JP2012220685A - Electrophoretic particle display device manufacturing method and electrophoretic particle display device manufacturing apparatus - Google Patents

Abstract

An electrophoretic particle display device manufacturing method and an electrophoretic particle display device manufacturing apparatus that can remove gaps and bubbles generated between microcapsules and reduce the destruction of microcapsules.
An application step of applying a dispersion liquid 110 including a binder resin 108 and a microcapsule 106 to a first surface of a counter substrate 102 provided with a common electrode 104, and drying the dispersion liquid 110 after the application step. A capsule protruding step of protruding a part of the microcapsule 106 from the upper surface of the binder resin 108, and a capsule pushing step of pressing the microcapsule 106 toward the common electrode 104 and pushing it into the binder resin 108 after the capsule protruding step. Including.
[Selection] Figure 1

Description

  The present invention relates to an electrophoretic particle display device manufacturing method and an electrophoretic particle display device manufacturing apparatus.

A microcapsule type electrophoretic particle display device is a microcapsule in which a dispersion liquid containing electrophoretic particles and a dispersion medium is wrapped in a polymer film (for example, gelatin or melamine resin), and a voltage is applied to the microcapsule. There are cases where the electrode and the microcapsules or a binder resin that bonds the microcapsule and the electrode are included.
In this electrophoretic particle display device, gaps and bubbles may occur between the microcapsules, which may cause display defects.

  In order to remove the gaps and the bubbles, in the prior art, after the binder resin and the microcapsules are applied on the substrate, the microcapsules may be pressed to the substrate side using a vacuum laminator. In addition, as a manufacturing method of the conventional electrophoretic particle display apparatus using a vacuum laminating apparatus, there exists a thing described in patent document 1, for example.

JP 2007-199245 A

However, when the microcapsule is pressed to the substrate side using a vacuum laminator, a pressure difference occurs between the inside and the outside of the microcapsule, which may break the microcapsule.
Accordingly, some aspects of the present invention have been made in view of such circumstances, and electrophoretic particles that can remove gaps and bubbles generated between microcapsules and reduce the destruction of microcapsules. It is an object of the present invention to provide a display device manufacturing method and an electrophoretic particle display device manufacturing apparatus.

  One embodiment of the present invention for solving the above problems is an application step of applying a dispersion liquid including a binder resin and microcapsules to a first surface of a substrate provided with electrodes, and after the application process, the dispersion liquid A capsule projecting step of projecting a part of the microcapsule from the upper surface of the binder resin, and after the capsule projecting step, pushing the microcapsule toward the electrode and pushing it into the binder resin A method for manufacturing an electrophoretic particle display device.

According to the said aspect, a microcapsule protruded from the upper surface of the binder resin is pushed toward the electrode side, whereby the microcapsule can be deformed and embedded in the binder resin. By doing so, the filling density of the microcapsules in the binder resin is increased, so that gaps and bubbles generated between the microcapsules can be removed.
Furthermore, according to the above aspect, gaps and bubbles generated between the microcapsules can be removed even in an air atmosphere (hereinafter also referred to as “atmospheric pressure”). For this reason, the pressure difference between the inside and the outside of the microcapsule is smaller than that in a vacuum atmosphere, so that the destruction of the microcapsule can be reduced.

In another aspect of the present invention, the capsule pushing step may be performed under atmospheric pressure.
According to the above aspect, since the pressure difference between the inside and the outside of the microcapsule is smaller than that in a vacuum atmosphere, the destruction of the microcapsule can be reduced.

In another aspect of the present invention, in the capsule pushing step, the dispersion may be heated from a second surface side opposite to the first surface to which the dispersion is applied.
According to the said aspect, the binder resin contained in a dispersion liquid can be softened by heating a dispersion liquid from the 2nd surface side. For this reason, compared with the case where the binder resin is not softened, the microcapsules can be easily pushed toward the electrode side and embedded in the binder resin.

In another aspect of the present invention, in the capsule pushing step, a first roll in contact with the first surface and a second roll in contact with the second surface are disposed to face the first roll. Then, the substrate may be pressed between the substrates.
According to the said aspect, a microcapsule can be continuously pushed in into binder resin using a 1st roll and a 2nd roll, and it can embed in binder resin.

In another aspect of the present invention, the binder resin may be a thermoplastic binder resin.
According to the above aspect, the binder resin can be softened by heating the binder resin. For this reason, the space | gap and bubble which arose between microcapsules can be removed by pushing a microcapsule toward an electrode side. Moreover, binder resin can be hardened by cooling binder resin. For this reason, it is possible to reduce the generation of gaps and bubbles between the microcapsules again by cooling the binder resin after removing the gaps and bubbles generated between the microcapsules.

  In another aspect of the present invention, there is provided an application unit that applies a dispersion liquid including a binder resin and microcapsules to a first surface of a substrate having electrodes, and the dispersion liquid applied by the application unit is dried. Capsule protruding means for protruding a part of the microcapsule from the upper surface of the binder resin, and pressing the microcapsule protruded from the upper surface of the binder resin by the capsule protruding means to the electrode side. An apparatus for manufacturing an electrophoretic particle display device, comprising: capsule pushing means for pushing into a resin.

According to the said aspect, a microcapsule protruded from the upper surface of the binder resin is pushed toward the electrode side, whereby the microcapsule can be deformed and embedded in the binder resin. Thereby, the filling density of the microcapsules in the binder resin is increased, and gaps and bubbles generated between the microcapsules can be removed.
Furthermore, according to the above aspect, it is possible to remove gaps and bubbles generated between the microcapsules even in an air atmosphere. For this reason, the pressure difference between the inside and the outside of the microcapsule is smaller than that in a vacuum atmosphere, so that the destruction of the microcapsule can be reduced.

In another aspect of the present invention, the processing by the applying unit, the capsule projecting unit, and the capsule pushing unit may be performed inline.
According to the above aspect, it is possible to perform inline application of the dispersion liquid by the application means, drying of the dispersion liquid by the capsule protruding means, and pushing of the microcapsules by the capsule pushing means, so that a gap formed between the microcapsules In addition, the electrophoretic particle display device from which bubbles and bubbles are removed can be manufactured continuously.

  Here, “in-line” means that each unit is arranged so as to sequentially process sequentially. That is, according to the aspect of the present invention, the application means, the capsule projecting means, and the capsule pushing means are provided on the same production line, and the processes of these means are successively performed without being divided. Means that it is done.

In another aspect of the present invention, the capsule pushing means may heat the dispersion from the second surface side opposite to the first surface to which the dispersion is applied.
According to the said aspect, the binder resin contained in a dispersion liquid can be softened by heating a dispersion liquid from the 2nd surface side. For this reason, compared with the case where the binder resin is not softened, the microcapsules can be easily pushed toward the electrode side and embedded in the binder resin.

According to another aspect of the present invention, the capsule pushing means includes a first roll and a second roll disposed to face the first roll, and the first roll includes the first roll The second roll may be in contact with the first face and may be in contact with the second face and may be pressed with the substrate sandwiched between the first roll and the second roll.
According to the said aspect, a microcapsule can be continuously pushed in in binder resin using a 1st roll and a 2nd roll.

The figure which shows the manufacturing method of the electrophoretic particle display apparatus which concerns on embodiment of this invention. The figure which shows the manufacturing apparatus of the electrophoretic particle display apparatus which concerns on embodiment of this invention. The figure which shows the modification of the manufacturing apparatus of the electrophoretic particle display apparatus which concerns on embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that, in the respective drawings described below, the same reference numerals are given to portions having the same configuration, and redundant description thereof may be omitted. First, the “electrophoretic particle display device manufacturing method” will be described with reference to FIG. 1, and then with reference to FIGS. 2 and 3, the “electrophoretic particle display device manufacturing device and its modifications” will be described. explain.

<< Method for Manufacturing Electrophoretic Particle Display Device >>
1A to 1F show a method for manufacturing an electrophoretic particle display device according to an embodiment of the present invention. The manufacturing method of the electrophoretic particle display device according to the present embodiment includes a coating process (see FIG. 1A), a drying process (see FIG. 1B), and a capsule pushing process (FIG. 1C). ), A protective substrate pressing step (see FIG. 1D), a protective substrate peeling step (see FIG. 1E), and a pixel substrate pressing step (see FIG. 1F). It is out. Therefore, the above process will be described below. The above steps are all performed in an air atmosphere.

  First, in the coating process, as shown in FIG. 1A, on the surface of the counter substrate 102 having the common electrode 104, a microcapsule 106, a binder resin 108, a volatile component such as water or an alcohol solvent, a thickening agent. A liquid dispersion 110 in which an agent or the like is arbitrarily prepared is applied. The thickness of the applied binder resin 108 is, for example, 50 to 200 μm in a wet state before drying. Note that a transparent material is used for the counter substrate 102 and the common electrode 104.

  In the next drying step, as shown in FIG. 1B, volatile components such as water and alcohol solvent contained in the dispersion 110 applied in the application step are evaporated, and at the same time compared with the binder resin 108. The microcapsules 106 having a large specific gravity are arranged so as to cover the common electrode 104. For this reason, in this process, the coating surface (that is, the surface of the counter substrate 102 provided with the common electrode 104) is set vertically upward, and the back surface on the opposite side of the coating surface is set vertically downward. Thereby, the electrophoretic particles 106 in the dispersion 110 can be precipitated and arranged on the common electrode 104 side. Furthermore, the capsule pushing process to be described later can be completed in a short time.

In this manner, the binder resin 108 is dried so that a part of the microcapsule 106 protrudes from the upper surface of the binder resin 108.
As shown in FIG. 1B, a gap 112 is generated between the microcapsules 106. In addition, there may be a bubble in the gap 112.

In the next capsule pushing step, as shown in FIG. 1C, the microcapsule 106 is pushed into the binder resin 108, and the gap 112 between the microcapsules 106 is filled. In addition, in FIG.1 (c), a mode that the microcapsule 106 is pressed is shown by the arrow.
In the next protective substrate pressure bonding step, as shown in FIG. 1D, the protective substrate 116 provided with the adhesive layer 114 is pressure bonded so as to cover the binder resin 108 and the microcapsule 106.
In the next protective substrate peeling step, as shown in FIG. 1E, the protective substrate 116 is peeled off, and the adhesive layer 114 is exposed.
In the final pixel substrate pressure-bonding step, as shown in FIG. 1 (f), the surface of the pixel substrate 118 including the pixel electrode 120 and the adhesive layer 114 are pressure-bonded.

  As described above, according to the above-described embodiment, the microcapsule 106 protruded from the upper surface of the binder resin 108 is pushed toward the common electrode 104 side, whereby the microcapsule 106 is deformed and embedded in the binder resin 108. Can do. Thereby, the packing density of the microcapsules 106 in the binder resin 108 is increased, and an electrophoretic particle display device in which the gap 112 generated between the microcapsules 106 is removed can be manufactured.

Further, according to the above aspect, the gap 112 generated between the microcapsules 106 in the air atmosphere can be removed. For this reason, since the pressure difference between the inside and outside of the microcapsule 106 is smaller than that in a vacuum atmosphere, an electrophoretic particle display device in which the destruction of the microcapsule 106 is reduced can be manufactured.
In the capsule pushing process, the binder resin 108 may be heated from the back side of the counter substrate 102. Accordingly, since the binder resin 108 can be softened, the gap 112 generated between the microcapsules 106 can be removed by pushing the microcapsules 106 toward the common electrode 104 side.

In the capsule pushing step, the application surface and the back surface of the counter substrate 102 may be sandwiched between a pair of rolls and pressed from both sides. As a result, the binder resin 108 is softened, and the gap 112 generated between the microcapsules 106 can be continuously removed.
In the capsule pushing step, the dispersion liquid 110 may be heated using a roll in contact with the back surface of the counter substrate 102 among the pair of rolls. As a result, the binder resin 108 is softened, and the gap 112 generated between the microcapsules 106 can be continuously removed.
Further, an ultraviolet irradiation step may be provided immediately after the capsule pushing step. Thereby, for example, when the binder resin 108 is cured by irradiation with ultraviolet rays, the strength of the binder resin 108 can be increased.

The binder resin 108 may be a thermoplastic binder resin. Thereby, by removing the gap 112 generated between the microcapsules 106 and cooling the binder resin 108, it is possible to prevent the gap 112 from being generated again between the microcapsules 106.
In the protective substrate crimping step, the case where the protective substrate 116 includes the adhesive layer 114 has been described, but the present invention is not limited to this. For example, when the protective substrate 116 is not provided with the adhesive layer 114, only the protective substrate 116 may be pressure-bonded so as to cover the binder resin 108 and the microcapsule 106.

Hereinafter, the counter substrate 102, the microcapsule 106, the electrophoretic particles 106a and the dispersion medium 106b included in the microcapsule 106, the binder resin 108, the adhesive layer 114, and the protective substrate 116 used in this embodiment will be described in order.
The counter substrate 102 is a flexible film such as PET (polyethylene terephthalate), PEN (polyethylene naphthalate), COP (cyclic olefin polymer), etc., which is highly transparent and excellent in dimensional stability, and ultra-thin glass. It is a substrate. The counter substrate 102 has a thickness of 20 to 200 μm.

  A common electrode 104 is provided on the application surface side of the counter substrate 102. The common electrode 104 is a transparent electrode, and for example, a metal oxide material such as ITO (indium tin oxide) or ZnO (zinc oxide) is used. In addition, by using carbon-based conductive agents such as carbon nanotubes, graphene, and fullerene, and conductive polymers such as polythiophene, it is possible to improve corrosion resistance and adhesiveness with an interfacial adhesive layer made of resin compared to ITO. it can. Further, a thin film for improving wettability may be formed on the surface of the common electrode 104, or surface activation treatment such as plasma treatment may be performed.

In addition, a layer that improves wear resistance and visibility, such as a hard coat layer, an AR (antireflection) layer, and an AG (antiglare) layer, is formed on the back surface of the counter substrate 102 facing the common electrode 104. May be.
The microcapsule 106 is a capsule having a particle size of 10 to 50 μm in which electrophoretic particles 106a and a dispersion medium 106b described later are contained, and the capsule shell is made of a resin material. The capsule shell is formed of a single layer or multiple layers of gelatin, melamine resin, urethane resin, urea resin, epoxy resin, and the like. Moreover, the film thickness of a capsule shell is 0.1-3 micrometers, for example.

  As the electrophoretic particles 106a, oxide particles, nitride-based particles, sulfide-based particles, boride-based particles, inorganic pigment particles, organic pigment particles, and the like can be used. Examples of the oxide particles that can be used include titanium oxide, zinc oxide, iron oxide, and zirconium oxide. Further, as nitride-based particles, for example, silicon nitride, titanium nitride, or the like can be used. Moreover, zinc sulfide etc. can be used as a sulfide type particle. Moreover, as boride-type particle | grains, a titanium boride etc. can be used, for example. Moreover, as an inorganic pigment particle, nickel titanium, chromium oxide, strontium chromate, cobalt aluminate, copper chromite, ultramarine, etc. can be used, for example. As the organic pigment particles, for example, azo, quinacridone, anthraquinone, dioxazine, and perylene can be used.

In order to prevent sedimentation, resin particles that are hollow and have a specific gravity smaller than that in the case where they are not hollow may be used which are coated with these pigment particles and colored. As the color of the particles, only black particles, a plurality of particles composed of white particles and black particles, or colored pigment particles such as yellow, magenta and cyan other than black and white may be used.
In addition, to control particle charging and prevent aggregation between particles, positively charged materials such as amine compounds and alumina, negatively charged materials such as carboxyl groups, sulfo groups, and silicon oxide, silane coupling agents and titanium cups are used on the particle surface. A coating treatment such as a coupling treatment such as a ring agent or a surfactant surface treatment may be performed.

  The dispersion medium 106b is preferably a hydrophobic and insulating material. Furthermore, a high boiling point solvent having a boiling point of 150 ° C. or higher which is not easily vaporized is preferable. Therefore, for example, aromatic solvents such as trimethylbenzene and naphthalene, petroleum solvents such as isopar, hydrocarbon solvents such as aliphatic solvents such as n-decane, silicone oil, and the like can be used.

Further, a small amount of a dispersant such as a nonionic surfactant that prevents aggregation of the electrophoretic particles 106a may be added.
The material of the binder resin 108 is preferably a thermoplastic resin having a softening point or melting point of 60 to 120 ° C. because the binder resin 108 must be extruded in the capsule pushing process. Typical polymers include acrylic resin, urethane resin, urea resin, epoxy resin, amide resin, ester resin, ether resin, ethylene vinyl acetate copolymer (EVA resin) and ethylene acrylic acid copolymer (EAA resin). A thermoplastic polymer having at least one ethylene copolymer such as ethylene methyl methacrylate copolymer (EMMA resin) and ethylene cyclic olefin copolymer (COC resin) is preferable.

  In addition, as additives for the above resins, cross-linking agents such as cationic polymerization initiators and radical polymerization initiators that react with ultraviolet rays, and cross-linking agents that react with heat, such as epoxy compounds and isocyanate compounds, are fixed after pushing the capsule. Various cross-linking agents may be added. These binder resins 108 are preferably dispersed in water or an alcohol solvent in consideration of compatibility with the microcapsules 106.

  The material of the adhesive layer 114 is preferably a thermoplastic adhesive resin such as an acrylic resin, an ether resin, a urethane resin, an ester resin, or an ethylene vinyl acetate copolymer (EVA), and may be an adhesive material that is semisolid at room temperature. Although it may be opaque, since it needs to have a lower resistance than the binder resin, the electrical resistance may be lowered by adding carbon nanotubes or nano metal fine particles. The thickness of the adhesive layer 114 is preferably in the range of 5 to 50 μm in consideration of the unevenness covering property and electric resistance.

By using the adhesive layer 114, the adhesiveness with the pixel substrate 118 having unevenness such as a TFT circuit or a pixel partition wall can be improved. Moreover, the adhesive strength can be ensured.
The protective substrate 116 is a component having a temporary electrode function used in the driving inspection of the electrophoretic particle display device before being bonded to the pixel substrate (for example, TFT substrate) 118. By using the protective substrate 116, it is possible to prevent damage to the display layer due to wear or the like when winding the electrophoretic particle display device from which the gap 112 generated between the microcapsules 106 is removed.

  As the configuration of the protective substrate 116, a conductive layer and a release layer are laminated on the base material of a plastic substrate having the same linear expansion coefficient as the counter substrate 102 having a thickness of 20 to 200 μm, and an adhesive layer 114 is further provided. Also good. Since the conductive layer may be opaque, an inexpensive and low resistance metal layer such as aluminum is used. On the surface of the conductive layer, a release layer made of a thin film such as a silicone resin or a fluorine resin is formed to prevent transfer of the binder resin 108 and the adhesive layer 114 at the time of re-peeling.

≪Electrophoretic particle display device manufacturing apparatus and modified examples thereof≫
FIG. 2 is a schematic view of the entire manufacturing apparatus of the electrophoretic particle display device according to this embodiment. 3A and 3B show a modification of the apparatus for manufacturing an electrophoretic particle display device according to this embodiment. The above modification is generally the same as the structure of the manufacturing apparatus shown in FIG. 2, but only the coating means 206 is different. Specifically, FIG. 3A shows a manufacturing apparatus in which a comma coat 306a is used as the coating unit 306. FIG. 3B shows a manufacturing apparatus in which a die coat 306 a is used as the coating means 306. 2 and 3 indicate the moving direction of a counter substrate 102 or a protective substrate 116 described later.
In the electrophoretic particle display device manufacturing apparatus according to the present embodiment, the above electrophoretic particle display device manufacturing method is used.

  As shown in FIG. 2, the apparatus for manufacturing an electrophoretic particle display device according to this embodiment includes a counter substrate unwinding means 202, a cleaning means 204, a coating means 206, a drying means 208, and a capsule pushing means 210. , Protective substrate unwinding means 212, pressure bonding means 214, cooling means 216, and winding means 218. Therefore, each of the above means will be described below. Note that all of the above means are continuously performed in an air atmosphere, and the electrophoretic particle display device manufacturing apparatus according to this embodiment can manufacture the electrophoretic particle display device in-line.

The counter substrate unwinding unit 202 unwinds the counter substrate 102 having the common electrode 104. As shown in the figure, the counter substrate 102 is supplied in a roll shape, for example.
The counter substrate 102 thus unwound is continuously conveyed to the cleaning means 204 without being cut, as indicated by arrows.

The cleaning unit 204 cleans the surface of the counter substrate 102 that includes the common electrode 104. Thereby, the surface provided with the common electrode 104 is cleaned while the counter substrate 102 unwound by the counter substrate unwinding means 202 moves through the cleaning means 204.
The counter substrate 102 thus cleaned is continuously conveyed to the coating unit 206 without being cut.

In the coating unit 206, the coating process described with reference to FIG. That is, while the counter substrate 102 moves through the coating means 206, the dispersion liquid 110 containing the binder resin 108 and the microcapsules 106 is applied to the surface of the counter substrate 102 having the common electrode 104. In FIG. 2, a gravure coat 206 a is shown as the application unit 206. Other coating methods include, for example, kiss reverse coating, wire bar coating, air knife coating, comma coating (see FIG. 3A), lip coating, die coating (see FIG. 3B), flexographic printing, and screen printing. For example, a coating method in which coating can be performed without separating the microcapsule 106 and the binder resin 108 can be used. Moreover, in order to apply | coat the dispersion liquid 110 continuously, you may provide a pump in these application heads, and you may supply the dispersion liquid 110 continuously.
The counter substrate 102 thus coated with the dispersion liquid 110 is continuously conveyed to the drying means 208 without being cut.

  In the drying means 208, the drying process described in FIG. That is, while the counter substrate 102 moves through the drying means 208, the volatile component such as water or alcohol solvent contained in the binder resin 108 applied to the counter substrate 102 is evaporated, and at the same time compared with the binder resin 108. The microcapsules 106 having a large specific gravity are arranged on the common electrode 104 side. Then, by drying the binder resin 108, a part of the microcapsule 106 protrudes from the upper surface of the binder resin 108.

In this means, for example, an oven can be used. In this oven, for example, three rooms of a low temperature chamber 208a, a middle greenhouse 208b set to a temperature higher than the temperature of the low temperature chamber 208a, and a high temperature chamber 208c set to a temperature higher than the temperature of the middle greenhouse 208b are continuously arranged. It has been done. And many hot-air blowing nozzles are arrange | positioned inside the oven. The hot air blowing nozzle is arranged not only on the application surface side but also on the back surface side of the application surface. The temperature ranges are, for example, 50 ° C. to 80 ° C. in the low temperature chamber 208a, 80 ° C. to 100 ° C. in the middle greenhouse 208b, and 100 ° C. to 120 ° C. in the high temperature chamber 208c. In addition, an infrared heater is provided in the high temperature chamber 208c at the rear end in order to increase the temperature transferability. The reason why the oven temperature is gradually increased from the entrance side (ie, upstream side) to the exit side (ie, downstream side) is that the binder resin 108 is first flattened in the low temperature chamber 208a, and then the temperature in the middle greenhouse 208b is high. By gradually evaporating the chamber 208c and the volatile components, not only the surface roughness of the binder resin 108 due to bumping is prevented, but also the time until the microcapsules 106 are arranged so as to cover the common electrode 104 is secured. There is also.
The counter substrate 102 having dried the binder resin 108 in this manner is continuously conveyed to the capsule pushing means 210 without being cut.

  In the capsule pushing means 210, the capsule pushing process described with reference to FIG. The capsule pushing means 210 includes a pushing roll 210a and a heating roll 210b arranged to face the pushing roll 210a. The heating roll 210b is heated to 80 to 120 ° C. and is in contact with the back surface of the counter substrate 102 facing the coating surface. Thereby, the counter substrate 102 is heated while being flattened. The pushing roll 210a pushes the microcapsule 106 toward the counter substrate 102 side. Therefore, while the counter substrate 102 moves through the capsule pushing means 210, the application surface and the back surface of the counter substrate 102 are pressed by a pair of rolls (that is, the push roll 210a and the heating roll 210b). Is pushed into the binder resin 108.

The counter substrate 102 in which the microcapsules 106 are pushed into the binder resin 108 in this way is continuously supplied to the pressure bonding means 214 without being cut.
The protective substrate unwinding means 212 unwinds the protective substrate 116 provided with the adhesive layer 114. As shown in the figure, the protective substrate 116 is supplied in a roll shape, for example.
The protective substrate 116 thus unwound is continuously conveyed to the crimping means 214 without being cut.

In the crimping means 214, the crimping process described with reference to FIG. The crimping means 214 includes a first crimping roll 214a disposed to face the heating roll 210b, and a pair of second crimping rolls 214b provided on the downstream side of the heating roll 210b. The first pressure roll 214a presses toward the heating roll 210b via the protective substrate 116.
Note that the first press roll 214a is heated. Further, the pair of second pressure rolls 214b presses from both the protective substrate 116 side and the counter substrate 102 side. The pair of second pressure rolls 214b is heated in the same manner as the first pressure roll 214a.

  Thereby, the protective substrate 116 can be pressure-bonded to the microcapsule 106 and the binder resin 108. Thus, an electrophoretic particle display device in which the gap 112 formed between the microcapsules 106 is removed while the counter substrate 102 and the protective substrate 116 move through the pressure bonding means 214 is manufactured. The manufactured electrophoretic particle display device is continuously supplied to the cooling means 216 without being cut.

  The cooling means 216 cools the manufactured electrophoretic particle display device. The cooling means 216 includes a pair of cooling rolls 216a, and the manufactured electrophoretic particle display device moves between the cooling rolls 216a, so that the temperature of the electrophoretic particle display device can be lowered. The electrophoretic particle display device immediately after manufacturing is heated, and the electrophoretic particle display device is cooled to near room temperature before winding it into a roll, thereby preventing curling and tightening during winding. Can do. Thus, the cooled electrophoretic particle display device is continuously supplied to the winding means 218 without being cut.

  The winding means 218 winds the cooled electrophoretic particle display device. At this time, the electrophoretic particle display device is continuously wound into a roll without being cut. Usually, the cooled electrophoretic particle display device is wound after being rolled up, but the electrophoretic particle display device may be cut without being wound and the electrophoretic particle display devices may be stacked in a sheet shape. .

As described above, according to the above-described embodiment, the microcapsule 106 protruded from the upper surface of the binder resin 108 is pushed toward the common electrode 104 side, whereby the microcapsule 106 is deformed and embedded in the binder resin 108. Can do. Thereby, an electrophoretic particle display device in which the gap 112 generated between the microcapsules 106 is removed can be manufactured.
Further, according to the above aspect, the gap 112 generated between the microcapsules 106 in the air atmosphere can be removed. For this reason, since the pressure difference between the inside and outside of the microcapsule 106 is smaller than that in a vacuum atmosphere, an electrophoretic particle display device in which the destruction of the microcapsule 106 is reduced can be manufactured.

  In this embodiment, in the drying unit 208, the low temperature chamber 208a, the middle greenhouse 208b set to a temperature higher than the temperature of the low temperature chamber 208a, and the high temperature chamber 208c set to a temperature higher than the temperature of the middle greenhouse 208b. Although an oven in which three chambers are continuously arranged has been described, the present invention is not limited to this. For example, the drying chamber may be changed from the above three chambers to five chambers. In this case, from the upstream side (that is, the side where the substrate enters the drying chamber) to the downstream side (that is, the side where the substrate exits from the drying chamber), the low temperature chamber 208a, the middle greenhouse 208b, the high temperature chamber 208c, The drying chamber may be provided in the order of the high greenhouse 208c and the high temperature chamber 208c, or the drying chamber may be provided in the order of the low temperature chamber 208a, the low temperature chamber 208a, the middle greenhouse 208b, the middle greenhouse 208b, and the high temperature chamber 208c.

In the capsule pushing means 210, the pushing roll 210a may be cooled. Accordingly, when the microcapsule 106 is pushed into the binder resin 108, the binder resin 108 can be prevented from being transferred to the pushing roll 210a.
In the capsule pushing means 210, the surface of the pushing roll 210a may be coated with, for example, a silicone resin or a fluororesin. Thereby, not only the transfer of the binder resin 108 but also the damage of the microcapsule 106 can be suppressed.

In the capsule pushing means 210, a plurality of pushing rolls 210a may be provided. When the plurality of microcapsules 106 are provided, the gaps 112 can be removed while the microcapsules 106 overlapped on the common electrode 104 are gradually deformed.
In the capsule pushing means 210, the heating roll 210b may be made of metal. Thereby, heat can be transferred to the counter substrate 102.

In the capsule pushing means 210, the diameter of the heating roll 210b may be larger than the diameter of the pushing roll 210a. Thereby, the counter substrate 102 can be heated while being flattened.
Further, an ultraviolet irradiation device may be provided immediately after the capsule pushing means 210. Thereby, for example, when the binder resin 108 is cured by irradiation with ultraviolet rays, the strength of the binder resin 108 can be increased.

  In the pressure bonding means 214, when the protective substrate 116 includes the adhesive layer 114, the first pressure roll 214a and the pair of second pressure rolls 214b are heated to room temperature to 120 ° C. according to the softening temperature of the adhesive layer 114. It is preferable. Accordingly, the adhesive layer 114 can be softened, and the protective substrate 116 can be securely bonded to the microcapsule 106 and the binder resin 108. Moreover, in the case of crimping | bonding, it can crimp reliably by applying the pressure of 0.2-1.0 Mpa between a pair of 2nd crimping | compression-bonding rolls 214b.

In the crimping means 214, the first crimping roll 214a and the second crimping roll 214b are preferably metal rolls having higher thermal conductivity than the resin roll, but the counter substrate 102 or the protective substrate 116 In order to facilitate peeling, the surface may be coated with a resin coat such as silicone.
In the crimping means 214, it is preferable to provide a plurality of pairs of the second crimping rolls 214b because the crimping time can be increased. In that case, it is more preferable to provide a straight line between the pressure-bonding rolls because it is less likely to cause curling or the like.

Finally, operations and effects other than the operations and effects described in the above embodiment will be briefly described below.
According to the above embodiment, since batch processing such as a vacuum process is not performed when manufacturing an electrophoretic particle display device, it can be continuously processed as a roll-shaped substrate. For this reason, an electrophoretic particle display device can be manufactured in a large amount in-line. In addition, the electrophoretic particle display device can be manufactured in large quantities by a small number of workers. Therefore, it is possible to manufacture an electrophoretic particle display device at a lower cost than in the prior art.

Moreover, according to the said embodiment, it can manufacture at low cost compared with the electrophoretic particle display apparatus of a partition structure system.
Further, according to the above-described embodiment, the gap generated between the microcapsules 106 can be removed without increasing the blending ratio of the binder resin 108 (that is, with a small amount of the binder resin 108). Therefore, it is possible to manufacture an electrophoretic particle display device at a lower cost than in the prior art.

Moreover, according to the said embodiment, since it is not divided between each manufacturing process, member loss can be suppressed. Therefore, it is possible to manufacture an electrophoretic particle display device at a lower cost than in the prior art.
Further, according to the above embodiment, when the rolled pixel substrate 118 is used, the electrophoretic particle display device can be manufactured in-line by pressing the pixel substrate 118 in place of the protective substrate 116.
In addition, according to the above embodiment, by using a roll-shaped substrate, it is possible to process up to the crimping process without performing the cutting process of the substrate. Can be reduced.

  102 counter substrate, 104 common electrode, 106 microcapsule, 106a electrophoretic particle, 106b dispersion medium, 108 binder resin, 110 dispersion, 112 gap, 114 adhesive layer, 116 protection substrate, 118 pixel substrate, 120 pixel electrode, 202 Substrate unwinding means, 204 cleaning means, 206 coating means, 206a gravure coat, 208 drying means, 208a low greenhouse, 208b medium greenhouse, 208c high greenhouse, 210 capsule pushing means, 210a pushing roll, 210b heating roll, 212 protective substrate winding Outlet means, 214 pressure bonding means, 214a first pressure roll, 214b second pressure roll, 216 cooling means, 216a cooling roll, 218 winding means, 306 coating means, 306a comma coat, 306b DAIKO

Claims (9)

An application step of applying a dispersion containing a binder resin and microcapsules on a first surface of a substrate provided with electrodes;
Capsule projecting step of drying the dispersion after the coating step and projecting a part of the microcapsule from the upper surface of the binder resin;
A method of manufacturing an electrophoretic particle display device, comprising: a capsule pushing step of pushing the microcapsule toward the electrode and pushing it into the binder resin after the capsule protruding step.   The method for manufacturing an electrophoretic particle display device according to claim 1, wherein the capsule pushing step is performed under atmospheric pressure.   The said capsule pushing process WHEREIN: The said dispersion liquid is heated from the 2nd surface side on the opposite side to the said 1st surface where the said dispersion liquid was apply | coated. Manufacturing method of electrophoretic particle display device.   In the capsule pushing step, the first roll in contact with the first surface and the second roll arranged to face the first roll and in contact with the second surface are pressed while sandwiching the substrate. The method for producing an electrophoretic particle display device according to any one of claims 1 to 3, wherein   The method for manufacturing an electrophoretic particle display device according to any one of claims 1 to 4, wherein the binder resin is a thermoplastic binder resin. An application means for applying a dispersion containing a binder resin and microcapsules on a first surface of a substrate provided with electrodes;
Capsule protruding means for drying the dispersion applied by the applying means, and protruding a part of the microcapsule from the upper surface of the binder resin;
A capsule pushing means for pushing the microcapsule projected from the upper surface of the binder resin by the capsule pushing means to the electrode side and pushing the microcapsule into the binder resin. apparatus.   7. The apparatus for manufacturing an electrophoretic particle display device according to claim 6, wherein the processing by the coating unit, the capsule projecting unit, and the capsule pushing unit is performed in-line.   The said capsule pushing means heats the said dispersion liquid from the 2nd surface side on the opposite side of the said 1st surface where the said dispersion liquid was apply | coated, The Claim 6 or Claim 7 characterized by the above-mentioned. An apparatus for manufacturing an electrophoretic particle display device. The capsule pushing means is
A first roll;
A second roll disposed opposite to the first roll,
The first roll is in contact with the first surface;
The second roll is in contact with the second surface;
The apparatus for manufacturing an electrophoretic particle display device according to any one of claims 6 to 8, wherein the substrate is sandwiched and pressed between the first roll and the second roll.

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