JP2012506162A - 可撓印刷配線板用保護覆い - Google Patents
可撓印刷配線板用保護覆い Download PDFInfo
- Publication number
- JP2012506162A JP2012506162A JP2011535001A JP2011535001A JP2012506162A JP 2012506162 A JP2012506162 A JP 2012506162A JP 2011535001 A JP2011535001 A JP 2011535001A JP 2011535001 A JP2011535001 A JP 2011535001A JP 2012506162 A JP2012506162 A JP 2012506162A
- Authority
- JP
- Japan
- Prior art keywords
- protective
- flexible printed
- printed wiring
- wiring board
- protective covering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10393—Clamping a component by an element or a set of elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0169—Using a temporary frame during processing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
Description
Claims (15)
- 可撓印刷配線板(14)を保護して保持する保護覆い(1)であって、可撓印刷配線板(14)の表面(21)を覆う保護装置(2;30;35)、及び保護覆い(1)に可撓印刷配線板(14)の補強板(19)を確実に受入れるための受入れ装置(3;31;38)を含む、保護覆い。
- 保護装置(2;30;35)が枠状に構成され、従って可撓印刷配線板(14)の保護すべき表面(21)に接近可能であることを特徴とする、請求項1に記載の保護覆い。
- 補強板(19)が保護覆い(1)に分離可能に結合されていることを特徴とする、前記請求項の1つに記載の保護覆い。
- 受入れ装置(3;31;38)が補強板(19)のすべての縁を部分的に包囲していることを特徴とする、前記請求項の1つに記載の保護覆い。
- 受入れ装置(3)が、補強板(19)を係止して受入れる係止突起(13)を持つ複数の側壁(11,12)から形成され、係止突起(13)が補強板(19)を導入しかつ取出すための導入斜面(15)及び取出し斜面(16)を持っていることを特徴とする、前記請求項の1つに記載の保護覆い。
- 保護覆い(1)が、これにそれぞれ一体に形成される結合素子(28,29)を除いて対称な2つの部分覆い(22,23)を持ち、これらの部分覆い(22,23)が両方の結合素子(28,29)の分離可能な結合部特に溝−キー結合部により互いに結合可能であり、1つの縁を除いて補強板(19)のすべての縁が部分覆い(22,23)により部分的に包囲されるように、1つの部分覆い(22,23)が複数の側壁(24,25)を持っていることを特徴とする、前記請求項の1つに記載の保護覆い。
- 部分覆い(22,23)が、結合された状態で補強板(19)のすべての縁を包囲することを特徴とする、請求項6に記載の保護覆い。
- 可撓印刷配線板(14)が分離不可能に特にはまり合い差込み結合により結合されていることを特徴とする、請求項1〜3の1つに記載の保護覆い。
- 受入れ装置(38)が、補強板の少なくとも2つの穴へ受入れるための少なくとも2つのほぞ(37)を含み、ほぞ(37)が保護装置(35)の基板(36)に直角に設けられ、かつほぞ(37)の中心軸線(39)に沿って、大きさを変化する同心的な断面を持ち、ほぞ(37)の外側輪郭が、補強板(19)の穴の内側輪郭に一致していることを特徴とする、請求項8に記載の保護覆い。
- ほぞ(37)の外側輪郭が円錐状であることを特徴とする、請求項8又は9に記載の保護覆い。
- ほぞ(37)が所定破断個所(43)を持っていることを特徴とする、請求項8〜9の1つに記載の保護覆い。
- 保護覆い(1)がプラスチックから成っていることを特徴とする、前記請求項の1つに記載の保護覆い。
- 保護覆い(1)が平らな台板上に確実に載置するための載置面(5;32)を持っていることを特徴とする、前記請求項の1つに記載の保護覆い。
- 保護覆い(1)が1片から製造されていることを特徴とする、前記請求項の1つに記載の保護覆い。
- 印刷配線板(14)が保護覆い(1)に収容されている、前記請求項の1つに記載の保護覆いを持つ印刷配線板。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102008052243A DE102008052243A1 (de) | 2008-10-18 | 2008-10-18 | Schutzabdeckung für eine flexible Leiterplatte |
DE102008052243.0 | 2008-10-18 | ||
PCT/DE2009/001410 WO2010043204A1 (de) | 2008-10-18 | 2009-10-09 | Schutzabdeckung für eine flexible leiterplatte |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012506162A true JP2012506162A (ja) | 2012-03-08 |
JP5548862B2 JP5548862B2 (ja) | 2014-07-16 |
Family
ID=41571162
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011535001A Active JP5548862B2 (ja) | 2008-10-18 | 2009-10-09 | 保護覆い |
Country Status (5)
Country | Link |
---|---|
US (1) | US8785783B2 (ja) |
EP (1) | EP2338320B1 (ja) |
JP (1) | JP5548862B2 (ja) |
DE (2) | DE102008052243A1 (ja) |
WO (1) | WO2010043204A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008052244A1 (de) * | 2008-10-18 | 2010-04-22 | Carl Freudenberg Kg | Flexible Leiterplatte |
SE538701C2 (en) * | 2014-12-19 | 2016-10-25 | Autoliv Dev | Electrical unit |
DE102015216419B4 (de) * | 2015-08-27 | 2022-06-15 | Vitesco Technologies GmbH | Elektronisches Gerät mit einem Gehäuse mit einer darin angeordneten Leiterplatte |
CN112089519B (zh) * | 2019-12-31 | 2022-07-19 | 未来穿戴技术有限公司 | 眼部按摩仪 |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61124421A (ja) * | 1984-11-20 | 1986-06-12 | Matsushita Electric Ind Co Ltd | パレツト装置 |
JPS61154094A (ja) * | 1984-12-26 | 1986-07-12 | 住友ベークライト株式会社 | フレキシブルプリント回路板の製造方法 |
JPS61146989U (ja) * | 1985-02-28 | 1986-09-10 | ||
JPH0644200U (ja) * | 1992-11-19 | 1994-06-10 | 住友ベークライト株式会社 | 基板固定治具 |
JPH09107178A (ja) * | 1995-10-11 | 1997-04-22 | Ibiden Co Ltd | はんだ付け用治具、はんだ付け用治具ユニット、はんだ付け方法 |
JPH10105666A (ja) * | 1996-09-06 | 1998-04-24 | Stocko Metallwarenfab Henkels & Sohn Gmbh & Co | パーソナルコンピュータカード用ケース |
JP2000059051A (ja) * | 1998-08-11 | 2000-02-25 | Murata Mfg Co Ltd | シャーシ構造体の製造方法およびそれに用いる治具装置 |
JP2000306069A (ja) * | 1999-04-20 | 2000-11-02 | Fujitsu Takamisawa Component Ltd | カード形周辺装置 |
JP2007207943A (ja) * | 2006-01-31 | 2007-08-16 | Sumitomo Bakelite Co Ltd | 保持装置及びチップ部品をプリント配線板に半田実装する実装方法 |
JP2007324473A (ja) * | 2006-06-02 | 2007-12-13 | Fujifilm Corp | 基板搬送キャリア |
JP2008016634A (ja) * | 2006-07-06 | 2008-01-24 | Shin Etsu Polymer Co Ltd | 薄型基板搬送治具 |
JP2008078522A (ja) * | 2006-09-25 | 2008-04-03 | Casio Comput Co Ltd | フレキシブル配線基板用搬送治具及びそれを用いた電子部品実装方法 |
Family Cites Families (17)
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US1288395A (en) | 1917-02-02 | 1918-12-17 | Addressograph Co | Combined printing and identification device. |
US4450955A (en) | 1981-12-04 | 1984-05-29 | Featherston Elmer F | Card holder |
EP0395443B1 (en) | 1989-04-28 | 1993-02-17 | Nikkan Industries Co., Ltd. | Circuit board and overlay |
DE9307959U1 (de) | 1993-05-26 | 1993-08-05 | Ritter, Gerhard, 74076 Heilbronn | Kartenhülle für Chipkarten |
CN1050810C (zh) * | 1993-06-09 | 2000-03-29 | 利尔Eeds因特瑞尔公司 | 复合式联接器 |
DK0661665T3 (da) | 1993-12-01 | 1998-05-18 | Gerhard Ritter | Etui til chip-kort |
US7133846B1 (en) * | 1995-02-13 | 2006-11-07 | Intertrust Technologies Corp. | Digital certificate support system, methods and techniques for secure electronic commerce transaction and rights management |
AT410728B (de) * | 2001-02-09 | 2003-07-25 | Pollmann Austria Ohg | Verfahren zum einbetten zumindest einer flexiblen leiterbahnfolie in kunststoff, leiterbahneneinheitsowie einbettungseinheit hiefür |
KR100783591B1 (ko) * | 2001-04-26 | 2007-12-07 | 삼성전자주식회사 | 액정 표시 장치 |
TWM271354U (en) * | 2005-01-26 | 2005-07-21 | Wintek Corp | Frame for optical display device |
DE102006005941A1 (de) | 2006-02-09 | 2007-08-23 | Knorr-Bremse Systeme für Nutzfahrzeuge GmbH | Halter für eine flexible Leiterplatte |
JP2008021832A (ja) | 2006-07-13 | 2008-01-31 | Fujikura Ltd | フレキシブルプリント基板の固定構造 |
DE102007002901B4 (de) * | 2006-09-11 | 2014-07-31 | Lg Electronics Inc. | Schaltungsplatinenmodul |
KR20080023554A (ko) | 2006-09-11 | 2008-03-14 | 엘지전자 주식회사 | 디스플레이모듈 및 이를 구비하는 이동통신 단말기 |
JP4835401B2 (ja) | 2006-11-16 | 2011-12-14 | 日本電気株式会社 | フレキシブルプリント基板の固定構造 |
US8169995B2 (en) * | 2006-12-04 | 2012-05-01 | Samsung Electronics Co., Ltd. | System and method for wireless communication of uncompressed video having delay-insensitive data transfer |
DE102008052244A1 (de) | 2008-10-18 | 2010-04-22 | Carl Freudenberg Kg | Flexible Leiterplatte |
-
2008
- 2008-10-18 DE DE102008052243A patent/DE102008052243A1/de not_active Withdrawn
-
2009
- 2009-10-09 DE DE112009002553T patent/DE112009002553A5/de not_active Withdrawn
- 2009-10-09 EP EP09765003.0A patent/EP2338320B1/de active Active
- 2009-10-09 US US13/124,710 patent/US8785783B2/en active Active
- 2009-10-09 JP JP2011535001A patent/JP5548862B2/ja active Active
- 2009-10-09 WO PCT/DE2009/001410 patent/WO2010043204A1/de active Application Filing
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61124421A (ja) * | 1984-11-20 | 1986-06-12 | Matsushita Electric Ind Co Ltd | パレツト装置 |
JPS61154094A (ja) * | 1984-12-26 | 1986-07-12 | 住友ベークライト株式会社 | フレキシブルプリント回路板の製造方法 |
JPS61146989U (ja) * | 1985-02-28 | 1986-09-10 | ||
JPH0644200U (ja) * | 1992-11-19 | 1994-06-10 | 住友ベークライト株式会社 | 基板固定治具 |
JPH09107178A (ja) * | 1995-10-11 | 1997-04-22 | Ibiden Co Ltd | はんだ付け用治具、はんだ付け用治具ユニット、はんだ付け方法 |
JPH10105666A (ja) * | 1996-09-06 | 1998-04-24 | Stocko Metallwarenfab Henkels & Sohn Gmbh & Co | パーソナルコンピュータカード用ケース |
JP2000059051A (ja) * | 1998-08-11 | 2000-02-25 | Murata Mfg Co Ltd | シャーシ構造体の製造方法およびそれに用いる治具装置 |
JP2000306069A (ja) * | 1999-04-20 | 2000-11-02 | Fujitsu Takamisawa Component Ltd | カード形周辺装置 |
JP2007207943A (ja) * | 2006-01-31 | 2007-08-16 | Sumitomo Bakelite Co Ltd | 保持装置及びチップ部品をプリント配線板に半田実装する実装方法 |
JP2007324473A (ja) * | 2006-06-02 | 2007-12-13 | Fujifilm Corp | 基板搬送キャリア |
JP2008016634A (ja) * | 2006-07-06 | 2008-01-24 | Shin Etsu Polymer Co Ltd | 薄型基板搬送治具 |
JP2008078522A (ja) * | 2006-09-25 | 2008-04-03 | Casio Comput Co Ltd | フレキシブル配線基板用搬送治具及びそれを用いた電子部品実装方法 |
Also Published As
Publication number | Publication date |
---|---|
DE102008052243A1 (de) | 2010-04-22 |
DE112009002553A5 (de) | 2011-09-29 |
US8785783B2 (en) | 2014-07-22 |
JP5548862B2 (ja) | 2014-07-16 |
US20120067622A1 (en) | 2012-03-22 |
WO2010043204A1 (de) | 2010-04-22 |
EP2338320B1 (de) | 2013-04-17 |
EP2338320A1 (de) | 2011-06-29 |
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