JP2013038018A - Lighting fixture - Google Patents

Abstract

A lighting apparatus capable of reducing the number of light emitting modules and reducing the cost is provided.
An instrument main body 101 and a light source 102 held by the instrument main body 101 are provided. The light source 102 is formed by deforming the long light emitting module 1 in which a plurality of light emitting devices 30 are arranged in accordance with a desired shape of the light source 102.
[Selection] Figure 1

Description

  The present invention relates to a lighting fixture.

  Conventionally, as an LED lighting device, as shown in FIG. 37, an aluminum device body 202 formed in a substantially disk shape, and a plurality of LED modules 203 arranged in an annular shape on one surface side of the device body 202, There has been proposed (Patent Document 1). Here, the LED module 203 is mounted on a substrate 218 made of an electrical insulator such as ceramic or synthetic resin, a plurality of first to fourth light emitting units 219, 220, 221, 222 having different emission colors, and the substrate 218. Electrical connectors 231 and 231 are provided. The LED module 203 is fixed to the apparatus main body 202 by a fixing component (not shown) such as a screw passing through a fixing hole 233 provided in the substrate 218. The LED lighting device is electrically connected via an insulation-coated electric wire 232 in which LED modules 203 adjacent in the arrangement direction of the LED module 203 are wired between the electrical connectors 231 and 231.

JP 2009-283214 A

  In the LED lighting device of Patent Document 1, a plurality of LED modules 203 are arranged in a ring shape. Here, in the LED illumination device, the outer shape of the substrate 218 in the LED module 203 is formed in a regular octagon in front view, and the LED modules 203 are arranged at equal intervals. For this reason, a plurality of LED modules 203 that are regular octagons in front view are individually arranged with respect to the apparatus main body 202, and the LED modules 203 that are adjacent in the arrangement direction of the LED modules 203 are connected to each other via the insulation-coated wires 232. Therefore, it is necessary to make an electrical connection, which increases the cost. In addition, it is conceivable that the substrate 218 of the LED module 203 is formed in a fan shape or an arc shape in plan view. In these cases, a dedicated LED module is provided for each LED lighting device having a different shape and size. It is necessary to design and manufacture and manage 203, which increases costs.

  The present invention has been made in view of the above-described reasons, and an object of the present invention is to provide a lighting apparatus capable of reducing the number of light emitting modules and reducing the cost.

  The lighting fixture of the present invention includes a fixture main body and a light source held by the fixture main body, and the light source includes a long light emitting module in which a plurality of light emitting devices are arranged, and a desired shape of the light source. It is formed by being deformed according to the above.

  In this lighting apparatus, the light emitting device includes an LED chip, a phosphor that is excited by light emitted from the LED chip, and emits light having a color different from the light emission color of the LED chip, and a translucent material. A heat transfer plate having a color conversion unit, wherein the light emitting module is formed of a first metal plate, and the plurality of the LED chips and the color conversion unit corresponding to the LED chips are mounted on one side. A wiring pattern formed of a second metal plate and disposed on the other surface side of the heat transfer plate and electrically connected to the plurality of LED chips; and between the heat transfer plate and the wiring pattern And an insulating layer interposed between the plurality of unit patterns electrically connectable to the LED chip and one end side in a prescribed direction perpendicular to the parallel arrangement direction of the unit patterns. Connecting the unit patterns to each other and electrically connecting them, and a first slit that is open at the other end side in the prescribed direction and reaches the connecting piece, and the heat transfer plate has the first slit. It is preferable that the connecting piece protrudes from a plane including side edges of the unit patterns along the juxtaposed direction on the one end side.

  In this lighting apparatus, the light emitting module includes a terminal portion at each of both ends in the longitudinal direction, and the terminal portion includes a half piece obtained by halving the connecting piece, and power is supplied between the terminal portions. The plurality of light emitting devices preferably emit light.

  In this lighting fixture, the heat transfer plate is such that the first metal plate is an aluminum plate, and an aluminum film having a higher purity than the aluminum plate is laminated on the side opposite to the insulating layer side of the aluminum plate, It is preferable that an aluminum film is laminated with a reflection enhancing film made of two kinds of dielectric films having different refractive indexes.

  In this lighting apparatus, the LED chip is provided with a first electrode and a second electrode on one surface side in the thickness direction, and each of the first electrode and the second electrode is connected to the wiring via a wire. It is preferable that the heat transfer plate is formed with a through hole through which each of the wires passes.

  In this lighting apparatus, the desired shape is preferably annular.

  In this lighting fixture, the desired shape is preferably a double annular shape having different diameters.

  In this lighting apparatus, the light emitting color of the light emitting device in the light emitting module deformed according to the outer ring of the double rings is a light bulb color, and is deformed according to the inner ring. The light emission color of the light emitting device in the light emitting module is a daylight color, the light emitting module deformed according to the outer ring and the light emitting module deformed according to the inner ring However, it is preferable that each can be lit.

  In this lighting apparatus, the desired shape is preferably a spiral shape.

  In this lighting fixture, the shape of the fixture body is circular, and includes a glove attached to the fixture body so as to cover the light source on one side of the fixture body, and the light emitting module It is preferable that the surface is mounted on an inclined surface that is inclined so that the distance from the central portion becomes longer with respect to the central portion.

  In this lighting fixture, it is preferable that a thermal coupling portion that has electrical insulation and thermal conductivity to thermally couple the light emitting module and the fixture main body is provided between the light emitting module and the fixture main body.

  In this lighting fixture, it is preferable that the thermal coupling portion is formed of a soft heat conductive sheet interposed between the light emitting module and the fixture main body and in close contact with each of the light emitting module and the fixture main body.

  In this lighting fixture, it is preferable that the thermal coupling portion is formed of an insulating layer interposed between the light emitting module and the fixture main body and bonded to each of the light emitting module and the fixture main body.

  In this lighting fixture, it is preferable that a heat radiating member having a heat radiating fin is disposed on the side of the fixture main body opposite to the light emitting module side.

  In this lighting apparatus, it is preferable that a heat dissipation hole is provided in a buffer member mounted on a peripheral portion of the surface of the apparatus main body opposite to the light emitting module side.

  In this lighting fixture, it is preferable that the fixture main body holds a socket to be formed in accordance with the desired shape and to which the deformed light emitting module is attached.

  In this lighting fixture, the socket is preferably formed of an insulating material.

  In this lighting apparatus, it is preferable that the socket is made of a heat conductive material.

  In this lighting fixture, it is preferable that the socket is provided with a terminal for feeding power to the light emitting module.

  In the lighting fixture of the present invention, the number of light emitting modules can be reduced and the cost can be reduced.

It is a principal part schematic bottom view of the lighting fixture in Embodiment 1. FIG. It is a principal part schematic exploded perspective view of the lighting fixture of Embodiment 1. FIG. It is a schematic sectional drawing in the usage pattern of the lighting fixture of Embodiment 1. FIG. It is principal part explanatory drawing of the lighting fixture of Embodiment 1. FIG. It is principal part explanatory drawing of the lighting fixture of Embodiment 1. FIG. 1 is a schematic perspective view of a light emitting module according to Embodiment 1. FIG. (A) is a principal part schematic perspective view of the light emitting module in Embodiment 1, (b) is a principal part schematic perspective view in which the light emitting module in Embodiment 1 was partially broken. 3 is a schematic cross-sectional view of a main part of a light emitting module in Embodiment 1. FIG. 3 is a schematic plan view of a main part of the light emitting module according to Embodiment 1. FIG. (A) is the schematic perspective view seen from the one surface side of the mounting board | substrate in Embodiment 1, (b) is the schematic perspective view seen from the other surface side of the mounting board | substrate in Embodiment 1. FIG. FIG. 2 is a schematic exploded perspective view seen from the other surface side of the mounting board in the first embodiment. It is a schematic perspective view which shows an example which changed the shape of the mounting substrate in Embodiment 1. FIG. It is explanatory drawing of the method to change the shape of the mounting substrate in Embodiment 1. FIG. It is a schematic perspective view which shows the other example which changed the shape of the mounting board | substrate in Embodiment 1. FIG. FIG. 5 is a schematic cross-sectional view of a main part of another configuration example of the light emitting module according to Embodiment 1. FIG. 6 is a schematic cross-sectional view of a main part of still another configuration example of the light emitting module according to Embodiment 1. FIG. 5 is a schematic cross-sectional view of a main part of another configuration example of the light emitting module according to Embodiment 1. FIG. 6 is a schematic cross-sectional view of a main part of still another configuration example of the light emitting module according to Embodiment 1. FIG. 6 is an explanatory diagram of a mounting board manufacturing method according to the first embodiment. FIG. 6 is an explanatory diagram of a mounting board manufacturing method according to the first embodiment. FIG. 6 is an explanatory diagram of a mounting board manufacturing method according to the first embodiment. It is explanatory drawing of the manufacturing method of the light emitting module in Embodiment 1. FIG. It is a schematic perspective view of the light emitting module in Embodiment 2. FIG. 10 is an explanatory diagram of a mounting board manufacturing method in Embodiment 2. It is explanatory drawing of the manufacturing method of the light emitting module in Embodiment 2. FIG. It is a principal part schematic bottom view of the lighting fixture of Embodiment 3. FIG. It is a principal part schematic bottom view of the lighting fixture of Embodiment 4. It is a principal part schematic bottom view of the lighting fixture of Embodiment 5. FIG. It is a principal part schematic sectional drawing of the lighting fixture of Embodiment 6. FIG. It is a principal part schematic sectional drawing of the lighting fixture of Embodiment 7. FIG. It is a principal part schematic sectional drawing of the other structural example of the lighting fixture of Embodiment 7. FIG. It is principal part explanatory drawing of the example of another structure of the lighting fixture of Embodiment 7. FIG. It is principal part explanatory drawing of another structural example of the lighting fixture of Embodiment 7. FIG. It is principal part explanatory drawing of another structural example of the lighting fixture of Embodiment 7. FIG. It is a principal part schematic perspective view of the lighting fixture of Embodiment 8. FIG. It is a principal part schematic perspective view of the lighting fixture of Embodiment 9. FIG. It is explanatory drawing which shows arrangement | positioning of the LED module in the LED lighting apparatus of a prior art example.

(Embodiment 1)
Below, the lighting fixture of this embodiment is demonstrated based on FIGS.

  The lighting fixture includes a fixture main body 101 and a light source 102 held by the fixture main body 101. Here, the light source 102 is formed by deforming a long light emitting module 1 (see FIG. 6 and the like) in which a plurality of light emitting devices 30 are arranged in accordance with a desired shape of the light source 102. In this embodiment, the case where the desired shape of the light source 102 is an annular shape is illustrated.

  The lighting fixture is a ceiling light, the fixture body 101 has a circular shape, and includes a globe 103 (see FIG. 2) attached to the fixture body 101 so as to cover the light source 102 on one side of the fixture body 101. Yes.

  The instrument body 101 includes a circular base portion 111 that holds the light source 102 and a frame-shaped frame portion 112 to which the base portion 111 is coupled by a fixture (for example, a screw) 113. The base part 111 and the frame part 112 are preferably formed of a metal having good thermal conductivity such as copper or stainless steel (SUS). Accordingly, the lighting fixture can easily dissipate heat generated by the light source 102 through the fixture main body 101.

  The material of the base part 111 and the frame part 112 may be the same material or different materials. For example, regarding the material of the base part 111 and the frame part 112, the material of the base part 111 may be a metal, and the material of the frame part 112 may be a synthetic resin. The instrument body 101 may be one in which the base portion 111 and the frame portion 112 are integrally formed.

  The globe 103 is made of milky white translucent resin (for example, acrylic resin). Here, the globe 103 has a blindfold function for preventing the light source 102 from being visible from the outside, and a function for diffusing and transmitting the light emitted from the light source 102. In short, the globe 103 is used as a translucent cover.

  A circuit block 130 that can supply power to the light source 102 is disposed at the center of the instrument body 101. The circuit block 130 includes a lighting circuit for lighting the light source 102, a remote control receiving unit that receives a remote control signal (radio signal using infrared rays as a medium) transmitted from the remote control transmitter, and a lighting circuit based on the output of the remote control receiving unit. It is preferable to provide a control circuit for controlling. In addition, the circuit block 130 is a mounting adapter (not shown) for mechanically coupling and electrically connecting to a wiring device such as a hook ceiling that is arranged in advance in a building such as a house (constructed when the building is built). Preferably).

  When the wiring device is an AC wiring device connected to the AC distribution board, the AC adapter supplied to the mounting adapter is converted into an AC / DC converter that converts the AC voltage supplied from the AC distribution panel into a predetermined DC voltage. The circuit block 130 may include an AC / DC converter that converts an AC voltage supplied via the mounting adapter into a DC voltage. Further, when the wiring device is a DC wiring device connected to the DC distribution board, the DC / DC for converting the DC voltage supplied from the DC distribution panel to a predetermined DC voltage is attached to the mounting adapter. A converter may be built in, or the circuit block 130 may be configured to include a DC / DC converter that converts a DC voltage supplied via the mounting adapter into a predetermined DC voltage. The circuit configuration of the circuit block 130 is not particularly limited.

  The light emitting module 1 includes a mounting substrate 2 on which a plurality of light emitting devices 30 are mounted. In the light emitting module 1, the long mounting substrate 2 that can be deformed in a curved shape in a plan view and a side view is deformed according to a desired shape of the light source 102. Note that the light emitting module 1 can be used in a linear form without being deformed into a curved line, or can be used in a form other than a linear or curved form.

  The light emitting device 30 includes the LED chip 3 and a color conversion unit 37 that includes a phosphor and a translucent material that are excited by light emitted from the LED chip 3 and emit light having a color different from the emission color of the LED chip 3. And have.

  As shown in FIG. 2, the globe 103 is formed in a dome shape having a circular opening on the upper surface, and a mouth tube 103a is erected around the entire periphery of the opening. On the inner peripheral surface of the mouth tube 103a, a plurality of (six in this embodiment) locking claws 103b having a height smaller than that of the mouth tube 103a are projected at predetermined intervals. A glove attachment member 114 that can engage with the locking claw 103 b of the globe 103 is fixed to the peripheral portion of the lower surface of the instrument body 101. The globe attachment members 114 are arranged at substantially equal intervals along the circumferential direction of the instrument main body 101. The globe attaching member 114 is fixed to the instrument body 101 by a fixing screw (not shown). The glove attachment member 114 holds the locking claw 103 b of the glove 103 between the lower surface of the instrument main body 101. Here, the glove attachment member 114 is engaged when the glove 103 is rotated with respect to the instrument body 101 in a state where the upper edge of the mouthpiece 103 a of the glove 103 is in contact with the peripheral portion of the lower surface of the instrument body 101. The pawl 103b is inserted between the glove attachment member 114 and the lower surface of the instrument body 101, so that the glove 103 is held. Therefore, in the lighting fixture of this embodiment, when the globe 103 is rotated in the opposite direction, the locking claw 103b can be removed from the globe mounting member 114 and the globe 103 can be detached from the fixture body 101. As shown in FIG. 3, a buffer member 106 that can come into contact with a construction surface made of a lower surface such as a ceiling material 160 is provided on the peripheral portion of the upper surface of the instrument main body 101.

  Below, the mounting board | substrate 2 is demonstrated based on FIGS. 10-14, and the light-emitting module 1 provided with this mounting board | substrate 2 is demonstrated based on FIGS. 6-9 after that.

  The mounting substrate 2 includes a heat transfer plate 21 on which a plurality of LED chips 3 can be mounted on one surface side, and a wiring pattern that is disposed on the other surface side of the heat transfer plate 21 and that can electrically connect the plurality of LED chips 3. 22 and an insulating layer 23 interposed between the heat transfer plate 21 and the wiring pattern 22.

  Here, the heat transfer plate 21 is formed of a first metal plate, and the wiring pattern 22 is formed of a second metal plate different from the first metal plate. The mounting substrate 2 is formed in a long shape as a whole, and a plurality of LED chips 3 can be mounted in a matrix of 2 rows and 40 columns with the longitudinal direction as the row direction and the short direction as the column direction. It is constituted as follows. Therefore, the mounting substrate 2 can mount 80 LED chips 3. The number of LED chips 3 that can be mounted on the mounting substrate 2 is not particularly limited.

  As a material of the first metal plate that is the basis of the heat transfer plate 21, a metal having high thermal conductivity such as aluminum and copper is preferable. However, the material of the first metal plate is not limited to these, and may be stainless steel or steel, for example.

  The heat transfer plate 21 is formed with a through hole 21b through which each of the wires 26 that are wirings for electrically connecting the LED chip 3 and the wiring pattern 22 are passed. The through holes 21 b are formed on both sides of the LED chip 3 mounting region in the longitudinal direction of the heat transfer plate 21.

  The through hole 21b has a circular opening shape. The inner diameter of the through hole 21b is set to 0.5 mm, but this value is an example and is not particularly limited. The shape of the through hole 21b is not limited to a circular shape, and may be, for example, a rectangular shape or an elliptical shape.

  The insulating layer 23 is formed with through holes 23 b communicating with the respective through holes 21 b of the heat transfer plate 21. Accordingly, when the LED chip 3 is mounted on the mounting substrate 2, the LED chip 3 and the wiring pattern 22 are electrically connected through the through hole 21 b of the heat transfer plate 21 and the through hole 23 b of the insulating layer 23, for example. can do.

  Further, as the second metal plate serving as the basis of the wiring pattern 22, a lead frame 320 (see FIG. 21A) formed by punching a metal hoop material with a press is used.

  The material of the second metal plate is preferably copper having a relatively high thermal conductivity among metals (the thermal conductivity of copper is about 398 W / m · K), but is not limited to copper, for example, phosphor bronze, etc. Alternatively, a copper alloy (for example, 42 alloy) may be used. Moreover, it is preferable to set the thickness of a 2nd metal plate in the range of about 100 micrometers-1500 micrometers, for example.

  In the lead frame 320, the wiring pattern 22 is supported on the inner side of the outer frame portion 321 via a support piece 322 (see FIG. 21A).

  In the mounting substrate 2 described above, the wiring pattern 22 includes a plurality of unit patterns 22u that can electrically connect the LED chips 3, and unit patterns 22u on one end side in a specified direction orthogonal to the direction in which the unit patterns 22u are arranged in parallel. A connecting piece (hereinafter referred to as a first connecting piece) 22c that is connected and electrically connected, and a linear first slit 22d that opens to the first connecting piece 22c at the other end in the prescribed direction. ing. The first connection piece 22c has a rectangular planar shape. Here, it is preferable that the 1st connection piece 22c is extended from the side edge of each unit pattern 22u along the said juxtaposition direction in the said one end side. In other words, the first connecting piece 22c preferably protrudes from the plane including the side edges of the unit patterns 22u along the juxtaposed direction on the one end side. The first slit 22d is formed longer than the entire length of the unit pattern 22u in the specified direction. In short, a part of the first slit 22d is formed in the first connecting piece 22c. Therefore, the first connecting piece 22c can be bent with the first portion along the longitudinal direction of the first slit 22d as the first fold, and the width direction of the first slit 22d at the end position of the first slit 22d. It is possible to bend the second part along the second fold.

  In the mounting substrate 2, the heat transfer plate 21 has a linear second slit 21d that overlaps the first slit 22d. Here, the heat transfer plate 21 includes the same number of heat transfer units 21u as the number of unit patterns 22u arranged in the parallel direction, and connects adjacent heat transfer units 21u on one end side in the specified direction. A connecting piece (hereinafter referred to as a second connecting piece) 21c. And the 2nd slit 21d in the heat exchanger plate 21 is formed so that the other end side of the said prescription | regulation direction may be open | released and the 2nd connection piece 21c may be reached. Further, in the mounting substrate 2, the insulating layer 23 has a linear third slit 23d that overlaps the first slit 22d. Here, in the insulating layer 23, the same number of insulating units 23u as the number of unit patterns 22u are arranged in the parallel direction, and a connecting piece (which connects adjacent insulating units 23u on one end side in the prescribed direction) (Hereinafter referred to as a third connecting piece) 23c.

  In the mounting substrate 2, a unit pattern 22u, a heat transfer unit 21u corresponding to the unit pattern 22u, and an insulating unit 23u corresponding to the unit pattern 22u constitute one substrate unit 2u. A number of substrate units 2u are provided. In the mounting substrate 2, adjacent substrate units 2u are connected by a connecting portion 2c including a first connecting piece 22c, a second connecting piece 21c, and a third connecting piece 23c. The mounting board 2 illustrated in FIG. 10 and FIG. 11 includes five board units 2u, and in each board unit 2u, 16 electronic components can be arranged in a matrix of 2 rows and 8 columns. It has become. The number of substrate units 2u is not particularly limited.

  Further, the mounting substrate 2 includes terminal portions 2f at both ends in the longitudinal direction. The terminal portion 2f includes a first half piece 22f obtained by halving the first connection piece 22c, a second half piece 21f obtained by halving the second connection piece 21c, and a third part obtained by halving the third connection piece 23c. It is composed of a half piece 23f.

  The insulating layer 23 contains a filler made of a filler such as silica or alumina, and has a property of lowering viscosity during heating and improving fluidity, and a B-stage epoxy resin layer (thermosetting resin) and two sheets It is formed by thermosetting an epoxy resin layer of a thermosetting sheet-like adhesive (for example, an adhesive sheet TSA manufactured by Toray Industries, Inc.) on which a plastic film (PET film) is laminated.

  Here, the two plastic films are laminated one by one on both surfaces in the thickness direction of the epoxy resin layer of the B stage. As the filler, an insulating material having higher thermal conductivity than the epoxy resin that is a thermosetting resin may be used. Here, the epoxy resin layer of the sheet-like adhesive has properties of being electrically insulating and having high thermal conductivity, high fluidity during heating, and high adhesion to the uneven surface. In the mounting substrate 2 provided with the insulating layer 23 formed by the epoxy resin layer of the sheet-like adhesive, it is possible to prevent a gap from being generated between the insulating layer 23 and the heat transfer plate 21 and the wiring pattern 22. As a result, the contact reliability is improved, and it is possible to suppress the increase in thermal resistance and the occurrence of variations due to insufficient contact.

  Thus, the mounting substrate 2 has a wiring pattern 22 from each LED chip 3 as compared to a case where a rubber sheet-like heat radiation sheet such as Sarcon (registered trademark) is sandwiched between the heat transfer plate 21 and the wiring pattern 22. It is possible to reduce the thermal resistance of the LED chips 3, improve the heat dissipation, and suppress the temperature rise of each LED chip 3. The thickness of the epoxy resin layer described above is set to 100 μm, but this value is merely an example, and is not particularly limited. For example, the thickness may be appropriately set in the range of about 50 μm to 150 μm. Note that the thermal conductivity of the epoxy resin layer is preferably 4 W / m · K or more. Further, the plastic film of the sheet adhesive is peeled off from the epoxy resin layer before the wiring pattern 22 and the heat transfer plate 21 are overlapped. In short, after one plastic film in the epoxy resin layer is peeled off, one surface opposite to the other plastic film side is fixed to the object, and then the other plastic film is peeled off.

  Here, when the insulating layer 23 is formed, the heat transfer plate 21, the epoxy resin layer, and the lead frame 320 having the wiring pattern 22 may be appropriately pressed together.

  The outer size of the insulating layer 23 may be set as appropriate based on the outer size of the lead frame 320. Here, the insulating layer 23 has electrical insulation and thermal conductivity, and has a function of electrically insulating and thermally coupling the heat transfer plate 21 and the wiring pattern 22.

  Further, the wiring pattern 22 is made of a metal material having higher oxidation resistance and corrosion resistance than the second metal plate, and a surface treatment layer (not shown) having high adhesion to the insulating layer 23 is formed. Is preferred. When the material of the second metal plate is Cu, as the surface treatment layer, for example, a Ni film, a laminated film of Ni film and Au film, a laminated film of Ni film, Pd film and Au film, or the like may be formed. preferable. The surface treatment layer may be formed by, for example, a plating method.

  As described above, the mounting substrate 2 described above includes a plurality of LED chips 3 formed of the first metal plate and a heat transfer plate 21 on which the color conversion unit 37 corresponding to each LED chip 3 can be mounted on one side. A wiring pattern 22 formed of a second metal plate and disposed on the other surface side of the heat transfer plate 21 and capable of electrically connecting a plurality of LED chips 3, and between the heat transfer plate 21 and the wiring pattern 22. And an insulating layer 23 interposed therebetween. The mounting board 2 includes a plurality of unit patterns 22u that can be electrically connected to the LED chip 3, and wiring patterns 22 between the unit patterns 22u on one end side in a prescribed direction perpendicular to the direction in which the unit patterns 22u are arranged in parallel. A second connecting piece 22c that is connected and electrically connected, and a first slit 22d that is opened at the other end in the prescribed direction and reaches the connecting piece 22c, and the heat transfer plate 21 overlaps the first slit 22c. A slit 22d is provided. Thus, the mounting substrate 2 is bent into the arch shape as shown in FIG. 12, for example, by bending the first portion of each of the first connecting pieces 22c as the first fold. Can be mounted on a polyhedron.

  In addition, as described above, in the mounting substrate 2, it is preferable that the first connecting piece 22 c protrudes from the plane including the side edges of the unit patterns 22 u along the juxtaposed direction on the one end side. As a result, the mounting substrate 2 can bend the connecting portion 2c as shown in FIG. 13A with the second portion of the first connecting piece 22c as the second fold, and further, the first connecting piece 22c. It is also possible to bend the connecting portion 2c as shown in FIG. 13 (b) with the first portion of the first fold as the first fold. Thereby, the mounting substrate 2 can change the planar shape into an arc shape as shown in FIG. 14, for example.

  Next, the light emitting module 1 using the mounting substrate 2 will be described with reference to FIGS.

  The light emitting module 1 includes a mounting substrate 2 and a plurality of LED chips 3 (see FIGS. 7 to 9) mounted on the mounting substrate 2.

The heat transfer plate 21 preferably has a function as a reflecting plate, and more preferably employs aluminum as the material of the first metal plate. Further, in the heat transfer plate 21, the first metal plate is an aluminum plate, an aluminum film having a higher purity than the aluminum plate is laminated on the side opposite to the insulating layer 23 side of the aluminum plate, and the refractive index of the aluminum film is different. It is preferable that a reflection enhancing film made of two kinds of dielectric films is laminated. Here, as the two types of dielectric films, for example, an SiO ₂ film and a TiO ₂ film are preferably employed. By using such a heat transfer plate 21, the reflectance with respect to visible light can be 95% or more. As the heat transfer plate 21, for example, MIRO2 or MIRO (registered trademark) manufactured by alanod can be used. As the above-mentioned aluminum plate, an anodized surface may be used. In addition, what is necessary is just to set the thickness of the heat exchanger plate 21 suitably in the range of about 0.2-3 mm, for example.

  As shown in FIG. 8, the LED chip 3 is provided with a first electrode (anode electrode) 31 and a second electrode (cathode electrode) 32 on one surface side in the thickness direction, and the other surface side in the thickness direction is a joint portion. It is joined to the heat transfer plate 21 via 35. In the LED chip 3, each of the first electrode 31 and the second electrode 32 is electrically connected to the wiring pattern 22 via a wire (bonding wire) 26. Here, the heat transfer plate 21 is formed with the above-described through-holes 21 b through which the wires 26 can pass. The through holes 21 b are formed on both sides of each mounting region of each LED chip 3 in the longitudinal direction of the heat transfer plate 21. What is necessary is just to form the junction part 35 with a die-bonding material.

  The LED chip 3 is a GaN-based blue LED chip that emits blue light and uses a sapphire substrate as a substrate. However, the substrate of the LED chip 3 is not limited to a sapphire substrate, and may be a GaN substrate, a SiC substrate, a Si substrate, or the like, for example. The structure of the LED chip is not particularly limited.

  The chip size of the LED chip 3 is not particularly limited, and for example, those having a chip size of 0.3 mm □, 0.45 mm □, or 1 mm □ can be used.

  Moreover, the material and luminescent color of the light emitting layer of the LED chip 3 are not particularly limited. That is, the LED chip is not limited to the blue LED chip, and for example, a violet light LED chip, an ultraviolet light LED chip, a red LED chip, a green LED chip, or the like may be used.

  As the die bond material, for example, a silicone die bond material, an epoxy die bond material, a silver paste, or the like can be used.

  Moreover, as the wire 26, a gold wire, an aluminum wire, etc. can be used, for example.

  By the way, it is preferable that the light emitting module 1 is provided with the sealing part 36 which sealed the LED chip 3 and the wire 26 in the said one surface side of the heat exchanger plate 21, for example, as shown in FIG. In FIG. 8, a silicone resin that is a first light transmissive material is used as the material of the sealing portion 36. The first light transmissive material is not limited to a silicone resin, and for example, an epoxy resin, an acrylic resin, glass, or the like may be used.

  Moreover, it is preferable that the light emitting module 1 is provided with the color conversion part 37 which has the wavelength conversion material which radiates | emits the light of the color different from the luminescent color of an LED chip, in order to obtain white light of high output. As such a color conversion unit 37, for example, a phosphor that is excited by light emitted from the LED chip and emits light of a color different from the emission color of the LED chip is used as the wavelength conversion material. Those containing two light-transmitting materials are preferred.

  For example, if the light emitting module 1 uses a blue LED chip as the LED chip 3 and a yellow phosphor as the phosphor of the color conversion unit 37, white light can be obtained. That is, the light emitting module 1 emits the blue light emitted from the LED chip 3 and the light emitted from the yellow phosphor through the surface of the color conversion unit 37 and can obtain white light. Silicone resin is used as the second translucent material used as the material of the color conversion unit 37, but is not limited to this. For example, acrylic resin, glass, organic component and inorganic component are mixed at the nm level or the molecular level. Alternatively, a combined organic / inorganic hybrid material may be employed. Further, the phosphor used as the material of the color conversion unit 37 is not limited to the yellow phosphor. For example, the color rendering can be achieved by using a yellow phosphor and a red phosphor, or using a red phosphor and a green phosphor. It becomes possible to raise. The phosphor used as the material of the color conversion unit 37 is not limited to one type of yellow phosphor, and two types of yellow phosphors having different emission peak wavelengths may be used.

  Further, when the LED chip 3 alone can emit white light, when the phosphor is dispersed in the sealing portion 36, or the light color desired to be obtained by the light emitting module 1 is the same as the emission color of the LED chip 3. In this case, a structure that does not include the color conversion unit 37 can be employed.

  In the light emitting module 1, the color conversion unit 37 is preferably in contact with the heat transfer plate 21. Thereby, the light emitting module 1 can dissipate not only the heat generated in the LED chip 3 but also the heat generated in the color conversion unit 37 through the heat transfer plate 21, thereby increasing the light output. It becomes possible. In the example illustrated in FIG. 8, the color conversion unit 37 is formed in a dome shape, and the LED chip 3 and the sealing unit 36 are provided between the heat transfer plate 21 and the heat transfer plate 21 on the one surface side. It is arranged in a form surrounding. More specifically, the color conversion unit 37 is disposed such that a gas layer (for example, an air layer) 38 is formed between the heat transfer plate 21 and the sealing unit 36 on the one surface side.

  As shown in FIG. 15, the light emitting module 1 may be configured such that the color conversion unit 37 has a hemispherical shape, and the LED chip 3 and the wire 26 are sealed by the color conversion unit 37. In the light emitting module 1, as shown in FIG. 16, the color conversion unit 37 may be formed in a dome shape, and the LED chip 3 and the wire 26 may be sealed by the color conversion unit 37. In the light emitting module 1, as shown in FIG. 17, the color conversion unit 37 may have a layered shape, and the LED chip 3 and the wire 26 may be sealed by the color conversion unit 37. In addition, the color conversion part 37 like FIG.8 and FIG.16 uses what was shape | molded. , Silicone resin, epoxy resin, or the like). Moreover, the color conversion part 37 as shown in FIG. 15 can be formed by a shaping | molding method, for example. Moreover, the color conversion part 37 as shown in FIG. 17 can be formed by the apply | coating method using a dispenser, the screen printing method, etc., for example.

  In the examples shown in FIGS. 8, 15, 16, and 17, the wire 26 is bonded to the wiring pattern 22. However, as shown in FIG. Alternatively, a protrusion 22h to be inserted into the through hole 21b of the heat transfer plate 21 may be provided, and the wire 26 may be bonded to the tip surface of the protrusion 22h.

  In each of the unit patterns 22u, the wiring pattern 22 has two first patterns 22a to which the first electrodes 31 of the LED chip 3 are connected and two second patterns 22b to which the second electrodes 32 are connected. . Here, the first pattern 22a and the second pattern 22b are formed in a comb shape in plan view. The unit pattern 22u includes two first patterns 22a and second patterns 22b arranged side by side in the longitudinal direction of the substrate unit 2u, and each of the first patterns 22a and the second pattern 22b in the short direction of the substrate unit 2u. The two patterns 22b are arranged in a complicated manner. Here, in the unit pattern 22u, the comb portions 22aa and 22ba of the first pattern 22a and the second pattern 22b arranged side by side in the short direction of the substrate unit 2u face each other, and in the longitudinal direction of the substrate unit 2u. The comb teeth 22aa of the first pattern 22a and the comb teeth 22bb of the second pattern 22b are alternately arranged. And the comb-tooth part 22bb of the 2nd pattern 22b in the center part in the longitudinal direction of the board | substrate unit 2u and the comb-tooth part 22ab of the 1st pattern 22a are formed continuously, and are electrically connected. Other than that, a gap is formed between the comb teeth 22bb of the second pattern 22b and the comb teeth 22ab of the first pattern 22a in the longitudinal direction of the substrate unit 2u.

  In the light emitting module 1, the LED chips 3 are arranged in a two-dimensional array (matrix) with i rows and j columns (where i = 2, j = 8) for each substrate unit 2u. A parallel circuit in which series circuits of j LED chips 3 arranged in the longitudinal direction (row direction) of 2u are connected in parallel is provided. Further, the light emitting module 1 includes m parallel units (m = 5 in the example of FIG. 6), which is the number of unit units 2u, and the parallel circuits formed for the adjacent substrate units 2u are connected in series. It is connected. Moreover, the light emitting module 1 can be made to light-emit each LED chip 3 by supplying electric power between the above-mentioned two terminal parts 2f, and supplying electric power with respect to all the LED chips 3. FIG. The number of LED chips 3 to be mounted for each substrate unit 2u is not particularly limited, and the arrangement form is not particularly limited, and is not limited to a two-dimensional array, for example, a one-dimensional array (for example, i = 1, j = 8). Further, when a plurality of light emitting modules 1 are used in line with a desired shape of the light source 102, the adjacent light emitting modules 1 are connected to, for example, a connector 105 (FIG. 5A, FIG. The electrical connection may be made by, for example, b). And the connector 108 (FIG. 4) provided in the front-end | tip of a pair of electric wire 107 and 107 led out from the circuit block 130 to the terminal part 2f on the opposite side to the adjacent light emitting module 1 side in each light emitting module 1 of both ends. (See (a) and (b)) may be electrically connected. Thereby, it is possible to supply power from one circuit block 130 (see FIG. 3) to the series circuit of the plurality of light emitting modules 1 to cause all LED chips 3 of each light emitting module 1 to emit light. Become. In addition, the terminal portion 2f can be functioned as a mating connector to which the connector 105 and the connector 108 are detachably coupled and electrically connected, so that the space between the light emitting modules 1 and the light emitting module 1 can be connected. Space for power supply can be saved. Here, as shown in FIG. 1, the number of substrate units 2 u necessary to realize a light source 102 having a desired shape is an even number of 4 or more, and the desired shape of the light source 102 is realized by two or more light emitting modules 1. In this case, if the number of light emitting modules 1 obtained by dividing the even number by an integer of 2 or more is arranged, the cost can be reduced by sharing the light emitting modules 1. For example, when the required number of substrate units 2u is 12 and the desired shape of the light source 102 is realized by three light emitting modules 1, the number of substrate units 2u in each light emitting module 1 is four. Therefore, it is possible to reduce the cost by sharing the light emitting module 1. In other words, if the light emitting module 1 having four substrate units 2u is prepared as a unit light emitting module and the light source 102 having a desired shape is realized by combining the unit light emitting modules, the components By sharing, it is possible to improve productivity and reduce management costs, thereby reducing costs. However, the unit light emitting module is not limited to the number of substrate units 2u being four, and for example, the number of substrate units 2u may be plural. When the light source 102 is configured by only one light emitting module 1, the connector 108 and the like may be electrically connected to the terminal portions 2 f at both ends of the light emitting module 1.

  In any case, the light emitting module 1 has a plurality of LED chips 3 mounted on the mounting substrate 2, and the mounting substrate 2 includes the above-described insulating layer 23 between the heat transfer plate 21 and the wiring pattern 22. ing. Thereby, the light emitting module 1 can reduce the thermal resistance from each LED chip 3 to the wiring pattern 22 as compared with a case where a rubber sheet-like heat radiation sheet is sandwiched between the heat transfer plate 21 and the wiring pattern 22. Thus, it is possible to reduce variation in thermal resistance. As a result, the light emitting module 1 has improved heat dissipation and can suppress the temperature rise of the junction temperature of each LED chip 3, so that the input power can be increased and the light output can be increased. It becomes. In addition, as a rubber sheet-like heat dissipation sheet, there is, for example, Sarcon (registered trademark).

  Further, as described above, the insulating layer 23 is formed with through holes 23 b communicating with the respective through holes 21 b of the heat transfer plate 21. Therefore, when manufacturing the light emitting module 1, the wire 26 can be bonded to the wiring pattern 22 through the through hole 21 b of the heat transfer plate 21 and the through hole 23 b of the insulating layer 23. Here, at the time of manufacturing the light emitting module 1, the first electrode 31 and the second electrode 32 of the LED chip 3 are respectively connected to the first pattern 22 a and the second pattern 22 b through the wire 26, and then, for example, by a dispenser or the like. The through hole 21b and the through hole 23b are filled with the material of the sealing portion 36 (see FIG. 8) so that the wire 26 does not contact the heat transfer plate 21, and then the sealing portion 36 is formed.

  By the way, depending on the size of the heat capacity of the heat transfer plate 21, if the heating temperature of the above-mentioned epoxy resin layer is raised to about 170 ° C. and cured, the fixing performance between the heat transfer plate 21 and the wiring pattern 22 decreases, and heating is performed. When the temperature is lowered to about 150 ° C. and cured, the electrical insulation between the heat transfer plate 21 and the wiring pattern 22 may be lowered. That is, there is a trade-off relationship between fixing performance and electrical insulation. Therefore, in the present embodiment, as described later, the epoxy resin layer (hereinafter referred to as the first epoxy resin layer) of the first sheet-like adhesive 323 (FIG. 19A) and the second sheet-like adhesive. 333 (see FIG. 19B) and an epoxy resin layer (hereinafter referred to as a second epoxy resin layer) are overlaid, and the first epoxy resin layer is cured at 170 ° C. to thereby achieve electrical insulation and heat conduction. The second epoxy resin layer is cured at 150 ° C. to secure the fixing performance and the thermal conductivity. More specifically, after the first epoxy resin layer is fixed to the heat transfer plate 21 as an object at 170 ° C., the second epoxy resin layer and the lead frame 320 are overlapped to form the second epoxy resin layer at 150 ° C. It is sufficient to cure with. Thereby, in manufacturing the mounting substrate 2 and the light emitting module 1, it is possible to satisfy both the requirements of the fixing performance and the electric insulation regardless of the heat capacity of the heat transfer plate 21.

  Hereinafter, a method for manufacturing the mounting substrate 2 will be briefly described with reference to FIGS. 19 and 20.

  First, as shown in FIG. 19A, a sheet-like adhesive 323 from which a first protective sheet 323a made of one plastic film is peeled off is used as a first metal plate whose first epoxy resin layer is the basis of the heat transfer plate 21. The first specified temperature (for example, lower than the curing temperature of the first epoxy resin layer) while being pressed so as to be in contact with the sheet-like member 420 using pressure and being pressurized by a cylindrical rubber roller 340 at a predetermined pressure (for example, 0.5 MPa). 110 ° C. to 120 ° C.) to temporarily fix the first sheet-like adhesive 323 to the sheet-like member 420. Then, the first epoxy resin layer is permanently fixed to the sheet-like member 420 by heating and pressurizing and curing the first epoxy resin layer at a temperature equal to or higher than the curing temperature (for example, 170 ° C.). In FIG. 19A, an unwinding machine 351 for unwinding the sheet-like member 420, a winder 352 for winding the sheet-like member 420, an unwinding machine 353 for unwinding the first sheet-like adhesive 323, A winder 354a for winding up the first protective sheet 323a of the first sheet-like adhesive 323 is schematically shown.

  Thereafter, as shown in FIG. 19B, the sheet-like member 420 to which the first sheet-like adhesive 323 is permanently fixed is naturally cooled. Subsequently, the second protective sheet 323b made of the other plastic film in the first sheet-like adhesive 323 is peeled off from the first epoxy resin layer. Thereafter, a second sheet-like adhesive 333 obtained by peeling off the third protective sheet 333a made of one plastic film is stacked on the first epoxy resin layer so that the second epoxy resin layer is in contact with the first epoxy resin layer. The second sheet is pressed by a columnar rubber roller 340 at a predetermined pressure (for example, 0.5 MPa) and heated at a first specified temperature (for example, 110 ° C. to 120 ° C.) lower than the curing temperature of the second epoxy resin layer. A temporary adhesive 333 is temporarily fixed to the first epoxy resin layer. In FIG. 19B, a winder 354b that winds up the second protective sheet 323b of the first sheet-like adhesive 323, an unwinder 355 that unwinds the second sheet-like adhesive 333, and the second A winder 356a for winding up the third protective sheet 333a of the sheet-like adhesive 333 is also schematically shown.

  Thereafter, as shown in FIG. 19C, in the laminated structure of the sheet-like member 420, the first epoxy resin layer, and the second epoxy resin layer, the through hole 21 b of the heat transfer plate 21 and the through hole 23 b of the insulating layer 23. A through hole 334 is formed in each region corresponding to 1 by, for example, a punch press 370.

  Then, as shown to Fig.20 (a), the 4th protection sheet 333b which consists of the other plastic film in the 2nd sheet-like adhesive agent 333 is peeled from a 2nd epoxy resin layer. Thereafter, the lead frame 320 is stacked so as to be in contact with the second epoxy resin layer, and is pressed by a cylindrical rubber roller 380 at a predetermined pressure (for example, 0.5 MPa) and lower than the curing temperature of the second epoxy resin layer. The lead frame 320 is temporarily fixed to the second epoxy resin layer by heating at a specified temperature (eg, 110 ° C. to 120 ° C.). 20A also schematically shows a winder 356b that winds up the fourth protective sheet 333b of the second sheet-like adhesive 333, and an unwinder 357 that winds up the lead frame 320. .

  After that, the press frame 390 pressurizes and heats the second epoxy resin layer via the lead frame 320, and cures the lead frame 320 and the second epoxy resin layer at a temperature equal to or higher than the curing temperature (for example, 150 ° C.). And fix this. Thereby, the insulating layer 23 is formed.

  Thereafter, the laminated body of the sheet-like member 420, the insulating layer 23, and the lead frame 320 is divided into portions corresponding to the individual mounting substrates 2 as shown in FIG. A mounting board is obtained by cutting the support piece 322 (see FIG. 21A) between the outer frame portion 321 (see FIG. 21A) of the lead frame 320 and the wiring pattern 22 and removing the outer frame portion 321. Get 2. The mounting substrate 2 obtained at this stage has the shape shown in FIG. 21C and FIG. 22A, is formed by the sheet-like member 420 described above, and the outer frame portion 321 of the lead frame 320 via the insulating layer 23. The outer frame portion 21g is joined. The outer frame portion 21g is connected to the heat transfer plate 21 via a support piece 21h formed by the sheet-like member 420. 21A is a schematic exploded perspective view of the mounting substrate 2 of FIG. 21C, and FIG. 21B is an outer frame portion of the lead frame 320 in the mounting substrate 2 of FIG. 21C. It is a schematic perspective view before removing 321.

  Next, the manufacturing method of the light emitting module 1 is demonstrated based on FIG.

  In manufacturing the light emitting module 1, first, the LED chip 3 is mounted on the one surface side of the mounting substrate 2 shown in FIG. Each of the electrodes 32 is electrically connected to the first pattern 22a and the second pattern 22b via a wire 26. Thereafter, if necessary, the sealing portion 36 is provided on the one surface side of the mounting substrate 2, and then the color conversion portion 37 is provided (mounted) on the one surface side of the mounting substrate 2, whereby FIG. The structure shown in is obtained.

  Thereafter, as shown in FIG. 22 (c), the light emitting module shown in FIG. 22 (d) is obtained by cutting the support piece 21h between the heat transfer plate 21 and the outer frame portion 21g to remove the outer frame portion 21g. Get one. And the light emitting module 1 is good also as what bent the connection part 2c, for example, as shown in FIG.22 (e).

  By the way, the above-described light emitting module 1 includes the heat transfer plate 21 and the wiring pattern 22 formed using the lead frame 320, so that an electrical insulator such as ceramic or synthetic resin as shown in FIG. Compared with the LED module 203 having the substrate 218 made of the above, it is possible to improve the heat dissipation. In addition, the above-described light emitting module 1 can achieve high light output at low cost compared to the case where the LED chip 3 is mounted on a metal base printed wiring board. In addition, the light emitting module 1 can reduce light loss in the heat transfer plate 21 by using the heat transfer plate 21 having a function as a reflection plate, and increase the light output. It becomes possible. Therefore, the light emitting module 1 can also reduce power consumption. Here, in the light emitting module 1, the first metal plate of the heat transfer plate 21 is an aluminum plate, and an aluminum film having a purity higher than that of the aluminum plate is laminated on the side opposite to the insulating layer 23 side of the aluminum plate. In addition, it is possible to increase the output of light by using a film in which an increasing reflection film made of two kinds of dielectric films having different refractive indexes is used. In particular, the light emitting module 1 can efficiently dissipate heat generated in the LED chip 3 to increase the light output, and in addition, improve the utilization efficiency of the light emitted from the LED chip 3. It becomes possible to plan. Moreover, when the light emitting module 1 is provided with the color conversion part 37 (refer FIG.8,9,15-18 etc.), it is radiated | emitted from the fluorescent substance which is the wavelength conversion material of the color conversion part 37 to the heat exchanger plate 21 side. In addition, it is possible to reflect the light emitted from the LED chip 3 and the light scattered by the phosphor to the heat transfer plate 21 side, so that the light utilization efficiency can be improved.

  The light emitting module 1 described above includes the mounting substrate 2 described above and a plurality of light emitting devices 30 mounted on the mounting substrate 2, can improve heat dissipation, and have various shapes ( Can be deformed into an arbitrary shape). Thereby, the light emitting module 1 can be used as a light source of various lighting fixtures. Here, various lighting fixtures can be classified from various viewpoints. According to the classification of lighting fixtures, there are ceiling lights, pendants, brackets, stands, chandeliers, downlights, spotlights, etc. Moreover, according to the classification according to the attachment state of the lighting fixture, there are, for example, a direct attachment type, a hanging type, an embedded type, a wall hanging type, and a floor standing type. In addition, for example, there are classifications based on the size of the lighting fixture, the shape of the light source, the size of the light source, and the like. The shape of the instrument body 101 is not limited to a circular shape, and may be, for example, an elliptical shape, a rectangular shape, a polygonal shape having five or more corners, a star shape, or the like.

  Here, in the light emitting module 1, the heat generated in each LED chip 3 and each color conversion unit 37 can be efficiently transferred in the lateral direction by the heat transfer plate 21 to be dissipated, and the heat transfer plate 21. It is possible to dissipate heat by transferring heat in the thickness direction. Therefore, the light emitting module 1 can improve heat dissipation, can suppress the temperature rise of each LED chip 3, and can achieve high light output. In short, in the light emitting module 1, the heat generated in each LED chip 3 and each color conversion unit 37 is radiated through the heat transfer plate 21 formed using the first metal plate. Even when the light output of the entire light emitting module 1 is increased by increasing the light output, it is possible to suppress the temperature rise of each LED chip 3 and the color conversion unit 37, and to increase the light output. It becomes possible to plan.

  Moreover, since the insulating layer 23 contains the filler with high heat conductivity compared with the said thermosetting resin in the insulating layer 23, the heat which generate | occur | produced in the LED chip 3 is radiated more efficiently. It becomes possible to make it.

  Further, in the light emitting module 1, the mounting substrate 2 includes the wiring pattern 22 formed using the second metal plate, and the first slit 21d, the third slit 23d, and the second slit are provided between the adjacent substrate units 2u. Since a gap formed by the slit 22d is formed and adjacent substrate units 2u are connected by the connecting portion 2c described above, it is possible to prevent disconnection when the mounting substrate 2 is deformed. The light emitting module 1 can be used as a light source of various shapes of lighting fixtures by appropriately deforming the mounting substrate 2, thereby reducing costs such as manufacturing cost and management cost including design cost of the light source. It becomes possible to do.

  Further, in the light emitting module 1, a gap formed by the first slit 21d, the third slit 23d, and the second slit 22d is formed between the adjacent substrate units 2u, and the adjacent substrate units 2u are connected to the above-described connecting portion. Since it is connected by 2c, even when the mounting substrate 2 is used in a long shape, it is possible to suppress the warpage of the heat transfer plate 21, and to suppress the warpage of the entire light emitting module 1. Become. As a result, the light emitting module 1 can be reduced in cost by improving the yield at the time of manufacture, and the reliability as a product can be improved.

  Further, in the light emitting module 1, by appropriately setting the number of unit units 2u of the mounting substrate 2, it is possible to form one or more light emitting modules 1 to form the annular light source 102, As in the LED lighting device shown in FIG. 37, a plurality of LED modules 203 that are regular octagons in front view are arranged in an annular shape, and the adjacent LED modules 203 in the arrangement direction of the LED modules 203 are insulated. The manufacturing cost can be reduced as compared with the case of being electrically connected via the electric wire 232.

  Moreover, in the light emitting module 1 of this embodiment, the 1st metal plate used as the foundation of the heat exchanger plate 21 is an aluminum plate, and the aluminum film on the opposite side to the insulating layer 23 side in an aluminum plate is higher-purity aluminum film than an aluminum plate Is laminated, and the aluminum film is laminated with a reflection-enhancing film made of two kinds of dielectric films having different refractive indexes, so that the light emitted from the LED chip 3 and incident on the one surface of the heat transfer plate 21 is efficiently reflected. It becomes possible to do.

  Moreover, in the light emitting module 1, what used the 1st electrode 31 and the 2nd electrode 32 provided in the one surface side of the thickness direction as the LED chip 3 is used, and each of the 1st electrode 31 and the 2nd electrode 32 is used. It is electrically connected to the wiring pattern 22 via the wire 26. Here, in the light emitting module 1, since the through holes 21 b through which the respective wires 26 pass are formed in the heat transfer plate 21, the LED chip 3 can be die-bonded to the heat transfer plate 21. The generated heat is easily transferred in the lateral direction of the heat transfer plate 21, and heat dissipation can be improved.

  The light emitting module 1 is die-bonded to the heat transfer plate 21 via a submount member that relieves stress acting on the LED chip 3 due to a difference in linear expansion coefficient between the LED chip 3 and the heat transfer plate 21. May be. That is, the light emitting module 1 may be one in which the LED chip 3 is mounted on the heat transfer plate 21 via the submount member. Here, it is preferable to use the submount member formed in a plane size larger than the chip size of the LED chip 3. When the LED chip 3 is a GaN-based blue LED chip and the first metal plate is an aluminum plate, for example, AlN, composite SiC, Si, CuW, or the like can be adopted as the material of the submount member. In addition, the submount member reflects the light emitted from the LED chip 3 around the bonding portion with the LED chip 3 on the surface to which the LED chip 3 is bonded (that is, the portion overlapping the LED chip). A film is preferably formed. Further, when the LED chip 3 having electrodes provided on both sides in the thickness direction is used, the first electrode 31 or the second electrode 32 disposed on the submount member side in the LED chip 3 is used as the submount member. A conductive pattern to be electrically connected may be provided, and the conductive pattern and the first pattern 22 a or the second pattern 22 b may be electrically connected through the wire 26.

  The lighting fixture of the present embodiment described above includes a fixture main body 101 and a light source 102 held by the fixture main body 101. Here, the light source 102 is formed by deforming the long light emitting module 1 in which a plurality of light emitting devices 30 are arranged in accordance with a desired shape of the light source 102. Therefore, in the lighting apparatus of the present embodiment, the number of light emitting modules 1 can be reduced and the cost can be reduced. In addition, the lighting fixture includes a thermal coupling portion (not shown) between the light emitting module 1 and the fixture main body 102 that has electrical insulation and thermal conductivity and thermally couples the light emitting module 1 and the fixture main body 101. It is preferable. Here, the thermal coupling portion can be formed using, for example, the above-described thermosetting sheet-like adhesive. Thus, in the lighting fixture, the heat coupling portion is interposed between the light emitting module 1 and the fixture main body 101 and becomes an insulating layer bonded to each of the light emitting module 1 and the fixture main body 101. In this case, it is possible to more efficiently dissipate heat generated in the light emitting module 1 while ensuring electrical insulation between the light emitting module 1 and the instrument body 101. Moreover, the lighting fixture can hold the light emitting module 1 by using the fixture main body 101 without using a separate member for attaching the light emitting module 1 to the fixture main body 101.

  Moreover, the mounting substrate 2 in the light emitting module 1 may have a configuration including the outer frame portion 21g formed by the above-described sheet-like member 420 as the shape shown in FIG. It can be used as a reflection plate that reflects light emitted from the chip 3 or the color conversion unit 37. Thereby, the light emitting module 1 can improve the light use efficiency and can control the light distribution by the reflector. In this case, the mounting substrate 2 has a connecting piece 21f that connects the heat transfer plate 21 and the outer frame portion 21g so that an angle formed by the heat transfer plate 21 and the outer frame portion 21g is a desired angle. Just bend. A fourth slit 21k is formed between the outer frame portion 21g and the second connecting piece 2c in the longitudinal direction of the mounting substrate 2.

  By the way, the mounting substrate 2 shown in FIG. 22A is formed of a first metal plate and is disposed on one side of the heat transfer plate 21 and is disposed on the other side. An outer frame portion 21g is constituted by the second side piece 21gb. Further, the support piece 21h on the first side piece 21ga side and the support piece 21h on the second side piece 21gb side constitute a first bar 21ha and a second bar 21hb that can be cut and bent, respectively. In this case, the mounting board 2 includes the heat transfer plate 21, the first bar 21ha, the first side piece 21ga, the second bar 21hb, and the second side piece 21gb formed from one first metal plate, The plate 21, the first bar 21ha, the first side piece 21ga, the second bar 21hb, and the second side piece 21gb are integrated. Therefore, it is possible to reduce the cost and to improve the positional accuracy of the reflecting plate as compared with the case where the reflecting plate is formed by a member different from the heat transfer plate 21 and the reflecting plate is fixed to the mounting substrate 2. It becomes possible to raise.

(Embodiment 2)
The basic configuration of the lighting fixture of the present embodiment is the same as that of the first embodiment, and only the configuration of the connecting portion 2c and the terminal portion 2f in the mounting substrate 2 of the light emitting module 1 shown in FIG. Illustration and description of the components are omitted. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 1 regarding the light emitting module 1, and description is abbreviate | omitted.

  24A is a schematic exploded perspective view of the mounting board 2 of FIG. 24C, and FIG. 24B shows the outer frame portion 321 of the lead frame 320 in the mounting board 2 of FIG. It is a schematic perspective view before removing.

  In the mounting substrate 2 in the present embodiment, the connecting portion 2c is configured only by the first connecting piece 22c described in the first embodiment, and the terminal portion 2f is configured only by the first half piece 22f described in the first embodiment. Has been. Thereby, the mounting substrate 2 can bend the connecting portion 2c and the terminal portion 2f more easily. Further, in this mounting substrate 2, even when the heat transfer plate 21 is provided with the reflective reflection film described in the first embodiment, the power supply connector 108 (see FIG. 4) or series connection is connected to the terminal portion 2f. It is possible to reduce the contact resistance when connecting the connector 105 (see FIG. 5).

  Next, the manufacturing method of the light emitting module 1 is demonstrated based on FIG.

  In manufacturing the light emitting module 1, first, the LED chip 3 is mounted on the one surface side of the mounting substrate 2 shown in FIG. 25A by mounting, and then the first electrode 31 and the second electrode of each LED chip 3 are mounted. Each of the electrodes 32 is electrically connected to the first pattern 22a and the second pattern 22b via a wire 26. Then, after forming the sealing part 36 as needed, the structure shown in FIG.25 (b) is obtained by providing the color conversion part 37 in the said one surface side of the mounting board | substrate 2 (mounting).

  Thereafter, as shown in FIG. 25 (c), the support piece 21h between the heat transfer plate 21 and the outer frame portion 21g is cut to remove the outer frame portion 21g, and the second connecting piece 21c and the second half piece. By removing 21f, the light emitting module 1 shown in FIG. 25 (d) is obtained. And the light emitting module 1 is good also as what bent the connection part 2c, for example, as shown in FIG.25 (e).

  As with the mounting substrate 2 in the first embodiment, the mounting substrate 2 in the present embodiment can improve heat dissipation and can be deformed into various shapes.

  Thereby, the light emitting module 1 in this embodiment can improve heat dissipation like the light emitting module 1 in Embodiment 1, and can be changed into various shapes. That is, the light source 102 (see FIG. 1 and the like) can be deformed according to a desired shape. Thus, in the lighting fixture of the present embodiment, the number of light emitting modules 1 can be reduced and the cost can be reduced as in the first embodiment.

(Embodiment 3)
Below, the lighting fixture of this embodiment is demonstrated based on FIG.

  The basic configuration of the lighting fixture of the present embodiment is substantially the same as that of the first and second embodiments, except that the desired shape of the light source 102 is an annular shape having a larger diameter than those of the first and second embodiments. Moreover, in this embodiment, the diameter of the instrument main body 101 is also larger than Embodiment 1,2. Since other components are the same as those in the first and second embodiments, illustration and description are omitted.

  The external size of each substrate unit 2u in the light emitting module 1 is the same as in the first and second embodiments. Therefore, in the lighting fixture of the present embodiment, the number of substrate units 2u necessary for realizing the light source 102 having a desired shape is different from those of the first and second embodiments. In the first and second embodiments, the number of substrate units 2u is 12 as shown in FIG. 1, whereas in this embodiment, the number of substrate units 2u is 24 as shown in FIG. In the present embodiment, as in the first and second embodiments, the light source 102 having a desired shape may be configured by one light emitting module 1, but the present invention is not limited thereto. For example, the number of unit units 2 u is four. Six light emitting modules 1 may be arranged. In the latter case, the light emitting module 1 before being deformed can be shared by the lighting fixtures of the first and second embodiments and the lighting fixture of the present embodiment.

  In the lighting fixture of the present embodiment, the desired shape of the light source 102 is an annular shape having a larger diameter than those of the first and second embodiments, the number of the light emitting devices 30 is large, and the illumination range can be widened. It can be installed and used in a larger room.

(Embodiment 4)
Below, the lighting fixture of this embodiment is demonstrated based on FIG.

  The basic configuration of the lighting fixture of the present embodiment is substantially the same as that of the first to third embodiments, and the difference is that the desired shape of the light source 102 is spiral. Since other components are the same as those in the first to third embodiments, illustration and description are omitted.

  The external size of each substrate unit 2u in the light emitting module 1 is the same as in the first to third embodiments. In the lighting apparatus of the present embodiment, the number of substrate units 2u necessary to realize the light source 102 having a desired shape is different from those of the first to third embodiments. In the first and second embodiments, the number of substrate units 2u is 12 as shown in FIG. 1, and in the third embodiment, the number of substrate units 2u is 24 as shown in FIG. 27, the number of substrate units 2u is 36. In the present embodiment, as in the first and second embodiments, the light source 102 having a desired shape may be configured by one light emitting module 1, but the present invention is not limited thereto. For example, the number of unit units 2 u is four. Nine light emitting modules 1 may be arranged. In the latter case, the light emitting module 1 before being deformed can be shared by the lighting fixtures of Embodiments 1 to 3 and the lighting fixture of the present embodiment. In addition, the number of the board | substrate units 2u in the lighting fixture of this embodiment is not specifically limited, You may be the same as the number of the board | substrate units 2u in any lighting fixture of Embodiment 1-3.

  Since the desired shape of the light source 102 is spiral in the lighting fixture of this embodiment, the luminance unevenness is reduced as compared with the case where the desired shape of the light source 102 is annular as in the lighting fixtures of the first to third embodiments. It becomes possible.

(Embodiment 5)
Below, the lighting fixture of this embodiment is demonstrated based on FIG.

  The basic configuration of the lighting fixture of this embodiment is substantially the same as that of Embodiments 1 to 3, except that the desired shape of the light source 102 is a double annular shape with different diameters. Since other components are the same as those in the first to third embodiments, illustration and description are omitted.

  The external size of each substrate unit 2u in the light emitting module 1 is the same as in the first to third embodiments. In the lighting apparatus of the present embodiment, the number of substrate units 2u necessary to realize the light source 102 having a desired shape is different from those of the first to third embodiments. In the first and second embodiments, the number of substrate units 2u is 12 as shown in FIG. 1, and in the third embodiment, the number of substrate units 2u is 24 as shown in FIG. As shown in FIG. 28, the number of substrate units 2u is 36. Here, in the lighting fixture of the present embodiment, the light source 102 of the lighting fixture in the first embodiment and the light source 102 of the lighting fixture in the third embodiment are arranged concentrically, so that the light source 102 has a double annular shape. It has become.

  Thus, in the lighting apparatus of the present embodiment, the light source 102 having a desired shape may be configured by at least two light emitting modules 1, but the present invention is not limited thereto, and for example, the number of unit units 2u is four light emitting elements. Three modules + 6 modules = 9 modules 1 may be used. In the latter case, the light emitting module 1 before being deformed can be shared by the lighting fixtures of Embodiments 1 to 4 and the lighting fixture of the present embodiment. In addition, the number of the board | substrate units 2u in the lighting fixture of this embodiment is not specifically limited.

  In the lighting fixture of the present embodiment, the light emitting color of the light emitting device 30 is set to be the same in all the light emitting modules 1, but not limited to this, according to the outer annular shape of the above-described double annular shapes. The light emission color of the light emitting device 30 in the deformed light emitting module 1 may be different from the light emission color of the light emitting device 30 in the light emitting module 1 deformed according to the inner annular shape. For example, in the luminaire, the light emitting color of the light emitting device 30 of the former light emitting module 1 may be a light bulb color, and the light emitting color of the latter light emitting device 30 may be a daylight color. In this case, it is preferable that the former light emitting module 1 and the latter light emitting module 1 can be lit separately. For example, the circuit block 130 described in the first embodiment preferably has the function of controlling the lighting of the former light emitting module 1 and the latter light emitting module 1 separately. In the case of the light emitting device 30 that emits a light bulb color that is reddish white, the light emitting device 30 that emits a daylight color that is bluish white results from the conversion efficiency of the red phosphor. Efficiency. Therefore, when considering the number necessary for securing a predetermined amount of light, the number of light-bulb-colored light-emitting devices 30 is larger than that of the daylight-colored light-emitting device 30. In the lighting fixture of the present embodiment, the light emitting color of the light emitting device 30 of the light emitting module 1 modified according to the outer annular shape is the light bulb color, and the light emitting device 30 of the light emitting module 1 deformed according to the inner annular shape. If the light emission color is daylight, and the former light-emitting module 1 and the latter light-emitting module 1 can be lit separately, the case where only the former light-emitting module 1 is lit and the case where only the latter light-emitting module 1 is lit In any case, it is possible to secure a predetermined light amount with less power consumption.

(Embodiment 6)
Below, the lighting fixture of this embodiment is demonstrated based on FIG.

  The basic configuration of the lighting fixture of the present embodiment is substantially the same as that of the first to third embodiments. It is different in that it is mounted on the inclined surface 101b inclined so as to increase the distance. Here, the instrument main body 101 is retracted from the central portion 101a as the inclined surface 101b is further away from the central portion 101a. Therefore, as the inclined surface 101b is further away from the central portion 101a, the distance to the construction surface formed by the lower surface of the ceiling material 160 is shortened while the distance to the globe 103 is increased. Since other components are the same as those in the first to third embodiments, illustration and description are omitted.

  In the lighting fixture of the present embodiment, the bending angle at which the connecting portion 2c is bent with the second portion of the first connecting piece 22c of the mounting substrate 2 as the second fold is different, and the connecting portion 2c and the central portion 101a are different. The bending angle is set so that the formed angle is approximately 90 degrees.

  In the lighting fixture of this embodiment, the shape of the fixture body 101 is circular as in Embodiments 1 to 3, and the globe 103 attached to the fixture body 101 so as to cover the light source 102 on the one surface side of the fixture body 101. Since the light emitting module 1 is mounted on the inclined surface 101b of the fixture body 101, it is possible to increase the distance from the light emitting device 30 to the globe 103, and uneven brightness on the light emitting side surface of the globe 103. Can be reduced. Moreover, in the lighting fixture of this embodiment, since the light emitting module 1 is mounted in the inclined surface 101b in the fixture main body 101, it becomes possible to change an illumination range with the lighting fixture of Embodiment 1-3.

(Embodiment 7)
Below, the lighting fixture of this embodiment is demonstrated based on FIG.

  The basic configuration of the lighting fixture of the present embodiment is substantially the same as that of the fifth embodiment, and is different in that a heat radiating member 140 having heat radiating fins 142 is arranged on the side of the fixture body 101 opposite to the light emitting module 1 side. To do. Note that the description of the same components as those in the fifth embodiment is omitted as appropriate.

  The heat radiating member 140 is provided with a plurality of fins 142 protruding from the flat plate-like main body portion 141, and the side opposite to the surface on which each fin 142 protrudes is disposed as the instrument main body 101 side. In addition, it is preferable to form the heat radiating member 140 with a metal having high thermal conductivity such as aluminum. In addition, you may provide the heat radiating member 140 suitably in the lighting fixture of other embodiment not only in the lighting fixture of this embodiment.

  Moreover, the lighting fixture of this embodiment is provided with the thermal coupling part 120 which has electrical insulation and thermal conductivity and thermally couples the light emitting module 1 and the fixture body 101 between the light emitting module 1 and the fixture body 101. It is preferable. In addition, you may provide the thermal coupling part 120 suitably in the lighting fixture of other embodiment not only in the lighting fixture of this embodiment.

  The thermal coupling unit 120 may be, for example, a soft heat conductive sheet that is interposed between the light emitting module 1 and the instrument main body 101 and is in close contact with each of the light emitting module 1 and the instrument main body 101, or the light emitting module 1 and the instrument main body 101. An insulating layer interposed between the light emitting module 1 and the fixture body 101 may be used.

  The material of the heat conductive sheet is preferably a material having high electrical insulation and high thermal conductivity. As the heat conductive sheet, a silicone gel sheet having electrical insulation and thermal conductivity can be used. The silicone gel sheet used as the heat conductive sheet is preferably soft. For example, Sarcon (registered trademark) can be used as this type of silicone gel sheet. Further, the material of the heat conductive sheet is not limited to silicone gel, and may be, for example, an elastomer as long as it has electrical insulation and heat conductivity.

  Here, in the case where the heat coupling portion 120 is configured by a heat conductive sheet, the light emitting module 1 and the heat conductive sheet are held between the one surface of the tool body 101 in order to hold the light emitting module 1 by the tool body 101. It is preferable to provide the holding part 109 which performs. Note that the number and arrangement of the holding portions 109 may be appropriately set in consideration of the mounting property of the light emitting module 1 and the like.

  Further, as described in the first embodiment, the insulating layer to be the thermal coupling portion 120 can be formed using the above-described thermosetting sheet adhesive. As a result, the lighting fixture has an insulating layer in which the thermal coupling portion 120 is interposed between the light emitting module 1 and the fixture main body 101 and is bonded to each of the light emitting module 1 and the fixture main body 101. When formed of metal, the heat generated in the light emitting module 1 can be radiated more efficiently while ensuring the electrical insulation between the light emitting module 1 and the instrument body 101. In addition, the lighting fixture can hold the light emitting module 1 by using the fixture main body 101 without using a separate member for attaching the light emitting module 1 to the fixture main body 101.

  Moreover, the lighting fixture of this embodiment mounts the light emitting module 170 having a shape different from that of the above-described light emitting module 1 at the central portion of the one surface of the fixture main body 101. Here, between the light emitting module 170 and the instrument main body 101, a thermal coupling portion 180 that thermally couples the light emitting module 170 and the instrument main body 101 is interposed. The thermal coupling portion 180 can be formed using, for example, the above-described heat conductive sheet or thermosetting sheet-like adhesive. When the heat coupling portion 180 is formed of a heat conductive sheet, in order to hold the light emitting module 170 by the instrument main body 101, the light emitting module 170 and the heat conductive sheet are held between the one surface of the instrument main body 101. It is preferable to provide the portion 109. Note that the number and arrangement of the holding portions 179 may be set as appropriate in consideration of the attachment of the light emitting module 170 and the like.

  In the light emitting module 170, a plurality of light emitting devices 30 are mounted on a circular mounting substrate 172. The light emitting module 170 is not limited to a ceiling light such as the lighting fixture of the present embodiment, and can be used as a light source of a lighting fixture such as a downlight.

  By the way, as shown in FIG. 31, as for the lighting fixture, the hole 107 for heat dissipation is provided in the buffer member 106 mounted in the peripheral part of the surface on the opposite side to the light emitting module 1 side in the fixture main body 101. Is preferred. Thereby, the luminaire can easily dissipate heat generated in the light emitting module 1 to the outside of the luminaire, and can improve heat dissipation. In addition, it is preferable to provide such a heat radiation hole 107 also in the lighting fixtures of other embodiments.

  In addition, the lighting fixture includes a socket 150 (FIGS. 32 (a) and (b)) in which the fixture body 101 is not formed in the above-described holding portion 109 but is formed in a desired shape and the light emitting module 1 after deformation is attached. You may hold. By setting the shape of the socket 150 in accordance with the desired shape of the light source 102, the lighting fixture suppresses variation in the shape of the light source 102 formed by the light emitting module 1 and displacement of the arrangement position. It becomes possible. The socket 150 may be provided as appropriate in the lighting fixtures of other embodiments.

  The socket 150 shown in FIGS. 32 (a) and 32 (b) is formed in a U-shape that is open on the side opposite to the instrument body 101 side, and extends from the tip of one leg piece to the tip of the other leg piece. A projecting piece 152 is extended in the direction of approach. Here, the dimension between one leg piece and the other leg piece is set to be slightly larger than the width dimension of the light emitting module 1 including the connecting portion 2c bent at an angle of about 90 degrees. On the other hand, the light emitting module 1 can be attached from an oblique direction. Further, the socket 150 includes a holding member 155 having a guide surface 155a for guiding the board unit 2u when the light emitting module 1 is mounted on the distal end surface of the other leg piece. Since the socket 150 is arranged so that a part of the holding member 155 overlaps the side part in the width direction of the light emitting module 1, the light emitting module 1 can be attached without using a screw or the like.

  The lighting fixture uses a socket 150 made of an insulating material such as resin, so that the insulation distance between the light emitting module 1 and the fixture body 101 can be increased even when the fixture body 101 is made of metal. It can be ensured easily and reliably. In addition, by using a lighting fixture made of a heat conductive material such as metal as the socket 150, the socket 150 can be configured to also serve as a heat sink, and heat dissipation can be improved. It becomes. However, in this case, as shown in FIG. 33, it is necessary to provide an insulating portion 156 on the surface facing the light emitting module 1 in the socket 150.

  It is preferable that the power supply terminal 158 to the light emitting module 1 is provided in the socket 150 so as to be in contact with the terminal portion 2f of the light emitting module 1 to which the light emitting module 1 is attached. Thereby, the lighting fixture can improve assemblability.

(Embodiment 8)
Below, the lighting fixture of this embodiment is demonstrated based on FIG.

  The basic configuration of the lighting fixture of the present embodiment is substantially the same as that of the seventh embodiment, and the arrangement of the light emitting module 170 provided in the central portion of the fixture body 101 is different. Note that the description of the same components as those in the seventh embodiment is omitted as appropriate.

  In the present embodiment, a through hole 101 c is formed at the center of the instrument body 101, the light emitting module 170 is disposed on the other surface side of the instrument body 101, and each light emitting device 30 of the light emitting module 170 penetrates the instrument body 101. It is located in the hole 101c. Thereby, when the light emitting module 1 arrange | positioned at the said one surface side of the instrument main body 101 is lighted, it becomes possible to suppress that the shadow resulting from the light emitting module 170 is made.

(Embodiment 9)
Below, the lighting fixture of this embodiment is demonstrated based on FIG.

  The basic configuration of the lighting fixture of the present embodiment is substantially the same as that of the eighth embodiment, and only the light emitting module 1 is different. Therefore, in the lighting fixture of the present embodiment, the number of light emitting devices 30 in the light emitting module 1 can be reduced as compared with the eighth embodiment.

DESCRIPTION OF SYMBOLS 1 Light emitting module 2 Mounting board 2f Terminal part 3 LED chip 21 Heat-transfer plate 21c Connection piece 21b Through-hole 21d 2nd slit 22 Wiring pattern 22c Connection piece 22d 1st slit 22u Unit pattern 23 Insulating layer 26 Wire 30 Light-emitting device 31 1st Electrode 32 Second electrode 37 Color conversion part 101 Instrument body 101b Inclined surface 102 Light source 103 Globe 106 Buffer member 107 Hole 120 Thermal coupling part (heat conduction sheet, insulating layer)
140 Heat radiating member 142 Heat radiating fin 150 Socket 158 Power supply terminal

Claims (19)

  An instrument body and a light source held by the instrument body, wherein the light source is formed by deforming a long light emitting module in which a plurality of light emitting devices are arranged in accordance with a desired shape of the light source. A luminaire characterized by being formed.   The light emitting device includes an LED chip, and a color conversion unit including a phosphor and a translucent material that is excited by light emitted from the LED chip and emits light having a color different from the emission color of the LED chip. The light emitting module includes a heat transfer plate formed of a first metal plate, the plurality of LED chips and the color conversion unit corresponding to each LED chip mounted on one side, and a second metal plate A wiring pattern formed on the other surface side of the heat transfer plate and electrically connected to the plurality of LED chips, and an insulating layer interposed between the heat transfer plate and the wiring pattern And the wiring pattern includes a plurality of unit patterns that can be electrically connected to the LED chip, and the unit patterns on one end side in a prescribed direction perpendicular to the parallel arrangement direction of the unit patterns. A connecting piece for connecting and electrically connecting the two, and a first slit that is opened at the other end in the prescribed direction and reaches the connecting piece, and the heat transfer plate overlaps the first slit. The lighting apparatus according to claim 1, further comprising a slit, wherein the connecting piece protrudes from a plane including a side edge of the unit patterns along the juxtaposed direction on the one end side. .   The light emitting module includes a terminal portion at each of both ends in the longitudinal direction, and the terminal portion includes a halved piece obtained by halving the connecting piece. The lighting apparatus according to claim 2, wherein the light emitting device emits light.   In the heat transfer plate, the first metal plate is an aluminum plate, an aluminum film having a purity higher than that of the aluminum plate is laminated on a side opposite to the insulating layer side of the aluminum plate, and a refractive index is provided on the aluminum film. The lighting apparatus according to claim 2 or 3, wherein the reflection-increasing films made of two different types of dielectric films are laminated.   The LED chip is provided with a first electrode and a second electrode on one surface side in the thickness direction, and each of the first electrode and the second electrode is electrically connected to the wiring pattern via a wire. The lighting apparatus according to any one of claims 2 to 4, wherein the heat transfer plate is formed with a through hole through which each of the wires passes.   The lighting apparatus according to claim 1, wherein the desired shape is an annular shape.   The lighting device according to any one of claims 1 to 5, wherein the desired shape is a double annular shape having different diameters.   The light emitting module in which the light emitting color of the light emitting module in the light emitting module deformed according to the outer circular shape of the double circular shape is a light bulb color, and the light emitting module is deformed according to the inner circular shape. The light emitting color of the light emitting device is a daylight color, and the light emitting module deformed according to the outer ring and the light emitting module deformed according to the inner ring are lit separately. The luminaire according to claim 7, which is possible.   The lighting device according to claim 1, wherein the desired shape is a spiral shape.   The shape of the instrument body is circular, and includes a glove attached to the instrument body so as to cover the light source on one surface side of the instrument body, and the light emitting module is a central portion of the one surface of the instrument body. The lighting fixture according to any one of claims 1 to 6, wherein the lighting fixture is mounted on an inclined surface that is inclined so that the distance from the globe increases as the distance from the central portion increases. .   The thermal coupling part which has electrical insulation and thermal conductivity and thermally couples the light emitting module and the instrument body is provided between the light emitting module and the instrument body. The lighting fixture of any one of Claim 10.   The said heat coupling part consists of a soft heat conductive sheet which is interposed between the said light emitting module and the said instrument main body, and is closely_contact | adhered with each of the said light emitting module and the said instrument main body. lighting equipment.   The lighting fixture according to claim 11, wherein the thermal coupling portion is formed of an insulating layer interposed between the light emitting module and the fixture main body and bonded to each of the light emitting module and the fixture main body.   The lighting fixture according to any one of claims 11 to 13, wherein a heat radiating member having a heat radiating fin is disposed on a side opposite to the light emitting module side in the fixture main body.   The heat dissipation hole is provided in the buffer member mounted on the peripheral portion of the surface opposite to the light emitting module side in the appliance main body. The lighting fixture as described in a term.   The lighting fixture according to claim 1, wherein the fixture main body holds a socket formed in accordance with the desired shape and to which the deformed light emitting module is attached.   The lighting fixture according to claim 16, wherein the socket is formed of an insulating material.   The lighting device according to claim 16, wherein the socket is made of a heat conductive material.   The lighting device according to any one of claims 16 to 18, wherein the socket is provided with a terminal for supplying power to the light emitting module.

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