130 is fixed, and the measurement object is maintained while maintaining the period of the luminance in the luminance changing light by controlling the operation of the filter or the reflecting member that generates the luminance changing light. The luminance distribution of light on the surface of the object may be moved relatively in the second direction (X-axis direction) so as to scan the measurement object.

  That is, if the stripe pattern of the light due to the luminance change light that appears on the surface of the measurement object is moved in the second direction (X-axis direction), the measurement object and other components such as the imaging unit 200 Any of these may be moved or operated.

  As described above, when the imaging unit 200, the light projecting unit 130, the lens group 150, and the reflecting unit 180 are moved with respect to the component 40 whose position is fixed at the time of imaging of the component 40 that is the measurement target, A mechanism or software for moving the imaging unit 200 or the like functions as a moving unit in the component mounting board production apparatus and the three-dimensional shape measurement apparatus of the present invention.

  In addition, as described above, when imaging the component 40 that is the measurement target, the operation of the filter or the reflection member that generates the luminance change light included in the light projecting unit 130 is controlled with respect to the component 40 whose position is fixed. In this case, a mechanism or software for performing the control functions as a moving unit in the component mounting board production apparatus and the three-dimensional shape measurement apparatus of the present invention.

  Further, in the present embodiment, the luminance change light emitted from the light projecting unit 130 passes through all the lenses included in the lens group 150 (see FIG. 4). However, the luminance change light emitted from the light projecting unit 130 does not have to pass through all the lenses included in the lens group 150.

  For example, the luminance change light emitted from the light projecting unit 130 may be reflected by the reflecting unit 180 without passing through the second lens 154 and irradiated onto the component 40 that is the measurement object. In this case, for example, by making the reflection surface of the reflection unit 180 a curved surface that is recessed outward with respect to the imaging optical axis A1, the luminance change light can be irradiated onto the component 40 as parallel light.

  Moreover, in this Embodiment, the component mounting apparatus 20 was illustrated as a component mounting board production apparatus. However, the component mounting board production apparatus is not limited to the component mounting apparatus 20 that mounts a component on a board, and any apparatus that contributes to the production of a component mounting board such as a solder printing apparatus and an inspection apparatus can be used. Included in production equipment.

  For example, the inspection apparatus includes an apparatus having the same function as that of the three-dimensional shape measuring apparatus 10, so that a board on which solder is printed or a board on which components are mounted is moved by a moving unit such as a conveyor, a plate, or a table. However, when inspecting the board, it is inspected whether the solder is printed at the correct position or the component is mounted in the correct position at the correct position while eliminating the influence of vibration caused by the movement. be able to.

  In this case, the measurement object is a board, printed solder, or a component mounted on the board.

  INDUSTRIAL APPLICABILITY The present invention is useful as a component mounting board production apparatus and a three-dimensional shape measurement apparatus that can achieve both measurement of a three-dimensional shape using a phase shift method and miniaturization.

DESCRIPTION OF SYMBOLS 10 3D shape measuring apparatus 20 Component mounting apparatus 30 Board | substrate 40 Components 100 Head 110 Nozzle 130, 131 Light projection part 135 Light source 136 Reflective member 150 Lens group 151 Lens group space 153 First lens 153a First main area 153b First peripheral area 154 Second lens 154a Second main region 154b Second peripheral region 160 Intermediate lens group 164a, 164b, 164c Relay lens 166 Aperture unit 180, 181 Reflection unit 200 Imaging unit 210 Area image sensor 211 Pixel 300 Component supply unit 310 Component cassette

Claims (5)

A component mounting board production apparatus for producing a component mounting board on which components are mounted,
An imaging unit in which pixels for imaging are arranged in a matrix;
Luminance that is light having a luminance distribution in which the luminance is uniform along the first direction in the imaging target region of the imaging unit and the luminance periodically changes according to the position in the second direction intersecting the first direction. A light projecting unit that emits change light;
A moving unit that moves the luminance distribution of the luminance change light on the surface of the measurement object in the second direction relative to the measurement object while maintaining the luminance period of the luminance change light;
A lens group including a plurality of lenses arranged side by side in a third direction intersecting both the first direction and the second direction, the imaging unit and the measurement object in the third direction; A lens group that is disposed at a position between the lens unit and the imaging unit to form an image of the measurement object;
Reflecting the luminance change light emitted from the light projecting unit and passing through the lens group space where the lens group is arranged, the luminance change light is reflected at a predetermined angle with respect to the imaging optical axis of the imaging unit. A reflective portion for irradiating the measurement object,
The light projecting unit is arranged such that a light projecting axis that is an optical axis of the luminance change light emitted from the light projecting unit and the imaging optical axis intersect in the lens group space. Production equipment. The plurality of lenses includes a first lens disposed at a position closest to the imaging unit in the third direction,
The light projecting unit is a first peripheral region of the first lens, the first peripheral region being a peripheral region of the first main region through which light imaged in the imaging unit passes, and the light projecting unit. The component mounting board production apparatus according to claim 1, wherein the shaft is disposed so as to pass therethrough. The lens group includes a second lens disposed at a position closest to the measurement object in the third direction among the plurality of lenses.
The light projecting unit is a second peripheral region which is a second peripheral region of the second lens, and a second peripheral region which is a peripheral region of a second main region through which light imaged in the imaging unit passes. The component mounting board production apparatus according to claim 2, wherein the light projecting axis that has passed through the peripheral region is arranged to pass. An imaging unit in which pixels for imaging are arranged in a matrix;
Luminance that is light having a luminance distribution in which the luminance is uniform along the first direction in the imaging target region of the imaging unit and the luminance periodically changes according to the position in the second direction intersecting the first direction. A light projecting unit that emits change light;
A moving unit that moves the luminance distribution of the luminance change light on the surface of the measurement object in the second direction relative to the measurement object while maintaining the luminance period of the luminance change light;
A lens group including a plurality of lenses arranged side by side in a third direction intersecting both the first direction and the second direction, the imaging unit and the measurement object in the third direction; A lens group that is disposed at a position between the lens unit and the imaging unit to form an image of the measurement object;
Reflecting the luminance change light emitted from the light projecting unit and passing through the lens group space where the lens group is arranged, the luminance change light is reflected at a predetermined angle with respect to the imaging optical axis of the imaging unit. A reflective portion for irradiating the measurement object,
The light projecting unit is arranged such that a light projecting axis, which is an optical axis of the luminance change light emitted from the light projecting unit, and the imaging optical axis intersect in the lens group space. measuring device. In the imaging target area of the imaging unit in which pixels for imaging are arranged in a matrix, the luminance is uniform along the first direction, and the luminance is periodic according to the position in the second direction intersecting the first direction. A light projecting step in which the light projecting unit emits luminance change light, which is light having a luminance distribution that changes with time,
A movement step of moving the luminance distribution of the luminance change light on the surface of the measurement object in the second direction relative to the measurement object while maintaining the luminance period in the luminance change light;
A lens group including a plurality of lenses arranged side by side in a third direction intersecting both the first direction and the second direction, the imaging unit and the measurement object in the third direction; An imaging step in which the imaging unit images the measurement object via a lens group that is disposed at a position between the lens unit and forms an image of the measurement object in the imaging unit;
Reflecting the luminance change light emitted from the light projecting unit and passing through the lens group space where the lens group is arranged, the reflection unit reflects the luminance change light with respect to the imaging optical axis of the imaging unit. Irradiating the measurement object at an angle, and
In the imaging step, the imaging unit images the measurement object during the period in which the luminance change light is irradiated on the measurement object in the irradiation step;
The light projecting unit is arranged such that a light projecting axis, which is an optical axis of the luminance change light emitted from the light projecting unit, and the imaging optical axis intersect in the lens group space. Measuring method.

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