JP2012243726A - Automatic processing system - Google Patents

Abstract

In automatic processing of a sample by a FIB apparatus, an identification mark for specifying the position of the processing region cannot be normally detected and processing may fail. In order to detect the identification mark normally, it is necessary to appropriately adjust various setting values. However, this adjustment operation damages the processing region and the identification mark.
In addition to a processing region and an identification mark, a reference shape is formed on the surface of a sample to be processed. By using this reference shape for adjusting a set value group necessary for detecting the identification mark, the set value group can be adjusted without damaging the identification mark or the processing region.
[Selection] Figure 2A

Description

  The present invention relates to an automatic processing system that automatically processes a sample and an automatic processing method that performs this processing, and more particularly, to an automatic processing system that automatically processes a sample with a focused ion beam and an automatic that performs this processing. Related to the processing method.

  In the field of semiconductors and electronic devices, in order to perform structural analysis and failure analysis of LSI (Large Scale Integration), SEM (Scanning Electron Microscope) and TEM (Transmission Electron Microscopy: Microscopy Microscopy: An observation method using an electron microscope is used. However, with the progress of miniaturization and multilayering in semiconductors and electronic devices, an FIB (Focused Ion Beam) apparatus is used to specify the position of an observation point or perform fine processing of an observation surface. It is essential.

  The FIB apparatus has a sharply processed metal part and a lead electrode. By applying an electric field between the metal part and the extraction electrode and supplying a liquid metal such as Ga (gallium) to the tip of the metal part, ions can be extracted. The extracted ions are accelerated by a voltage from an accelerating voltage source to become an ion beam and collide with the surface of the sample. The FIB apparatus can process a sample according to such a principle.

  Here, by setting the sample on the movable stage and appropriately controlling the positional relationship between the sample and the FIB apparatus, it is possible to finely process a specific portion of the sample. Further, secondary electrons are emitted from the surface of the sample irradiated with the ion beam. By scanning an arbitrary region of the sample surface with an ion beam and detecting the generated secondary electrons with a detector, the state of the sample surface can be observed as a SIM (Scanning Ion Microscope) image.

  In relation to the above, Patent Document 1 (Japanese Patent Laid-Open No. 2000-215838) discloses a description relating to a mark detection method and a beam processing apparatus. FIG. 1A is a configuration diagram simply showing a configuration of a beam processing apparatus 100 according to Patent Document 1. As shown in FIG. The beam processing apparatus 100 in FIG. 1A includes an ion source 111, an acceleration voltage source 112, a beam adjustment mechanism 113, a movable stage 116, and a secondary electron detector 120.

  FIG. 1B is a plan view showing a configuration of a sample 130 used in the mark detection method according to Patent Document 1. The sample 130 in FIG. 1B includes a processing area 131 and a reference image area 132. A specific shape mark 133 is formed in the reference image area 132.

  The sample 130 is installed on the movable stage 116. The movable stage 116 moves in the plane direction to adjust the positional relationship between the sample 130 and the ion source 111 as appropriate. The acceleration voltage source 112 supplies an acceleration voltage to the ion source 111. The ion source 111 supplied with the acceleration voltage irradiates the sample 130 with the FIB 114. The beam adjustment mechanism 113 adjusts the FIB 114 irradiated from the ion source 111. When the FIB 114 hits the surface of the sample 130, the sample 130 is etched and deposited, and secondary electrons 115 are generated. The secondary electron detector 120 detects the secondary electrons 115.

  In the mark detection method according to Patent Document 1, a reference image region 132 is provided outside the processing region 131 of the sample 130. A specific shape mark 133 is formed in the reference image area 132. When the FIB 114 is irradiated from the ion source 111 toward the specific shape mark 133, secondary electrons 115 are generated from the specific shape mark 133. When the secondary electron 115 is detected by the secondary electron detector 120, a SIM image is obtained. In the mark detection method according to Patent Document 1, the irradiation of the FIB 114 is repeated, and the correction amount of the processing position deviation is obtained based on the deviation amount of the SIM image obtained before and after that. At the same time, the contrast is adjusted at this point.

  Among the FIB apparatuses, there is an apparatus having an automatic processing function in order to improve an analysis TAT (Turn Around Time). If an FIB apparatus capable of automatic processing is used, a sample can be literally automatically manufactured by designating a processing location on the sample in advance. As a procedure of the automatic processing method by the FIB apparatus, for example, first the setting before the automatic processing of the FIB apparatus is performed, and then the operation at the time of the automatic processing of the FIB apparatus is performed.

  As a setting before automatic processing of the FIB apparatus, for example, there are a total of three steps, which are shown below. As a first step, an identification mark is provided in the vicinity of the region to be processed. This identification mark is produced by processing using an FIB apparatus. As a second step, it is determined whether or not the identification mark produced on the sample surface has a shape that can be identified by the FIB apparatus. This determination is made by processing the identification mark by the pattern recognition algorithm of the FIB apparatus. If it is determined in the second step that the identification mark can be identified, the position of the identification mark is stored as a third step.

  As an operation at the time of automatic processing of the FIB apparatus, there are a total of four steps, for example, the fourth to seventh shown below. As a fourth step, the movable stage is moved to the position stored in the third step. As a fifth step, automatic adjustment of contrast and brightness is performed using a SIM image obtained by scanning the entire sample with an FIB apparatus. As a sixth step, the position of the identification mark produced in the first step is searched from the SIM image obtained in the fourth step by a pattern recognition algorithm. If there is a deviation between the found position and the position stored in the third step, the position deviation correction value is calculated in the FIB apparatus, and the movable stage is moved to the same position as the setting stage. As a seventh step, a sample is prepared according to processing conditions programmed in advance.

JP 2000-215838 A

  As described above, when an observation sample is manufactured using the automatic processing function of the FIB apparatus, there are cases in which the FIB apparatus cannot correctly detect an identification mark that designates a processing location and the manufacturing fails. One of the factors that prevents the identification mark from being detected is a phenomenon in which sufficient contrast for detecting the identification mark cannot be obtained in the contrast and brightness automatic adjustment performed in the fifth step. In fact, while the depth and size that can be formed in the identification mark are limited, the surface of the sample is also uneven, and the contrast due to this unevenness makes it difficult to detect the identification mark. Therefore, in order to detect the identification mark, it is necessary to increase the contrast of the identification mark.

  Therefore, the automatic adjustment of contrast and brightness performed in the fifth step can be performed, for example, for the following. As the step 5-1, the contrast and brightness are automatically adjusted. As a 5-2 process, it adjusts in the direction which reduces only a brightness | luminance. As a fifth step, adjustment is made in the direction of reducing only the contrast. In step 5-4, it is confirmed whether the identification mark can be detected. The steps 5-1 to 5-3 are repeated five times, and if the identification mark is still not detected, the sample processing operation is stopped.

  However, if a value far from the appropriate value is set in the step 5-1, the adjustment of only the luminance in the step 5-2 or the adjustment of only the contrast in the step 5-3 Insufficient adjustment is possible. Further, since the step 5-1 involves irradiation of Ga ions on the sample surface, physical damage due to etching is given to both the sample and the identification mark. Therefore, it is also necessary to reduce the number of adjustment operations.

  The means for solving the problem will be described below using the numbers used in the (DETAILED DESCRIPTION). These numbers are added to clarify the correspondence between the description of (Claims) and (Mode for Carrying Out the Invention). However, these numbers should not be used to interpret the technical scope of the invention described in (Claims).

  The automatic processing system (200) according to the present invention includes an FIB device (211 etc.), a secondary electron detector (220), and a control unit (240). Here, the FIB apparatus (211 etc.) irradiates the FIB (214) toward the sample (230) to be processed. The secondary electron detector (220) detects secondary electrons (215) generated from the sample (230) irradiated with the FIB (214). The control unit (240) controls the FIB apparatus (211 etc.) and the secondary electron detector (220). The control unit (240) includes a reference body group formation unit (241), a reference body group scanning unit (242), an appropriate value calculation unit (243), a storage unit (244), and an identification object detection unit (245). And a machining position calculation unit (246) and a machining unit (247). Here, the reference body group forming unit (241) controls the FIB apparatus (211 etc.) to form the reference body group (235B, 236B etc.) on the surface of the sample (230). The reference body group scanning unit (242) controls the FIB device (such as 211) and the secondary electron detector (220) to acquire a SIM image of the reference body group (such as 235B and 236B). The appropriate value calculation unit (243) adjusts the contrast and brightness to appropriate values based on the SIM image. The storage unit (244) stores the adjusted appropriate value. The identifier detection unit (245) is provided on the surface of the sample (230) by controlling the FIB apparatus (211 etc.) and the secondary electron detector (220) and using the stored appropriate value. The position of the identification body (233) is detected. The processing position calculation unit (246) calculates the position of the processing region (231) provided on the surface of the sample (233) based on the detected position of the identification body (233). The processing unit (247) controls the FIB apparatus (211 etc.) to process the processing area (231).

  The automatic processing method according to the present invention controls the FIB device (211 etc.) that irradiates the FIB (214) toward the sample (230) to be processed to control the reference body group (235B, 236B) on the surface of the sample (230). And the like, a FIB apparatus (211 etc.), and a secondary electron detector (220) for detecting secondary electrons (215) generated from the sample (230) irradiated with the FIB (214). Obtaining a SIM image of the reference body group (235B, 236B, etc.) by controlling, adjusting the contrast and brightness to appropriate values based on the SIM image, storing the adjusted appropriate values, and FIB An identifier (233) provided on the surface of the sample (230) by controlling the apparatus (211 etc.) and the secondary electron detector (220) and using the stored appropriate value. A step of detecting the position of the workpiece, a step of calculating the position of the processing region (231) provided on the surface of the sample (230) based on the detected position of the identification body (233), and an FIB device (211 etc.) ) To control the processing region (231).

  In the automatic processing system and the automatic processing method according to the present invention, the reference body group is formed on the surface of the sample to be processed, in addition to the processing area and the identification body for specifying the position of the processing area. By using the reference body group to adjust the contrast and brightness necessary for detecting the identification body to appropriate values, the identification body and the processing region are not damaged by etching or deposition.

FIG. 1A is a configuration diagram simply showing the configuration of a beam processing apparatus according to the patent literature. FIG. 1B is a plan view showing a configuration of a sample used in a mark detection method according to a patent document. FIG. 2A is a configuration diagram showing an overall configuration of the automatic machining system according to the first embodiment of the present invention. FIG. 2B is a plan view showing the configuration of the sample according to the first embodiment of the present invention. FIG. 2C is an overhead view showing the configuration of the reference region according to the first embodiment of the present invention. FIG. 2D is a block diagram illustrating the configuration of the control unit according to the first embodiment of the present invention for each functional block. FIG. 2E is a flowchart showing the procedure of the automatic machining method according to the first embodiment of the present invention. FIG. 3 is an overhead view showing the configuration of the reference region according to the second embodiment of the present invention.

  DESCRIPTION OF EMBODIMENTS Embodiments for carrying out an automatic machining system and an automatic machining method according to the present invention will be described below with reference to the accompanying drawings.

(First embodiment)
FIG. 2A is a configuration diagram showing an overall configuration of the automatic machining system 200 according to the first embodiment of the present invention. Components of the automatic machining system 200 in FIG. 2A will be described. 2A includes an ion source 211, an acceleration voltage source 212, a beam adjustment mechanism 213, a movable stage 216, a secondary electron detector 220, and a control unit 240.

  The connection relationship of the components of the automatic machining system 200 in FIG. 2A will be described. The acceleration voltage source 212 is connected to the ion source 211. A sample 230 can be installed on the movable stage 216. The control unit is connected to the beam adjustment mechanism 213, the secondary electron detector 220, and the movable stage 216. The ion source 211, the beam adjustment mechanism 213, and the movable stage 216 are in a positional relationship such that the FIB 214 irradiated from the ion source 211 hits the sample 230 placed on the movable stage 216 via the beam adjustment mechanism 213. . The secondary electron detector 220 and the movable stage 216 are in a positional relationship in which secondary electrons 215 generated when the sample 230 placed on the movable stage 216 is irradiated with the FIB 214 can be detected.

  The operation of the automatic machining system 200 in FIG. 2A will be described. The ion source 211, the acceleration voltage source 212, the beam adjustment mechanism 213, the movable stage 216, the secondary electron detector 220, and the control unit 240 operate as an FIB apparatus having an automatic processing function.

  The sample 230 is installed on the movable stage 216. The movable stage 216 is controlled by the control unit 240 to move in the plane direction, thereby adjusting the positional relationship between the sample 230 and the ion source 211 as appropriate. The ion source 211 is supplied with a liquid metal such as Ga at its tip. The acceleration voltage source 212 supplies an acceleration voltage to the ion source 211. When an acceleration voltage is applied to the ion source 211, ions are extracted from the liquid metal. The extracted ions become FIB 214 and are irradiated toward the sample 230. At this time, the beam adjustment mechanism 213 is controlled by the control unit 240 to adjust the characteristics of the FIB 214 irradiated from the ion source 211. When the FIB 114 hits the surface of the sample 230, the sample 230 is etched and deposited, and secondary electrons 215 are generated. The secondary electron detector 220 detects the secondary electrons 215. A SIM image is obtained by scanning a part or all of the surface of the sample 230 with the FIB 214 and detecting the generated secondary electrons with the secondary electron detector 220. In order to obtain an appropriate SIM image, the contrast and brightness are adjusted. Details of this adjustment will be described later.

  FIG. 2B is a plan view showing the configuration of the sample 230 according to the first embodiment of the present invention. A processing area 231, an identification area 232, and a reference area 234 are provided on the surface of the sample in FIG. 2B. The processing region 231 is a region where the target processing is performed on the sample. In the identification area 232, an identification body 233 used for specifying the position of the processing area 231 is formed. Reference body groups 235B and 236B described later are formed in the reference region.

  FIG. 2C is an overhead view showing the configuration of the reference region 234 according to the first embodiment of the present invention. In the reference region 234, a part or all of the reference body groups 235A, 236A, 235B, and 236B used for adjusting the contrast and brightness to appropriate values are formed. The reference body groups 235 </ b> A and 235 </ b> B are convex portions protruding upward with respect to the surface of the sample 230. The reference body groups 236A and 236B are flat surfaces at the same level as the surface of the sample 230.

  Here, the combination of the reference body groups 235A and 236A or the combination of the reference body groups 235B and 236B needs to have a height difference sufficient to adjust the appropriate values of necessary contrast and brightness, as will be described later. . Therefore, hereinafter, a case where a combination of the reference body groups 235B and 236B is formed in the reference region 234 will be described.

  FIG. 2D is a block diagram illustrating the configuration of the control unit 240 according to the first embodiment of the present invention for each functional block. FIG. 2E is a flowchart showing the procedure of the automatic machining method according to the first embodiment of the present invention. With reference to FIG. 2D and FIG. 2E, operation | movement of the automatic processing system by this embodiment, ie, the automatic processing method by this embodiment, is demonstrated.

  The components of the control unit 240 in FIG. 2D will be described. The control unit 240 in FIG. 2D includes a reference body group forming unit 241, a reference body group scanning unit 242, an appropriate value calculation unit 243, a storage unit 244, an identification object detection unit 245, a machining position calculation unit 246, A processing unit 247 and a bus 248 are provided. The bus 248 includes a reference body group forming unit 241, a reference body group scanning unit 242, an appropriate value calculation unit 243, a storage unit 244, an identification object detection unit 245, a processing position calculation unit 246, and a processing unit 247. It is connected to the.

  The control unit 240 in FIG. 2D may be, for example, a general computer having an input unit, an output unit, a calculation unit, a storage unit, and a bus connecting them. In this case, some or all of the reference body group forming unit 241, the reference body group scanning unit 242, the appropriate value calculation unit 243, the storage unit 244, the identification object detection unit 245, the processing position calculation unit 246, and the processing unit 247 Various function units realized by sharing the input unit, the output unit, the calculation unit, and the storage unit may be used. Further, the reference body group forming unit 241, the reference body group scanning unit 242, the appropriate value calculation unit 243, the storage unit 244, the identification object detection unit 245, the processing position calculation unit 246, and a part or all of the processing unit 247 are independent. It does not matter.

  The flowchart of FIG. 2E includes first to seventh steps S1 to S7. When the automatic machining method according to the present embodiment is started, first step S1 is first executed.

  In the first step S1, the reference body group forming unit 241 forms a reference body group. That is, under the control of the reference body group forming unit 241, the FIB apparatus of the automatic machining system 200 forms the reference body groups 235 </ b> B and 236 </ b> B in the reference region 234. At this time, the reference body 235B can be formed by depositing on the surface of the sample 230 by FIB. As the reference body 236B, the surface of the sample 230 may be used as it is without being processed. Following the first step S1, a second step S2 is performed.

  In the second step S2, the reference body group scanning unit 242 scans the reference body groups 235B and 236B. That is, under the control of the reference body group scanning unit 242, the FIB apparatus of the automatic machining system 200 scans the reference region 234 to obtain SIB images of the reference body groups 235 </ b> B and 236 </ b> B. At this time, it is assumed that there is a sufficient difference in the amount detected by the secondary electron detector 220 among the secondary electrons 215 generated by the reference body 235B and the reference body 236B. Following the second step S2, a third step S3 is performed.

  In the third step S3, the appropriate value calculation unit 243 calculates an appropriate value. That is, based on the difference between the detected secondary electrons 215 obtained in the second step S2, the appropriate value calculator 243 calculates appropriate values for contrast and brightness. Following the third step S3, a fourth step S4 is performed.

  In the fourth step S4, the storage unit 244 stores an appropriate value. That is, the appropriate values of contrast and brightness calculated in the third step S3 are stored in the storage unit 244. Following the fourth step S4, a fifth step S5 is executed.

  In the fifth step S5, the identification object detection unit 245 detects the identification object 233. That is, under the control of the identification object detection unit 245, the FIB apparatus of the automatic machining system 200 scans the identification region 232, detects the secondary electrons 215 generated as a result, and obtains the position and shape of the identification object 233. Following the fifth step S5, a sixth step S6 is executed.

  In the sixth step S6, the machining position calculation unit 246 calculates the machining position. That is, the processing position calculation unit 246 calculates the position and range of the processing region 231 based on the position and shape of the identification body 233 obtained in the fifth step S5. Here, the positional relationship between the identifier 233 and the processing region 231 is preferably stored in advance in the storage unit 244, for example. After the sixth step S6, a seventh step S7 is executed.

  In 7th step S7, the process part 247 processes the process area | region 231. FIG. That is, under the control of the processing unit 247, the FIB apparatus of the automatic processing system 200 automatically performs processing on the processing region 231. The specific content of this processing is preferably executed in accordance with a program in which, for example, how much FIB 214 of which characteristic is irradiated in which order and in what order. Further, this program is preferably stored in advance in the storage unit 244, for example. Since the processing of the processing region 231 is the same as that in the case of the prior art, further detailed description thereof is omitted. When the seventh step S7 is completed, the automatic machining method according to the present embodiment ends.

  As described above, when the contrast and brightness are adjusted, the identification area 232 is scanned by the FIB 214 in the conventional technique, but another reference area 234 is scanned in the present embodiment. In the reference region 234, the reference body groups 235B and 236B can be formed with a greater height difference regardless of the shape restriction imposed on the identification body 233. Therefore, according to the present embodiment, it is possible to adjust the contrast and the brightness with higher accuracy than in the prior art.

  Further, in the case of the present embodiment, the number of times of scanning the identification body 233 with the FIB 214 is smaller than in the case of the prior art. Therefore, damage to the identification body 233 due to irradiation of the FIB 214 can be reduced. This leads to the ability to specify the position of the processing region 231 with higher accuracy.

(Second Embodiment)
The automatic machining system and the automatic machining method according to the second embodiment of the present invention are equivalent to the automatic machining system and the automatic machining method according to the first embodiment of the present invention with the following changes. That is, the sample 230 according to the present embodiment is provided with the reference region 334 instead of the reference region 234 according to the first embodiment of the present invention. Here, the reference body groups 235A, 235B, 236A and 236B are formed in the reference region 334 by etching using FIB.

  FIG. 3 is an overhead view showing the configuration of the reference region 334 according to the second embodiment of the present invention. Part or all of the reference bodies 335A, 335B, 336A, and 336B are formed in the reference region 334 of FIG. The basic bodies 335A and 335B are concave portions that are recessed downward with respect to the surface of the sample 230. The reference body groups 336A and 336B are flat surfaces at the same level as the surface of the sample 230.

  Again, as in the first embodiment, the combination of the reference body groups 335A and 336A or the combination of the reference body groups 335B and 336B adjusts the appropriate values of necessary contrast and brightness, as will be described later. It is necessary to have a sufficient height difference. Therefore, also in the present embodiment, a combination of the reference body groups 335B and 336B is formed in the reference region 334 so that a greater difference in height is obtained.

  Here, as in the case of the first embodiment, the combination of the reference body groups 335B and 336B is more suitable for adjusting the appropriate values of contrast and brightness than the combination of the reference body groups 335A and 336A. ing. The reason is as follows. That is, in the combination of the reference body groups 335 </ b> A and 336 </ b> A, almost all of the secondary electrons 215 generated by the irradiation of the FIB 214 are detected by the secondary electron detector 220. On the other hand, in the combination of the reference body groups 335B and 336B, a part of the secondary electrons 215 generated by the irradiation of the FIB 214 is blocked by the inner wall of the reference body 335B and is not detected by the secondary electron detector 220.

  With this change, the reference body group forming unit 241 and the first step S1, the appropriate value calculating unit 243 and the third step S3, and various programs stored in the storage unit 244 are also operated and calculated. It is necessary to change the contents of.

  Other components of the automatic machining system, the procedure of the automatic machining method, and the effects obtained as a result are the same as in the case of the first embodiment of the present invention, and further detailed description is omitted.

  The automatic machining system and the automatic machining method according to the above-described embodiments in the present invention can be freely combined within a technically consistent range.

DESCRIPTION OF SYMBOLS 100 Beam processing apparatus 111 Ion source 112 Acceleration voltage source 113 Beam adjustment mechanism 114 FIB apparatus 116 Movable stage 120 Secondary electron detector 130 Sample 131 Processing area 132 Reference image area 133 Specific shape mark 200 Automatic processing system 211 Ion source 212 Acceleration voltage Source 213 Beam adjustment mechanism 214 FIB
215 Secondary electron 216 Movable stage 220 Secondary electron detector 230 Sample 231 Processing area 232 Identification area 233 Identification body 234 Reference area 235A, 235B Reference body 236A, 236B Reference body 240 Control section 241 Reference body group formation section 242 Reference body group Scan unit 243 Appropriate value calculation unit 244 Storage unit 245 Identification object detection unit 246 Processing position calculation unit 247 Processing unit 248 Bus 334 Reference area 335A, 335B Reference object 336A, 336B Reference object

Claims (5)

An FIB apparatus that irradiates a sample to be processed with an FIB (Focused Ion Beam);
A secondary electron detector for detecting secondary electrons generated from the sample irradiated with the FIB;
A controller that controls the FIB device and the secondary electron detector;
The controller is
A reference body group forming unit that controls the FIB apparatus to form a reference body group on the surface of the sample;
A reference body group scanning unit that controls the FIB device and the secondary electron detector to obtain a SIM (Scanning Ion Microscope) image of the reference body group;
An appropriate value calculation unit that adjusts contrast and brightness to appropriate values based on the SIM image;
A storage unit for storing the adjusted appropriate value;
An identifier detection unit that controls the FIB device and the secondary electron detector and detects the position of the identifier provided on the surface of the sample using the stored appropriate value;
Based on the detected position of the identifier, a processing position calculation unit that calculates the position of the processing region provided on the surface of the sample;
An automatic processing system comprising: a processing unit that controls the FIB apparatus to perform processing in the processing region. In the automatic processing system according to claim 1,
The reference body group is:
An automatic processing system comprising first and second reference bodies having a height difference sufficient to adjust the contrast value necessary for identifying the identification body and the luminance value to the appropriate value. In the automatic processing system according to claim 1 or 2,
The FIB device
An ion source for generating ions from a liquid metal;
An acceleration voltage source for supplying a voltage for accelerating the ions to the ion source;
A beam adjustment mechanism for generating the FIB from the accelerated ions;
An automatic processing system comprising a movable stage that sets the sample and moves the irradiation position of the FIB on the surface of the sample. Forming a reference body group on the surface of the sample by controlling an FIB apparatus that irradiates the FIB toward the sample to be processed;
Obtaining a SIM image of the reference body group by controlling the FIB device and a secondary electron detector that detects secondary electrons generated from the sample irradiated with the FIB;
Adjusting the contrast and brightness to appropriate values based on the SIM image;
Storing the adjusted appropriate value;
Controlling the FIB device and the secondary electron detector and detecting the position of an identifier provided on the surface of the sample using the stored proper value;
Calculating the position of the processing region provided on the surface of the sample based on the detected position of the identifier;
An automatic processing method comprising: controlling the FIB apparatus to perform processing on the processing region. In the automatic processing method of Claim 4,
The step of forming the reference body group includes:
Forming a first reference body;
Forming a second reference body having a height difference from the first reference body,
The height difference is sufficient to adjust the contrast value and the luminance value necessary for identifying the identifier to the appropriate value.

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