JP2012212556A - Electronic component mounting module and socket for electronic component mounting unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component mounting module which prevents the deterioration of the quality of signals by reducing the transmission loss of the signals flowing between multiple electronic component mounting units.SOLUTION: An electronic component mounting module 1 includes: a socket 70 installed on a mother board 2; and electronic component mounting units 41, 51 connecting with the socket 70. The electronic component mounting units 41, 51 respectively includes wiring boards 10, 50 and electrodes 47, 62 are respectively disposed on substrate rear surfaces 13, 53. The socket 70 includes a first conductive metal component 91 and a second conductive metal component 101. The first conductive metal component 91 electrically connects the electronic component mounting units 41, 51 with the mother board 2, and the second conductive metal component 101 electrically connects the electronic component mounting units 41, 51 with each other.

Description

  The present invention relates to an electronic component mounting module including a socket that can be installed on a mother board and an electronic component mounting unit connected to the socket, and a socket for the electronic component mounting unit.

  In recent years, in the field of electrical products such as personal computers and digital home appliances, and in the field of automobiles, the miniaturization, high functionality, and high added value of products have been increasing. Accordingly, miniaturization and high density of the mother board, which is an important electrical component in this type of product, are desired, and miniaturization of various components mounted on the motherboard is also desired. Examples of such components include an element mounting unit on which a semiconductor integrated circuit element such as an IC chip is mounted, an opto-electric hybrid unit on which an optical element and a semiconductor integrated circuit element for driving an optical element are mounted, and the like. The electronic component mounting unit can be listed. In addition, a technique for electrically connecting these units via a wiring pattern on a mother board has been proposed (for example, see Patent Document 1).

JP 2010-191365 A (FIG. 11 etc.)

  However, the conventional technique described in Patent Document 1 has the following problems. That is, the element mounting unit and the opto-electric hybrid unit described in Patent Document 1 are of a ball grid array (BGA) type in which solder bumps are formed on the surface of a terminal pad in order to achieve reliable mounting with wiring on a motherboard. It has become a unit. However, since the solder bumps are interposed between the element mounting unit and the motherboard, or between the opto-electric hybrid unit and the motherboard, the electric path connecting the element mounting unit and the opto-electric hybrid unit becomes long. End up. In this case, signal quality degradation due to transmission loss becomes a problem in ultra-high-speed signals.

  The present invention has been made in view of the above problems, and a first object thereof is to prevent signal quality deterioration by reducing transmission loss of signals flowing between a plurality of electronic component mounting units. It is to provide an electronic component mounting module that is possible. A second object is to provide an electronic component mounting unit socket capable of suitably mounting the electronic component mounting unit.

  Means for solving the above problems (means 1) is an electronic component mounting module comprising a socket that can be installed on a mother board and an electronic component mounting unit connected to the socket, wherein the electronic component A plurality of mounting units are connected on the socket, have a circuit board main surface and a circuit board back surface, and have a wiring board on which a plurality of electrodes are arranged on the circuit board back surface side. A socket body having a back surface and having a plurality of unit mounting areas on the socket main surface side on which the electronic component mounting unit is mounted, and a plurality of first components electrically connecting the electronic component mounting unit and the mother board to each other An electronic component mounting module comprising: a conductive metal component; and a second conductive metal component that electrically connects the plurality of electronic component mounting units to each other. There is Lumpur.

  Therefore, according to the electronic component mounting module of the means 1, a plurality of electronic component mounting units are connected on the socket that can be installed on the mother board, and the second conductive metal provided in the socket is provided between the plurality of electronic component mounting units. They are electrically connected to each other through components. In this case, since it is not necessary to route the electrical path connecting the plurality of electronic component mounting units to the mother board, the electrical path is shortened. As a result, transmission loss of signals flowing between a plurality of electronic component mounting units is reduced, and signal quality deterioration can be prevented.

  Here, as the wiring board provided in the electronic component mounting unit, for example, a resin wiring board, a ceramic wiring board, a glass wiring board, and a metal wiring board can be used. preferable. If a ceramic wiring board having higher thermal conductivity than the resin wiring board is used, the generated heat is efficiently dissipated. In this case, if an optical element is mounted on the wiring board, the shift of the emission wavelength due to the deterioration of heat dissipation can be avoided, and a wiring board excellent in operational stability and reliability can be realized.

  Preferable examples of such ceramic wiring boards include wiring boards made of alumina, aluminum nitride, silicon nitride, boron nitride, beryllia, mullite, low-temperature fired glass ceramic, glass ceramic and the like. Moreover, as a suitable example of a resin wiring board, the wiring board which consists of EP resin (epoxy resin), PI resin (polyimide resin), BT resin (bismaleide-triazine resin), PPE resin (polyphenylene ether resin) etc. is mentioned, for example. be able to. In addition, a wiring board made of a composite material of these resins and organic fibers such as glass fibers (glass woven fabric or glass nonwoven fabric) or polyamide fibers may be used. Preferable examples of the metal wiring board include a wiring board made of copper, a wiring board made of a copper alloy, a wiring board made of a single metal other than copper, and a wiring board made of an alloy other than copper.

  A plurality of electrodes are disposed on the back side of the wiring board. The wiring board may be a multilayer wiring board formed by laminating a plurality of wiring layers and insulating layers. Furthermore, a through-hole conductor may be formed inside the substrate in order to achieve interlayer connection between these wiring layers. Such electrodes, wiring layers and through-hole conductors are conductive metals made of, for example, gold (Au), silver (Ag), copper (Cu), platinum (Pt), tungsten (W), molybdenum (Mo), etc. It is formed by printing or filling a paste. An electrical signal flows through such electrodes, wiring layers, and through-hole conductors. In addition to such a multilayer wiring board, for example, it is allowed to use a build-up multilayer wiring board having a build-up layer formed by alternately laminating wiring layers and insulating layers on one side or both sides of the core board. The This makes it easy to increase the density of the wiring board.

  Further, the first conductive metal component and the second conductive metal component are formed of, for example, a conductive metal. Although it does not specifically limit as a conductive metal, For example, 1 type, or 2 or more types of metals selected from copper, gold, silver, platinum, palladium, nickel, tin, lead, titanium, tungsten, molybdenum, tantalum, niobium, etc. Can be mentioned. The plurality of first conductive metal parts preferably constitute a power supply wiring and a ground wiring, and the second conductive metal parts preferably constitute a signal wiring. If comprised in this way, the power supply from a motherboard to an electronic component mounting unit will be attained by a 1st conductive metal component. Further, the second conductive metal component enables signal communication between the plurality of electronic component mounting units.

  Further, as the plurality of electrodes, a land grid array (LGA) type constituted only by a plurality of terminal pads formed on the back surface of the substrate, or a plurality of terminal pads and a plurality of terminals formed on the surface of the terminal pads are used. A ball grid array (BGA) type composed of solder bumps, a pin grid array (PGA) type composed of a plurality of terminal pads and a plurality of pins bonded on the surface of the terminal pads, etc. Can be mentioned.

  Here, when a plurality of electrodes are constituted by only a plurality of terminal pads or both a plurality of terminal pads and a plurality of solder bumps, the first conductive metal component and the second conductive metal component are, for example, A configuration is preferred. For example, the first conductive metal component is formed by bending a metal plate, and includes a first fixing portion incorporated in the socket body, a first contact portion that contacts an electrode of the wiring board, a first fixing portion, and a first fixing portion. Preferably, the first contact pin includes a first arm portion that is provided between the contact portions and holds the contact pressure by bending when the electrode contacts the first contact portion. Further, the second conductive metal component is formed by bending a metal plate, and a second fixing portion incorporated in the socket body, and an electrode of a wiring board provided in a specific electronic component mounting unit among the plurality of electronic component mounting units Between the second contact portion that contacts the electrode of the wiring board included in the electronic component mounting unit different from the specific electronic component mounting unit, and the second fixed portion and the second contact portion Provided between the second arm portion, the second fixing portion, and the third contact portion that hold the contact pressure by bending when the electrode contacts the second contact portion, and the electrode is the third contact portion. It is preferable that it is a 2nd contact pin provided with the 3rd arm part which hold | maintains a contact pressure by bending when it contacts. That is, when the first conductive metal component and the second conductive metal component are configured as described above, when connecting the specific electronic component mounting unit and another electronic component mounting unit on the socket, the first contact portion, The contact portion and the third contact portion are in pressure contact with the plurality of electrodes. For this reason, a specific electronic component mounting unit and another electronic component mounting unit can be reliably connected on a socket.

  Of the plurality of electrodes included in the specific electronic component mounting unit, the electrode arranged on the outermost periphery of the back surface of the substrate comes into contact with the second contact portion so as to be able to contact and separate, and another electronic component mounting unit Of the plurality of electrodes provided, the electrode disposed on the outermost periphery of the back surface of the substrate is preferably in contact with the third contact portion so as to be able to contact and separate. In this case, the distance between the second contact portion and the third contact portion can be shortened. Moreover, it is preferable that the distance of a 2nd fixing | fixed part and a socket main surface is smaller than the distance of a 2nd fixing | fixed part and a socket back surface. In this case, the length of the second arm portion provided between the second fixing portion and the second contact portion and the length of the third arm portion provided between the second fixing portion and the third contact portion are short. Become. That is, since the length of each part (second fixing part, second arm part, and third arm part) of the second contact pin is shortened, the electrical path connecting the specific electronic component mounting unit and another electronic component mounting unit. Becomes even shorter. As a result, the transmission loss of a signal flowing between a specific electronic component mounting unit and another electronic component mounting unit is further reduced, so that signal quality deterioration can be more reliably prevented.

  Moreover, it is preferable that the cover which presses a some electrode in the direction which contacts a 1st contact part, a 2nd contact part, and a 3rd contact part is attached with respect to a socket so that attachment or detachment is possible. In this way, since the electronic component mounting unit can be fixed by the cover, it is possible to prevent the electronic component mounting unit from coming off from the socket, and thus a plurality of electrodes from the first contact portion, the second contact portion, and the third contact portion. Can be reliably prevented from separating.

  On the other hand, when a plurality of electrodes are constituted by a plurality of terminal pads and a plurality of pins, it is preferred that the first conductive metal component and the second conductive metal component have the following configuration, for example. For example, it is preferable that the first conductive metal component is a first pin holding sleeve having first contact means in the socket body for holding the pin in contact with the tip of the pin so as to be detachable. In addition, the second conductive metal component is in contact with the tip of the pin of the wiring board included in the specific electronic component mounting unit and is detachably held; and the wiring board included in another electronic component mounting unit. It is preferable that the second pin holding sleeve has third contact means in contact with the tip end portion of the pin and detachably held in the socket body. That is, when the first conductive metal component and the second conductive metal component are configured as described above, when connecting the specific electronic component mounting unit and another electronic component mounting unit on the socket, the first contact means, The contact means and the third contact means are in contact with the plurality of electrodes. Therefore, also in this case, a specific electronic component mounting unit and another electronic component mounting unit can be reliably connected on the socket.

  Of the plurality of electrodes included in the specific electronic component mounting unit, the electrode disposed on the outermost periphery of the back surface of the substrate comes into contact with the second contact means so as to be able to come into contact with and separate from, and another electronic component mounting unit Of the plurality of electrodes provided, the electrode disposed on the outermost periphery of the back surface of the substrate is preferably in contact with the third contact means so as to be able to contact and separate. The second pin holding sleeve includes a connecting portion that connects the second contact means and the third contact means to each other, the connecting portion is disposed in the socket body, and the distance between the connecting portion and the socket main surface is the connecting portion. It is preferable that the distance is smaller than the distance between the socket and the back of the socket. In this case, the distance between the second contact means and the third contact means, in other words, the length of the connecting portion that connects the second contact means and the third contact means can be shortened. Further, the lengths of the second contact means and the third contact means are shortened. That is, since the length of each part of the second pin holding sleeve (the connecting part, the second contact means, and the third contact means) is shortened, there is an electric path that connects the specific electronic component mounting unit and another electronic component mounting unit. Even shorter. As a result, the transmission loss of a signal flowing between a specific electronic component mounting unit and another electronic component mounting unit is further reduced, so that signal quality deterioration can be more reliably prevented.

  Moreover, it is preferable that the cover which presses a some electrode in the direction which contacts a 1st contact means, a 2nd contact means, and a 3rd contact means is attached with respect to a socket so that attachment or detachment is possible. In this way, since the electronic component mounting unit can be fixed by the cover, it is possible to prevent the electronic component mounting unit from coming off from the socket. As a result, a plurality of electrodes are formed from the first contact means, the second contact means, and the third contact means. Can be reliably prevented from separating.

  The type of the specific electronic component mounting unit and another electronic component mounting unit is not particularly limited. For example, the specific electronic component mounting unit is an element mounting unit in which a semiconductor integrated circuit element is mounted on the substrate main surface. Another electronic component mounting unit is an opto-electric hybrid unit in which an optical element having at least one of a light emitting part and a light receiving part and a semiconductor integrated circuit element for driving the optical element are mounted on the main surface of the substrate. It is preferable. In this case, the semiconductor integrated circuit element and the semiconductor integrated circuit element for driving the optical element can be electrically connected to each other through the second conductive metal component. As a result, a circuit connecting the semiconductor integrated circuit element and the semiconductor integrated circuit element for driving the optical element can be easily formed. Further, as described above, the second conductive metal component shortens the electrical path connecting the plurality of electronic component mounting units, and therefore, an increase in the inductance component of the electrical path is prevented. Accordingly, since noise entering between the semiconductor integrated circuit element and the semiconductor integrated circuit element for driving the optical element can be suppressed to a very small level, high reliability can be obtained without causing malfunction such as malfunction. The “semiconductor integrated circuit element” refers to an element mainly used as a microprocessor of a computer.

  Here, one or two or more optical elements are mounted on a wiring board included in the opto-electric hybrid unit. As the mounting method, for example, a method such as wire bonding or flip chip bonding, a method using an anisotropic conductive material, or the like can be employed. In addition, as an optical element (namely, light emitting element) which has a light emission part, for example, a light emitting diode (Light Emitting Diode; LED), a semiconductor laser diode (Laser Diode; LD), a surface emitting laser (Vertical Cavity Surface Emitting Laser; VCSEL) Etc. These light emitting elements have a function of converting an inputted electric signal into an optical signal and then emitting the optical signal from a light emitting portion toward a predetermined portion. On the other hand, examples of the optical element having a light receiving portion (that is, a light receiving element) include a pin photodiode (pin PD) and an avalanche photodiode (APD). These light receiving elements have a function of causing an optical signal to be incident on the light receiving unit, converting the incident optical signal into an electric signal, and outputting the electric signal. The optical element may be a light emitting / receiving element having both a light emitting unit and a light receiving unit. The light emitting / receiving element may have a plurality of light emitting / receiving units. Furthermore, in this case, the light emitting / receiving units may be arranged in a line or may be arranged in a plurality of lines. Such a light emitting / receiving element is operated by an operation circuit. Specifically, the operation circuit for the light emitting element is called, for example, a driver IC, and the operation circuit for the light receiving element is called, for example, an amplifier or a transimpedance amplifier (TIA). The optical element and the operation circuit are electrically connected through, for example, a wiring layer formed on the wiring board. Examples of suitable materials used for the optical element include Si, Ge, InGaAs, GaAsP, AlGaAs, and InP.

  In the element mounting unit and the opto-electric hybrid unit, the substrate main surface of the wiring board has a substantially rectangular shape in plan view, and the area of the substrate main surface on the element mounting unit side is the area of the substrate main surface on the opto-electric hybrid unit side. The element mounting unit and the opto-electric hybrid unit are disposed adjacent to each other via the guide member, and the end surface of the wiring board included in the element mounting unit and the wiring substrate included in the opto-electric hybrid unit It is preferable that the end surfaces are arranged in parallel to each other. In this way, since the element mounting unit and the opto-electric hybrid unit are arranged close to each other, the size of the socket on which the element mounting unit and the opto-electric hybrid unit are mounted can be reduced. Miniaturization can be achieved. In addition, the element mounting unit and the opto-electric hybrid unit are disposed adjacent to each other, and the end surface of the wiring board included in the element mounting unit and the end surface of the wiring substrate included in the opto-electric hybrid unit are disposed in parallel to each other. It is possible to further shorten the electrical path connecting the mounting unit and the opto-electric hybrid unit. As a result, the transmission loss of the signal flowing between the element mounting unit and the opto-electric hybrid unit is further reduced, so that signal quality deterioration can be more reliably prevented.

  The opto-electric hybrid unit includes an optical connector connected to the tip of an optical transmission medium serving as an optical path through which the optical signal propagates, and a plurality of opto-electric hybrid units are arranged adjacent to each other around the element mounting unit. The plurality of opto-electric hybrid units preferably have different extending directions of the optical transmission medium with respect to the optical connector. In this case, since a plurality of opto-electric hybrid units are arranged adjacent to each other around the element mounting unit, the electronic component mounting module can be reduced in size even if there are a plurality of opto-electric hybrid units. . In addition, since the extension direction of the optical transmission medium with respect to the optical connector is different for each opto-electric hybrid unit, interference between the optical transmission media can be prevented.

  Examples of the optical transmission medium include an optical waveguide and an optical fiber. The optical connector is originally a means for connecting optical transmission media to each other, but here, it is used as a means for connecting the optical transmission medium side and the opto-electric hybrid unit side. Such an optical connector may be a single-fiber optical connector or a multi-fiber optical connector.

  Another means (means 2) for solving the above problems is a socket that can be installed on a mother board and on which an electronic component mounting unit is detachably mounted. A socket body having a plurality of unit mounting areas on the socket main surface side on which the electronic component mounting unit is mounted, and a plurality of first conductive metal components that electrically connect the electronic component mounting unit and the mother board to each other There is a socket for an electronic component mounting unit comprising a second conductive metal component that electrically connects the electronic component mounting units to each other.

  Therefore, according to the electronic component mounting unit socket of the means 2, by mounting the electronic component mounting unit in the unit mounting area, the plurality of electronic component mounting units are electrically connected to each other via the second conductive metal component. Is done. In this case, the electrical path is shortened because it is not necessary to route the electrical path connecting the plurality of electronic component mounting units to the mother board on which the socket is installed. As a result, transmission loss of signals flowing between a plurality of electronic component mounting units is reduced, and signal quality deterioration can be prevented.

The schematic perspective view which shows the electronic component mounting module of 1st Embodiment. Similarly, the schematic top view which shows the positional relationship of a socket, an element mounting unit, and an opto-electric hybrid unit. Similarly, schematic sectional drawing which shows an electronic component mounting module. Similarly, principal part sectional drawing which shows an electronic component mounting module. Similarly, the schematic perspective view which shows the relationship between a socket and a 1st contact pin. Similarly, the schematic perspective view which shows the relationship between an element mounting unit, an opto-electric hybrid unit, and a 2nd contact pin. Similarly, the schematic top view which shows the positional relationship of an element mounting unit, an opto-electric hybrid unit, a 1st contact pin, and a 2nd contact pin. The principal part sectional drawing which shows the electronic component mounting module of 2nd Embodiment. The principal part sectional drawing which shows the relationship between the pin and pin holding sleeve in other embodiment. The principal part sectional drawing which shows the relationship between the pin and pin holding sleeve in other embodiment.

[First Embodiment]
Hereinafter, an electronic component mounting module 1 according to a first embodiment embodying the present invention will be described in detail with reference to the drawings. The dimensions, material, number of channels, and the like are not limited to the present embodiment, and can be changed as appropriate.

  As shown in FIGS. 1 to 4, an electronic component mounting module 1 according to the present embodiment includes a motherboard 2 (mother board) and an electronic component mounting unit socket (hereinafter referred to as “socket”) 70 installed on the motherboard 2. 1 element mounting unit 41 detachably mounted on the socket 70, two opto-electric hybrid units 51 mounted detachably on the socket 70, and the like.

  The mother board 2 of the present embodiment is a plate-like member that has a top surface 3 and a bottom surface 4 and has a substantially rectangular shape in plan view. The mother board 2 includes a resin insulating layer (not shown) and a metal conductor layer (not shown). The resin insulating layer is, for example, about 30 μm in thickness, and is made of various insulating sheets such as a resin-resin composite material obtained by impregnating continuous porous PTFE with an epoxy resin, and an epoxy resin containing a filler such as silica particles. Become. Through holes (not shown) for internal conduction penetrating in the thickness direction of the resin insulation layer are formed at a plurality of locations in the resin insulation layer. These through-hole portions serve to electrically connect metal conductor layers having different layers. A pad 5 is disposed at a position on the upper surface 3 of the mother board 2 where there is an upper end surface of each through-hole portion.

  As shown in FIGS. 2 to 4, the element mounting unit 41 includes a wiring board 10. The wiring substrate 10 has a substantially rectangular plate shape having one substrate main surface 12 (upper surface in FIG. 4), one substrate rear surface 13 (lower surface in FIG. 4), and four end surfaces 11. The substrate main surface 12 and the substrate back surface 13 have a substantially rectangular shape in plan view of 50.0 mm length × 50.0 mm width. Further, the wiring board 10 has a substantially rectangular plate-shaped core substrate 14 made of glass epoxy, and has a first buildup layer 31 on the front surface (upper surface in FIG. 4), and on the rear surface (lower surface in FIG. 4). 2 is a build-up multilayer wiring board having a second build-up layer 32.

  As shown in FIG. 4, through-hole conductors 17 that penetrate the core substrate 14 in the thickness direction are formed at a plurality of locations on the core substrate 14. The inside of the through-hole conductor 17 is filled with a closing body 18 such as an epoxy resin. A lid-like conductor 19 made of a copper plating layer is formed in the opening of the through-hole conductor 17, and as a result, the through-hole conductor 17 is closed.

  The second buildup layer 32 has a structure in which two metal wiring layers 42 made of copper and two resin insulation layers 34 made of a thermosetting resin (for example, epoxy resin) are alternately laminated. . Inner layer connection via conductors 44 connected to the metal wiring layer 42 are formed at a plurality of locations in each resin insulating layer 34. In addition, terminal pads 47 which are electrodes electrically connected to the metal wiring layer 42 are arranged in an array at a plurality of positions on the lower surface of the second resin insulating layer 34. Further, the lower surface of the second resin insulating layer 34 is almost entirely covered with a solder resist 36. An opening 48 for exposing the terminal pad 47 is formed at a predetermined position of the solder resist 36. The element mounting unit 41 (wiring board 10) of this embodiment is a land grid array (LGA) type electronic component mounting unit in which no pins are attached to the terminal pads 47.

  As shown in FIG. 4, the first buildup layer 31 includes two metal wiring layers 42 made of copper and two resin insulation layers 33 made of a thermosetting resin (for example, epoxy resin) alternately. It has a laminated structure. Inner layer connection via conductors 43 connected to the metal wiring layer 42 are formed at a plurality of locations in each resin insulating layer 33. In addition, CPU connection terminals 45 that are electrically connected to the metal wiring layer 42 through the inner layer connection via conductors 43 are formed in an array at a plurality of locations on the surface of the second resin insulation layer 33. Yes. Further, the surface of the resin insulating layer 33 is almost entirely covered with the solder resist 35. An opening 46 for exposing the CPU connection terminal 45 is formed at a predetermined position of the solder resist 35. A plurality of solder bumps 49 are arranged on the surface of the CPU connection terminal 45.

  As shown in FIG. 4, each solder bump 49 is electrically connected to a surface connection terminal 22 of an IC chip 21 (CPU) that is a semiconductor integrated circuit element. The IC chip 21 having a function as an MPU has a rectangular plate shape, and circuit elements (not shown) are formed on the lower surface layer. Further, the substrate main surface 12 side of the wiring substrate 10 is covered with a metal lid 110.

  As shown in FIGS. 2 to 4, each of the opto-electric hybrid units 51 includes a wiring board 50. The wiring substrate 50 has a substantially rectangular plate shape having one substrate main surface 52 (upper surface in FIG. 4), one substrate back surface 53 (lower surface in FIG. 4), and four end surfaces 65. The substrate main surface 52 and the substrate back surface 53 have a substantially rectangular shape in plan view of 10.0 mm long × 40.0 mm wide. The areas of the substrate main surface 12 and the substrate back surface 13 on the element mounting unit 41 side are set larger than the areas of the substrate main surface 52 and the substrate back surface 53 on the opto-electric hybrid unit 51 side. In addition, through hole conductors 54 penetrating the substrate main surface 52 and the substrate back surface 53 are formed at a plurality of locations on the wiring substrate 50. The inside of the through-hole conductor 54 is filled with a closing body 55 such as an epoxy resin.

  As shown in FIG. 4, terminal pads 62, which are electrodes electrically connected to the through-hole conductors 54, are formed in an array at a plurality of locations on the substrate back surface 53 of the wiring substrate 50. Further, the substrate back surface 53 of the wiring substrate 50 is almost entirely covered with the solder resist 63. An opening 64 for exposing the terminal pad 62 is formed at a predetermined location of the solder resist 63. The opto-electric hybrid unit 51 (wiring board 50) of the present embodiment is a land grid array (LGA) type electronic component mounting unit in which no pins are attached to the terminal pads 62.

  A plurality of driver IC connection terminals 56 and a plurality of optical element connection terminals 57 that are electrically connected to the through-hole conductors 54 are formed on the board main surface 52 of the wiring board 50. Furthermore, a wiring pattern 58 that connects each driver IC connection terminal 56 and each optical element connection terminal 57 is formed on the substrate main surface 52 of the wiring substrate 50. Further, the substrate main surface 52 of the wiring substrate 50 is almost entirely covered with the solder resist 59. An opening 60 for exposing the driver IC connection terminal 56 and the optical element connection terminal 57 is formed at a predetermined position of the solder resist 59. Solder bumps 61 are disposed on the surfaces of the driver IC connection terminal 56 and the optical element connection terminal 57, respectively.

  As shown in FIG. 4, each solder bump 61 disposed on the surface of the optical element connection terminal 57 has a VCSEL 24, which is a kind of optical element (light emitting element), with the light emitting surface facing upward. It is joined with. The VCSEL 24 of the present embodiment has a substantially rectangular flat plate shape, and has a plurality of light emitting units 25 arranged in a line along the longitudinal direction of the VCSEL 24 in the light emitting surface. These light emitting sections 25 emit laser light (optical signals) having a predetermined wavelength in a direction orthogonal to the substrate main surface 52 of the wiring substrate 50 (that is, upward direction in FIG. 4). Further, the plurality of terminals 26 included in the VCSEL 24 are joined to the solder bumps 61, respectively.

  As shown in FIG. 4, a driver IC 27, which is a semiconductor integrated circuit element for driving the VCSEL 24, is joined to each solder bump 61 disposed on the surface of the driver IC connection terminal 56. The driver IC 27 of the present embodiment has a substantially rectangular flat plate shape, and circuit elements (not shown) are formed on the lower surface layer. The plurality of terminals 28 of the driver IC 27 are bonded to the solder bumps 61, respectively. Accordingly, the driver IC 27 and the VCSEL 24 are electrically connected via the wiring pattern 58 or the like.

  As shown in FIGS. 2 to 4, an optical connector 81 having a substantially rectangular flat plate shape is joined to the substrate main surface 52 side of the wiring substrate 50. The optical connector 81 is formed with an accommodation hole 84 for accommodating the VCSEL 24 and the driver IC 27, and an optical fiber fitting groove 85 is formed on the inner bottom surface (upper surface) of the accommodation hole 84. In the optical fiber fitting groove 85, the tips of four optical fibers 86 (optical transmission media) serving as optical paths through which an optical signal propagates are fitted. The optical connector 81 includes an optical path conversion unit 87 that converts the path of light propagating in the optical path. The optical path conversion unit 87 is an inclined surface having an angle of about 45 ° with respect to the inner bottom surface (upper surface) of the optical fiber fitting groove 85, and the inclined surface is a thin film made of a metal capable of totally reflecting light. Is deposited. As a result, an optical path changing unit 87 that reflects light at an angle of 90 ° is configured. Instead of fitting the optical fiber 86 into the optical fiber fitting groove 85, a multi-channel optical waveguide having a 45 ° inclined surface may be used. In this case, if the other of the inclined surfaces is air, light can be reflected at an angle of 90 ° without depositing a metal thin film, and therefore the presence or absence of the thin film can be selected as appropriate.

  Also in the opto-electric hybrid unit (not shown) connected to the opto-electric hybrid unit 51 shown in FIG. 4 via the optical fiber 86, a plurality of solder bumps 61 are formed on the substrate main surface 52 of the wiring substrate 50. Has been. A photodiode which is a kind of optical element (light receiving element) is joined to each solder bump 61 with the light receiving surface facing upward. The photodiode of this embodiment has a substantially rectangular flat plate shape, and has a plurality of light receiving portions (not shown) arranged in a line along the longitudinal direction of the photodiode in the light receiving surface. Therefore, these light receiving parts are configured to easily receive laser light (optical signal) from the upper side to the lower side.

  A receiver IC, which is a semiconductor integrated circuit element that amplifies the photocurrent output from the photodiode, is disposed in the vicinity of the photodiode on the substrate main surface 52 of the wiring substrate 50. The receiver IC of the present embodiment has a substantially rectangular flat plate shape, and circuit elements (not shown) are formed on the lower surface layer. A plurality of terminals (not shown) of the receiver IC are joined to the solder bumps 61, respectively. Therefore, the photodiode and the receiver IC are electrically connected via a wiring pattern (not shown).

  As shown in FIGS. 2 to 4, the socket main body 71 constituting the socket 70 has one socket main surface 72 (upper surface in FIG. 3), one socket rear surface 73 (lower surface in FIG. 3), and It has a substantially rectangular plate shape with four socket side surfaces 74. The socket back surface 73 is located opposite to the socket main surface 72 in the thickness direction of the socket body 71. The socket side surface 74 is orthogonal to the socket main surface 72 and the socket back surface 73.

  Further, the socket body 71 is provided with a housing recess 75 having a substantially rectangular shape in plan view that opens at the socket main surface 72. A first unit mounting area 79 (see FIG. 2) in which the element mounting unit 41 is mounted is set at one place on the bottom surface 76 of the housing recess 75, and a second unit mounting in which the opto-electric hybrid unit 51 is mounted. Two areas 80 are set.

  As shown in FIG. 2, two opto-electric hybrid units 51 are arranged adjacent to each other around the element mounting unit 41. Specifically, the two end faces 11 (in FIG. 2, the end faces 11 positioned on the right side and the lower side of the element mounting unit 41) provided in the element mounting unit 41 (wiring board 10) are respectively connected to the opto-electric hybrid unit 51 (wiring board). 50). In addition, the end surface 11 and the end surface 65 that are arranged to face each other are arranged in parallel to each other. An optical fiber 86 extends toward the outside of the socket body 71 from both the opto-electric hybrid unit 51. Therefore, the extending direction of the optical fiber 86 with respect to the optical connector 81 is different for each opto-electric hybrid unit 51.

  Further, the element mounting unit 41 and the opto-electric hybrid unit 51 are arranged adjacent to each other via a plurality of guide members 6 and 7 having a block shape. The guide members 6 and 7 of the present embodiment have rectangular step portions (not shown) in plan view set so that a part (corner portion) of the upper surface is lowered. The guide member 6 is configured to lock and fix the wiring substrate 10 by engaging the stepped portion with the lower end portion of the wiring substrate 10. More specifically, the wiring board 10 is supported by the four guide members 6 from the substrate back surface 13 side. In one guide member 6 (a member that supports the upper left portion of the wiring board 10 in FIG. 2), two adjacent side surfaces come into contact with the inner wall surface of the housing recess 75, and the two guide members 6 (FIG. 2). Then, in the member that supports the upper right portion and the lower left portion of the wiring board 10, one side surface is in contact with the inner wall surface of the housing recess 75. For this reason, two of the four end surfaces 11 included in the wiring substrate 10 are arranged in parallel with the inner wall surface of the housing recess 75. Further, the guide member 7 is configured to lock and fix the wiring substrate 50 by engaging the stepped portion with the lower end portion of the wiring substrate 50. More specifically, each wiring board 50 is supported by the two guide members 7 from the board rear surface 53 side. Each of the guide members 7 has one side surface in contact with the inner wall surface of the housing recess 75. For this reason, one of the four end faces 65 included in the wiring board 50 is arranged in parallel with the inner wall surface of the housing recess 75.

  As shown in FIGS. 4 and 5, the socket body 71 is opened only by the plurality of first holes 77 penetrating the bottom surface 76 of the housing recess 75 and the socket back surface 73 and the bottom surface 76 of the housing recess 75. A plurality of second holes 78 are provided. Further, the socket body 71 is provided with a plurality of slits 90 (see FIG. 7) for communicating the pair of second holes 78.

  A plurality of first contact pins 91 (first conductive metal parts) are press-fitted into each first hole 77. The first contact pin 91 is formed by bending a punched metal plate, and includes a first fixing portion 92, a first contact portion 93, a first arm portion 94, and a connection portion 95. The first fixing portion 92 is incorporated and fixed in the socket body 71. More specifically, the first fixing portion 92 has a strip shape extending along the thickness direction of the socket body 71, and has an upper notch 98 and a lower notch 99 on both sides. The first fixing portion 92 is fixed to the socket main body 71 by pressing a region where the upper notch portion 98 and the lower notch portion 99 are provided on both side edges against the inner wall surface of the first hole portion 77. It has become. The first contact portion 93 has a C-shaped cross section that is curved so that the center protrudes upward, and the terminal pad 47 of the wiring board 10 (element mounting unit 41) or the wiring board 50 (photoelectric / electrical mounting unit 51). The terminal pad 62 is detachably contacted. The first arm portion 94 is provided between the first fixing portion 92 and the first contact portion 93. The lower portion of the first arm portion 94 extends along the thickness direction of the socket main body 71, and the region where the upper notch portion 98 is provided in the first fixing portion 92 via the connecting portion 100. It is connected. The upper portion of the first arm portion 94 extends obliquely upward from the vicinity of the opening of the first hole 77 and is connected to the first contact portion 93. When the terminal pad 47 or the terminal pad 62 comes into contact with the first contact portion 93, the first arm portion 94 holds the contact pressure by bending downward (to the first fixing portion 92 side). . The connection portion 95 has a rectangular plate shape and is disposed below the first fixing portion 92 so as to be orthogonal to the first fixing portion 92. A solder bump 96 having a substantially hemispherical shape is disposed on the lower surface of the connection portion 95. The solder bump 96 is connected to the pad 5 on the mother board 2 side. In addition, a spring portion 97 is provided between the first fixing portion 92 and the connection portion 95. The spring portion 97 has a band plate shape narrower than the first fixing portion 92, extends downward from the center of the lower end of the first fixing portion 92, and has a tip connected to the connecting portion 95.

  Accordingly, as shown in FIGS. 3 to 5, in the first contact pin 91, the first contact portion 93 contacts the terminal pad 47 and the connection portion 95 is connected to the pad 5 via the solder bump 96. Thus, the element mounting unit 41 and the mother board 2 are electrically connected to each other. Further, the first contact pin 91 has the first contact portion 93 in contact with the terminal pad 62 and the connection portion 95 is connected to the pad 5 through the solder bump 96 so that the opto-electric hybrid unit 51 and the mother board 2 are connected. Are electrically connected to each other. In the present embodiment, most of each first contact pin 91 constitutes a power supply wiring, and a part of each of the plurality of first contact pins 91 constitutes a ground wiring.

  As shown in FIGS. 4 and 6, a part of the plurality of second contact pins 101 (second conductive metal parts) is press-fitted into each second hole 78. The second contact pin 101 is formed by bending a punched metal plate, and includes a second fixing portion 102, a second contact portion 103, a third contact portion 104, a second arm portion 105, and a third arm portion. 106 is provided. The second fixing portion 102 is incorporated and fixed in the socket body 71. More specifically, the second fixing portion 102 includes a pair of fixing plates 107 and 108 having a strip shape extending along the thickness direction of the socket body 71, and a strip-shaped connecting plate 109 for connecting the two fixing plates 107 and 108 to each other. It is made up of. Both fixing plates 107 and 108 have an upper notch 121 and a lower notch 122, respectively. Both the fixing plates 107 and 108 are fixed to the socket body 71 by pressing the regions where the upper notch 121 and the lower notch 122 are not provided on both side edges to the inner wall surface of the second hole 78. It has become. The connecting plate 109 connects the region where the lower notch 122 is provided on the fixed plate 107 and the region where the upper notch 121 is not provided on the fixed plate 108. The connecting plate 109 is disposed in the socket body 71, and the lower end edge is pressed against the bottom surface of the slit 90, and the front surface (front surface in FIG. 4) and the back surface are pressed against the inner wall surface of the slit 90. 71 is fixed. In the present embodiment, the distance between the connecting plate 109 and the socket main surface 72 is larger than the distance between the connecting plate 109 and the socket back surface 73.

  As shown in FIGS. 4 and 6, the second contact portion 103 has a C-shaped cross section curved so that the center protrudes upward, and a plurality of terminal pads provided on the wiring board 10 (element mounting unit 41). 47, the terminal pad 47 disposed on the outermost periphery of the back surface 13 of the substrate is brought into contact with the terminal pad 47 so as to be able to contact and separate. The element mounting unit 41 is a specific electronic component mounting unit selected from a plurality of electronic component mounting units. The second arm unit 105 is provided between the second fixing unit 102 and the second contact unit 103. The lower portion of the second arm portion 105 extends along the thickness direction of the socket body 71 and is connected to a region where the upper notch portion 121 is provided on the fixing plate 107 via a connecting portion 123. ing. The upper portion of the second arm portion 105 extends obliquely upward from the vicinity of the opening of the second hole portion 78 and is connected to the second contact portion 103. When the terminal pad 47 comes into contact with the second contact portion 103, the second arm portion 105 is configured to hold the contact pressure by bending downward (to the second fixed portion 102 side).

  As shown in FIGS. 4 and 6, the third contact portion 104 has a C-shaped cross section that is curved so that the center protrudes upward, and includes a plurality of wiring boards 50 (the opto-electric hybrid unit 51). Of the terminal pads 62, the terminal pads 62 arranged on the outermost periphery of the back surface 53 of the substrate are brought into contact with each other so as to be able to contact and separate. The opto-electric hybrid unit 51 is an electronic component mounting unit different from the element mounting unit 41. In addition, the third arm portion 106 is provided between the second fixing portion 102 and the third contact portion 104. The lower part of the third arm portion 106 extends along the thickness direction of the socket main body 71 and is connected to a region where the upper notch portion 121 is provided on the fixing plate 108 via a connecting portion 123. ing. The upper portion of the third arm portion 106 extends obliquely upward from the vicinity of the opening of the second hole 78 and is connected to the third contact portion 104. When the terminal pad 62 contacts the third contact portion 104, the third arm portion 106 is configured to hold the contact pressure by bending downward (to the second fixing portion 102 side).

  Therefore, as shown in FIGS. 3, 4, and 6, the second contact pin 101 has the second contact portion 103 in contact with the terminal pad 47 and the third contact portion 104 in contact with the terminal pad 62. Thus, the element mounting unit 41 and the opto-electric hybrid unit 51 are electrically connected to each other. Therefore, the IC chip 21 mounted on the element mounting unit 41 and the driver IC 27 mounted on the opto-electric hybrid unit 51 are electrically connected to each other via the second contact pins 101. In the present embodiment, all of the second contact pins 101 constitute a signal wiring.

  As shown in FIG. 7, in the first contact pin 91, the direction in which the first contact portion 93 and the first arm portion 94 extend is an angle θ <b> 1 (in this embodiment, with respect to the arrangement direction of the first contact pins 91. 20 ° or more and 60 ° or less). Similarly, in the second contact pin 101, the direction in which the second contact portion 103 and the second arm portion 105 extend, and the direction in which the third contact portion 104 and the third arm portion 106 extend are determined by the arrangement direction of the second contact pins 101. It is inclined by an angle θ2 (20 ° or more and 60 ° or less in this embodiment) with respect to (a direction orthogonal to the direction in which the connecting plate 109 extends). In this case, the first arm portion 94, the second arm portion 105, and the third arm portion 106 can be formed long while preventing contact with the adjacent contact pins 91 and 101, so that the elastic displacement amount is sufficient. Become.

  As shown in FIGS. 4 and 7, the first contact portion 93 and the first arm portion 94 of the first contact pin 91 located on the element mounting unit 41 side are the second contact portion 103 of the second contact pin 101. The second arm portion 105 and the third contact portion 104 and the third arm portion 106 of the second contact pin 101 extend in the same direction. On the other hand, the first contact portion 93 and the first arm portion 94 of the first contact pin 91 located on the opto-electric hybrid unit 51 side are the first contact portion 93 and the first contact portion 93 of the first contact pin 91 located on the element mounting unit 41 side. The first arm portion 94, the contact portions 103 and 104 of the second contact pin 101, and the arm portions 105 and 106 extend in the opposite direction. A first contact pin 91 in which the first contact portion 93 and the first arm portion 94 extend in the same direction as the contact portions 103 and 104 and the arm portions 105 and 106, and the first contact portion 93 and the first arm portion 94 in the contact portion 103. , 104 and the arm portions 105, 106 have the same number of first contact pins 91 extending in the opposite direction.

  1 and 3, a cover 111 is detachably attached to the socket 70 (and the mother board 2). Specifically, a plurality of fixing members 115 are attached to the side plate portion 114 of the cover 111. Each fixing member 115 has an L-shaped cross section and has a screw hole 116. Each fixing member 115 is placed on the upper surface 3 of the mother board 2 and the mother board 2 and the holding plate 117 are inserted into the screw holes 116 with the holding plate 117 disposed on the lower surface 4 side of the mother board 2. The cover 111 is fixed to the mother board 2 by screwing the tip of the penetrating screw 118 to the nut 119. Further, the top plate portion 112 of the cover 111 is provided with an opening hole 113 for exposing the metal lid 110. Therefore, when the cover 111 is attached to the socket 70, the metal lid 110 is positioned in the opening hole 113, and the board main surface 12 of the wiring board 10 and the upper surface 88 of the optical connector 81 are in contact with the inner surface of the cover 111. It comes to touch. Further, the cover 111 presses the plurality of terminal pads 47 included in the element mounting unit 41 in a direction in which the terminal pads 47 are brought into contact with the first contact portion 93 of the first contact pin 91 and the second contact portion 103 of the second contact pin 101. It has become. Similarly, the cover 111 presses the plurality of terminal pads 62 included in the opto-electric hybrid unit 51 in a direction to contact the first contact portion 93 of the first contact pin 91 and the third contact portion 104 of the second contact pin 101. It is supposed to be.

  A general operation of the electronic component mounting module 1 configured as described above will be briefly described.

  The VCSEL 24 and the photodiode become operable by supplying power via the metal conductor layer of the motherboard 2, the first contact pins 91 of the socket 70, the terminal pads 62 of the wiring board 50, and the like. When an electrical signal is output from the driver IC 27 on the wiring board 50 to the VCSEL 24, the VCSEL 24 converts the input electrical signal into an optical signal (laser light), and then converts the optical signal into an optical path conversion unit 87 in the optical connector 81. The light is emitted from the light emitting unit 25 toward. The laser light emitted from the light emitting unit 25 enters the optical path conversion unit 87, and the laser light incident on the optical path conversion unit 87 changes the traveling direction by 90 °. For this reason, the laser light passes through the optical fiber 86 and enters the optical path conversion unit 87 of another wiring substrate 50 and further enters the light receiving unit of the photodiode. The photodiode converts the received laser beam into an electrical signal and outputs the converted electrical signal to the receiver IC.

  Next, a method for manufacturing the electronic component mounting module 1 having the above configuration will be described.

  First, the socket 70 is prepared and prepared in advance. The socket main body 71 constituting the socket 70 is manufactured as follows, for example. First, a first mold (not shown) and a second mold (not shown) are combined to form a cavity having the same shape and the same volume as the socket body 71 inside. In this state, the socket main body 71 is molded by cooling the liquid crystal polymer having thermoplasticity in the cavity after heating. Thereafter, when the first mold and the second mold are separated from each other, the molded socket body 71 is taken out.

  Next, a method for attaching the first contact pin 91 and the second contact pin 101 to the socket body 71 will be described.

  First, the first contact pin 91 and the second contact pin 101 are formed by bending a punched metal plate and prepared in advance. Next, the first contact pin 91 and the second contact pin 101 are attached to the socket body 71 using a conventionally known automatic assembly apparatus (not shown). More specifically, the socket main body 71 is fixed to a socket support base provided in the automatic assembly apparatus, and the first contact pin 91 and the second contact pin 101 are loaded into an insertion machine provided in the automatic assembly apparatus. Then, the insertion machine is moved above the first hole 77 to press-fit the first fixing portion 92 of the first contact pin 91 into the first hole 77. Further, the insertion machine is moved above the pair of second holes 78 and the slit 90 to press-fit the fixing plates 107 and 108 of the second contact pin 101 into the second holes 78 respectively. The connecting plate 109 is inserted into the slit 90. In this embodiment, the insertion machine is moved and the contact pins 91 and 101 are repeatedly inserted. Thereafter, when the solder bump 96 is formed on the connecting portion 95 of each inserted first contact pin 91, the socket 70 shown in FIG. 4 is completed.

  Further, each solder bump 96 is reflowed in a state where the solder bump 96 of the socket 70 is in close contact with the upper surface 3 of the mother board 2. As a result, the solder bump 96 and the pad 5 of the mother board 2 are joined, and the socket 70 is soldered to the mother board 2.

  Then, the element mounting unit 41 and the opto-electric hybrid unit 51 are installed on the socket 70. As a result, the first contact portion 93 of the first contact pin 91 comes into contact with the terminal pad 47 and the connection portion 95 of the first contact pin 91 is connected to the pad 5 via the solder bump 96, thereby mounting the element. The unit 41 and the mother board 2 are electrically connected to each other. Further, the first contact portion 93 contacts the terminal pad 62 and the connection portion 95 is connected to the pad 5 via the solder bump 96, so that the opto-electric hybrid unit 51 and the mother board 2 are electrically connected to each other. Is done. Furthermore, when the second contact portion 103 of the second contact pin 101 contacts the terminal pad 47 and the third contact portion 104 of the second contact pin 101 contacts the terminal pad 62, the device mounting unit 41 and the photoelectric device are connected. The mixed unit 51 is electrically connected to each other. As described above, the electronic component mounting module 1 of the present embodiment shown in FIG. 1 is completed.

  Therefore, according to the present embodiment, the following effects can be obtained.

  (1) In the electronic component mounting module 1 of the present embodiment, the element mounting unit 41 and the opto-electric hybrid unit 51 are connected to the socket 70, and the space between the element mounting unit 41 and the opto-electric hybrid unit 51 is provided to the socket 70. The second contact pins 101 are electrically connected to each other. In this case, the electrical path is shortened because the electrical path connecting the element mounting unit 41 and the opto-electric hybrid unit 51 does not have to be routed to the mother board 2. As a result, the transmission loss of the signal flowing between the element mounting unit 41 and the opto-electric hybrid unit 51 is reduced, so that signal quality deterioration can be prevented.

  (2) When the element mounting unit 41 and the opto-electric hybrid unit 51 are connected to the socket 70, the contact portions 93 and 103 slide on the terminal pad 47, and the contact portions 93 and 104 are on the terminal pad 62. Therefore, a force in the horizontal direction acts on the element mounting unit 41 and the opto-electric hybrid unit 51. However, in this case, sinking of the element mounting unit 41 and the opto-electric hybrid unit 51 is hindered, or a portion where the element mounting unit 41 and the opto-electric hybrid unit 51 are pressed is shaved on the inner wall surface of the housing recess 75. Such problems will occur.

  Therefore, in the present embodiment, the first contact portion 93 and the first arm portion 94 of the first contact pin 91 located on the element mounting unit 41 side, and the first contact pin 91 located on the opto-electric hybrid unit 51 side. The contact portion 93 and the first arm portion 94 are set so as to extend in directions opposite to each other. Moreover, the same number of first contact pins 91 located on the element mounting unit 41 side and the first contact pins 91 located on the opto-electric hybrid unit 51 side exist. As a result, the force received from the first contact portion 93 of the first contact pin 91 located on the element mounting unit 41 side and the force received from the first contact portion 93 of the first contact pin 91 located on the opto-electric hybrid unit 51 side. Are offset, so the above-mentioned problems can be solved.

[Second Embodiment]
Hereinafter, a second embodiment of the present invention will be described with reference to the drawings. Here, it demonstrates centering on the part which is different from 1st Embodiment, and abbreviate | omits description instead of attaching | subjecting the same member number about a common part.

  In the present embodiment, the structure of the electrodes of the wiring board is different from that of the first embodiment. More specifically, as shown in FIG. 8, in the element mounting unit 141 included in the electronic component mounting module 131 of this embodiment, the terminal pads 147 (electrodes) are arranged in an array on the substrate rear surface 143 side of the wiring substrate 142. Has been. Further, pins 148 (electrodes) are joined to the surface of the terminal pad 147 by soldering. The element mounting unit 141 (wiring board 142) of this embodiment is a pin grid array (PGA) type electronic component mounting unit in which pins 148 are attached to terminal pads 147.

  Similarly, in the opto-electric hybrid unit 151 included in the electronic component mounting module 131 described above, the terminal pads 162 (electrodes) are arranged in an array on the substrate back surface 153 side of the wiring substrate 152. Furthermore, pins 163 (electrodes) are joined to the surface of the terminal pads 162 by soldering. The opto-electric hybrid unit 151 (wiring board 152) of the present embodiment is a pin grid array (PGA) type electronic component mounting unit in which pins 163 are attached to terminal pads 162.

  In this embodiment, the structure of the socket is different from that of the first embodiment. Specifically, as shown in FIG. 8, the socket 170 of this embodiment includes a socket body 171, and a first pin holding sleeve 191 (first conductive sleeve 191) is provided in the first hole 177 provided in the socket body 171. Metal parts) are press-fitted. The first pin holding sleeve 191 is formed by bending a punched metal plate, and includes a first fixing portion 192, a first contact means 193, and a connecting portion 194. The first fixing portion 192 has a substantially rectangular plate shape extending along the thickness direction of the socket body 171. The first fixing portion 192 is fixed to the socket main body 171 when both side edges are pressed against the inner wall surface of the first hole portion 177. The first contact means 193 is connected in a state where the upper portion has a hook shape and the lower portion is orthogonal to the first fixing portion 192. Further, the first contact means 193 comes into contact with the front end of the pin 148 of the wiring board 142 (element mounting unit 141) or the front end of the pin 163 of the wiring board 152 (photoelectric mixed unit 151) from the side. It has become. At this time, the tips of the pins 148 and 163 are sandwiched between the first contact means 193 and the inner wall surface of the first hole 177, and the first contact means 193 is bent laterally (in a direction away from the pins 148 and 163). As a result, the contact pressure is maintained, so that the pins 148 and 163 are detachably held. The connecting portion 194 has a rectangular plate shape, and is disposed below the first fixing portion 192 so as to be orthogonal to the first fixing portion 192. Solder bumps 96 are disposed on the lower surface of the connecting portion 194. Further, a spring portion 195 is provided between the first fixing portion 192 and the connection portion 194. The spring portion 195 has a band plate shape narrower than the first fixing portion 192, extends downward from the center of the lower end of the first fixing portion 192, and has a tip connected to the connecting portion 194.

  Therefore, as shown in FIG. 8, the first pin holding sleeve 191 is configured such that the first contact means 193 contacts the pin 148 and the connection portion 194 is connected to the pad 5 via the solder bump 96. The element mounting unit 141 and the mother board 2 are electrically connected to each other. In addition, the first pin holding sleeve 191 is configured such that the first contact means 193 contacts the pin 163 and the connecting portion 194 is connected to the pad 5 via the solder bump 96, so that the opto-electric hybrid unit 151 and the motherboard 2 are connected. Are electrically connected to each other.

  A part of the second pin holding sleeve 201 (second conductive metal part) is press-fitted into the second hole 178 provided in the socket body 171. The second pin holding sleeve 201 is formed by bending a stamped metal plate, and includes a second fixing portion 202, a third fixing portion 203, a second contact means 204, and a third contact means 205. . The second fixing part 202 and the third fixing part 203 have a substantially rectangular plate shape extending along the thickness direction of the socket body 171. The second fixing portion 202 and the third fixing portion 203 are fixed to the socket body 171 by the side edges positioned on the opposite sides being pressed against the inner wall surface of the second hole portion 178, respectively.

  As shown in FIG. 8, the second contact means 204 has an upper portion having a hook shape and a lower portion connected to the second fixing portion 202 in a state of being orthogonal. Further, the second contact means 204 comes in contact with the tip of the pin 148 disposed on the outermost periphery of the back surface 143 of the plurality of pins 148 provided in the wiring board 142 (element mounting unit 141) from the side. It has become. At this time, the tip end portion of the pin 148 is sandwiched between the second contact means 204 and the inner wall surface of the second hole portion 178, and the second contact means 204 comes into contact by bending sideways (in a direction away from the pin 148). Since the pressure is maintained, the pin 148 is detachably held.

  In addition, the third contact means 205 is connected in a state where the upper portion has a hook shape and the lower portion is orthogonal to the third fixing portion 203. Further, the third contact means 205 comes in contact with the tip of the pin 163 disposed on the outermost periphery of the substrate back surface 153 from the side among the plurality of pins 163 included in the wiring board 152 (the opto-electric hybrid unit 151). It has become. At this time, the tip portion of the pin 163 is sandwiched between the third contact means 205 and the inner wall surface of the second hole portion 178, and the third contact means 205 is contacted by bending sideways (in a direction away from the pin 163). Since the pressure is maintained, the pin 163 is detachably held.

  As shown in FIG. 8, the second pin holding sleeve 201 includes a connecting portion 209 that connects the second fixing portion 202 (second contact means 204) and the third fixing portion 203 (third contact means 205) to each other. I have. Note that a notch portion 206 is formed at a connection portion between the connecting portion 209 and the third fixing portion 203. The connecting portion 209 is disposed in the socket main body 171, and the lower end edge is pressed against the bottom surface of the slit 90, and the front surface (front surface in FIG. 8) and the back surface are pressed against the inner wall surface of the slit 90. 171 is fixed. In the present embodiment, the distance between the connecting portion 209 and the socket main surface 72 is larger than the distance between the connecting portion 209 and the socket back surface 73.

  Therefore, in the second pin holding sleeve 201, the second contact means 204 contacts the pin 148 and the third contact means 205 contacts the pin 163, thereby electrically connecting the element mounting unit 141 and the opto-electric hybrid unit 151 to each other. Are connected to each other.

  In this embodiment, a cover (not shown) similar to the cover 111 of the first embodiment is detachably attached to the socket 170. The cover of the present embodiment presses the plurality of pins 148 included in the element mounting unit 141 in a direction in which the plurality of pins 148 are brought into contact with the first contact means 193 of the first pin holding sleeve 191 and the second contact means 204 of the second pin holding sleeve 201. It is supposed to be. Similarly, the cover presses the plurality of pins 163 included in the opto-electric hybrid unit 151 in a direction to contact the first contact means 193 of the first pin holding sleeve 191 and the third contact means 205 of the second pin holding sleeve 201. It is supposed to be.

  Therefore, in the electronic component mounting module 131 of the present embodiment, the element mounting unit 141 and the opto-electric hybrid unit 151 are connected on the socket 170, and the space between the element mounting unit 141 and the opto-electric hybrid unit 151 is provided on the socket 170. The second pin holding sleeves 201 are electrically connected to each other. Therefore, in this embodiment as well, as in the first embodiment, the electrical path that connects the element mounting unit 141 and the opto-electric hybrid unit 151 does not have to be routed to the mother board 2, so the electrical path is shortened. As a result, the transmission loss of the signal flowing between the element mounting unit 141 and the opto-electric hybrid unit 151 is reduced, so that signal quality deterioration can be prevented.

  In addition, you may change this embodiment as follows.

  In the element mounting unit 41 of the first embodiment, the plurality of electrodes arranged on the substrate back surface 13 side of the wiring substrate 10 are configured only by the plurality of terminal pads 47. Similarly, also in the opto-electric hybrid unit 51 of the first embodiment, the plurality of electrodes arranged on the substrate back surface 53 side of the wiring substrate 50 are configured only by the plurality of terminal pads 62. That is, the element mounting unit 41 and the opto-electric hybrid unit 51 are land grid array (LGA) type electronic component mounting units.

  However, the element mounting unit 41 may be changed to one in which the plurality of electrodes are constituted by both the plurality of terminal pads 47 and the plurality of solder bumps formed on the surface of the terminal pads 47. Similarly, the opto-electric hybrid unit 51 may be changed to one in which the plurality of electrodes are constituted by both the plurality of terminal pads 62 and the plurality of solder bumps formed on the surface of the terminal pads 62. . That is, the element mounting unit and the opto-electric hybrid unit may be a ball grid array (BGA) type electronic component mounting unit.

  In the first embodiment, the first contact portion 93 and the first arm portion 94 of the first contact pin 91 located on the element mounting unit 41 side, and the first contact pin 91 located on the opto-electric hybrid unit 51 side. The first contact portion 93 and the first arm portion 94 extend in opposite directions. However, the orientations of the first contact portion 93 and the first arm portion 94 can be changed as appropriate. For example, the first contact portion 93 and the first arm portion 94 of the first contact pin 91 located in the area A1 (see FIG. 2) of the first unit mounting area 79, and the area A2 of the first unit mounting area 79 (FIG. 2). The first contact portion 93 and the first arm portion 94 of the first contact pin 91 located in the reference) may extend in directions opposite to each other.

  The shapes of the first pin holding sleeve 191 and the second pin holding sleeve 201 of the second embodiment may be changed to other shapes. For example, the pin holding sleeve 211 shown in FIG. 9 may be used as the first pin holding sleeve or the second pin holding sleeve. The pin holding sleeve 211 includes a pair of contact means 212 (first contact means, second contact means, and third contact means). The both contact means 212 has a hook-like upper portion, and sandwiches the tip portions of the pins 148 and 163. In this case, when the tip portions of the pins 148 and 163 are clamped, the force that presses the pins 148 and 163 acts on the both contact means 212 as the both contact means 212 bends in a direction away from each other. Therefore, the pins 148 and 163 are detachably held.

  Further, the pin holding sleeve 221 shown in FIG. 10 may be used as the first pin holding sleeve or the second pin holding sleeve. The pin holding sleeve 221 includes a cylindrical contact means 222 (first contact means, second contact means, and third contact means). The contact means 222 is press-fitted into a hole 224 provided in the socket body 223, and the tips of the pins 148 and 163 are inserted into the insertion hole 225. In this case, the frictional force acts between the inner wall surface of the insertion hole 225 and the outer peripheral surface of the tip portion of the pins 148 and 163, so that the pins 148 and 163 are detachably held.

  In the first embodiment, the distance between the connecting plate 109 constituting the second fixing portion 102 and the socket main surface 72 is larger than the distance between the connecting plate 109 and the socket back surface 73. However, the distance between the connecting plate 109 and the socket main surface 72 may be smaller than the distance between the connecting plate 109 and the socket back surface 73. According to this configuration, the length of the second arm portion 105 provided between the second fixing portion 102 and the second contact portion 103 and the second length provided between the second fixing portion 102 and the third contact portion 104. The length of the three-arm portion 106 is shortened. That is, since the length of the path formed by the second contact pins 101 is shortened, the electrical path connecting the element mounting unit 41 and the opto-electric hybrid unit 51 is further shortened. As a result, the transmission loss of the signal flowing between the element mounting unit 41 and the opto-electric hybrid unit 51 is further reduced, so that signal quality deterioration can be more reliably prevented.

  Similarly, in the second embodiment, the distance between the connecting portion 209 and the socket main surface 72 is larger than the distance between the connecting portion 209 and the socket back surface 73. However, the distance between the connecting portion 209 and the socket main surface 72 may be smaller than the distance between the connecting portion 209 and the socket back surface 73. In this way, the lengths of the second contact means 204 and the third contact means 205 are shortened. That is, since the length of the path constituted by the second pin holding sleeve 201 is shortened, the electrical path connecting the element mounting unit 141 and the opto-electric hybrid unit 151 is further shortened. As a result, the transmission loss of the signal flowing between the element mounting unit 141 and the opto-electric hybrid unit 151 is further reduced, and in this case as well, signal quality deterioration can be more reliably prevented.

  In the above embodiment, the cover 111 is detachably attached to the socket 70, but the structure of the cover 111 may be changed. For example, the cover may be configured to be openable and closable around a rotation shaft provided on one end side.

  The wiring board 10 of the above embodiment is a multilayer wiring board in which the buildup layers 31 and 32 are formed on the front surface and the back surface of the core substrate 14. However, in recent years, with the increase in the speed of the IC chip 21, the signal frequency used has become a high frequency band. In this case, the wiring (through-hole conductor 17) penetrating through the core substrate 14 contributes as a large inductance, which may lead to transmission loss of high-frequency signals and circuit malfunction, which may hinder speeding up. Therefore, the wiring substrate 10 of the above embodiment may be changed to a multilayer wiring substrate that does not have the core substrate 14 and includes a plurality of resin insulating layers 33 having the same thickness. Since this multilayer wiring board shortens the entire wiring length by omitting the relatively thick core substrate 14, the transmission loss of high-frequency signals is reduced, and the IC chip 21 can be operated at high speed. It becomes.

DESCRIPTION OF SYMBOLS 1,131 ... Electronic component mounting module 2 ... Mother board 6 as mother board 7, 7 ... Guide members 10, 50, 142, 152 ... Wiring board 11 ... End face 12, 52 ... Substrate main surface 13 provided in element mounting unit , 53, 143, 153... Substrate back surface 21... IC chip 24 as semiconductor integrated circuit element... VCSEL as optical element
25... Light emitting section 27... Driver IC as a semiconductor integrated circuit element for driving optical elements
41, 141 ... Element mounting units 47, 62, 147, 162 ... (specific) as electronic component mounting units Terminal pads 51, 151 constituting electrodes (another) Opto-electric hybrid unit 65 as an electronic component mounting unit ... End surfaces 70, 170 of the wiring board provided in the opto-electric hybrid unit ... Socket for electronic component mounting unit (socket)
71, 171, 223 ... Socket body 72 ... Socket main surface 73 ... Socket back surface 79 ... First unit mounting area 80 as unit mounting area ... Second unit mounting area 81 as unit mounting area ... Optical connector 86 ... Optical transmission medium Optical fiber 91 as a first contact pin 92 as a first conductive metal part ... First fixing part 93 ... First contact part 94 ... First arm part 101 ... Second contact pin 102 as a second conductive metal part ... 2nd fixed part 103 ... 2nd contact part 104 ... 3rd contact part 105 ... 2nd arm part 106 ... 3rd arm part 111 ... Cover 148,163 ... Pin 191 which comprises an electrode ... 1st as 1st electroconductive metal components 1-pin holding sleeve 193 ... 1st contact means 201 ... 2nd pin-holding sleeve 204 as 2nd conductive metal component ... 2nd contact means 205 ... 3rd Touch means 209..., Connecting portions 211, 221... First conductive metal parts, second conductive metal parts, first pin holding sleeves and pin holding sleeves 212 and 222 as second pin holding sleeves. First contact means, second contact And contact means as third contact means

Claims (19)

An electronic component mounting module comprising a socket that can be installed on a mother board, and an electronic component mounting unit connected to the socket,
A plurality of the electronic component mounting units are connected on the socket, have a substrate main surface and a substrate back surface, and include a wiring substrate in which a plurality of electrodes are arranged on the substrate back surface side,
The socket is
A socket body having a socket main surface and a socket back surface, the socket main surface side including a plurality of unit mounting areas on which the electronic component mounting unit is mounted;
A plurality of first conductive metal components that electrically connect the electronic component mounting unit and the mother board to each other;
An electronic component mounting module comprising: a second conductive metal component that electrically connects the plurality of electronic component mounting units to each other. The plurality of electrodes includes a plurality of terminal pads formed on the back surface of the substrate, or both the plurality of terminal pads and a plurality of solder bumps formed on the surface of the terminal pads.
The first conductive metal part is formed by bending a metal plate, and includes a first fixing part incorporated in the socket body, a first contact part in contact with an electrode of the wiring board, the first fixing part, A first contact pin provided between the first contact portions, and a first arm portion that holds a contact pressure by bending when the electrode contacts the first contact portion;
The second conductive metal component is formed by bending a metal plate, and the wiring board provided in a specific electronic component mounting unit among the plurality of electronic component mounting units, and a second fixing portion incorporated in the socket body A second contact portion in contact with the electrode, a third contact portion in contact with the electrode of the wiring board provided in an electronic component mounting unit different from the specific electronic component mounting unit, the second fixing portion, and A second arm portion that is provided between the second contact portions and holds the contact pressure by bending when the electrode contacts the second contact portion; the second fixing portion; and the third contact portion. 2. A second contact pin comprising a third arm portion provided between the first arm portion and the third arm portion that holds the contact pressure by bending when the electrode comes into contact with the third contact portion. Electronic component tower Module. Among the plurality of electrodes provided in the specific electronic component mounting unit, the electrode disposed on the outermost periphery of the back surface of the substrate is in contact with the second contact portion so as to be able to contact and separate,
The electrode disposed on the outermost periphery of the back surface of the substrate among the plurality of electrodes included in the other electronic component mounting unit is in contact with the third contact portion so as to be able to contact and separate. 2. The electronic component mounting module according to 2.   4. The electronic component mounting module according to claim 2, wherein a distance between the second fixing portion and the socket main surface is smaller than a distance between the second fixing portion and the socket rear surface.   A cover that presses the plurality of electrodes in a direction in which the plurality of electrodes are brought into contact with the first contact portion, the second contact portion, and the third contact portion is detachably attached to the socket. Item 5. The electronic component mounting module according to any one of Items 2 to 4. The plurality of electrodes includes a plurality of terminal pads formed on the back surface of the substrate, and a plurality of pins bonded on the surface of the terminal pads.
The first conductive metal component is a first pin holding sleeve having first contact means in the socket body that contacts and detachably holds the tip of the pin.
The second conductive metal component is in contact with a tip end portion of the pin of the wiring board included in a specific electronic component mounting unit among the plurality of electronic component mounting units, and is detachably held, and Second pin holding having third contact means in the socket main body for detachably holding in contact with the tip of the pin of the wiring board provided in the electronic component mounting unit different from the specific electronic component mounting unit The electronic component mounting module according to claim 1, wherein the electronic component mounting module is a sleeve. Among the plurality of electrodes provided in the specific electronic component mounting unit, the electrode disposed on the outermost periphery of the back surface of the substrate is in contact with the second contact means so as to be able to contact and separate,
The electrode disposed on the outermost periphery of the back surface of the substrate among the plurality of electrodes included in the other electronic component mounting unit is in contact with the third contact means so as to be able to contact and separate. 6. The electronic component mounting module according to 6. The second pin holding sleeve includes a connecting portion that connects the second contact means and the third contact means,
The said connection part is arrange | positioned in the said socket main body, The distance of the said connection part and the said socket main surface is smaller than the distance of the said connection part and the said socket back surface. Electronic component mounting module.   The cover for pressing the plurality of electrodes in a direction in which the plurality of electrodes are brought into contact with the first contact means, the second contact means, and the third contact means is detachably attached to the socket. Item 9. The electronic component mounting module according to any one of Items 6 to 8. The specific electronic component mounting unit is an element mounting unit in which a semiconductor integrated circuit element is mounted on the substrate main surface,
The another electronic component mounting unit is an opto-electric hybrid unit in which an optical element having at least one of a light emitting part and a light receiving part and a semiconductor integrated circuit element for driving the optical element are mounted on the main surface of the substrate. Yes,
10. The semiconductor integrated circuit device and the semiconductor integrated circuit device for driving an optical device are electrically connected to each other through the second conductive metal component. The electronic component mounting module described in 1. In the element mounting unit and the opto-electric hybrid unit, the substrate main surface of the wiring board has a substantially rectangular shape in plan view, and the area of the substrate main surface on the element mounting unit side is on the opto-electric hybrid unit side. It is set larger than the area of the main surface of the substrate,
The element mounting unit and the opto-electric hybrid unit are disposed adjacent to each other via a guide member,
11. The electronic component mounting module according to claim 10, wherein an end face of the wiring board provided in the element mounting unit and an end face of the wiring board provided in the opto-electric hybrid unit are arranged in parallel to each other. The opto-electric hybrid unit includes an optical connector connected to the tip of an optical transmission medium that becomes an optical path through which an optical signal propagates.
Around the element mounting unit, a plurality of the opto-electric hybrid units are disposed adjacent to each other,
The electronic component mounting module according to claim 10 or 11, wherein the plurality of the opto-electric hybrid units have different extending directions of the optical transmission medium with respect to the optical connector.   2. The plurality of first conductive metal parts constitute a power supply wiring and a ground wiring, and the second conductive metal parts constitute a signal wiring. The electronic component mounting module of any one of thru | or 12. A socket that can be installed on a mother board and on which an electronic component mounting unit is detachably mounted,
A socket body having a socket main surface and a socket back surface, the socket main surface side including a plurality of unit mounting areas on which the electronic component mounting unit is mounted;
A plurality of first conductive metal components that electrically connect the electronic component mounting unit and the mother board to each other;
A socket for an electronic component mounting unit, comprising: a second conductive metal component that electrically connects the plurality of electronic component mounting units to each other. The first conductive metal component is formed by bending a metal plate, and a first fixing portion incorporated in the socket body, a first contact portion that contacts an electrode of a wiring board included in the electronic component mounting unit, A first contact pin provided between the first fixing portion and the first contact portion, and a first arm portion that holds the contact pressure by bending when the electrode contacts the first contact portion. And
The second conductive metal component is formed by bending a metal plate, and the wiring board provided in a specific electronic component mounting unit among the plurality of electronic component mounting units, and a second fixing portion incorporated in the socket body A second contact portion in contact with the electrode, a third contact portion in contact with the electrode of the wiring board provided in an electronic component mounting unit different from the specific electronic component mounting unit, the second fixing portion, and A second arm portion that is provided between the second contact portions and holds the contact pressure by bending when the electrode contacts the second contact portion; the second fixing portion; and the third contact portion. 15. A second contact pin comprising a third arm portion provided between the first arm portion and a third arm portion that holds the contact pressure by bending when the electrode comes into contact with the third contact portion. Electronic components listed For mounting unit socket.   The electronic component mounting unit socket according to claim 15, wherein a distance between the second fixing portion and the socket main surface is smaller than a distance between the second fixing portion and the socket back surface. The first conductive metal component is a first pin holding sleeve having first contact means in the socket body for holding the pin in contact with the tip of the pin constituting the electrode in a detachable manner,
The second conductive metal component is in contact with a tip end portion of the pin of the wiring board included in a specific electronic component mounting unit among the plurality of electronic component mounting units, and is detachably held, and Second pin holding having third contact means in the socket main body for detachably holding in contact with the tip of the pin of the wiring board provided in the electronic component mounting unit different from the specific electronic component mounting unit The electronic component mounting unit socket according to claim 14, wherein the electronic component mounting unit socket is a sleeve. The second pin holding sleeve includes a connecting portion that connects the second contact means and the third contact means,
The electronic component according to claim 17, wherein the connecting part is disposed in the socket body, and a distance between the connecting part and the socket main surface is smaller than a distance between the connecting part and the socket back surface. Socket for mounted unit.   15. The plurality of first conductive metal parts constitute a power supply wiring and a ground wiring, and the second conductive metal parts constitute a signal wiring. The socket for electronic component mounting units of any one of thru | or 18.

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