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JP2013080938A5 - - Google Patents

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Publication number
JP2013080938A5
JP2013080938A5 JP2012258048A JP2012258048A JP2013080938A5 JP 2013080938 A5 JP2013080938 A5 JP 2013080938A5 JP 2012258048 A JP2012258048 A JP 2012258048A JP 2012258048 A JP2012258048 A JP 2012258048A JP 2013080938 A5 JP2013080938 A5 JP 2013080938A5
Authority
JP
Japan
Prior art keywords
wafer holder
pressure
vacuum chuck
wafer
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2012258048A
Other languages
Japanese (ja)
Other versions
JP2013080938A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2012258048A priority Critical patent/JP2013080938A/en
Priority claimed from JP2012258048A external-priority patent/JP2013080938A/en
Publication of JP2013080938A publication Critical patent/JP2013080938A/en
Publication of JP2013080938A5 publication Critical patent/JP2013080938A5/ja
Withdrawn legal-status Critical Current

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Claims (2)

半導体ウエハを吸着して固定する真空チャックを備えたウエハ保持具と、上記ウエハ保持具と対向して配置され、片持ち梁の形状のプローブが設けられたカード基板と、上記ウエハ保持具と上記カード基板の間に密閉空間を作るために、上記ウエハ保持具と上記カード基板の間に上記半導体ウエハと上記プローブを取り囲むように設けられたスペーサを備え、上記密閉空間が減圧され、大気圧より低く、かつ、上記真空チャックの圧力よりも高い状態に維持されていることを特徴とする半導体検査装置。 A wafer holder provided with a vacuum chuck for adsorbing and fixing a semiconductor wafer, a card substrate disposed opposite to the wafer holder and provided with a cantilever probe, the wafer holder, and the wafer holder In order to create a sealed space between the card substrates, a spacer is provided between the wafer holder and the card substrate so as to surround the semiconductor wafer and the probe. A semiconductor inspection apparatus characterized in that it is kept at a low level and higher than the pressure of the vacuum chuck. 上記密閉空間の圧力と、上記真空チャックの圧力との差が、上記プローブの針圧の総和に応じて調整されていることを特徴とする請求項１記載の半導体検査装置。   2. The semiconductor inspection apparatus according to claim 1, wherein a difference between the pressure in the sealed space and the pressure in the vacuum chuck is adjusted in accordance with a sum of needle pressures of the probes.
JP2012258048A 2012-11-26 2012-11-26 Semiconductor inspection device Withdrawn JP2013080938A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012258048A JP2013080938A (en) 2012-11-26 2012-11-26 Semiconductor inspection device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012258048A JP2013080938A (en) 2012-11-26 2012-11-26 Semiconductor inspection device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2007267260A Division JP2009099630A (en) 2007-10-12 2007-10-12 Semiconductor inspection equipment

Publications (2)

Publication Number Publication Date
JP2013080938A JP2013080938A (en) 2013-05-02
JP2013080938A5 true JP2013080938A5 (en) 2013-09-26

Family

ID=48527045

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012258048A Withdrawn JP2013080938A (en) 2012-11-26 2012-11-26 Semiconductor inspection device

Country Status (1)

Country Link
JP (1) JP2013080938A (en)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3251194B2 (en) * 1997-04-03 2002-01-28 松下電器産業株式会社 Semiconductor wafer container
US6705876B2 (en) * 1998-07-13 2004-03-16 Formfactor, Inc. Electrical interconnect assemblies and methods

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