JP2013133522A - Film deposition apparatus and particle capturing plate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a film deposition apparatus and a particle capturing plate capable of effectively suppressing peeling of a deposited film.SOLUTION: The film deposition apparatus 1 has the particle capturing plate 30 disposed in a vacuum vessel 3. A first unevenness 32, and a second unevenness 34 provided on the first unevenness 32 and finer than the first unevenness 32 are formed on a surface 30a of the particle capturing plate 30. Thus, peeling of a deposited film can be effectively suppressed.

Description

  The present invention relates to a film forming apparatus for forming a film forming material on a film forming material and a particle trap plate attached to the film forming apparatus.

  In film deposition equipment that forms thin films such as ITO (Indium Tin Oxide) films, film deposition atoms (film deposition materials) adhere to the inner walls of the substrate other than the film deposition material. Coarse particles called particles may accumulate on the inner wall. The film on which the particles are deposited may be peeled off from the inner wall of the film forming chamber, and the film is scattered and attached to the film forming chamber and the substrate, resulting in problems such as deterioration in film forming quality.

  Therefore, for example, in the film forming apparatus described in Patent Document 1, a shield member is arranged in the film forming chamber. The shield member has a plasma sprayed film made of aluminum or an aluminum alloy formed on the surface thereof, and the surface of the plasma sprayed film is roughened. Thereby, in the shield member, prevention of particle peeling is achieved.

  For example, in the film forming apparatus described in Patent Document 2, an electrolytic copper foil having an embossed surface having a Vickers hardness of 100 to 130 Hv is disposed inside the film forming chamber, and particle peeling is prevented by the electrolytic copper foil. .

JP 2008-291299 A JP 2001-234325 A

  However, in the above-described conventional configuration, the film forming material capturing function and the retention of the deposited film formed by the deposition of particles are not sufficient, and the deposited film is inevitably peeled off. Therefore, further improvement is desired regarding peeling of the deposited film.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a film forming apparatus and a particle trap plate that can effectively suppress peeling of a deposited film.

  As a result of intensive studies to solve the above problems, the present inventors have found that the film forming material can be effectively captured and held by making the surface to which the film forming material adheres into a specific shape. The present invention has been reached.

  That is, a film forming apparatus according to the present invention is a film forming apparatus including a film forming chamber for performing a film forming process for forming a film forming material on a film forming material, and includes particles disposed in the film forming chamber. A capture plate is provided, and on the surface of the particle capture plate, a first unevenness and a second unevenness that is provided on the first unevenness and is finer than the first unevenness are formed. To do.

  In this film forming apparatus, first irregularities and second irregularities finer than the first irregularities are formed on the surface of the particle capturing plate. In the particle trap plate, the surface area is enlarged by the first unevenness and the second unevenness, so that an adhesion surface of the film forming material is secured. Further, the film forming material can be effectively captured by the anchor effect of the fine second unevenness. Furthermore, the film-forming material (particles) captured by the second unevenness can be deposited and held by the first unevenness that is larger than the second unevenness. Therefore, the film forming material can be effectively captured and held. As a result, the peeling of the deposited film can be effectively suppressed.

  The 1st unevenness | corrugation is formed by the 1st process, and the 2nd unevenness | corrugation is formed by the 2nd process implemented after a 1st process. As described above, by performing the second processing after the first processing, the second unevenness is formed over the entire surface of the first unevenness.

  The first process is a knurling process, and the second process is an air blast process. By using such a processing method, the first unevenness and the second unevenness can be satisfactorily formed.

  The first unevenness is a twill formed by knurling. By setting the first unevenness as a rough eye, the surface area of the particle capturing plate can be increased, and as a result, the formation surface of the second unevenness is also increased. Therefore, it is possible to further secure a capture surface for the film forming material. In addition, the film formation material can be captured from a plurality of directions by using a rough eye.

  The particle capturing plate is preferably made of copper. By using a copper plate, the first unevenness and the second unevenness can be processed satisfactorily.

  The particle capturing plate preferably has a plate thickness of about 3 mm. Thus, rigidity can be secured by setting the plate thickness to 3 mm. Therefore, it is possible to satisfactorily perform the removal (cleaning) operation of the film forming material attached to the particle trap plate.

  The particle trap plate according to the present invention is a particle trap plate disposed in a film formation chamber of a film formation apparatus, and is provided with a first unevenness and a first unevenness on a surface thereof. Second irregularities finer than the irregularities are formed.

  In this particle capturing plate, first irregularities and second irregularities finer than the first irregularities are formed. Thereby, since the surface area is expanded by the first unevenness and the second unevenness, an adhesion surface of the film forming material is secured. Further, the film forming material can be effectively captured by the anchor effect of the fine second unevenness. Furthermore, the film-forming material (particles) captured by the second unevenness can be deposited and held by the first unevenness that is larger than the second unevenness. Therefore, the film forming material can be effectively captured and held. As a result, peeling of the deposited film can be suppressed.

  According to the present invention, peeling of the deposited film can be effectively suppressed.

It is a figure which shows the structure of the film-forming apparatus which concerns on one Embodiment. It is the figure which looked at the film-forming apparatus shown in FIG. 1 from the side. It is a figure which shows the surface of a particle capture plate. It is sectional drawing which expands and shows the surface of the particle capture plate shown in FIG. It is sectional drawing which shows the attachment structure of a particle capture plate and a cooling plate.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same or equivalent elements will be denoted by the same reference numerals, and redundant description will be omitted.

  FIG. 1 is a diagram illustrating a configuration of a film forming apparatus according to an embodiment. FIG. 2 is a side view of the film forming apparatus shown in FIG. The film forming apparatus 1 includes a vacuum vessel 3 that is a film forming chamber, a plasma gun 5 that is a plasma source that supplies a plasma beam PB into the vacuum vessel 3, and a plasma beam PB that is disposed at the bottom of the vacuum vessel 3. An incident anode member 7 and a transport mechanism 10 that is disposed above the vacuum vessel 3 and moves the tray T above the anode member 7 are provided.

  Here, the plasma gun 5 is a pressure gradient type plasma gun that generates a plasma beam PB. Between the plasma gun 5 and the vacuum vessel 3, intermediate electrodes 12 and 14 that guide the plasma beam PB to the vacuum vessel 3. A steering coil (not shown) and the like are arranged. The anode member 7 includes a hearth 16 having a hearth body 18 for guiding the plasma beam PB from the plasma gun 5 downward and containing a film forming material, and an annular auxiliary anode 20 disposed around the hearth. The transport mechanism 10 includes a plurality of rollers 24 arranged in the horizontal direction in the transport path 22, a driving device (not shown) that rotates the rollers 24 at an appropriate speed and moves the tray T at a constant speed. Is provided. A heater 26 for heating the glass substrate (film forming material) W is disposed in the transport path 22.

  In the film forming apparatus 1, a discharge is generated between the cathode (not shown) of the plasma gun 5 and the hearth 16 in the vacuum vessel 3, thereby generating a plasma beam PB. The plasma beam PB reaches the hearth 16 while being guided by a magnetic field determined by a steering coil, a permanent magnet in the auxiliary anode 20 or the like. A film forming material such as ITO (indium tin oxide) housed in the hearth body 18 is heated by the plasma beam PB to evaporate. The evaporated film forming material (evaporated particles) is ionized by the plasma beam PB and adheres to the surface of the glass substrate W exposed on the lower surface of the tray T that moves at a constant speed by the transport mechanism 10. A film such as an oxide) is formed.

  In the vacuum container 3 of the film forming apparatus 1 having the above configuration, the film forming material adheres to the inner side surface (inner wall) of the vacuum container 3 and particles (coarse particles) are deposited. If these particles are deposited to some extent, the particles (film) deposited from the inner surface of the vacuum vessel 3 may be peeled off and scattered in the vacuum vessel 3 and attached to the glass substrate W. Thereby, the problem that the glass substrate W is contaminated and quality deteriorates arises.

  Therefore, the film forming apparatus 1 includes a particle capturing plate 30 disposed in the vacuum container 3. The particle capturing plate 30 is disposed along the inner surface of the vacuum vessel 3 and has a function of capturing and holding the film forming material. The particle capturing plate 30 is a copper plate member, for example, and has a thickness of about 3 mm, for example. Hereinafter, the particle capturing plate 30 will be described in detail with reference to FIGS. 3 and 4.

  FIG. 3 is a view showing the surface of the particle capturing plate. FIG. 4 is an enlarged cross-sectional view showing the surface of the particle capturing plate shown in FIG.

  As shown in FIGS. 3 and 4, a first unevenness (first unevenness) 32 and a second unevenness (second unevenness) 34 are formed on the surface 30 a of the particle capturing plate 30. The first irregularities 32 are knurled eyelets formed by knurling. The knurled eye (English name: Knurling) is defined in JIS B 0951.

  As for the 1st unevenness | corrugation 32, the cross section of the convex part is exhibiting the substantially mountain shape. The pitch t of the first irregularities 32 is, for example, about 1.6 mm. The depth (height from the bottom to the top) h of the groove in the first unevenness 32 is, for example, about 0.7 mm. The first irregularities 32 are formed, for example, by pressing a knurled tool against the copper plate and crushing the surface of the copper plate to cause plastic deformation or cutting the surface of the copper plate.

  The second unevenness 34 is formed on the first unevenness 32. The second unevenness 34 is a fine unevenness formed by air blasting, and the unevenness is very small compared to the first unevenness 32. The second irregularities 34 are formed on the surface of the first irregularities 32 by air blasting after the first irregularities 32 are formed by knurling. That is, the surface of the first unevenness 32 (the surface 30a of the particle capturing plate 30) is a pear ground.

  The second unevenness 34 is preferably formed, for example, by colliding a projectile (for example, alumina) having a particle size of about 300 to 355 μm, and the center line average roughness Rz is preferably about 20 to 40 μm, for example. .

  The particle capturing plate 30 is disposed in the vacuum container 3 so that the surface 30 a on which the first unevenness 32 and the second unevenness 34 are formed faces the inside of the vacuum container 3. Specifically, the particle capturing plate 30 is disposed along the inner surface of the vacuum vessel 3 so as to surround the anode member 7.

  The back surface 30b opposite to the front surface 30a of the particle capturing plate 30 is a glossy surface (unprocessed surface). A cooling plate 40 is provided on the back surface 30b. The cooling plate 40 is a plate-like member having a thickness of about 5 mm, for example, and is disposed between the inner surface of the vacuum vessel 3 and the particle trap plate 30 in the vacuum vessel 3.

  The cooling plate 40 is attached to the particle capturing plate 30 with stud bolts 50 and cap nuts 52. FIG. 5 is an enlarged cross-sectional view showing a structure for attaching the particle capturing plate and the cooling plate. As shown in FIG. 5, the cooling plate 40 is disposed so that one surface 40 a faces the back surface 30 b of the particle capturing plate 30 and is in close contact with the back surface 30 b. Note that the term “adhesion” used here only means that the back surface 30b of the particle capturing plate 30 and the one surface 40a of the cooling plate 40 are at least in surface contact. With such a configuration, the cooling plate 40 is provided integrally with the particle capturing plate 30.

  When attaching the cooling plate 40 to the particle capturing plate 30, set the cooling plate 40, the particle capturing plate 30, the press washer 54 and the cap nut 52 in this order from the inner surface side of the vacuum vessel 3 to the stud bolt 50. The cap nut 52 is fastened to the stud bolt with a swab. The stat bolt 50 is provided with a nut 56, and a set screw 58 for preventing biting is attached to the nut 56.

  As shown in FIGS. 1 and 2, the cooling plate 40 is provided with a cooling pipe 42 through which a coolant (water) is passed. The cooling pipe 42 is disposed on the other surface 40 b side of the cooling plate 40. The cooling pipe 42 is disposed over the entire surface of the cooling plate 40. The cooling plate 40 and the cooling pipe 42 constitute a cooling mechanism.

  As described above, in this embodiment, the particle capturing plate 30 is disposed in the vacuum vessel 3. On the surface 30 a of the particle capturing plate 30, first irregularities 32 and second irregularities 34 that are finer than the first irregularities 32 are formed. In the particle capturing plate 30, the surface area is enlarged by the first unevenness 32 and the second unevenness 34, and the adhesion surface of the film forming material is secured. Further, the film forming material can be effectively captured by the anchor effect of the fine second unevenness 34. Furthermore, particles captured by the second unevenness 34 can be deposited and held by the first unevenness 32 having a larger unevenness than the second unevenness 34. Therefore, the film forming material can be effectively captured and held. As a result, the peeling of the deposited film can be effectively suppressed.

  Further, since the thickness of the particle capturing plate 30 is about 3 mm, rigidity is ensured. Therefore, the deposit removal operation can be performed satisfactorily. In addition, since the first unevenness 32 having a depth h of about 0.7 mm is formed on the particle capturing plate 30, the second unevenness 34 is formed by performing air blast processing on the first unevenness 32 during reproduction. That's fine. Therefore, the reproduction work can be easily performed. As a result, workability can be improved and costs can be reduced.

  Moreover, since the 1st unevenness | corrugation 32 is the eye which was formed by knurling, it can aim at the expansion of a surface area, and compared with the case where the eye is formed along one direction (flat eye), the film-forming material is used. Can capture in multiple directions. Therefore, the trapping property of the film forming material can be improved.

  Moreover, since the particle trap plate 30 and the cooling plate 40 are provided integrally, a cooling function can be added to the particle trap plate 30 itself. Therefore, the configuration of the cooling mechanism, and hence the configuration of the film forming apparatus 1 can be simplified.

  Further, since the particle capturing plate 30 and the cooling plate 40 are attached by the stud bolt 50 and the cap nut 52, the cooling plate 40 is used even when the thickness of the cooling plate 40 is thin (for example, about 5 mm). Can be protected, and the particle capturing plate 30 and the cooling plate 40 can be firmly fixed.

  The present invention is not limited to the above embodiment. For example, in the above embodiment, the first unevenness 32 is formed by knurling and the second unevenness 34 is formed by air blasting. However, the first unevenness 32 and the second unevenness 34 are formed by other processing methods. May be.

  Moreover, although the said embodiment demonstrated the structure by which the particle capture plate 30 is arrange | positioned in the film-forming apparatus 1 which performs the film-forming process by ion plating using plasma, the particle capture plate 30 is formed into a film by sputtering etc. You may arrange | position in the apparatus which processes.

  In the above embodiment, the cooling plate 40 is provided integrally with the particle capturing plate 30, but the cooling plate 40 may not be provided depending on the temperature environment of the vacuum container 3 in the film forming apparatus 1.

  Moreover, in the said embodiment, although the particle capture plate 30 is made into the copper plate member, the particle capture plate 30 may be comprised from the other raw material. From the viewpoint of ease of processing, the particle trap plate 30 is preferably made of copper.

  Moreover, although the said embodiment demonstrated the form in which the fine 2nd unevenness | corrugation 34 was provided also in the recessed part in the 1st unevenness | corrugation 32, the 2nd unevenness | corrugation 34 was not provided in the recessed part of the 1st unevenness | corrugation 32. Also good. In the case where the particle capturing plate 30 has a function of mainly capturing the film forming material on the fine second unevenness 32 and a function of retaining the film forming material deposited mainly on the concave portion of the first unevenness 32, Thus, even if the second unevenness 34 is not formed in the concave portion of the first concave portion 32, it is possible to effectively suppress the peeling of the deposited film.

  DESCRIPTION OF SYMBOLS 1 ... Film-forming apparatus, 3 ... Vacuum container (film-forming chamber), 30 ... Particle capture plate, 30a ... Front surface, 30b ... Back surface, 32 ... 1st unevenness | corrugation (1st unevenness | corrugation), 34 ... 2nd unevenness | corrugation (2nd 40 ... cooling plate, 50 ... stud bolt, 52 ... cap nut.

Claims (11)

A film forming apparatus including a film forming chamber for performing a film forming process for forming a film forming material on a film forming material,
A particle capturing plate disposed in the film forming chamber;
On the surface of the particle capturing plate, there are formed first irregularities and second irregularities that are provided on the first irregularities and are finer than the first irregularities. Membrane device. The first unevenness is formed by a first processing,
The film forming apparatus according to claim 1, wherein the second unevenness is formed by a second process performed after the first process. The first processing is knurling,
The film forming apparatus according to claim 2, wherein the second processing is air blast processing.   The film forming apparatus according to claim 3, wherein the first unevenness is a round eye formed by the knurling process.   The film forming apparatus according to claim 1, wherein a cooling plate is provided on a back surface of the particle capturing plate opposite to the front surface.   The film forming apparatus according to claim 1, wherein the particle capturing plate is made of copper.   The film forming apparatus according to claim 1, wherein the particle capturing plate has a thickness of about 3 mm.   The film forming apparatus according to claim 5, wherein the cooling plate is provided integrally with the particle capturing plate by a stat bolt and a nut. A particle capturing plate disposed in a film forming chamber of the film forming apparatus,
A particle capturing plate, wherein a first unevenness and a second unevenness which is provided on the first unevenness and is finer than the first unevenness are formed on a surface. The first unevenness is formed by a first processing,
The particle capturing plate according to claim 9, wherein the second unevenness is formed by a second process performed after the first process. The first processing is knurling,
The particle capturing plate according to claim 10, wherein the second processing is air blast processing.

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