JP2012250526A - Method for manufacturing card - Google Patents

Abstract

Provided is a card manufacturing method capable of efficiently imparting a pattern or texture to a surface without bonding different materials or processing a hot-pressed metal plate.
A step of temporarily stretching a core substrate made of a thermoplastic resin from the outside with a plurality of exterior substrates of the same type as the core substrate to form a laminate, and sandwiching the laminate with a pair of release films A step, a step of placing a Japanese paper or cloth having a desired pattern or texture on both sides or one side of the sandwiched laminate, and a step of sandwiching the laminate from above the Japanese paper or paper by a pair of metal plates, Including a step of heat laminating press using the metal plate, a step of separating the metal plate, the Japanese paper or cloth, a release film and the laminate, and a cutting step of forming the laminate into a card. Japanese-style pattern card manufacturing method.
[Selection] Figure 1

Description

  The present invention relates to a method of manufacturing a card having a texture with a Japanese pattern on the surface.

  In recent years, contactless IC cards have been widely used as commuter passes, boarding tickets, or prepaid cards having personal authentication and electronic payment functions. The IC chip is equipped with an 8-bit RISC CPU, and the data exchange speed between the external reader / writer and the card can be processed at a high speed of 0.1 seconds or less. There is.

  The non-contact type IC card is manufactured by sandwiching an electronic substrate (inlet) including an IC memory, a control unit, and an antenna with a resin base material, and hot-pressing and integrating them. An example of a manufacturing technique centered on a hot press technique is disclosed in Patent Document 1 and Patent Document 2.

According to the manufacturing method disclosed in Patent Document 1, first, a resin substrate on which an IC module and an antenna line are arranged is temporarily stretched on a center core sheet in which holes are formed so that the IC module can be accommodated in advance.
Next, the center core sheet is sandwiched with a core sheet having a thickness of 250 μm, and a transparent oversheet having a thickness of 50 μm is temporarily stretched. It is said that a laminate used for a card is prepared by heat laminating and pressing the temporarily stretched sheet at 150 ° C. and 1.96 MPa. All the sheet materials are made of vinyl chloride resin.

In Patent Document 2, first, a communication coil and a communication circuit portion are formed in a frame shape, and this is accommodated in a frame-shaped spot portion of a circuit mounting core sheet and flattened. The core sheet is sandwiched between three separate core sheets so that the layer structure is symmetrical, and further sandwiched between oversheet films forming the outermost surface, and then a laminate is formed.
Finally, it is described that the laminate was used for a card by sandwiching the laminate with a mirror surface metal plate and subjecting the laminate to hot lamination press at a temperature of 150 ° C. and a pressure of 25 kg / cm 2 for 5 minutes.

The heat laminating press (heat press) is a step of cooling by holding a laminated body composed of a multi-layer sheet between metal surface plates and heating and holding it. Since the thermosetting or thermoplastic sheet is fused in the process, an integrated laminate can be obtained.
As a problem in this case, there is a warp due to a difference in thermal expansion of each sheet material. This warping can be dealt with by making the layer structure odd and symmetrical, making the central layer a hard and heat resistant material, or pressing at a low temperature.

However, there may be a problem that cannot be dealt with only by the material and arrangement of the laminate as the card body.
One of the problems is that the sandwiched sheet material sticks to the metal surface plate of the hot press apparatus, or the printed layer on the surface of the laminate is transferred to the metal surface plate side. This sticking to the metal surface plate is directly connected to the appearance failure such as peeling of the card surface and printing failure.

  Further, if the next hot pressing is performed while remaining on the metal surface plate side, a dent is formed on the card surface, resulting in poor appearance. If the metal surface plate surface is forcibly peeled off and the surface of the metal surface plate is damaged, the surface plate surface portion cannot be reused.

Another problem with the metal surface plate is that when the upper and lower metal surface plates are separated after the temperature is lowered, it is not known whether the laminated body fused and integrated with the upper or lower surface plate sticks.
In general, the size of the sandwiched sheet is set to be smaller than the metal surface plate in order to maintain the temperature uniformity at the periphery, so it is carefully peeled off from the edge of the sheet so as not to damage the surface of the surface plate. It was necessary. Due to these circumstances, there is a problem that it is difficult to automate the hot press portion in the process of manufacturing the laminate.

  Another problem is that the insoluble layer on the surface of the metal surface plate and the dust and debris resulting from the work environment need to be cleaned and wiped fairly frequently with a solvent. In addition to this, as described above, manual work is always necessary around the heat press apparatus, and the intervention of workers is indispensable. Therefore, there has been a problem that environmental pollution due to dust generation due to work activities and a decrease in manufacturing yield due to the contamination are inevitable.

  In order to solve the above-mentioned problem, Patent Document 3 discloses that an inlet base material (20) in which an IC tag or an antenna is laid is temporarily stretched from the outside with a plurality of core base materials (21) to (23). 26), a step of sandwiching the laminate with a pair of release films (24), a step of sandwiching the laminate from above the release film with a pair of metal plates (25), the metal plate Manufacturing a non-contact type IC card, comprising: a step of heat-pressing, a step of separating the metal plate, a release film and the laminate, and a cutting step of forming the laminate (26) into a card. A method is disclosed (see FIG. 3).

  As a result, the card substrate is attached to the metal plate of the device by the heat lamination press of the card substrate with the release film interposed between the metal plate and the laminate, and the printed layer of the card substrate is transferred. It has become possible to prevent this.

  According to the above method, the heat laminating press is performed by disposing the release film and the metal plate on the card surface. As a result, the surface state of the release film is transferred to the card surface, and the card surface is inverted from the surface of the release film.

  Usually, the surface of the card is subjected to a heat laminating press using a release film with high smoothness so that the surface is smooth in consideration of printing personal information in post-processing so that the card surface becomes smooth. ing.

However, personal information may not be printed depending on the type of card, and such a card does not necessarily require surface smoothness.
The surface of cards that do not require smoothness can be decorated by various methods, but it is possible to add patterns and textures that cannot be obtained by normal printing, so several methods are proposed for this purpose. Has been.

Patent Document 4 discloses a technique for attaching a flexible sheet such as paper to a telephone card. As a result, the texture of the card surface can be improved.
A paper-like flexible sheet is used on the telephone card, with strong adhesive strength that does not cause peeling when the telephone card is read out, and the curl of the telephone card that causes the reading error is well eliminated. As a surface material for a magnetic card that can be bonded together, there is a heating temperature for bonding on the back surface of a flexible sheet (for example, Japanese paper, silk cloth, leather, etc.) that has extremely low rigidity compared to the magnetic card body. It has been proposed to provide a thermoplastic resin adhesive having a thickness of 5 to 100 μm at 100 to 150 ° C.

  As another method, Patent Document 5 discloses a technique for creating a card by sealing a storage object such as a pressed flower on a base material using a cover material. This technique can also give the card surface a texture such as a pressed flower.

That is, according to this method, the sheet-like storage object (pressed flower or the like) arranged on the flat base material is sealed with the cover material in a state where it can be seen through from the surface of the card.
This cover material is composed of a thin paper layer (such as Japanese paper) through which the object to be stored can be seen through, and a heat-adhesive fibrous layer (hot melt adhesive fiber layer) formed on one surface of the thin paper layer. ing. This cover material has air permeability and transparency is improved by heating and pressing.

  When a pattern or texture that cannot be obtained by normal printing is applied to the surface of a card that does not require surface smoothness by the method proposed in Patent Document 3, the surface of the metal plate is processed to make paper or cloth A method such as embossing the surface of the card by hot pressing to form a pattern or an uneven surface with a reversed pattern is considered, but a special additional process is required for this, leading to a decrease in production efficiency. I will.

  However, when a pattern or texture that cannot be obtained by normal printing is applied to the surface of the card that does not require surface smoothness by the methods proposed in Patent Document 4 and Patent Document 5, the texture is applied to the card surface. It is necessary to provide a flexible sheet or cover material to give.

  Not only these methods, but also cards with different materials such as cloth and pressed flowers that are different from the plastic material of the outer packaging material on the card surface, it is difficult to ensure physical properties such as surface resistance. There are many cases.

JP 2002-197433 A JP-A-9-277766 JP 2009-113357 A JP-A-8-50719 JP 2000-309061 A

  In order to solve the above problems, in the present invention, the manufacture of a card that can efficiently impart a pattern or texture to the surface of the card without bonding different materials or processing a hot-pressed metal plate It is an object to provide a method.

  In order to solve the above-mentioned problems, the invention of claim 1 includes a step of sandwiching a card substrate with a pair of release films, and a card substrate sandwiched between the release films with a pair of metal plates. Or a step of sandwiching with a cloth, a step of heat laminating and pressing using the metal plate, a step of separating the metal plate and the paper or cloth, a release film, and a card substrate. Card manufacturing method.

  The invention according to claim 2 is characterized in that the paper or cloth has irregularities.

  The invention according to claim 3 is characterized in that the film thickness of the release film is between 20 and 40 μm.

  The invention according to claim 4 is characterized in that the card base material has one or more core base materials made of thermoplastics, and a pair of thermoplastic base materials on both sides of the core base materials. To do.

  The invention according to claim 5 is characterized in that the release film is larger in plan dimension than the card substrate and the metal plate.

  The invention according to claim 6 is characterized in that the release film has a release protective layer, and the release protective layer is transferred and formed on a card substrate in the thermal laminating press step.

  According to the production method of the present invention, the gloss or texture of the surface of paper or cloth can be reproduced on the card surface at low cost without special processing to form a pattern on the mold. It is now possible to make a card with a feeling that can not be obtained.

It is a cross-sectional schematic diagram which shows an example of the non-contact-type card | curd which concerns on the manufacturing method of the card | curd of this invention. It is a cross-sectional schematic diagram which shows an example of the card | curd which concerns on the manufacturing method of the card | curd of this invention. It is a cross-sectional schematic diagram which shows an example of the non-contact type card | curd of a conventional manufacturing method. It is explanatory drawing explaining the manufacturing process of the non-contact-type IC card which concerns on the manufacturing method of the card | curd of this invention. It is the external appearance example before and behind the heat laminating press process by the manufacturing method of the card | curd of this invention.

Hereinafter, an example of an embodiment of a method for producing a Japanese paper pattern card of the present invention will be described with reference to the drawings.
FIG. 4 shows an example of a manufacturing process of a non-contact type IC card as an example of the Japanese paper pattern card according to the present invention, arranged around the metal plate circulation portion (28) for each target unit of work. It is explanatory drawing typically demonstrated.
FIG. 1 shows a laminate structure of a card base material that is a card body of a non-contact type IC card.

First, although it is a card base material supply unit (1), the card base material (26) used as a card body is the structure shown in FIG.
The inlet substrate (20) is a component (IC chip or IC) required for wireless communication such as an antenna or semiconductor component on one plane of a film made of vinyl chloride resin, polyethylene terephthalate, polycarbonate, or the like or in a hole through the film. Module).

  These antennas, semiconductor parts, and the like are generally multifaceted, and individual cards are individually cut and completed in the final cutting process of the manufacturing process. In addition, before cutting, the inlet base material (20) includes only the antenna, and there may not be a semiconductor component or the like and a hole for receiving the semiconductor component. May be implemented.

  The card base material (26) serving as the card body includes a core base material (21) made of a vinyl chloride resin and the like so that the layer structure is symmetrical with the inlet base material (20) as a central layer, and an intermediate base material (22). ), A plurality of layers such as the exterior substrate (23) are temporarily laminated with an adhesive such as cyanoacrylate and laminated. In addition, the said layer structure is an example and you may abbreviate | omit an intermediate | middle layer according to the objective.

  As a method for laminating the base material constituting the card base material, a well-known method such as a roll-to-roll method or a single wafer method can be used. The number of layers to be laminated is determined as necessary, but usually the total thickness of the card is set within the range of 0.68 mm to 0.84 mm. This card substrate is cut into a desired size and held in a stocker in the card substrate supply unit (1).

  Plastic films such as vinyl chloride resin (PVC), amorphous polyethylene terephthalate (PET-G), and polycarbonate can be used as materials used for the individual layers constituting the card base (26). From the point of view, PET-G can be preferably used.

As the release films (24) and (24 ′), plastic films having good releasability from the metal plates (25) and (25 ′) and the exterior base materials (23) and (23 ′) can be used. .
Examples of such a film include a PP (polypropylene) film and a biaxially stretched PET film.
Although the releasability of the PP film and biaxially stretched PET film for the metal plate was equivalent, the releasability of the PP film and biaxially stretched PET film for PET-G was superior to that of the PP film. When PET-G is used as the base material of the base material (23) or (23 ′), it is preferable to use a PP film as the release film. This is considered to be because the affinity of PP for PET-G is inferior to that of biaxially stretched PET film.
The thickness of the release film is preferably between 20 and 40 μm. If it is this range, the release property of the card base material from the metal plate will be good, and the pattern of the paper or cloth sandwiched between them will be good.

Further, the release film can be made larger in plan dimension than the card substrate and the metal plate.
Thereby, it becomes possible to grip the protruding portion of the release film without touching the surface of the metal plate, and handling on the apparatus can be facilitated. For example, when separating the card substrate, the metal plate, and the release film, the release film, the integrated laminate, the metal plate, and the paper and cloth can be mechanically separated in the separation unit.

  In addition, a release protective layer may be formed on the release film, and may be transferred and formed on a card substrate at the time of laminating press. The release protective layer can be formed by coating. Moreover, it is preferable that the thickness of a peeling protective layer is between 0.5-3.0 micrometers. If it is this range, a pattern can be provided on the card substrate surface and the protection performance of the card substrate surface can be improved.

The release films (24) and (24 ′) may be supplied in a roll shape and cut before being collated with the laminate. When PP films are used as the release films (24) and (24 '), there are cases where the films are brought into close contact with each other due to triboelectric charging and foreign matter in the air adheres.
For this reason, by supplying the release film in a roll shape, the film is brought into close contact with each other due to the static electricity generated by the friction when the release film is fed, and the dust generation film such as dust or dust in the work environment. Can be effectively prevented. In addition, it is also useful to prevent static electricity generation by supplying a film with a roll and performing a static elimination blower process when the film is pulled out.
Since the superposition is performed on a single sheet, the sheet is cut and discharged in synchronism with the superposition. These processes are automatically performed by the release film supply unit (2).

In the Japanese paper supply unit (16), paper such as Japanese paper or cloth (27), (27 ') is cut and overlapped on the release film and discharged.
Here, the paper or cloth used in the present invention is Japanese paper as long as it has no thermal deformation at the time of the heat laminating press and can pattern the surface of the card substrate such as the surface of the exterior substrate through the release film. Various materials such as a material having a pattern containing a fibrous substance made of plant fibers or chemical fibers such as paper, cloth, and woven fabric, and a material having a pattern such as a plant or animal skin can be used.
Moreover, these patterns of paper, cloth, etc. have a three-dimensional concavo-convex shape, can maintain a certain shape even when pressed in a laminating press process, and can be transferred to a card substrate via a release film. It is preferable.
The overlapping unit (3) includes an upper metal plate (25), paper and cloth (27), a release film (24), a card substrate (26), a release film (24 '), paper and cloth (27' ) And the lower metal plate (25 ′) are positioned and mechanically automatically performed. A plurality of basic card substrates (26) can be stacked.
In this state, the superposed ones are discharged to the press previous flow path (4) of the metal plate circulation flow path (28) and moved to the laminate press unit (5).

It is important that the size of the release films (24) and (24 ′) is larger than the sizes of the card base (26) and the metal plates (25) and (25 ′). This extra ear is used in the separation unit (7) after the hot laminating press. For the metal plate, SUS304, SUS430, or the like can be used.
When the surface of the metal plate is a mirror surface, the surface of the card substrate has a pattern such as paper or cloth with the mirror surface as a base. When the surface of the metal plate has a mat shape, the surface of the card substrate has a pattern such as paper or cloth with the mat shape as a base.

The laminating press unit (5) is loaded with a card substrate (26) sandwiched between a release film and Japanese paper sandwiched between metal plates 25 and 25 ', and mechanically presses and unloads. It is.
The pressing conditions are preferably higher than the glass transition temperature of the card substrate in contact with the metal plate and the release film, for example, the film used for the exterior substrate. Usually, the pressure is from 100 ° C to 160 ° C and the pressure is from 1.5 MPa. The standard range is 4 MPa and the time is 30 to 60 minutes.

  The separation unit (7) includes release films (24) and (24 '), paper and cloth (27), (27') metal plates (25) and (25 '), and an integrated card base (26 ). In the separation, the metal plate is pulled while gripping the protruding portion of the release film, and then the release film is pulled together with the Japanese paper.

  Any of these processes is possible mechanically. Finally, the card base material integrated with the release film and paper or cloth is separated and stored in the respective stockers, that is, the film Japanese paper recovery unit (8) and the card base material discharge unit (9) by a transport hand or the like.

  The card base material stored in the card base material discharge unit (9) is sent to the cutting part (10). The cutting part (10) is a part that separates the card base material by a punching method, and thereby a non-contact type IC card having a paper pattern or a cloth pattern is completed.

The metal plates (25) and (25 ′) are collected in the metal plate stocker (11) through the metal plate circulation passage (28), and if necessary, washed, dried or exchanged and re-introduced.
Such a series of operations can be easily performed by combining a hand, a lifter, a conveyor and the like. By automating the above operations, an improvement in manufacturing yield rate can be achieved.
More specifically, the card substrate, the release film, paper or cloth and a process of superimposing a metal plate, one unit, the process of hot pressing a metal plate, one unit, the metal plate, the paper or cloth, The process of separating the release film and the integrated laminate is one unit, and the metal plate stocker process is one unit, and all units are connected so as to circulate the metal plate, so that each step of card manufacturing is a conveyor, It can be connected with a transfer hand or a lifter to make an automated production line.

In the present invention, as described above, during the heat laminating press of the card base material, a paper or cloth is interposed between the metal plate and the release film and the heat laminating press is performed so that the Japanese paper or cloth is directly placed and heated. When laminating, there is no paper or fabric fiber residue (fluffing) generated on the card surface. In addition, the release film is softened by the heat applied through the metal plate during thermal lamination, and is also applied through the metal plate. Since the pressure deforms following the unevenness of the paper or cloth, the pattern of the paper or cloth can be transferred to the card surface.
As a result, the gloss and texture of the surface of the paper or fabric placed through the release film is reproduced on the card surface, and the card surface is made of the same plastic material. It is now possible to make a card with a sticker that floats.
Furthermore, according to the method of the present invention, there is no sticking between the metal plate and Japanese paper or cloth during the heat laminating press, and no sticking between the card surface and the release film occurs. And with the release film and the laminate sandwiched, it can be carried into a hot press machine and subjected to hot press and discharge processing.
Furthermore, there is no product sticking to the heat press apparatus itself. As a result, there is no related manual work in the vicinity, and the work can be automated, thereby improving the production efficiency and reducing the defect rate.

  In the above example, the configuration of the non-contact IC card has been described. However, the present invention can also be applied to a card using a single-layer base material, a contact IC card, and a magnetic card. In the case of using a contact IC card, a recess for collecting the contact IC module is formed by milling after the heat laminating press process, and the contact IC module is embedded in the recess. When a magnetic card is used, a magnetic recording layer (magnetic tape) is embedded on the card surface after the heat laminating press process so as not to crush the surface pattern.

  Further, a pattern layer may be provided on the card surface. When forming a release protective layer on the release film, a pattern layer can be formed on the release protective layer.

<Example 1>
Examples of embodiments of the present invention will be described below. An example of the layer structure of a non-contact IC card without a magnetic tape according to the manufacturing method of the present invention is shown in FIG.
The card configuration of this example uses a vinyl chloride resin (PVC) having a glass transition temperature (Tg) of 85 ° C. for the core base materials (21) and (21 ′), and the intermediate base materials (22) and (22 ′). The base materials of the same kind as the core base material were used for the exterior base materials (23) and (23 ′).

As shown in FIG. 1, the core base material, the intermediate base material, and the exterior base material are laminated in this order on the front and back surfaces of these base materials as shown in FIG.
Using a polypropylene (PP) film having a Tg of around 0 ° C. for the release films (24) and (24 ′), the temperature condition is 120 ° C. to 160 ° C. which is equal to or higher than the Tg of the base material, the pressure condition is 140 N / cm 2. Then, the base materials were integrated by a heat laminating press to prepare a card base material (26).

The surface state of the metal plates (25) and (25 ′) is transferred to the surface of the integrated card base via the release films (24) and (24 ′).
If the surface of the metal plate is a mirror surface, the surface of the card substrate is a mirror surface, and if the surface of the metal plate is matted (matte), the card surface has a matte surface.

  In this example, as shown in FIG. 1, a Japanese paper (27) is sandwiched between a release film (24) and a metal plate (25), so that a PP film (24), a core substrate (21), an intermediate Among the base material (22) and the exterior base material (23), the Tg of the exterior base material (23) is lower than the laminating temperature and the heat resistance temperature of the sandwiched Japanese paper (27) is high, so that the PP film (24), the exterior The surface of the substrate (23) is deformed, and the pattern of the Japanese paper (27) can be given to the card surface.

  Similarly, on the opposite surface of the inlet base material (20), a Japanese paper (27 ') is sandwiched between the release film (24') and the metal plate (25 '), so that the PP film (24') and the core Of the base material (21 ′), intermediate base material (22 ′), and exterior base material (23 ′), the Tg of the exterior base material (23 ′) is particularly lower than the laminating temperature, and the heat resistance of the sandwiched Japanese paper (27 ′). Since the temperature is high, the surfaces of the PP film (24 ′) and the exterior base material (23 ′) are deformed, and the pattern of the Japanese paper (27 ′) can be given to the back surface of the card.

In addition, the pattern and texture of the surface of the card base (26) can be easily changed by replacing the Japanese paper (27) and (27 ') to be sandwiched with paper or cloth. The cloth used here may be made of natural fibers such as cotton, or may be made of chemical fibers as long as thermal deformation does not occur during lamination.
The card substrate (26) was cut to obtain a Japanese-style non-contact IC card of the present invention. The card's surface pattern and texture are of a Japanese style.

<Example 2>
A non-contact IC card without a magnetic tape according to the production method of the present invention was prepared in the same manner as in Example 1 except that the core substrate was changed to PET-G having a glass transition temperature (Tg) of 80 ° C.
The pattern and texture on the surface of this card was a Japanese style with the same surface as in Example 1.

<Example 3>
As shown in FIG. 2, the inlet base material (20) and the intermediate base materials (22), (22 ′) are omitted, and the core base materials (21), (21 ′) and the exterior base material (23), ( 23 ′) was changed to PET-G having a glass transition temperature (Tg) of 80 ° C., and a card without a magnetic tape was produced in the same manner as in Example 1 by the production method of the present invention.
The pattern and texture on the surface of this card was a Japanese style with the same surface as in Example 1.

<Comparative Example 1>
As shown in FIG. 3, the magnetic properties were the same as in Example 1 except that the Japanese paper (27) between the metal plates (25), (25 ′) and the release films (24), (24 ′) was removed. A non-contact IC card without tape was prepared.
The pattern and texture of the card surface was the same smooth matte surface as that of the metal plate, giving it an appearance that was far from being simple, but also Japanese.

As mentioned above, the example of the manufacturing process of the non-contact type IC card has been mainly shown as an example of the Japanese paper pattern card of the present invention. However, according to the manufacturing method of the present invention, the card can have various configurations other than the non-contact type IC card. It is possible to efficiently produce a card with a Japanese-style quaint appearance.
As an example, FIG. 2 shows an example of a laminate structure in the case of a card having a simpler structure other than the non-contact type IC card.

  In this case, a simpler card base material (26 ′) having a configuration is used instead of the card base material (26), and the layer constituting the card base material is a pair of the base material sandwiching the inlet base material (20). Core substrate (21), (21 '), a pair of intermediate substrates (22), (22'), a pair of exterior substrates (23), (23 ') The structure is simplified to a configuration of a pair of exterior base materials (23) and (23 ′) sandwiching.

FIG. 5 shows an example of the appearance of the Japanese paper and the card surface before and after lamination by the method for producing a Japanese paper pattern card of the present invention.
FIG. 5A shows the Japanese paper surface before lamination, (B) shows the card surface before lamination, (C) shows the Japanese paper surface after lamination, and (D) shows the appearance of the card surface after lamination.
It can be confirmed that a state in which the texture of Japanese paper is imparted to the card surface by the method for producing a Japanese paper pattern card of the present invention appears on the card surface after lamination.

As described above, according to the method for producing a Japanese-style pattern card of the present invention, the texture of the front and back surfaces of the card is changed, so that the tactile design by texture is added in addition to the visual design by printing.
In addition, the card surface can be maintained with the physical properties of a conventional plastic card as it is simply by adding a pattern due to the irregularities of paper or cloth on the card surface.

  In particular, compared to the case where paper or cloth is pasted on the card surface, the paper or cloth is likely to generate dust due to friction, but the card of the present invention is less dusty because the paper or cloth is not on the surface. In addition, there is an effect that the absorption of hand sweat is small and the dirt is hardly noticeable.

The manufacturing method of the present invention can be widely used in addition to the manufacture of non-contact type IC cards, such as ID cards, contact type IC cards, and non-contact type IC dual cards.
That is, it is desired to provide a pattern or texture on the surface of an ID card that does not have a magnetic tape or that does not include CP, UG, or other card surface printing, and a contact IC card or non-contact IC dual card. It is a technology that can be widely applied in various fields.

1... Card substrate supply unit 2... Release film supply unit 3... Overlapping unit 4. ··································································································· ··· Card base material discharge unit 10 ··· Cutting section 11 ··· Metal plate stocker 16 ··· Japanese paper supply unit 20 ··· Inlet base materials 21 and 21 ' ..Core base material 22, 22 '.. Intermediate base material 23, 23' .. Exterior base material 24, 24 '.. Release film 25, 25' .. Metal plate 26, 26 '.. Card base material 27 27 '·· Paper or cloth 28 ··· Metal plate circulation part

Claims (6)

Sandwiching the card substrate with a pair of release films,
A step of sandwiching the card substrate sandwiched by the release film with a pair of metal plates via paper or cloth,
A step of heat laminating using the metal plate,
Separating the metal plate, the paper or cloth, the release film, and the card substrate;
A method of manufacturing a card, comprising:   The card manufacturing method according to claim 1, wherein the paper or cloth has irregularities.   The card manufacturing method according to claim 1, wherein a film thickness of the release film is between 20 and 40 μm.   The said card | curd base material has the core base material of 1 or more layers which consists of thermoplastics, and the exterior base material which consists of a pair of thermoplastics on both sides of this core base material, The any one of Claims 1-3 characterized by the above-mentioned. The manufacturing method of the card | curd of crab.   The card release method according to claim 1, wherein the release film is larger in plan dimension than the card base and the metal plate. The release film has a release protective layer;
The card manufacturing method according to any one of claims 1 to 5, wherein a peeling protective layer is transferred and formed on a card substrate in the heat laminating press step.