JP2013162017A - Electric component box and air conditioner - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electric power conversion system and an air conditioner which achieve further cost reduction of an electric component box incorporating multiple semiconductor devices having different allowable temperatures.SOLUTION: An electric component box includes: a housing 1; a printed board 4 where a semiconductor device 2 having a relatively high allowable temperature and a semiconductor device 3 having an allowable temperature lower than that of the semiconductor device 2 are mounted, the printed board 4 provided in the housing 1 so that the semiconductor devices 2, 3 face an air channel side surface of the housing 1; an opening 10 formed on the air channel side surface of the housing 1 so that a non-substrate side surface of the semiconductor device 3 is exposed to the air channel side A of the housing 1; and a radiator 5 covering the opening 10 and connected with the non-substrate side surface of the semiconductor device 3.

Description

  The present invention relates to an electrical component box including a printed circuit board on which a semiconductor device having a high permissible temperature and a semiconductor device having a permissible temperature lower than that of the semiconductor device are mounted, and an air conditioner equipped with the electrical component box.

  In recent years, wide band gap semiconductor devices such as SiC (silicon carbide) and GaN (gallium nitride) have been put into practical use in the field of power conversion devices due to the demand for high-power and high-frequency electronic devices. Wide bandgap semiconductor devices are attracting attention as new devices with features such as high-speed operation, low loss, and improved heat resistance. The operating temperature of conventional semiconductor devices such as Si is 100 ° C. While it is around, it is as high as 200-300 ° C. When a plurality of semiconductor devices having different allowable temperatures are employed in a power conversion device such as an inverter device, it is necessary to employ a cooling structure in which the temperature of each semiconductor device is equal to or lower than the allowable temperature. As an example of the cooling structure, for example, each of these semiconductor devices can be cooled by being attached to one heat radiator (such as a heat sink). In such a structure, when each semiconductor device is provided close to each other, a wide area is provided. There is a possibility that the heat of the band gap semiconductor device is transferred to the semiconductor device such as Si through the heat radiating body and has a thermal influence. In consideration of such influences, for example, in the prior art disclosed in Patent Document 1 below, separate heat dissipators are attached to a plurality of semiconductor devices having different allowable temperatures.

JP 2010-172183 A (FIG. 2)

  The prior art disclosed in the above-mentioned patent documents requires a semiconductor device having a low allowable temperature on the upstream side of forced convection and a semiconductor device having a high allowable temperature on the downstream side of forced convection. Although cooling performance has been realized, it is necessary to attach a heat sink of the same degree to any semiconductor device, so there are many parts required for cooling, and power converters in which these semiconductor devices are adopted, that is, these semiconductors There was a problem that it was not possible to meet the need to further reduce the cost of the electrical component box in which the device was built.

  The present invention has been made in view of the above, and obtains an electrical component box and an air conditioner capable of further reducing the cost of an electrical component box incorporating a plurality of semiconductor devices having different allowable temperatures. For the purpose.

  In order to solve the above-described problems and achieve the object, the present invention is provided with a casing configured in a rectangular parallelepiped shape, and a component surface facing the air path side surface of the casing in the casing, A first semiconductor device having a relatively high permissible temperature and a second semiconductor device having a permissible temperature lower than that of the first semiconductor device are mounted, and these semiconductor devices face the air path side surface of the housing. A printed circuit board provided in the housing, an opening formed on the air path side surface of the housing so that the opposite side surface of the second semiconductor device is exposed to the air path side of the housing, and And a heat radiator that covers the opening and is thermally connected to the opposite side surface of the second semiconductor device.

  According to the present invention, the number of heat dissipators of the semiconductor device is reduced by conducting heat from the semiconductor device having a high allowable temperature to the electrical component box, so that a plurality of semiconductor devices having different allowable temperatures are incorporated. There is an effect that it is possible to further reduce the cost of the electrical component box.

FIG. 1 is a configuration diagram of an electrical component box according to the first embodiment of the present invention. FIG. 2 is a longitudinal sectional view of the electrical component box according to the first embodiment of the present invention. FIG. 3 is a configuration diagram of an electrical component box according to the second embodiment of the present invention. FIG. 4 is a structural diagram of the heat dissipating body shown in FIG. FIG. 5 is a structural diagram of the holding member shown in FIG. FIG. 6 is a configuration diagram of an outdoor unit on which the electrical component box according to the first and second embodiments is mounted.

  Embodiments of an electrical component box and an air conditioner according to the present invention will be described below in detail with reference to the drawings. Note that the present invention is not limited to the embodiments.

Embodiment 1 FIG.
FIG. 1 is a configuration diagram of an electrical component box according to the first embodiment of the present invention, and FIG. 2 is a longitudinal sectional view of the electrical component box according to the first embodiment of the present invention. The electrical component box mainly includes a housing 1 configured in a rectangular parallelepiped shape, and a printed circuit board 4 provided in the housing 1 so that the component surface 4a faces the air path side surface 1a of the housing 1; The semiconductor device 2 having a high allowable temperature mounted on the component surface 4 a of the printed circuit board 4, and mounted on the component surface 4 a of the printed circuit board 4 close to the semiconductor device 2, and the allowable temperature is higher than the allowable temperature of the semiconductor device 2. The lower semiconductor device 3, the opening 10 formed in the air passage side surface 1 a of the housing 1 so that the opposite side surface 3 b of the semiconductor device 3 is exposed to the air passage side of the housing 1, and the opening 10 is covered. And the heat radiator 5 connected to the non-board | substrate side surface 3b of the semiconductor device 3 is comprised. In FIG. 1, the semiconductor device 2 and the semiconductor device 3 are provided close to each other, but the locations of the semiconductor device 2 and the semiconductor device 3 are not limited to the positions shown in FIG.

  The semiconductor device 2 is provided on the component surface 4 a of the printed circuit board 4 so that the non-substrate side surface 2 b faces the air path side surface 1 a of the housing 1. The semiconductor device 3 is provided on the component surface 4 a of the printed circuit board 4 so that the non-substrate side surface 3 b is exposed from the opening 10 to the air path side A of the housing 1. The non-substrate side surface 3 b of the semiconductor device 3 is disposed on the same plane as the air path side surface 1 a of the housing 1, for example.

  The semiconductor device 2 is composed of a wide band gap semiconductor such as SiC or GaN, and constitutes a power conversion unit composed of, for example, an IGBT or a feedback diode. The semiconductor device 3 is composed of a semiconductor such as Si, For example, it constitutes a PWM signal generation unit that generates a drive signal for PWM driving the IGBT. In an electrical component box in which these semiconductor devices 2 and 3 are built in, for example, the semiconductor device 3 controls the semiconductor device 2, so that a commercial power source is converted into direct current by a converter unit (not shown) in the semiconductor device 2. The direct current is converted into alternating current of a desired frequency by an inverter unit (not shown) in the semiconductor device 2 and supplied to an electric motor (not shown) built in the compressor 32 described later.

  The printed circuit board 4 is disposed such that the component surface 4 a on which the semiconductor devices 2 and 3 are mounted faces the air path side surface 1 a of the housing 1. As a method for attaching the printed circuit board 4, for example, the printed circuit board 4 is installed on the air path side surface 1 a of the housing 1 via a plurality of supporters 6. The supporter 6 simply fixes the printed circuit board 4 to the housing 1 and prevents the printed circuit board 4 from being bent to the air passage side surface 1 a of the housing 1. In FIG. 2, the supporter 6 is provided near the end of the printed circuit board 4 as an example, but the position and number of the supporters 6 are not limited to this.

  The printed circuit board 4 is formed with a hole 4c into which a screw 7 inserted from the inside of the housing 1 toward the air path side A can be inserted at a position facing the substrate side surface 2a of the semiconductor device 2. The semiconductor device 2 has an insertion hole 2c for a screw 7 inserted through the hole 4c. An insertion hole 1 b for a screw 7 is formed in the air passage side surface 1 a of the housing 1. The insertion hole 1 b is formed on an extension of a line passing through the approximate center of the insertion hole 2 c of the semiconductor device 2 at a position facing the opposite side surface 2 b of the semiconductor device 2. In the electrical component box according to the first embodiment, the holes 4c, the insertion hole 2c, and the insertion hole 1b are formed on an extension of a line that passes through the approximate center of the insertion hole 2c of the semiconductor device 2. Then, after the screws 7 are inserted into the holes from the inside of the housing 1 toward the air passage side A, the nuts 8 are fastened to the screw portions 7 a of the screws 7 on the air passage side A of the housing 1. As a result, the non-substrate side surface 2b of the semiconductor device 2 and the air path side surface 1a of the housing 1 are in surface contact, and the housing 1 and the semiconductor device 2 are thermally connected. In FIG. 1, the nut 8 is used as an example, but the nut 8 is not necessary when the housing 1 can be tapped.

  The printed circuit board 4 is provided with a hole 4 d into which a screw 71 inserted from the inside of the housing 1 toward the air path side A can be inserted at a position facing the substrate side surface 3 a of the semiconductor device 3. The semiconductor device 3 is formed with an insertion hole 3c of a screw 71 inserted through the hole 4d. The opening 10 described above is formed on the air passage side surface 1 a of the housing 1. The heat radiating body 5 is formed in such a size that the outer edge of the semiconductor device side surface 5a covers the entire opening 10, and flows through the air path side surface 1a of the housing 1 by driving a fan (not shown), for example. Arranged on the air path. On the semiconductor device side surface 5 a of the radiator 5, a hole into which the screw portion 71 a of the screw 71 can be screwed is formed. In the electrical component box according to the first embodiment, after the screw 71 is inserted from the inside of the housing 1 toward the air path side A into these holes, the screw portion 71 a is screwed into the heat radiator 5. Thereby, the non-substrate side surface 3b of the semiconductor device 3 and the heat radiating body 5 are thermally connected.

  As described above, the electrical component box according to the first embodiment includes the casing 1 configured in a rectangular parallelepiped shape, and the component surface 4 a faces the air passage side surface 1 a of the casing 1 in the casing 1. The first semiconductor device (semiconductor device 2) having a relatively high allowable temperature and the second semiconductor device (semiconductor device 3) having a lower allowable temperature than the semiconductor device 2 are mounted, and these semiconductors are mounted. The printed circuit board 4 provided in the housing 1 so that the device faces the air path side surface 1 a of the housing 1 and the non-substrate side surface 3 b of the semiconductor device 3 are exposed to the air path side A of the housing 1. Since the opening 10 formed in the air passage side surface 1a of the body 1 and the heat radiating body 5 covering the opening 10 and connected to the non-substrate side surface 3b of the semiconductor device 3 are provided. Body 1 serves as a cooling means for semiconductor device 2 And ability, the heat radiator 5 functions as cooling means a lower allowable temperature semiconductor devices 3. Therefore, the radiator 5 can be effectively cooled without providing the semiconductor device 2 with a cooling means equivalent to the radiator 5. As a result, the cost of the electrical component box can be reduced as compared with the case where the semiconductor devices 2 and 3 are provided with individual cooling means. Further, when the semiconductor device 2 is provided with a cooling means equivalent to the radiator 5, a hole equivalent to the opening 10 is formed in the air passage side surface 1 a of the housing 1 (an anti-air passage of the cooling means for the semiconductor device 2). However, according to the electrical component box of the first embodiment, it is necessary to provide such an opening. There is no. Therefore, compared with the case where the opening for the semiconductor device 2 is provided, the processing man-hours of the housing 1 can be reduced, and dust or water that may enter the housing 1 from the outside of the housing 1 may be used. Costs associated with such measures can also be suppressed.

Embodiment 2. FIG.
Although the electrical component box of the first embodiment is configured to connect the semiconductor device 2 to the housing 1, the electrical component box of the second embodiment can enhance the heat dissipation effect of the semiconductor device 2. It is configured. Hereinafter, the same reference numerals are given to the same parts as those in the first embodiment, and the description thereof is omitted, and only different parts will be described here.

  3 is a configuration diagram of the electrical component box according to the second embodiment of the present invention, FIG. 4 is a structural diagram of the radiator 11 shown in FIG. 3, and FIG. 5 is a holding member shown in FIG. FIG.

  The difference from the first embodiment is that the opening 40 is formed in the air passage side surface 1a of the housing 1 so that the non-substrate side surface 2b of the semiconductor device 2 is exposed to the air passage side A of the housing 1. The heat dissipating member 11 that covers the opening 40 and is connected to the opposite side surface 2b of the semiconductor device 2 is provided, and the hole 4c of the printed circuit board 4 is omitted.

  The radiator 11 is formed by bending, for example, a flexible rectangular plate-like elastic material (for example, aluminum or stainless steel). The flat surface portion 11e of the heat radiating body 11 forms a central portion of a rectangular plate-like elastic material, and the flatness is controlled so that the contact area with the semiconductor device 2 is widened. A plurality of through holes 11f are formed in the flat surface portion 11e for allowing engagement portions 12a of the holding member 12 described later to pass therethrough.

  At both ends of the radiator 11 in the longitudinal direction, the flat surface portion 11e is pressed against the semiconductor device 2 to be deformed from a natural state, and an elastic restoring force is accumulated. The urging portions 11c and 11d for urging in the direction are formed.

  One end 11a and the other end 11b of the heat dissipating body 11 are disposed offset to the air path side A (anti-semiconductor device side) from the extension line of the flat portion 11e. One end 11 a of the radiator 11 is fixed to the housing 1 positioned between the semiconductor device 2 and the semiconductor device 3 with screws 72 a, for example, and the other end 11 b of the radiator 11 is connected to the semiconductor device 2 and the semiconductor device 3, for example. It fixes to the housing | casing 1 located on the opposite side to between by the screw 72b.

  The attachment of the radiator 11 will be described. The anti-substrate side surface 3b of the semiconductor device 3 is arranged offset to the printed circuit board 4 side from the extension line of the air passage side surface 1a of the housing 1 as shown in FIG. Has been. Here, since the one end 11a and the other end 11b of the heat dissipating body 11 are arranged offset to the air passage side A from the extension line of the flat surface portion 11e as described above, the flat surface portion of the heat dissipating body 11 is relatively disposed. 11e is located closer to the semiconductor device 2 than on the extended line of the planar portion 11e. Therefore, the semiconductor device 2 is pressed against the flat surface portion 11e in the process in which the screws 72a and 72b are fastened at the one end 11a and the other end 11b of the radiator 11 set in the opening 40. At this time, an elastic restoring force is stored in the urging portions 11c and 11d. Therefore, when the fastening of the screws 72a and 72b is completed, the mechanical and thermal connection between the flat surface portion 11e of the radiator 11 and the semiconductor device 2 is maintained by this elastic restoring force. Furthermore, since the one end 11a and the other end 11b of the radiator 11 are mechanically and thermally connected to the air passage side surface 1a of the casing 1, the casing 1 and the semiconductor device 2 are thermally connected. . Thus, in the electrical component box of the second embodiment, the thermal connection between the semiconductor device 2 and the housing 1 is maintained without using the fastening members such as the screws 7 and nuts 8 of the first embodiment. Is possible.

  The holding member 12 shown in FIG. 4 is a member having a letter C shape made of an insulating synthetic resin such as polyethylene or polypropylene. As the material of the holding member 12, an optimum material is selected according to necessary insulation performance and heat resistant temperature. The base portion 12 b of the holding member 12 has a plate shape parallel to the flat portion 11 e of the radiator 11 and is formed to be larger than the area of the non-substrate side surface 2 b of the semiconductor device 2. At the center portion of the base portion 12b, when the holding member 12 is engaged with the substrate side surface 2a of the semiconductor device 2 via the radiator 11, the flat portion 11e of the radiator 11 can be pressed from the air path side A. In addition, a mountain portion 12d that protrudes toward the opposite wind path side B is formed.

  Both ends of the base portion 12b of the holding member 12 are bent toward the anti-air path side B, and are opposed to each other at positions that are approximately the same length as the sum of the thickness of the semiconductor device 2 and the thickness of the radiator 11. It is formed in a bent claw shape. The front end portion 12c of the claw-like engaging portion 12a is opposed to the printed circuit board 4 when the holding member 12 is attached to the radiator 11, and the outer shape of the front end section 12c when projected onto the printed circuit board 4 is It is formed in substantially the same manner as the through hole 11 f of the radiator 11.

  The attachment of the holding member 12 configured as described above will be described with reference to FIG. As described above, when the fastening of the screws 72a and 72b is completed, the mechanical and thermal connection between the flat surface portion 11e of the radiator 11 and the semiconductor device 2 is the elastic restoring force of the biasing portions 11c and 11d. Maintained by. Thereafter, the holding member 12 is fitted from the air path side A of the radiator 11 toward the semiconductor device 2, and the tip 12 c of the engaging portion 12 a is caught on the end surface of the semiconductor device 2 (the outer peripheral edge of the substrate side surface 2 a of the semiconductor device 2). . As a result, the flat portion 11 e of the radiator 11 is pressed by the peak portion 12 d of the holding member 12. Accordingly, the elastic restoring force of the radiator 11 is assisted, and the semiconductor device 2 is prevented from being displaced.

  In FIG. 3, after the opening 40 is provided on the air path side A of the semiconductor device 2, the radiator 11 is attached to the outer edge of the opening 40 (the air path side surface 1 a of the housing 1) by screws 72 a and 72 b. Although the fixed example is shown, you may comprise so that the heat radiator 11 may be attached to the housing | casing 1 by a rivet, welding, etc. instead of the screws 72a and 72b. In this case, although the attachment and detachment of the heat radiator 11 is poor, the heat generated in the semiconductor device 2 can be radiated outside the apparatus by the housing 1 as in the case where the screws 72a and 72b are used.

  As described above, in the electrical component box according to the second embodiment, the anti-substrate side surface 3b of the semiconductor device 2 is exposed to the air path side A of the housing 1 on the air path side surface 1a of the housing 1. A pair of opposing sides of the four sides of the flexible rectangular plate-like material disposed in the opening 40 so as to be in contact with the formed substrate 40 and the opposite side surface 2b of the semiconductor device 2 A heat sink 11 formed by bending, and the heat sink 11 is provided at the center of the pair of sides and is a flat first that is thermally connected to the anti-substrate side surface 3b of the semiconductor device 3. Are formed between the plane portion 11e and the air passage side surface 1a of the housing 1 on one side of the pair of sides, and the plane portion 11e is formed on the semiconductor device 2. The elastic restoring force is accumulated by being deformed from the natural state by being pressed against the A second connection portion (one end 11a and one end) that is formed so as to urge the flat portion 11e toward the semiconductor device 2 by elastic restoring force and is thermally connected to the air passage side surface 1a and the flat portion 11e of the housing 1. The biasing portion 11d) is formed between the plane portion 11e and the air passage side surface 1a of the housing 1 on the other side of the pair of sides, and the plane portion 11e is pressed against the semiconductor device 2. Accordingly, the elastic restoring force is accumulated by being deformed from the natural state, and the flat portion 11e is urged toward the semiconductor device 2 by the elastic restoring force, and the air passage side surface 1a of the housing 1 and Since the third connecting portion (the other end 11b and the urging portion 11c) thermally connected to the flat portion 11e is formed, the machine between the flat portion 11e of the radiator 11 and the semiconductor device 2 is formed. Mechanical and thermal connection by elastic restoring force It is maintained. Furthermore, since the one end 11a and the other end 11b of the radiator 11 are mechanically and thermally connected to the air passage side surface 1a of the casing 1, the casing 1 and the semiconductor device 2 are thermally connected. . Therefore, the thermal connection between the semiconductor device 2 and the housing 1 can be maintained without using a fastening member such as the screw 7 or the nut 8 of the first embodiment. Since it is not necessary to use fastening members such as the screws 7 and nuts 8 of the first embodiment, workability such as replacement of the printed circuit board 4 is improved. Further, since the bent portion of the radiator 11 functions as a cooling means for the semiconductor device 2, it is possible to cool the semiconductor device 2 more effectively than in the first embodiment.

  In addition, a plurality of through holes 11f are formed in the flat surface portion 11e of the heat radiating body 11, have a cross-sectional C shape, and are mounted from the air passage side A of the heat radiating body 11 toward the flat surface portion 11e. The parallel base portion 12b is bent toward the through hole 11f, and a claw-like engaging portion 12a that extends to the substrate side surface 2a of the semiconductor device 2 through the through hole 11f and can be engaged with the substrate side surface 2a is formed. Since the insulating holding member 12 is provided, the holding member 12 is fitted from the air passage side A of the radiator 11 toward the semiconductor device 2, and the tip 12 c of the engaging portion 12 a is attached to the end surface of the semiconductor device 2. Get caught. Accordingly, the flat surface portion 11e of the heat radiating body 11 is pressed by the peak portion 12d of the holding member 12, and the elastic restoring force of the heat radiating body 11 is assisted, and the position shift of the semiconductor device 2 is prevented.

  In the electrical component box shown in FIG. 3, the opening 1 is formed in the housing 1 and the heat radiator 11 is provided so as to cover the opening 40. However, the opening 40 is not necessarily provided. . For example, the housing 1 at a position facing the semiconductor device 2 is formed in a concave shape that protrudes from the air path side A of the housing 1 toward the semiconductor device 2 side, and the concave top portion (corresponding to the flat surface portion 11e). A portion between the concave base portion (corresponding to the outer edge portion of the opening 40) may be processed in the same manner as the urging portions 11c and 11d. As described above, in the electrical component box according to the second embodiment, the air passage side surface 1a of the housing 1 protrudes from the air passage side A of the housing 1 toward the semiconductor device 2 side. The portion between the top of the concave semiconductor device 2 and the base of the concave housing 1 is deformed from a natural state when the top is pressed against the semiconductor device 2. The elastic restoring force is accumulated, and the elastic restoring force is formed so as to urge the top portion in the direction of the semiconductor device 2, so that the elastic restoring force is compared with the case where the opening 40 and the radiator 11 are provided. Although somewhat small, mechanical and thermal connection between the planar portion 11e of the heat dissipating body 11 and the semiconductor device 2 can be secured, and the number of processing steps for the opening 40 can be reduced.

Embodiment 3 FIG.
FIG. 6 is a configuration diagram of the outdoor unit 30 on which the electrical component box 100 according to the first and second embodiments is mounted. FIG. 6 shows an outdoor unit 30 of the air conditioner. Inside the outdoor unit 30, a fan 31, a compressor 32, and a fan are arranged to face a compressor 32 and a heat exchanger (not shown). An electrical component box 100 or the like that houses a control board that drives and controls 31 and the like is installed. The electrical component box 100 corresponds to the casing 1 according to the first and second embodiments. The electrical component box 100 includes various control boards other than the printed board 4 shown in FIG. The heat-radiating body 5 is provided. And the electrical component box 100 is arrange | positioned so that the ventilation by the fan 31 may hit the heat radiator 5. FIG. By doing so, the cooling capacity of the radiator 5 is improved.

  In the electrical component box 100 arranged in this way, when the semiconductor device 3 such as a PWM signal generation unit operates to drive the compressor 32, the operating temperature is absorbed by the radiator 5. Further, the semiconductor device 2 composed of power elements such as IGBTs and feedback diodes operates, and the operating temperature reaches 200 to 300 ° C., but the heat generated by the semiconductor device 2 is generated by the housing of the electrical component box 100 (housing). Therefore, the semiconductor device 2 is cooled in the entire casing.

  As described above, the air conditioner according to the third embodiment includes an indoor unit (not shown) having a blower fan, the electrical component box according to the first and second embodiments, and the compressor 32 that compresses the refrigerant. Since the heat exchanger for performing heat exchange between the refrigerant and the outside air and the outdoor unit 30 having the fan 31 for sending outside air to the heat exchanger are provided, further cost reduction and improvement in maintainability can be achieved. It is possible to plan.

  Note that the electrical component box and the air conditioner according to the embodiment of the present invention show an example of the contents of the present invention, and can be combined with another known technique. Of course, it is possible to change and configure such as omitting a part without departing from the gist.

  As described above, the present invention can be applied to an electrical component box and an air conditioner, and in particular, an invention capable of further reducing the cost of an electrical component box in which a plurality of semiconductor devices having different allowable temperatures are incorporated. Useful as.

DESCRIPTION OF SYMBOLS 1 Case 1a Air path side surface 1b, 2c, 3c Insertion hole 2 Semiconductor device (1st semiconductor device)
2a, 3a Substrate side surface 2b, 3b Non-substrate side surface 3 Semiconductor device (second semiconductor device)
4 Printed Circuit Board 4c, 4d Hole 5, 11 Heat Dissipator 5a Semiconductor Device Side 6 Supporter 7, 71, 72a, 72b Screw 7a, 71a Screw Part 8 Nut 10, 40 Opening 11 Heat Dissipator 11a One End (Second Connection Part)
11b The other end (third connection part)
11c Energizing part (third connection part)
11d Energizing part (second connecting part)
11e Plane part (first connection part)
11f Through hole 12 Holding member 12a Engagement part 12b Base part 12c Tip part 12d Mountain part 30 Outdoor unit 31 Fan 32 Compressor 100 Electrical box A Air path side B Anti-air path side

Claims (6)

A housing configured in a rectangular parallelepiped shape;
A first semiconductor device having a relatively high permissible temperature and a second permissible temperature lower than that of the first semiconductor device are provided so that a component surface faces the air path side surface of the housing within the housing. A semiconductor device is mounted, and a printed circuit board provided in the housing so that these semiconductor devices face the air path side surface of the housing,
An opening formed on the air passage side surface of the housing such that the side opposite to the substrate side of the second semiconductor device is exposed to the air passage side of the housing;
A radiator that covers the opening and is thermally connected to the side opposite to the substrate of the second semiconductor device;
An electrical component box characterized by comprising: The air passage side surface of the housing is formed in a concave shape in which a portion facing the first semiconductor device protrudes from the air passage side of the housing toward the first semiconductor device side,
The portion between the concave top portion on the first semiconductor device side and the concave base portion on the housing side is:
When the top portion is pressed against the first semiconductor device, it is deformed from a natural state and an elastic restoring force is accumulated, and the elastic restoring force biases the top portion toward the first semiconductor device. The electrical component box according to claim 1, wherein the electrical component box is formed. On the air path side surface of the housing, an opening formed so that the anti-substrate side surface of the first semiconductor device is exposed to the air path side of the housing, and the anti-substrate side surface of the first semiconductor device; A radiator formed by bending a pair of opposing sides of the four sides of the flexible rectangular plate-like material disposed in the opening so as to be in contact with each other;
The radiator is
A planar first connection portion provided at the center of the pair of sides and thermally connected to the opposite side surface of the second semiconductor device;
One side of the pair of sides is formed between the first connection portion and the air path side surface of the housing, and the first connection portion is pressed against the first semiconductor device. Accordingly, the elastic restoring force is accumulated by being deformed from the natural state, and the elastic connecting force is formed so as to bias the first connection portion toward the first semiconductor device. A second connection thermally connected to the airway side and the first connection;
The other side of the pair of sides is formed between the first connection portion and the air path side surface of the housing, and the first connection portion is pressed against the first semiconductor device. Accordingly, the elastic restoring force is accumulated by being deformed from the natural state, and the elastic connecting force is formed so as to bias the first connection portion toward the first semiconductor device. The electrical component box according to claim 1, wherein the electrical component box is formed of a side surface of the air passage and a third connection portion thermally connected to the first connection portion. A plurality of through holes are formed in the first connection portion of the heat radiator,
A cross-sectional C-shaped is formed, mounted from the air path side of the radiator to the first connection portion, bent from the base parallel to the first connection portion to the through hole side, and this penetration 4. The holding member having a claw-like engaging portion that extends to a substrate side surface of the first semiconductor device through a hole and is engageable with the substrate side surface. Electrical box.   The electrical component box according to claim 1, wherein the first semiconductor device is formed of a wide band gap semiconductor. An indoor unit having the blower fan;
An electrical component box according to any one of claims 1 to 5, a compressor that compresses a refrigerant, a heat exchanger that performs heat exchange between the refrigerant and outside air, and a fan that sends outside air to the heat exchanger. An outdoor unit having
An air conditioner characterized by comprising:

Images