JP2013042681A - Wiring board for analyzing gene - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring board for analyzing a gene which is suitable for use in a method for gene analysis using nanopores.SOLUTION: The wiring board for analyzing a gene includes: a first electrical insulation layer 2; a plurality of detective electrodes 9 disposed in matrix on the top surface of the first electrical insulation layer 2; a second electrical insulation layer 3 laminated on the first electrical insulation layer 2, and formed with detective recesses 10 formed by laser beam machining with the detective electrodes 9 serving as the bottom surface; and an externally connective terminal 13 formed on the top surface of the second electrical insulation layer 3 and electrically connected to the detective electrodes 9. Because of having the detective recesses 10 of high dimensional accuracy formed by laser beam machining along with effecting good connection to the outside, the wiring board with nanopores, suitable for use in a method for gene analysis using nanopores, can be provided.

Description

  The present invention relates to a wiring board for gene analysis used for analyzing genes.

  In recent years, techniques for analyzing genes have made rapid progress. Among such techniques for analyzing genes, gene analysis methods using nanopores are attracting attention. This gene analysis method using nanopores is a method for detecting a change in current when a gene passes through a nanopore that is a pore having a size slightly larger than that of a gene molecule to read a base sequence.

JP 2001-242135 A

  The problem to be solved by the present invention is to provide a wiring board for gene analysis suitable for use in a gene analysis method using nanopores.

  The wiring board for gene analysis of the present invention is laminated on a first insulating layer, a plurality of detection electrodes arranged in a matrix on the upper surface of the first insulating layer, and the first insulating layer. And a detection recess having a detection electrode as a bottom surface is formed on the second insulating layer formed by laser processing and an upper surface of the second insulation layer, and is electrically connected to the detection electrode. And a connection terminal.

  The wiring board for gene analysis of the present invention is characterized in that the first insulating layer and the second insulating layer are formed of the same insulating material.

  Furthermore, the wiring board for gene analysis of the present invention is characterized in that the second insulating layer is thinner than the first insulating layer.

  Furthermore, in the wiring board for gene analysis of the present invention, a dummy electrode that occupies at least a portion where the external connection terminal is projected is disposed between the first insulating layer and the second insulating layer. It is characterized by this.

  According to the wiring board for gene analysis of the present invention, the first insulating layer, the plurality of detection electrodes arranged in a matrix on the upper surface of the first insulating layer, and the first insulating layer are stacked. A detection recess having a detection electrode as a bottom surface is formed on the second insulating layer formed by laser processing and the upper surface of the second insulation layer, and is electrically connected to the detection electrode. Since it has a terminal for external connection, it has a small concave part for detection with a high dimensional system formed by laser processing and has good connection with the outside, so it can be used for gene analysis using nanopores. A wiring board for gene analysis suitable for use can be provided.

  In addition, when the first insulating layer and the second insulating layer are formed using the same insulating material, warpage of the substrate can be reduced and the first insulating layer and the second insulating layer can be firmly stacked.

  Further, when the second insulating layer is made thinner than the first insulating layer, a detection recess that is fine and excellent in dimensional system can be easily formed in the second insulating layer by laser processing.

  Furthermore, when a dummy electrode that occupies at least a portion where the external connection terminal is projected is disposed between the first insulating layer and the second insulating layer, the flatness of the external connection terminal is kept good. Thus, the connection with the outside can be improved.

FIG. 1 is a schematic cross-sectional view showing an example of an embodiment of a wiring board for gene analysis of the present invention. 2 is a top view of the wiring board for gene analysis shown in FIG. FIG. 3 is an enlarged schematic cross-sectional view of a main part for explaining a method for using the wiring board for gene analysis of the present invention.

  Next, an example of an embodiment of the wiring board for gene analysis of the present invention will be described with reference to FIGS. As shown in FIG. 1, the wiring board 10 for gene analysis of this example is formed by laminating an insulating layer 2 and an insulating layer 3 on the upper and lower surfaces of the core substrate 1.

  The core substrate 1 is made of, for example, an electrically insulating material obtained by impregnating a glass cloth obtained by weaving glass fiber bundles vertically and horizontally with a thermosetting resin such as a bismaleimide triazine resin or an epoxy resin. The core substrate 1 has a thickness of about 100 to 1000 μm, and a through hole 4 having a diameter of about 100 to 300 μm is formed from the upper surface to the lower surface of the core substrate 1.

  Core conductor layers 5 are attached to the upper and lower surfaces of the core substrate 1 and the inner walls of the through holes 4. The core conductor layer 5 is made of a highly conductive metal material such as a copper foil having a thickness of about 5 to 25 μm or a copper plating layer. Furthermore, the inside of the through hole 4 to which the core conductor layer 5 is attached is filled with a hole filling resin 6 made of a thermosetting resin such as an epoxy resin.

  Such a core substrate 1 is formed as follows. First, a double-sided copper-clad plate is prepared in which a copper foil having a thickness of about 5 to 35 μm is deposited on both upper and lower surfaces of an insulating plate obtained by impregnating glass cloth with a thermosetting resin. Next, the through-hole 4 is drilled in the double-sided copper-clad plate by drilling or laser processing. Next, after desmearing the inside of the through hole 4, an electroless copper plating layer and an electrolytic copper plating layer are sequentially deposited in the through hole 4 and the upper and lower copper foil surfaces. The thickness of the electroless copper plating layer is about 0.1 to 1 μm, and the thickness of the electrolytic copper plating layer is about 5 to 25 μm. Next, a hole-filling resin 6 is filled in the through hole 4 provided with the electrolytic copper plating layer. The filling of the hole filling resin 6 is performed by filling the through hole 4 with a paste-like thermosetting resin by a screen printing method and then thermosetting it. The filled hole-filling resin 6 is flattened by polishing together with upper and lower copper plating layers. Next, an electroless copper plating layer and an electrolytic copper plating layer are sequentially deposited on the upper and lower end surfaces and the upper and lower copper plating layers of the planarized hole filling resin 6. The thickness of the electroless copper plating layer is about 0.1 to 1 μm, and the thickness of the electrolytic copper plating layer is about 5 to 25 μm. Finally, the core conductor layer 5 is obtained by patterning the copper foil and the copper plating layer thereon by a known subtractive method.

  The insulating layer 2 is made of an insulating material containing a thermosetting resin such as an epoxy resin. The insulating layer 2 has a thickness of about 30 to 50 μm, and via holes 7 having a diameter of about 50 to 100 μm are formed from the upper surface to the lower surface of the insulating layer 2. Such an insulating layer 2 is formed as follows, for example. First, a thermosetting resin film is laminated on the upper and lower surfaces of the core substrate 1. A vacuum press is used for lamination. The resin film contains an uncured thermosetting resin component and an inorganic insulating filler. Finally, after the resin film is thermally cured, laser processing is performed from the surface to drill the via hole 7. In addition, after drilling the via hole 7, a desmear process or a soft etching process is performed as needed.

  A conductor layer 8 is deposited on the surface of the insulating layer 2 and in the via hole 7. The conductor layer 8 is made of a highly conductive metal material such as a copper plating layer having a thickness of about 5 to 25 μm. A part of the conductor layer 8 forms a detection electrode 9 for detecting a current corresponding to the base sequence of the gene on the upper surface of the insulating layer 2. The detection electrodes 9 have a circular shape with a diameter of about 50 to 100 μm, and are arranged in a matrix at a pitch of about 100 to 200 μm.

  Such a conductor layer 8 is formed as follows. First, an electroless copper plating layer is deposited on the surface of the insulating layer 2 and the via hole 7. The thickness of the electroless copper plating layer is about 0.1 to 1 μm. Next, a plating resist layer having an opening corresponding to the pattern of the conductor layer 8 is deposited on the electroless copper plating layer. The plating resist layer is formed by adhering a photosensitive thermosetting resin film on the electroless plating layer and using a well-known photolithography technique to expose and develop a predetermined pattern. Next, an electrolytic copper plating layer is deposited on the electroless copper plating layer exposed in the opening of the plating resist layer. The thickness of the electrolytic copper plating layer is about 5 to 25 μm. Finally, after the plating resist layer is peeled and removed, the electroless copper plating layer exposed from the electrolytic copper plating layer is removed by etching to form the conductor layer 8.

  The insulating layer 3 is made of the same electrically insulating material as the insulating layer 2. The thickness of the insulating layer 3 is about 20 to 30 μm, and is about 5 to 25 μm thinner than the insulating layer 2. In the insulating layer 3, a detection recess 10 having a detection electrode 9 as a bottom surface is formed by laser processing. The opening diameter of the detection recess 10 is about 30 to 50 μm. Furthermore, a via hole 11 is formed in the insulating layer 3. The diameter of the via hole 11 is about 50 to 100 μm.

  Such an insulating layer 3 is formed as follows. First, a thermosetting resin film is laminated on the surface of the insulating layer 2 to which the conductor layer 8 is applied. A vacuum press is used for lamination. Finally, after the resin film is thermally cured, laser processing is performed from the surface to punch the detection recess 10 and the via hole 11. Note that after the detection recess 10 and the via hole 11 are drilled, a desmear process or a soft etching process is performed as necessary.

  A conductor layer 12 is deposited on the surface of the insulating layer 3 and in the via hole 11. The conductor layer 12 is made of a highly conductive metal material such as a copper plating layer having a thickness of about 5 to 25 μm. Part of the conductor layer 12 forms an external connection terminal 13 that is connected to an external analyzer on the surface of the end portion of the insulating layer 3. The external connection terminal 13 and the detection electrode 9 are electrically connected to each other through the conductor layer 8 and the core conductor layer 5. A dummy electrode 14 occupying at least a portion where the external connection terminal 13 is projected is disposed between the insulating layer 2 and the insulating layer 3 by the conductor layer 8. The dummy electrode 14 may be substantially the same pattern as the external connection terminal 13 or may be a solid pattern.

  Such a conductor layer 12 is formed by the same method as that for the conductor layer 8. First, an electroless copper plating layer is deposited on the surface of the insulating layer 3 and in the via hole 11. The thickness of the electroless copper plating layer is about 0.1 to 1 μm. Next, a plating resist layer having an opening corresponding to the pattern of the conductor layer 12 is deposited on the electroless copper plating layer. The plating resist layer is formed by adhering a photosensitive thermosetting resin film on the electroless plating layer and using a well-known photolithography technique to expose and develop a predetermined pattern. Next, an electrolytic copper plating layer is deposited on the electroless copper plating layer exposed in the opening of the plating resist layer. The thickness of the electrolytic copper plating layer is about 5 to 25 μm. Finally, after removing the plating resist layer, the conductive layer 12 is formed by etching away the electroless copper plating layer exposed from the electrolytic copper plating layer.

  Then, according to the wiring board for gene analysis of this example, as shown in the enlarged schematic sectional view of the main part in FIG. 3, the film M having the nanopore P is deposited so as to cover the detection recess 10 and the gene G The base sequence of gene G is detected by detecting the current generated according to its base sequence when passing through the nanopore P and analyzing the current with an external analyzer connected to the external connection terminal 13 Can do.

  In addition, the connection between the external connection terminal 13 and the external analysis device is performed by providing a socket corresponding to the external connection terminal 13 in the external analysis device and inserting the end portion on which the external connection terminal 13 is formed into the socket. Is done by.

  At this time, since the detection concave portion 10 is formed in the insulating layer 3 by laser processing, the dimensional accuracy in the fine detection concave portion 10 having an opening diameter of 30 to 50 μm is high, and thereby passes through the nanopore P. The current generated according to the base sequence of gene G can be accurately detected. Further, since the external connection terminal 13 is formed on the surface of the outermost insulating layer 3, when it is inserted into a socket provided in the external analyzer, the connection with the external analyzer is good. be able to. Therefore, according to the wiring board for gene analysis of this example, it is possible to provide a wiring board for gene analysis suitable for use in a gene analysis method using nanopores.

  Note that when the insulating layer 2 and the insulating layer 3 are formed of the same insulating material, the warpage of the substrate can be reduced and the lamination of the insulating layer 2 and the insulating layer 3 can be strengthened. Therefore, the insulating layer 2 and the insulating layer 3 are preferably formed of the same insulating material.

  Furthermore, if the thickness of the insulating layer 3 is made thinner than the thickness of the insulating layer 2, a fine detection recess having excellent dimensional accuracy can be easily formed in the insulating layer 3 by laser processing. Therefore, it is preferable to make the thickness of the insulating layer 3 thinner than the thickness of the insulating layer 2.

  Furthermore, when the dummy electrode 14 that occupies at least a portion where the external connection terminal 13 is projected is disposed between the insulating layer 2 and the insulating layer 3, the flatness of the external connection terminal 13 can be kept good. Thus, the connection with the outside can be made more reliable. Therefore, it is preferable to dispose a dummy electrode 14 that occupies at least a portion where the external connection terminal 13 is projected between the insulating layer 2 and the insulating layer 3.

  The wiring board for gene analysis of the present invention can also be used for analysis of substances other than genes.

2 First Insulating Layer 3 Second Insulating Layer 10 Detection Electrode 11 Detection Recess 13 External Connection Terminal 14 Dummy Electrode

Claims (4)

  A first insulating layer; a plurality of detection electrodes arranged in a matrix on the top surface of the first insulating layer; and the first insulating layer stacked on the first insulating layer, the detection electrode serving as a bottom surface A detection recess formed by laser processing, and an external connection terminal formed on an upper surface of the second insulation layer and electrically connected to the detection electrode. A wiring board for gene analysis, characterized by comprising:   The wiring board for gene analysis according to claim 1, wherein the first insulating layer and the second insulating layer are formed of the same insulating material.   The wiring board according to claim 1, wherein the second insulating layer is thinner than the first insulating layer.   4. A dummy electrode occupying at least a portion where the external connection terminal is projected is disposed between the first insulating layer and the second insulating layer. A wiring board for gene analysis according to claim 1.

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