JP2013098323A - Support device and support method, sheet peeling device and peeling method, and sheet sticking device and sticking method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a support device and support method capable of recognizing the position of a notch from a reduced pressure state by sucking and supporting a plate-like member having the notch at a fringe part, a sheet peeling device and peeling method for peeling an adhesive sheet stuck to the plate-like member on the basis of the notch, and a sheet sticking device and sticking method for sticking adhesive sheet onto the plate-like member on the basis of the notch.SOLUTION: A support device 11 includes a table 16 provided with a support face 14 for supporting a plate-like member WF, sucking means 19 including sucking means 17 provided on the support face 14 to suck a fringe part of the plate-like member WF, and detection means 22 for detecting a reduced pressure state of the sucking means 17. A sheet peeling device is configured by providing sheet holding means 12 for sticking a peeling tape PT onto an adhesive sheet AS stuck onto the plate-like member WF over the support device 11. The sheet holding means 12 determines a peeling start position on the basis of notches 20, 21 provided in the plate-like member WF, and peels the adhesive sheet from the peeling start position.

Description

  The present invention relates to a support device and a support method, a sheet peeling device and a peeling method, and further to a sheet sticking device and a sticking method, for example, peeling of an adhesive sheet stuck on a plate-like member, Support device and support method adapted to perform peeling and sticking by supporting a plate-like member so that the regularity can be secured when giving a certain regularity in the sticking direction of the adhesive sheet, and the sheet The present invention also relates to a peeling device and a peeling method, and further to a sheet sticking device and a sticking method.

A semiconductor wafer on which a circuit is formed (hereinafter sometimes referred to as “wafer”) is protected by sticking an adhesive sheet to the circuit forming surface, and the adhesive sheet is finally peeled off for each circuit. A chip obtained by dividing a wafer into pieces is used as an electronic component.
Such a wafer has a notch portion formed of a V-shaped notch (hereinafter referred to as “notch”), a linear orientation flat (hereinafter referred to as “orientation flat”) or the like at the outer edge portion. A circuit is formed on the wafer in association with the position.

  As a wafer support apparatus, for example, an apparatus disclosed in Patent Document 1 is known, and as an adhesive sheet peeling apparatus, disclosed in Patent Document 2, and as an adhesive sheet pasting apparatus, What was disclosed by patent document 3 is known.

JP 2009-246027 A JP 2001-291762 A JP 2006-024743 A

In order to perform positioning of the wafer supported by the support table, the support device of Patent Document 1 detects the notch from the outside of the support table and positions the wafer. Therefore, it is necessary to provide a sensor outside the support table. There is an inconvenience that the apparatus becomes large.
Further, in Patent Document 2, a sensor for detecting a notch is arranged outside the table in order to peel the protective sheet from the corner of the circuit when peeling the protective sheet attached to the circuit forming surface. Therefore, there is an inconvenience of increasing the size as in Patent Document 1.
Further, in Patent Document 3, a sensor for detecting a notch is arranged outside the table in order to rotate the wafer by a predetermined angle when the adhesive sheet is attached to the wafer. There is an inconvenience.

An object of the present invention is to adsorb and hold a plate-like member and detect the reduced pressure state, thereby recognizing the position of the notch portion of the plate-like member without providing a detection means outside the support device. To provide a support device and a support method.
Another object of the present invention is to recognize the position of the cutout portion of the plate-like member by adsorbing and holding the plate-like member and detecting the reduced pressure state, and to determine the peeling direction of the adhesive sheet based on the cutout portion. An object of the present invention is to provide a sheet peeling apparatus and a peeling method that can be determined.
Furthermore, an object of the present invention is to recognize the position of the notch portion of the plate-like member by sucking and holding the plate-like member and detecting the reduced pressure state, and to determine the adhesive sheet sticking direction with reference to the notch portion. It is providing the sheet sticking apparatus and sticking method which can be determined.

  In order to achieve the above object, the present invention provides a support device for a plate-like member having a notch formed on an outer edge, a support surface for supporting one surface of the plate-like member, and an opening in the support surface. A plurality of suction means provided so as to be closed by an outer edge portion of the plate-like member, capable of sucking the plate-like member, a detection means for detecting respective pressures in the plurality of suction means, and a pressure by the notch portion. The detection means detects the suction means that does not decrease, and has a control means for recognizing the position of the notch.

  The support device includes positioning means for displacing the position of the notch portion to a predetermined position by the output of the control means.

  Further, the present invention is a method for supporting a plate-like member having a notch formed on an outer edge, the step of supporting one surface of the plate-like member with a support surface, and the plate opened by opening the support surface. A step of sucking the plate-like member by a plurality of suction means capable of sucking the plate-like member, a step of detecting respective pressures in the plurality of suction means, and a pressure by the notch And a step of recognizing the position of the notch by detecting a suction means that does not decrease.

  Furthermore, the present invention is a sheet peeling apparatus for peeling an adhesive sheet from a plate-like member having a notch formed on the outer edge and having an adhesive sheet attached to the other surface, and supports the plate-like member. A support device; a sheet holding means for holding the adhesive sheet by applying a peeling tape to the adhesive sheet; and the plate-like member by relatively moving the support device and the sheet holding means in a predetermined relative movement direction. Moving means for peeling the adhesive sheet from the support member, and the support device can support the one surface of the plate-like member, and can be closed by the outer edge of the plate-like member by opening the support surface. A plurality of suction means provided and capable of sucking the plate-like member; detection means for detecting respective pressures in the plurality of suction means; and suction means in which the pressure is not reduced by the notch. And a control means for recognizing the position of the notch by detecting, and based on the position of the notch recognized by the control means, the support device for the sheet holding means and the moving means. By adopting a relative displacement, the sheet holding means includes a position for attaching the peeling tape to the adhesive sheet and a positioning means for determining the peeling direction of the adhesive sheet with respect to the plate-like member.

  The plate-like member of the sheet peeling device has a circuit formed on the other surface, and an adhesive sheet is pasted on the circuit, and the control means is configured such that the peeling edge of the adhesive sheet to be peeled is a side portion of the circuit. The positioning means is controlled so as not to be parallel to the axis.

  In addition, the present invention is a sheet peeling method for peeling an adhesive sheet from a plate-like member having a notch formed on the outer edge and having an adhesive sheet attached to the other surface, the device supporting the plate-like member A supporting step for supporting the adhesive sheet, a sheet holding process for holding the adhesive sheet by attaching a peeling tape to the adhesive sheet by a sheet holding means, and a predetermined relative relationship between the supporting device and the sheet holding means by a moving means. A moving step of separating the adhesive sheet from the plate-like member by relatively moving in the moving direction, and the supporting step includes a step of supporting one surface of the plate-like member with a support surface; A step of opening and sucking the plate-like member by a plurality of suction means capable of sucking the plate-like member, and the respective pressures of the plurality of suction means; And a step of recognizing the position of the notch by detecting a suction means that does not reduce pressure due to the notch, and holding the sheet based on the recognized position of the notch Determining the position where the sheet holding means applies the peeling tape to the adhesive sheet and the peeling direction of the adhesive sheet with respect to the plate-like member by displacing the support device relative to the means and the moving means Is used.

  Furthermore, the present invention provides a sheet sticking device for sticking an adhesive sheet to the other surface of a plate-like member having a notch formed on the outer edge, and a support device for supporting the plate-like member, and feeding the adhesive sheet The adhesive sheet is affixed to the plate-like member by relatively moving the sheet supply means that presses and contacts the adhesive sheet against the plate-like member, and the support device and the sheet supply means in a predetermined relative movement direction. The support device is provided with a support surface that supports one surface of the plate-like member, and is provided in the plate-like member so as to be closed by an outer edge portion of the plate-like member. A plurality of suction means capable of sucking a member; a detection means for detecting a pressure in each of the plurality of suction means; and a detection means for detecting suction means in which the pressure is not reduced by the notch, so that the notch Control means for recognizing the position, and by displacing the support device relative to the sheet supply means and the movement means based on the position of the notch recognized by the control means, the sheet supply The means is provided with a positioning means for determining a position where the adhesive sheet is brought into contact with the plate-like member and a direction in which the adhesive sheet is attached to the plate-like member.

  The plate-like member of the sheet sticking device has a circuit formed on the other surface, and the control means sets the positioning means so that the sticking edge of the adhesive sheet to be stuck is not parallel to the side of the circuit. Configured to control.

Further, the present invention is a sheet sticking method for sticking an adhesive sheet on the other surface of the plate-like member having a notch formed in the outer edge, a support step of supporting the plate-like member by a support means;
The adhesive sheet is fed out by a sheet supply means, and the adhesive sheet is pressed against and contacted with the plate-like member, and the support device and the sheet supply means are moved relative to each other in a predetermined relative movement direction by the movement means. And a moving step of attaching an adhesive sheet to the plate-like member. The supporting step includes a step of supporting one surface of the plate-like member with a support surface, and an opening to the support surface to A step of sucking the plate-like member by a plurality of suction means capable of being sucked by the outer edge portion of the plate-like member, a step of detecting respective pressures in the plurality of suction means, and the notch A step of recognizing the position of the notch by detecting a suction means that does not decrease the pressure, and based on the recognized position of the notch. Determining the position where the sheet feeding means contacts the adhesive sheet with the plate-like member and the direction in which the adhesive sheet is applied to the plate-like member by displacing the support device relative to the means. , Is adopted.

According to the present invention, when the outer edge portion of the plate-like member is sucked and held, the suction means corresponding to the position where the notch exists is not sufficiently decompressed with respect to the other suction means, This is detected by the detecting means. Thereby, the position of the notch part of the said plate-shaped member can be recognized, without providing a detection means outside the support apparatus.
Further, if the sheet holding means determines the position where the peeling tape is applied to the adhesive sheet and the relative movement direction of the moving means based on the position of the notch portion, Since the adhesive sheet can be peeled from the same position with respect to each other, for example, by pulling the adhesive sheet, the amount and direction of the residual stress applied to each plate-like member can all be the same. The quality of the shaped member can be equalized.
Further, when the plate-like member has a circuit such as a semiconductor wafer and peels off the adhesive sheet affixed to the circuit forming surface, the adhesion is made so that the peeling edge of the adhesive sheet is not parallel to the side of the circuit. If the sheet is peeled off, the adhesive sheet can be peeled without leaving as much adhesive as possible on the uneven portions of the circuit.
Further, if the sheet supply unit is configured to determine the position where the adhesive sheet contacts the plate-like member and the relative movement direction of the moving unit based on the position of the notch, each plate-like member Since the adhesive sheet can be affixed from the same position for each, for example, by pressing the adhesive sheet, the amount and direction of the residual stress applied to each plate member can all be the same, The quality of the plate member can be equalized.
Further, when the plate-like member has a circuit such as a semiconductor wafer and affixes the adhesive sheet to the circuit forming surface, the adhesive sheet is pressed so that the adhering edge of the adhesive sheet is not parallel to the side of the circuit. If it does so, it will become possible to affix an adhesive sheet so that the force per unit area which presses an adhesive agent by the uneven | corrugated | grooved part of a circuit may not run short.

The schematic front view of the sheet peeling apparatus which concerns on 1st Embodiment. The schematic plan view of a support apparatus. (A), (B) is a wafer explanatory drawing. (A), (B) is explanatory drawing of the positioning procedure of a wafer. (A), (B) is principal part explanatory drawing. The schematic front view of the sheet sticking apparatus which concerns on 2nd Embodiment.

(First embodiment)
Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.
In the present embodiment, the left-right direction in FIG. 1 is the X-axis direction, the direction orthogonal to the plane of FIG. 1 and the direction orthogonal to the X-axis is the Y-axis, and the direction orthogonal to the X-axis and Y-axis is the Z-axis. Axis. Further, for example, when directions such as up, down, left, right, front, and back are shown without giving a reference figure in the present embodiment, all are based on FIG.

  As shown in FIG. 1, the sheet peeling apparatus 10 includes a supporting device 11 that supports a wafer WF as a plate-like member, and an adhesive sheet AS that is obtained by attaching a peeling tape PT to an adhesive sheet AS attached to the wafer WF. The sheet holding means 12 for holding the sheet, the moving means 13 for separating the adhesive sheet AS from the wafer WF by relatively moving the support device 11 and the sheet holding means 12 in a predetermined relative movement direction, and the support means 11 for a predetermined plane. And positioning means 23 that can be displaced by being rotated inside.

  The wafer WF includes two types shown in FIGS. 3 (A) and 3 (B). These wafers WF are formed with notches 20 or orientation flats 21 as notches CU, with the notch CU as a reference position, and a region surrounded on one side by the outer frame CTO as one unit, and each outer frame CTO. In this area, a large number of circuit CTs are formed which are composed of printed wiring, printed parts, mounted parts, etc., all provided in the same shape, and an adhesive sheet AS is applied to protect the circuit CT. Yes. Note that the wafer WF in FIG. 3A is the first wafer WF1, and the wafer WF in FIG. 3B is the second wafer WF2.

  As shown in FIGS. 1 and 2, the support device 11 includes a table 16 having a support surface 14 that supports one surface (lower surface) of the wafer WF where the circuit CT is not formed, and a support 16. A plurality of suction means 17 that are open to the surface 14 and can be closed by the outer edge portion of the wafer WF, and are capable of sucking the wafer WF. The pressure sensor 22 and the control means 18 composed of a computer, a sequencer or the like for recognizing the position of the notch CU when the pressure sensor 22 detects the suction means 17 whose pressure is not reduced by the notch CU. ing.

The table 16 has a circular shape in plan view corresponding to the planar shape of the wafer WF, and the upper surface thereof serves as a support surface 14.
Each suction means 17 includes an arcuate vertical hole 35 along the outer periphery of the support surface 14, a horizontal hole 34 extending from the vertical hole 35 toward the center of the table 16, and a decompression means (not shown) such as a suction pump or a vacuum ejector connected to the horizontal hole 34. Each vertical hole 35 is blocked by the partition wall 17 </ b> B, and the pressure sensor 22 is provided in each lateral hole 34. The vertical hole 35 is opened to the support surface 14 by a porous body or a hole forming body (not shown) having fine holes, and the hole forming body has a flat surface in the same plane as the support surface 14. Further, each pressure sensor 22 is connected to the control means 18, and the control means 18 identifies the suction means 17 where the pressure does not drop and recognizes the position of the notch CU. In the present embodiment, a total of 36 vertical holes 35 are provided at intervals of 10 degrees along the circumferential direction.

  The sheet holding means 12 is capable of winding the peeling tape PT by a feeding portion 40 provided so that the peeling tape PT can be fed by a rotating motor 40A as a driving device and a rotating motor 41A as a driving device. The winding unit 41 is provided, and a sticking member 43 that is arranged between the feeding unit 40 and the winding unit 41 and is supported by a tip of an output shaft of an air cylinder 44 as a driving device.

  The moving means 13 is constituted by a linear motor 50 as a driving device, a slider 51 of the linear motor 50 is fixed to the lower surface side of the base table 30, and the support device 11 is supported on the upper surface of the base table 30. . The base table 30 is provided with a linear motor 32 as a driving device arranged at intervals of 120 degrees in the circumferential direction with respect to the center point of the table 16, and a slider 32 A of each linear motor 32. Centering means 31 including a centering pin 32B provided so as to be able to advance and retract toward the center is provided.

  The positioning means 23 is provided on the upper surface of the base table 30, and includes a rotation motor 23 </ b> A as a drive device that can connect the output shaft 23 </ b> B to the lower surface of the table 16 and rotate the table 16 within the surface of the support surface 14. .

  Next, a support method and a sheet peeling method in this embodiment will be described.

  As shown in FIG. 1, when the wafer WF is arranged on the table 16 with the adhesive sheet AS facing the upper surface side, the three centering pins 32B move from the solid line position to the dotted line position in FIG. Thus, centering is performed so that the center point CP of the wafer WF coincides with the center point of the table 16. At this time, each vertical hole 35 is closed by the outer edge portion of the wafer WF except for the portion corresponding to the formation part of the notch CU (see FIG. 4).

  Next, a decompression unit (not shown) is activated, and the suction unit 17 sucks the outer edge of the wafer WF so that the wafer WF is sucked and held on the support surface 14 and the centering pin 32B returns to the solid line position in FIG. To do. When suction is performed by the suction means 17, the detection value of each pressure sensor 22 is output to the control means 18. At this time, in the case of the first wafer WF1, as shown in FIG. 4A, the vertical hole 35A corresponding to the formation part of the notch 20 leaks outside air due to the notch 20, so that the pressure does not drop and corresponds to the vertical hole 35A. The detection value of the pressure sensor 22 is extremely different from the detection values of the other pressure sensors 22. In the case of the second wafer WF2, as shown in FIG. 4B, the three vertical holes 35B, 35C, and 35D corresponding to the formation site of the orientation flat 21 leak the outside air due to the orientation flat 21, so that the pressure does not decrease. The detection values of the pressure sensors 22 corresponding to the vertical holes 35B, 35C, and 35D are extremely different from the detection values of the other pressure sensors 22. Thereby, the control means 18 can recognize in which position the notch CU is located with respect to the table 16.

  Here, in the case of the first wafer WF1, as shown in FIG. 3A, a straight line connecting the valley center of the notch 20 and the center point CP of the wafer WF is parallel to the Y axis, and the circuit surface is set to the X axis. , Each circuit CT has a circuit portion CTX as a side portion extending in the X-axis direction, a circuit portion CTY as a side portion extending in the Y-axis direction, and 45 in the counterclockwise direction as viewed from the X-axis. It has been found that there is a circuit portion CT45 as a side portion extending in the advanced direction. The presence of each of these circuit portions CTX, CTY, and CT45 is input by the operator directly or indirectly to the control means 18 or detected by an imaging means such as a camera (not shown) or a detection means such as an optical sensor. It can be stored in the control means 18. Therefore, in the case of the first wafer WF1, from the X-axis direction, the Y-axis direction, and the direction advanced 135 degrees in the left rotation direction as viewed from the X axis (the direction advanced 45 degrees in the right rotation direction as viewed from the X axis). When peeling is performed, the peeling edge SE of the adhesive sheet AS indicated by a two-dot chain line in FIG. 1 becomes parallel to each side portion that is finely uneven. As described above, when the peeling edge SE of the adhesive sheet AS and each side portion are parallel, the adhesive entering the concavo-convex portion formed by each side portion is not attracted well to the peeled adhesive sheet AS side. It may be left behind and the yield in semiconductor manufacturing may be reduced. In such a case, for example, the control means 18 prevents the peeling edge SE of the adhesive sheet AS from being parallel to each side portion, for example, from a direction DR112.5 advanced 112.5 degrees in the counterclockwise direction when viewed from the X axis. The rotation motor 23A is controlled so as to perform peeling toward the center point CP of the wafer WF. That is, as shown in FIG. 4A, the virtual center line L1 extending from the center point of the table 16 (center point CP of the wafer WF) to the center in the support surface 14 in the vertical hole 35A rotates clockwise as viewed from the X axis. Control is performed to rotate the table 16 so as to reach a position advanced by 22.5 degrees in the direction. The direction DR112.5 degrees is only an example. That is, it can be arbitrarily determined as long as the peeling edge SE of the adhesive sheet AS can be peeled at an angle that is not parallel to any of the circuit portions CTX, CTY, and CT45.

  In the case of the second wafer WF2, as shown in FIG. 3B, a straight line connecting the center of the orientation flat 21 in the left-right direction in the figure and the center point CP of the wafer WF is parallel to the Y axis, Are parallel to the X-axis, the circuit portions CTX and CTY as sides extending in the X-axis direction and the Y-axis direction, and the circuit as a side extending in a direction advanced by 50 degrees in the counterclockwise rotation direction when viewed from the X-axis. It is understood that there is a portion CT50 and a circuit portion CT120 as a side portion extending in a direction advanced by 120 degrees in the counterclockwise direction when viewed from the X axis. Therefore, in the case of the second wafer WF2, peeling is performed from the X-axis direction, the Y-axis direction, the direction advanced 30 degrees in the left rotation direction as viewed from the X axis, and the direction advanced 140 degrees in the left rotation direction as viewed from the X axis. If it performs, peeling edge SE of adhesive sheet AS will become parallel to each side. Therefore, for example, the control means 18 moves from the direction DR60 advanced 60 degrees in the left rotation direction as viewed from the X axis to the center point CP of the wafer WF so that the peeling edge SE of the adhesive sheet AS is not parallel to each side. The rotating motor 23A is controlled so as to perform the peeling to go. That is, as shown in FIG. 4B, the virtual center line L2 extending from the center point of the table 16 (center point CP of the wafer WF) to the center in the support surface 14 in the vertical hole 35C is rotated clockwise as viewed from the X axis. Control is performed to rotate the table 16 so as to reach a position advanced by 30 degrees in the direction.

  In the above case, a positioning error of 5 degrees at the maximum with respect to a predetermined position occurs, but the displacement angle of the table 16 is determined so that each side portion does not become parallel to the peeling edge SE within this error range. What is necessary is just to increase the number of the vertical holes 35, when each side part will become parallel with peeling edge SE still. Here, as shown in FIG. 5A, the notch 20 may be located across the two vertical holes 35E and 35F. In such a case, the center point of the table 16 (the center point CP of the wafer WF). ) To rotate the table 16 so that a virtual center line L3 extending to the center of the partition wall 17B located between the vertical holes 35E and 35F advances a predetermined angle in the left and right rotation directions as viewed from the X axis. Further, as shown in FIG. 5B, when the orientation flat 21 is detected across the four vertical holes 35G to 35J, the center of the partition wall 17B located between the vertical holes 35H and 35I from the center point of the table 16 is detected. Control is performed so that the table 16 is rotated so that the virtual center line L4 extending in the direction advances by a predetermined angle in the left-right rotation direction as viewed from the X axis.

  When the positioning is completed in this way, the table 16 is moved in the X-axis direction by the linear motor 50, and the intersection of the X-axis and the adhesive sheet AS is controlled to be located directly below the sticking member 43. Thereafter, the peeling tape PT is applied to the right end portion of the adhesive sheet AS by the air cylinder 44 to hold the adhesive sheet AS. Next, in synchronization with the movement of the table 16 to the right in the X-axis direction by the linear motor 50, the rotation motors 40A and 41A are also driven, so that the adhesive sheet AS is peeled off as shown by the two-dot chain line in FIG. While being peeled from the wafer WF at the edge SE, the film is wound around the winding unit 41.

  Therefore, according to the present embodiment, the position of the notch CU can be detected and recognized without arranging an optical sensor or the like outside the support device, and the adhesive sheet AS can be positioned in an optimum direction with the notch CU as a reference. Can be peeled toward.

(Second Embodiment)
As shown in FIG. 6, the sheet sticking device 50 is different from the sheet peeling device 10 of the first embodiment only in that a sheet supply unit 60 is provided instead of the sheet holding unit 12. Only the sheet supply means 60 will be described.

  The sheet supply means 60 is a raw material in which an adhesive sheet AS having an adhesive layer AD on one surface of a base sheet BS is temporarily attached to one surface of a strip-shaped release sheet RL via the adhesive layer AD. A release sheet by a support shaft 61 that supports the RS, two guide rollers 62, a release plate 63 that folds the release sheet RL and peels the adhesive sheet AS from the release sheet RL, and a rotation motor 64 as a drive device. A driving roller 65 that applies a repetitive output to the RL, a pinch roller 66 that sandwiches the release sheet RL with the drive roller 65, a recovery roller 67 that collects the release sheet RL, and the adhesive sheet AS are pressed against the wafer WF. And a pressing roller 68.

  In order to attach the adhesive sheet AS to the wafer WF using such a sheet attaching apparatus 50, the wafer WF is disposed on the table 16 with the circuit surface facing the upper surface side as in the first embodiment, and the centering and suction holding are performed. Then, the notch CU is recognized and the table 16 is controlled to rotate so that the notch CU is positioned at a predetermined position, thereby positioning. Thereafter, when the table 16 is moved to the right in the X-axis direction by the linear motor 50, it is detected by a sensor (not shown) that the wafer WF has reached a predetermined position, and the control means 18 drives the rotation motor 64 by this detection. The adhesive sheet AS peeled off by the peeling plate 63 is pressed by the pressing roller 68 and pasted. At this time, the adhesive sheet AS is bonded to the wafer WF starting from the pasting edge SF. Therefore, when the sticking edge SF is stuck in parallel with each side portion, the pressing force of the pressing roller 68 rides on or falls over a wide range of unevenness at a time, so the adhesive sheet AS is pressed in an instant. The pressing force per unit area is insufficient, air bubbles are involved and the adhesive sheet AS is stuck to the wafer WF, and a sticking failure of the adhesive sheet AS occurs. In order to avoid such an inconvenience, the control means 18 displaces the table 16 by a predetermined angle so that the sticking edge SF is not parallel to any side as in the first embodiment.

  Therefore, according to the present embodiment, the adhesive sheet AS can be attached in the optimum direction with the notch CU as a reference.

The best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
That is, the invention has been illustrated and described with particular reference to particular embodiments, but it should be understood that the above-described embodiments are not deviated from the technical idea and scope of the invention. On the other hand, various modifications can be made by those skilled in the art in shape, quantity, and other detailed configurations.
Therefore, the description limited to the shape disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded one part or all part is included in this invention.

For example, in the embodiment, the table 16 has the same size as the wafer WF. However, as long as the suction unit 17 is positioned along the outer edge of the wafer WR, the planar shape and size of the table are not limited.
Further, the arrangement interval, the number of formations, and the shape of the suction means 17 are not limited to those of the above-described embodiment, and can be appropriately changed depending on the shape, material, and the like of the plate-like member.
Further, the rotation angle of the table 16 described above is an example, and it is sufficient that the peeling edge is not parallel to each side. For example, in the case of the first wafer WF1, the left rotation direction is 170 degrees as viewed from the X axis. Further, it may be configured to peel from the direction of 65 degrees in the right rotation direction. Further, in the case of the wafer of the second wafer WF2, it may be configured to peel from the direction of the left rotation direction 100 degrees or the right rotation direction 103 degrees as viewed from the X axis.

Further, the moving means 13 may be configured to stop the table 16 and move the sheet holding means 12 or to move both of them.
Further, the moving unit 13 may be configured to stop the table 16 and move the sheet supply unit 60, or to move both of them.

Further, the positioning unit 23 may be configured to stop the table 16 and displace the sheet holding unit 12 and the moving unit 13, or to displace both of them.
Further, the positioning unit 23 may be configured to stop the table 16 and displace the sheet supply unit 60 and the moving unit 13, or to displace both of them.

  Moreover, although the example which incorporated the support apparatus 11 in the sheet peeling apparatus 10 or the sheet sticking apparatus 50 was shown in the said embodiment, you may use the support apparatus 11 alone. In this case, the control means 18 outputs the position of the recognized notch CU of the plate-like member to, for example, a transport device (not shown), and when the transport device transports the plate-like member to another place, the notch portion The CU can be transported with the same position. It is also possible for the control means 18 to output to an imaging means such as a camera (not shown) to image a predetermined position of the plate member.

  Further, the notch CU may be other than the notch 20 or the orientation flat 21, and when the outer edge of the plate-like member is sucked and held, there is a region where the pressure does not decrease due to suction decompression under a certain condition. It is enough if it can be done.

  In the above embodiment, 36 vertical holes 35 are provided at intervals of 10 degrees along the circumferential direction, but 37 or more may be provided, or may be provided in a range of 2 to 35, for example, 72 can be provided at intervals of 5 degrees along the circumferential direction, 12 can be provided at intervals of 30 degrees along the circumferential direction, or two can be provided at intervals of 180 degrees along the circumferential direction.

  Further, the type and material of the adherend (plate member) and the adhesive sheet AS in the present invention are not particularly limited. For example, the adhesive sheet AS is intermediate between the base sheet BS and the adhesive layer AD. There may be three or more layers such as one having a layer or one having a cover layer on the upper surface of the base sheet BS. Further, the adherend may be an appropriate article (for example, food or a resin container), and the adhesive sheet AS may be a label, the adherend is a semiconductor wafer, and the adhesive sheet S is a protective sheet, A dicing tape, a die attach film, etc. may be sufficient. In this case, the semiconductor wafer can be exemplified by a silicon semiconductor wafer, a compound semiconductor wafer, etc., and the adhesive sheet to be attached to such a semiconductor wafer is not limited to a protective sheet, a dicing tape, a die attach film, but any other sheet, An adhesive sheet having an arbitrary use and shape such as a film and a tape can be applied. As described above, as the adherend, not only a glass plate, a steel plate, a resin plate, and other plate-like members, but also members and articles in any form can be targeted.

  Further, the drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 10 Sheet peeling apparatus 11 Support apparatus 12 Sheet holding means 13 Moving means 14 Support surface 17 Suction means 18 Control means 19 Suction means 50 Sheet sticking apparatus 60 Sheet supply means 22 Pressure sensor (detection means)
23 positioning means AS adhesive sheet CT circuit CU notch PT peeling tape SE peeling edge SF sticking edge WF semiconductor wafer (plate-like member)

Claims (9)

A plate-like member support device having a notch formed on the outer edge,
A support surface that supports one surface of the plate-like member, and a plurality of suction means that are provided in the support surface so as to be closed by an outer edge portion of the plate-like member and can suck the plate-like member; Detecting means for detecting each pressure in the plurality of suction means, and control means for recognizing the position of the notch by detecting the suction means in which the pressure is not reduced by the notch. A support device characterized by the above.   2. The support device according to claim 1, further comprising positioning means for displacing the position of the notch portion to a predetermined position by an output of the control means. A method for supporting a plate-like member having a notch formed on the outer edge,
Supporting one surface of the plate-like member with a support surface;
A step of opening the support surface so as to be closed by an outer edge portion of the plate-like member, and sucking the plate-like member by a plurality of suction means capable of sucking;
Detecting each pressure in the plurality of suction means;
And a step of recognizing the position of the notch by detecting a suction means whose pressure is not reduced by the notch. A sheet peeling device for peeling the adhesive sheet from a plate-like member having a notch formed on the outer edge and having the adhesive sheet attached to the other surface,
A support device for supporting the plate member;
A sheet holding means for holding the adhesive sheet by attaching a peeling tape to the adhesive sheet;
A moving means for separating the adhesive sheet from the plate-like member by relatively moving the support device and the sheet holding means in a predetermined relative movement direction;
The support device is provided with a support surface that supports one surface of the plate-like member, a plurality of openings that are open to the support surface and can be closed by an outer edge portion of the plate-like member, and can suck the plate-like member. Control for recognizing the position of the notch by detecting the suction means for detecting the pressure in each of the plurality of suction means and the suction means for which the pressure is not reduced by the notch. Means,
Based on the position of the notch recognized by the control means, the sheet holding means attaches a peeling tape to the adhesive sheet by relatively displacing the support device with respect to the sheet holding means and the moving means. A sheet peeling apparatus comprising positioning means for determining a position and a peeling direction of the adhesive sheet with respect to the plate-like member. The plate-like member has a circuit formed on the other surface, and an adhesive sheet is pasted on the circuit,
5. The sheet peeling apparatus according to claim 4, wherein the control means controls the positioning means so that a peeling edge of the adhesive sheet to be peeled does not become parallel to a side portion of the circuit. A sheet peeling method for peeling the adhesive sheet from a plate-like member having a notch formed on the outer edge and having the adhesive sheet attached to the other surface,
A supporting step of supporting the plate-like member by a supporting device;
A sheet holding process for holding the adhesive sheet by attaching a peeling tape to the adhesive sheet by a sheet holding means;
A moving step of moving the support device and the sheet holding means relative to each other in a predetermined relative moving direction by a moving means, and peeling the adhesive sheet from the plate-like member;
The supporting step includes a step of supporting one surface of the plate-like member with a support surface, an opening in the support surface that can be closed by an outer edge portion of the plate-like member, and the plate-like member can be sucked The position of the notch is recognized by detecting the pressure in the plurality of suction means, detecting the pressure in each of the plurality of suction means, and the suction means whose pressure is not reduced by the notch. Process,
Based on the recognized position of the notch, the position of the sheet holding means to apply the peeling tape to the adhesive sheet by relatively displacing the support device with respect to the sheet holding means and the moving means, and And a step of determining a peeling direction of the adhesive sheet with respect to the plate-like member. A sheet sticking device for sticking an adhesive sheet to the other surface of a plate-like member having a notch formed on the outer edge,
A support device for supporting the plate member;
Sheet supply means for feeding out the adhesive sheet and pressing the adhesive sheet against the plate-shaped member;
Moving means for attaching the adhesive sheet to the plate-like member by relatively moving the support device and the sheet supply means in a predetermined relative movement direction;
The support device is provided with a support surface that supports one surface of the plate-like member, a plurality of openings that are open to the support surface and can be closed by an outer edge portion of the plate-like member, and can suck the plate-like member. Control for recognizing the position of the notch by detecting the suction means for detecting the pressure in each of the plurality of suction means and the suction means for which the pressure is not reduced by the notch. Means,
Based on the position of the notch recognized by the control unit, the sheet supply unit brings the adhesive sheet into contact with the plate-like member by relatively displacing the support device with respect to the sheet supply unit and the moving unit. A sheet sticking device comprising positioning means for determining a position and a sticking direction of the adhesive sheet with respect to the plate-like member. The plate-like member has a circuit formed on the other surface,
8. The sheet sticking apparatus according to claim 7, wherein the control means controls the positioning means so that a sticking edge of the adhesive sheet to be stuck is not parallel to a side portion of the circuit. A sheet sticking method for sticking an adhesive sheet to the other surface of a plate-like member having a notch formed on the outer edge,
A supporting step of supporting the plate-like member by a supporting means;
A sheet supply step of drawing out the adhesive sheet by a sheet supply means and pressing the adhesive sheet against the plate-shaped member; and
Moving the supporting device and the sheet supply means relative to each other in a predetermined relative movement direction by moving means, and affixing an adhesive sheet to the plate-like member,
The supporting step includes a step of supporting one surface of the plate-like member with a support surface, an opening in the support surface that can be closed by an outer edge portion of the plate-like member, and suction of the plate-like member The position of the notch is recognized by detecting the pressure in the plurality of suction means, detecting the pressure in each of the plurality of suction means, and the suction means whose pressure is not reduced by the notch. Process,
Based on the recognized position of the notch, the position of the sheet supply unit to contact the adhesive sheet to the plate-like member by relatively displacing the support device with respect to the sheet supply unit and the moving unit, and And a step of determining a sticking direction of the adhesive sheet with respect to the plate-like member.

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