JP2012160777A - Method for manufacturing package, piezoelectric vibrator, oscillator, electronic apparatus and radio-controlled timepiece - Google Patents

Abstract

PROBLEM TO BE SOLVED: To form through electrodes with a minimum fraction defective while suppressing warping, cracking or other incidents of a base substrate, and manufacture a package productively.SOLUTION: A method for manufacturing a package is provided in which a through electrode forming step includes the steps of: forming through holes 30, 31 through a base substrate 40; disposing core portions 7b of rivets 7 in the through holes and abutting head portions 7a to one surface 40b of the base substrate; releasably attaching a first cover 70 to the base substrate to temporarily fix the rivets; fixing a second cover 80 onto the first cover; filling gaps between the through holes and the core portions with a paste P; releasing the first cover from the base substrate via the second cover; and firing the paste to set it and then removing the head portions. In the fixing step, the second cover is fixed such that one end portion 80a protrudes outward beyond the base substrate, and in the release step, the one end portion is used as a release operation tab.

Description

  The present invention relates to a method for manufacturing a package capable of sealing an electronic component in a cavity, a piezoelectric vibrator having a piezoelectric vibrating piece sealed as an electronic component in the package, an oscillator having the piezoelectric vibrator, an electronic device, and a radio wave. It relates to watches.

Conventionally, a package is known as a container capable of bonding a pair of substrates and sealing an electronic component in a cavity formed between the substrates. In addition, a piezoelectric vibrating piece is sealed as an electronic component in the package, and a piezoelectric vibrator is known as a product used for a time source of a mobile phone or a portable information terminal, a timing source such as a control signal, a reference signal source, Yes.
Various piezoelectric vibrators of this type are known, and one of them is a surface mount device (SMD: Surface Mount Device) piezoelectric vibrator.

  As a surface mount type piezoelectric vibrator, a two-layer structure type in which a base substrate and a lid substrate are directly bonded and a piezoelectric vibrating piece is sealed in a cavity formed between the two substrates is known. Yes. This two-layer structure type piezoelectric vibrator is excellent in that it can be thinned and is preferably used. As this type of piezoelectric vibrator, a piezoelectric vibrator is known in which a piezoelectric vibrating piece and an external electrode formed on the base substrate are electrically connected using a through electrode formed so as to penetrate the base substrate. (See Patent Document 1).

  By the way, as a method of forming the through electrode, for example, a method in which a metal pin is directly driven and fixed in the through hole, or after the metal pin is disposed in the through hole, the remaining gap in the through hole is formed. A method is known in which a paste is filled, the paste is cured by firing, and a metal pin is fixed.

JP 2002-124845 A

  By the way, when forming a penetration electrode using a metal pin and a paste, as shown in FIG.24 and FIG.25 so that the metal pin inserted in the through-hole may not fall off and shake before filling the paste. A method is adopted in which the peeling tape 201 is attached to the wafer 200 and the metal pins 203 inserted into the through holes 202 are temporarily fixed. The peeling tape 201 is then peeled after the remaining gap in the through hole 202 is filled with the paste 204 and the metal pin 203 is held by the filled paste 204.

However, since the peeling tape 201 is easily firmly attached to the wafer 200, the work for peeling from the wafer 200 is likely to take time and workability is poor. In particular, since it is difficult to make a starting point for peeling off the peeling tape 201, workability is poor, and there is a risk that the wafer 200 may be damaged. Further, when the peeling tape 201 is peeled off, stress tends to be concentrated locally on the wafer 200, and the wafer 200 is prone to malfunction such as warping or cracking, and easily becomes defective.
It should be noted that the larger the size of the wafer 200 (for example, about 8 inches in diameter), the more easily the above-described problem occurs. For this reason, when the release tape 201 is peeled off, the release tape 201 is once divided along the dotted line shown in FIG. For this reason, workability is likely to be further deteriorated.

The present invention has been made in view of such circumstances, and its purpose is to form a through electrode with as few defects as possible while suppressing the occurrence of warping, cracking, etc. in the base substrate. Another object of the present invention is to provide a package manufacturing method capable of manufacturing a package with high productivity.
Another object is to provide a piezoelectric vibrator provided with this package, an oscillator having the piezoelectric vibrator, an electronic device, and a radio timepiece.

The present invention provides the following means in order to solve the above problems.
(1) A manufacturing method of a package according to the present invention is a manufacturing method of a package including a base substrate and a lid substrate bonded to each other, and a cavity capable of sealing an electronic component formed between both substrates. A through electrode forming step of forming a through electrode that penetrates the base substrate in a thickness direction and electrically connects the electronic component and the outside, and the through electrode forming step forms a through hole in the base substrate. A conductive casing having a through-hole forming step, a flat base portion, and a core portion protruding in the normal direction from the surface of the base portion is inserted into the through-hole, A housing inserting step of disposing a material portion in the through-hole and bringing the base portion into contact with one surface of the base substrate; and a first covering so as to cover the base portion on one surface of the base substrate Affix the body in a peelable manner and temporarily fix the housing The fixing step, the fixing step of stacking and fixing the belt-like second covering body on the first covering body, and filling the gap between the through hole and the core material portion from the other surface side of the base substrate A filling step, a peeling step of peeling the first covering body from one surface of the base substrate through the second covering body, and baking and hardening the filled paste, And a post-process for removing the first covering body, so that, in the fixing step, the second covering body protrudes outward from the base substrate in the longitudinal direction of the second covering body. The one end part of the second covering body is used as a peeling operation piece in the peeling step.

According to the present invention, since the housing inserted into the through hole is temporarily fixed by the first covering body, the housing can be prevented from falling off from the through hole, and the wobbling of the housing can be suppressed. The paste can be filled. Then, after the housing is fixed in the through hole by the viscosity of the filled paste, the first covering body temporarily fixing the housing through the second covering body is peeled off from one surface of the base substrate, Thereafter, the filled paste is cured by baking to integrate the core part of the casing and the through hole, and then the base part is removed by polishing or the like. Thereby, a penetration electrode can be formed.
In particular, since the casing is temporarily fixed when the paste is filled, the inclination of the core portion can be suppressed and a high quality through electrode can be formed.

  By the way, when the first cover is peeled from one surface of the base substrate, one end of the second cover protrudes outward from the base substrate and the first cover. This one end can be used as a stripping operation piece. Therefore, the starting point of peeling can be easily made without damaging the base substrate, and the first cover can be peeled smoothly and efficiently through the second cover.

  Also, by rolling up the second covering from the one end side, the first covering fixed to the second covering can follow the movement of the second covering, thereby the first covering The body can be gradually peeled off from one side of the base substrate. At this time, since the second covering is formed in a band shape having a predetermined lateral width, the portion of the first covering that overlaps the second covering is on the one end side as the second covering is turned. At the same time begins to peel off. That is, the first covering is not peeled off so that the range gradually increases from one point, but the length corresponding to the lateral width of the second covering is peeled off from the beginning.

  Therefore, the stress acting on the base substrate can be dispersed without locally concentrating, and the occurrence of warping, cracking, or the like in the base substrate can be suppressed. Therefore, the through electrode can be formed with as few defects as possible, and the package can be manufactured with high productivity.

(2) In the method for manufacturing a package according to the present invention, in the peeling step, the angle formed by the second covering body and one surface of the base substrate is maintained at an angle of 30 ° ± 10 °. The first covering body may be peeled off from the base substrate through the second covering body.

  In this case, since the angle formed by the second cover and one surface of the base substrate is maintained at an angle of 30 ° ± 10 °, the first cover is attached to one of the base substrates via the second cover. Peeling can be performed simultaneously while lifting away from the surface. Therefore, the first cover can be peeled off more smoothly with a slight force, and stress is less likely to act on the base substrate, and the occurrence of warpage, cracking, and the like can be effectively suppressed.

  When the angle formed between the second cover and one surface of the base substrate is smaller than the above angle range, the force to lift the first cover in the direction away from the one surface of the base substrate becomes weak. Therefore, it is considered that smooth peeling cannot be performed. On the other hand, when the angle range is larger than the above range, the force to lift the first covering body away from one surface of the base substrate is too strong, so that not only smooth peeling can be performed. It is considered that the base substrate is likely to be warped.

(3) In the package manufacturing method according to the present invention, the second cover may have a lateral width of 40 mm or more.

  In this case, since the second covering body is formed in a wide band shape having a width of 40 mm or more, a large fixing area for the first covering body can be secured, and the first covering body can be spread over a wider range during the peeling process. Can be peeled off simultaneously from one surface of the base substrate. Therefore, the stress acting on the base substrate can be distributed over a wider range, and the occurrence of warping, cracking, or the like in the base substrate can be further effectively suppressed.

(4) A piezoelectric vibrator according to the present invention includes a package manufactured by the method for manufacturing a package according to the present invention, and a piezoelectric vibrating piece sealed in the cavity of the package. Features.

  According to the piezoelectric vibrator according to the present invention, since the above-described package is provided, the piezoelectric vibrator is manufactured with high yield and efficiency and reduced in cost, and has a high-quality through electrode. Can do.

(5) An oscillator according to the present invention is characterized in that the piezoelectric vibrator of the present invention is electrically connected to an integrated circuit as an oscillator.
(6) An electronic apparatus according to the present invention is characterized in that the piezoelectric vibrator of the present invention is electrically connected to a time measuring unit.
(7) A radio-controlled timepiece according to the present invention is characterized in that the piezoelectric vibrator of the present invention is electrically connected to a filter portion.

  According to the oscillator, the electronic device, and the radio timepiece according to the present invention, since the high-quality and low-cost piezoelectric vibrator is provided, high quality and low cost can be achieved in the same manner.

  According to the present invention, it is possible to form a through electrode with as few defects as possible while suppressing the occurrence of warping, cracking, or the like in the base substrate, and it is possible to manufacture a package with high productivity.

1 is an external perspective view showing an embodiment of a piezoelectric vibrator according to the present invention. FIG. 2 is an internal configuration diagram of the piezoelectric vibrator shown in FIG. 1, and is a view of a piezoelectric vibrating piece viewed from above with a lid substrate removed. FIG. 3 is a cross-sectional view of the piezoelectric vibrator taken along line AA shown in FIG. 2. FIG. 2 is an exploded perspective view of the piezoelectric vibrator shown in FIG. 1. FIG. 2 is a top view of a piezoelectric vibrating piece constituting the piezoelectric vibrator shown in FIG. 1. FIG. 6 is a bottom view of the piezoelectric vibrating piece shown in FIG. 5. It is sectional drawing along the BB line shown in FIG. It is a flowchart which shows the flow at the time of manufacturing the piezoelectric vibrator shown in FIG. It is a figure which shows one process at the time of manufacturing a piezoelectric vibrator, Comprising: It is a figure which shows the state which formed the several recessed part in the wafer for lid substrates used as the origin of a lid substrate. It is a figure which shows one process at the time of manufacturing a piezoelectric vibrator, Comprising: It is a figure which shows the state which formed a pair of through-hole in the wafer for base substrates used as the origin of a base substrate. It is the figure which looked at the state shown in FIG. 10 in the cross section of the wafer for base substrates. It is a figure which shows the state which inserted the housing in the through hole after the state shown in FIG. FIG. 13 is a diagram showing a state in which, after the state shown in FIG. 12, the first cover is detachably attached to the upper surface of the base substrate wafer, and then the second cover is fixed on the first cover. It is sectional drawing along CC line shown in FIG. It is a figure which shows the state which was filled with the paste between the core material part of a housing and a through hole after the state shown in FIG. It is a figure which shows the state which has peeled the 1st coating body through the 2nd coating body after the state shown in FIG. FIG. 17 is a view showing a state in which, after the state shown in FIG. 16, the paste filled in the through hole is baked to integrally fix the through hole and the core member. FIG. 18 is a diagram showing a state in which the base portion of the housing is removed by polishing the lower surface side of the base substrate wafer after the state shown in FIG. 17. FIG. 19 is a diagram illustrating a state in which a bonding film and a routing electrode are patterned on the upper surface of the base substrate wafer after the state illustrated in FIG. 18. FIG. 3 is an exploded perspective view of a wafer body in which a base substrate wafer and a lid substrate wafer are anodically bonded in a state where a piezoelectric vibrating piece is accommodated in a cavity. It is a block diagram which shows one Embodiment of the oscillator which concerns on this invention. It is a block diagram which shows one Embodiment of the electronic device which concerns on this invention. It is a block diagram which shows one Embodiment of the radio timepiece which concerns on this invention. It is a figure explaining the conventional temporary fixing method of a metal pin, Comprising: It is a top view which shows the state which affixed the peeling sheet to the wafer by which the metal pin was inserted in the through-hole. FIG. 25 is a partial cross-sectional view of the wafer shown in FIG. 24.

Hereinafter, an embodiment according to the present invention will be described with reference to the drawings.
(Piezoelectric vibrator)
As shown in FIGS. 1 to 4, the piezoelectric vibrator 1 of this embodiment includes a package 9 in which a base substrate 2 and a lid substrate 3 are anodically bonded via a bonding film 35, and a cavity C in the package 9. A surface-mounted piezoelectric vibrator having a piezoelectric vibrating piece (electronic component) 4 sealed inside.
In FIG. 4, the excitation electrode 15, the extraction electrodes 19 and 20, the mount electrodes 16 and 17, and the weight metal film 21, which will be described later, are omitted for easy understanding of the drawing.

(Piezoelectric vibrating piece)
First, the piezoelectric vibrating piece 4 will be described in detail.
As shown in FIGS. 5 to 7, the piezoelectric vibrating piece 4 of the present embodiment is a tuning fork type vibrating piece formed of a piezoelectric material such as crystal, lithium tantalate, or lithium niobate, and is applied with a predetermined voltage. It will vibrate when pressed.
The piezoelectric vibrating reed 4 includes a pair of vibrating arm portions 10 and 11 arranged in parallel, a base portion 12 that integrally fixes the base end sides of the pair of vibrating arm portions 10 and 11, and a pair of vibrating arm portions. Groove portions 18 formed on both main surfaces 10 and 11. The groove 18 is formed along the longitudinal direction of the vibrating arms 10 and 11 from the base end side of the vibrating arms 10 and 11 to the vicinity of the middle.

  The piezoelectric vibrating reed 4 is formed of a first excitation electrode 13 and a second excitation electrode 14 that are formed on the outer surfaces of the pair of vibrating arm portions 10 and 11 and vibrate the pair of vibrating arm portions 10 and 11. And the mount electrodes 16 and 17 electrically connected to the first excitation electrode 13 and the second excitation electrode 14.

  The excitation electrode 15 is an electrode that vibrates the pair of vibrating arm portions 10 and 11 at a predetermined resonance frequency in a direction toward or away from each other. Then, the first excitation electrode 13 and the second excitation electrode 14 constituting the excitation electrode 15 are formed by patterning on the outer surfaces of the pair of vibrating arm portions 10 and 11 in a state of being electrically separated from each other. Has been. Specifically, as shown in FIG. 7, the first excitation electrode 13 is mainly formed on the groove portion 18 of one vibration arm portion 10 and on both side surfaces of the other vibration arm portion 11. Two excitation electrodes 14 are mainly formed on both side surfaces of one vibrating arm portion 10 and on a groove portion 18 of the other vibrating arm portion 11.

Further, as shown in FIGS. 5 and 6, the first excitation electrode 13 and the second excitation electrode 14 are mounted on the main surfaces of the base portion 12 via the extraction electrodes 19 and 20, respectively, on the main electrodes 12 and 17. Is electrically connected. A voltage is applied to the piezoelectric vibrating reed 4 via the mount electrodes 16 and 17.
The excitation electrode 15, the mount electrodes 16 and 17, and the extraction electrodes 19 and 20 described above are made of a conductive film such as chromium (Cr), nickel (Ni), aluminum (Al), or titanium (Ti). It is formed.

A weight metal film 21 for adjusting (frequency adjustment) to vibrate its own vibration state within a predetermined frequency range is coated on the tips of the pair of vibrating arm portions 10 and 11.
The weight metal film 21 is divided into a coarse adjustment film 21a used when the frequency is roughly adjusted and a fine adjustment film 21b used when the frequency is finely adjusted. By adjusting the frequency using the coarse adjustment film 21a and the fine adjustment film 21b, the frequency of the pair of vibrating arm portions 10 and 11 can be kept within the range of the nominal frequency of the device.

(package)
Next, the package 9 will be described in detail.
As shown in FIGS. 1, 3 and 4, the lid substrate 3 is a transparent substrate made of a glass material, for example, soda-lime glass, which can be anodically bonded, and is formed in a substantially plate shape. A rectangular recess 3 a in which the piezoelectric vibrating reed 4 is accommodated is formed on the bonding surface side to which the base substrate 2 is bonded. The recess 3 a is a cavity recess that serves as a cavity C that accommodates the piezoelectric vibrating reed 4 when the substrates 2 and 3 are overlapped. The lid substrate 3 is anodically bonded to the base substrate 2 with the recess 3a facing the base substrate 2 side.

The base substrate 2 is a substrate made of a glass material, for example, soda-lime glass, like the lid substrate 3, and has a substantially plate shape with a size that can be superimposed on the lid substrate 3 as shown in FIGS. 1 to 4. Is formed.
In the base substrate 2, a pair of through holes (through holes) 30 and 31 that penetrate the base substrate 2 and a pair of through electrodes 32 and 33 are formed.

The pair of through holes 30 and 31 are formed so as to be accommodated in the cavity C. More specifically, one through hole 30 is positioned on the base 12 side of the mounted piezoelectric vibrating reed 4, and the other through hole 31 is positioned on the distal end side of the vibrating arm portions 10 and 11. .
In the present embodiment, the taper-shaped through holes 30 and 31 whose diameter gradually decreases from the upper surface (the other surface) to the lower surface (the one surface) of the base substrate 2 will be described as an example. In this case, the base substrate 2 may be formed so as to penetrate straight. In any case, it only has to penetrate the base substrate 2.

The pair of through electrodes 32 and 33 are formed so as to fill the pair of through holes 30 and 31, respectively. These through-electrodes 32 and 33 are formed by the core material portion 7b and the hardened paste P, maintain airtightness in the cavity C, and have external electrodes 38 and 39, which will be described later, and routing electrodes 36, 37 is connected to conduct.
The core part 7b is a conductive core material formed in a columnar shape, and is a member cut off from a base part 7a of the casing 7 described later in the manufacturing stage. The core portion 7 b is disposed at the center of the through holes 30 and 31 and is firmly fixed to the through holes 30 and 31 by the hardened paste P.

  On the upper surface side of the base substrate 2 (the bonding surface side to which the lid substrate 3 is bonded), a bonding film 35 for anodic bonding and a pair of lead-out electrodes 36 and 37 are patterned by a conductive material (for example, aluminum). Has been. Among these, the bonding film 35 is formed along the periphery of the base substrate 2 so as to surround the periphery of the recess 3 a formed in the lid substrate 3.

The pair of lead electrodes 36 and 37 electrically connect one of the pair of through electrodes 32 and 33 to the one mount electrode 16 of the piezoelectric vibrating reed 4 and the other through electrode 33. The piezoelectric vibrating piece 4 is patterned so as to be electrically connected to the other mount electrode 17.
More specifically, as shown in FIGS. 2 and 4, the one lead-out electrode 36 is formed right above the one through electrode 32 so as to be positioned directly below the base 12 of the piezoelectric vibrating piece 4. The other routing electrode 37 is routed from the position adjacent to the one routing electrode 36 along the vibrating arm portions 10 and 11 to the distal end side of the vibrating arm portions 10 and 11, and then the other through electrode 33. It is formed so that it may be located just above.

A bump B is formed on the pair of lead-out electrodes 36 and 37, and the pair of mount electrodes 16 and 17 of the piezoelectric vibrating reed 4 are mounted using the bump B. Thereby, one mount electrode 16 of the piezoelectric vibrating reed 4 is electrically connected to one through electrode 32 through one routing electrode 36, and the other mount electrode 17 is passed through the other routing electrode 37 to the other penetration electrode. The electrode 33 is electrically connected.
The piezoelectric vibrating reed 4 is supported in a state of floating from the upper surface of the base substrate 2.

  Further, as shown in FIGS. 1, 3, and 4, external electrodes 38 and 39 that are electrically connected to the pair of through electrodes 32 and 33 are formed on the lower surface of the base substrate 2. . That is, one external electrode 38 is electrically connected to the first excitation electrode 13 of the piezoelectric vibrating reed 4 via one through electrode 32 and one routing electrode 36. The other external electrode 39 is electrically connected to the second excitation electrode 14 of the piezoelectric vibrating reed 4 via the other through electrode 33 and the other routing electrode 37.

(Operation of piezoelectric vibrator)
When the piezoelectric vibrator 1 configured as described above is operated, a predetermined drive voltage is applied to the external electrodes 38 and 39 formed on the base substrate 2. As a result, a voltage can be applied to the excitation electrode 15 including the first excitation electrode 13 and the second excitation electrode 14 of the piezoelectric vibrating reed 4, and the pair of vibrating arm portions 10 and 11 can be moved closer to and away from each other. It can be vibrated at a predetermined frequency. The vibration of the pair of vibrating arm portions 10 and 11 can be used as a time source, a control signal timing source, a reference signal source, and the like.

(Manufacture of piezoelectric vibrators and packages)
Next, a method for manufacturing the piezoelectric vibrator 1 described above will be described with reference to a flowchart shown in FIG.
In the present embodiment, a case where a plurality of piezoelectric vibrators 1 are manufactured at a time using the base substrate wafer 40 and the lid substrate wafer 50 will be described as an example, and a method for manufacturing the package 9 at the same time. Is also explained.

  First, the piezoelectric vibrating reed manufacturing step (S10) is performed to manufacture the piezoelectric vibrating reed 4 shown in FIGS. Specifically, a quartz Lambert rough is first sliced at a predetermined angle to obtain a wafer having a constant thickness. Subsequently, the wafer is lapped and roughly processed, and then the work-affected layer is removed by etching, and then mirror polishing such as polishing is performed to obtain a wafer having a predetermined thickness. Subsequently, after performing an appropriate process such as cleaning on the wafer, the wafer is patterned with the outer shape of the piezoelectric vibrating reed 4 by photolithography, and a metal film is formed and patterned to obtain the excitation electrode 15, Lead electrodes 19 and 20, mount electrodes 16 and 17, and weight metal film 21 are formed. Thereby, the some piezoelectric vibrating piece 4 is producible.

  Further, after the piezoelectric vibrating reed 4 is manufactured, the resonance frequency is coarsely adjusted. This is performed by irradiating the coarse adjustment film 21 a of the weight metal film 21 with laser light to evaporate a part thereof and changing the weight of the vibrating arm portions 10 and 11. Note that fine adjustment for adjusting the resonance frequency with higher accuracy is performed after mounting. This will be described later.

  Next, a lid substrate wafer manufacturing process is performed in which the lid substrate wafer 50 to be the lid substrate 3 later is manufactured up to the state immediately before anodic bonding (S20). First, after polishing and cleaning soda-lime glass to a predetermined thickness, as shown in FIG. 9, a disk-shaped lid substrate wafer 50 is formed by removing the outermost work-affected layer by etching or the like ( S21). Next, a recess forming step is performed in which a plurality of cavity recesses 3a are formed in the matrix direction on the bonding surface of the lid substrate wafer 50 by hot press molding or etching (S22). At this point, the lid substrate wafer manufacturing step (S20) is completed.

Next, a base substrate wafer manufacturing step is performed in which the base substrate wafer 40 to be the base substrate 2 later is manufactured up to the state immediately before anodic bonding (S30).
First, after polishing and washing soda-lime glass to a predetermined thickness, a disk-shaped base substrate wafer 40 is formed by removing the outermost work-affected layer by etching or the like (S31). Next, a through electrode forming step for forming a plurality of pairs of through electrodes 32 and 33 on the base substrate wafer 40 is performed (S32). Here, the through electrode forming step (S32) will be described in detail.

First, as shown in FIG. 10, a through hole forming step (S32a) for forming a plurality of pairs of through holes 30, 31 penetrating the base substrate wafer 40 is performed. In addition, the dotted line M shown in FIG. 10 has shown the cutting line cut | disconnected by the cutting process performed later. When this step is performed, for example, sandblasting is performed from the upper surface (the other surface) 40a side of the base substrate wafer 40.
As a result, as shown in FIG. 11, through-holes 30 and 31 having tapered sections that gradually decrease in diameter toward the lower surface (one surface) 40b of the base substrate wafer 40 can be formed. At this time, the through holes 30 and 31 are formed so as to be accommodated in the recesses 3a formed in the lid substrate wafer 50 when the wafers 40 and 50 are overlapped later. That is, one through hole 30 is formed on the base 12 side of the piezoelectric vibrating piece 4, and the other through hole 31 is formed on the tip side of the vibrating arm sections 10 and 11.

Next, a housing insertion step (32b) for inserting the housing 7 (see FIG. 12) into the through holes 30 and 31 is performed. Here, the casing 7 will be described.
As shown in FIG. 12, the casing 7 is a conductive member formed of a metal material such as stainless steel, silver, nickel alloy or aluminum, and particularly contains 58% by weight of iron and 42% by weight of nickel. It is desirable to form with an alloy (42 alloy).
And the housing 7 is comprised by the flat base part 7a and the core part 7b projected along the normal line direction from the surface of this base part 7a. The base portion 7 a has an outer shape in plan view larger than the openings of the through holes 30 and 31 on the lower surface (one surface) 40 b side of the base substrate wafer 40. Thereby, when the core part 7 b is inserted into the through holes 30 and 31, the base part 7 a can be brought into contact with the lower surface 40 b side of the base substrate wafer 40. In addition, the length of the core portion 7 b is substantially the same as the thickness of the base substrate wafer 40.

And the housing | casing body insertion process (32b) which inserts the housing 7 comprised in this way in the through holes 30 and 31 is performed.
Specifically, as shown in FIG. 12, the core material portion 7 b is placed on the lower surface 40 b side of the base substrate wafer 40 so that the central axis of the core material portion 7 b and the central axes of the through holes 30 and 31 substantially coincide with each other. Are inserted into the through holes 30 and 31, the core portion 7 b is disposed in the through holes 30 and 31, and the base portion 7 a is brought into contact with the lower surface 40 b side of the base substrate wafer 40.
In particular, the core member 7b can be positioned in the through holes 30 and 31 in the axial direction by a simple operation of inserting the housing 7 until the base portion 7a comes into contact. In addition, since the base portion 7a is in contact with the lower surface 40b of the base substrate wafer 40, the core portion 7b is disposed in a stable posture in the through holes 30 and 31.

Next, as shown in FIGS. 13 and 14, the first fixing body 70 is detachably pasted onto the lower surface 40b of the base substrate wafer 40, and the housing 7 is temporarily fixed (S32c). I do.
The first covering 70 is formed in a circular shape having a slightly smaller diameter than the base substrate wafer 40. Then, the first covering body 70 is pasted via a release layer 71 over substantially the entire lower surface 40b of the base substrate wafer 40 so as to cover all the base portions 7a of the plurality of casings 7.
Thereby, the housing 7 inserted into the through holes 30 and 31 can be temporarily fixed by the first covering body 70, and the housing 7 can be prevented from falling off from the through holes 30 and 31. The wobble can be suppressed.

  In addition, as the 1st coating | covering body 70, what has the flexibility which is hard to tear is preferable, for example, a sheet | seat, a film, etc. made from paper, metal, resin, or rubber | gum etc. are mentioned, As a single layer structure or laminated structure It doesn't matter. Moreover, as the peeling layer 71, an acrylic adhesive etc. are mentioned, for example.

Next, an adhering step (S32d) is performed in which the second covering 80 is stacked and fixed on the first covering 70.
The second cover 80 is formed in a strip shape with a lateral width L that is approximately 1/3 of the diameter of the base substrate wafer 40. Then, the second covering 80 is fixed to the first covering 70 via the fixing layer 81 so as to cross the substantially central portion of the base substrate wafer 40. At this time, the one end 80a in the longitudinal direction of the second covering 80 is fixed so as to protrude outward in the radial direction from the base substrate wafer 40. Note that the protruding one end portion 80 a of the second covering body 80 functions as a peeling operation piece when the first covering body 70 is peeled off from the base substrate wafer 40 via the second covering body 80.

  In addition, as the 2nd coating body 80, the thing similar to the said 1st coating body 70 is mentioned, For example, it is a sheet | seat etc. which consist of polypropylenes. However, it is preferable that the first covering body 70 has a thickness. Examples of the fixing layer 81 include a pressure-sensitive adhesive such as a rubber-based pressure-sensitive adhesive and an adhesive.

Next, as shown in FIG. 15, a filling step (S <b> 32 e) of filling the paste P into the through holes 30 and 31 from the upper surface 40 a side of the base substrate wafer 40 is performed.
Specifically, after the base substrate wafer 40 is turned over, the paste P is poured onto the upper surface 40a of the base substrate wafer 40 using a screen printing machine (not shown), and then the squeegee (not shown) is scanned to paste the paste P. Is spread over the entire base substrate wafer 40. Thereby, the paste P can be reliably filled in the gap between the through holes 30 and 31 and the core part 7 b of the casing 7.
In this embodiment, as the paste P, a nonconductive glass paste containing glass frit solids is used.

  In particular, when the paste P is filled, since the casing 7 is temporarily fixed by the first covering body 70, the paste P is filled in a state in which the wobbling of the casing 7 and particularly the wobbling of the core member 7b is suppressed. Can do. Further, by filling the paste P, the casing 7 is fixed in the through holes 30 and 31 by the viscosity of the paste P.

Next, a peeling process (S32f) is performed in which the first cover 70 is peeled off from the lower surface 40b of the base substrate wafer 40 through the second cover 80.
Specifically, after the base substrate wafer 40 is turned over again, the second cover 80 protrudes outward in the radial direction from the base substrate wafer 40 and the first cover 70 and functions as a peeling operation piece. While grasping the one end 80a with a fingertip, the second covering 80 is rolled up in a direction away from the lower surface 40b of the base substrate wafer 40 as shown in FIG. Accordingly, the first cover 70 fixed to the second cover 80 can be made to follow the movement of the second cover 80, and the first cover 70 is gradually moved from the lower surface 40 b of the base substrate wafer 40. Can be peeled off.

  In particular, since the second covering 80 is formed in a band shape having a predetermined lateral width L, the portion of the first covering 70 that overlaps the second covering 80 is accompanied by the turning of the second covering 80. Then, it begins to peel from the one end 80a side at the same time. That is, the first covering 70 is not peeled off so that the range gradually increases from one point, but the length corresponding to the lateral width L of the second covering 80 is peeled off simultaneously from the beginning.

  Therefore, the stress acting on the base substrate wafer 40 can be dispersed without locally concentrating, and the housing 7 is temporarily fixed while suppressing the occurrence of warping or cracking in the base substrate wafer 40. The first covering 70 that has been removed can be removed.

Next, after the filled paste P is baked and cured, a post-process (S32g) for removing the base portion 7a of the housing 7 is performed.
First, a baking step (S32h) is performed in which the paste P is heated at a predetermined temperature and cured as shown in FIG. Thereby, the core part 7b of the housing 7 and the through holes 30 and 31 can be firmly integrated, and the airtightness of the through holes 30 and 31 can be ensured.

Subsequently, as shown in FIG. 18, at least the lower surface 40b side of the base substrate wafer 40 is polished, and a removing step (S32i) for removing the base portion 7a of the housing 7 is performed.
As a result, only the core portion 7b can be left in the through holes 30 and 31, and the lower surface 40b of the base substrate wafer 40 can be a flat surface without protrusion, which can be used for surface mounting. It becomes.
Then, when the subsequent step (S32g) is performed, the through electrode forming step (S32) is completed, and the through electrodes 32 and 33 can be formed. In particular, since the casing 7 is temporarily fixed by the first covering 70 when the paste P is filled, the inclination of the core portion 7b and the like can be suppressed, and high quality through electrodes 32 and 33 can be formed.

  Next, a conductive material is patterned on the upper surface 40a of the base substrate wafer 40, and as shown in FIG. 19, a bonding film forming step (S33) for forming the bonding film 35 is performed, and a pair of through electrodes 32, A routing electrode forming step for forming a plurality of routing electrodes 36 and 37 that are electrically connected to 33 is performed (S34). In addition, the dotted line M shown in FIG. 19 has shown the cutting line cut | disconnected by the cutting process performed later.

In particular, since the through electrodes 32 and 33 are substantially flush with the upper surface 40a of the base substrate wafer 40, the lead-out electrodes 36 and 37 patterned on the upper surface 40a do not leave a gap. It adheres to 32 and 33. As a result, it is possible to ensure the electrical conductivity between the one routing electrode 36 and the one through electrode 32 and the electrical conductivity between the other routing electrode 37 and the other through electrode 33.
At this time, the base substrate wafer manufacturing step (S30) is completed.

  By the way, in FIG. 8, it is set as the process order which performs the routing electrode formation process (S34) after the bonding film formation process (S33), but conversely, after the routing electrode formation process (S34), the bonding film formation is performed. The step (S33) may be performed, or both steps may be performed simultaneously. Regardless of the order of steps, the same effects can be obtained. Therefore, the process order may be changed as necessary.

Next, a mounting step is performed in which the produced plurality of piezoelectric vibrating reeds 4 are bump-bonded to the upper surface 40a of the base substrate wafer 40 via the routing electrodes 36 and 37, respectively (S40).
First, bumps B such as gold are formed on the pair of lead-out electrodes 36 and 37, respectively. Then, after the base 12 of the piezoelectric vibrating piece 4 is placed on the bump B, the piezoelectric vibrating piece 4 is pressed against the bump B while heating the bump B to a predetermined temperature. As a result, the piezoelectric vibrating reed 4 is mechanically supported by the bumps B, and the mount electrodes 16 and 17 and the routing electrodes 36 and 37 are electrically connected. Therefore, at this time, the pair of excitation electrodes 15 of the piezoelectric vibrating reed 4 are in a conductive state with respect to the pair of through electrodes 32 and 33, respectively.
In particular, since the piezoelectric vibrating reed 4 is bump-bonded, it is supported in a state where it floats from the upper surface 40 a of the base substrate wafer 40.

After the mounting of the piezoelectric vibrating reed 4 is completed, an overlaying step of overlaying the lid substrate wafer 50 on the base substrate wafer 40 is performed (S50).
Specifically, both wafers 40 and 50 are aligned at the correct positions while using a reference mark (not shown) as an index. As a result, the mounted piezoelectric vibrating reed 4 is housed in a cavity C surrounded by the recess 3 a formed in the base substrate wafer 40 and the wafers 40 and 50.

Next, the two stacked wafers 40 and 50 are put into an anodic bonding apparatus (not shown), and a bonding process is performed in which a predetermined voltage is applied in a predetermined temperature atmosphere to perform anodic bonding (S60).
Specifically, a predetermined voltage is applied between the bonding film 35 and the lid substrate wafer 50. As a result, an electrochemical reaction occurs at the interface between the bonding film 35 and the lid substrate wafer 50, and the two are firmly bonded and anodically bonded. Thereby, the piezoelectric vibrating reed 4 can be sealed in the cavity C, and the wafer body 60 shown in FIG. 20 in which the base substrate wafer 40 and the lid substrate wafer 50 are bonded can be obtained.

In FIG. 20, in order to make the drawing easier to see, a state in which the wafer body 60 is disassembled is illustrated, and the bonding film 35 is not illustrated from the base substrate wafer 40. Moreover, the dotted line M shown in the figure shows the cutting line cut | disconnected by the cutting process performed later.
By the way, when the anodic bonding is performed, the through holes 30 and 31 formed in the base substrate wafer 40 are completely closed by the through electrodes 32 and 33, so that the airtightness in the cavity C is kept through the through holes 30 and 31. Will not be damaged through.

  After the anodic bonding described above is completed, a conductive material is patterned on the lower surface 40b of the base substrate wafer 40, and a pair of external electrodes 38 and 39 electrically connected to the pair of through electrodes 32 and 33, respectively. An external electrode forming step of forming a plurality of electrodes is performed (S70). Through this step, the piezoelectric vibrating reed 4 sealed in the cavity C can be operated using the external electrodes 38 and 39.

  In particular, when this step is performed, the through electrodes 32 and 33 are substantially flush with the lower surface 40b of the base substrate wafer 40 as in the case of forming the routing electrodes 36 and 37. The external electrodes 38 and 39 are in close contact with the through electrodes 32 and 33 with no gap between them. Thereby, the continuity between the external electrodes 38 and 39 and the through electrodes 32 and 33 can be ensured.

Next, in the state of the wafer body 60, a fine adjustment step of finely adjusting the frequency of each piezoelectric vibrator 1 sealed in the cavity C to be within a predetermined range is performed (S80).
More specifically, a voltage is applied to the external electrodes 38 and 39 to vibrate the piezoelectric vibrating reed 4. Then, laser light is irradiated from the outside through the lid substrate wafer 50 while measuring the frequency, and the fine adjustment film 21b of the weight metal film 21 is evaporated. Thereby, since the weight of the tip end side of the pair of vibrating arm portions 10 and 11 is changed, the frequency of the piezoelectric vibrating piece 4 can be finely adjusted so as to be within a predetermined range of the nominal frequency.

After the fine adjustment of the frequency is completed, a cutting process is performed in which the bonded wafer body 60 is cut along the cutting line M shown in FIG. As a result, the surface-mounted piezoelectric vibrator 1 shown in FIG. 1 in which the piezoelectric vibrating reed 4 is sealed in the cavity C formed in the package 9 composed of the base substrate 2 and the lid substrate 3 that are anodically bonded to each other. A plurality of can be manufactured at a time.
In addition, after performing the cutting process (S90) and dividing into individual piezoelectric vibrators 1, the order of processes in which the fine adjustment process (S80) is performed may be used. However, as described above, by performing the fine adjustment step (S80) first, the fine adjustment can be performed in the state of the wafer body 60, so that the plurality of piezoelectric vibrators 1 can be finely adjusted more efficiently. Therefore, the throughput can be improved, which is more preferable.

  Thereafter, an internal electrical characteristic inspection is performed (S100). That is, the resonance frequency, resonance resistance value, drive level characteristic (excitation power dependency of the resonance frequency and resonance resistance value) and the like of the piezoelectric vibrating piece 4 are measured and checked. In addition, the insulation resistance characteristics and the like are also checked. Finally, an appearance inspection of the piezoelectric vibrator 1 is performed to finally check dimensions, quality, and the like. This completes the manufacture of the piezoelectric vibrator 1.

  As described above, according to the present embodiment, since the casing 7 is temporarily fixed by the first covering body 70 when the paste P is filled, the high-quality through electrodes 32 and 33 can be formed. In addition, since the first cover 70 is peeled off from the base substrate wafer 40 via the second cover 80, the occurrence of defects is minimized while suppressing occurrence of warping, cracking, or the like in the base substrate wafer 40. The through electrodes 32 and 33 can be formed. Therefore, it is possible to manufacture with good yield and efficiency (good productivity) and to reduce costs, and it is possible to manufacture the package 9 and the piezoelectric vibrator 1 including the high-quality through electrodes 32 and 33.

  Further, when the first cover 70 is peeled from the lower surface 40b of the base substrate wafer 40, the one end portion 80a of the second cover 80 can be used as a peeling operation piece, so that the base substrate wafer 40 is damaged. The starting point of peeling can be easily made, and the peeling operation of the first covering 70 can be smoothly and efficiently performed via the second covering 80.

In the above embodiment, when the first cover 70 is peeled off, the angle θ formed by the second cover 80 and the lower surface 40b of the base substrate wafer 40 is 30 ° ± 10 ° as shown in FIG. It is preferable to carry out while maintaining the angle range.
In this case, the first covering 70 can be peeled off at the same time while lifting the first covering 70 away from the lower surface 40 b of the base substrate wafer 40 via the second covering 80. For this reason, the first covering 70 can be peeled off more smoothly with a slight force, and stress is less likely to act on the base substrate wafer 40, thereby suppressing the occurrence of warpage, cracking, etc. more effectively. Can do.

  When the angle θ is smaller than the above angle range, the force to lift the first covering 70 in the direction away from the lower surface 40b of the base substrate wafer 40 becomes weak, so that smooth peeling cannot be performed. It is considered a thing. On the other hand, if the angle range is larger than the above range, the force to lift the first cover 70 away from the lower surface 40b of the base substrate wafer 40 is too strong, so that smooth peeling can be performed. In addition, the base substrate wafer 40 is likely to be warped.

Moreover, in the said embodiment, it is preferable to use the 2nd coating body 80 by which the horizontal width L was 40 mm or more.
In this case, it is possible to secure a large fixing region with respect to the first cover 70, and simultaneously pull the first cover 70 from the lower surface 40b of the base substrate wafer 40 over a wider range during the peeling step (S32f). Can be peeled off. Accordingly, the stress acting on the base substrate wafer 40 can be dispersed over a wider range, and the occurrence of warping, cracking, or the like in the base substrate wafer 40 can be further effectively suppressed.

(Oscillator)
Next, an embodiment of an oscillator according to the present invention will be described with reference to FIG.
As shown in FIG. 21, the oscillator 100 according to the present embodiment is configured such that the piezoelectric vibrator 1 is an oscillator electrically connected to the integrated circuit 101. The oscillator 100 includes a substrate 103 on which an electronic component 102 such as a capacitor is mounted. The integrated circuit 101 for the oscillator is mounted on the substrate 103, and the piezoelectric vibrating piece 4 of the piezoelectric vibrator 1 is mounted in the vicinity of the integrated circuit 101. The electronic component 102, the integrated circuit 101, and the piezoelectric vibrator 1 are electrically connected by a wiring pattern (not shown). Each component is molded with a resin (not shown).

In the oscillator 100 configured as described above, when a voltage is applied to the piezoelectric vibrator 1, the piezoelectric vibrating piece 4 in the piezoelectric vibrator 1 vibrates. This vibration is converted into an electric signal by the piezoelectric characteristics of the piezoelectric vibrating piece 4 and input to the integrated circuit 101 as an electric signal. The input electrical signal is subjected to various processes by the integrated circuit 101 and is output as a frequency signal. Thereby, the piezoelectric vibrator 1 functions as an oscillator.
Further, by selectively setting the configuration of the integrated circuit 101, for example, an RTC (real-time clock) module or the like according to a request, the operation date and time of the device and external device in addition to a single-function oscillator for a clock A function for controlling the time, providing a time, a calendar, and the like can be added.

  According to the oscillator 100 of the present embodiment, since the piezoelectric vibrator 1 that is efficiently manufactured, reduced in cost, and improved in quality is provided, the oscillator 100 itself is similarly reduced in cost and increased in quality. Can be achieved.

(Electronics)
Next, one embodiment of an electronic apparatus according to the invention will be described with reference to FIG. Note that the portable information device 110 having the above-described piezoelectric vibrator 1 will be described as an example of the electronic device.
First, the portable information device 110 according to the present embodiment is represented by, for example, a mobile phone, and is a development and improvement of a wrist watch in the related art. The appearance is similar to that of a wristwatch, and a liquid crystal display is arranged in a portion corresponding to a dial so that the current time and the like can be displayed on this screen. Further, when used as a communication device, it is possible to perform communication similar to that of a conventional mobile phone by using a speaker and a microphone that are removed from the wrist and incorporated in the inner portion of the band. However, it is much smaller and lighter than conventional mobile phones.

  Next, the configuration of the portable information device 110 of this embodiment will be described. As shown in FIG. 22, the portable information device 110 includes the piezoelectric vibrator 1 and a power supply unit 111 for supplying power. The power supply unit 111 is made of, for example, a lithium secondary battery. The power supply unit 111 includes a control unit 112 that performs various controls, a clock unit 113 that counts time, a communication unit 114 that communicates with the outside, a display unit 115 that displays various types of information, A voltage detection unit 116 that detects the voltage of the functional unit is connected in parallel. The power unit 111 supplies power to each functional unit.

  The control unit 112 controls each function unit to control operation of the entire system such as transmission and reception of audio data, measurement and display of the current time, and the like. The control unit 112 includes a ROM in which a program is written in advance, a CPU that reads and executes the program written in the ROM, and a RAM that is used as a work area of the CPU.

  The timer unit 113 includes an integrated circuit including an oscillation circuit, a register circuit, a counter circuit, an interface circuit, and the like, and the piezoelectric vibrator 1. When a voltage is applied to the piezoelectric vibrator 1, the piezoelectric vibrating reed 4 vibrates, and the vibration is converted into an electric signal by the piezoelectric characteristics of the crystal and is input to the oscillation circuit as an electric signal. The output of the oscillation circuit is binarized and counted by a register circuit and a counter circuit. Then, signals are transmitted to and received from the control unit 112 via the interface circuit, and the current time, current date, calendar information, or the like is displayed on the display unit 115.

The communication unit 114 has functions similar to those of a conventional mobile phone, and includes a radio unit 117, a voice processing unit 118, a switching unit 119, an amplification unit 120, a voice input / output unit 121, a telephone number input unit 122, and a ring tone generation unit. 123 and a call control memory unit 124.
The wireless unit 117 exchanges various data such as audio data with the base station via the antenna 125. The audio processing unit 118 encodes and decodes the audio signal input from the radio unit 117 or the amplification unit 120. The amplifying unit 120 amplifies the signal input from the audio processing unit 118 or the audio input / output unit 121 to a predetermined level. The voice input / output unit 121 includes a speaker, a microphone, and the like, and amplifies a ringtone and a received voice or collects a voice.

In addition, the ring tone generator 123 generates a ring tone in response to a call from the base station. The switching unit 119 switches the amplifying unit 120 connected to the voice processing unit 118 to the ringing tone generating unit 123 only when an incoming call is received, so that the ringing tone generated in the ringing tone generating unit 123 is transmitted via the amplifying unit 120. To the audio input / output unit 121.
The call control memory unit 124 stores a program related to incoming / outgoing call control of communication. The telephone number input unit 122 includes, for example, a number key from 0 to 9 and other keys. By pressing these number keys and the like, a telephone number of a call destination is input.

  When the voltage applied to each functional unit such as the control unit 112 by the power supply unit 111 falls below a predetermined value, the voltage detection unit 116 detects the voltage drop and notifies the control unit 112 of the voltage drop. . The predetermined voltage value at this time is a value set in advance as a minimum voltage necessary for stably operating the communication unit 114, and is, for example, about 3V. Upon receiving the voltage drop notification from the voltage detection unit 116, the control unit 112 prohibits the operations of the radio unit 117, the voice processing unit 118, the switching unit 119, and the ring tone generation unit 123. In particular, it is essential to stop the operation of the wireless unit 117 with high power consumption. Further, the display unit 115 displays that the communication unit 114 has become unusable due to insufficient battery power.

That is, the operation of the communication unit 114 can be prohibited by the voltage detection unit 116 and the control unit 112, and that effect can be displayed on the display unit 115. This display may be a text message, but as a more intuitive display, a x (X) mark may be attached to the telephone icon displayed at the top of the display surface of the display unit 115.
In addition, the function of the communication part 114 can be stopped more reliably by providing the power supply cutoff part 126 that can selectively cut off the power of the part related to the function of the communication part 114.

  According to the portable information device 110 of the present embodiment, since the piezoelectric vibrator 1 that is efficiently manufactured and reduced in cost and includes high quality is provided, the cost of the portable information device 110 itself is similarly reduced. In addition, high quality can be achieved.

(Radio watch)
Next, an embodiment of a radio timepiece according to the present invention will be described with reference to FIG.
As shown in FIG. 23, the radio-controlled timepiece 130 according to the present embodiment includes the piezoelectric vibrator 1 electrically connected to the filter unit 131. The radio-controlled timepiece 130 receives a standard radio wave including timepiece information and is accurate. It is a clock with a function of automatically correcting and displaying the correct time.
In Japan, there are transmitting stations (transmitting stations) that transmit standard radio waves in Fukushima Prefecture (40 kHz) and Saga Prefecture (60 kHz), each transmitting standard radio waves. Long waves such as 40 kHz or 60 kHz have the property of propagating the surface of the earth and the property of propagating while reflecting the ionosphere and the surface of the earth, so the propagation range is wide, and the above two transmitting stations cover all of Japan. doing.

Hereinafter, the functional configuration of the radio timepiece 130 will be described in detail.
The antenna 132 receives a long standard wave of 40 kHz or 60 kHz. The long-wave standard radio wave is obtained by subjecting time information called a time code to AM modulation on a 40 kHz or 60 kHz carrier wave. The received long standard wave is amplified by the amplifier 133 and filtered and tuned by the filter unit 131 having the plurality of piezoelectric vibrators 1.
The piezoelectric vibrator 1 according to this embodiment includes crystal vibrator portions 138 and 139 having resonance frequencies of 40 kHz and 60 kHz that are the same as the carrier frequency.

Further, the filtered signal having a predetermined frequency is detected and demodulated by the detection and rectification circuit 134. Subsequently, the time code is taken out via the waveform shaping circuit 135 and counted by the CPU 136. The CPU 136 reads information such as the current year, accumulated date, day of the week, and time. The read information is reflected in the RTC 137, and accurate time information is displayed.
Since the carrier wave is 40 kHz or 60 kHz, the crystal vibrator units 138 and 139 are preferably vibrators having the tuning fork type structure described above.

  In addition, although the above-mentioned description was shown in the example in Japan, the frequency of the long standard wave is different overseas. For example, in Germany, a standard radio wave of 77.5 KHz is used. Accordingly, when the radio timepiece 130 that can be used overseas is incorporated in a portable device, the piezoelectric vibrator 1 having a frequency different from that in Japan is required.

  According to the radio-controlled timepiece 130 of the embodiment, the radio-controlled timepiece 130 is provided with the piezoelectric vibrator 1 that is efficiently manufactured, reduced in cost, and improved in quality. Can be achieved.

  The technical scope of the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention.

For example, in the above-described embodiment, the piezoelectric vibrator 1 in which the piezoelectric vibrating reed 4 is sealed as an electronic component inside the package 9 has been described as an example. A device other than the vibrator may be used.
Further, when the piezoelectric vibrating piece 4 is sealed, it is not limited to the tuning fork type, and an AT-cut thickness sliding vibrating piece may be used. Further, when the tuning fork type piezoelectric vibrating piece 4 is used, in the above embodiment, the grooved type piezoelectric vibrating piece 4 in which the groove portions 18 are formed on both main surfaces of the vibrating arm portions 10 and 11 has been described as an example. A piezoelectric vibrating piece of a type having no groove may be used. However, by forming the groove portion, it is possible to increase the electric field efficiency between the excitation electrodes when a voltage is applied, so that vibration loss can be further suppressed and vibration characteristics can be further improved. That is, the CI value (Crystal Impedance) can be further reduced, and the performance of the piezoelectric vibrating piece can be improved. In this respect, it is preferable to form a groove.

  In the above embodiment, the non-conductive glass paste has been described as an example of the paste P. However, a conductive paste (for example, silver paste) may be used.

(Example)
Next, an example when the first covering 70 is actually peeled from the base substrate wafer 40 via the second covering 80 will be described based on the above embodiment.
As the base substrate wafer 40, soda lime glass having a thickness of about 0.6 mm and a diameter of 8 inches (about 200 mm) was used. As the first covering 70, a circular paper sheet having a diameter of about 190 mm was used, and was attached to the base substrate wafer 40 in a detachable manner using an acrylic adhesive. As the second covering 80, a resin-made belt-like sheet made of polypropylene having a lateral width L of 50 mm was used, and was fixed to the first covering 70 using a rubber-based adhesive. At this time, the first cover body 70 was fixed so as to cross the central portion of the base substrate wafer 40.

Under the above conditions, the first covering 70 was slowly peeled off from the base substrate wafer 40 via the second covering 80. As a result, the first covering 70 could be smoothly peeled without causing any warping or cracking in the base substrate wafer 40 having a diameter of 8 inches. At that time, the first covering 70 and the second covering 80 were not fixed, and the first covering 70 and the second covering 80 were not broken.
In this way, the first cover 70 on which the casing 7 is temporarily fixed can be smoothly peeled without causing warpage, cracking, or the like on the base substrate wafer 40. It was possible to actually confirm the excellent action and effect.

C ... Cavity P ... Paste 1 ... Piezoelectric vibrator 2 ... Base substrate 3 ... Lid substrate 4 ... Piezoelectric vibrating piece (electronic component)
7 ... Housing 7a ... Base part 7b ... Core part 9 ... Package 30, 31 ... Through hole (through hole)
32, 33 ... Through electrode 70 ... First covering 80 ... Second covering 80a ... One end of the second covering 100 ... Oscillator 101 ... Oscillator integrated circuit 110 ... Portable information device (electronic device)
DESCRIPTION OF SYMBOLS 113 ... Time-measurement part 130 of an electronic device 130 ... Radio wave clock 131 ... Filter part of a radio wave clock S30 ... Through-electrode formation process S32a ... Through-hole formation process S32b ... Housing insertion process S32c ... Temporary fixing process S32d ... Fixing process S32e ... Filling process S32f ... Peeling process S32g ... Post process

Claims (7)

A manufacturing method of a package comprising: a base substrate and a lid substrate bonded to each other; and a cavity capable of sealing an electronic component formed between both substrates,
A through electrode forming step of forming a through electrode that penetrates the base substrate in the thickness direction and electrically connects the electronic component and the outside;
The through electrode forming step includes:
A through hole forming step of forming a through hole in the base substrate;
A conductive casing having a flat base portion and a core portion protruding in the normal direction from the surface of the base portion is inserted into the through hole, and the core portion is inserted into the through hole. A housing insertion step of placing the base portion in contact with one surface of the base substrate;
A temporary fixing step of temporarily fixing the casing by pasting the first covering body so as to be peelable so as to cover the base portion on one surface of the base substrate;
An adhering step of stacking and adhering a belt-like second covering on the first covering;
From the other surface side of the base substrate, a filling step of filling a paste in the gap between the through hole and the core material part;
A peeling step of peeling the first covering from one surface of the base substrate through the second covering;
A post-process for removing the foundation after baking and curing the filled paste, and
In the fixing step, the second covering body is fixed to the first covering body so that one end portion in the longitudinal direction of the second covering body protrudes outward from the base substrate. A method for manufacturing a package, wherein one end portion of the second covering body is used as a peeling operation piece. In the manufacturing method of the package of Claim 1,
In the peeling step, the first covering body is interposed through the second covering body while maintaining an angle between the second covering body and one surface of the base substrate at an angle of 30 ° ± 10 °. Is peeled off from the base substrate. In the manufacturing method of the package of Claim 1 or 2,
The method of manufacturing a package, wherein the second covering has a lateral width of 40 mm or more. A package manufactured by the method for manufacturing a package according to any one of claims 1 to 3,
A piezoelectric vibrator comprising: a piezoelectric vibrating piece sealed in the cavity of the package.   An oscillator, wherein the piezoelectric vibrator according to claim 4 is electrically connected to an integrated circuit as an oscillator.   5. An electronic apparatus, wherein the piezoelectric vibrator according to claim 4 is electrically connected to a time measuring unit.   A radio-controlled timepiece wherein the piezoelectric vibrator according to claim 4 is electrically connected to a filter portion.

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