JP2013125871A - Tool cutting device - Google Patents

Abstract

Provided is a cutting tool capable of cleaning a surface of a workpiece that has been subjected to cutting and cleaning a surface opposite to the surface that has been subjected to cutting.
A cutting tool including a transfer means for transferring a work piece from a chuck table to a holding table of a second surface cleaning mechanism in a state where a first surface of the work piece cut by the cutting tool is exposed. In the cutting apparatus 2, the first surface cleaning means has a cleaning plate having the same diameter as the workpiece facing the workpiece held by the conveying means, and the upper surface of the cleaning plate has the cleaning plate A plurality of cleaning liquid jets for ejecting the cleaning liquid are formed on the first surface side of the workpiece so as to face the workpiece held by the conveying means, and a plurality of the cleaning liquids are formed on the outer peripheral edge of the upper surface of the cleaning plate. An annular outer peripheral wall surrounding the spout is formed to form a cleaning liquid reservoir, and the first surface of the workpiece comes into contact with the cleaning liquid collected in the cleaning liquid reservoir so that the first surface of the workpiece is Washed.
[Selection] Figure 1

Description

  The present invention relates to a cutting tool provided with a spinner cleaning device for cleaning a workpiece after cutting.

  There are various techniques for realizing light and thin semiconductor devices. As an example, a flip in which a plurality of metal protrusions called bumps having a height of about 10 to 100 μm are formed on the surface of a device formed on a semiconductor wafer, and these bumps are directly bonded to an electrode formed on a wiring board. A mounting technique called chip bonding has been put into practical use.

  In flip chip bonding, it is necessary to align a plurality of bumps formed on the surface of a semiconductor wafer to a desired height. As a method for aligning the bumps to a desired height, using a cutting tool as described in Japanese Patent Application Laid-Open No. 2009-172723, the workpiece and the cutting tool are rotated while rotating the cutting tool positioned at a predetermined height. A method has been implemented in which a tool is rotated relative to a horizontal direction and a workpiece is turned by a cutting tool.

  The cutting tool performs cutting while supplying fluid such as pure water to the processing point where the cutting edge and workpiece are in contact with each other in order to improve the processing quality and reduce the consumption of the cutting edge of the cutting tool. (See JP 2010-005721 A).

  The wafer after the cutting of the cutting tool is held by a transport mechanism, transported from the chuck table to a spinner cleaning device, spin-washed by the spinner cleaning device, and spin-dried (see, for example, JP-A-2007-059524). .

JP 2010-005721 A JP 2007-059524 A

  In a conventional cutting tool, the surface on which a workpiece such as a wafer has been processed (the surface on which the cutting has been performed) can be cleaned by a spinner cleaning device, but the surface on which the workpiece has been processed There was a problem that the opposite surface could not be cleaned.

  Tool cutting that can clean the surface opposite to the machined surface because the processing waste generated during machining may adhere to the surface opposite to the machined surface and contaminate the workpiece. An apparatus is desired.

  The present invention has been made in view of these points, and the object of the present invention is to clean the surface of the workpiece that has been subjected to cutting and to the surface opposite to the surface that has been subjected to cutting. It is another object of the present invention to provide a cutting tool that can also be cleaned.

  According to the present invention, a chuck table that holds the first surface of the workpiece and exposes the second surface, a cutting tool that cuts the second surface side of the workpiece held by the chuck table, A holding table that holds the first surface side of the workpiece cut on the second surface side by a cutting tool, and a cleaning liquid supply that supplies the cleaning liquid to the second surface side of the workpiece held on the holding table And a second surface cleaning mechanism having a means, and the chuck table to be exposed to the holding table of the second surface cleaning mechanism in a state where the first surface of the workpiece cut by the cutting tool is exposed. A cutting tool provided with a conveying means for conveying a workpiece, wherein the conveying means is disposed on a conveying path for conveying the workpiece from the chuck table to the holding table, and the conveying means. The first surface side of the work piece held on A first surface cleaning means for supplying a cleaning liquid to clean the first surface side is further provided, and the first surface cleaning means is disposed on the transport path so as to face the workpiece held by the transport means. A cleaning plate having substantially the same diameter as the workpiece to be disposed, and an upper surface of the cleaning plate facing the workpiece held by the conveying means on the first surface side of the workpiece; And a plurality of cleaning liquid jets are formed on the outer peripheral edge of the upper surface of the cleaning plate, and an annular outer peripheral wall surrounding the plurality of cleaning liquid jets is formed on the outer peripheral wall of the cleaning plate. A cleaning liquid reservoir is formed, and the first surface of the workpiece held by the conveying means is brought into contact with the cleaning liquid collected in the cleaning liquid reservoir so that the first surface of the workpiece is cleaned. A feature cutting tool is provided.

  According to the cutting tool of the present invention, since the surface opposite to the surface on which the workpiece is processed is brought into contact with the cleaning liquid stored in the cleaning liquid reservoir, the both surfaces of the workpiece can be cleaned, Even workpieces that have been thinned by cutting can be cleaned without fear of being damaged.

It is a perspective view of the cutting tool which concerns on this invention embodiment. It is a longitudinal cross-sectional view of a 1st surface washing | cleaning unit. It is a longitudinal cross-sectional view of the 1st surface washing | cleaning unit which shows a mode that the 1st surface of a to-be-processed object is wash | cleaned.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Referring to FIG. 1, a perspective view of a cutting tool 2 according to an embodiment of the present invention is shown. Reference numeral 4 denotes a housing of the cutting tool 2, and a column 8 is erected on the rear side of the horizontal housing 6.

  A pair of guide rails 12 and 14 extending in the vertical direction are fixed to the column 8. A cutting tool unit 16 is mounted along the pair of guide rails 12 and 14 so as to be movable in the vertical direction. The cutting tool unit 16 is attached to a moving base 18 that moves up and down along a pair of guide rails 12 and 14 via a support portion 20.

  The cutting tool unit 16 includes a housing 22 attached to the support portion 20, a spindle 24 rotatably accommodated in the housing 22, and a servo motor 26 that rotationally drives the spindle 24.

  A wheel mount 28 is fixed to the tip of the spindle 24, and a bite wheel 30 is detachably attached to the wheel mount 28 with a plurality of screws. A bite tool 32 having a cutting edge at the tip is detachably attached to the bite wheel 30.

  The cutting tool unit 16 includes a cutting tool feed mechanism (cutting means) 34 that moves the cutting tool unit 16 in the vertical direction along the pair of guide rails 12 and 14.

  The cutting tool feed mechanism 34 includes a ball screw 36, a pulse motor 38 fixed to one end of the ball screw 36, and a nut that is screwed into the ball screw 36 disposed on the moving base 18. . When the pulse motor 38 is pulse-driven, the ball screw 36 rotates and the moving base 18 is moved in the vertical direction.

  A chuck table unit 40 is disposed in the recess 10 of the horizontal housing portion 6. The chuck table unit 40 includes a chuck table 42, and the chuck table 42 is moved in the front-rear direction of the apparatus, that is, in the Y-axis direction by a horizontal movement mechanism (chuck table movement mechanism) (not shown).

  In other words, the chuck table 42 is linearly moved by the horizontal movement mechanism in a direction approaching and moving away from the cutting tool unit 16. The chuck table 42 has a suction holding surface 42a formed of porous ceramics or the like.

  The chuck table mechanism 40 includes a protective cover mechanism 45 that covers the movement path of the horizontal movement mechanism. The protective cover mechanism 45 includes a chuck table cover 44 having an upper surface that exposes the suction holding surface 42 a of the chuck table 42 and surrounds the chuck table 42, and bellows 46 and 48 disposed at both ends of the chuck table cover 44. Composed.

  The front end of the bellows 46 is fixed to the front wall that defines the recess 10, and the rear end is fixed to the front end surface of the chuck table cover 44. The rear end of the bellows 48 is fixed to the column 8, and the front end thereof is fixed to the rear end surface of the chuck table cover 44.

  A horizontal housing portion 6 of the housing 4 includes a cassette 52 for storing a wafer before cutting, a cassette 54 for storing a wafer after cutting, a wafer transfer robot 56, and a positioning mechanism 60 having a plurality of positioning pins 58. A wafer carry-in mechanism (loading arm) 62, a wafer carry-out mechanism (unloading arm) 64, a spinner cleaning unit 68 having a spinner table 66, and an operation panel 70 for an operator to input cutting conditions and the like are provided.

  Further, the recess 10 of the housing 4 is provided with a drain port 72 for draining cutting water containing cutting waste of the workpiece by the cutting tool unit 16. Further, on the transport path through which the wafer carry-out mechanism 64 transports the wafer from the chuck table 42 to the spinner cleaning unit 68, cleaning liquid is applied to the surface (first surface) opposite to the wafer cutting surface (second surface). A first surface cleaning mechanism 74 for supplying and cleaning the first surface is disposed.

  As shown in the longitudinal sectional view of FIG. 2, the first surface cleaning mechanism 74 is a cleaning plate having substantially the same diameter as the wafer 11 disposed on the transport path so as to face the wafer held by the wafer carry-out mechanism 64. 76 is included.

  On the upper surface 76a of the cleaning plate 76, as shown in FIG. 3, there are a plurality of cleaning liquid jets 88 that jet the cleaning liquid to the first surface 11a side of the wafer 11 so as to face the wafer 11 held by the wafer carry-out mechanism 64. Is formed. Each cleaning liquid spout 80 is connected to a cleaning liquid supply source 84 via a cleaning liquid supply path 81.

  Further, an annular outer peripheral wall 82 is formed on the outer peripheral edge of the upper surface of the cleaning plate 76 so as to surround the plurality of cleaning liquid jets 80, and the circular outer peripheral wall 82 and the upper surface 76 a of the cleaning plate 76 form a circular shape as a cleaning liquid reservoir 86. A recess 78 is formed. As the cleaning liquid, pure water or a mixed fluid obtained by blowing carbon dioxide into pure water is used.

  In cutting the wafer 11 held on the chuck table 42, the cutting tool 32 is cut by driving the cutting tool feed mechanism (cutting means) 34 while rotating the cutting tool wheel 30 in the clockwise direction in FIG. The blade is cut into the upper surface (second surface) 11b of the wafer 11 to a predetermined depth.

  Then, the wafer 11 is turned while the chuck table 42 is moved in the Y-axis direction at a feed rate of 1 mm / s, for example. During this turning cutting, the chuck table 42 is processed and fed in the Y-axis direction without rotating.

  When the cutting of the second surface 11b of the wafer 11 is completed, the chuck table 42 is moved to the wafer loading / unloading position on the front side of the apparatus by a horizontal movement mechanism (chuck table moving mechanism), and then the wafer 11 is moved by the wafer unloading mechanism 64. As shown in FIG. 3, the cleaning liquid 88 stored in the cleaning liquid reservoir 86 is subjected to cutting of the wafer 11 by adsorbing the second surface 11b side and rotating the arm of the wafer carry-out mechanism 64. The first surface 11a opposite to the second surface 11b is brought into contact, and in this state, the wafer 11 is held for a while to clean the first surface 11a of the wafer 11.

  Since the first surface 11a side of the wafer 11 is cleaned with the cleaning liquid 88 stored in the cleaning liquid reservoir 86 in this way, for example, even in the wafer 11 that has been thinned by grinding before the cutting of the cutting tool, the cleaning liquid The first surface 11a side of the wafer 11 can be cleaned without fear of being damaged by the ejection pressure.

  After the cleaning of the first surface 11 a of the wafer 11, the wafer 11 is transported to the spinner table 66 of the spinner cleaning unit 68 by further rotating the arm of the wafer carry-out mechanism 64, and the first surface of the wafer 11 is rotated by the spinner table 66. The second surface 11b side of the wafer 11 is spin-cleaned and spin-dried while sucking and holding the 11a side. The wafer 11 after the spin drying is sucked by the wafer transfer robot 56 and stored in the cassette 54.

  In the above-described embodiment, the example in which the first surface cleaning unit 74 cleans the first surface 11a side of the wafer 11 has been described. However, the workpiece is not limited to the wafer, but a glass substrate, a sapphire substrate, a resin Other workpieces such as sealed package substrates are also included.

2 Bite cutting device 10 Bite cutting unit 11 Wafer 11a First surface 11b Second surface 30 Bite wheel 32 Bite tool 42 Chuck table 64 Wafer unloading mechanism (unloading arm)
68 Spinner cleaning unit 74 First surface cleaning unit 76 Cleaning plate 78 Circular recess 82 Annular outer peripheral wall 86 Cleaning liquid reservoir

Claims (1)

A chuck table for holding the first surface of the workpiece and exposing the second surface, a cutting tool for cutting the second surface of the workpiece held by the chuck table, and a cutting tool for cutting the second surface. A holding table that holds the first surface side of the workpiece cut on the second surface side, and a cleaning liquid supply means that supplies a cleaning liquid to the second surface side of the workpiece held on the holding table. The workpiece is conveyed from the chuck table to the holding table of the second surface cleaning mechanism in a state where the first surface of the workpiece cut by the two-surface cleaning mechanism and the cutting tool is exposed. A cutting tool comprising a conveying means,
The conveying means is disposed on a conveying path for conveying the workpiece from the chuck table to the holding table, and supplies cleaning liquid to the first surface side of the workpiece held by the conveying means. A first surface cleaning means for cleaning the first surface side;
The first surface cleaning means has a cleaning plate having substantially the same diameter as the workpiece disposed on the transport path so as to face the workpiece held by the transport means,
A plurality of cleaning liquid jets are formed on the upper surface of the cleaning plate so as to jet the cleaning liquid to the first surface side of the workpiece so as to face the workpiece held by the conveying means, and the upper surface of the cleaning plate An annular outer peripheral wall surrounding the plurality of cleaning liquid jets is formed on the outer peripheral edge, and a cleaning liquid reservoir is formed by the annular outer peripheral wall and the upper surface of the cleaning plate,
A cutting tool for cutting a workpiece, wherein the first surface of the workpiece held by the conveying means comes into contact with the cleaning liquid accumulated in the cleaning liquid reservoir, whereby the first surface of the workpiece is cleaned.

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