JP2012191039A - Electronic circuit module and ceramic component calcined at low temperature - Google Patents

Abstract

PROBLEM TO BE SOLVED: To facilitate assembly of an electronic circuit module while downsizing the electronic circuit module.SOLUTION: The electronic circuit module is connected with a master substrate 4000 having terminals at least on one principal surface. The electronic circuit module comprises a module substrate 2000 having terminals on both principal surfaces and mounting an electronic component on one principal surface, and a ceramic component 1000 calcined at low temperature having terminals on both principal surfaces and having a conductor pattern internally. When the terminals on one principal surface of the ceramic component 1000 calcined at low temperature are connected with the terminals on the other principal surface of the module substrate 2000, the ceramic component 1000 calcined at low temperature is mounted on the module substrate 2000. When the terminals on the other principal surface of the ceramic component 1000 calcined at low temperature are connected with the terminals of the master substrate 4000, the module substrate 2000 is mounted on the master substrate 4000 while sandwiching the ceramic component 1000 calcined at low temperature.

Description

  The present invention relates to an electronic circuit module and a low-temperature fired ceramic component.

  With the expansion of use of wireless communication devices such as mobile phones, wireless LAN (Local Area Network) and mobile WiMAX (Worldwide Interoperability for Microwave Access), miniaturization and cost reduction of devices are strongly demanded.

  Generally, at the antenna end of a wireless communication device, a transmission / reception changeover switch, a duplexer for band selection, a filter for removing unnecessary waves, a low noise amplifier for amplifying a received signal, and amplifying a transmission signal In addition, a circuit called a front end unit is configured which includes a power amplifier for performing the above operation and a balun for converting a balanced signal into an unbalanced signal.

  FIG. 18 is a circuit diagram showing an example of the configuration of the front end unit. As shown in FIG. 18, the antenna terminal (ANT) is switched to the transmission side or the reception side by a transmission / reception changeover switch (SW). When the antenna terminal is connected to the transmission side, the signal input from the Tx terminal of the balun (BALUN) is amplified by the power amplifier (PA) and transmitted to the antenna terminal.

  In order to remove unnecessary signals outside the band, bandpass filters (BPF) are provided at the input and output of the power amplifier (PA). Two systems with power amplifiers (PA1, PA2) are connected to the antenna terminal (ANT) on the transmitting side so that the frequencies of the two bands can be handled. These are banded via a duplexer (DUPLEXER). It is separated.

  When the antenna terminal (ANT) is on the receiving side, the received signal from the antenna terminal (ANT) is amplified by the low noise amplifier (LNA) and output to the Rx terminal of the balun (BALUN). Two systems with low noise amplifiers (LNA1, LNA2) are connected so that the frequencies on the receiving side can also handle the two bands. ing.

  The front end part is a part that directly processes the frequency of the communication signal, and a special design as a distributed constant circuit is required particularly in the band of GHz order. In order to stabilize the performance of the front end part and facilitate handling, a part in which the front end part or a part thereof is modularized has been proposed and put into practical use.

  Patent Documents 1 and 2 are prior art documents disclosing a switch / filter module in which a switch and a filter are integrated. In these switch / filter modules, the filter is composed of a conductive pattern in the multilayer substrate, and the switch is mounted on the surface of the multilayer substrate.

  Patent Document 3 is a prior art document that discloses a power amplifier / filter module in which a power amplifier and a filter are integrated. In the power amplifier / filter module described in Patent Document 3, the filter is composed of a conductive pattern in the multilayer substrate, and the power amplifier is mounted on the surface of the multilayer substrate.

  There exists patent document 4 as a prior art document which disclosed the high frequency module. In the high-frequency module described in Patent Document 4, the duplexer, the filter, and the balun are composed of conductive patterns in the multilayer substrate. The switch, the low noise amplifier, and the power amplifier are mounted on the surface of the multilayer substrate.

  As described above, an integrated electronic circuit module is formed by configuring a filter circuit using a resonance circuit and a transmission line configured by a conductive pattern in a multilayer substrate, and further mounting functional parts on the surface of the substrate. be able to.

  When a circuit such as a filter is formed of a conductive pattern, a low-temperature fired ceramic substrate that can be laminated with a dielectric and a conductive pattern with high accuracy and has excellent temperature characteristics is suitable and widely used.

  There is Patent Document 5 as a prior document disclosing a front end module formed by other methods. In the front-end module described in Patent Document 5, a resonant circuit component such as a filter formed of multilayer ceramic is mounted on a resin substrate together with other components such as a switch to constitute a module.

  When an electronic circuit module is manufactured using a low-temperature fired ceramic substrate, a mounting component is joined to the substrate by soldering in the same manner as the resin substrate. At this time, in order to efficiently mount components in the same process as the resin substrate using an automatic machine, a spelled substrate in which a plurality of low-temperature fired ceramic substrates are provided in a matrix form vertically and horizontally may be used.

  FIG. 19 is a perspective view showing the appearance of the spelling substrate. As shown in FIG. 19, the spelling substrate 3000 is provided with a plurality of low-temperature fired ceramic substrates 3001 in a matrix. When producing a front end module, after mounting components on a plurality of low-temperature fired ceramic substrates 3001, reflow processing is performed in the state of the spelling substrate 3000, so that the mounted components are placed on each of the plurality of low-temperature fired ceramic substrates 3001. Let it be implemented. Thereafter, a plurality of low-temperature fired ceramic substrates 3001 are separated into individual pieces to obtain products.

JP 2002-344347 A JP 2004-235877 A JP 2009-182903 A JP 2008-193739 A JP 2003-249868 A

  Since the spelling substrate 3000 is produced by firing, it has distortion due to firing. Therefore, when mounting components are mounted on the plurality of low-temperature fired ceramic substrates 3001 in the state of the spelling substrate 3000, it may be necessary to correct the mounting positions of the mounting components due to accumulation of dimensional errors due to strain.

  Further, in the electrical inspection of the low-temperature fired ceramic substrate 3001, since the collective probing inspection is performed in the state of the binding substrate 3000, it is difficult to perform the high-frequency inspection on all the low-temperature fired ceramic substrates 3001. For this reason, the high frequency inspection is performed by sampling inspection. In this case, as long as the quality variation of the low-temperature fired ceramic substrate 3001 exists, there is a possibility that the manufactured low-temperature fired ceramic substrate 3001 includes a non-standard product that does not satisfy the performance standard.

  The present invention has been made in view of the above problems, and provides an electronic circuit module and a low-temperature fired ceramic component that can facilitate the assembly of the electronic circuit module while reducing the size of the electronic circuit module. The purpose is to do.

  The electronic circuit module based on this invention is an electronic circuit module connected to the parent board | substrate which has a terminal in at least one main surface. The electronic circuit module has terminals on both main surfaces, a module substrate on which electronic components are mounted on one main surface, and a low-temperature fired ceramic component having terminals on both main surfaces and having a conductor pattern inside With. The terminals on one main surface of the low-temperature fired ceramic component are connected to the terminals on the other main surface of the module substrate, whereby the low-temperature fired ceramic component is mounted on the module substrate. By connecting the terminals of the other main surface of the low-temperature fired ceramic component to the terminals of the parent substrate, the module substrate is mounted on the parent substrate with the low-temperature fired ceramic component interposed therebetween.

  In one embodiment of the present invention, the module substrate and the low-temperature fired ceramic component have substantially the same shape in plan view.

  In one embodiment of the present invention, the electronic component includes at least one of a power amplifier component, a low noise amplifier component, and a high frequency switch component.

  The low-temperature fired ceramic component according to the present invention is mounted on a module substrate having terminals on both main surfaces and electronic components mounted on one main surface, and a module on a parent substrate having terminals on at least one main surface This is a low-temperature fired ceramic component that is interposed between the parent substrate and the module substrate in a state where the substrate is mounted. A first terminal formed on one main surface and connected to a terminal on the other main surface of the module substrate, a second terminal formed on the other main surface and connected to a terminal on the parent substrate, and formed inside And a conductive pattern electrically connected to the first terminal and the second terminal.

  In one embodiment of the present invention, the conductive pattern constitutes a circuit that functions as a high-frequency filter.

  In one embodiment of the present invention, the conductive pattern further constitutes a circuit having at least one function of a balun and a duplexer.

  ADVANTAGE OF THE INVENTION According to this invention, an assembly of an electronic circuit module can be made easy, aiming at size reduction of an electronic circuit module.

It is a circuit diagram which shows the structure of the electronic circuit module which concerns on one Embodiment of this invention. It is a perspective view which shows the state which mounts a low-temperature baking ceramic component in a module board | substrate, and comprises the electronic circuit module which concerns on this embodiment. It is a perspective view which shows the state which mounts the module board | substrate which mounted the low-temperature baking ceramic component on the parent board | substrate. It is a perspective view which shows the state in which the electronic circuit module was mounted in the parent board | substrate. It is a top view which shows the structure of the 1st terminal formed in one main surface of a low-temperature baking ceramic component. It is a rear view which shows the structure of the 2nd terminal formed in the other main surface of the low-temperature baking ceramic component. It is a top view which shows the component mounted in the terminal formed in one main surface of a module board. It is a rear view which shows the structure of the terminal formed in the other main surface of a module board. It is a perspective view which shows the external appearance of the module board | substrate 2000 comprised as a spelling board as the 1st modification of the embodiment. It is a side view which shows the state by which the electronic component was mounted in one main surface of a module board. It is a side view which shows the state which mounted the low-temperature baking ceramic component in the module board in the modification. It is a side view which shows the state which diced the module board which mounted the low-temperature baking ceramic component in the modification. It is a side view which shows the state which mounted | wore the mounted electronic component with the shield case. It is a side view which shows the state which sealed all the electronic components mounted on one main surface of a module board in the 2nd modification of the embodiment with resin. It is a side view which shows the state which mounted the low-temperature baking ceramic component in the module board in the modification. It is a side view which shows the state which diced the module board which mounted the low-temperature baking ceramic component in the modification. It is a side view which shows the structure of the low-temperature-fired ceramic component and module board | substrate integrated by the modification. It is a circuit diagram which shows an example of a structure of a front end part. It is a perspective view which shows the external appearance of a spelling board | substrate.

  Hereinafter, an electronic circuit module and a low-temperature fired ceramic component according to an embodiment of the present invention will be described with reference to the drawings. In the following description of the embodiments, the same or corresponding parts in the drawings are denoted by the same reference numerals, and the description thereof will not be repeated.

  In the following embodiments, a single band front-end module for wireless LAN will be described, but the present invention is not limited to this. The present invention is applicable to, for example, a wireless communication system such as a mobile phone, WiMAX, and LTE (Long Term Evolution).

  The present invention is not limited to a single band and can be easily applied to a multiband module. Although described later, the present invention can be easily applied to an electronic circuit module including different circuit blocks such as an antenna switch module and a power amplifier module.

  FIG. 1 is a circuit diagram showing a configuration of an electronic circuit module according to an embodiment of the present invention. As shown in FIG. 1, an electronic circuit module 10 according to an embodiment of the present invention includes a transmission / reception change-over switch 1 that switches an antenna connection terminal (ANT) to a circuit on a transmission side or a reception side.

  In the circuit on the receiving side of the electronic circuit module 10, a low noise amplifier 3 and a band pass filter 2 are provided. In addition, a balun 4 is provided to make a signal output to an RFIC (Radio Frequency Integrated Circuit) a balanced signal (Rxp, Rxn). A reception signal in which an unnecessary wave is attenuated by the bandpass filter 2 is input to the low noise amplifier 3 and a high reception sensitivity can be obtained by amplifying the reception signal.

  Band-pass filters 5 and 7 and a power amplifier 6 are provided on the transmission side. Further, a balun 8 is provided for converting balanced signals (Txp, Txn) from the RFIC into unbalanced signals. Bandpass filters 5 and 7 are provided on both the input signal side and the output signal side of the power amplifier in order to attenuate unnecessary waves from the transmission signal. With this configuration, a transmission signal with sufficient power can be obtained without affecting other communication channels.

  Among the components of the electronic circuit module 10 shown in FIG. 1, the baluns 4 and 8 and the band pass filters 2, 5 and 7 can form a circuit using the conductive pattern in the low-temperature fired ceramic component. In the present embodiment, the three components, the band-pass filter 2 on the reception side, the balun 4 and the balun 8 on the transmission side, are incorporated as a circuit in the low-temperature fired ceramic component.

  In other words, a circuit in which the conductive pattern functions as a high frequency filter is configured. In the present embodiment, the conductive pattern further constitutes a circuit having a balun function, but the conductive pattern may constitute a circuit having a duplexer function.

Hereinafter, the structure of the electronic circuit module of the present embodiment will be described.
FIG. 2 is a perspective view showing a state in which the low-temperature fired ceramic component is mounted on the module substrate to constitute the electronic circuit module according to the present embodiment. FIG. 3 is a perspective view showing a state in which the module substrate on which the low-temperature fired ceramic component is mounted is mounted on the parent substrate. FIG. 4 is a perspective view showing a state in which the electronic circuit module is mounted on the parent board.

  The low-temperature fired ceramic component 1000 has terminals (not shown) on both main surfaces 101 and 201, and has a conductor pattern (not shown) inside. The low-temperature fired ceramic component 1000 has a structure in which a plurality of ceramic layers are laminated, and a conductive pattern is formed between the layers. The circuit is configured by the conductive pattern so as to have the functions of the reception-side bandpass filter 2, the balun 4 and the transmission-side balun 8 shown in FIG.

  A first terminal for external connection is formed on one main surface 101 of the low-temperature fired ceramic component 1000. A second terminal for external connection is formed on the other main surface 201 of the low-temperature fired ceramic component 1000. The conductive pattern of the low-temperature fired ceramic component 1000 is electrically connected to the first terminal and the second terminal. Specifically, the first terminal and the second terminal are connected by an interlayer via formed in the low-temperature fired ceramic component 1000 and a conductive pattern.

The module substrate 2000 has terminals (not shown) on both main surfaces 301 and 401, and electronic components (not shown) are mounted on one main surface 401. The module substrate 2000 is produced by mixing inorganic fillers such as Al ₂ O ₃ , SiO ₂ and TiO _{2 in} thermosetting resins such as epoxy, phenol and cyanate. The module substrate 2000 includes at least one unit module substrate 2001 corresponding to one low-temperature fired ceramic component 1000.

  As shown in FIG. 2, the low-temperature fired ceramic component 1000 is mounted on the module substrate 2000 by connecting the terminals on one main surface 101 of the low-temperature fired ceramic component 1000 to the terminals on the other main surface 301 of the module substrate 2000. Thus, the electronic circuit module 10 is configured.

  As shown in FIG. 3, the terminal of the other main surface 201 of the low-temperature fired ceramic component is connected to the terminal of one main surface 501 of the parent substrate 4000 so that the module substrate 2000 has the low-temperature fired ceramic component 1000 in between. It is mounted on the parent board 4000 with being sandwiched. In other words, the electronic circuit module 10 is mounted on the parent board 4000. Note that parent substrate 4000 may have terminals on both main surfaces.

  As shown in FIG. 4, in a state where the low-temperature fired ceramic component 1000 is mounted on the module substrate 2000 and the module substrate 2000 is mounted on the parent substrate 4000, the low-temperature fired ceramic is interposed between the parent substrate 4000 and the module substrate 2000. Part 1000 is interposed.

  FIG. 5 is a top view showing the configuration of the first terminal formed on one main surface of the low-temperature fired ceramic component. FIG. 6 is a rear view showing the configuration of the second terminal formed on the other main surface of the low-temperature fired ceramic component.

  As shown in FIG. 5, the low-temperature fired ceramic component 1000 of the present embodiment has, on one main surface 101, a first terminal connected to the module substrate 2000, which is an input terminal 11 and an output terminal 12 of a band-pass filter, and reception. An unbalanced input terminal 14 to the side balun and an unbalanced output terminal 15 from the transmission side balun are formed.

  In addition, on one main surface 101 of the low-temperature fired ceramic component 1000, a power terminal 18, a GND terminal, a control terminal 17, and an antenna terminal 19, which are first terminals connected to the module substrate 2000, are formed. Further, dummy terminals 21 are formed on one main surface 101 of the low-temperature fired ceramic component 1000 in order to balance the terminal arrangement.

  In the low-temperature fired ceramic component 1000, all the first terminals for connection to the module substrate 2000 are formed on one main surface 101.

  As shown in FIG. 6, the other main surface 201 of the low-temperature fired ceramic part 1000 is the second terminal, the balanced signal output terminal 31 of the reception-side balun built in the low-temperature fired ceramic part 1000 and the balanced signal of the transmission-side balun. In addition to the input terminal 33, terminals such as a power supply terminal 35, a GND terminal, a control terminal 37, and an antenna terminal 39 are formed.

  In the low-temperature fired ceramic component 1000, all the second terminals for connecting the module substrate 2000 to the parent substrate 4000 are formed on the other main surface 201.

  FIG. 7 is a top view showing components mounted on terminals formed on one main surface of the module substrate. FIG. 8 is a rear view showing the configuration of the terminals formed on the other main surface of the module substrate.

  As shown in FIG. 7, a low noise amplifier 61, a power amplifier 62, a switch IC 64, and a band pass filter 65 are mounted on one main surface 401 of the module substrate 2000 of the present embodiment. Further, on one main surface 401 of the module substrate 2000, chip components 67 such as an impedance matching capacitor, a coil, a choke coil, and a power source noise removing capacitor are mounted.

  The low noise amplifier 61, the power amplifier 62, and the switch IC 64 are high-frequency integrated circuits composed of semiconductor elements formed on a semiconductor substrate made of Si, SiGe, GaAs, or the like. In order to reduce the size and cost of the electronic circuit module, these semiconductor components are desirably mounted on the module substrate 2000 in a bare chip.

  Specifically, the semiconductor component is die-bonded to a die-bonding area provided on one main surface 401 of the module substrate 2000 and mounted by wire bonding. Alternatively, the semiconductor component may be mounted on one main surface 401 of the module substrate 2000 by flip chip mounting.

  The band pass filter 65 is a single part made of ceramic having a laminated structure. The band pass filter 65 is disposed on a solder pattern provided on one main surface 401 of the module substrate 2000 together with the plurality of chip components 67 and mounted by reflow processing.

  The electronic component mounted on one main surface 401 of the module substrate 2000 is appropriately changed in accordance with the component incorporated in the low-temperature fired ceramic component 1000. In other words, the components of the electronic circuit module 10 other than the components incorporated in the low-temperature fired ceramic component 1000 are mounted on one main surface 401 of the module substrate 2000. The electronic component mounted on one main surface 401 of the module substrate 2000 includes at least one of a power amplifier component, a low noise amplifier component, and a high frequency switch component.

  As shown in FIG. 8, terminal groups 41 to 51 and a GND terminal are formed on the other main surface 301 of the module substrate 2000 so as to correspond to the first terminals of the low-temperature fired ceramic component 1000 shown in FIG. .

  Since one main surface 101 of the low-temperature fired ceramic component 1000 is connected so as to face the other main surface 301 of the module substrate 2000, the first terminal of the low-temperature fired ceramic component 1000 and the corresponding terminal of the module substrate 2000 Are arranged so as to be mirror-symmetrical when facing each other.

  The GND terminal of the module substrate 2000 has a plurality of terminals so as to have substantially the same area as the other terminals of the other main surface 301 of the module substrate 2000 in order to ensure the quality of solder bonding with the GND terminal of the low-temperature fired ceramic component 1000. It is divided and arranged.

  In the present embodiment, the module substrate 2000 and the low-temperature fired ceramic component 1000 have substantially the same shape in plan view. A component incorporated in the low temperature fired ceramic component 1000 and an electronic component mounted on one main surface 401 of the module substrate 2000 so that the area of the low temperature fired ceramic component 1000 and the area of the module substrate 2000 are substantially equal. By assigning the number of parts, the low-temperature fired ceramic parts 1000 and the module substrate 2000 can be uniformly downsized.

  Note that the die bond area of the power amplifier 62 mounted on one main surface 401 of the module substrate 2000 has a via hole formed immediately below the die bond area in order to secure a reduction in ground inductance and a heat dissipation path. It is directly connected to the GND terminal of the other main surface 301.

  Further, the GND terminal formed on one main surface 101 of the low-temperature fired ceramic component 1000 connected to the GND terminal of the module substrate 2000 is connected to the other of the low-temperature fired ceramic component via a via hole formed in the low-temperature fired ceramic component 1000. Are directly connected to a GND terminal formed on the main surface 201 of the main body 201. With this configuration, the path from the die bond area of the power amplifier 62 to the GND terminal of the other main surface 201 of the module substrate 2000 can be minimized.

  With the above configuration, electrical connection with all external circuits of the module substrate 2000 is performed through the low-temperature fired ceramic component 1000. Therefore, the electronic components mounted on the module substrate 2000 perform input / output with the parent substrate 4000 in conjunction with the components incorporated in the low-temperature fired ceramic component 1000.

  In this embodiment, since the low-temperature fired ceramic component 1000 is mounted as an individual part, the electronic circuit module 10 can be produced without being affected by the strain generated when the low-temperature fired ceramic component 1000 is produced. Each low-temperature fired ceramic component 1000 can be easily subjected to a high-frequency electrical test, and the electronic circuit module 10 can be assembled using only the low-temperature fired ceramic component 1000 that was a good product in the high-frequency electrical test. Yield can be improved.

  As a result, the electronic circuit module 10 can be easily assembled while reducing the size of the electronic circuit module 10.

  Hereinafter, as a modification of the present embodiment, a method for mounting the low-temperature fired ceramic component 1000 on the module substrate 2000 configured as a spelling substrate including a plurality of unit module substrates 2001 will be described.

(First modification)
FIG. 9 is a perspective view illustrating an appearance of a module substrate 2000 configured as a spelling substrate as a first modification of the present embodiment. As shown in FIG. 9, in the first modification of the present embodiment, the module substrate 2000 is configured as a spelling substrate in which a plurality of unit module substrates 2001 are provided in a matrix.

  FIG. 10 is a side view showing a state in which an electronic component is mounted on one main surface of the module substrate. As shown in FIG. 10, the module substrate 2000 is in a spelled substrate state, and a reflow component 71 such as a chip capacitor and a semiconductor bare chip component 72 are mounted for each unit module substrate 2001.

  Specifically, first, a solder pattern is formed on one main surface 401 of the module substrate 2000. Next, the reflow component 71 is arranged with a mounter. Then, the reflow component 71 is joined on one main surface 401 of the module substrate 2000 by performing a reflow process.

  Next, the semiconductor bare chip component 72 is die-bonded with a conductive paste and placed on one main surface 401 of the module substrate 2000. The electrodes of the semiconductor bare chip component 72 are connected to the module substrate 2000 by wire bonding. Thereafter, in order to protect the semiconductor bare chip component 72 and the wire, the semiconductor bare chip component 72 and the wire are covered with potting resin.

  By mounting electronic components on the module substrate 2000 in this manner, the electronic components can be mounted on a plurality of unit module substrates 2001 at a time, so that production efficiency can be improved. The reflow component 71 and the semiconductor bare chip component 72 are examples of electronic components, and the electronic components mounted on the module substrate 2000 are not limited thereto.

  The module substrate 2000 is not affected by distortion due to firing unlike the low-temperature fired ceramic substrate spelling board 3000, so that even when the electronic component is mounted in the state of the spelling board, the electronic component is placed on the module board 2000 with high positional accuracy. Can be arranged.

  FIG. 11 is a side view showing a state where the low-temperature fired ceramic component is mounted on the module substrate in the present modification. As shown in FIG. 11, the low-temperature fired ceramic component 1000 is mounted for each unit module substrate 2001 on the other main surface 301 of the module substrate 2000.

  Specifically, first, a solder pattern is formed on the other main surface 301 of the module substrate 2000. Next, the low-temperature fired ceramic component 1000 is arranged with a mounter. Thereafter, the low-temperature fired ceramic component 1000 is bonded onto the other main surface 301 of the module substrate 2000 by performing a reflow process.

  FIG. 12 is a side view showing a state in which the module substrate on which the low-temperature fired ceramic component is mounted is diced in the present modification. As shown in FIG. 12, the module substrate 2000 is divided into unit module substrates 2001 and separated into individual pieces.

FIG. 13 is a side view showing a state where a shield case is mounted on the mounted electronic component.
As shown in FIG. 13, a shield case 500 is mounted to protect the reflow component 71 and the semiconductor bare chip component 72 mounted on the module substrate 2000 separated for each unit module substrate 2001.

  The low-temperature fired ceramic component 1000 can be mounted on the module substrate 2000 by the above method. Even in this case, the electronic circuit module 10 can be manufactured without being affected by the distortion generated when the low-temperature fired ceramic component 1000 is manufactured. Assembling of the circuit module 10 can be facilitated.

  Also, the low-temperature fired ceramic component 1000 can be mounted on the module substrate 2000 by the following method.

(Second modification)
Also in the second modification of the present embodiment, the module substrate 2000 is formed in a spelled substrate shape, and electronic components are mounted on one main surface 401 of the module substrate 2000 as shown in FIG. The description of the same parts as the first modification will not be repeated.

  FIG. 14 is a side view showing a state where all of the electronic components mounted on one main surface of the module substrate are sealed with resin in the second modification of the present embodiment.

  As shown in FIG. 14, in the second modification of the present embodiment, before the module substrate 2000 is separated into pieces, a reflow is performed by applying a sealing resin on one main surface 401 of the module substrate 2000. The component 71 and the semiconductor bare chip component 72 are sealed with a resin mold 600. The sealing resin can be applied by injection molding or vacuum printing. In this modification, resin potting of the bare chip component 72 is not necessarily performed.

  FIG. 15 is a side view showing a state where the low-temperature fired ceramic component is mounted on the module substrate in the present modification. As shown in FIG. 15, the low-temperature fired ceramic component 1000 is mounted for each unit module substrate 2001 on the other main surface 301 of the module substrate 2000.

  FIG. 16 is a side view showing a state in which the module substrate on which the low-temperature fired ceramic component is mounted is diced in the present modification. As shown in FIG. 16, the module substrate 2000 is divided into unit modules substrate 2001 together with the resin mold 600. The reflow component 71 and the semiconductor bare chip component 72 mounted on the unit module substrate 2001 are sealed by a divided unit resin mold 601.

  FIG. 17 is a side view showing the structure of a low-temperature fired ceramic component and a module substrate integrated according to this modification. As shown in FIG. 17, the low-temperature fired ceramic component 1000 can be mounted on the module substrate 2000 also by the method of this modification.

  Even in this case, the electronic circuit module 10 can be manufactured without being affected by the distortion generated when the low-temperature fired ceramic component 1000 is manufactured. Assembling of the circuit module 10 can be facilitated.

  In addition, the said embodiment disclosed this time is an illustration in all the points, Comprising: It does not become a basis of limited interpretation. Therefore, the technical scope of the present invention is not interpreted only by the above-described embodiments, but is defined based on the description of the scope of claims. Further, all modifications within the meaning and scope equivalent to the scope of the claims are included.

  1 switch, 2, 5, 65 band pass filter, 3, 61 low noise amplifier, 4, 8 balun, 6, 62 power amplifier, 10 electronic circuit module, 11 input terminal, 12 output terminal, 14 unbalanced input terminal, 15 Unbalanced output terminal, 17, 37 Control terminal, 18, 35 Power supply terminal, 19, 39 Antenna terminal, 21 Dummy terminal, 31 Balanced signal output terminal, 33 Balanced signal input terminal, 41-51 terminal group, 67 Chip component, 71 Reflow parts, 72 Semiconductor bare chip parts, 72 Bare chip parts, 500 Shield case, 600 Resin mold, 601 Unit resin mold, 1000 Low temperature fired ceramic parts, 2000 Module board, 2001 Unit module board, 3000 Spell board, 3001 Low temperature fired ceramic board 4000 Parent board.

Claims (6)

An electronic circuit module connected to a parent substrate having terminals on at least one main surface,
A module substrate having terminals on both main surfaces and electronic components mounted on one main surface;
With low-temperature fired ceramic parts having terminals on both main surfaces and conductor patterns inside,
By connecting a terminal on one main surface of the low-temperature fired ceramic component to a terminal on the other main surface of the module substrate, the low-temperature fired ceramic component is mounted on the module substrate,
An electronic circuit in which the module substrate is mounted on the parent substrate with the low-temperature fired ceramic component interposed therebetween by connecting a terminal on the other main surface of the low-temperature fired ceramic component to the terminal of the parent substrate module.   The electronic circuit module according to claim 1, wherein the module substrate and the low-temperature fired ceramic component have substantially the same shape in plan view.   The electronic circuit module according to claim 1, wherein the electronic component includes at least one of a power amplifier component, a low noise amplifier component, and a high frequency switch component. The main board is mounted on a module board having terminals on both main faces and electronic components are mounted on one main face, and the module board is mounted on a parent board having terminals on at least one main face. A low-temperature fired ceramic component interposed between a substrate and the module substrate,
A first terminal formed on one main surface and connected to a terminal on the other main surface of the module substrate;
A second terminal formed on the other main surface and connected to the terminal of the parent substrate;
A low-temperature fired ceramic component comprising a conductive pattern formed inside and electrically connected to the first terminal and the second terminal.   The low-temperature fired ceramic component according to claim 4, wherein the conductive pattern constitutes a circuit that functions as a high-frequency filter.   The low-temperature fired ceramic component according to claim 5, wherein the conductive pattern further constitutes a circuit having at least one function of a balun and a duplexer.

Images