JP2012220736A - Electrophoretic particle display device, electrophoretic particle display device manufacturing method and electronic apparatus - Google Patents

Abstract

Leakage current generated in an electrophoretic particle display device and reduction in effective voltage applied to a microcapsule are suppressed.
An electrophoretic particle display device includes a pixel substrate provided with a pixel electrode, and a common electrode arranged on the pixel substrate side so as to face the pixel substrate on which the pixel electrode is formed. A counter substrate 104 including: a microcapsule 106 disposed between the pixel electrode 110 and the common electrode 112; a binder 108 disposed between the pixel electrode 110 and the common electrode 112 and surrounding the microcapsule 106; The binder 108 includes an insulating binder 108a and a conductive binder 108b disposed between the insulating binder 108a and the common electrode 112.
[Selection] Figure 1

Description

  The present invention relates to an electrophoretic particle display device, a method for manufacturing an electrophoretic particle display device, and an electronic apparatus.

  A microcapsule electrophoretic particle display device includes a microcapsule in which a solution containing electrophoretic particles and a dispersion medium is wrapped in a polymer film, an electrode for applying a voltage to the microcapsule, and between microcapsules or between microcapsules and electrodes And a binder for adhering to each other. And as the prior art, there exist some which were described in patent document 1 or patent document 2, for example.

JP 2010-102051 A JP 2003-140201 A

  By the way, in the conventional microcapsule type electrophoretic particle display device, when a low-resistance material is used as the binder, only the binder portion provided between the pixel electrode and the common electrode is used. There is a possibility that the flowing current, that is, the leakage current increases. As a result, the power consumption of the electrophoretic particle display device may increase. On the other hand, when a high-resistance material is used as the binder, a voltage drop occurs between the microcapsule and the common electrode, which may reduce the effective voltage applied to the microcapsule. As a result, voltage application to the microcapsules cannot be performed efficiently, and the display performance of the electrophoretic particle display device may be deteriorated. In order not to reduce the display performance, it is necessary to increase the external input voltage, which may lead to an increase in power consumption of the electrophoretic particle display device.

  Accordingly, some aspects of the present invention have been made in view of such circumstances, and an electrophoretic particle display device and an electrophoretic particle display device capable of suppressing the occurrence of the leakage current and the decrease in the effective voltage. An object of the present invention is to provide a manufacturing method and an electronic device.

  In one embodiment of the present invention for solving the above-described problem, a first substrate including a first electrode is disposed opposite to a side of the first substrate where the first electrode is formed. A second substrate including a second electrode disposed on the first substrate side, a microcapsule disposed between the first electrode and the second electrode, the first electrode, and the first electrode A binder disposed between the two electrodes and surrounding the periphery of the microcapsule, the binder comprising an insulating binder, and a conductive material disposed between the insulating binder and the second electrode. And an electrophoretic particle display device.

  According to the above aspect, since the binder formed on the first electrode side has an insulating property, when a voltage is applied to the first electrode, generation of a leakage current flowing only through the binder portion is generated. Can be suppressed. In addition, since the binder formed between the second electrode and the insulating binder has electrical conductivity, when a voltage is applied to the first electrode, it is between the microcapsule and the second electrode. The voltage drop is reduced, and the drop in effective voltage applied to the microcapsules can be suppressed.

  Another aspect of the present invention is an electrophoretic particle display device having a plurality of pixels, the first substrate including a plurality of first electrodes corresponding to the plurality of pixels, and the first substrate. Between the plurality of first electrodes and the second electrode, the second substrate disposed opposite to the side on which the first electrode is formed, and disposed on the first substrate side. An electrophoretic display element disposed, the electrophoretic display element having a microcapsule and a binder surrounding the microcapsule, wherein the binder includes an insulating binder and the insulating binder. And an electroconductive binder disposed between the second electrode and the second electrode.

  According to the above aspect, since the insulating binder is formed on the first electrode side, when a voltage is applied to the first electrode, the generation of leakage current flowing only through the binder portion is suppressed. it can. In addition, it is possible to suppress the occurrence of a leak current between the adjacent first electrodes via the binder. Further, since a conductive binder is formed between the insulating binder and the second electrode, when a voltage is applied to the first electrode, the voltage between the microcapsule and the second electrode The drop is reduced, and the drop in effective voltage applied to the microcapsules can be suppressed.

In another aspect of the present invention, the conductive binder may include conductive particles.
According to the said aspect, the electrical conductivity of a conductive binder can be changed by changing the density | concentration of the electroconductive particle contained in a binder.
According to another aspect of the present invention, there is provided a first application step of applying a coating material including a microcapsule and a first binder to a side of the first substrate that includes the first electrode, and the first application. After the step, a second binder having a different conductivity from the first binder is applied so as to cover the microcapsules and the first binder, and the first binder and the second binder are applied. A second coating step comprising: laminating; and after the second coating step, a second substrate having a second electrode on the side facing the first electrode across the paint and the second binder An electrophoretic particle display device manufacturing method comprising: an arranging step of arranging.

According to the above aspect, the conductive binder and the insulating binder are laminated between the first electrode and the second electrode, and the microcapsule is further interposed between the first electrode and the second electrode. Can be produced.
For this reason, according to the electrophoretic particle display device manufactured in the above aspect, if the binder formed on the first electrode side has insulation, when a voltage is applied to the first electrode, Generation of leakage current flowing only through the binder portion can be suppressed. In addition, if the binder formed between the second electrode and the first binder has conductivity, when a voltage is applied to the first electrode, the microcapsule and the second electrode The voltage drop between them becomes small, and the fall of the effective voltage applied to a microcapsule can be suppressed.

  According to another aspect of the present invention, there is provided a first application step of applying a first binder to a side of the first substrate including the first electrode, and the first application step after the first application step. A second coating in which a coating containing a second binder and microcapsules having different conductivity from the first binder is applied so as to cover the binder, and the first binder and the second binder are laminated. A step of arranging a second substrate having a second electrode on the side facing the first electrode with the first binder and the paint sandwiched between the step and the second coating step; And a method for manufacturing an electrophoretic particle display device.

According to the above aspect, the conductive binder and the insulating binder are laminated between the first electrode and the second electrode, and the microcapsule is further interposed between the first electrode and the second electrode. Can be produced.
For this reason, according to the electrophoretic particle display device manufactured in the above aspect, if the binder formed on the first electrode side has insulation, when a voltage is applied to the first electrode, Generation of leakage current flowing only through the binder portion can be suppressed. In addition, if the binder formed between the second electrode and the insulating binder has conductivity, when a voltage is applied to the first electrode, it is between the microcapsule and the second electrode. The voltage drop is reduced, and the drop in effective voltage applied to the microcapsules can be suppressed.

  According to another aspect of the present invention, there is provided a first application step in which a coating material including a microcapsule and an insulating binder is applied to a side of the first substrate that includes a plurality of first electrodes; After the coating step, a second coating step of coating the conductive binder so as to cover the microcapsules and the insulating binder, and laminating the insulating binder and the conductive binder, and after the second coating step And a disposing step of disposing a second substrate having a second electrode on a side facing the first electrode with the paint and the conductive binder interposed therebetween. It is a manufacturing method of a particle display device.

According to the above aspect, an electrophoretic particle display device having a plurality of pixels is formed by laminating a conductive binder and an insulating binder between a first electrode and a second electrode. An electrophoretic particle display device in which a microcapsule is sandwiched between one electrode and a second electrode can be manufactured.
For this reason, according to the electrophoretic particle display device manufactured in the above aspect, since the binder formed on the first electrode side has insulation, when a voltage is applied to the first electrode, Generation of leakage current flowing only through the binder portion can be suppressed. In addition, since the binder formed between the second electrode and the insulating binder has electrical conductivity, when a voltage is applied to the first electrode, it is between the microcapsule and the second electrode. The voltage drop is reduced, and the drop in effective voltage applied to the microcapsules can be suppressed.

According to another aspect of the present invention, in an electronic device including a display body and a drive circuit that supplies a drive signal to the display body, the display body is any one of claims 1 to 3. An electronic apparatus comprising the described electrophoretic particle display device.
According to the above aspect, by providing the electrophoretic particle display device described in the above embodiment as a display body, it is possible to improve display response and maintain good contrast over a long period of time.

The figure which shows the electrophoretic particle display apparatus which concerns on 1st Embodiment of this invention. The figure which shows the manufacturing method of the electrophoretic particle display apparatus which concerns on 1st Embodiment of this invention. The figure which shows the modification 1 to the modification 3 of 1st Embodiment of this invention. The figure which shows the manufacturing method of the modification 1 of 1st Embodiment of this invention. The figure which shows the manufacturing method of the modification 2 of 1st Embodiment of this invention. The figure which shows the manufacturing method of the modification 3 of 1st Embodiment of this invention. The figure which shows the electrophoretic particle display apparatus which concerns on 2nd Embodiment of this invention. The figure which shows the manufacturing method of the electrophoretic particle display apparatus which concerns on 2nd Embodiment of this invention. The figure which shows the modification of 2nd Embodiment of this invention. The figure which shows the structure of the electronic paper to which the electrophoretic particle display apparatus in this invention is applied. The figure which shows the structure of the display to which the electrophoretic particle display apparatus in this invention is applied.

  First, a first embodiment and a second embodiment of the present invention will be described with reference to the drawings. Next, as a third embodiment of the present invention, an application example of the electrophoretic particle display device according to the first and second embodiments will be described with reference to the drawings. Note that, in the respective drawings described below, the same reference numerals are given to portions having the same configuration, and redundant description thereof may be omitted.

(1) First Embodiment << Electrophoretic Particle Display Apparatus >>
FIG. 1 is a sectional view of an electrophoretic particle display device according to a first embodiment of the present invention.
As shown in FIG. 1, the electrophoretic particle display device includes a pixel substrate 102, a counter substrate 104 disposed to face the pixel substrate 102, and a microcapsule sandwiched between the pixel substrate 102 and the counter substrate 104. 106, a binder 108 formed between the pixel substrate 102 and the counter substrate 104 and surrounding the microcapsule 106, a pixel electrode 110 formed between the pixel substrate 102 and the microcapsule 106, and the counter substrate 104. And the microcapsule 106 include a common electrode 112 formed to face the pixel electrode 110.
Note that a constant voltage can be applied to the pixel electrode 110, and the common electrode 112 is grounded. The common electrode 112 is, for example, an ITO electrode. The counter substrate 104 is, for example, a transparent substrate.

The binder 108 includes an insulating binder 108a formed on the pixel substrate 102 side and a conductive binder 108b formed between the counter substrate 104 and the insulating binder 108a. Here, the film thickness of the conductive binder 108b and the film thickness of the insulating binder 108a are substantially the same.
Further, the microcapsule 106 and the pixel electrode 110 are in contact with each other. Further, a conductive binder 108 b is interposed between the microcapsule 106 and the common electrode 112.

As described above, according to the above aspect, since the insulating binder 108a is provided on the pixel electrode 110 side, when a voltage is applied to the pixel electrode 110, the leakage current flowing only through the binder 108 portion is reduced. Generation can be suppressed. In addition, since the conductive binder 108b is provided between the common electrode 112 and the insulating binder 108a, a voltage drop between the microcapsule 106 and the common electrode 112 occurs when a voltage is applied to the pixel electrode 110. It becomes small and the fall of the effective voltage applied to the microcapsule 106 can be suppressed.
The insulating binder 108a may be an insulating binder, and for example, a urethane material or an epoxy material can be used. The conductive binder 108b may be any conductive binder, and for example, an epoxy-based material containing silver paste or an epoxy-based material containing carbon black can be used.

Further, the conductive binder 108b may be formed of a binder containing conductive particles.
In the present embodiment, the case where the insulating binder 108a and the conductive binder 108b have substantially the same film thickness has been described, but the present invention is not limited to this. For example, the conductive binder 108b may be thicker than the insulating binder 108a, or the insulating binder 108a may be thicker than the conductive binder 108b.

In this embodiment, the case where the microcapsule 106 is in contact with the pixel electrode 110 has been described. However, the present invention is not limited to this. For example, an insulating binder 108 a may be interposed between the microcapsule 106 and the pixel electrode 110.
In the present embodiment, the case where the conductive binder 108b is interposed between the microcapsule 106 and the common electrode 112 is described, but the present invention is not limited to this. For example, the microcapsule 106 may be in contact with the common electrode 112.

In this embodiment, the microcapsule 106 may be surrounded by an insulating binder 108a or may be surrounded by a conductive binder 108b.
Here, the “pixel substrate 102” in the present embodiment corresponds to a “first substrate” in the claims of the present application, and the “counter substrate 104” corresponds to a “second substrate” in the claims of the present application. The “pixel electrode 110” corresponds to a “first electrode” in the claims of the present application, and the “common electrode 112” corresponds to a “second electrode” in the claims of the present application.

<< Method for Manufacturing Electrophoretic Particle Display Device >>
The manufacturing method of the electrophoretic particle display device according to the first embodiment will be described with reference to FIGS.
First, as shown in FIG. 2A, a paint containing microcapsules 106 and an insulating binder 108 a is applied so as to cover the pixel substrate 102 provided with the pixel electrodes 110. At this time, for example, a coating method such as die coating or slit coating can be used. Note that when the coating containing the microcapsule 106 and the insulating binder 108a is applied, the entire surface of the microcapsule 106 may be covered with the insulating binder 108a, or a part of the surface of the microcapsule 106 may be covered. It may be exposed. As the insulating binder 108a, for example, a urethane material or an epoxy material can be used.

Next, as shown in FIG. 2B, the insulating binder 108a is dried and cured by evaporating the solvent component contained in the insulating binder 108a. At this time, the entire surface of the microcapsule 106 may be covered with the insulating binder 108a, or a part of the surface of the microcapsule 106 may be exposed.
Next, as shown in FIG. 2C, a conductive binder 108b is applied so as to cover the microcapsules 106 and the insulating binder 108a. At this time, for example, a coating method such as die coating or slit coating can be used. Note that as the conductive binder 108b, for example, an epoxy-based material containing silver paste or an epoxy-based material containing carbon black can be used.

Next, as shown in FIG. 2D, the conductive binder 108b is dried and cured by evaporating the solvent component contained in the conductive binder 108b.
Finally, as shown in FIG. 2E, the counter substrate 104 including the common electrode 112 is disposed so as to cover the conductive binder 108b.
According to the above manufacturing method, the electrophoretic particle display device according to the first embodiment can be manufactured.

  For this reason, according to the electrophoretic particle display device manufactured in the above aspect, the insulating binder 108a is provided on the pixel electrode 110 side. Therefore, when a voltage is applied to the pixel electrode 110, only the portion of the binder 108 is provided. It is possible to suppress the occurrence of leak current flowing through the. In addition, since the conductive binder 108b is provided between the common electrode 112 and the insulating binder 108a, a voltage drop between the microcapsule 106 and the common electrode 112 occurs when a voltage is applied to the pixel electrode 110. It becomes small and the fall of the effective voltage applied to the microcapsule 106 can be suppressed.

Here, the “insulating binder 108a” in the present embodiment corresponds to the “first binder” in the claims of the present application, and the “conductive binder 108b” corresponds to the “second binder” in the claims of the present application. .
In the present embodiment, the application of the insulating binder 108a and the conductive binder 108b in two steps has been described. However, the present invention is not limited to this. For example, the insulating binder 108a, the conductive binder 108b having a lighter specific gravity than the insulating binder 108a, and the microcapsule 106 having a higher specific gravity than the insulating binder 108a may be mixed and applied. As a result, the phases are separated by their own weights, so that the periphery of the microcapsule 106 can be surrounded by the insulating binder 108a and the conductive binder 108b.

  In the present embodiment, the process of applying the paint including the microcapsule 106 and the insulating binder 108a so as to cover the pixel substrate 102 including the pixel electrode 110 has been described. However, the present invention is not limited to this. Absent. For example, the microcapsules 106 may be first disposed so as to cover the image pixel substrate 102, and then the insulating binder 108a may be applied.

<Modifications 1-3>
The present invention is not limited to the electrophoretic particle display device. For example, as a modified example of the electrophoretic particle display device, the electrophoretic particle display device shown in FIG. 3A (hereinafter, also referred to as “modified example 1”) may be used, or FIG. The electrophoretic particle display device (hereinafter also referred to as “Modification 2”) may be used, or the electrophoretic particle display device (hereinafter also referred to as “Modification 3”) shown in FIG. There may be.
The structures of the modified examples 1 to 3 are substantially the same as the structure of the electrophoretic particle display device according to the first embodiment, but the ratio of the film thickness between the insulating binder 108a and the conductive binder 108b and the pixel electrode 110 And the position of the microcapsule 106 held between the common electrode 112 is different.

  Even in the electrophoretic particle display devices according to the first to third modifications, the insulating binder 108a is provided on the pixel electrode 110 side as in the case of the electrophoretic particle display device according to the first embodiment. When a voltage is applied to the pixel electrode 110, it is possible to suppress the occurrence of a leak current that flows only through the binder 108 portion. In addition, since the conductive binder 108b is provided between the common electrode 112 and the insulating binder 108a, a voltage drop between the microcapsule 106 and the common electrode 112 occurs when a voltage is applied to the pixel electrode 110. It becomes small and the fall of the effective voltage applied to the microcapsule 106 can be suppressed.

<< Manufacturing Method of Modification 1 >>
The manufacturing method of the modification 1 shown to Fig.3 (a) is demonstrated easily, referring FIG.4 (a)-(e).
First, as shown in FIG. 4A, an insulating binder 108a is applied so as to cover the pixel substrate 102 provided with the pixel electrode 110.
Next, as shown in FIG. 4B, the insulating binder 108a is dried and cured by evaporating the solvent component contained in the insulating binder 108a.

Next, as shown in FIG. 4C, a coating material including the microcapsule 106 and the conductive binder 108b is applied.
Next, as shown in FIG. 4 (d), the conductive binder 108b is dried and cured by evaporating the solvent component contained in the conductive binder 108b.
Finally, as shown in FIG. 4E, the counter substrate 104 including the common electrode 112 is disposed so as to cover the conductive binder 108b.

According to the above manufacturing method, the electrophoretic particle display device shown in FIG. 3A can be manufactured.
For this reason, according to the electrophoretic particle display device manufactured in the above aspect, the insulating binder 108a is provided on the pixel electrode 110 side. Therefore, when a voltage is applied to the pixel electrode 110, only the portion of the binder 108 is provided. It is possible to suppress the occurrence of leak current flowing through the. In addition, since the conductive binder 108b is provided between the common electrode 112 and the insulating binder 108a, a voltage drop between the microcapsule 106 and the common electrode 112 occurs when a voltage is applied to the pixel electrode 110. It becomes small and the fall of the effective voltage applied to the microcapsule 106 can be suppressed.

<< Manufacturing Method of Modification 2 >>
The manufacturing method of the modification 2 shown in FIG.3 (b) is demonstrated easily, referring FIG.5 (a)-(e).
First, as shown in FIG. 5A, a coating material containing microcapsules 106 and a conductive binder 108b is applied so as to cover the counter substrate 104 provided with the common electrode 112.
Next, as shown in FIG. 5B, the conductive binder 108b is dried and cured by evaporating the solvent component contained in the conductive binder 108b. At this time, the entire surface of the microcapsule 106 may be covered with the conductive binder 108b, or a part of the surface of the microcapsule 106 may be exposed.

Next, as illustrated in FIG. 5C, an insulating binder 108 a is applied so as to cover the conductive binder 108 b and the microcapsules 106.
Next, as shown in FIG. 5D, the insulating binder 108a is dried and cured by evaporating the solvent component contained in the insulating binder 108a.
Finally, as shown in FIG. 5E, the pixel substrate 102 including the pixel electrode 110 is disposed so as to cover the insulating binder 108a.

According to the above manufacturing method, the electrophoretic particle display device shown in FIG. 3B can be manufactured.
For this reason, according to the electrophoretic particle display device manufactured in the above aspect, the insulating binder 108a is provided on the pixel electrode 110 side. Therefore, when a voltage is applied to the pixel electrode 110, only the portion of the binder 108 is provided. It is possible to suppress the occurrence of leak current flowing through the. In addition, since the conductive binder 108b is provided between the common electrode 112 and the insulating binder 108a, a voltage drop between the microcapsule 106 and the common electrode 112 occurs when a voltage is applied to the pixel electrode 110. It becomes small and the fall of the effective voltage applied to the microcapsule 106 can be suppressed.

<< Manufacturing Method of Modification 3 >>
The manufacturing method of the modification 3 shown in FIG.3 (c) is demonstrated easily, referring FIG.6 (a)-(e).
First, as shown in FIG. 6A, a conductive binder 108b is applied so as to cover the counter substrate 104 provided with the common electrode 112.
Next, as shown in FIG. 6B, the conductive binder 108b is dried and cured by evaporating the solvent component contained in the conductive binder 108b.

Next, as shown in FIG. 6C, a coating material including the insulating binder 108a and the microcapsule 106 is applied so as to cover the conductive binder 108b.
Next, as shown in FIG. 6D, the insulating binder 108a is dried and cured by evaporating the solvent component contained in the insulating binder 108a.
Finally, as shown in FIG. 6E, the pixel substrate 102 including the pixel electrode 110 is disposed so as to cover the insulating binder 108a.

According to the above manufacturing method, the electrophoretic particle display device shown in FIG. 3C can be manufactured.
For this reason, according to the electrophoretic particle display device manufactured in the above aspect, the insulating binder 108a is provided on the pixel electrode 110 side. Therefore, when a voltage is applied to the pixel electrode 110, only the portion of the binder 108 is provided. It is possible to suppress the occurrence of leak current flowing through the. In addition, since the conductive binder 108b is provided between the common electrode 112 and the insulating binder 108a, a voltage drop between the microcapsule 106 and the common electrode 112 occurs when a voltage is applied to the pixel electrode 110. It becomes small and the fall of the effective voltage applied to the microcapsule 106 can be suppressed.

  As shown in the manufacturing methods of Modifications 1 to 3, the microcapsule 106 may be mixed with the insulating binder 108a and applied, or may be mixed with the conductive binder 108b and applied. Further, the microcapsule 106 may be mixed and applied with a binder that forms a thick film, or may be mixed and applied with a binder that forms a thin film.

(2) Second Embodiment << Electrophoretic Particle Display Apparatus >>
FIG. 7 is a sectional view of an electrophoretic particle display device according to the second embodiment of the present invention.
As shown in FIG. 7, the electrophoretic particle display device is an electrophoretic particle display device having a plurality of pixels, and includes a pixel substrate 202, a counter substrate 204 arranged to face the pixel substrate 202, and a pixel substrate 202. Electrophoretic display element 214 disposed between the pixel substrate and the counter substrate, the plurality of pixel electrodes 210 formed for each pixel on the electrophoretic display element 214 side of the pixel substrate 202, and the electrophoretic display of the counter substrate 204 A common electrode 212 formed to face the pixel electrode 210 is included on the element 214 side.
Note that a constant voltage can be applied to the pixel electrode 210, and the common electrode 212 is grounded. The common electrode 212 is, for example, an ITO electrode. The counter substrate 204 is, for example, a transparent substrate.

The electrophoretic display element 214 includes a microcapsule 206 and a binder 208 that surrounds the microcapsule 206.
Further, the binder 208 includes an insulating binder 208 a formed on the side of the plurality of pixel electrodes 202, and a conductive binder 208 b formed between the insulating binder 208 a and the common electrode 212. Here, the film thickness of the conductive binder 208b and the film thickness of the insulating binder 208a are substantially the same thickness.
Further, the microcapsule 206 and the pixel electrode 210 are in contact with each other. Further, a conductive binder 208 b is interposed between the microcapsule 206 and the common electrode 212.

  As described above, according to the above aspect, since the insulating binder 208a is provided on the pixel electrode 210 side, when a voltage is applied to the pixel electrode 210, the leakage current flowing only through the binder 208 portion is reduced. Generation can be suppressed. In addition, since the conductive binder 208b is provided between the common electrode 212 and the insulating binder 208a, when a voltage is applied to the pixel electrode 210, a voltage drop between the microcapsule 206 and the common electrode 212 occurs. It becomes small and the fall of the effective voltage applied to the microcapsule 206 can be suppressed.

Note that the insulating binder 208a may be an insulating binder, and for example, a urethane-based material or an epoxy-based material can be used. The conductive binder 208b may be any conductive binder, and for example, an epoxy-based material containing silver paste or an epoxy-based material containing carbon black can be used.
The conductive binder 208b may be formed of a binder containing conductive particles.

In the present embodiment, the case where the insulating binder 208a and the conductive binder 208b have substantially the same film thickness has been described, but the present invention is not limited to this. For example, the conductive binder 208b may be thicker than the insulating binder 208a, or the insulating binder 208a may be thicker than the conductive binder 208b.
In this embodiment, the case where the microcapsule 206 is in contact with the pixel electrode 210 has been described, but the present invention is not limited to this. For example, an insulating binder 208 a may be interposed between the microcapsule 206 and the pixel electrode 210.

In the present embodiment, the case where the conductive binder 208b is interposed between the microcapsule 206 and the common electrode 212 is described, but the present invention is not limited to this. For example, the microcapsule 206 may be in contact with the common electrode 212.
In this embodiment, the microcapsule 206 may be surrounded by an insulating binder 208a or may be surrounded by a conductive binder 208b.

<< Method for Manufacturing Electrophoretic Particle Display Device >>
A method for manufacturing the electrophoretic particle display device according to the second embodiment will be briefly described with reference to FIGS.
First, as shown in FIG. 8A, a paint containing microcapsules 206 and an insulating binder 208a is applied so as to cover the pixel substrate 202 on which the plurality of pixel electrodes 210 are formed.

Next, as shown in FIG. 8B, the insulating binder 208a is dried and cured by evaporating the solvent component contained in the insulating binder 208a.
Next, as shown in FIG. 8C, a conductive binder 208b is applied so as to cover the microcapsules 206 and the insulating binder 208a.
Next, as shown in FIG. 8D, the conductive binder 208b is dried and cured by evaporating the solvent component contained in the conductive binder 208b.
Finally, as shown in FIG. 8E, the counter substrate 204 including the common electrode 212 is disposed so as to cover the conductive binder 208b.

According to the above manufacturing method, the electrophoretic particle display device shown in FIG. 7 can be manufactured.
Therefore, according to the electrophoretic particle display device manufactured in the above aspect, since the insulating binder 208a is provided on the pixel electrode 210 side, when a voltage is applied to the pixel electrode 210, only the portion of the binder 208 is provided. It is possible to suppress the occurrence of leak current flowing through the. In addition, since the conductive binder 208b is provided between the common electrode 212 and the insulating binder 208a, when a voltage is applied to the pixel electrode 210, a voltage drop between the microcapsule 206 and the common electrode 212 occurs. It becomes small and the fall of the effective voltage applied to the microcapsule 206 can be suppressed.

In the present embodiment, the application of the insulating binder 208a and the conductive binder 208b in two steps has been described. However, the present invention is not limited to this. For example, the insulating binder 208a, the conductive binder 208b having a lighter specific gravity than the insulating binder 208a, and the microcapsule 206 having a higher specific gravity than the insulating binder 208a may be mixed and applied. As a result, the phases are separated by their own weights, so that the periphery of the microcapsule 206 can be surrounded by the insulating binder 208a and the conductive binder 208b.
In the present embodiment, the process of applying the paint including the microcapsule 206 and the insulating binder 208a so as to cover the pixel substrate 202 including the pixel electrode 210 has been described. However, the present invention is not limited to this. . For example, the microcapsules 206 may be first disposed so as to cover the pixel substrate 202, and then the insulating binder 208a may be applied.

≪Modification≫
The present invention is not limited to the electrophoretic particle display device. For example, as a modified example of the electrophoretic particle display device, the electrophoretic particle display device shown in FIG. 9 may be used.
The structure of this modified example is substantially the same as the structure of the electrophoretic particle display device according to the second embodiment, but a member (hereinafter referred to as “a material formed of a conductive material so as to cover the pixel electrode 210”). It is also referred to as a “conductive member”.) 216 is provided.

  Even in the electrophoretic particle display device according to the modified example, since the insulating binder 208a is provided on the pixel electrode 210 side as in the case of the electrophoretic particle display device according to the second embodiment, the pixel electrode When a voltage is applied to 210, it is possible to suppress the occurrence of a leak current that flows only through the portion of the binder 208. In addition, since the conductive binder 208b is provided between the common electrode 212 and the insulating binder 208a, when a voltage is applied to the pixel electrode 210, a voltage drop between the microcapsule 206 and the common electrode 212 occurs. It becomes small and the fall of the effective voltage applied to the microcapsule 206 can be suppressed. In addition, since the conductive member 216 is provided, the contact area between the microcapsule 206 and the conductive member 216 is increased, and a voltage can be effectively applied to the microcapsule 206.

(3) Third Embodiment << Application Example of Electrophoretic Particle Display Device >>
It is also possible to apply the electrophoretic particle display device described in the first embodiment and the second embodiment to an electronic apparatus.
Here, electronic paper and a display device (display) as electronic devices will be described with reference to FIGS.
FIG. 10 is a perspective view illustrating a configuration of electronic paper.
The electronic paper 300 includes a main body 301 made of a rewritable sheet having the same texture and flexibility as paper, and a display unit 302. Here, in the electronic paper 300, the display unit 302 includes the electrophoretic particle display device described in the first and second embodiments.

11A and 11B illustrate a configuration of a display to which the electronic paper in FIG. 10 is applied, in which FIG. 11A is a cross-sectional view and FIG.
The display 400 includes a main body 401 provided with two pairs of transport rollers 402a and 402b, an electronic paper 300 installed on the main body 401 while being sandwiched between the pairs of transport rollers 402a and 402b, and a main body 401. A transparent glass plate 404 fitted in a rectangular hole 403 provided on the display surface side (upper surface side in FIG. 11A) and one end of the main body 401, and the electronic paper 300 is attached to and detached from the main body 401. An insertion port 405 that is freely inserted, a controller 408 that can be connected to a terminal portion 406 provided at a distal end portion in the insertion direction of the electronic paper 300 via a socket 407, and an operation unit 409 are provided. Here, in the display 400, the display unit 302 included in the electronic paper 300 includes the electrophoretic particle display device described in the first embodiment and the second embodiment.

The display 400 forms a display surface by making the electronic paper 300 installed in the main body 401 visible on the transparent glass plate 404. The electronic paper 300 is detachably installed on the main body 401, and can be carried and used while being detached from the main body 401.
Electronic devices are not limited to this, but include televisions, viewfinder type, monitor direct-view type video tape recorders, car navigation devices, pagers, electronic notebooks, calculators, word processors, workstations, videophones, POS terminals, and touch panels. The electrophoretic particle display device described in the first embodiment and the second embodiment can be applied as the display unit of the electronic device.

  102 pixel substrate, 104 counter substrate, 106 microcapsule, 108 binder, 108a insulating binder, 108b conductive binder, 110 pixel electrode, 112 common electrode, 202 pixel substrate, 204 counter substrate, 206 microcapsule, 208 binder, 208a insulating Conductive binder, 208b conductive binder, 210 pixel electrode, 212 common electrode, 214 electrophoretic display element, 216 conductive member, 300 electronic paper (electronic device), 301 body, 302 display unit, 400 display (electronic device), 401 Main unit, 402a Conveying roller pair, 402b Conveying roller pair, 403 Rectangular hole, 404 Transparent glass plate, 405 Insertion port, 406 Terminal unit, 407 Socket, 408 Controller, 409 Operation unit

Claims (7)

A first substrate comprising a first electrode;
A second substrate provided with a second electrode disposed on the side of the first substrate, facing the side where the first electrode of the first substrate is formed;
A microcapsule disposed between the first electrode and the second electrode;
A binder disposed between the first electrode and the second electrode and surrounding the microcapsule,
The binder is
An insulating binder;
An electrophoretic particle display device comprising: an electrically conductive binder disposed between the insulating binder and the second electrode. An electrophoretic particle display device having a plurality of pixels,
A first substrate comprising a plurality of first electrodes corresponding to the plurality of pixels;
A second substrate disposed on the side of the first substrate opposite to the side on which the first electrode of the first substrate is formed; and
An electrophoretic display element disposed between the plurality of first electrodes and the second electrode,
The electrophoretic display element is:
Microcapsules,
A binder surrounding the periphery of the microcapsule,
The binder is
An insulating binder;
An electrophoretic particle display device comprising: an electrically conductive binder disposed between the insulating binder and the second electrode.   The electrophoretic particle display device according to claim 1, wherein the conductive binder includes conductive particles. A first application step of applying a coating containing a microcapsule and a first binder to a side of the first substrate that includes the first electrode;
After the first application step, a second binder having a different conductivity from the first binder is applied so as to cover the microcapsules and the first binder, and the first binder and the second binder are applied. A second coating step of laminating a binder of
An arrangement step of arranging a second substrate having a second electrode on the side facing the first electrode with the paint and the second binder sandwiched therebetween after the second application step. A method for manufacturing an electrophoretic particle display device. A first application step of applying a first binder to the first substrate on the side provided with the first electrode;
After the first application step, a coating containing a second binder and a microcapsule having different conductivity from the first binder is applied so as to cover the first binder, and the first binder and the A second application step of laminating a second binder;
An arrangement step of arranging a second substrate having a second electrode on the side facing the first electrode with the first binder and the paint sandwiched therebetween after the second application step. A method for manufacturing an electrophoretic particle display device. A first application step of applying a coating containing microcapsules and an insulating binder to a side of the first substrate including a plurality of first electrodes;
A second coating step of applying a conductive binder so as to cover the microcapsules and the insulating binder after the first coating step, and laminating the insulating binder and the conductive binder;
An arrangement step of arranging a second substrate having a second electrode on the side facing the first electrode with the paint and the conductive binder sandwiched between the second application step and the second application step. A method for manufacturing an electrophoretic particle display device. In an electronic device comprising a display body and a drive circuit that supplies a drive signal to the display body,
An electronic apparatus comprising the electrophoretic particle display device according to any one of claims 1 to 3 as the display body.

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