JP2012189347A - Substrate inspection apparatus and substrate inspection method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve accuracy of probing while improving inspection efficiency.SOLUTION: A substrate inspection apparatus comprises a probing mechanism and a control unit. The probing mechanism executes probing processing in which probing is performed on a probe 5a by moving a mounting section 14a in which the probe 5a and a camera 4a are mounted. On the basis of a result of imaging by the camera 4a, the control unit specifies a correction value for a moving amount of the mounting section 14a in the execution of probing processing. On the basis of data indicating a reference position Ps1, the control unit determines a position deviation amount between a center C of an imaging area of the camera 4a in the case where the mounting section 14a is moved so as to position the camera 4a at a counter position of the reference position Ps1, and the reference position Ps1, and executes correction value specification processing, for a plurality of reference probe positions Pp, to specify the correction value at a reference probe position Pp where the probe 5a is positioned while the camera 4a is positioned at the counter position, on the basis of distances Lx1 and Ly1 between the camera 4a and the probe 5a and the position deviation amount.

Description

  The present invention relates to a substrate inspection apparatus and a substrate inspection method in which a probe is probed with respect to a substrate to be inspected, and the substrate is inspected based on an electric signal input / output via the probe.

  As this type of board inspection apparatus, a circuit board inspection apparatus disclosed by the applicant in Japanese Patent Application Laid-Open No. 2009-19907 is known. This circuit board inspection apparatus includes an XYZ moving mechanism, a camera, a probe, a control unit, and the like, and is configured to be able to electrically inspect an inspection target board. In addition, the circuit board inspection apparatus executes the first correction data acquisition process and the second correction data acquisition process, and corrects the positional deviation when the camera is moved by the XYZ moving mechanism. Movement amount correction data (hereinafter also referred to as “camera correction data”), and movement amount correction data for correcting positional deviation when the probe is moved by the XYZ movement mechanism Data (hereinafter also referred to as “probe correction data”) is acquired. In the second correction data acquisition process, after the probe is moved and probing is performed on the dent sheet, the movement distance is based on the correction data for the camera acquired by the first correction data acquisition process. The camera is moved to the probing position while correcting. In this case, when the dent formed by probing and the center of the imaging area of the camera are separated from each other, the camera is moved so that the two coincide with each other, and the amount of movement is acquired as correction data for the probe. In the circuit board inspection apparatus, movement amount correction data for a plurality of reference positions is acquired in the first correction data acquisition process and the second correction data acquisition process. For this reason, in this circuit board inspection apparatus, it is possible to move the camera and the probe more accurately than in the configuration in which only the movement amount correction data for one reference position is acquired.

JP 2009-19907 (page 6-11, FIG. 1-2)

  However, the above circuit board inspection apparatus has the following problems to be improved. That is, in this circuit board inspection apparatus, two processes of the first correction data acquisition process and the second correction data acquisition process are executed for one reference position. For this reason, in this circuit board inspection apparatus, when there are a large number of reference positions, there is a problem that it is difficult to improve inspection efficiency as a result of requiring much time for processing. Further, in this circuit board inspection apparatus, when the camera is moved to the probing position in the second correction data acquisition process and the dent and the center of the imaging area of the camera are separated from each other, the two match each other. The camera is moved again, and the amount of movement is acquired as correction data for the probe. That is, in the second correction data acquisition process, the correction data for the probe is acquired by moving the camera twice. In this case, in the first movement of moving the camera to the probing position, the movement distance is corrected based on the correction data for the camera, but the movement amount in the second movement includes an XYZ movement mechanism. There is a possibility that the amount of misalignment due to mechanical distortion or backlash during operation is included. For this reason, in this circuit board inspection apparatus, it is difficult to improve the accuracy of probing due to the difficulty in improving the accuracy of probe correction data acquired by the second correction data acquisition processing. There are also challenges.

  The present invention has been made in view of the problems to be improved, and a main object of the present invention is to provide a substrate inspection apparatus and a substrate inspection apparatus that can improve the accuracy of probing while improving the inspection efficiency.

  In order to achieve the above object, the substrate inspection apparatus according to claim 1 is configured such that the mounting portion to which the probe and the camera are mounted is moved in parallel to the mounting surface on which the substrate to be inspected is mounted. And a probing mechanism for performing probing processing for probing the probe, and controlling the probing processing by the probing mechanism, and the amount of movement of the attachment portion during execution of the probing processing based on an imaging result by the camera. A substrate inspection apparatus that inspects the substrate based on an electric signal input / output via the probe, the control unit determining in advance on the placement surface. Based on the data indicating the reference position, the probe is positioned so that the camera is positioned at a position opposite to the reference position. A displacement amount between a predetermined reference point and the reference position in the imaging region of the camera when the attachment portion is moved with respect to the mechanism is obtained, and the camera is positioned at the facing position. A correction value specifying process for specifying the correction value at the reference probe position where the probe is positioned based on the distance between the camera and the probe and the amount of positional deviation is executed for a plurality of reference probe positions. Then, based on the specified correction value, the amount of movement of the attachment portion during execution of the probing process is corrected.

  The substrate inspection apparatus according to claim 2 is the substrate inspection apparatus according to claim 1, wherein the control unit positions the correction value at a non-reference position excluding the reference probe position around the non-reference position. It is specified by interpolation processing using the correction values at a plurality of the reference probe positions.

  According to a third aspect of the present invention, there is provided the method for inspecting a substrate according to the present invention, wherein the probe is attached to the probe and the camera is moved in parallel with the mounting surface on which the substrate to be inspected is placed. A board inspection in which a correction value of the amount of movement of the mounting portion at the time of execution of a probing process for probing is specified based on an imaging result by the camera, and the board is inspected based on an electric signal input / output via the probe An image of the camera when the mounting portion is moved so that the camera is positioned at a position opposite to the reference position based on data indicating a predetermined reference position on the placement surface. The amount of positional deviation between a predetermined reference point in the region and the reference position is obtained, and when the camera is located at the opposite position, A correction value specifying process for specifying the correction value at the reference probe position where the lobe is located based on the distance between the camera and the probe and the amount of positional deviation is performed for a plurality of the reference probe positions. Based on the correction value, the amount of movement of the attachment portion during the execution of the probing process is corrected.

  Further, the substrate inspection method according to claim 4 is the substrate inspection method according to claim 3, wherein the correction values at the non-reference positions excluding the reference probe position are the plurality of reference probes positioned around the non-reference position. The position is specified by an interpolation process using the correction value at the position.

  4. The substrate inspection apparatus according to claim 1, and the substrate inspection method according to claim 3, wherein the reference point and the reference in the imaging region of the camera when the mounting portion is moved so that the camera is positioned at a position opposite to the reference position. Determines the amount of misalignment between the position and the correction value at the reference probe position where the probe is located when the camera is located at the opposite position based on the distance between the camera and the probe and the amount of misalignment The correction value specifying process is executed for a plurality of reference probe positions. For this reason, according to this board | substrate inspection apparatus and board | substrate inspection method, the process which moves a camera (attachment part) to the position facing a reference position is performed only once, and the amount of position shift between a reference point and a reference position is obtained. Thus, the correction value at the reference probe position can be specified based on the positional deviation amount. Therefore, according to the substrate inspection apparatus and the substrate inspection method, the number of reference probe positions to be specified (number of reference positions) is compared with the conventional configuration and method in which processing is performed twice for one reference position. It is possible to sufficiently shorten the processing time for specifying the correction value when there are many. Further, in this board inspection apparatus and board inspection method, since the correction value is specified by performing the process of moving the mounting portion only once, the mechanical distortion of the XYZ movement mechanism and the back during operation The correction value can be accurately specified as compared to the conventional configuration and method in which the correction value is specified by performing a second movement that may include a deviation amount due to rush. Therefore, according to this board | substrate inspection apparatus and board | substrate inspection method, the precision of probing can fully be improved, fully improving inspection efficiency.

  Further, in the substrate inspection apparatus according to claim 2 and the substrate inspection method according to claim 4, the correction values at the non-reference positions excluding the reference probe position are corrected values at a plurality of reference probe positions positioned around the non-reference position. It is specified by the interpolation process using. For this reason, according to the substrate inspection apparatus and the substrate inspection method, for example, the reference probe position (reference position) is defined by the number of probing positions, and the correction value specifying process is performed for the number of times without performing the process. By specifying correction values for a small number of reference probe positions, it is possible to specify correction values at other arbitrary non-reference positions from correction values at the reference probe positions. As a result, correction value specifying processing is performed in a short time. be able to.

1 is a configuration diagram showing a configuration of a substrate inspection apparatus 1. FIG. 4 is a plan view of a substrate holding unit 2, a reference plate 20, and a probing mechanism 3. FIG. It is the 1st explanatory view explaining the specification method of a correction value. It is the 2nd explanatory view explaining a specific method of a correction value. It is a 3rd explanatory drawing explaining the identification method of a correction value.

  Embodiments of a substrate inspection apparatus and a substrate inspection method according to the present invention will be described below with reference to the accompanying drawings.

  Initially, the structure of the board | substrate inspection apparatus 1 shown in FIG. 1 as an example of a board | substrate inspection apparatus is demonstrated. As shown in the figure, the substrate inspection apparatus 1 includes a substrate holder 2, a probing mechanism 3, cameras 4a and 4b (hereinafter also referred to as “camera 4” when not distinguished), and probes 5a and 5b (hereinafter referred to as not distinguished). (Also referred to as “probe 5”), a measurement unit 6, a control unit 7, and a storage unit 8.

  As shown in FIG. 2, the substrate holding unit 2 includes a mounting table 2a, and is configured to be able to hold a substrate 10 mounted on the mounting surface of the mounting table 2a and a reference plate 20 described later. In this case, the mounting table 2a has, for example, a suction function that sucks and holds the substrate 10 and the reference plate 20 placed on the placement surface.

  As shown in FIG. 2, the probing mechanism 3 includes a mounting portion 14 a to which the camera 4 a and the probe 5 a are attached and a mounting portion 14 b to which the camera 4 b and the probe 5 b are attached as shown in FIG. Is moved parallel to the mounting surface of the mounting table 2a on which the probe 5a is mounted, and is moved along a direction perpendicular to the substrate 10, thereby probing the probes 5a and 5b with respect to the substrate 10. Execute. In addition, the probing mechanism 3 moves the mounting portions 14a and 14b to the mounting surface of the mounting table 2a in the substrate holding unit 2 so that the camera 4 is positioned at a position facing the reference position Ps, which will be described later, under the control of the control unit 7. A camera movement process for moving in parallel with the camera is executed.

  Specifically, as an example, the probing mechanism 3 includes guide rails 11a to 11d (hereinafter, also referred to as “guide rail 11” when not distinguished) and sliders 12a to 12f (hereinafter, when not distinguished), as shown in FIG. (Also referred to as “slider 12”), vertical movement mechanisms 13a and 13b (hereinafter also referred to as “vertical movement mechanism 13” when not distinguished), and attachment portions 14a and 14b (hereinafter also referred to as “attachment portion 14” when not distinguished). It is configured with.

  The guide rails 11a and 11b are arranged in parallel as shown in FIG. The sliders 12a and 12b are disposed on the guide rail 11a so as to be slidable along the length direction of the guide rail 11a (X direction shown in the figure), and the sliders 12c and 12d are arranged in the length direction (X The guide rail 11b is slidable along the direction). Both ends of the guide rail 11c are fixed to the sliders 12a and 12c so as to be orthogonal to the guide rails 11a and 11b, and the guide rail 11d is orthogonal to the guide rails 11a and 11b. Both ends thereof are fixed to the sliders 12b and 12d.

  As shown in FIG. 2, the slider 12e is disposed on the guide rail 11c so as to be slidable along the length direction of the guide rail 11c (Y direction shown in FIG. 2). The slider 12f is the length of the guide rail 11d. The guide rail 11d is slidable along the direction (Y direction). Each slider 12 is driven by a driving mechanism (not shown) and is slid along the guide rail 11 on which each slider 12 is disposed.

  As shown in FIG. 2, the vertical movement mechanism 13a is disposed on the slider 12e, and moves the mounting portion 14a in the vertical direction (Z direction orthogonal to the X direction and the Y direction). Further, as shown in the figure, the vertical movement mechanism 13b is disposed on the slider 12f and moves the mounting portion 14b in the vertical direction.

  The cameras 4a and 4b are attached to the attachment portions 14a and 14b, respectively. Further, the cameras 4a and 4b are controlled by the control unit 7 so that the mounting surface side of the mounting table 2a in the substrate holding unit 2 (specifically, a reference hole H formed at a reference position Ps of a reference plate 20 described later). ). The probes 5a and 5b are attached to the attachment portions 14a and 14b, respectively. The probes 5a and 5b are connected to the measurement unit 6 via a connection cable (not shown). The measurement unit 6 performs measurement processing according to the control of the control unit 7 and measures physical quantities (voltage and current) based on electric signals input and output via the probes 5a and 5b.

  The control unit 7 controls each unit constituting the substrate inspection apparatus 1. Specifically, the control unit 7 controls probing processing and camera movement processing by the probing mechanism 3. In addition, the control unit 7 controls the image pickup by the camera 4 and executes a correction value specifying process for specifying a correction value for the amount of movement of the attachment unit 14 at the time of executing the probing process based on the image pickup result by the camera 4. The control unit 7 inspects the quality of the substrate 10 based on the physical quantity measured by the measurement unit 6.

  The storage unit 8 stores probing position data Dp indicating a position where the probe 5 is to be probed with respect to the substrate 10 (hereinafter also referred to as “probing position Pc”) and reference position data Ds indicating the reference position Ps. The storage unit 8 also includes a distance L between the camera 4 and the probe 5 attached to the attachment unit 14 (specifically, a distance Lx1 along the X direction shown in FIG. 5 and a distance along the Y direction). The distance data Dd indicating Ly1) is stored. Further, the storage unit 8 stores correction value data Dr generated by the control unit 7.

Next, a substrate inspection method using the substrate inspection apparatus 1 will be described with reference to the drawings.

  When the substrate inspection apparatus 1 is used to inspect the substrate 10 to be inspected, accurate probing can be performed by preventing the occurrence of displacement when the probes 5a and 5b are probed to the substrate 10 prior to the inspection. Therefore, a correction value specifying process for specifying a correction value for correcting the movement amount of the probes 5a and 5b during the probing process is executed. Specifically, first, as shown in FIG. 2, the reference plate 20 is placed while being aligned with a predetermined position on the placement table 2 a of the substrate holder 2. As an example, the reference plate 20 is placed at the center of the placement surface so that the center of the placement surface in the placement table 2a and the center of the reference plate 20 coincide (oppose). Next, the reference plate 20 is held by the suction function of the mounting table 2a. In this case, this reference | standard board 20 is formed in the rectangle with ceramics, glass, etc. as an example. Further, as shown in the figure, the reference plate 20 has, for example, reference holes H at 20 predetermined reference positions Ps in a total of 20 rows along the long direction and 4 rows along the short direction. Each is formed. In the substrate inspection apparatus 1, the reference position data Ds indicating each reference position Ps in a state where the reference plate 20 is placed on the center portion of the placement surface of the placement table 2 a of the substrate holder 2 is stored in advance in the storage unit 8. Is remembered.

  Next, an operation unit (not shown) is operated to instruct the start of the correction value specifying process. In response to this, the control unit 7 reads the reference position data Ds from the storage unit 8. Subsequently, the control unit 7 selects one of the 20 reference positions Ps on the reference plate 20 (for example, the lower left reference position Ps1 shown in FIG. 3) based on the reference position data Ds. Next, the control unit 7 controls the probing mechanism 3 to execute the camera movement process, and as shown in FIG. 3, the initial position of the camera 4a is set so that the camera 4a is located at a position facing the reference position Ps1. The attachment portion 14a is moved by the distance between the position and the reference position Ps1.

  Subsequently, the control unit 7 controls the camera 4a to image the reference hole H1 (around the reference hole H1 including the reference hole H1) formed at the reference position Ps1, and performs analysis processing on the captured image. Then, it is determined whether or not a predetermined reference point (for example, the center C shown in FIG. 4) in the imaging region of the camera 4a is located at the reference position Ps1 (reference hole H1). To do.

  Here, when there is a mechanical distortion of the probing mechanism 3 or when a backlash occurs when the mounting portion 14a is moved, as described above, the distance between the initial position of the camera 4a and the reference position Ps1. Even if an instruction to move the mounting portion 14a by the distance is given, there is a difference between the instructed distance and the actual moving distance. As a result, the center C and the reference position Ps1 are displaced as shown in FIG. Sometimes. When such a positional deviation occurs, the control unit 7 determines that, and then, by the above-described image analysis processing, the positional deviation amount G between the center C and the reference position Ps1, specifically, Finds a distance Lx2 along the X direction between the center C and the reference position Ps1 and a distance Ly2 along the Y direction (both refer to the figure).

  Subsequently, the control unit 7 reads the distance data Dd from the storage unit 8. Next, the control unit 7 determines the distance L between the camera 4 and the probe 5 attached to the attachment unit 14 (specifically, the distance Lx1 along the X direction and the Y direction based on the distance data Dd). Distance Ly1: see FIG. 5). Subsequently, the control unit 7 determines the position of the probe 5a when the camera 4a is located at the position opposite to the reference position Ps (in this example, the reference position Ps1) from which the displacement G is obtained (hereinafter referred to as “reference probe”). Is also referred to as “position Pp” (see FIG. 5)) based on the distance L and the positional deviation amount G. Next, the control unit 7 specifies the positional deviation amount G at the reference position Ps1 as a correction value at the reference probe position Pp, and stores correction value data Dr indicating the correction value in the storage unit 8.

  Subsequently, the control unit 7 selects the other one of the reference positions Ps on the reference plate 20, and then executes the above-described processes to obtain the positional deviation amount G at the reference position Ps. A correction value at the reference probe position Pp corresponding to the reference position Ps is specified, and correction value data Dr indicating the correction value is stored in the storage unit 8. Thereafter, the control unit 7 similarly obtains each positional deviation amount G at all other reference positions Ps and specifies each positional deviation amount G as a correction value at the reference probe position Pp corresponding to each reference position Ps. Then, correction value data Dr indicating the correction value is stored in the storage unit 8.

  Subsequently, the control unit 7 performs the same processing for the camera 4b and the probe 5b. Specifically, the control unit 7 controls the probing mechanism 3 to execute a camera movement process, and the camera when the attachment unit 14b is moved so that the camera 4b is located at a position facing the reference position Ps. A correction value specifying process for obtaining a positional deviation amount G between the center C of the imaging region 4b and the reference position Ps and specifying a correction value at the reference probe position Pp corresponding to the reference position Ps based on the positional deviation amount G. Is executed for each reference position Ps. Further, the control unit 7 causes the storage unit 8 to store correction value data Dr indicating the specified correction value. Thus, the specification of the correction value is completed.

  Next, the substrate 10 to be inspected is inspected. Specifically, the substrate 10 is placed and held at the center of the placement surface so that the center of the placement surface of the placement table 2a of the substrate holding portion 2 and the center of the substrate 10 coincide (oppose). Subsequently, an operation unit (not shown) is operated to instruct the start of inspection. In response to this, the control unit 7 reads the probing position data Dp from the storage unit 8. Next, the control unit 7 specifies the probing position Pc at which the probes 5a and 5b are to be probed based on the probing position data Dp.

  Subsequently, the control unit 7 specifies a correction value at the specified probing position Pc. In this case, when the probing position Pc matches any of the above-described reference probe positions Pp, the control unit 7 reads correction value data Dr indicating the correction value at the reference probe position Pp from the storage unit 8. Next, the control unit 7 corrects the distance between the initial positions of the probes 5a and 5b and the probing position Pc with the correction value indicated by the correction value data Dr, and moves the attachment parts 14a and 14b by the corrected distance. An instruction to move is given to the probing mechanism 3. In response to this, the probing mechanism 3 executes the probing process. Thereby, the probes 5a and 5b are correctly probed (contacted) at the probing position Pc.

  Subsequently, the control unit 7 controls the measurement unit 6 to execute measurement processing. In this measurement process, the measurement unit 6 outputs measurement electrical signals via the probes 5a and 5b, and measures physical quantities (voltage and current) based on the electrical signals input via the probes 5a and 5b. Next, the control unit 7 determines the quality of the substrate 10 based on the physical quantity measured by the measurement unit 6.

  On the other hand, when there is no reference probe position Pp that coincides with the probing position Pc, that is, when the probing position Pc corresponds to a non-reference position excluding the reference probe position Pp, the correction value at the probing position Pc is specified by interpolation processing. In this interpolation processing, the control unit 7 specifies a plurality (four as an example) of reference probe positions Pp around the probing position Pc (close to the probing position Pc). Next, the control unit 7 reads out correction value data Dr indicating correction values at the plurality of reference probe positions Pp from the storage unit 8. Subsequently, the control unit 7 specifies the correction value at the probing position Pc by, for example, affine transformation using each correction value. Instead of affine transformation, various transformations such as pseudo affine transformation and Helmart transformation can also be employed.

  Next, the control unit 7 corrects the distance between the initial positions of the probes 5a and 5b and the probing position Pc with the correction value specified by the interpolation process, and moves the attachment units 14a and 14b by the corrected distance. An instruction is given to the probing mechanism 3. Accordingly, the probes 5a and 5b are accurately probed at the probing position Pc corresponding to the non-reference position. Subsequently, the control unit 7 determines pass / fail of the substrate 10 based on the physical quantity measured by the measurement unit 6. Hereinafter, the control unit 7 causes the probing mechanism 3 to perform a probing process for each probing position Pc, and causes the measurement unit 6 to perform a measurement process to determine whether the substrate 10 is acceptable.

  As described above, in the substrate inspection apparatus 1 and the substrate inspection method, the center C of the imaging region of the camera 4 and the reference position Ps when the mounting portion 14 is moved so that the camera 4 is positioned at a position opposite to the reference position Ps. A correction value specifying process for determining the correction value at the reference probe position Pp based on the distance L between the camera 4 and the probe 5 and the positional shift amount G. Execute for position Pp. For this reason, according to this board | substrate inspection apparatus 1 and the board | substrate inspection method, the process which moves the camera 4 (attachment part 14) to the position facing the reference position Ps is performed only once, and the center C of the imaging area of the camera 4 and the reference | standard By obtaining the positional deviation amount G from the position Ps, the correction value at the reference probe position Pp can be specified based on the positional deviation amount G. Therefore, according to the substrate inspection apparatus 1 and the substrate inspection method, the number of reference probe positions Pp to be specified (reference position Ps) is compared with the conventional configuration and method in which processing is performed twice for one reference position. The processing time of the process of specifying the correction value when there is a large number can be sufficiently shortened. Moreover, in this board | substrate inspection apparatus 1 and a board | substrate inspection method, since the process which moves the attachment part 14 is performed only once and the correction value is specified, the mechanical distortion of an XYZ moving mechanism and the time of an operation | movement are carried out. Compared with the conventional configuration and method of specifying the correction value by performing the second movement that may include a deviation amount due to the backlash, the correction value can be specified accurately. Therefore, according to this board | substrate inspection apparatus 1 and a board | substrate inspection method, the precision of probing can fully be improved, fully improving inspection efficiency.

  In the substrate inspection apparatus 1 and the substrate inspection method, the correction value at the non-reference position excluding the reference probe position Pp is specified by interpolation processing using the correction values at the plurality of reference probe positions Pp located around the non-reference position. To do. Therefore, according to the substrate inspection apparatus 1 and the substrate inspection method, for example, the reference probe position Pp (reference position Ps) is defined by the number of probing positions, and the correction value specifying process is executed for the number of times. Instead, by specifying the correction values for a small number (20 in the above example) of the reference probe positions Pp, the correction values at other arbitrary non-reference positions are specified from the correction values at the reference probe positions Pp. As a result, the correction value specifying process can be performed in a short time.

  The substrate inspection apparatus and the substrate inspection method are not limited to the above configuration and method. For example, although the configuration and method including two mounting portions 14 to which the camera 4 and the probe 5 are mounted have been described above, the number thereof is not limited to two and can be defined as one or any plurality. The configuration and method for specifying the correction value at the non-reference position by interpolation processing have been described above. However, when the probing position Pc is the non-reference position, the probing is performed using the correction value at the reference probe position Pp closest to the probing position Pc. A configuration and a method for correcting the movement amount of the attachment portion 14 in the processing can also be adopted.

DESCRIPTION OF SYMBOLS 1 Board | substrate inspection apparatus 2 Board | substrate holding | maintenance part 2a Mounting stand 3 Probing mechanism 4a, 4b Camera 5a, 5b Probe 7 Control part 10 Board | substrate 14a, 14b Mounting part 20 Reference | standard board C Center part Ds Reference | standard position data G Reference | standard displacement amount H | reference hole Lx1 , Lx2, Ly1, Ly2 Distance Pc Probing position Pp Reference probe position Ps Reference position

Claims (4)

A probing mechanism for performing a probing process for probing the probe with respect to the substrate by moving a mounting portion to which the probe and the camera are mounted in parallel to the mounting surface on which the substrate to be inspected is mounted;
A control unit for controlling the probing process by the probing mechanism and for specifying a correction value for the amount of movement of the attachment unit at the time of execution of the probing process based on an imaging result by the camera, and through the probe. A substrate inspection apparatus for inspecting the substrate based on an electric signal input / output,
The control unit moves the mounting unit with respect to the probing mechanism so that the camera is positioned at a position opposite to the reference position based on data indicating a predetermined reference position on the placement surface. A reference probe in which the probe is located when the camera is located at the opposite position, while obtaining a positional deviation amount between a predetermined reference point and the reference position in the imaging area of the camera A correction value specifying process for specifying the correction value at a position based on the distance between the camera and the probe and the amount of positional deviation is performed for a plurality of the reference probe positions, and the correction value specifying process is performed based on the specified correction value. A board inspection apparatus that corrects the amount of movement of the mounting portion during execution of a probing process.   The control unit identifies the correction value at a non-reference position excluding the reference probe position by an interpolation process using the correction values at a plurality of the reference probe positions located around the non-reference position. Board inspection equipment. The mounting portion at the time of performing a probing process in which a mounting portion to which the probe and the camera are mounted is moved in parallel with the mounting surface on which the substrate to be inspected is mounted and the probe is probed with respect to the substrate. A substrate inspection method for inspecting the substrate based on an electrical signal input / output via the probe, specifying a correction value for the movement amount of the camera based on an imaging result by the camera,
Based on the data indicating the predetermined reference position on the placement surface, the predetermined position in the imaging region of the camera when the mounting portion is moved so that the camera is positioned at a position opposite to the reference position. The amount of positional deviation between the determined reference point and the reference position is obtained, and the correction value at the reference probe position at which the probe is located when the camera is located at the opposite position is determined from the camera and the probe. A correction value specifying process that is specified based on the distance between the reference position and the amount of positional deviation is performed for a plurality of the reference probe positions, and the attachment portion is moved when the probing process is executed based on the specified correction value. Substrate inspection method that corrects the amount.   4. The substrate inspection method according to claim 3, wherein the correction value at a non-reference position excluding the reference probe position is specified by an interpolation process using the correction values at a plurality of the reference probe positions located around the non-reference position.

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