JP2012124460A5

JP2012124460A5 -

Info

Publication number: JP2012124460A5
Application number: JP2011209540A
Authority: JP
Filing date: 2011-09-26
Publication date: 2012-08-09
Anticipated expiration: 2031-09-26

Claims

An insulating substrate comprising a cured product of a laminate comprising one or more fiber base layers and two or more resin layers, wherein the outermost layers on both sides are resin layers,
The fiber base material layer contained in the insulating substrate is Cx (x is an integer represented by 1 to n, and n is the number of fiber base material layers) in order from one surface side.
The overall thickness (B3) of the insulating substrate is equally divided by the number (n) of the fiber base layers, and the thickness (B4) of each divided region is further divided into two equal parts by the fiber base layer. When the reference position is set to Ax (x is an integer represented by 1 to n and n is the number of fiber base layers) in order from one surface side to the reference position,
An insulating substrate characterized in that at least one of the fiber base layers is unevenly distributed on one side or the other side of the reference position of the corresponding order, and none is unevenly distributed in different directions.

At least one of the fiber base layers is unevenly distributed on one side of the reference position of the corresponding order,
The unevenly distributed fiber base layer is
The thickness (B5) of the resin-filled region on one side of the fiber base layer;
The insulating property according to claim 1, wherein the ratio (B5 / B6) to the thickness (B6) of the resin-filled region on the other surface side of the fiber base layer is 0.1 <B5 / B6 <1.2. substrate.

The insulating substrate according to claim 2, wherein the number of the fiber base layers is one or two.

4. The insulating substrate according to claim 1, wherein one fiber base layer is present in each region of the equally divided thickness B <b> 4.

At least one of the regions of the equally divided thickness B4 has one fiber base layer that is unevenly distributed on one side of the reference position of the corresponding order,
The unevenly distributed fiber base layer is
The distance (B7) from the interface on the one surface side of the fiber substrate layer to the boundary on the one surface side of the region of thickness B4 to which the fiber substrate layer belongs,
The ratio (B7 / B8) to the distance (B8) from the interface on the other surface side of the fiber substrate layer to the boundary on the other surface side of the region of thickness B4 to which the fiber substrate layer belongs is 0.1 < The insulating substrate according to any one of claims 1 to 4, wherein B7 / B8 <0.9.

The fiber base material layer located in the said 1st surface side most among the fiber base material layers which the said insulating substrate has is arrange | positioned unevenly in the said 1 surface side rather than the reference | standard position of a corresponding order | rank. The insulating substrate according to claim 5.

The fiber base material layer located in the said other surface side most among the fiber base material layers which the said insulating substrate has is arrange | positioned unevenly in the said one surface side rather than the reference | standard position of a corresponding order | rank. The insulating substrate as described in any one of thru | or 5.

The insulating board | substrate as described in any one of Claims 1 thru | or 7 whose thickness is 0.03 mm or more and 0.5 mm or less.

In an insulating substrate composed of a cured product of only one prepreg or a laminate of two or more prepregs,
A first resin layer is provided on one side of the fiber substrate layer, a second resin layer is provided on the other side, and the thickness of the first resin layer includes at least one asymmetric prepreg smaller than the thickness of the second resin layer. The insulating substrate according to any one of claims 1 to 8 , wherein the insulating substrate is characterized.

A metal-clad laminate, wherein a metal foil layer is provided on at least one side of the insulating substrate according to any one of claims 1 to 9 .

On at least one surface of an insulating substrate according to any one of claims 1 to 9, characterized in that one or more layers of conductor circuit layers are provided, the printed wiring board.

It is a conductor circuit layer of the printed wiring board of Claim 11 , Comprising: The conductor circuit provided in the surface on the opposite side to the surface of the direction where a fiber base material layer is unevenly distributed in the insulating board | substrate contained in the said printed wiring board A semiconductor device comprising a semiconductor element mounted on a layer .

Of the fiber base layer that the insulating substrate included in the printed wiring board has, the fiber base layer located on the most surface side is arranged unevenly on the one surface side than the reference position of the corresponding order,
The semiconductor device according to claim 11 or 12, wherein the semiconductor element is mounted on a conductor circuit layer provided on a surface opposite to a surface in a direction in which the fiber base material layer is unevenly distributed.