JP2012238412A - Manufacturing method and manufacturing apparatus of air tight container - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of an air tight container which achieves both high productivity and reliability.SOLUTION: A joining material 1 having the viscosity, having a negative temperature coefficient, and a softening point lower than first and second glass base materials 14 and 13 is formed into a frame shape on the first glass base material 14, and the second glass base material 13 is disposed facing the first glass base material 14 in which the joining material 1 is formed so as to contact with the first joining material 1. Local heating light 41 enters a gap formed between the pair of reflection members disposed so as to face each other, thereby being beam shaped into a linear shape extending along the direction that the frame shape of the joining material 1 extends. The Local heating light 41, which is beam shaped, is radiated to the joining material 1 while being moved along the direction that the frame shape of the joining material 1 extends, thereby joining the first glass base material 14 to the second glass base material 13 which are disposed facing each other.

Description

  The present invention relates to a manufacturing method and a manufacturing apparatus for an airtight container, and more particularly to a manufacturing method and a manufacturing apparatus for an airtight container that can be applied to an image display device that is evacuated and includes an electron-emitting device and a fluorescent film.

  2. Description of the Related Art Conventionally, a technique for forming an internal space having airtightness by hermetically bonding opposing glass substrates is known. This technology is applied to the manufacturing method of vacuum insulation containers and the manufacturing method of flat panel airtight containers (envelopes) such as organic LED display (OLED), field emission display (FED), plasma display panel (PDP), etc. Has been. In the production of these airtight containers, a gap-defining member or a local adhesive material is disposed between the opposing glass base materials as necessary, and then a bonding material is disposed in the periphery, and heating is performed. Glass substrates are joined together. As a method for joining the glass substrates, a method of heating (baking) the entire assembly obtained by temporarily assembling the glass substrates with a heating furnace, and selectively heating only the peripheral portion of the assembly by local heating means. A heating method has been proposed. Local heating is more advantageous than overall heating in terms of heating and cooling time, reduction of energy required for heating, and prevention of thermal deterioration of functional devices inside the container.

  Patent Document 1 discloses an example in which hermetic bonding by laser light is applied to a method for manufacturing a flat display device by taking advantage of local heating. In order to manufacture a flat display device, a mask having an opening of a bonding material (frit) portion is placed on the flat display device, the frit is heated and melted by irradiation with laser light, and the glass substrates are bonded to each other. Due to the effect of using the mask, irradiation of the laser beam to the element portion of the flat display device is prevented, and a highly reliable flat display device is provided.

  Patent Document 2 discloses an example of hermetic sealing with a laser beam as a method of hermetic sealing of a flat panel display or an electronic device. As a device for hermetic sealing, multiple laser beams are arranged side by side and condensed into a linear laser beam, or laser beams irradiated using an optical lens are condensed into a linear shape to bond substrates together To do. By concentrating on a linear laser and sealing the base material, it is possible to suppress the occurrence of residual stress due to a temperature difference and perform highly reliable hermetic sealing.

US Patent Application Publication No. 2010/0035503 JP 2009-104841 A

  As described above, in order to protect the element portion and reduce the residual stress at the joint portion, a method of shaping the local heating light in a linear shape with respect to the scanning direction is known. However, when an optical lens or a plurality of local heating lights are used as a method for shaping the local heating light, a highly reliable hermetic sealing with reduced residual stress is possible, but it is difficult to ensure productivity from the viewpoint of apparatus cost. There is a case. On the other hand, when an optical lens or a mask that does not require a plurality of local heating lights is used, high productivity is ensured. However, in order to obtain sufficient bonding, the energy of the local heating light is insufficient, resulting in cracks. And may cause poor bonding such as peeling.

  Therefore, an object of the present invention is to solve the above-described problems and to provide a manufacturing method and a manufacturing apparatus for an airtight container that achieves both high productivity and reliability.

  According to the present invention, the manufacture of an airtight container comprising joining a first glass base material and a second glass base material that forms at least a part of the airtight container together with the first glass base material. A method is provided.

  In the method for producing an airtight container of the present invention, a bonding material having a negative temperature coefficient of viscosity and having a softening point lower than those of the first and second glass substrates is formed in a frame shape on the first glass substrate. The step of forming the second glass substrate in contact with the first glass substrate on which the bonding material is formed, and the direction extending in the frame shape of the bonding material. A step of beam-shaping the local heating light linearly, and irradiating the bonding material while moving the beam-shaped local heating light along the direction extending in the frame shape of the bonding material, A step of bonding the first glass substrate and the second glass substrate, and the step of beam-shaping the local heating light is within a gap formed between the pair of opposingly arranged reflecting members. Incident the local heating light to be beam shaped.

  Moreover, according to this invention, the manufacturing apparatus of the airtight container for enforcing the manufacturing method of the airtight container as described above is provided.

  The airtight container manufacturing apparatus of the present invention includes a light source device that emits local heating light, and a beam shaping member that includes a pair of reflecting members that are disposed to face each other with a gap interposed therebetween.

  Thus, according to the present invention, it is possible to provide a manufacturing method and a manufacturing apparatus for an airtight container that achieves both high productivity and reliability.

It is a partially broken perspective view of FED which can apply the manufacturing method of the airtight container of the present invention. It is sectional drawing of the glass substrate which shows an example of the process flow of this invention. It is a perspective view which shows the beam shaping member in the manufacturing apparatus of the airtight container of this invention. FIG. 4 is a top view, a front view, and a side view of the beam shaping member of FIG. 3. It is a top view which shows the mode of irradiation to the joining material of the beam-shaped local heating light. It is a side view which shows the relationship between a laser head, a beam shaping member, and a glass base material. It is a schematic diagram which shows the effective beam diameter of the local heating light in an Example.

  Hereinafter, embodiments of the present invention will be described. The manufacturing method of the hermetic container of the present invention can be applied to a manufacturing method of FED, OLED, PDP or the like having a device that requires the internal space to be hermetically cut off from the external atmosphere. In particular, in an image display device such as an FED in which the inside is a decompressed space, a bonding strength that can resist an atmospheric pressure load generated by a negative pressure in the internal space is required. According to the method for manufacturing an airtight container of the present invention, however. In addition, it is possible to achieve both a high level of bonding strength and airtightness. However, the manufacturing method of the hermetic container of the present invention is not limited to the manufacturing of the above-described hermetic container, but the manufacturing method of the hermetic container having a joint part that requires airtightness at the peripheral part of the opposing glass substrate. Can be widely applied.

  FIG. 1 is a partially broken perspective view showing an example of an image display device that is an object of the present invention. The envelope (airtight container) 10 of the image display device 11 has a glass face plate 12, a rear plate 13, and a frame member 14. Each of the frame members 14 is located between the flat face plate 12 and the rear plate 13, and forms a sealed space between the face plate 12 and the rear plate 13. Specifically, the envelope 10 having a sealed internal space is formed by joining the face plate 12 and the frame member 14 and the rear plate 13 and the frame member 14 on the surfaces facing each other. Yes. The internal space of the envelope 10 is maintained in a vacuum, and spacers 8 that are space defining members between the face plate 12 and the rear plate 13 are provided at a predetermined pitch. The face plate 12 and the frame member 14 or the rear plate 13 and the frame member 14 may be bonded or integrally formed in advance.

  The rear plate 13 is provided with a large number of electron-emitting devices 27 that emit electrons in accordance with image signals, and driving matrix wirings (X-directional wirings 28, X) for operating the electron-emitting devices 27 in response to image signals. A Y-direction wiring 29) is formed. The face plate 12 positioned opposite to the rear plate 13 is provided with a phosphor film 34 made of a phosphor that emits light upon receiving irradiation of electrons emitted from the electron emitter 27 and displays an image. A black stripe 35 is further provided on the face plate 12. The fluorescent films 34 and the black stripes 35 are alternately arranged. A metal back 36 made of an Al thin film is formed on the fluorescent film 34. The metal back 36 has a function as an electrode that attracts electrons, and is supplied with a potential from a high voltage terminal Hv provided in the envelope 10. A non-evaporable getter 37 made of a Ti thin film is formed on the metal back 36.

  The face plate 12, the rear plate 13, and the frame member 14 only need to be transparent and translucent, and soda lime glass, high strain point glass, non-alkali glass, or the like can be used. It is desirable that these members have good wavelength transparency in the wavelength used for the local heating light and the absorption wavelength region of the bonding material, which will be described later.

  Next, a method for joining glass substrates in the method for manufacturing an airtight container of the present invention will be described with reference to FIGS. In the following description, the first glass base material is used as a base material on which a bonding material is formed, and the second glass base material is used as a base material disposed opposite to the first glass base material. For this reason, the specific member which the 1st and 2nd glass base materials mean may differ.

  (Step 1) First, as shown in FIG. 2A, a frame member 14 (first glass substrate) is prepared, and then, as shown in FIG. 14 is formed. The bonding material 1 has a negative temperature coefficient, has only to be softened at a high temperature, and preferably has a lower softening point than any of the face plate 12, the rear plate 13, and the frame member 14. Examples of the bonding material 1 include glass frit, inorganic adhesive, and organic adhesive. It is preferable that the bonding material 1 exhibits high absorbability with respect to the wavelength of the local heating light described later. When applied to an FED or the like that requires maintaining the degree of vacuum in the internal space, a glass frit or an inorganic adhesive that can suppress the decomposition of residual hydrocarbons is preferably used.

  (Step 2) Next, as shown in FIG. 2C, the rear plate 13 (second glass base material) on which the electron-emitting devices 27 and the like are formed is disposed opposite to the frame member 14. Thus, the bonding material 1 is placed between the frame member 14 (first glass substrate) and the rear plate 13 (second glass substrate) so as to come into contact with both the frame member 14 and the rear plate 13. Be placed. At this time, as shown in FIG. 2 (d), in order to ensure the contact between the bonding material 1 and the rear plate 13, the frame member 14 is supplementarily covered with the glass substrate 52, and the bonding material 1 is covered with the rear plate 13. It is preferable to press against.

  (Step 3) Next, as shown in FIGS. 2E and 3, the local heating light 41 is beam-shaped using the beam shaping member 70. FIG. 4 shows a detailed configuration of the beam shaping member 70 used in the present embodiment.

  As shown in FIG. 4, the beam shaping member 70 includes a pair of reflective films (reflective members) 73 arranged to face each other, and a gap 71 is formed between the reflective films 73. The local heating light 41 is radiated from the laser head 61 so that the total luminous flux enters the gap 71. The local heating light 41 incident on the gap 71 is condensed by being repeatedly reflected by the reflection film 73, and is shaped into a substantially linear effective beam diameter 41b as shown in FIG. It is injected from the opposite side.

  The reflective film 73 is preferably a material that reflects the local heating light 41 more. For example, when near infrared rays are used for the local heating light 41, for example, silver, copper, aluminum, or the like is preferably used. By selecting such a material, the local heating light 41 radiated from the laser head 61 is beam-shaped within the gap 71 of the reflective film 73 disposed so as to minimize attenuation of energy intensity. Is possible.

  Incidence of the total luminous flux of the local heating light 41 into the gap 71 is made possible by adjusting the distance 72 from the laser head 61 to the upper surface of the beam shaping member to the focal length of the local heating light 41 to be used. In this way, most of the energy of the local heating light 41 can be input into the gap 71. However, depending on the beam characteristics of the local heating light 41 to be used, the local heating light 41 may be reflected or scattered on the upper surface of the beam shaping member 70, and the total luminous flux may not be input to the beam shaping member. Therefore, in the present embodiment, it is preferable that the size of the gap 71 of the beam shaping member 70 is larger than the effective beam diameter at the focal position of the local heating light 41. By doing so, reflection and scattering on the upper surface of the beam shaping member 70 can be reduced, and energy loss of the local heating light 41 can be suppressed.

  As described above, in the present embodiment, the local heating light 41 radiated from the laser head 61 is incident into the gap 71 of the beam shaping member 70, so that the beam from the side opposite to the laser head 61 side can be obtained. It becomes possible to extract the shaped local heating light 41b. The beam shaped local heating light 41b can improve the energy density as will be described later with respect to the local heating light when the beam shaping member 70 of the present embodiment is not used (the beam is not shaped). As described above, in this embodiment, the local heating light can be shaped into a substantially linear shape without using an expensive optical lens or the like. Moreover, the above-mentioned beam-shaped local heating light can be suitably used not only in the field of manufacturing an airtight container but also in other fields of joining and welding.

  (Step 4) Next, the laser head 61 and the beam shaping member 70 are moved together to irradiate the bonding material 1 with the local heating light 41b shaped in step 3, and the rear plates arranged opposite to each other. 13 and the frame member 14 are joined. At this time, the beam shaping member 70 is disposed so that the gap 71 is opposed to the portion extending in the frame shape of the bonding material 1, and the direction in which the beam shaping member 70 extends in the frame shape of the bonding material 1 is maintained. Move. Therefore, as shown in FIG. 5, the beam-shaped local heating light 41 b is along the direction D in a state where the longitudinal direction of the effective beam diameter is substantially parallel to the direction extending in the frame shape of the bonding material 1. The bonding material 1 is irradiated while moving.

  In the present embodiment, as shown in FIG. 6A, a laser head (light source device) 61 that emits local heating light 41 is movably attached to a conveyance guide 60 and connected by a beam shaping member 70 and an arm 74. Has been. As a result, the beam shaping member 70 can be transported together with the laser head 61 as the laser head 61 is transported. On the other hand, by separating the beam shaping member from the laser head and attaching it to an auxiliary pressure device (not shown) disposed on the glass substrate to assist the pressure applied to the bonding material, the laser head You may move only. In that case, since the beam shaping member becomes a structure fixed with respect to the joining material to which local heating light is irradiated, it is necessary to have a length equivalent to the length of the joining material.

  The local heating light only needs to be able to locally heat the vicinity of the bonding region, and a semiconductor laser is preferably used as the light source. From the viewpoint of locally heating the bonding material 1 and the transparency of the glass substrate, a processing semiconductor laser having a wavelength in the infrared region is preferable.

  The local heating light (laser) scanning speed, power, spot diameter size (shape), wavelength, number of units used (number), etc. can be arbitrarily selected according to industrial productivity and temperature characteristics of the bonding material. is there. Moreover, a high strain point glass substrate can be used as the material to be joined. In this case, the local heating light 41 can be applied in the range of power 10 W to 1000 W, wavelength 808 nm to 980 nm, spot diameter 0.1 mmφ to 6.0 mmφ, and scanning speed 5 to 2500 mm / sec. However, the irradiation conditions of the local heating light are not limited to these conditions, and in order to perform more preferable bonding, it is desirable to adjust according to the characteristics of the bonding material.

  In the present embodiment, the effective beam diameter (shape) of the beam-shaped local heating light 41b is determined by the size of the gap 71 of the beam shaping member 70 and the distance 75 between the upper surface of the beam shaping member 70 and the bonding material 1 (FIG. It can be adjusted by changing a). Specifically, the length of the effective beam diameter 41 b in the longitudinal direction can be increased by increasing the distance 75 between the upper surface of the beam shaping member 70 and the bonding material 1. On the other hand, the lateral length, that is, the width can be increased by increasing the gap 71 of the beam shaping member 70. As described above, the effective beam diameter (shape) of the beam-shaped local heating light 41b is preferably adjusted according to the characteristics of the material to be joined. That is, adjusting the size of the gap 71 of the beam shaping member 70 and the distance 75 between the upper surface of the beam shaping member 70 and the bonding material 1 in accordance with the characteristics of the material to be bonded produces a highly reliable airtight container. Is important above.

  (Step 5) Next, as shown in FIGS. 2 (g) to 2 (k), the face plate 12 (first glass substrate) and the frame member 14 (first 2 glass substrate). Specifically, first, as shown in FIG. 2G, the face plate 12 on which the fluorescent film 34 and the like are formed is prepared. Next, as shown in FIG. 2 (h), the bonding material 2 is formed in a frame shape on the face plate 12 in the same manner as in Step 1. Next, as shown in FIG. 2 (i), the face plate 12 and the frame member 14 are brought into contact with each other through the bonding material 2 in the same manner as in Step 2. Here, the third glass substrate 52 is not used. Next, as shown in FIG. 2 (j), the local heating light 41b beam-shaped by the beam-shaping member 70 is passed along each side of the frame-shaped bonding material 2 in the same manner as in Step 3 and Step 4. Irradiate. In this way, as shown in FIG. 2 (k), the face plate 12 and the rear plate 13 are opposed to each other via the frame member 14 to form the envelope 10 in which the internal space is formed. In the present embodiment, the bonding material 2 is formed on the face plate 12, but may be formed on the frame member 14. In addition, it is preferable to make it the same as that of step 1-5 about the kind and physical property of the joining material 2, and the irradiation conditions of a laser beam.

  In the embodiment described above, the rear plate 13 and the frame member 14 are joined, and further, the face plate 12 and the frame member 14 are joined, so that the frame member 14 is inserted between the face plate 12 and the rear plate 13. The envelope 10 is manufactured. However, the present invention more generally provides a method for manufacturing an airtight container at least partially comprising a rear plate 13 and a face plate 12. Therefore, it is also possible to use a glass base material in which protrusions having the shape of the frame member 14 are integrally formed in advance as one of the rear plate 13 or the face plate 12 and to join the other plate. Further, the face plate 12 and the frame member 14 can be joined first, and then the rear plate 13 and the frame member 14 can be joined.

  Furthermore, although the embodiment described above is directed to an image display device, the present invention can be applied to the joining of the first glass substrate and the second glass substrate more generally. When a plurality of local heating lights are used, all of the local heating lights may be irradiated from the first glass substrate side, some from the first glass substrate side, and the rest from the second glass substrate side. Or all may be irradiated from the second glass substrate side.

  Hereinafter, the present invention will be described in detail with specific examples.

Example 1
The manufacturing method described in the above embodiment was applied to perform airtight bonding between the frame member and the rear plate, and further, airtight bonding was performed between the frame member and the face plate to manufacture a vacuum airtight container.

  (Step 1) A frame member 14 was formed as a first glass substrate. Specifically, first, a 1.5 mm thick high strain point glass substrate (PD200 manufactured by Asahi Glass Co., Ltd.) was prepared and cut into an outer shape of 980 mm × 580 mm × 1.5 mm. Next, an area of 970 mm × 570 mm × 1.5 mm in the center portion was cut out by cutting, and a frame member 14 having a substantially square cross section with a width of 5 mm and a thickness of 1.5 mm was formed. Next, the surface of the frame member 14 was degreased by organic solvent cleaning, pure water rinsing, and UV-ozone cleaning.

  Next, the bonding material 1 was prepared. In this example, glass frit was used as the bonding material 1 (the same applies to the bonding material 2). As a glass frit, a Bi-based lead-free glass frit (BAS115 manufactured by Asahi Glass Co., Ltd.) having a thermal expansion coefficient α = 79 × 10 −7 / ° C., a transition point 357 ° C., and a softening point 420 ° C. is used as a base material, and as a binder A paste in which organic substances were dispersed and mixed was used. Such a paste was applied on the frame member 14 by screen printing so as to have a width of 1 mm and a thickness of 7 μm along the circumferential length of the frame member 14. Next, it was dried at 120 ° C., and then heated and baked at 460 ° C. to burn out organic substances, thereby forming the bonding material 1 (see FIGS. 2A and 2B).

  (Step 2) A rear plate 13 was formed as a second glass substrate. Specifically, first, a glass substrate (PD200 manufactured by Asahi Glass Co., Ltd.) having an outer diameter of 1000 mm × 600 mm × 1.8 mm was prepared, and the surface was degreased by organic solvent cleaning, pure water rinsing, and UV-ozone cleaning. Next, a surface electron conduction electron-emitting device 27 and matrix wirings 28 and 29 were formed in a 960 mm × 550 mm region at the center of the glass substrate thus obtained. The formed electron-emitting device 27 was connected to the matrix wirings 28 and 29 so that the number of pixels of 1920 × 3 × 1080 can be individually driven. Next, a non-evaporable getter material made of Ti was formed on the matrix wirings 28 and 29 by sputtering with a thickness of 2 μm to form a non-evaporable getter (not shown). As described above, the rear plate 13 as the second glass substrate was prepared. In order to perform evacuation, an opening (not shown) having a diameter of 3 mm penetrating the glass substrate was provided in advance in a region of the rear plate 13 where the matrix wirings 28 and 29 were not formed.

  Next, while aligning the frame member 14 on which the bonding material 1 is formed with respect to the rear plate 13, these members are placed so that the bonding material 1 comes into contact with the surface of the rear plate 13 having the electron emitting elements 27. Temporarily assembled. Thereafter, in order to make the pressure applied to the bonding material 1 uniform, a glass substrate 52 (PD200 manufactured by Asahi Glass Co., Ltd.) was arranged so as to cover the frame member 14 in an auxiliary manner. A glass substrate 52 having the same size as the rear plate 13 was used. Furthermore, in order to assist the pressing force, the rear plate 13, the bonding material 1, and the frame member 14 were pressurized by a pressurizing device (not shown). In this way, the rear plate 13 and the frame member 14 were brought into contact with each other through the bonding material 1 (see FIGS. 2C and 2D).

  (Step 3) In this step, local heating light (laser light) beam-shaped by the beam shaping member 70 to the temporarily assembled structure composed of the rear plate 13, the frame member 14, and the bonding material 1 prepared in Step 2. (See FIG. 2 (e)).

  Specifically, the following beam shaping member 70 was prepared. Aluminum was used as a base material, and the reflective film 73 was coated with silver. Further, the gap 71 between the reflection films 73 was 2 mm, and the height 77 and the width 76 of the beam shaping member 70 were 5.3 cm and 11 cm, respectively (see FIG. 4). Then, as shown in FIG. 6, the laser head 61 and the beam shaping member 70 are connected by an arm 74, and the laser head 61 is attached to the conveyance guide 60 so that it can move in the direction D. At this time, the distance between the tip of the laser head 61 and the upper surface of the beam shaping member 70 was set to 13 cm, which is equal to the focal length of the local heating light 41.

  Next, one semiconductor laser transmitter for processing was prepared, connected to the laser head 61 with a fiber (not shown), and the local heating light 41 was incident on the beam shaping member 70. At this time, the distance 75 (see FIG. 6A) between the upper surface of the beam shaping member 70 (the focal position of the local heating light) and the bonding material 1 as the bonded material was set to 9.3 cm.

The irradiation conditions of the local heating light 41 were a wavelength of 980 nm, a laser power of 730 W, and a scanning speed in the scanning direction D of 1000 mm / s. The effective beam diameter at the focal position of the local heating light 41 was 0.8 mmφ. In this specification, the laser power is defined as an intensity value obtained by integrating the total luminous flux emitted from the laser head, and the effective beam diameter is defined as a range in which the intensity of the laser light is e ⁻² times or more of the peak intensity. Stipulated.

  FIG. 7 shows the result of examining the difference in the beam profile depending on whether or not the beam shaping member 70 of this embodiment is used separately from this step. According to FIG. 7, by using the beam shaping member 70 of the present embodiment, the effective beam diameter in which the intensity of the laser light is equal to or greater than a predetermined intensity is changed from a circle 41 a when the beam shaping member 70 is not used to an elliptical shape. It was confirmed that it was narrowed to 41b. In this way, it was confirmed that the local heating light was shaped into a substantially linear beam.

  As shown in FIG. 5, the irradiation of the local heating light 41b beam-shaped by the beam shaping member 70 is performed by combining the local heating light 41b with the bonding material 1 so that the entire width of the bonding material 1 is included in the effective beam diameter. I was burned. In the present embodiment, the beam-shaped local heating light 41b is approximately 20 mm in length 42 in the major axis direction and approximately 2 mm in length 43 in the minor axis direction when the effective beam diameter is elliptical (see FIG. 7).

  The above process was performed on the four peripheral portions of the plate, and the joining of the rear plate 13 and the frame member 14 was completed (see FIG. 2F).

  (Step 4) Next, similarly to the rear plate 13, the face plate 12 including the fluorescent film 34 and the like was prepared using PD200 manufactured by Asahi Glass Co., Ltd. as a glass substrate (see FIG. 2G).

  Thereafter, in the same manner as in Steps 1 to 3, the face plate 12 and the frame member 14 were joined using the beam-shaped local heating light 41b to complete the hermetic container. In this step, the auxiliary glass substrate 52 used in step 2 was not used. The laser light irradiation conditions and scanning method were the same as those in step 3. In this step, the frit paste was formed on the face plate 12 without being formed on the frame member 14 as in steps 1 to 3. Otherwise, the face plate 12 and the frame member 14 were joined in the same manner as in Steps 1 to 3 (see FIGS. 2 (g) to 2 (k) and FIG. 6 (b)).

  An airtight container was prepared as described above, and an FED apparatus was completed according to a normal method. When the completed FED is operated, the electron emission performance and the image display performance are stably maintained for a long time, and the joint portion has a strength applicable to the FED and stable airtightness. confirmed.

(Example 2)
In the present embodiment, in step 3, the beam shaping member 70 is connected to a pressurizing device (not shown), and only the laser head 61 is moved to irradiate the bonding material 1 with the beam-shaped local heating light 41b. . Except for this, an FED device was produced in the same manner as in Example 1.

  When the completed FED is operated, the electron emission performance and the image display performance are stably maintained for a long time, and the joint portion has a strength applicable to the FED and stable airtightness. confirmed.

DESCRIPTION OF SYMBOLS 1, 2 Joining material 12 Face plate 13 Rear plate 14 Frame member 41, 41b Local heating light 70 Beam shaping member

Claims (8)

A method for producing an airtight container, comprising joining a first glass base material and a second glass base material that forms at least a part of the airtight container together with the first glass base material,
Forming a bonding material having a negative temperature coefficient of viscosity and having a softening point lower than that of the first and second glass substrates on the first glass substrate;
Placing the second glass substrate opposite to the first glass substrate on which the bonding material is formed so as to contact the bonding material;
A step of beam-shaping local heating light linearly along a direction extending in a frame shape of the bonding material;
The first and second glass substrates and the second glass substrate disposed opposite to each other are irradiated with the beam-shaped local heating light while being moved along a direction extending in a frame shape of the bonding material. Joining the materials,
Have
The step of beam-shaping the local heating light includes injecting the local heating light to be beam-shaped into a gap formed between a pair of reflective members arranged to face each other. .   The step of beam-shaping the local heating light includes injecting the total luminous flux from the light source of the local heating light into the gap arranged so as to face a portion of the bonding material extending in a frame shape. The manufacturing method of the airtight container of Claim 1. An airtight container manufacturing apparatus for carrying out the airtight container manufacturing method according to claim 1 or 2,
A light source device for emitting the local heating light;
A beam shaping member including the pair of reflecting members disposed opposite to each other with the gap interposed therebetween;
An apparatus for manufacturing an airtight container.   The airtight container manufacturing apparatus according to claim 3, wherein the reflecting member contains silver.   The manufacturing apparatus of the airtight container of Claim 3 with which the said reflection member contains copper.   The manufacturing apparatus of the airtight container of Claim 3 with which the said reflection member contains aluminum.   The light source device is configured to be movable with respect to the bonding material irradiated with the local heating light, and the beam shaping member is coupled to the light source device so as to move integrally with the light source device. The manufacturing apparatus of the airtight container of any one of Claim 3 to 6.   The light source device is configured to be movable with respect to the bonding material irradiated with the local heating light, and the beam shaping member is fixed to the bonding material irradiated with the local heating light. The manufacturing apparatus of the airtight container of any one of Claim 3 to 6.