JP2012245533A - Method and device for supplying wire solder - Google Patents

Abstract

An object of the present invention is to accurately supply solder to an object to be soldered even if the wire solder has a thin wire diameter.
When the length of the thread solder corresponding to the amount of solder required for soldering is X, and the distance that separates the tip of the thread solder from the soldering target after the solder supply is Y, the movable clamp is The thread solder is released and moved in the return direction by a distance X, and the thread solder is gripped again at the position after the movement. Then, the holding of the thread solder by the fixed clamp is released, and the movable clamp moves the distance X in the delivery direction, thereby conveying the length X of the solder solder in the delivery direction. Next, the thread solder is gripped by the fixed clamp, and the movable clamp moves the distance Y in the return direction while gripping the thread solder, so that the thread solder positioned in the gap between both the clamps is held in a curved state. Then, the movable clamp is moved by the distance Y in the feeding direction while the thread solder is held by the fixed clamp and the movable clamp.

[Selection] Figure 5

Description

  The present invention relates to supply of thread solder used in a soldering apparatus, and more particularly to a thread solder supply method and supply apparatus suitable when precise solder supply using thread solder with a thin wire diameter is required.

  Conventionally, soldering has been widely performed when joining connection terminals and wiring materials of electrical / electronic components. As mass production of products has progressed, automation of soldering has been widely performed. The automatic soldering apparatus generally has a soldering head as shown in FIG. In FIG. 6, reference numeral 51 is a soldering head, 52 is a base plate, 53 is an elevating drive unit, 54 is a heating means, 55 is a nozzle, 56 is a tube, 57 is a feed mechanism unit, and 58 is a spool.

  Here, the raising / lowering drive part 53 fixed to the base plate 52 moves the heating means 54 and the nozzle 55 integrally up and down by moving the rod 53A provided at the lower end up and down. Here, the up and down movement means that the object is to be separated and close to the soldering target (hereinafter also referred to as a workpiece) indicated by reference numeral 60. On the other hand, the thread solder 59 wound around and supplied to the spool 58 passes through the feed mechanism portion 57 and then is guided by the tube 56 to penetrate the nozzle 55, and its tip 59 A protrudes from the tip of the nozzle 55.

  When the tip 59A of the thread solder that has been lowered together with the heating means 54 is positioned in the vicinity of the workpiece 60, the heating of the workpiece 60 is performed by the heating means 54 (solder rod or laser light irradiation device). Then, when the workpiece 60 has risen to a predetermined temperature, the pair of feed rollers 57A provided in the feed mechanism unit 57 is rotated to feed the thread solder 59 from the tip of the nozzle 55, and thereafter, a predetermined amount of thread solder is sent out. A predetermined amount of solder is supplied to the workpiece 60 while melting the tip 59A of the thread solder. Thus, soldering is automatically performed, and the elevating drive unit 53 is driven to raise the heating means 54 and the nozzle 55. Thereafter, by moving the workpiece 60, the next soldering position is positioned immediately below the heating means 54, and the same soldering operation is repeated.

  In such automatic soldering technology, with the recent miniaturization of electronic components and wiring materials, the soldering target is also becoming finer, the thread solder becomes finer, and the supply amount of solder is also required to be precise. It became so. Therefore, Patent Document 1 has the following description. In order to cause the thread solder to sag in the tube (corresponding to reference numeral 56 in FIG. 6) (FIG. 4 in Patent Document 1), the rotation of the feed roller (corresponding to reference numeral 57A in FIG. 6) and the actual feeding from the nozzle tip There is a difference in the length of thread solder. Therefore, in addition to the feed roller, a serrated roller is provided to feed the thread solder with serrated irregularities, and the number of the irregularities is counted by a reflective optical sensor provided at the tip of the nozzle. Is accurately controlled (FIG. 1 of Patent Document 1).

  However, as mentioned above, the wire diameter of thread solder has recently become remarkable, and the wire diameter of the thread solder has become less than 0.3 mm. As a result, the unevenness has to be fine, and the number of unevenness is accurately counted. In addition, it is difficult to provide a reflective optical sensor on the workpiece side at the tip of the nozzle, which hinders a fine soldering operation. Therefore, the thread solder 59 is not sent out to the nozzle through a tube where the thread solder is likely to be loosened, but the feed mechanism 61 is directly connected to the nozzle 62 as shown in FIG. A structure that eliminates a conveyance path in which the solder 59 bends has been studied. Thereby, the variation in the feed amount due to loosening of the thread solder can be greatly reduced.

  In this way, the amount of thread solder delivered can be controlled almost accurately, but further problems remain, and when the wire diameter of the thread solder to be used becomes thinner and its direct line becomes less than 0.3 mm, Slip occurs between the feed roller 61A and the thread solder 59, and it becomes difficult to accurately feed the thread solder 59 having a predetermined length. Therefore, when the slippage is eliminated by providing irregularities on the surface of the feed roller 61A that comes into contact with the thread solder 59, the fed thread solder 59 is deformed in a zigzag shape. Problems arise.

  Therefore, the inventors have conceived a method of feeding the thread solder by using two clamps instead of the feed roller, one clamp being a fixed clamp and the other clamp being a movable clamp. As shown in FIG. 8, the feeding mechanism 71 and the nozzle 72 are directly connected and the thread solder 75 is fed by two clamps 73 and 74 provided in the feeding mechanism 71. First, as shown in FIG. 8A, the fixed solder 73 that is one of the clamps is closed to grip the thread solder 75, and the movable clamp 74 that is the other clamp is opened to release the thread solder 75. Move the distance L in the direction of the middle arrow a. Then, this distance L is set to the subsequent amount (length) of the solder wire feed.

  Next, as shown in FIG. 8B, the movable clamp 74 is closed to grip the thread solder 75, and the fixed clamp 73 is opened to release the thread solder 75. Further, as shown in FIG. 8C, the movable clamp 74 is moved by a distance L in the direction of arrow A in the figure while the thread solder 75 is held by the movable clamp 74. By these operations, the tip 75A of the thread solder 75 is sent out forward of the nozzle 72 by a distance L. A wire feeding method using such a fixed clamp and a movable clamp, as disclosed in Patent Document 2, for example, to cut a wire or the like into a certain length, for example, to a certain length in one direction. It is used to intermittently send out the wire.

JP 2003-181633 A (3rd page, FIGS. 1 and 4) Japanese Patent Laying-Open No. 2006-61967 (6th page, FIG. 4)

  However, there is no problem if the operation required for the thread solder supply device during soldering is only to send the thread solder in one direction as described above, but a predetermined amount of solder while melting the tip of the thread solder. When the nozzle is moved upward as it is after supplying the wire, there is a high possibility that the tip of the thread solder will be fused and bent with the supplied solder. Therefore, immediately after supplying a predetermined amount of solder, it is necessary to return the thread solder to the nozzle side while leaving the position of the nozzle as it is. When this return operation is performed by the above-described thread solder conveying method using the two clamps, the linearity of the thread solder in the feeding mechanism section is lost, and the shape is bent into an unpredictable shape. Then, when the clamp again grips the curved thread solder, normal feeding cannot be performed.

  In addition, if a back tension is applied to the thread solder by adding a mechanism with a new driving force, such as applying a constant torque in the reverse rotation direction to the spool that supplies the thread solder, the thread solder will reverse in the tube. It is considered that the linearity of the thread solder in the delivery mechanism can be maintained by moving in the direction (return direction), but the equipment becomes large and this time the wire diameter is small when transporting the solder in the delivery direction. There is a high possibility that the thread solder cannot withstand this tension and breaks.

  Therefore, in order to solve these problems, the present invention precisely controls the amount of solder to be supplied even when the wire diameter of the thread solder used for the soldering work is thin, without complicating or increasing the size of the apparatus. It is possible to stabilize the quality of soldering.

The present invention provides, as a first aspect, a solder supply method for feeding a predetermined amount of thread solder toward a soldering target, wherein the length of the thread solder corresponding to the amount of solder required for soldering is X, the solder When the distance that separates the tip of the thread solder from the soldering target is Y after the supply is finished, a fixed clamp that is fixed in the feeding mechanism section, and in the sending and returning directions of the thread solder in the feeding mechanism section. Provided is a method for supplying thread solder, characterized in that thread solder is supplied through the following operations a) to e) using a movable clamp that is movably provided.
a) Operation to hold the thread solder with a fixed clamp and a movable clamp provided with a gap and hold the thread solder located in the gap between both clamps in a substantially straight line b) Continue to hold the thread solder with the fixed clamp However, the movable clamp releases the thread solder and moves the distance X in the return direction, and the movable clamp grips the thread solder again at the moved position. C) The thread clamp is released from the fixed clamp and the thread is released. The movable clamp moves the distance X in the delivery direction while holding the solder, and moves the length X of the thread solder in the delivery direction. D) The thread clamp is held by the fixed clamp. Moving the distance Y in the return direction while holding it, and holding the solder solder located in the gap between both clamps in a curved state e) Fixed clamp While holding the wire solder in fine movable clamp, a movable clamp it to the distance Y moved to the dispensing direction, the operation for holding the wire solder located in the gap between these two clamps substantially linearly

  As a result, even when the tip of the thread solder is moved in the return direction, the curved portion due to the slack of the thread solder can be limited to the range of the gap between the fixed clamp and the movable clamp. Therefore, by moving the movable clamp in the feeding direction while holding the thread solder, the thread solder can be returned to a substantially linear shape, and the next feeding operation can proceed normally.

  According to a second aspect of the present invention, there is provided a solder supply device for feeding a predetermined amount of yarn solder toward a soldering target, a feeding mechanism portion that houses the feeding mechanism, and a yarn feeding mechanism portion that is directly fixed to the feeding mechanism portion. A nozzle that guides the solder toward the soldering target, a fixed clamp that is fixed in the delivery mechanism and holds or releases the thread solder, and can be moved in the delivery direction and return direction of the solder in the delivery mechanism A movable clamp that grips or releases the solder and an operation control unit that controls the operation of the delivery mechanism, wherein the delivery mechanism includes the fixed clamp and the movable clamp, and the operation control unit is fixed. With the clamp and the movable clamp holding the substantially linear thread solder, the movable clamp is set in a predetermined distance by the return direction. By causing moved, to provide a supply device for solder wire, characterized in that to hold the wire solder located in the gap between these two clamps in a curved state.

  Thereby, the supply apparatus which implement | achieves the supply method of the thread solder which is a 1st aspect is obtained.

  According to a third aspect of the present invention, the movable clamp includes a fixed block and an opening / closing block provided at least one end thereof so as to be able to approach and separate from the fixed block in order to grasp and release the thread solder. A second aspect is characterized in that a pair of gripping members that grips the fixing block and the opening / closing block facing each other in direct contact with the thread solder are detachably provided. An apparatus for supplying the described solder wire is provided.

  This makes it possible to adjust the contact area of the gripping member with the thread solder by replacing the gripping member even if the force for gripping the thread solder between the fixed block and the open / close block is constant. The pressure to be adjusted can be adjusted. Furthermore, by changing to a gripping member having different physical properties, the friction coefficient and elasticity of the contact surface with the thread solder can be easily adjusted.

  The feed roller, which has been widely used for supplying thread solder, transports the thread solder on a contact surface close to a point, so that if the wire diameter of the thread solder becomes thin, slipping occurs and an accurate amount of solder is supplied. It was difficult. According to the present invention, since the thread solder is gripped and transported in a surface contact close to a wire, even when the wire diameter of the thread solder is thin, it is possible to supply an accurate amount of solder without causing slippage. Become. Further, according to the present invention, even when the thread solder is transported in the returning direction, the portion that is bent by the loosening of the thread solder can be limited, and then the thread solder at the bent portion can be restored to a substantially straight line. The yarn solder can be accurately conveyed in the feed direction after being conveyed in the return direction.

Schematic of a soldering head including a yarn solder supply device according to an embodiment of the present invention The principal part side view explaining the supply method of the thread solder which concerns on embodiment of this invention The principal part side view explaining the supply method of the thread solder which concerns on embodiment of this invention The graph which shows the soldering operation | movement which concerns on embodiment of this invention The principal part perspective view of the supply apparatus of the thread solder which concerns on embodiment of this invention Schematic diagram of soldering head showing conventional technology Schematic diagram of a soldering head showing another conventional technique Schematic showing an example of the method of feeding the solder wire

  Next, with reference to an accompanying drawing, an embodiment of a supply method and supply device of thread solder concerning the present invention is described in detail. FIG. 1 shows a state in which a solder supply apparatus according to the present invention is provided in a soldering head. In FIG. 1, reference numeral 1 denotes a yarn solder supply device, which includes a delivery mechanism portion 2, a nozzle 3, and a tube 56. Here, the thread solder 4 wound and accommodated on the spool 58 is guided by the tube 56, inserted into the delivery mechanism portion 2 and the nozzle 3 in which the delivery mechanism is accommodated, and the tip 4A is soldered to the workpiece 5 It is attached towards the target of.

  Further, the base 6 rotatably supports the spool 58 and also supports the lift drive unit 7, and when the lift drive unit 7 is driven, the rod 7 </ b> A provided at the lower end and extending downward is vertically moved. The feed mechanism part 2 moves up and down together with the heating means 8 provided at the lower end of the rod 7A. As a result, the heating unit 8, the delivery mechanism unit 2, and the nozzle 3 are integrally separated and close to the workpiece 5. In the present embodiment, the heating means 8 uses laser light irradiation means, and laser light 8A input from a laser transmission device (not shown) via an optical fiber (not shown) is soldered by a condensing lens provided in the heating means 8. The target is focused and irradiated.

  Next, only the main part of FIG. 1 is drawn in FIGS. 2 and 3, and the soldering operation including the thread solder supply method will be described. Here, (a), (b), (c) in FIG. 2 and (d), (e) in FIG. 3 show a flow of a series of soldering operations from (a) to (e). 2 and 3, the same parts as those in FIG. 1 are denoted by the same reference numerals. 2 and 3, reference numeral 3 is a nozzle directly fixed to the delivery mechanism section 2, 9 is a fixed clamp fixed in the delivery mechanism section 2, and 10 is a delivery direction of the thread solder 4 in the delivery mechanism section 2. It is a movable clamp provided to be movable in the return direction.

  Although the detailed configuration of the fixed clamp 9 and the movable clamp 10 will be described later, each of the clamps 9 and 10 has a pair of blocks provided in the front-rear direction with the thread solder 4 positioned in the gap. They are opened and closed in the front-rear direction to grip or release the thread solder 4. Further, circles 9A and 10A drawn by dotted lines are gripping members that are provided on the opposing surfaces of a pair of blocks of both the clamps 9 and 10 and are in direct contact with and gripped by the thread solder 4. The open / closed state of both the clamps 9 and 10 is not shown in FIGS. 2 and 3, so that “close” or “open” is attached in the vicinity to hold the thread solder 4, or the thread It shows whether the solder 4 is open.

  FIG. 2A shows a state at the start of the soldering operation. Here, the laser beam is not yet irradiated from the heating means 8, the workpiece 5 is positioned at a predetermined soldering work position, and the heating means 8 and the thread solder supply device are integrated to perform the soldering work. In addition, the solder wire 4 is lowered to the position, and the solder wire 4 is attached to the solder wire feeder, and the tip 4A is positioned at the end of the soldering target. Here, both the fixed clamp 9 and the movable clamp 10 hold the thread solder, and the thread solder 4 positioned in the gap between the clamps 9 and 10 is held in a substantially straight line shape. This state of the thread solder supply device and the thread solder 4 is called a standby state.

  Next, as shown in FIG. 2B, the laser beam 8A is irradiated from the heating means 8 and preheating is started. This preheating is performed by irradiating a laser beam 8A having a lower output than the main heating performed later, and heats the tip 4A portion of the thread solder 4 together with the soldering target. The preheating by the heating means 8 is performed, and the gripping of the fixed clamp 9 in the delivery mechanism unit 2 is continued, while the movable clamp 10 releases the thread solder 4 and returns (in the direction of arrow A in the figure). ) For a distance X. Then, the movable clamp 10 grips the thread solder 4 again at that position.

  Next, the heating means 8 that has finished the preliminary heating increases the output of the laser beam and shifts to the main heating. When the soldering target and the tip 4A portion of the thread solder 4 reach a predetermined main heating temperature, the fixed clamp 9 releases the thread solder 4 and the movable clamp 10 is threaded as shown in FIG. The solder 4 is moved in the feeding direction (in the direction of arrow A in the figure) while being held, and the thread solder 4 is conveyed by a length X and supplied to the soldering target. Here, the feed length X of the thread solder 4 is preset as the length of the thread solder 4 corresponding to the amount (volume) of solder necessary for soldering, and is a portion indicated by reference numeral 11 in the figure. However, it is a solder that has melted by being supplied and has wetted up the soldering target.

  When the supply of the solder is completed in this way, the thread solder 4 is gripped by the fixed clamp 9 and the movable clamp 10 as shown in FIG. 3 (d), and the movable clamp 10 returns (in the direction of arrow A in the figure). ) To the distance Y. As a result, the thread solder 4 is bent due to the slack only in the portion located in the gap between the fixed clamp 9 and the movable clamp 10, and at the same time, the tip 4A of the thread solder 4 moves in the return direction by the distance Y. By doing so, the linearity of the portion of the thread solder 4 protruding from the tip of the nozzle 3 can be maintained, and at the same time, the curved portion of the thread solder 4 is positioned in the gap between both clamps in the feed mechanism portion 2. It can be limited to the part to do.

  Then, as shown in FIG. 3E, the laser beam irradiation from the heating means 8 is stopped to raise the heating means 8 and the solder supply device, and the thread solder 4 is held by the fixed clamp 9 and the movable clamp 10. The movable clamp 10 is moved by the distance Y in the feeding direction (the direction of arrow A in the figure). As a result, the thread solder 4 that has been curved at the gap between the clamps 9 and 10 is restored to a substantially straight line, and the state of the thread solder supply device and the thread solder 4 is described in the description based on FIG. It becomes a state. Therefore, the work 5 ′ to be subjected to the next soldering is arranged at a predetermined position, or another soldering object of the same work is arranged at a predetermined position, and has been described based on FIG. From the operation, the soldering operation can be repeated.

  FIG. 4 is a graph showing the operation of the above-described yarn solder supply device 1 and the output of the heating means 8 on the basis of the time axis. First, as described with reference to FIGS. 2 (a) and 2 (b), the thread solder supply device 1 is configured to heat the heating means 8 in a standby state in which the tip 4A of the thread solder 4 is positioned at the end of the soldering target. Starts preheating, performs preheating, and the movable clamp 10 releases the thread solder 4 and moves the distance X in the return direction, and grips the thread solder 4 again. Further, when the preheating is completed, the heating means 8 increases the output of the laser beam and performs the main heating. Then, after reaching a predetermined output of the main heating, the fixed clamp 9 releases the thread solder 4, and the movable clamp 10 moves the distance X in the feeding direction while holding the thread solder 4, so that the thread solder 4 of length X is moved. Is supplied to the object to be soldered. When the supply of the length X of the solder wire 4 is completed in this way, the fixed clamp 9 grips the thread solder 4 and then the movable clamp 10 moves in the return direction while holding the thread solder 4 by the distance Y. 4A is separated from the object to be soldered by a distance Y. Next, when the heating means 8 stops the output of the laser beam, the soldering is finished, and the movable clamp moves the distance Y in the feed direction, so that the state of the thread solder supply device and the thread solder 4 becomes the standby state again. Become.

  Next, the structure of the delivery mechanism part 2 which concerns on embodiment of this invention is demonstrated based on FIG. FIG. 5 is a perspective view showing the configuration of the feed mechanism provided inside the feed mechanism portion 2, and the solder wire 4 passes straight through the feed mechanism portion 2, and its tip 4 A protrudes from the tip of the nozzle 3. The state is drawn. First, the nozzle 3 is directly fixed to the delivery mechanism section 2, and the front panel 2A is provided so as to be freely opened and closed. The fixed clamp 9 is mainly composed of a fixed block 12 and an opening / closing block 13. The fixing block 12 is fixed to the delivery mechanism 2, and the opening / closing block 13 rotates around a fulcrum 14 provided near the lower end. Thus, the upper end thereof is provided so as to be close to and away from the fixed block 12.

  The structure of the proximity and separation and the structure of the gripping member that directly contacts and grips the thread solder 4 are the same in the movable clamp 10, and these structures will be described based on the movable clamp 10. The movable clamp 10 also has a fixed block 15 and an opening / closing block 16, and has a fulcrum in the vicinity of the lower end. The upper part of the opening / closing block 16 can be opened and closed as indicated by an arrow C. A tension coil spring 17 is stretched, and when the opening / closing block 16 is opened widely, the opening / closing block 16 is urged in the opening direction, and when the opening / closing block 16 is closed, the tension coil spring 17 is further closed. The opening / closing block 16 is urged in the direction.

  Here, a state in which the open / close block 16 of the movable clamp 10 is greatly opened is illustrated, but this state is effective when setting the thread solder 4 in the feeding mechanism portion 2 as a setup for soldering work. A pair of gripping members 10A and 10A shown in the movable clamp 10 are provided on a pair of surfaces of the fixed block 15 and the opening / closing block 16 facing each other, and the gripping members 10A and 10A are detachably provided. Thus, it is easy to adjust the length of contact when the thread solder 4 is gripped or to change the material of the gripping members 10A and 10A themselves. There are a plurality of options such as a friction coefficient of the surface and a rubber material having high elasticity. In this embodiment, the gripping members 10A and 10A are formed by cutting a stainless steel bar by cutting and making the contact surface with the thread solder 4 a smooth flat surface. I use it. The same applies to the gripping members 9A and 9A in the fixed clamp 9.

  Further, push solenoids 19, 19 are fixed to the fixed block 12 of the fixed clamp 9 and the fixed block 15 of the movable clamp 10, and these push rods 19A, 19A open the open / close blocks 13, 16 in the closed state. By pressing at a slight distance, the gripping state of the thread solder by the fixed clamp 9 or the movable clamp 10 can be opened at a predetermined timing. In this embodiment, the push rods 9A, 9A release the thread solder by separating the open / close blocks 13, 16 by about 1 mm from the gripped state, that is, the state closest to the fixed blocks 12, 15, so that the push solenoids 19, 19 When the driving is stopped, the open / close blocks 13 and 16 are again in a state of gripping the thread solder 4 by the urging force of the tension coil springs 17 and 17.

  As described above, the fixed block 12 of the fixed clamp 9 is fixed to the delivery mechanism unit 2. On the other hand, the fixed block 15 of the movable clamp 10 is supported by the linear guide 20 on the back surface. The linear guide 20 is provided in parallel with the conveying direction of the thread solder 4, and the movable clamp 10 is supported so as to be movable only in the conveying direction of the thread solder 4. Similarly, the fixed block 15 of the movable clamp 10 has a nut 21 fixed on the back side, and the motor 22 is driven to rotate the ball screw 23, whereby the movable clamp 10 moves in the conveying direction of the thread solder 4. In this embodiment, a stepping motor is used as the motor 22. Therefore, even when a driving method is adopted in which the rotational speed is gradually increased to reach a predetermined rotational speed when the motor 22 is started, the number of steps and the moving distance of the movable clamp 10 correspond one-to-one. The feed length of the thread solder 4 can be easily controlled. According to this driving method, it is possible to prevent a sudden tension from being applied when the wire diameter of the thread solder 4 is thin and easily cut.

DESCRIPTION OF SYMBOLS 1 Thread solder supply apparatus 2 Feeding mechanism part 3 Nozzle 4 Thread solder 5 Work 6 Base 7 Lifting drive part 8 Heating means 9 Fixed clamp 10 Movable clamp 9A, 10A Holding member 11 Solder 12, 15 Fixed blocks 13, 16 Opening / closing block 14 Support point 17 Pull coil spring 19 Push solenoid 20 Linear guide 21 Nut 22 Motor 23 Ball screw

Claims (3)

A solder supply method for feeding a predetermined amount of thread solder toward a soldering target,
When the length of the thread solder corresponding to the amount of solder required for soldering is X, and the distance at which the tip of the thread solder is separated from the soldering target after the solder supply is finished is Y,
The following operations a) to e) are performed using a fixed clamp provided fixedly in the delivery mechanism and a movable clamp provided in the delivery mechanism so as to be movable in the sending and returning directions of the thread solder. A method of supplying thread solder, characterized in that the thread solder is supplied in order.
a) Operation to hold the thread solder with a fixed clamp and a movable clamp provided with a gap and hold the thread solder located in the gap between both clamps in a substantially straight line b) Continue to hold the thread solder with the fixed clamp However, the movable clamp releases the thread solder and moves the distance X in the return direction, and the movable clamp grips the thread solder again at the moved position. C) The thread clamp is released from the fixed clamp and the thread is released. The movable clamp moves the distance X in the delivery direction while holding the solder, and moves the length X of the thread solder in the delivery direction. D) The thread clamp is held by the fixed clamp. Moving the distance Y in the return direction while holding it, and holding the solder solder located in the gap between both clamps in a curved state e) Fixed clamp While holding the wire solder in fine movable clamp, a movable clamp it to the distance Y moved to the dispensing direction, the operation for holding the wire solder located in the gap between these two clamps substantially linearly A solder supply device for feeding a predetermined amount of thread solder toward a soldering target,
A delivery mechanism for storing the delivery mechanism;
A nozzle that is fixed directly to the delivery mechanism and guides the solder wire toward the soldering target;
A fixed clamp that is fixed in the delivery mechanism and grips or releases the thread solder;
A movable clamp that is provided so as to be movable in the sending-out direction and the returning direction of the thread solder in the sending-out mechanism, and holds or releases the thread solder;
An operation control unit for controlling the operation of the delivery mechanism,
The delivery mechanism includes the fixed clamp and the movable clamp, and the operation control unit grips the substantially linear thread solder with the fixed clamp and the movable clamp, and sets the movable clamp in a predetermined distance in the return direction. An apparatus for supplying thread solder, characterized in that the thread solder located in the gap between both clamps is held in a curved state by being moved. The movable clamp is composed of a fixed block and an opening / closing block provided at least one end thereof to be able to approach and separate from the fixed block in order to grasp and release the thread solder,
The pair of gripping members that are in direct contact with and gripped by the thread solder are detachably provided on a pair of surfaces of the fixed block and the opening / closing block that face each other. Yarn solder supply device.

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