JP2012169429A - Heat exchanger - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat exchanger which improves heat exchange efficiency.SOLUTION: A heat medium passage 30 is divided into multiple narrow passages 333 in a passage pipe 3, and an inner fin 33 facilitating heat exchange between a heat medium and an electronic component 2 is provided. The inner fin 33 is formed by positioning protruding parts on one side and the other side alternately so that a cross section perpendicular to a flow direction of the heat medium has a bending wave shape. When a distance between the centers of the adjacent protruding parts on the same side, from among the one side and the other side, in the cross section shape is referred to as a fin pitch FP, the inner fin 33 is composed of multiple fin parts 33A and 33B which have the different fin pitches FP.

Description

  The present invention relates to a heat exchanger that exchanges heat between a heat medium that flows through a flow channel pipe and a heat exchange object disposed outside the flow pipe.

  Conventionally, in this type of heat exchanger, in order to improve the heat exchange performance, the heat transfer area between the heat medium and the flow path tube is increased in the flow path tube through which the heat medium flows, and the heat medium and the heat exchange target The thing provided with the inner fin which accelerates | stimulates heat exchange with a thing is proposed (for example, refer patent document 1).

JP 2005-191527 A

  By the way, in the heat exchanger described in the above-mentioned Patent Document 1, when the width dimension inside the flow path pipe does not coincide with a value obtained by multiplying the fin pitch of the inner fin by an integral multiple, the inner fin extends over the entire width direction of the flow path pipe. Cannot be placed. That is, a region where no inner fin exists in a part of the flow path pipe is generated. In this case, since the heat medium flows preferentially in the region where the inner fin is not present, the flow rate of the heat medium flowing in the region where the inner fin is present in the flow path pipe is decreased, and the heat exchange efficiency may be decreased. is there.

  An object of this invention is to provide the heat exchanger which can improve heat exchange efficiency in view of the said point.

  In order to achieve the above object, according to the first aspect of the present invention, in the flow path forming member (3), the heat medium flow path (30) is divided into a plurality of narrow flow paths (333), and the heat medium and Inner fins (33) that promote heat exchange with the heat exchange target object 2 are provided, and the inner fins (33) have a cross-sectional shape perpendicular to the flow direction of the heat medium, with protrusions on one side and the other side. In the cross-sectional shape, the distance between the centers of adjacent convex portions on the same side of one side and the other side is defined as a fin pitch (FP). The inner fin (33) is characterized by having a plurality of fin portions (33A, 33B) having different fin pitches (FP).

  As described above, the inner fin (33) is configured by the plurality of fin portions (33A, 33B) having different fin pitches (FP), so that the fin pitch (FP) is a part of the inner fin (33). A finer part is made. For this reason, according to the length of the flow path forming member (3) in the width direction, the fin pitch (FP) is changed by changing the length of the fin section in the flow path width direction or the fin pitch (FP). A fin (33) can be arrange | positioned over the whole area of the width direction of a flow-path formation member (3). Thereby, since it can suppress that a heat carrier preferentially flows into a part of heat carrier channel (30) in a channel formation member (3), it becomes possible to improve heat exchange efficiency.

  Moreover, in invention of Claim 2, in the heat exchanger of Claim 1, among the several fin parts (33A, 33B), the fin part with the finest fin pitch (FP) is the first fin part ( 33A), the fin portion having a fin pitch (FP) coarser than that of the first fin portion (33A) is defined as the second fin portion (33B), and the heat medium flow direction and heat exchange with the flow path forming member (3) are performed. When the direction perpendicular to the arrangement direction with the object (2) is the flow path width direction, the length of the first fin part (33A) in the flow path width direction is the length of the second fin part (33B). It is characterized by being shorter than the fin pitch (FP).

  Since the first fin portion (33A) has a fine fin pitch (FP), the pressure loss generated in the heat medium flowing through the narrow flow path (333) divided by the first fin portion (33A) increases. For this reason, the length of the first fin portion (33A) in the channel width direction is made shorter than the fin pitch (FP) of the second fin portion (33B), so that the second fin portion with a coarse fin pitch (FP) is obtained. (33B) can be arranged as much as possible. Thereby, since the increase in the pressure loss which arises in a heat medium can be suppressed, it becomes possible to improve a heat exchange efficiency more.

  Moreover, in invention of Claim 3, in the heat exchanger of Claim 1 or 2, the heat exchange target object (2) is arrange | positioned in the part of the exterior of a flow-path formation member (3). The first fin portion (33A) is provided in a portion other than the portion corresponding to the heat exchange object (2) in the flow path forming member (3).

  Thus, by arranging the first fin portion (33A) with a fine fin pitch (FP) in a portion other than the portion corresponding to the heat exchange object (2) in the flow path forming member (3), The pressure loss generated in the heat medium flowing through the portion other than the portion corresponding to the heat exchange object (2) in the path forming member (3) increases. As a result, the flow rate of the heat medium flowing into the portion corresponding to the heat exchange object (2) in the flow path forming member (3) increases, that is, the flow velocity increases and the heat exchange efficiency can be further improved. It becomes possible.

  Moreover, in invention of Claim 4, in the heat exchanger of Claim 3, an inner fin (33) is a board part (331) which divides | segments a narrow flow path (333) while extending in the flow direction of a heat carrier. And a connecting portion (332) that connects between adjacent plate portions (331), and the cross-sectional shape orthogonal to the flow direction of the heat medium is wavy, and the flow path forming member (3) and the heat exchange object When viewed from the arrangement direction with (2), the plate portion (331) is a wave fin that refracts in a wave shape in the flow direction of the heat medium, and is perpendicular to the arrangement direction of the inner fin (33) and is a trickle When the dimension in the amplitude direction of the wave shape of the plate portion (331) in the cross section passing through the central portion in the arrangement direction in the path (333) is the wave depth (WD), the wave depth of the first fin portion (33A) (WD) is the second fin portion (3 Is characterized by deeper than the wave depth B) (WD).

  Thus, by arranging the first fin portion (33A) having a deep wave depth (WD) in a portion other than the portion corresponding to the heat exchange object (2) in the flow path forming member (3), The pressure loss generated in the heat medium flowing through the part other than the part corresponding to the heat exchange object (2) in the flow path forming member (3) increases. As a result, the flow rate of the heat medium flowing into the portion corresponding to the heat exchange object (2) in the flow path forming member (3) increases, that is, the flow velocity increases and the heat exchange efficiency can be further improved. It becomes possible.

  Further, in the invention according to claim 5, in the heat exchanger according to claim 3, the inner fin (33) extends in the flow direction of the heat medium and divides the narrow channel (333) into the plate portion (331). And a connecting portion (332) that connects between adjacent plate portions (331), and the cross-sectional shape orthogonal to the flow direction of the heat medium is wavy, and the flow path forming member (3) and the heat exchange object When viewed from the arrangement direction with (2), the plate portion (331) is a wave fin that refracts in a wave shape in the flow direction of the heat medium, and is perpendicular to the arrangement direction of the inner fin (33) and is a trickle When the wave shape pitch of the plate portion (331) in the cross section passing through the central portion in the arrangement direction in the path (333) is the wave pitch (WP), the wave pitch (WP) of the first fin portion (33A) is C of the second fin part (33B) It is characterized in that finer Bupitchi (WP).

  Thus, by arranging the first fin portion (33A) having a fine wave pitch (WP) in a portion other than the portion corresponding to the heat exchange object (2) in the flow path forming member (3), The pressure loss generated in the heat medium flowing through the portion other than the portion corresponding to the heat exchange object (2) in the path forming member (3) increases. As a result, the flow rate of the heat medium flowing into the portion corresponding to the heat exchange object (2) in the flow path forming member (3) increases, that is, the flow velocity increases and the heat exchange efficiency can be further improved. It becomes possible.

  In addition, the code | symbol in the bracket | parenthesis of each means described in this column and the claim shows the correspondence with the specific means as described in embodiment mentioned later.

It is a front view which shows the laminated heat exchanger 1 which concerns on 1st Embodiment. It is AA sectional drawing of FIG. It is an expanded sectional view showing channel pipe 3 neighborhood in a 2nd embodiment. It is an expanded sectional view showing channel pipe 3 neighborhood in a 3rd embodiment. It is an expanded sectional view showing channel pipe 3 neighborhood in a 4th embodiment. It is an expanded sectional view showing channel pipe 3 neighborhood in a 5th embodiment. It is BB sectional drawing of FIG. It is an expanded sectional view showing inner fin 33 neighborhood in a 6th embodiment. It is a permeation | transmission perspective view which shows the heat exchanger which concerns on 7th Embodiment. It is CC sectional drawing of FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, the same or equivalent parts are denoted by the same reference numerals in the drawings.

(First embodiment)
A first embodiment of the present invention will be described with reference to FIGS. 1 and 2. FIG. 1 is a front view showing a stacked heat exchanger 1 according to the first embodiment.

  As shown in FIG. 1, the laminated heat exchanger 1 of the present embodiment cools a plurality of electronic components 2 as heat exchange objects from both sides, and a heat medium flow path 30 (see FIG. 2), and a communication member 4 that communicates the plurality of flow channel tubes 3. The plurality of flow path pipes 3 are formed in a flat shape, and a plurality of the flow path pipes 3 are arranged so as to sandwich the electronic component 2 from both sides.

  In the present embodiment, as the electronic component 2, a semiconductor module incorporating a semiconductor element such as an IGBT and a diode is used. The semiconductor module can be used for an inverter for automobiles, a motor drive inverter for industrial equipment, an air conditioner inverter for building air conditioning, and the like. In addition to the semiconductor module, for example, a power transistor, a power FET, an IGBT, or the like can be used as the electronic component 2.

  In addition, fluid such as air, water, oil is used as the heat medium. More specifically, for example, when the stacked heat exchanger 1 is mounted on an automobile, automobile cooling water, oil, or the like can be used as the heat medium. In the present embodiment, water mixed with an ethylene glycol antifreeze is used as the heat medium.

  FIG. 2 is a cross-sectional view taken along the line AA of FIG. As shown in FIG. 2, the channel tube 3 of this embodiment has a so-called drone cup structure. That is, the flow path pipe 3 is configured to have a pair of outer shell plates 31, and the heat medium flow path 30 is formed between the pair of outer shell plates 31. An inner fin 33 that divides the heat medium flow path 30 into a plurality of narrow flow paths 333 and promotes heat exchange between the heat medium and the electronic component 2 is provided in the flow path pipe 3.

Returning to FIG. 1, the electronic component 2 is disposed on a part of the outside of the flow path tube 3. Specifically, two electronic components 2 are provided for each of the pair of outer shell plates 31 of the channel tube 3. The two electronic components 2 provided on each outer shell plate 31 are arranged in series in the flow direction of the heat medium. In the present embodiment, two electronic components 2 are provided on each outer shell plate 31, but one electronic component 2 may be provided, or three or more electronic components 2 may be provided. At both ends in the longitudinal direction of the outer shell plate 31 of the channel tube 3, a substantially cylindrical flange portion 300 that protrudes to the outside, that is, the side of the other adjacent channel tube 3 is formed. And the communication member 4 which connects the several flow path pipes 3 is formed by joining the flange parts 300 of the adjacent flow path pipes 3 by brazing.

  When the channel tube 3 disposed on the outermost side in the stacking direction among the plurality of channel tubes 3 is an outer channel tube 3a, both ends in the longitudinal direction of one outer channel tube 3a of the two outer channel tubes 3a. The unit is connected with a heat medium inlet 401 for introducing the heat medium into the laminated heat exchanger 1 and a heat medium outlet 402 for discharging the heat medium from the laminated heat exchanger 1, respectively. Yes. The heat medium introduction port 401 and the heat medium discharge port 402 are joined to one outer flow path pipe 3a by brazing. In addition, the flow path pipe 3, the communication member 4, the heat medium introduction port 401, and the heat medium discharge port 402 of this embodiment are made of aluminum.

  The heat medium introduced from the heat medium introduction port 401 flows into the flow channel pipes 3 from one end in the longitudinal direction through the communication member 4, and the inside of each heat medium flow channel 30 to the other end. It flows toward. The heat medium is discharged from the heat medium discharge port 402 through the communication member 4. As described above, while the heat medium flows through the heat medium flow path 30, heat exchange is performed with the electronic component 2 to cool the electronic component 2.

  As shown in FIG. 2, the inner fin 33 is a wave whose cross-sectional shape perpendicular to the flow direction of the heat medium, that is, the longitudinal direction of the flow channel tube 3 is bent with the convex portions alternately positioned on one side and the other side. It is formed into a shape. Specifically, the inner fin 33 includes a plate portion 331 that extends in the longitudinal direction of the flow channel tube and divides the narrow flow channel 333, and a connecting portion 332 that connects adjacent plate portions 331, and the longitudinal direction of the flow channel tube. A straight fin having a cross-sectional shape orthogonal to the shape of a trapezoidal wave.

  The inner fin 33 has two fin portions 33A and 33B having different fin pitches FP. In the present embodiment, the two fin portions 33A and 33B are integrally formed.

  Here, the fin pitch FP is a cross-sectional shape orthogonal to the longitudinal direction of the flow path pipe of the inner fin 33, and is a convex portion adjacent on the same side of one side and the other side, that is, between the centers of the connecting portions 332. Say distance. Of the two fin portions 33A and 33B, the one having the finest fin pitch FP is referred to as a first fin portion 33A, and the one having a fin fin FP coarser than the first fin portion 33A is referred to as a second fin portion 33B. Further, the flow direction is perpendicular to both the longitudinal direction of the flow path tube 3 (that is, the flow direction of the heat medium) and the stacking direction of the flow path tubes 3 (that is, the arrangement direction of the flow path tube 3 and the electronic component 2). The road width direction.

  The length L1 in the flow path width direction of the first fin portion 33A is shorter than the fin pitch FP2 of the second fin portion 33B. In other words, the first fin portion 33A is disposed in a region corresponding to one pitch of the second fin portion 33B. In the present embodiment, the first fin portion 33A is disposed at one end in the flow path width direction.

  As described above, the inner fin 33 is constituted by the first fin portion 33A and the second fin portion 33B having different fin pitches FP, so that a portion of the inner fins 33 having a finer fin pitch FP than the other portions. Can do. For this reason, according to the length in the width direction of the flow path tube 3, by changing the portion where the fin pitch FP is fine, that is, the length L1 in the flow path width direction of the first fin portion 33A and the fin pitch FP1, The inner fins 33 can be arranged over the entire width direction of the flow channel tube 3. As a result, it is possible to prevent the heat medium from flowing preferentially to a part of the heat medium flow path 30 in the flow path pipe 3, so that the heat exchange efficiency can be improved.

  Incidentally, since the first fin portion 33A has a finer fin pitch FP than the second fin portion 33B, the heat flowing through the narrow channel 333 (hereinafter referred to as the first narrow channel 333A) divided by the first fin unit 33A. The pressure loss generated in the medium is larger than the pressure loss generated in the heat medium flowing through the narrow channel 333 divided by the second fin portion 33B (hereinafter referred to as the second narrow channel 333B).

  For this reason, in the present embodiment, the length L1 of the first fin portion 33A in the flow path width direction is shorter than the fin pitch FP2 of the second fin portion 33B. According to this, since it is possible to arrange as many second fin portions 33B with a coarse fin pitch FP as possible, it is possible to suppress an increase in pressure loss that occurs in the heat medium. Therefore, it is possible to further improve the heat exchange efficiency.

(Second Embodiment)
Next, a second embodiment of the present invention will be described with reference to FIG. The second embodiment is different from the first embodiment in that two first fin portions 33A are provided. FIG. 3 is an enlarged cross-sectional view showing the vicinity of the flow path pipe 3 in the second embodiment, and corresponds to FIG. 2 of the first embodiment.

  As shown in FIG. 3, the length of the electronic component 2 in the flow path width direction is shorter than the length of the flow path tube 3 in the flow path width direction. Further, the electronic component 2 is disposed at the center portion in the flow path width direction outside the flow path tube 3.

  The inner fin 33 has two first fin portions 33A and one second fin portion 33B. More specifically, one first fin portion 33A is disposed on each side of one second fin portion 33B. The second fin portion 33 </ b> B is provided in a portion corresponding to the electronic component 2 in the flow channel tube 3, that is, a portion facing the electronic component 2 in the flow channel tube 3 through the flow channel tube 3. 33 A of 1st fin parts are each provided in parts other than the site | part corresponding to the electronic component 2 in the flow path pipe | tube 3. As shown in FIG.

  As described above, by arranging the first fin portion 33A having a fine fin pitch FP in a portion other than the portion corresponding to the electronic component 2 in the flow channel tube 3, the electronic component 2 in the flow channel tube 3 The pressure loss generated in the heat medium flowing through the part other than the corresponding part increases. As a result, the flow rate of the heat medium flowing into the portion corresponding to the electronic component 2 in the flow channel tube 3 increases, that is, the flow velocity increases, and the heat exchange efficiency can be further improved.

(Third embodiment)
Next, a third embodiment of the present invention will be described with reference to FIG. The third embodiment is different from the second embodiment in that the inner fins 33 are stacked in two stages. FIG. 4 is an enlarged cross-sectional view showing the vicinity of the flow path pipe 3 in the third embodiment, corresponding to FIG. 3 of the second embodiment.

  As shown in FIG. 4, the inner fin 33 is disposed between the pair of outer shell plates 31, that is, in the heat medium flow path 30, in the stacking direction of the flow path pipes 3, that is, in the arrangement direction of the electronic component 2 and the flow path pipe 3. Are arranged in two layers. The inner fins 33 at each stage are configured in the same manner as in the second embodiment. In other words, each of the inner fins 33 at each stage is provided with one first fin portion 33A on each side of one second fin portion 33B. And the 2nd fin part 33B is provided in the site | part corresponding to the electronic component 2 in the flow path tube 3, and the 1st fin part 33A is other than the site | part corresponding to the electronic component 2 in the flow path tube 3. It is provided at the site. In the present embodiment, the two-layered inner fins 33 are arranged symmetrically with respect to a virtual plane orthogonal to the stacking direction of the flow path tubes 3.

  As described above, in the present embodiment, the inner fins 33 are arranged in two layers, and the fin pitch of the inner fins 33 is disposed in a portion other than the portion corresponding to the electronic component 2 in the flow path tube 3. The first fin portion 33A having a fine FP is arranged. Thereby, the pressure loss which arises in the heat medium which distribute | circulates parts other than the site | part corresponding to the electronic component 2 in the flow path tube 3 becomes large, and the heat medium which flows into the site | part corresponding to the electronic component 2 in the flow path tube 3 Since the flow rate increases, that is, the flow velocity increases, the same effect as in the second embodiment can be obtained.

(Fourth embodiment)
Next, a fourth embodiment of the present invention will be described with reference to FIG. The fourth embodiment is different from the second embodiment in that the inner fins 33 are arranged in three layers. FIG. 5 is an enlarged cross-sectional view showing the vicinity of the flow path pipe 3 in the fourth embodiment, corresponding to FIG. 3 in the second embodiment.

  As shown in FIG. 5, the inner fins 33 are disposed between the pair of outer shell plates 31, that is, in the heat medium flow path 30, in the stacking direction of the flow path pipes 3, that is, in the arrangement direction of the electronic component 2 and the flow path pipe 3. Are arranged in three layers. Here, of the three-stage inner fins 33, the two inner fins 33 adjacent to the outer shell plate 31 are referred to as outer inner fins 334, and one inner fin 33 disposed between the two inner fins 33 is the inner side. It is called the inner fin 335.

  The outer inner fin 334 is configured in the same manner as in the second embodiment. That is, each of the outer inner fins 334 is provided with one first fin portion 33A on each side of one second fin portion 33B. And the 2nd fin part 33B is provided in the site | part corresponding to the electronic component 2 in the flow path tube 3, and the 1st fin part 33A is other than the site | part corresponding to the electronic component 2 in the flow path tube 3. It is provided at the site.

The inner inner fin 335 is formed so that the fin pitch FP _in is substantially equal to the fin pitch FP1 of the first fin portion 33A having the finest fin pitch FP among the outer inner fins 334.

  As described above, in the present embodiment, the inner fins 33 are arranged in three layers, and the fin pitch of the outer inner fins 334 is disposed in a portion other than the portion corresponding to the electronic component 2 in the flow channel tube 3. The first fin portion 33A having a fine FP is arranged. Thereby, the pressure loss which arises in the heat medium which distribute | circulates parts other than the site | part corresponding to the electronic component 2 in the flow path tube 3 becomes large, and the heat medium which flows into the site | part corresponding to the electronic component 2 in the flow path tube 3 Since the flow rate increases, that is, the flow velocity increases, the same effect as in the second embodiment can be obtained.

Further, in the present embodiment, the fin pitch FP _in of the inner inner fin 335 is substantially equal to the fin pitch FP1 of the first fin portion 33A having the finest fin pitch FP among the outer inner fins 334. Thereby, the pressure loss which arises in the heat medium which distribute | circulates the site | part in which the inner side inner fin 335 was provided, ie, the flow path pipe lamination direction center part which does not correspond to the electronic component 2 in the flow path pipe 3, becomes large. For this reason, since the flow velocity of the heat medium flowing into the channel tube stacking direction outer side corresponding to the electronic component 2 in the channel tube 3 is increased, the heat exchange efficiency can be improved more reliably.

(Fifth embodiment)
Next, a fifth embodiment of the present invention will be described with reference to FIGS. The fifth embodiment is different from the second embodiment in that wave fins are used as the inner fins 33. FIG. 6 is an enlarged cross-sectional view showing the vicinity of the flow path pipe 3 in the fifth embodiment, corresponding to FIG. 3 in the second embodiment.

  As shown in FIG. 6, the inner fin 33 of the present embodiment connects the plate portion 331 that extends in the longitudinal direction of the flow channel (the flow direction of the heat medium) and divides the narrow flow channel 333 and the adjacent plate portions 331. The cross-sectional shape perpendicular to the longitudinal direction of the flow channel tube is wavy and has a plate portion when viewed from the flow channel stacking direction (the arrangement direction of the flow channel tube 3 and the electronic component 2). Reference numeral 331 denotes a wave fin that refracts into a wave shape in the flow direction of the heat medium. Thereby, mixing of the heat medium can be promoted by forming a heat medium flow in the flow path width direction in the flow path pipe 3.

  7 is a cross-sectional view taken along line BB in FIG. Here, the dimension in the amplitude direction of the wave shape of the plate portion 331 in the cross section of the inner fin 33 perpendicular to the flow channel stacking direction and passing through the central portion of the narrow flow channel 333 in the flow channel stacking direction is defined as the wave depth. WD.

  As shown in FIG. 7, the wave depth WD1 of the first fin portion 33A is formed deeper than the wave depth WD2 of the second fin portion 33B. For this reason, the pressure loss generated in the heat medium flowing through the first narrow channel 333A divided by the first fin portion 33A is the pressure generated in the heat medium passing through the second narrow channel 333B divided by the second fin portion 33B. Greater than loss.

  Therefore, the flow rate of the heat medium in the second narrow channel 333B is larger than the flow rate of the heat medium in the first narrow channel 333A. That is, since the flow velocity of the heat medium flowing into the second narrow channel 333B corresponding to the electronic component 2 is increased, the heat exchange efficiency can be further improved.

(Sixth embodiment)
Next, a sixth embodiment of the present invention will be described with reference to FIG. The sixth embodiment is different from the fifth embodiment in the wave pitch WP of the inner fins 33. FIG. 8 is an enlarged cross-sectional view showing the vicinity of the inner fin 33 in the sixth embodiment, corresponding to FIG. 7 in the fifth embodiment.

  Here, the wave pitch WP is the wave pitch of the plate portion 331 in the cross section of the inner fin 33 that is orthogonal to the channel tube stacking direction and passes through the center of the narrow channel 333 in the channel tube stacking direction. . As shown in FIG. 8, the wave pitch WP1 of the first fin portion 33A is formed finer than the wave pitch WP2 of the second fin portion 33B. For this reason, the pressure loss generated in the heat medium flowing through the first narrow channel 333A is larger than the pressure loss generated in the heat medium passing through the second narrow channel 333B.

  Therefore, the flow rate of the heat medium in the second narrow channel 333B is larger than the flow rate of the heat medium in the first narrow channel 333A. That is, since the flow velocity of the heat medium flowing into the second narrow channel 333B corresponding to the electronic component 2 is increased, the heat exchange efficiency can be further improved.

(Seventh embodiment)
Next, a seventh embodiment of the present invention will be described with reference to FIGS. The seventh embodiment includes a semiconductor mounting body in which the heat exchanger of the present invention is formed by sealing a semiconductor element as a heat exchange object with a heat dissipation metal body connected by a sealing material, This is applied to a heat exchanger in which the heat radiating surface of the metal body is cooled by a heat medium.

  FIG. 9 is a partially transparent perspective view showing a heat exchanger according to the seventh embodiment, and FIG. 10 is a sectional view taken along the line CC in FIG. As shown in FIG. 10, the semiconductor mounting body 51 is interposed between the first semiconductor chip 511 and the second semiconductor chip 512 as semiconductor elements, the lower heat sink 520 and the upper heat sink 530 as metal bodies. Each solder 541 and 542 as a conductive bonding member and a mold resin 550 as a sealing material are further provided.

  In the semiconductor mounting body 51 of the present embodiment, as shown in FIG. 10, the first semiconductor chip 511 and the second semiconductor chip 12 are arranged in parallel in the plane direction. In FIG. 10, two semiconductor chips are provided, but one semiconductor chip may be provided, or three or more semiconductor chips may be provided.

  The back surfaces (lower surfaces in FIG. 10) of the respective semiconductor chips 511 and 512 and the upper surface of the lower heat sink 520 are joined by a first solder 541. Further, the surfaces of the respective semiconductor chips 511 and 512 (upper surface in FIG. 10) and the lower surface of the upper heat sink 530 are joined by the second solder 542. In the present embodiment, as these solders 541 and 542, various commonly used solders, for example, lead-free solders such as Sn-Pb solder and Sn-Ag solder can be employed. .

  Thereby, in the above-described configuration, heat is radiated on the surfaces of the first semiconductor chip 511 and the second semiconductor chip 512 via the second solder 542 and the upper heat sink 530, and the first semiconductor chip 511 and the second semiconductor chip On the back surface of 512, heat is radiated from the first solder 541 through the lower heat sink 520.

  As described above, the lower heat sink 520 and the upper heat sink 530 are configured as metal bodies that are thermally connected to the first semiconductor chip 511 and the second semiconductor chip 512 and transmit heat from the semiconductor chips 511 and 512. Yes. In the lower heat sink 520, the lower surface in FIG. 10 is configured as a heat dissipation surface 521, and in the upper heat sink 530, the upper surface in FIG. 10 is configured as a heat dissipation surface 531. The heat radiating surfaces 521 and 531 are exposed from the mold resin 550.

  Here, the first semiconductor chip 11 is not particularly limited, but can be constituted by, for example, a power semiconductor element such as an IGBT (insulated gate bipolar transistor) or a thyristor. Similarly, the second semiconductor chip 512 can be made of, for example, an FWD (free wheel diode). Specifically, the shapes of the first semiconductor chip 511 and the second semiconductor chip 512 can be, for example, rectangular thin plates.

  Further, electrodes (not shown) are formed on the front and back surfaces of the semiconductor chips 511 and 512 of the present embodiment. The electrodes are electrically connected to the solders 541 and 542.

  Thus, in the present embodiment, the electrodes on the back surfaces of the first semiconductor chip 511 and the second semiconductor chip 512 are electrically connected to the lower heat sink 520 via the first solder 541, and the first The electrodes on the surface side of the first semiconductor chip 511 and the second semiconductor chip 512 are electrically connected to the upper heat sink 530 via the second solder 542.

  Here, the lower heat sink 520 and the upper heat sink 530 are made of a metal having good thermal conductivity and electrical conductivity, such as a copper alloy or an aluminum alloy. Further, the lower heat sink 520 and the upper heat sink 530 can be, for example, substantially rectangular plate materials as a whole.

  In the heat exchanger of this embodiment, the heat radiation surfaces 521 and 531 of the heat sinks 520 and 530 in the semiconductor mounting body 51 having the above-described configuration are cooled by the heat medium. Therefore, the heat radiation surfaces 521 and 531 of the heat sinks 520 and 530 correspond to the heat exchange object of the present invention.

  As shown in FIG. 10, in the heat exchanger of this embodiment, a part of the mold resin 550 in the semiconductor mounting body 51 is configured as a heat medium flow path 30 through which the heat medium refrigerant flows. The mold resin 550 includes a sealing portion 551 that seals the semiconductor chips 511 and 512 and the heat sinks 520 and 530, and a tip portion that is provided around the sealing portion 551 than the heat radiation surfaces 521 and 531 of the heat sinks 520 and 530. It is comprised from the wall part 552 which protrudes. In the present embodiment, the wall portion 552 is provided in an annular shape so as to surround the heat dissipation surfaces 521 and 531.

  Further, a through hole 553 is provided in a portion of the sealing portion 551 between the heat radiation surfaces 521 and 531 of the heat sinks 520 and 530 and the wall portion 552, and the through hole 553 is configured as the heat medium flow path 30. Has been.

  As shown in FIG. 9, the heat exchanger of the present embodiment is configured as a plurality of semiconductor mounting bodies 51 connected together. Specifically, a plurality (four in the illustrated example) of the semiconductor mounting bodies 51 are stacked and connected, and the respective through holes 553 communicate with each other.

  A first lid member 60 having an inlet 61 and an outlet 62 for the heat medium is connected to the semiconductor mounting body 51 on one end side of the stacked body, and the inlet 61 and the outlet 62 and the through hole 553 communicate with each other. . Further, the second lid member 70 is connected to the semiconductor mounting body 51 on the other end side in the stacked body, and the through hole 553 is closed by the second lid member 70. In this way, the inlet 61, the outlet 62 and the through hole 553 are connected, and the heat medium flowing in from the inlet 61 flows out of the outlet 62 through the through hole 553.

  In addition, the connection of each semiconductor mounting body 51 and the connection of the semiconductor mounting body 51 and the lid members 60 and 70 are performed on the end surface of the wall portion 552, and each connection in the wall portion 552 is not illustrated. It is performed by adhesion via an adhesive. In addition, both the lid members 60 and 70 can be formed from a material such as resin, metal, or ceramic by molding, pressing, or the like.

  Here, in the plurality of stacked semiconductor mounting bodies 51, the heat radiating surfaces 521 and 531 are arranged to face each other, and the space between the facing heat radiating surfaces 521 and 531 is also used as the heat medium flow path 30. The medium is flowing. Therefore, the opposing heat radiation surfaces 521 and 531 and the mold resin 550 correspond to the flow path forming member of the present invention.

  On the surface of the heat dissipation surfaces 521 and 531 of the heat sinks 520 and 530, the heat medium flow path 30 formed between the heat dissipation surfaces 521 and 531 is divided into a plurality of narrow flow paths, and the heat medium and the heat sinks 520 and 530 dissipate heat. Inner fins 33 that promote heat exchange with the surfaces 521 and 531 are provided.

  The inner fin 33 is configured in the same manner as in the second embodiment. That is, in the inner fin 33, one first fin portion 33A is disposed on each side of one second fin portion 33B. The second fin portion 33 </ b> B is provided in a portion facing the heat radiating surfaces 521 and 531, and the first fin portion 33 </ b> A is provided in a portion other than the portion facing the heat radiating surfaces 521 and 531.

  As explained above, by configuring the inner fin 33 with the first fin portion 33A and the second fin portion 33B having different fin pitches, the fin pitch is fine according to the length in the flow path width direction, That is, the inner fins 33 can be disposed over the entire area in the flow path width direction by changing the length or fin pitch in the flow path width direction of the first fin portion 33A. As a result, it is possible to prevent the heat medium from preferentially flowing into a part of the heat medium flow path 30, thereby improving the heat exchange efficiency.

  Further, in the present embodiment, the first fin portion 33A having a fine fin pitch is disposed in a portion other than the portion corresponding to the heat radiation surfaces 521 and 531 of the heat sinks 520 and 530 in the heat medium flow path 30. Thereby, the pressure loss which arises in the heat medium which distribute | circulates parts other than the site | part corresponding to the thermal radiation surfaces 521 and 531 in the heat-medium flow path 30 becomes large, and to the site | part corresponding to the thermal radiation surfaces 521 and 531 in the heat-medium flow path 30. Since the flow rate of the inflowing heat medium is increased, that is, the flow velocity is increased, and the heat exchange efficiency can be further improved.

(Other embodiments)
As mentioned above, although embodiment of this invention was described, this invention is not limited to this, Unless it deviates from the range described in each claim, it is not limited to the wording of each claim, and those skilled in the art Improvements based on the knowledge that a person skilled in the art normally has can be added as appropriate to the extent that they can be easily replaced. For example, various modifications are possible as follows.

  (1) In the first to sixth embodiments, the example in which the electronic component 2 is employed as the heat exchange object has been described. However, the heat exchange object is not limited thereto. For example, an outer fin that is joined to the outer surface of the flow channel tube 3 and increases the heat transfer area between the flow channel tube 3 and the external fluid (air) flowing outside the flow channel tube 3 is adopted as a heat exchange object. May be.

  (2) In the first to sixth embodiments, as the heat exchanger, the flow path pipe 3 has a so-called drone cup structure, and the flange portions 300 of the adjacent flow path pipes 3 are joined to each other by brazing. Although the example which employ | adopted the laminated heat exchanger 1 which formed the communication member 4 which connects the flow-path pipe | tube 3 was demonstrated, a heat exchanger is not limited to this. For example, it has so-called a plurality of tubes as flow path forming members, a pair of collective distribution tanks that are arranged at both ends of the plurality of tubes, and perform collection or distribution of heat mediums that circulate through the tubes. A tank-and-tube heat exchanger may be adopted as the heat exchanger.

  (3) In the first to sixth embodiments, the example in which a plurality of flow path tubes 3 are provided has been described. However, the present invention is not limited to this, and there may be one flow path tube 3.

  (4) In the first embodiment, the example in which the first fin portion 33A is disposed at one end in the flow path width direction has been described, but the position of the first fin portion 33A is not limited to this. For example, you may arrange | position the 1st fin part 33A in the center part of a flow path width direction.

  (5) In each of the above embodiments, the example in which the inner fin 33 is configured by the two fin portions 33A and 33B having different fin pitches FP has been described. However, the present invention is not limited to this, and there are three or more different fin pitches FP. The inner fin 33 may be configured by the fin portion.

(6) In the fourth embodiment, the inner inner fin 335 has the fin pitch FP _in substantially equal to the fin pitch FP1 of the first fin portion 33A having the finest fin pitch FP among the outer inner fins 334. However, the shape of the inner inner fin 335 is not limited to this. For example, the inner inner fin 335 may have the same shape as the outer inner fin 334.

  (7) In the fourth embodiment, the example in which the inner fins 33 are stacked in three stages has been described. However, the present invention is not limited thereto, and the inner fins 33 may be stacked in four or more stages.

  (8) Each above-mentioned embodiment can be suitably combined in the possible range.

2 Electronic components (objects for heat exchange)
3 Channel pipe (channel forming member)
30 Heat medium flow path 33 Inner fin 33A 1st fin part 33B 2nd fin part 331 Plate part 332 Connection part 333 Narrow flow path

Claims (5)

A flow path forming member (3) having a heat medium flow path (30) through which the heat medium flows;
A heat exchanger that exchanges heat between the heat medium and a heat exchange object (2) disposed outside or inside the flow path forming member (3),
In the flow path forming member (3), the heat medium flow path (30) is divided into a plurality of narrow flow paths (333), and heat exchange between the heat medium and the heat exchange object (2) is performed. Inner fins (33) to promote are provided,
The inner fin (33) has a cross-sectional shape perpendicular to the flow direction of the heat medium, and is formed into a wave shape that bends with convex portions positioned alternately on one side and the other side,
In the cross-sectional shape, when the distance between the centers of the convex portions adjacent on the same side of the one side and the other side is a fin pitch (FP),
The inner fin (33) includes a plurality of fin portions (33A, 33B) having different fin pitches (FP), and is configured as a heat exchanger. Of the plurality of fin portions (33A, 33B), the fin portion with the finest fin pitch (FP) is defined as the first fin portion (33A), and the fin pitch (FP) is greater than that of the first fin portion (33A). The rough fin portion is the second fin portion (33B), and is orthogonal to the flow direction of the heat medium and the arrangement direction of the flow path forming member (3) and the heat exchange object (2). When the direction to do is the channel width direction,
The heat exchanger according to claim 1, wherein a length of the first fin portion (33A) in the flow path width direction is shorter than the fin pitch (FP) of the second fin portion (33B). . Of the plurality of fin portions (33A, 33B), the fin portion with the finest fin pitch (FP) is defined as the first fin portion (33A), and the fin pitch (FP) is greater than that of the first fin portion (33A). When the rough fin portion is the second fin portion (33B),
The heat exchange object (2) is disposed on a part of the outside of the flow path forming member (3),
The said 1st fin part (33A) is provided in site | parts other than the site | part corresponding to the said heat exchange target object (2) in the said flow-path formation member (3). The heat exchanger as described in. The inner fin (33) includes a plate portion (331) that extends in the flow direction of the heat medium and divides the narrow channel (333), and a connecting portion (332) that connects between the adjacent plate portions (331). And the cross-sectional shape orthogonal to the flow direction of the heat medium is wavy, and the plate portion when viewed from the arrangement direction of the flow path forming member (3) and the heat exchange object (2) (331) is a wave fin that refracts into a wave shape in the flow direction of the heat medium,
The dimension in the amplitude direction of the wave shape of the plate part (331) in the cross section orthogonal to the arrangement direction of the inner fin (33) and passing through the central part of the arrangement direction in the narrow channel (333). Is the wave depth (WD),
The heat exchanger according to claim 3, wherein the wave depth (WD) of the first fin portion (33A) is deeper than the wave depth (WD) of the second fin portion (33B). . The inner fin (33) includes a plate portion (331) that extends in the flow direction of the heat medium and divides the narrow channel (333), and a connecting portion (332) that connects between the adjacent plate portions (331). And the cross-sectional shape orthogonal to the flow direction of the heat medium is wavy, and the plate portion when viewed from the arrangement direction of the flow path forming member (3) and the heat exchange object (2) (331) is a wave fin that refracts into a wave shape in the flow direction of the heat medium,
The pitch of the wave shape of the plate portion (331) in a cross section orthogonal to the arrangement direction of the inner fin (33) and passing through the central portion of the arrangement direction in the narrow channel (333) is a wave pitch. (WP)
The heat exchanger according to claim 3, wherein the wave pitch (WP) of the first fin portion (33A) is finer than the wave pitch (WP) of the second fin portion (33B).

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