JP2012195056A - Connector, circuit board unit, circuit board device, and method for manufacturing circuit board device - Google Patents
Connector, circuit board unit, circuit board device, and method for manufacturing circuit board device Download PDFInfo
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- JP2012195056A JP2012195056A JP2011056021A JP2011056021A JP2012195056A JP 2012195056 A JP2012195056 A JP 2012195056A JP 2011056021 A JP2011056021 A JP 2011056021A JP 2011056021 A JP2011056021 A JP 2011056021A JP 2012195056 A JP2012195056 A JP 2012195056A
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- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 238000000034 method Methods 0.000 title description 7
- 238000005476 soldering Methods 0.000 claims description 14
- 229910000679 solder Inorganic materials 0.000 abstract description 50
- 238000012986 modification Methods 0.000 description 20
- 230000004048 modification Effects 0.000 description 20
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000012423 maintenance Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000009545 invasion Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
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- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
本発明は、コネクタ及びそのコネクタを実装した回路基板ユニット、回路基板装置及び回路基板装置の製造方法に関し、特に、２枚の対向する回路基板を複数のピンにより電気接続するためのコネクタ、及びそのコネクタを実装した回路基板ユニット、回路基板装置及び回路基板装置の製造方法に関する。 The present invention relates to a connector, a circuit board unit on which the connector is mounted, a circuit board device, and a method for manufacturing the circuit board device, and in particular, a connector for electrically connecting two opposing circuit boards with a plurality of pins, and the same The present invention relates to a circuit board unit mounted with a connector, a circuit board device, and a method for manufacturing the circuit board device.
ＩＣチップやコネクタ等の電子部品がハンダや接着剤で表面に実装される回路基板において、小型化や狭小化に伴う表面実装の高密度化に対応するために、回路基板の上に電子部品やもう一枚の回路基板を重層的に取り付けることは広く知られている。このような回路基板の製造工程において、回路基板と電子部品（又はもう一枚の回路基板）の間にハンダボールや余分な接着剤が入り込むと、回路基板自体の品質に影響を与えるため、そのような異物を入り込まないようにすることが重要となる。特にハンダボールは、回路基板に電子部品をハンダ付けする際に発生するため、ハンダボールが回路基板や電子部品などの間に入り込んでしまうと、実装後にそのハンダボールを確認するのは難しい。また、実装後にハンダ付けを行った部分の近辺にハンダボールが付着などしていないかどうか検査しやすくすることが重要となる。 In circuit boards on which electronic components such as IC chips and connectors are mounted on the surface with solder or adhesive, electronic components or It is well known to attach another circuit board in multiple layers. In such a circuit board manufacturing process, if a solder ball or extra adhesive enters between the circuit board and the electronic component (or another circuit board), the quality of the circuit board itself is affected. It is important not to enter such foreign matter. In particular, a solder ball is generated when an electronic component is soldered to a circuit board. Therefore, if the solder ball enters between the circuit board and the electronic component, it is difficult to check the solder ball after mounting. In addition, it is important to make it easy to inspect whether or not a solder ball is attached in the vicinity of a portion subjected to soldering after mounting.
例えば、特許文献１では、回路基板に低コストでリワークし易い構造をもたせるため、電子部品と回路基板とを接合した接着部材が塗布された隅で、回路基板と電子部品との間に位置し、接着部材が塗布された隅をＬ字状に囲んで、接着部材が回路基板と電子部品の間に侵入しないように設けられた接着部材侵入防止用部品を有する回路基板が開示されている。 For example, in Patent Document 1, in order to give the circuit board a structure that is easy to rework at low cost, it is located between the circuit board and the electronic component at a corner where an adhesive member that joins the electronic component and the circuit board is applied. A circuit board having an adhesive member intrusion prevention component that surrounds the corner to which the adhesive member is applied in an L shape so that the adhesive member does not enter between the circuit board and the electronic component is disclosed.
また、特許文献２では、端子とランドとの間のハンダ付け状態を容易に検査できるようにするため、コネクタのハウジングと回路基板との間に、端子とランドとの間のハンダ付け部のハンダ付け状態をハウジングの前方から視認可能な隙間を設けた、コネクタと回路基板の実装構造が開示されている。 Further, in Patent Document 2, in order to easily inspect the soldering state between the terminal and the land, the solder of the soldering portion between the terminal and the land is provided between the housing of the connector and the circuit board. A mounting structure of a connector and a circuit board is disclosed in which a gap is provided so that the attached state can be visually recognized from the front of the housing.
そこで、本発明の目的とするところは、２枚の対向する回路基板に挟まれ、この２枚の回路基板を電気的に接続するコネクタにおいて、コネクタを回路基板にハンダ付けする際に発生するハンダボールが、２枚の回路基板の間に侵入することを防ぎ、かつ、コネクタと回路基板とのハンダの結合状態を容易に目視で確認できるコネクタ、及びそのコネクタを実装した回路基板ユニット、回路基板装置及び回路基板装置の製造方法を提供することである。 Accordingly, an object of the present invention is a solder that is generated when soldering a connector to a circuit board in a connector that is sandwiched between two opposing circuit boards and electrically connects the two circuit boards. A connector that prevents a ball from entering between two circuit boards and can easily visually check the soldered state between the connector and the circuit board, and a circuit board unit and circuit board on which the connector is mounted It is to provide a device and a method for manufacturing a circuit board device.
上記課題を解決するために、対向する第一回路基板と第二回路基板との間に配置され、その第一回路基板とその第二回路基板とを電気接続するためのコネクタであって、そのコネクタは、複数のピンと、その複数のピンを保持する保持部と、その保持部と一体成型された壁部と、を備え、そのコネクタは、その第一回路基板の端部に取り付けられ、その壁部は、その保持部の端部側とは逆側に形成され、かつ、その第二回路基板の方へ延在しながら、その複数のピンとその第二回路基板の接合部と所定の間隔をもって形成され、その第二回路基板とその壁部の距離は、その第二回路基板とその保持部の距離より短いコネクタが提供される。
これによれば、２枚の対向する回路基板に挟まれ、この２枚の回路基板を電気的に接続するコネクタにおいて、コネクタを回路基板にハンダ付けする際に発生するハンダボールが、２枚の回路基板の間に侵入することを防ぎ、かつ、コネクタと回路基板とのハンダの結合状態を容易に目視で確認できるコネクタを提供できる。
In order to solve the above problems, a connector is disposed between the first circuit board and the second circuit board facing each other, and electrically connects the first circuit board and the second circuit board. The connector includes a plurality of pins, a holding portion that holds the plurality of pins, and a wall portion that is integrally formed with the holding portion, and the connector is attached to an end portion of the first circuit board, The wall portion is formed on the side opposite to the end portion side of the holding portion, and extends toward the second circuit board, and has a predetermined distance between the plurality of pins and the joint portion of the second circuit board. A connector is provided in which the distance between the second circuit board and the wall is shorter than the distance between the second circuit board and the holding part.
According to this, in a connector that is sandwiched between two opposing circuit boards and electrically connects the two circuit boards, the solder balls that are generated when the connector is soldered to the circuit board have two solder balls. It is possible to provide a connector that can prevent invasion between circuit boards and can easily visually check the solder connection state between the connector and the circuit board.
さらに、その壁部は、その保持部からその第二回路基板に略平行に延在する第一延在部と、その第一延在部からその第二回路基板に略垂直に延在する第二延在部とを備えることを特徴としてもよい。
これによれば、単純な構造を有する壁部により、ハンダボールが２枚の回路基板の間に侵入することを防ぐコネクタを提供できる。
Further, the wall portion includes a first extension portion extending substantially parallel to the second circuit board from the holding portion, and a first extension portion extending substantially perpendicular to the second circuit board from the first extension portion. Two extending portions may be provided.
According to this, it is possible to provide a connector that prevents a solder ball from entering between two circuit boards by a wall portion having a simple structure.
さらに、その壁部は、その第一延在部と第二延在部の間に、略平行と略垂直の中間の角度を有する第三延在部を備えることを特徴としてもよい。
これによれば、自由度の高い構造を有する壁部により、ハンダボールが２枚の回路基板の間に侵入することを防ぐコネクタを提供できる。
Further, the wall portion may include a third extension portion having an intermediate angle between substantially parallel and substantially vertical between the first extension portion and the second extension portion.
According to this, it is possible to provide a connector that prevents a solder ball from entering between two circuit boards by the wall portion having a highly flexible structure.
さらに、その壁部の端面は、その第二回路基板に当接することを特徴としてもよい。
平面精度の高い回路基板に取り付ける場合、これによれば、確実にハンダボールが２枚の回路基板の間に侵入することを防ぐコネクタを提供できる。
Furthermore, the end surface of the wall portion may be in contact with the second circuit board.
When attaching to a circuit board with high planar accuracy, this can provide a connector that reliably prevents solder balls from entering between the two circuit boards.
さらに、その保持部の両端を支持し、その第一回路基板と第二回路基板の間隔を規定する間隔規定部とをさらに有し、その壁部は、２つの間隔規定部の間でその保持部と一体成型されていることを特徴としてもよい。
これによれば、２つの回路基板の間隔を確実に規定でき、壁部が２つの間隔規定部の間で保持部と一体成型されていることにより、さらに確実にハンダボールが２枚の回路基板の間に侵入することを防ぐコネクタを提供できる。
Furthermore, it has both ends of the holding portion, and further includes a space defining portion that defines the distance between the first circuit board and the second circuit board, and the wall portion holds the space between the two space defining portions. It may be characterized by being integrally molded with the part.
According to this, the interval between the two circuit boards can be reliably defined, and the wall portion is integrally formed with the holding portion between the two interval defining portions, so that the solder ball is more reliably formed with two circuit boards. It is possible to provide a connector that prevents intrusion during the operation.
別の観点によれば、上記課題を解決するために、上記のコネクタと第一回路基板を有する回路基板ユニットであって、そのコネクタは、その第一回路基板の端部に備えられ、そのコネクタの壁部は、その端部から遠ざかるように形成されたことを特徴とする回路基板ユニットが提供される。
これによれば、上記コネクタを有する回路基板ユニットであって、この回路基板ユニットを対向する回路基板にハンダ付けする際に発生するハンダボールが、２枚の回路基板の間に侵入することを防ぎ、かつ、コネクタと回路基板とのハンダの結合状態を容易に目視で確認できる回路基板ユニットを提供できる。
According to another aspect, in order to solve the above problems, a circuit board unit having the connector and the first circuit board, the connector being provided at an end of the first circuit board, the connector A circuit board unit is provided in which the wall portion is formed to be away from the end portion thereof.
According to this, it is a circuit board unit having the connector, and prevents a solder ball generated when soldering the circuit board unit to the opposite circuit board from entering between the two circuit boards. And the circuit board unit which can confirm visually the joint state of the solder of a connector and a circuit board visually can be provided.
また、別の観点によれば、上記課題を解決するために、上記の回路基板ユニットが、そのコネクタにより電気接続する第二回路基板に取り付けられた、２枚の対向する回路基板を有する回路基板装置が提供される。
これによれば、上記回路基板ユニットを有する回路基板装置であって、この回路基板ユニットを対向する回路基板にハンダ付けする際に発生するハンダボールが、２枚の回路基板の間に侵入することを防ぎ、かつ、コネクタと回路基板とのハンダの結合状態を容易に目視で確認できることにより、品質の高い回路基板装置を提供できる。
According to another aspect, in order to solve the above-described problem, the circuit board unit includes two opposing circuit boards attached to a second circuit board electrically connected by the connector. An apparatus is provided.
According to this, in the circuit board device having the circuit board unit, a solder ball generated when soldering the circuit board unit to the opposite circuit board enters between the two circuit boards. In addition, it is possible to provide a high-quality circuit board device by easily visually confirming the soldered connection state between the connector and the circuit board.
また、別の観点によれば、上記課題を解決するために、複数のピンを備えるコネクタにより電気接続する、２枚の対向する回路基板を有する回路基板装置の製造方法あって、その複数のピンを保持する保持部と一体成型されて、その保持部から延在する壁部を備えるそのコネクタを、第一回路基板の端部に、その壁部がその端部から遠ざかり、第二回路基板の方へ延在するように取り付け、その複数のピンの一端をその第一回路基板のスルーホールにハンダ付けする工程と、その第一回路基板をその第二回路基板に対向させて、その複数のピンの他端を、第二回路基板のスルーホールにハンダ付けする工程と、を有する製造方法が提供される。
これによれば、回路基板にハンダ付けする際に発生するハンダボールが、２枚の回路基板の間に侵入することを防ぎ、かつ、コネクタと回路基板とのハンダの結合状態を容易に目視で確認できることにより、品質の高い回路基板装置の製造方法を提供できる。
According to another aspect, in order to solve the above problem, there is a method of manufacturing a circuit board device having two opposing circuit boards that are electrically connected by a connector having a plurality of pins, and the plurality of pins The connector having a wall portion that is integrally molded with the holding portion that holds and extends from the holding portion is moved to the end portion of the first circuit board, the wall portion is moved away from the end portion, and the second circuit board And mounting one end of the plurality of pins to the through hole of the first circuit board, the first circuit board facing the second circuit board, and the plurality of pins And soldering the other end of the pin to the through hole of the second circuit board.
According to this, solder balls generated when soldering to the circuit board are prevented from entering between the two circuit boards, and the connection state of the solder between the connector and the circuit board can be easily visually checked. By being able to confirm, a manufacturing method of a high-quality circuit board device can be provided.
以上説明したように、本発明によれば、２枚の対向する回路基板に挟まれ、この２枚の回路基板を電気的に接続するコネクタにおいて、コネクタを回路基板にハンダ付けする際に発生するハンダボールが、２枚の回路基板の間に侵入することを防ぎ、かつ、コネクタと回路基板とのハンダの結合状態を容易に目視で確認できるコネクタ、及びそのコネクタを実装した回路基板ユニット、回路基板装置及び回路基板装置の製造方法を提供することができる。 As described above, according to the present invention, a connector that is sandwiched between two opposing circuit boards and electrically connects the two circuit boards is generated when the connector is soldered to the circuit board. A connector that prevents solder balls from penetrating between two circuit boards, and can easily visually check the soldered state between the connector and the circuit board, and a circuit board unit and circuit on which the connector is mounted A substrate device and a method for manufacturing a circuit board device can be provided.
以下では、図面を参照しながら、本発明に係る各実施例について説明する。
（第一実施例）
図１は、本発明に係る第一実施例におけるコネクタ１ａを示す。なお、保持部と壁部に焦点を当てて説明するため、本図では第一回路基板は図示していない。
Hereinafter, embodiments according to the present invention will be described with reference to the drawings.
(First Example)
FIG. 1 shows a connector 1a according to a first embodiment of the present invention. Note that the first circuit board is not shown in the drawing in order to focus on the holding portion and the wall portion.
コネクタ１ａは、ピン１１ａ、保持部１２ａ、及び壁部１４ａを備える。ピン１１ａは、回路基板を電気接続するための導電性の線材であり、側面視本図（Ａ）においてコネクタ１ａの上下位置に配される回路基板のスルーホール（図示せず）に挿入され、ハンダ付けされる。コネクタ１ａは、複数のピン１１ａを備える。ピン１１ａの本数は、回路基板を電気的に接続するために適宜選択される。また、複数のピン１１ａは一列をなすが、これに限定されず、波形、鉤形、曲形などに形成されてもよい。また、本実施例のように、複数のピン１１ａは等間隔に配されなくともよい。 The connector 1a includes a pin 11a, a holding portion 12a, and a wall portion 14a. The pin 11a is a conductive wire for electrically connecting the circuit board, and is inserted into a through hole (not shown) of the circuit board disposed at the upper and lower positions of the connector 1a in the side view (A). Soldered. The connector 1a includes a plurality of pins 11a. The number of pins 11a is appropriately selected in order to electrically connect the circuit board. Moreover, although the several pin 11a makes a row, it is not limited to this, You may form in a waveform, a saddle shape, a curved shape. Further, as in the present embodiment, the plurality of pins 11a need not be arranged at equal intervals.
保持部１２ａは、複数のピン１１ａを保持する。保持部１２ａは、側面視で長方形をなし、また、斜視図（Ｂ）に示すように、側面視長方形と同じ形状を以って奥行きをなし、全体として直方体をなしている。後述するように、形態は様々なものが考えられ、特に限定されない。材質は、一般に成型の容易性から非導電性の樹脂等であるが、非導電性である限り特に限定されない。 The holding part 12a holds a plurality of pins 11a. The holding part 12a has a rectangular shape in a side view, and as shown in a perspective view (B), has the same shape as the rectangular shape in a side view, and has a rectangular parallelepiped shape as a whole. As will be described later, various forms are possible and are not particularly limited. The material is generally a non-conductive resin or the like for ease of molding, but is not particularly limited as long as it is non-conductive.
壁部１４ａは、側面視で長方形をなし、また、斜視図（Ｂ）に示すように、側面視長方形と同じ形状を以って奥行きをなし、全体として直方体をなしている。また、壁部１４ａは、保持部１２ａの長手方向に同じ長さに亘って、保持部１２ａと一体成型されている。従って、通常材質は保持部１２ａと同じだが、特に限定されない。 The wall portion 14a has a rectangular shape when viewed from the side, and as shown in a perspective view (B), has the same shape as the rectangular shape when viewed from the side, and has a rectangular parallelepiped shape as a whole. The wall portion 14a is integrally formed with the holding portion 12a over the same length in the longitudinal direction of the holding portion 12a. Therefore, the normal material is the same as that of the holding portion 12a, but is not particularly limited.
保持部１２ａは、保持部１２ａの上面及び下面に対して垂直にピン１１ａを保持するが、後述するように、これに限定されない。保持部１２ａと壁部１４ａは、壁部１４ａのピン１１ａ側の面が保持部１２ａの上面とほぼ垂直をなし、壁部１４ａのピン１１ａと反対側の面が保持部１２ａの側面がひとつの面となるように、一体成型されている。後述するように、これに限定されない。 The holding portion 12a holds the pin 11a perpendicular to the upper surface and the lower surface of the holding portion 12a, but is not limited thereto as will be described later. In the holding portion 12a and the wall portion 14a, the surface of the wall portion 14a on the pin 11a side is substantially perpendicular to the upper surface of the holding portion 12a, and the opposite surface of the wall portion 14a to the pin 11a is the side surface of the holding portion 12a. It is integrally molded so that it becomes a surface. As will be described later, the present invention is not limited to this.
本図（Ｃ）は、コネクタ１ａを第二回路基板２２ａに取り付けた時の斜視図である。壁部１４ａの端面１６ａは、第二回路基板２２ａに当接してもよいし、第二回路基板２２ａとの間に隙間があってもよい。例えば、第二回路基板２２ａが反りなどのない平面精度の高い回路基板である場合、端面１６ａは第二回路基板２２ａに当接すると、ハンダボールの侵入を確実に防ぐことができる。また、第二回路基板２２ａに反りなどがあることが想定される回路基板である場合、ハンダボールが侵入しない程度のわずかな隙間がある方が取り付け容易となる。 This figure (C) is a perspective view when the connector 1a is attached to the second circuit board 22a. The end surface 16a of the wall portion 14a may abut against the second circuit board 22a, or there may be a gap between the second circuit board 22a. For example, in the case where the second circuit board 22a is a circuit board with high planar accuracy without warping, the solder balls can be reliably prevented from entering when the end face 16a contacts the second circuit board 22a. Further, when the circuit board is assumed to be warped in the second circuit board 22a, it is easier to attach if there is a slight gap that does not allow solder balls to enter.
本図（Ｃ）に示すように、複数のピン１１ａは、第二回路基板２２ａとハンダ５１ａでハンダ付けされる。このハンダ付けの際に、ハンダボールが散乱する場合がある。しかし、たとえハンダボールが散乱したとしても、壁部１４ａがその散乱するハンダボールを壁部１４ａの後方に散乱することを防止することができる。逆に言えば、本発明における保持部と壁部の形態は、ピンと第二回路基板のハンダ付けによる接合部から散乱するハンダボールを、壁部の後ろ側に散乱することを防止することができる形態すべてである。以下に、本実施例における保持部と壁部の形態の変形例を説明する。 As shown in this figure (C), the plurality of pins 11a are soldered by the second circuit board 22a and the solder 51a. During this soldering, solder balls may be scattered. However, even if the solder balls are scattered, it is possible to prevent the wall 14a from scattering the scattered solder balls to the rear of the wall 14a. In other words, the form of the holding portion and the wall portion in the present invention can prevent the solder ball scattered from the joint portion by soldering the pin and the second circuit board from being scattered to the rear side of the wall portion. All forms. Below, the modification of the form of the holding | maintenance part and wall part in a present Example is demonstrated.
図２は、変形例１を示す。なお、保持部と壁部に焦点を当てて説明するため、本図では間隔規定部や回路基板は図示していない。これは、以下、図６まで同様である。また、図１に示される実施例との異なる部分のみを説明する。 FIG. 2 shows a first modification. In addition, in order to explain focusing on the holding portion and the wall portion, the interval defining portion and the circuit board are not shown in the drawing. The same applies to FIG. 6 below. Only the parts different from the embodiment shown in FIG. 1 will be described.
コネクタ１ｂは、ピン１１ｂ、保持部１２ｂ、及び壁部１４ｂを備える。上記実施例との違いは、上記実施例では壁部１４ａが保持部１２ａの片側に一つのみ形成されていたが、当変形例では壁部１４ｂが保持部１２ｂの上下両側に２つ形成されている点である。これにより、片側の回路基板の接合部からのハンダボールの散乱だけでなく、両側の回路基板の接合部からのハンダボールの散乱を防止することができる。 The connector 1b includes a pin 11b, a holding portion 12b, and a wall portion 14b. The difference from the above embodiment is that, in the above embodiment, only one wall portion 14a is formed on one side of the holding portion 12a, but in this modification, two wall portions 14b are formed on both upper and lower sides of the holding portion 12b. It is a point. Thereby, not only the scattering of the solder ball from the joint portion of the circuit board on one side but also the scattering of the solder ball from the joint portion of the circuit board on both sides can be prevented.
図３は、変形例２を示す。コネクタ１ｃは、ピン１１ｃ、保持部１２ｃ、及び壁部１４ｃを備える。保持部１２ｃは、側面視でほぼ正方形をなし、また、斜視図（Ｂ）に示すように、側面視正方形と同じ形状を以って奥行きをなし、全体として直方体をなしている。壁部１４ｃは、側面視で鉤形をなし、また、斜視図（Ｂ）に示すように、側面視鉤形と同じ形状を以って奥行きをなし、保持部１２ｃの長手方向に同じ長さに亘って、保持部１２ｃと一体成型されている。 FIG. 3 shows a second modification. The connector 1c includes a pin 11c, a holding portion 12c, and a wall portion 14c. The holding portion 12c has a substantially square shape when viewed from the side, and as shown in a perspective view (B), the holding portion 12c has the same shape as the square when viewed from the side, and has a rectangular parallelepiped shape as a whole. The wall portion 14c has a bowl shape in a side view, and as shown in a perspective view (B), has the same shape as the side view bowl shape and a depth, and has the same length in the longitudinal direction of the holding portion 12c. It is integrally molded with the holding part 12c.
即ち、壁部１４ｃは、保持部１２ｃから側面視でほぼ垂直に延在する第一延在部１７ｃと、第一延在部１７ｃから側面視でほぼ垂直に上方に、即ち第二回路基板（図示せず）の方へ延在する第二延在部１８ｃとを備える。また、コネクタ１ｃが保持部１２ｃの上面に対してほぼ平行に第二回路基板に取り付けられることを鑑みれば、換言すれば、壁部１４ｃは、保持部１２ｃから第二回路基板にほぼ平行に延在する第一延在部１７ｃと、第一延在部１７ｃから第二回路基板にほぼ垂直に第二回路基板の方へ延在する第二延在部１８ｃとを備える。 That is, the wall portion 14c extends from the holding portion 12c substantially vertically in a side view and from the first extension portion 17c in a substantially vertical upward direction, that is, a second circuit board ( (Not shown) and a second extending portion 18c extending toward the direction. In view of the fact that the connector 1c is attached to the second circuit board substantially parallel to the upper surface of the holding part 12c, in other words, the wall part 14c extends substantially parallel to the second circuit board from the holding part 12c. A first extending portion 17c, and a second extending portion 18c extending from the first extending portion 17c toward the second circuit board substantially perpendicularly to the second circuit board.
図４は、変形例３を示す。コネクタ１ｄは、ピン１１ｄ、保持部１２ｄ、及び壁部１４ｄを備える。保持部１２ｄは、側面視でほぼ正方形をなし、また、斜視図（Ｂ）に示すように、側面視正方形と同じ形状を以って奥行きをなし、全体として直方体をなしている。壁部１４ｄは、側面視で台形をなし、また、斜視図（Ｂ）に示すように、側面視台形と同じ形状を以って奥行きをなし、保持部１２ｄの長手方向に同じ長さに亘って、保持部１２ｄと一体成型されている。 FIG. 4 shows a third modification. The connector 1d includes a pin 11d, a holding portion 12d, and a wall portion 14d. The holding portion 12d has a substantially square shape when viewed from the side, and as shown in a perspective view (B), the holding portion 12d has the same shape as the square when viewed from the side, and has a rectangular parallelepiped shape as a whole. The wall portion 14d has a trapezoidal shape when viewed from the side, and as shown in a perspective view (B), has the same shape as the trapezoidal shape when viewed from the side, and has the same length in the longitudinal direction of the holding portion 12d. Thus, it is integrally formed with the holding portion 12d.
上記変形例との違いは、上記変形例では、壁部のピン側の面がピンとほぼ平行又は保持部の上面とほぼ垂直であるが、当変形例では壁部のピン側の面がピンと平行ではない又は保持部の上面と垂直ではないで点である。保持部と壁部の構造において、このような形態であっても、ピンと第二回路基板の接合部から散乱するハンダボールを、壁部の後ろ側に散乱することを防止することができる。 The difference from the above modification is that, in the above modification, the surface on the pin side of the wall portion is substantially parallel to the pin or substantially perpendicular to the upper surface of the holding portion, but in this modification, the surface on the pin side of the wall portion is parallel to the pin. The point is not or not perpendicular to the upper surface of the holding part. Even in such a form in the structure of the holding portion and the wall portion, it is possible to prevent the solder balls scattered from the joint portion between the pin and the second circuit board from being scattered to the rear side of the wall portion.
図５は、変形例４を示す。コネクタ１ｅは、ピン１１ｅ、保持部１２ｅ、及び壁部１４ｅを備える。保持部１２ｅは、側面視でほぼ長方形をなし、また、斜視図（Ｂ）に示すように、側面視長方形と同じ形状を以って奥行きをなし、全体として直方体をなしている。壁部１４ｅは、側面視で長方形と扇型が結合した形をなし、また、斜視図（Ｂ）に示すように、その形と同じ形状を以って奥行きをなし、保持部１２ｅの長手方向に同じ長さに亘って、保持部１２ｅと一体成型されている。 FIG. 5 shows a fourth modification. The connector 1e includes a pin 11e, a holding portion 12e, and a wall portion 14e. The holding part 12e is substantially rectangular in a side view, and as shown in a perspective view (B), the holding part 12e has the same shape as the rectangular in a side view and has a rectangular parallelepiped shape as a whole. The wall portion 14e has a shape in which a rectangle and a fan shape are combined in a side view, and as shown in a perspective view (B), the wall portion 14e has the same shape as that of the shape and has a depth, and the longitudinal direction of the holding portion 12e. Are integrally formed with the holding portion 12e over the same length.
上記変形例との違いは、上記変形例では、壁部は平面により形成されていたが、当変形例では壁部の一部が曲面により形成されている点である。即ち、壁部１４ｅは、変形例２における第一延在部１７ｅと第二延在部１８ｅの間に、第二回路基板に平行でも垂直でもない中間の角度を有する第三延在部１９ｅとを備える。保持部と壁部の構造において、このような形態であっても、ピンと第二回路基板の接合部から散乱するハンダボールを、壁部の後ろ側に散乱することを防止することができる。 The difference from the above modification is that, in the above modification, the wall portion is formed by a flat surface, but in this modification, a part of the wall portion is formed by a curved surface. That is, the wall portion 14e includes a third extending portion 19e having an intermediate angle between the first extending portion 17e and the second extending portion 18e in Modification 2 and neither parallel nor perpendicular to the second circuit board. Is provided. Even in such a form in the structure of the holding portion and the wall portion, it is possible to prevent the solder balls scattered from the joint portion between the pin and the second circuit board from being scattered to the rear side of the wall portion.
図６は、変形例５を示す。コネクタ１ｆは、ピン１１ｆ、保持部１２ｆ、及び壁部１４ｆを備える。保持部１２ｆは、側面視で長方形ではない多角形をなし、また、斜視図（Ｂ）に示すように、この多角形と同じ形状を以って奥行きをなした形態をなしている。壁部１４ｆは、側面視で長方形ではない多角形をなし、また、斜視図（Ｂ）に示すように、その多角形と同じ形状を以って奥行きをなし、保持部１２ｆの長手方向に同じ長さに亘って、保持部１２ｆと一体成型されている。上記変形例との違いは、上記変形例では、保持部の上面と壁部の端面は、保持部の下面と平行だったが、当変形例では保持部１２ｆの上面と壁部１４ｆの端面１６ｆは第二回路基板とは平行ではない点である。 FIG. 6 shows a fifth modification. The connector 1f includes a pin 11f, a holding portion 12f, and a wall portion 14f. The holding part 12f has a polygonal shape that is not rectangular in a side view, and has a depth that is the same shape as the polygonal shape as shown in the perspective view (B). The wall portion 14f is a polygon that is not rectangular in a side view, and as shown in the perspective view (B), the wall portion 14f has the same shape as the polygon and has the same depth in the longitudinal direction of the holding portion 12f. It is integrally molded with the holding portion 12f over the length. The difference from the modified example is that in the modified example, the upper surface of the holding part and the end surface of the wall part are parallel to the lower surface of the holding part, but in this modified example, the upper surface of the holding part 12f and the end surface 16f of the wall part 14f. Is not parallel to the second circuit board.
即ち、コネクタ１ｆが保持部１２ｆの上面に対してほぼ平行に第二回路基板に取り付けられることを鑑みれば、上記変形例では、第二回路基板とほぼ平行であったが、当変形例では保持部１２ｆの上面と壁部１４ｆの端面１６ｆは第二回路基板とは平行ではない点である。保持部と壁部の構造において、このような形態であっても、端面１６ｆの最も第二回路基板に近い部分と第二回路基板との間にハンダボールが侵入しない程度の隙間がある、又は端面１６ｆの最も第二回路基板に近い部分が第二回路基板に当接する場合には、ピンと第二回路基板の接合部から散乱するハンダボールを、壁部の後ろ側に散乱することを防止することができる。 That is, in view of the fact that the connector 1f is attached to the second circuit board substantially parallel to the upper surface of the holding portion 12f, in the above modification, the connector 1f is substantially parallel to the second circuit board. The upper surface of the portion 12f and the end surface 16f of the wall portion 14f are not parallel to the second circuit board. In the structure of the holding portion and the wall portion, even in such a form, there is a gap that does not allow solder balls to enter between the portion of the end face 16f closest to the second circuit board and the second circuit board, or When the portion of the end face 16f closest to the second circuit board comes into contact with the second circuit board, the solder balls scattered from the joint between the pin and the second circuit board are prevented from scattering to the rear side of the wall. be able to.
（第二実施例）
図７は、本発明に係る第二実施例におけるコネクタ１を示す。コネクタ１は、ピン１１、保持部１２、間隔規定部１３、壁部１４、位置決め部１５を備える。ピン１１は、回路基板を電気接続するための導電性の線材であり、コネクタ１の上下位置に配される回路基板のスルーホール（図示せず）に挿入され、ハンダ付けされる。本実施例では、ピン１１は、保持部の下方において二か所で折れ曲がっている。この折れ曲がっている方が、第一回路基板のスルーホールに挿入され、反対側の折れ曲がっていない方が、第二回路基板のスルーホールに挿入される。
(Second embodiment)
FIG. 7 shows the connector 1 in the second embodiment according to the present invention. The connector 1 includes a pin 11, a holding part 12, a space defining part 13, a wall part 14, and a positioning part 15. The pin 11 is a conductive wire for electrically connecting the circuit board, and is inserted into a through hole (not shown) of the circuit board disposed at the upper and lower positions of the connector 1 and soldered. In this embodiment, the pin 11 is bent at two places below the holding portion. The bent side is inserted into the through hole of the first circuit board, and the non-bent side is inserted into the through hole of the second circuit board.
コネクタ１は、複数のピン１１を備える。ピン１１の本数は、回路基板を電気的に接続するために適宜選択される。また、複数のピン１１は一列をなすが、これに限定されず、波形、鉤形、曲形などに形成されてもよい。また、本実例のように複数のピン１１は等間隔に配されなくともよい。 The connector 1 includes a plurality of pins 11. The number of pins 11 is appropriately selected in order to electrically connect the circuit board. Moreover, although the several pin 11 makes a row, it is not limited to this, You may form in a waveform, a saddle shape, a curved shape. Further, as in this example, the plurality of pins 11 may not be arranged at equal intervals.
保持部１２は、複数のピン１１を保持する。また、保持部１２は、本図（Ｅ）の断面視で長方形をなし、その形と同じ形状を以って長手方向に形成され、全体として直方体をなしている。材質は、一般に成型の容易性から非導電性の樹脂等であるが、非導電性である限り特に限定されない。 The holding unit 12 holds a plurality of pins 11. In addition, the holding portion 12 has a rectangular shape in a cross-sectional view of the figure (E), is formed in the longitudinal direction with the same shape as the shape, and forms a rectangular parallelepiped as a whole. The material is generally a non-conductive resin or the like for ease of molding, but is not particularly limited as long as it is non-conductive.
間隔規定部１３は、保持部１２の長手方向の両端を支持し、コネクタ１が取り付けられる第一回路基板と第二回路基板（図示せず）の間隔を、間隔規定部１３の高さにより規定する。間隔規定部１３は、２つの基板の間隔を規定するために必要な厚みと強度を適宜備える。また、コネクタ１が取り付けられる時に第一回路基板上で転倒しないために必要な、保持部１２長手方向と垂直方向の巾を適宜備える。なお、本実施例では、間隔規定部１３は保持部１２の両端に２つ備えられるが、これに限定されず、例えば、保持部１２の中間にさらに一つ備えてもよい。間隔規定部１３は、保持部１２と一体成型されているので、その材質は保持部１２と通常同じだが、特に限定されない。 The space defining portion 13 supports both ends of the holding portion 12 in the longitudinal direction, and the space between the first circuit board and the second circuit board (not shown) to which the connector 1 is attached is defined by the height of the space defining portion 13. To do. The space | interval definition part 13 is suitably provided with the thickness and intensity | strength required in order to prescribe | regulate the space | interval of two board | substrates. Further, when the connector 1 is attached, a width in a direction perpendicular to the longitudinal direction of the holding portion 12 is provided as appropriate so as not to fall on the first circuit board. In the present embodiment, two interval defining portions 13 are provided at both ends of the holding portion 12, but the present invention is not limited to this, and for example, one more may be provided in the middle of the holding portion 12. Since the interval defining portion 13 is integrally formed with the holding portion 12, the material is usually the same as that of the holding portion 12, but is not particularly limited.
位置決め部１５は、第一回路基板の周辺部に設けられる孔に挿入され、第一回路基板上において、コネクタ１の取付け位置を決めるものである。位置決め部１５は、間隔規定部１３の図示下側（第一回路基板側）に結合し２つ形成されている。位置決め部１５は、間隔規定部１３と一体成型されているので、材質は間隔規定部１３と通常同じだが、特に限定されない。 The positioning portion 15 is inserted into a hole provided in the peripheral portion of the first circuit board, and determines the mounting position of the connector 1 on the first circuit board. Two positioning portions 15 are formed on the lower side (first circuit board side) of the space defining portion 13 in the figure. Since the positioning portion 15 is integrally formed with the interval defining portion 13, the material is usually the same as that of the interval defining portion 13, but is not particularly limited.
壁部１４は、保持部１２の長手方向の両端を支持する２つの間隔規定部１３の間に亘り、保持部１２と一体成型され、形成されている。これにより、コネクタ１を回路基板にハンダ付けする際に発生するハンダボールが、２枚の回路基板の間に侵入することを確実に防ぐことができる。 The wall portion 14 is formed integrally with the holding portion 12 so as to extend between the two interval defining portions 13 that support both ends of the holding portion 12 in the longitudinal direction. Thereby, it is possible to reliably prevent solder balls generated when the connector 1 is soldered to the circuit board from entering between the two circuit boards.
壁部１４は、保持部１２の側面の一方（断面図（Ｅ）において、保持部１２の左側）に、保持部１２の側面にほぼ垂直に突出するように延在する第一延在部１７を備える。コネクタ１が保持部１２の上面に対してほぼ平行に第二回路基板に取り付けられることを鑑みれば、第一延在部１７は、第二回路基板にほぼ平行に延在する。また、壁部１４は、第一延在部１７から第二回路基板に近づくように（断面図（Ｅ）において、上の方）延在する第三延在部１９を備える。また、さらに壁部１４は、第三延在部１９から保持部１２の側面やピン１１と平行になるように、即ち、第二回路基板にほぼ垂直となるように延在する第二延在部１８を備える。そうすると、第三延在部１９は、第一延在部１７と第二延在部１８の間に、保持部１２の側面、第一回路基板及び第二回路基板に平行でもなく垂直でもない中間の角度を以って形成される。 The wall portion 14 extends to one of the side surfaces of the holding portion 12 (on the left side of the holding portion 12 in the sectional view (E)) so as to protrude substantially perpendicularly to the side surface of the holding portion 12. Is provided. Considering that the connector 1 is attached to the second circuit board substantially parallel to the upper surface of the holding part 12, the first extension part 17 extends substantially parallel to the second circuit board. Moreover, the wall part 14 is provided with the 3rd extension part 19 extended so that it may approach a 2nd circuit board from the 1st extension part 17 (upward in sectional drawing (E)). Further, the wall portion 14 extends from the third extension portion 19 so as to be parallel to the side surface of the holding portion 12 and the pin 11, that is, to be substantially perpendicular to the second circuit board. The unit 18 is provided. Then, the third extension portion 19 is intermediate between the first extension portion 17 and the second extension portion 18 and is neither parallel nor perpendicular to the side surface of the holding portion 12, the first circuit board, and the second circuit board. It is formed with the angle of.
壁部１４（第二延在部１８）の端面１６は、保持部１２の側面とほぼ垂直になるように形成され、換言すれば、第二回路基板にほぼ水平になるように形成れている。端面１６は、間隔規定部１３の第二回路基板と当接する部分（断面図（Ｅ）において、間隔規定部１３の上端部）の位置より低い位置に形成されている。これにより、第二回路基板との間に隙間ができ、第二回路基板に反りなどがあっても、容易にコネクタ１を第二回路基板に取り付けることが可能となる。一方、この隙間は、ハンダ付けの際にハンダボールが壁部のピン１１側と反対側に散乱しないように、大きな隙間ではない。 The end surface 16 of the wall portion 14 (second extending portion 18) is formed to be substantially perpendicular to the side surface of the holding portion 12, in other words, to be substantially horizontal to the second circuit board. . The end face 16 is formed at a position lower than the position of the portion that contacts the second circuit board of the interval defining portion 13 (the upper end portion of the interval defining portion 13 in the sectional view (E)). Accordingly, a gap is formed between the second circuit board and the connector 1 can be easily attached to the second circuit board even if the second circuit board is warped. On the other hand, this gap is not a large gap so that the solder balls are not scattered on the side opposite to the pin 11 side of the wall portion during soldering.
図８は、回路基板にハンダ付けされたコネクタ１、コネクタ１を第一回路基板２１にハンダ付けした回路基板ユニット３、及び、回路基板ユニット３がコネクタ１により電気的に接続された第二回路基板２２に取り付けられた回路基板装置４を、断面を以って示す図である。図７と比べ、コネクタ１の上下が入れ替わっている。 FIG. 8 shows a connector 1 soldered to a circuit board, a circuit board unit 3 soldered to the first circuit board 21, and a second circuit in which the circuit board unit 3 is electrically connected by the connector 1. It is a figure which shows the circuit board apparatus 4 attached to the board | substrate 22 with a cross section. Compared with FIG. 7, the top and bottom of the connector 1 are interchanged.
位置決め部１５は、第一回路基板２１の孔に挿入され、第一回路基板２１の所定の位置に配置される。この所定の位置とは、第一回路基板２１の周縁部付近である端部２４である。第一回路基板２１の端面２５を示すが、第一回路基板２１の端部２４とは、より具体的には、本図において示す第一回路基板２１の端面２５から一定の距離内であることを言う。あまり端面２５から離れ、２つの回路基板に挟まれた奥の方に取り付けられると、例えば、図示Ａのような位置から、コネクタと回路基板（特に第二回路基板２２）とのハンダの結合状態を容易に目視で確認することができなくなるからである。従って、第一回路基板２１の端面２５から一定の距離とは、コネクタと回路基板とのハンダの結合状態を容易に目視で確認できる範囲であればよい。この範囲は、２つの回路基板の間の距離、即ち、間隔規定部１３の高さにより変化する。 The positioning unit 15 is inserted into the hole of the first circuit board 21 and is disposed at a predetermined position on the first circuit board 21. This predetermined position is the end 24 that is near the peripheral edge of the first circuit board 21. Although the end face 25 of the first circuit board 21 is shown, the end portion 24 of the first circuit board 21 is more specifically within a certain distance from the end face 25 of the first circuit board 21 shown in the figure. Say. If it is too far away from the end face 25 and attached to the back between the two circuit boards, for example, from the position A in the figure, the connector and the circuit board (especially the second circuit board 22) are connected to the solder. This is because it is not possible to easily confirm this visually. Therefore, the fixed distance from the end face 25 of the first circuit board 21 may be within a range in which the soldered connection state between the connector and the circuit board can be easily visually confirmed. This range varies depending on the distance between the two circuit boards, that is, the height of the interval defining portion 13.
間隔規定部１３の高さは、第一回路基板２１と第二回路基板２２の対向する面の距離を規定する。また、２つの回路基板に挟まれることにより固定された間隔規定部１３は、保持部１２を両側から支持するので、結果的に、保持部１２が保持するピン１１を固定することができる。 The height of the interval defining portion 13 defines the distance between the opposing surfaces of the first circuit board 21 and the second circuit board 22. Moreover, since the space | interval prescription | regulation part 13 fixed by being pinched | interposed into two circuit boards supports the holding | maintenance part 12 from both sides, the pin 11 which the holding | maintenance part 12 hold | maintains as a result can be fixed.
保持部１２により保持されたピン１１の屈曲した側（図で保持部１２の上側）は、第一回路基板２１のスルーホール２３’に挿入され、ハンダ５１’によりハンダ付けされる。後述するように、通常、コネクタ１と第一回路基板２１のハンダ付けは、コネクタ１と第二回路基板２２のハンダ付けより先に行われる。この際、コネクタ１は、壁部１４が保持部１２の端部側とは逆側であって、第二回路基板２２の方へ延在するように、第一回路基板２１に取り付けられる。即ち、壁部１４は、保持部１２から、第一回路基板２１の端面２５から遠ざかるように、換言すれば、第一回路基板２１と第二回路基板２２の間に挟まれた中心領域Ｓの方へ、かつ、第二回路基板２２の方へ近づくように、延在する。 The bent side of the pin 11 held by the holding part 12 (the upper side of the holding part 12 in the figure) is inserted into the through hole 23 ′ of the first circuit board 21 and soldered by the solder 51 ′. As will be described later, the connector 1 and the first circuit board 21 are usually soldered before the connector 1 and the second circuit board 22 are soldered. At this time, the connector 1 is attached to the first circuit board 21 such that the wall portion 14 is opposite to the end portion side of the holding portion 12 and extends toward the second circuit board 22. That is, the wall portion 14 is moved away from the holding portion 12 from the end face 25 of the first circuit board 21, in other words, in the central region S sandwiched between the first circuit board 21 and the second circuit board 22. And so as to approach the second circuit board 22.
また、壁部１４の、第二回路基板２２と最も近い距離にある端面１６は、コネクタ１が第二回路基板２２に取り付けられた時には、第二回路基板２２とわずかな隙間を形成する。この隙間は、ピン１１が第二回路基板２２のスルーホール２３に挿入され、ハンダ５１によりハンダ付けされる際に、その結合部５０からハンダボールが散乱しても侵入しない程度の隙間である。 Further, the end surface 16 of the wall portion 14 that is closest to the second circuit board 22 forms a slight gap with the second circuit board 22 when the connector 1 is attached to the second circuit board 22. This gap is such that when the pins 11 are inserted into the through holes 23 of the second circuit board 22 and soldered by the solder 51, the solder balls are scattered from the coupling portion 50 and do not enter.
この隙間の大きさは、ハンダボールは接合部から一定の角度を以って散乱するので、接合部５０と壁部１４の距離に依存する。即ち、接合部５０と壁部１４の距離が大きければ、この隙間は大きくてもよく、接合部５０と壁部１４の距離が小さければ、この隙間も小さくなる。従って、壁部１４は、接合部５０と所定の間隔を以って形成されることにより、ハンダボールが壁部１４の後ろ側（換言すれば、第一回路基板２１と第二回路基板２２の間に挟まれた中心領域Ｓの方）に散乱することを防止し、かつ、第二回路基板２２に反りなどがあっても、容易にコネクタ１を第二回路基板２２に取り付けることが可能となる。 The size of the gap depends on the distance between the joint portion 50 and the wall portion 14 because the solder balls are scattered from the joint portion at a certain angle. That is, if the distance between the joint 50 and the wall 14 is large, this gap may be large, and if the distance between the joint 50 and the wall 14 is small, this gap is also small. Therefore, the wall portion 14 is formed with a predetermined distance from the joint portion 50, so that the solder balls are behind the wall portion 14 (in other words, the first circuit board 21 and the second circuit board 22). And the connector 1 can be easily attached to the second circuit board 22 even if the second circuit board 22 is warped or the like. Become.
さらに、壁部１４は、保持部１２の側面であって、第一回路基板２１の端部２４と反対側（換言すれば、第一回路基板２１と第二回路基板２２の間に挟まれた中心領域Ｓの方）にほぼ垂直に突出するように延在する第一延在部１７を備えるので、接合部５０を避けるように形成されている。また、保持部１２の接合部５０に対向する面（図示保持部１２の下の面）と第一延在部１７の接合部５０に対向する面は、連続した面を形成している。 Further, the wall portion 14 is a side surface of the holding portion 12 and is opposite to the end portion 24 of the first circuit board 21 (in other words, sandwiched between the first circuit board 21 and the second circuit board 22). Since the first extending portion 17 is provided so as to protrude substantially perpendicularly toward the central region S), the first extending portion 17 is formed so as to avoid the joint portion 50. Further, the surface (the surface below the illustrated holding portion 12) facing the joint portion 50 of the holding portion 12 and the surface facing the joint portion 50 of the first extension portion 17 form a continuous surface.
そして、このような第一延在部１７から、第三延在部１９を経て、第二延在部１８が形成されているので、第二回路基板２２と保持部１２の最短距離は、第二回路基板２２と壁部１４（第二延在部１８又は端面１６）までの最短距離より大きい。逆にいえば、第二回路基板２２と壁部１４の最短距離は、第二回路基板２２と保持部１２の最短距離より短い。このような形態となることにより、第一回路基板２１の端部２４側から目視することにより、容易に接合部５０の結合状態を確認することができ、また、壁部１４により散乱がブロックされたハンダボールがある場合には容易に視認し、取り除くことができる。 And since the 2nd extension part 18 is formed through the 3rd extension part 19 from such a 1st extension part 17, the shortest distance of the 2nd circuit board 22 and the holding part 12 is the 1st. It is larger than the shortest distance between the two circuit boards 22 and the wall part 14 (the second extending part 18 or the end face 16). Conversely, the shortest distance between the second circuit board 22 and the wall part 14 is shorter than the shortest distance between the second circuit board 22 and the holding part 12. With such a configuration, it is possible to easily confirm the coupling state of the joint portion 50 by visually observing from the end portion 24 side of the first circuit board 21, and scattering is blocked by the wall portion 14. If there is a solder ball, it can be easily seen and removed.
上述したコネクタ１を端部２４に備えた第一回路基板２１は、コネクタ１と共に回路基板ユニット３を構成する。また、かかる回路基板ユニット３をコネクタ１により電気接続し取り付けられた第二回路基板２２は、回路基板ユニット３と共に回路基板装置４を構成する。かかる回路基板ユニット３と回路基板装置４は、コネクタ１を回路基板にハンダ付けする際に発生するハンダボールが、２枚の回路基板の間に侵入することを防ぎ、かつ、コネクタと回路基板とのハンダの結合状態を容易に目視で確認できる、品質の高いものとなる。 The first circuit board 21 having the connector 1 described above at the end 24 constitutes the circuit board unit 3 together with the connector 1. The second circuit board 22 to which the circuit board unit 3 is electrically connected by the connector 1 and attached constitutes the circuit board device 4 together with the circuit board unit 3. The circuit board unit 3 and the circuit board device 4 prevent a solder ball generated when the connector 1 is soldered to the circuit board from entering between the two circuit boards. Therefore, it is possible to easily check the bonding state of the solder with a high quality.
図９は、回路基板ユニット３と回路基板装置４の斜視図である。回路基板ユニット３は、第一回路基板２１とその端部に４つのコネクタ１を備える。また、回路基板装置４は、第二回路基板２２とそのおよそ中央部に回路基板ユニット３を備える。むろん、回路基板ユニット３は、第二回路基板２２のいずれの位置に配置されてもよい。かかる回路基板装置４においては、第二回路基板２２と第一回路基板２１の間に挟まれた領域Ｓにはハンダボールが存在せず、品質の高い回路基板装置４が提供できる。 FIG. 9 is a perspective view of the circuit board unit 3 and the circuit board device 4. The circuit board unit 3 includes a first circuit board 21 and four connectors 1 at its ends. The circuit board device 4 includes a second circuit board 22 and a circuit board unit 3 at approximately the center thereof. Of course, the circuit board unit 3 may be arranged at any position on the second circuit board 22. In such a circuit board device 4, there is no solder ball in the region S sandwiched between the second circuit board 22 and the first circuit board 21, and a high quality circuit board device 4 can be provided.
図１０は、本実施例のコネクタ１を使用した回路基板ユニット３と回路基板装置４の製造方法を示す斜視図である。まず、位置決め部１５を第一回路基板２１の端部にある孔に挿入し、コネクタ１の壁部１４が端部２４から遠ざかり、第二回路基板の方へ延在するように取り付け、コネクタ１の第一回路基板２１上の位置を確定する。 FIG. 10 is a perspective view showing a method of manufacturing the circuit board unit 3 and the circuit board device 4 using the connector 1 of this embodiment. First, the positioning portion 15 is inserted into the hole at the end portion of the first circuit board 21 and attached so that the wall portion 14 of the connector 1 moves away from the end portion 24 and extends toward the second circuit board. The position on the first circuit board 21 is determined.
これと共に、コネクタ１の屈曲した側（保持部１２を介して壁部１４と反対側）のピン１１を、第一回路基板２１の端部にあるスルーホール２３’に挿入し、リフロー方式でハンダ付けする。これにより、コネクタ１を使用した回路基板ユニット３が作製される。この段階では、コネクタ１は、第一回路基板２１にのみハンダ付けされている状態なので、ハンダ付けの部分の目視は容易に行うことが可能である。 At the same time, the pin 11 on the bent side of the connector 1 (the side opposite to the wall portion 14 through the holding portion 12) is inserted into the through hole 23 'at the end of the first circuit board 21, and soldered by a reflow method. Attach. Thereby, the circuit board unit 3 using the connector 1 is produced. At this stage, since the connector 1 is soldered only to the first circuit board 21, the soldered portion can be easily visually observed.
次に、コネクタ１が取り付けられた第一回路基板２１を、第二回路基板２２に対向させて、ピン１１のもう一方側の端を、第二回路基板２２の挿入すべきスルーホール２３に挿入し、フロー方式でハンダ付けする。これにより、回路基板ユニット３を使用した回路基板装置４が作製される。
第一回路基板２１と第二回路基板２２の間に挟まれた領域に、フロー方式のハンダ付けによりハンダボールが散乱した場合、目視により確認しにくくなるが、本発明に係るコネクタ１を用いた上記製造方法によれば、第一回路基板２１と第二回路基板２２の間に挟まれた領域にはハンダボールが散乱しないので、品質の高い回路基板装置４が提供できる。
Next, the first circuit board 21 to which the connector 1 is attached is opposed to the second circuit board 22, and the other end of the pin 11 is inserted into the through hole 23 into which the second circuit board 22 is to be inserted. And solder by flow method. Thereby, the circuit board device 4 using the circuit board unit 3 is manufactured.
When solder balls are scattered in the region sandwiched between the first circuit board 21 and the second circuit board 22 by flow-type soldering, it becomes difficult to visually confirm, but the connector 1 according to the present invention is used. According to the manufacturing method described above, since the solder balls are not scattered in the region sandwiched between the first circuit board 21 and the second circuit board 22, the high-quality circuit board device 4 can be provided.
なお、本発明は、例示した実施例に限定するものではなく、特許請求の範囲の各項に記載された内容から逸脱しない範囲の構成による実施が可能である。 In addition, this invention is not limited to the illustrated Example, The implementation by the structure of the range which does not deviate from the content described in each item of a claim is possible.
１ コネクタ
２ 回路基板
３ 回路基板ユニット
４ 回路基板装置
１１ ピン
１２ 保持部
１３ 間隔規定部
１４ 壁部
１５ 位置決め部
１６ 端面
１７ 第一延在部
１８ 第二延在部
１９ 第三延在部
２１ 第一回路基板
２２ 第二回路基板
２３ スルーホール
２４ 端部
２５ 第一回路基板の端面
５０ 接合部
５１ ハンダ
Ｓ 回路基板に挟まれる領域
DESCRIPTION OF SYMBOLS 1 Connector 2 Circuit board 3 Circuit board unit 4 Circuit board apparatus 11 Pin 12 Holding part 13 Space | interval definition part 14 Wall part 15 Positioning part 16 End surface 17 1st extension part 18 2nd extension part 19 3rd extension part 21 1st One circuit board 22 Second circuit board 23 Through hole 24 End 25 End face of first circuit board 50 Joint part 51 Solder S Area sandwiched between circuit boards
Claims (8)
前記コネクタは、
複数のピンと、
前記複数のピンを保持する保持部と、
前記保持部と一体成型された壁部と、
を備え、
前記コネクタは、前記第一回路基板の端部に取り付けられ、
前記壁部は、前記保持部の前記端部側とは逆側に形成され、かつ、前記第二回路基板の方へ延在しながら、前記複数のピンと前記第二回路基板の接合部と所定の間隔をもって形成され、
前記第二回路基板と前記壁部の距離は、前記第二回路基板と前記保持部の距離より短い、コネクタ。 A connector for electrically connecting the first circuit board and the second circuit board, disposed between the opposing first circuit board and the second circuit board,
The connector is
Multiple pins,
A holding portion for holding the plurality of pins;
A wall portion integrally molded with the holding portion;
With
The connector is attached to an end of the first circuit board;
The wall portion is formed on a side opposite to the end portion side of the holding portion, and extends toward the second circuit board, and a predetermined portion of the joint between the plurality of pins and the second circuit board. Formed at intervals of
The distance between the second circuit board and the wall is a connector shorter than the distance between the second circuit board and the holding part.
前記壁部は、２つの前記間隔規定部の間で前記保持部と一体成型されている
ことを特徴とする請求項１乃至４のいずれかに記載のコネクタ。 An interval defining portion that supports both ends of the holding portion and defines an interval between the first circuit board and the second circuit board;
The connector according to any one of claims 1 to 4, wherein the wall portion is integrally formed with the holding portion between two of the interval defining portions.
前記コネクタは、前記第一回路基板の端部に備えられ、
前記コネクタの前記壁部は、前記端部から遠ざかるように形成された、
ことを特徴とする回路基板ユニット。 A circuit board unit comprising the connector according to any one of claims 1 to 5 and the first circuit board,
The connector is provided at an end of the first circuit board;
The wall portion of the connector is formed to be away from the end portion,
A circuit board unit characterized by that.
前記複数のピンを保持する保持部と一体成型されて、前記保持部から延在する壁部を備える前記コネクタを、第一回路基板の端部に、前記壁部が前記端部から遠ざかり、第二回路基板の方へ延在するように取り付け、前記複数のピンの一端を前記第一回路基板のスルーホールにハンダ付けする工程と、
前記第一回路基板を前記第二回路基板に対向させて、前記複数のピンの他端を、第二回路基板のスルーホールにハンダ付けする工程と、
を有する製造方法。 A method of manufacturing a circuit board device having two opposing circuit boards that are electrically connected by a connector having a plurality of pins,
The connector having a wall portion that is integrally formed with the holding portion that holds the plurality of pins and extends from the holding portion is moved to the end portion of the first circuit board, and the wall portion is moved away from the end portion. Mounting to extend toward the two circuit board, soldering one end of the plurality of pins to the through hole of the first circuit board;
Soldering the other end of the plurality of pins to the through hole of the second circuit board with the first circuit board facing the second circuit board;
A manufacturing method comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011056021A JP2012195056A (en) | 2011-03-14 | 2011-03-14 | Connector, circuit board unit, circuit board device, and method for manufacturing circuit board device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011056021A JP2012195056A (en) | 2011-03-14 | 2011-03-14 | Connector, circuit board unit, circuit board device, and method for manufacturing circuit board device |
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| Publication Number | Publication Date |
|---|---|
| JP2012195056A true JP2012195056A (en) | 2012-10-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011056021A Pending JP2012195056A (en) | 2011-03-14 | 2011-03-14 | Connector, circuit board unit, circuit board device, and method for manufacturing circuit board device |
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| JP (1) | JP2012195056A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20240002496A (en) * | 2022-06-29 | 2024-01-05 | 주식회사 트래닛 | Connector for Connecting Boards |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS636681U (en) * | 1986-06-30 | 1988-01-18 | ||
| JPS63128758U (en) * | 1987-02-17 | 1988-08-23 | ||
| JPH09199200A (en) * | 1996-01-19 | 1997-07-31 | Fujitsu Takamizawa Component Kk | Inter-plate connecting connector and electronic circuit module mounting circuit device |
| JPH11121112A (en) * | 1997-08-06 | 1999-04-30 | Robert Bosch Gmbh | Electric connector |
-
2011
- 2011-03-14 JP JP2011056021A patent/JP2012195056A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS636681U (en) * | 1986-06-30 | 1988-01-18 | ||
| JPS63128758U (en) * | 1987-02-17 | 1988-08-23 | ||
| JPH09199200A (en) * | 1996-01-19 | 1997-07-31 | Fujitsu Takamizawa Component Kk | Inter-plate connecting connector and electronic circuit module mounting circuit device |
| JPH11121112A (en) * | 1997-08-06 | 1999-04-30 | Robert Bosch Gmbh | Electric connector |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20240002496A (en) * | 2022-06-29 | 2024-01-05 | 주식회사 트래닛 | Connector for Connecting Boards |
| KR102736749B1 (en) * | 2022-06-29 | 2024-12-03 | 주식회사 트래닛 | Connector for Connecting Boards |
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