JP2012082336A - Adhesive sheet, method for producing the same, method for manufacturing semiconductor device, and semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an adhesive sheet, which is previously cut, can prevent a breakage failure of a semiconductor element since no peeling occurs in an interface between an adhesive layer and a tacky film layer in a process for picking the semiconductor element and bonding it to a mounted substrate by thermocompression bonding, and can easily pick up the semiconductor element; a method for producing the adhesive sheet; a semiconductor device and a method for manufacturing the same using the adhesive sheet.SOLUTION: The adhesive sheet includes: a separation base material; the adhesive layer partially disposed on the surface of the separation base material; and the tacky film layer covering the adhesive layer and contacting the separation base material in the circumference of a region for arranging the adhesive layer. The surface of the tacky film layer has a region, to which roughening process is applied, in the whole or a part of a region contacting with the adhesive layer.

Description

  The present invention relates to an adhesive sheet, a manufacturing method thereof, a manufacturing method of a semiconductor device, and a semiconductor device.

  In recent years, there has been a rapid increase in demands for multifunctional and lightweight and compact mobile related devices. Accordingly, the need for high-density mounting of semiconductor elements is increasing year by year, and the development of a stacked multi-chip package (hereinafter referred to as “stacked MCP”) in which semiconductor elements are stacked plays a central role. The technical development of stacked MCP is to achieve the conflicting goals of package miniaturization and multi-stage loading. For this reason, the thickness of silicon wafers used for semiconductor elements has been rapidly reduced, and wafers with a thickness of 100 μm or less are being actively used and studied. In addition, since the multi-stage loading causes the package production process to become complicated, there is a need for a production process and material proposal corresponding to the simplification of the package production process and the increase in the number of wire bonding thermal histories by multi-stage loading.

  Under such circumstances, a paste material has been conventionally used as an adhesive member of the stacked MCP. However, the paste material has a problem that the resin protrudes in the bonding process of the semiconductor element and the film thickness accuracy is low. Since these problems cause problems during wire bonding, voids in the paste, and the like, when the paste material is used, it has become impossible to cope with the above requirements.

  In recent years, in order to improve such a problem, a film-like adhesive has been used instead of the paste material. Compared to paste materials, film adhesives can control the amount of protrusion in the bonding process of semiconductor elements, and increase film thickness accuracy to reduce film thickness variation. Therefore, application to a stacked MCP is being actively studied.

  This film-like adhesive usually has a configuration in which an adhesive layer is formed on a release substrate, and one of typical usage methods is a wafer back surface application method. The wafer back surface attaching method is a method of directly attaching a film adhesive to the back surface of a silicon wafer used for manufacturing a semiconductor element. In this method, after a film adhesive is applied to a semiconductor wafer, the release substrate is removed, and a dicing tape is applied on the adhesive layer. Thereafter, the wafer is mounted on the wafer ring, and the wafer is cut into a desired semiconductor element size together with the adhesive layer. The semiconductor element after dicing has a structure having an adhesive layer cut out to the same size on the back surface. The semiconductor element with the adhesive layer is picked up and attached to a substrate to be mounted by a method such as thermocompression bonding. wear.

  The dicing tape used for this back surface application method usually has a structure in which an adhesive layer is formed on an adhesive layer, and is roughly classified into two types, a pressure-sensitive dicing tape and a UV dicing tape. . As a function required for the dicing tape, at the time of dicing, a sufficient adhesive force is required so that the semiconductor element does not scatter due to a load accompanying cutting of the wafer, and when picking up each diced semiconductor element, an adhesive to each element It is required that there is no residue and that a semiconductor element with an adhesive layer can be easily picked up by a die bonder facility.

  In addition, there is a growing demand for process improvement due to the desire to shorten the package manufacturing process. In order to simplify this process, the conventional wafer backside application method requires two steps of attaching a film adhesive to the wafer and then applying a dicing tape. Adhesive sheets (die-bond dicing sheets) that have both functions of tape have been developed. As this adhesive sheet, a laminated type having a structure in which a film adhesive and a dicing tape are bonded together (for example, see Patent Documents 1 to 3), or both a pressure-sensitive adhesive layer and an adhesive layer with a single resin layer. There is a single layer type (see, for example, Patent Document 4) having the above functions.

  In addition, a method (so-called precut processing) in which such an adhesive sheet is processed in advance into the shape of a wafer constituting a semiconductor element is known (see, for example, Patent Documents 5 and 6). Such pre-cut processing is a method in which a resin layer is punched in accordance with the shape of the wafer to be used, and the resin layer other than the portion to which the wafer is attached is peeled off.

  When such pre-cut processing is performed, generally, a laminated type adhesive sheet is pre-cut in a film adhesive so that the adhesive layer is matched to the wafer shape and bonded to the dicing tape. It is manufactured by applying pre-cut processing according to the wafer ring shape, or pasting a dicing tape pre-cut into a wafer ring shape with a pre-cut film adhesive. In addition, a single layer type adhesive sheet generally forms a resin layer (hereinafter referred to as “adhesive layer”) having both functions of an adhesive layer and an adhesive film layer on a release substrate. The adhesive layer is prepared by a method such as pre-cut processing, removing unnecessary portions of the resin layer, and then bonding to the adhesive film layer.

By the way, the adhesive sheet has a structure in which the adhesive layer and the pressure-sensitive adhesive film layer are in contact with each other in the pre-cut processing. When the adhesive force between the adhesive layer and the pressure-sensitive adhesive film layer is high, the semiconductor element is picked up and mounted. In the process of thermocompression bonding, the interface between the adhesive layer and the pressure-sensitive adhesive film layer is not peeled off, resulting in a problem that the element is damaged.
Therefore, conventionally, in order to avoid such peeling, a method such as reducing the adhesion between the adhesive layer and the pressure-sensitive adhesive film layer is performed to suppress damage to the semiconductor element.

Japanese Patent No. 3348923 JP 10-335271 A Japanese Patent No. 2678655 Japanese Patent Publication No. 7-15087 Japanese Utility Model Publication No. 6-18383 Registered Utility Model No. 3021645

However, the method of reducing the adhesion between the adhesive layer and the pressure-sensitive adhesive film layer and suppressing the breakage of the semiconductor element has a problem that the wafer is peeled off from the wafer ring in the dicing process of cutting the wafer.
The present invention has been made in view of the above-mentioned problems of the prior art, and in the step of picking up the semiconductor element and thermocompression bonding to the substrate to be mounted, the interface between the adhesive layer and the pressure-sensitive adhesive film layer does not peel off, It is an object of the present invention to provide an adhesive sheet capable of sufficiently suppressing the problem of damaging elements, a method for manufacturing the same, a method for manufacturing a semiconductor device using the adhesive sheet, and a semiconductor device.

The present invention relates to the following.
<1> A peeling base material, an adhesive layer partially provided on the surface of the peeling base material, and the peeling around the area where the adhesive layer is covered and the adhesive layer is provided A pressure-sensitive adhesive film layer provided so as to be in contact with the substrate, and the surface of the pressure-sensitive adhesive film layer has a region subjected to a treatment having irregularities in all or part of the region in contact with the adhesive layer. , Adhesive sheet.
<2> Of the surface of the pressure-sensitive adhesive film layer, the adhesive force with the adhesive layer in the region subjected to the unevenness treatment is greater than 4 N / m and 20 N / m or less, <1> Adhesive sheet.
<3> The adhesive layer includes an epoxy resin, an epoxy resin curing agent, and a polymer having a structural unit derived from a functional monomer and having a weight average molecular weight of 100,000 or more, <1> or <1>2>. The adhesive sheet according to 2>.
<4> The polymer contains at least one of a glycidyl group-containing acrylic copolymer and a glycidyl group-containing methacrylic copolymer, and the content of the epoxy resin with respect to the entire adhesive layer is 5% by mass or more and 50% by mass. % Or less, the adhesive sheet according to <3>.
<5> The method for producing an adhesive sheet according to any one of <1> to <4>, comprising a release substrate and an adhesive layer partially provided on the surface of the release substrate. A step of preparing a release substrate with an adhesive layer, a step of preparing a pressure-sensitive adhesive film layer having a region subjected to a treatment having irregularities in all or part of a region in contact with the adhesive layer, and the adhesive In the release substrate with a layer, in the adhesive film layer, the step of providing the adhesive film layer so as to cover the adhesive layer and contact the release substrate around a region where the adhesive layer is provided; Cutting from the surface not in contact with the release substrate until reaching the release substrate, removing a part of the cut adhesive film layer, the adhesive layer of the predetermined planar shape, Covering the adhesive layer and said adhesive layer Comprising a pressure-sensitive adhesive film layer in contact with the release substrate at ambient, and forming a laminate having a predetermined shape, manufacturing method of the adhesive sheet.
<6> In the adhesive sheet according to any one of <1> to <4> or the adhesive sheet obtained by the method for producing an adhesive sheet according to <5>, an adhesive layer and an adhesive film layer are provided. A step of separating the laminated body configured to be peeled from the peeling substrate, and attaching the surface on the adhesive layer side of the laminated body to the semiconductor wafer to obtain a semiconductor wafer with the laminated body, and the semiconductor wafer with the laminated body A step of cutting from the surface on the semiconductor wafer side to the interface between the adhesive layer and the adhesive film layer, the semiconductor wafer and the adhesive layer that have been cut off are peeled from the adhesive film layer, and the adhesive layer The manufacturing method of a semiconductor device including the process of obtaining an attached semiconductor element, and the process of adhere | attaching the said semiconductor element in the said semiconductor element with an adhesive bond layer to a to-be-adhered body through the said adhesive bond layer.
<7> The method for manufacturing a semiconductor device according to <6>, wherein the adherend is a support member for mounting a semiconductor element or another semiconductor element.
<8> A semiconductor device manufactured by the method for manufacturing a semiconductor device according to <6> or <7>.

  According to the present invention, a part or all of the region of the pressure-sensitive adhesive film layer that is in contact with the adhesive layer is subjected to uneven treatment, and in the step of picking up the semiconductor element and thermocompression bonding to the substrate to be mounted, Adhesive sheet capable of sufficiently suppressing the problem that the interface between the adhesive layer and the adhesive film layer does not peel off and damages the element, a method for manufacturing the same, and a method for manufacturing a semiconductor device using the adhesive sheet In addition, a semiconductor device can be provided.

It is a top view which shows the adhesive sheet of this invention. FIG. 2 is a part of an end view taken along the line A-A ′ of the plan view of FIG. 1. It is a side view which shows the semiconductor wafer with a laminated body using the adhesive sheet of this invention.

<Adhesive sheet>

  The adhesive sheet of the present invention includes a peeling base material, an adhesive layer partially provided on the surface of the peeling base material, a periphery of a region that covers the adhesive layer and is provided with the adhesive layer And a pressure-sensitive adhesive film layer provided so as to be in contact with the release substrate, and the surface of the pressure-sensitive adhesive film layer has been subjected to a treatment having irregularities in all or part of a region in contact with the adhesive layer. It has a region.

  The adhesion at the interface between the adhesive layer and the adhesive film layer is preferably greater than 4 N / m and not greater than 20 N / m. Here, the adhesion strength in the present invention means an average value obtained by measuring five points of peel strength when the pressure-sensitive adhesive film layer is peeled off in the 180-degree direction while supporting the adhesive layer side.

  The adhesive sheet of the present invention is an adhesive sheet subjected to the above-described precut processing. In the adhesive sheet of the present invention, when the adhesive force at the interface between the adhesive layer and the pressure-sensitive adhesive film layer is in the above range, in the step of picking up the semiconductor element and thermocompression bonding to the substrate to be mounted, The defect that the interface between the agent layer and the adhesive film layer does not peel off and the element is damaged can be prevented.

In the adhesive sheet of the present invention, the adhesive layer may have a predetermined planar shape that matches the planar shape of the adherend to which the laminate is to be attached after the release substrate is peeled off. preferable.
Examples of the adherend include a semiconductor wafer, and the adhesive layer has a planar shape that matches the planar shape of the semiconductor wafer, which tends to facilitate the process of dicing the semiconductor wafer. is there. Note that the planar shape of the adhesive layer does not have to completely match the planar shape of the semiconductor wafer. For example, it may be similar to the planar shape of the semiconductor wafer, and matches the planar shape of the semiconductor wafer. May be.

  Furthermore, in the adhesive sheet, the adhesive film layer has adhesiveness at room temperature (25 ° C.) with respect to the adherend to which the adhesive layer is to be attached and the adhesive layer after the release substrate is peeled off. It is preferable. Thereby, when dicing a semiconductor wafer, a semiconductor wafer is fully fixed and dicing becomes easy. In addition, when a wafer ring is used when dicing a semiconductor wafer and an adhesive sheet is attached so that the adhesive film layer is in close contact with the wafer ring, sufficient adhesive force to the wafer ring is obtained and dicing is performed. It becomes easy.

  It is preferable that the adhesive film layer has a lower adhesive force to the adhesive layer when irradiated with high energy rays. Thereby, when peeling an adhesive bond layer from an adhesion film layer, peeling becomes possible easily by irradiating with high energy rays, such as an ultraviolet-ray, an electron beam, and radiation.

  The adhesive sheet preferably further includes an adhesive layer disposed between at least a part of the peripheral edge of the pressure-sensitive adhesive film layer and the release substrate. By providing such an adhesive film layer, the adhesive film layer can be affixed to a wafer ring used when dicing a semiconductor wafer, and the adhesive layer can be prevented from being directly affixed to the wafer ring. When the adhesive layer is attached directly to the wafer ring, the adhesive strength of the adhesive layer needs to be adjusted to a low adhesive strength that can be easily removed from the wafer ring. By sticking, adjustment of such adhesive force becomes unnecessary. Therefore, the adhesive layer has a sufficiently high adhesive strength, and the adhesive film layer has a sufficiently low adhesive strength that allows the wafer ring to be easily peeled off. The wafer ring can be peeled off more efficiently. Furthermore, since the adhesive force of the adhesive film layer can be adjusted sufficiently low, it becomes easy to create a peeling starting point between the release substrate and the adhesive film layer, and the adhesive layer and the adhesive film layer from the release substrate Peeling is facilitated and the occurrence of peeling failure can be more sufficiently suppressed. Here, it is preferable that the said adhesive film layer has adhesiveness at room temperature (25 degreeC) with respect to the to-be-adhered body and the said adhesive bond layer which should stick the said adhesive film layer after peeling the said peeling base material.

  The adhesive sheet of the present invention has an adhesive layer having a storage elastic modulus before curing at 25 ° C. of 10 to 10,000 MPa and a storage elastic modulus after curing at 260 ° C. of 0.5 to 1000 MPa. preferable. When the storage elastic modulus before curing at 25 ° C. is in the above range, the precut processability can be ensured. Moreover, it is excellent in the reliability of a semiconductor device as the storage elastic modulus after hardening at 260 degreeC is the said range.

  The adhesive sheet of the present invention is formed on a release substrate, an adhesive layer disposed on the release substrate, having a predetermined planar shape, and in contact with the release substrate around the adhesive layer. It has a configuration in which an adhesive film layer is sequentially laminated. In the present invention, the adhesive layer and the adhesive film layer are referred to as a laminate. The laminate composed of the adhesive layer and the adhesive film layer is cut into a predetermined shape and partially laminated on the release substrate, and a plurality of the laminates are arranged in the length direction of the release substrate. Distributed.

  Here, the predetermined shape of the laminate is a state in which the laminate is partially laminated on the release substrate, and the predetermined planar shape of the adhesive layer is a planar shape of an adherend such as a semiconductor wafer. For example, a semiconductor such as a circle, a substantially circle, a quadrangle, a pentagon, a hexagon, an octagon, and a wafer shape (a shape in which a part of the outer periphery of the circle is a straight line) is not particularly limited. It is preferable that the shape be easily attached to the wafer. Among these, in order to reduce useless parts other than the semiconductor wafer mounting portion, a circular shape or a wafer shape is preferable.

  When dicing a semiconductor wafer, a wafer ring is usually used for handling with a dicing apparatus. In this case, the peeling substrate is peeled off from the adhesive sheet, a wafer ring is stuck on the adhesive film layer, and a semiconductor wafer is stuck inside the wafer ring. Here, the wafer ring is a frame such as an annular shape or a square shape, and the adhesive film layer of the laminate in the adhesive sheet preferably further has a planar shape that matches the wafer ring.

  The adhesive film layer can sufficiently fix an adherend such as a semiconductor wafer or a wafer ring at room temperature (25 ° C.), and is adhesive enough to be peeled off after dicing to a wafer ring or the like. It is preferable to have. The pressure-sensitive adhesive strength of the pressure-sensitive adhesive film layer before wafer irradiation is preferably 3 to 150 N / m, and more preferably 10 to 100 N / m. When it exceeds 150 N / m, it is difficult to peel off from the wafer ring, and workability is lowered. If it is less than 3 N / m, the holding force with respect to the wafer ring is insufficient, and there is a risk of hindering the manufacturing process of the semiconductor device.

Hereinafter, each layer which comprises an adhesive sheet is demonstrated in detail.
The release substrate serves as a carrier film when the adhesive sheet is used. Examples of the release substrate include polyester films such as polyethylene terephthalate films, polytetrafluoroethylene films, polyethylene films, and polypropylene films. Polyolefin films such as polymethylpentene film and polyvinyl acetate film, plastic films such as polyvinyl chloride film and polyimide film can be used. Moreover, paper, a nonwoven fabric, metal foil, etc. can also be used.

  The surface of the release substrate on the adhesive layer side is preferably surface-treated with a release agent such as a silicone release agent, a fluorine release agent, or a long-chain alkyl acrylate release agent. Although the thickness of a peeling base material can be suitably selected in the range which does not impair the workability | operativity at the time of use, it is preferable that it is 10-500 micrometers, It is more preferable that it is 20-100 micrometers, It is 25-50 micrometers. It is particularly preferred.

  In the adhesive layer in the present invention, for example, a high molecular weight component is used, and a thermal polymerizable component, a high energy ray polymerizable component, or the like can be contained therein. By setting it as the composition containing such a component, an adhesive bond layer can be given the characteristic which hardens | cures with a high energy ray (for example, an electron beam, an ultraviolet-ray, radiation, etc.) or a heat | fever. Moreover, the structure which mainly uses curable components, such as a thermally polymerizable component and a high energy ray polymerizable component, may be sufficient.

The high molecular weight component used in the adhesive layer is not particularly limited as long as it is a resin having thermoplasticity, or at least a resin that has thermoplasticity in an uncured state and forms a crosslinked structure after heating. 1) Tg (glass transition temperature) is 10 to 100 ° C. and weight average molecular weight is 5000 to 200000, or (2) Tg is −50 to 50 ° C. and weight average molecular weight is Those having 100,000 to 1,000,000 are preferably used.
Examples of the high molecular weight component (1) include polyimide resin, polyamide resin, polyetherimide resin, polyamideimide resin, polyester resin, polyesterimide resin, phenoxy resin, polysulfone resin, polyethersulfone resin, polyphenylene sulfide resin, Examples thereof include polyether ketone resins and acrylic resins. Among them, it is preferable to use a polyimide resin.

  The polyimide resin as one of the more preferable high molecular weight components of the above (1) can be obtained, for example, by subjecting tetracarboxylic dianhydride and diamine to a condensation reaction by a known method. That is, in an organic solvent, tetracarboxylic dianhydride and diamine are used in an equimolar or almost equimolar amount (the order of addition of each component is arbitrary), and an addition reaction is performed at a reaction temperature of 80 ° C. or lower, preferably 0 to 60 ° C. . As the reaction proceeds, the viscosity of the reaction solution gradually increases, and polyamic acid, which is a polyimide precursor, is generated.

  Moreover, the polymer containing a functional monomer is mentioned as a preferable thing among the high molecular weight components of said (2). Examples of the functional group in such a polymer include a glycidyl group, an acryloyl group, a methacryloyl group, a hydroxyl group, a carboxyl group, an isocyanurate group, an amino group, and an amide group, and among them, a glycidyl group is preferable. More specifically, a glycidyl group-containing (meth) acrylic copolymer containing a functional monomer such as glycidyl acrylate or glycidyl methacrylate is preferable, and these are used as a constituent material of the adhesive layer, before curing. It is preferably incompatible with thermosetting resins such as epoxy resins.

The polymer containing the functional monomer and having a weight average molecular weight of 100,000 or more includes, for example, a functional monomer such as glycidyl acrylate or glycidyl methacrylate and has a weight average molecular weight of 100,000. Examples thereof include glycidyl group-containing (meth) acrylic copolymers as described above, and among them, those that are incompatible with thermosetting resins such as epoxy resins before curing are preferable.
As said glycidyl group containing (meth) acrylic copolymer, a glycidyl group containing (meth) acrylic ester copolymer, a glycidyl group containing acrylic rubber, etc. can be used, for example, and a glycidyl group containing acrylic rubber is more preferable. The glycidyl group-containing acrylic rubber as used in the present invention is a copolymer containing a glycidyl group mainly composed of an acrylate ester and mainly composed of butyl acrylate and acrylonitrile, or ethyl acrylate and acrylonitrile. .

  The functional monomer means a monomer having a functional group, and it is preferable to use glycidyl acrylate or glycidyl methacrylate as such a monomer. Specific examples of the glycidyl group-containing (meth) acrylic copolymer having a weight average molecular weight of 100,000 or more include HTR-860P-3 (trade name) manufactured by Nagase ChemteX Corporation.

  The amount of the epoxy group-containing monomer unit such as glycidyl acrylate or glycidyl methacrylate is preferably 0.5 to 50% by mass based on the total amount of the monomer in order to cure by heating and effectively form a network structure. In addition, from the viewpoint of ensuring adhesive strength and preventing gelation, 0.5 to 6% by mass is more preferable, 0.8 to 5% by mass is further preferable, and 1 to 4% by mass is preferable. Particularly preferred.

  It is also possible to copolymerize with a monomer other than an epoxy group-containing monomer such as glycidyl acrylate and glycidyl methacrylate. Examples of the monomer other than the epoxy group-containing monomer include ethyl (meth) acrylate and butyl (meth) acrylate. These may be used alone or in combination of two or more. In the present invention, ethyl (meth) acrylate means ethyl acrylate or ethyl methacrylate. When the monomer other than the epoxy group-containing monomer is used in combination, the mixing ratio is determined in consideration of the Tg of the glycidyl group-containing (meth) acrylic copolymer so that the Tg becomes −10 ° C. or higher. preferable. When Tg is −10 ° C. or higher, the tackiness of the adhesive layer in an uncured state is appropriate, and the handleability tends to be good.

When polymerizing the functional monomer to produce a high molecular weight component having a functional monomer-containing weight average molecular weight of 100,000 or more, the polymerization method is not particularly limited. For example, pearl polymerization, solution polymerization, etc. The method can be used. The weight average molecular weight of the high molecular weight component containing the functional monomer is 100,000 or more, preferably 300,000 to 3,000,000, and more preferably 500,000 to 2,000,000. When the weight average molecular weight is within this range, the strength, flexibility, and tackiness of a sheet or film are appropriate, and the flowability is appropriate, so the circuit fillability of wiring is ensured. It tends to be possible.
In the present invention, the weight average molecular weight is a value measured by gel permeation chromatography and converted using a standard polystyrene calibration curve.

  Moreover, the usage-amount of the high molecular weight component whose weight average molecular weight containing a functional monomer is 100,000 or more has preferable 10-400 mass parts with respect to 100 mass parts of thermopolymerizable components. When it is in this range, storage elastic modulus and flowability during molding can be ensured, and handling properties at high temperatures tend to be good. Moreover, 15-350 mass parts is more preferable, and 20-300 mass parts is especially preferable with respect to 100 mass parts of thermopolymerizable components.

  The thermopolymerizable component used in the adhesive layer is not particularly limited as long as it is polymerized by heat. For example, glycidyl group, acryloyl group, methacryloyl group, hydroxyl group, carboxyl group, isocyanurate group, amino group, amide And compounds having a functional group such as a group. These can be used alone or in combination of two or more. In consideration of the heat resistance of the adhesive sheet, it is preferable to use a thermosetting resin or a curing agent that cures by heat and exerts an adhesive action on the adhesive layer.

Examples of the thermosetting resin include an epoxy resin, an acrylic resin, a silicone resin, a phenol resin, a thermosetting polyimide resin, a polyurethane resin, a melamine resin, and a urea resin, and in particular, heat resistance, workability, and reliability. It is preferable to use an epoxy resin in that an adhesive sheet excellent in the above can be obtained. Moreover, it is preferable that content of a thermosetting resin is 5 to 50 mass% with respect to the whole adhesive bond layer.
The epoxy resin is not particularly limited as long as it is cured and has an adhesive action. As such an epoxy resin, for example, a bifunctional epoxy resin such as a bisphenol A type epoxy resin, a novolak type epoxy resin such as a phenol novolac type epoxy resin or a cresol novolac type epoxy resin, or the like can be used. Moreover, what is generally known, such as a polyfunctional epoxy resin, a glycidyl amine type epoxy resin, a heterocyclic ring-containing epoxy resin, or an alicyclic epoxy resin, can be used.

  As the bisphenol A type epoxy resin, Epicoat series (Epicoat 807, Epicoat 815, Epicoat 825, Epicoat 827, Epicoat 828, Epicoat 834, Epicoat 1001, Epicoat 1004, Epicoat 1007, Epicoat 1009) manufactured by Japan Epoxy Resin Co., Ltd., Dow Chemical DER-330, DER-301, DER-361 made by the company, YD8125, YDF8170 made by Toto Kasei Co., Ltd., etc. are mentioned.

  Examples of phenol novolac type epoxy resins include Epicoat 152 and Epicoat 154 manufactured by Japan Epoxy Resin Co., Ltd., EPPN-201 manufactured by Nippon Kayaku Co., Ltd., DEN-438 manufactured by Dow Chemical Co., Ltd., and o-cresol novolak type epoxy resin. Examples of the resin include EOCN-102S, EOCN-103S, EOCN-104S, EOCN-1012, EOCN-1025, EOCN-1027 manufactured by Nippon Kayaku Co., Ltd., YDCN700-10 manufactured by Tohto Kasei Co., Ltd., and the like.

  As the polyfunctional epoxy resin, Epon 1031S manufactured by Japan Epoxy Resin Co., Ltd., Araldite 0163 manufactured by Ciba Specialty Chemicals Co., Ltd., Denacol EX-611, EX-614, EX-614B, EX-622 manufactured by Nagase ChemteX Corporation. , EX-512, EX-521, EX-421, EX-411, EX-321, and the like.

As glycidylamine type epoxy resins, Epicoat 604 manufactured by Japan Epoxy Resin Co., Ltd., YH-434 manufactured by Toto Kasei Co., Ltd., TETRAD-X and TETRAD-C manufactured by Mitsubishi Gas Chemical Co., Ltd., ELM manufactured by Sumitomo Chemical Co., Ltd. -120 etc. are mentioned.
Examples of the heterocyclic ring-containing epoxy resin include Araldite PT810 manufactured by Ciba Specialty Chemicals, ERL4234, ERL4299, ERL4221, and ERL4206 manufactured by UCC.
Examples of the alicyclic epoxy resin include Epolide series and Celoxide series manufactured by Daicel Chemical Industries, Ltd.
These epoxy resins can be used alone or in combination of two or more.

  When using an epoxy resin, it is preferable to use an epoxy resin curing agent. As the epoxy resin curing agent, known curing agents that are usually used can be used, for example, amines, polyamides, acid anhydrides, polysulfides, boron trifluoride, dicyandiamide, bisphenol A, bisphenol F, bisphenol. Examples thereof include bisphenols having two or more phenolic hydroxyl groups per molecule such as S, phenol resins such as phenol novolac resin, bisphenol A novolac resin and cresol novolac resin. Phenol resins such as phenol novolac resin, bisphenol A novolac resin, and cresol novolac resin are particularly preferable in terms of excellent electric corrosion resistance at the time of moisture absorption. In the present invention, the epoxy resin curing agent includes what is called a curing accelerator that acts catalytically on an epoxy group to promote crosslinking.

  Among the phenol resins as the epoxy resin curing agent, for example, Dainippon Ink & Chemicals, Inc., trade names: Phenolite LF4871, Phenolite LF2822, Phenolite TD-2090, Phenolite TD-2149 Phenolite VH-4150, Phenolite VH4170, Meiwa Kasei Co., Ltd., trade name: H-1, Japan Epoxy Resin Co., Ltd., trade name: EpiCure MP402FPY, EpiCure YL6065, EpiCure YLH129B65, and Mitsui Chemicals, Inc. Name: Milex XL, Milex XLC, Milex RN, Milex RS, Milex VR and the like.

In the pressure-sensitive adhesive film layer in the present invention, a radiation polymerizable component (or a high energy ray polymerizable component), a photopolymerization initiator, or the like can be usually used.
As a high energy ray polymerizable component used for the pressure-sensitive adhesive film layer, for example, by containing a radiation polymerizable component, after adhering an adhesive layer to an adherend such as a semiconductor wafer, radiation before dicing Picking up can be facilitated by improving the adhesive strength during dicing by irradiating, or conversely reducing the adhesive strength by irradiating with radiation after dicing. In the present invention, as such a radiation polymerizable component, a compound conventionally used in a radiation polymerizable dicing sheet can be used without particular limitation.
Also, by including a thermosetting resin component in the adhesive layer, the adhesive layer is cured by heat when mounting the semiconductor element, heat when passing through the solder reflow, etc., and the reliability of the semiconductor device Can be improved.

  Although it does not restrict | limit especially as a radiation polymerizable component, For example, methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, butyl acrylate, butyl methacrylate, 2-ethylhexyl acrylate, methacrylic acid-2- Ethylhexyl, pentenyl acrylate, tetrahydrofurfuryl acrylate, tetrahydrofurfuryl methacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, tetraethylene glycol diacrylate, diethylene glycol dimethacrylate, triethylene glycol dimethacrylate, tetraethylene glycol dimethacrylate, trimethylolpropane Diacrylate, trimethylolpropane triacrylate, trimethylolpropane Methacrylate, trimethylolpropane trimethacrylate, 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate, 1,4-butanediol dimethacrylate, 1,6-hexanediol dimethacrylate, pentaerythritol triacrylate, penta Erythritol tetraacrylate, pentaerythritol trimethacrylate, pentaerythritol tetramethacrylate, dipentaerythritol hexaacrylate, dipentaerythritol hexamethacrylate, styrene, divinylbenzene, 4-vinyltoluene, 4-vinylpyridine, N-vinylpyrrolidone, 2-hydroxyethyl Acrylate, 2-hydroxyethyl methacrylate, 1,3-acryloyloxy-2-hydroxy Propane, 1,2-methacryloyloxy-2-hydroxypropane, methylenebisacrylamide, N, N- dimethyl acrylamide, N- methylol acrylamide, tris (beta-hydroxyethyl) can be used triacrylate isocyanurate.

  In addition, a photopolymerization initiator (for example, one that generates free radicals by irradiation with high energy rays such as radiation) can be added to the adhesive film layer. Examples of the photopolymerization initiator include benzophenone, N, N′-tetramethyl-4,4′-diaminobenzophenone (Michler ketone), N, N′-tetraethyl-4,4′-diaminobenzophenone, 4-methoxy- 4′-dimethylaminobenzophenone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1,2,2-dimethoxy-1,2-diphenylethane-1-one, 1-hydroxy- Aromatic ketones such as cyclohexyl-phenyl-ketone, 2-methyl-1- (4- (methylthio) phenyl) -2-morpholinopropanone-1,2,4-diethylthioxanthone, 2-ethylanthraquinone, phenanthrenequinone, benzoin Methyl ether, benzoin ethyl ether, benzoin pheny Benzoin ethers such as ether, benzoins such as methylbenzoin and ethylbenzoin, benzyl derivatives such as benzyldimethyl ketal, 2- (o-chlorophenyl) -4,5-diphenylimidazole dimer, 2- (o-chlorophenyl) -4 , 5-di (m-methoxyphenyl) imidazole dimer, 2- (o-fluorophenyl) -4,5-phenylimidazole dimer, 2- (o-methoxyphenyl) -4,5-diphenylimidazole dimer 2-mer, 2- (p-methoxyphenyl) -4,5-diphenylimidazole dimer, 2,4-di (p-methoxyphenyl) -5-phenylimidazole dimer, 2- (2,4-dimethoxy) 2,4,5-triarylimidazole dimer such as phenyl) -4,5-diphenylimidazole dimer, - phenyl acridine, 1,7-bis (9,9'-acridinyl) like acridine derivatives heptane, and the like.

Moreover, you may add the photoinitiator which generate | occur | produces a base and a radical with high energy rays, such as radiation irradiation, to an adhesion film layer or an adhesive bond layer. Thereby, radicals are generated by high energy beam irradiation before dicing or after dicing, and the high energy beam polymerizable component is cured, and a base which is a curing agent of the thermosetting resin is generated in the system, and thereafter Since the thermosetting reaction of the adhesive layer by the heat history can be efficiently performed, it is not necessary to add respective initiators for the photoreaction and the thermosetting reaction.
Examples of photoinitiators that generate bases and radicals upon irradiation with radiation include 2-methyl-1 (4- (methylthio) phenyl-2-morpholinopropan-1-one (manufactured by Ciba Specialty Chemicals, Irgacure 907), 2-Benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1-one (Ciba Specialty Chemicals, Irgacure 369), hexaarylbisimidazole derivative (halogen, alkoxy group, nitro group, cyano A substituent such as a group may be substituted with a phenyl group), a benzoisoxazolone derivative, or the like.

In the adhesive film layer or the adhesive layer, the above-mentioned photopolymerization initiator that generates free radicals with high energy rays and the following compound that generates a base with high energy rays may be added separately.
A compound that generates a base upon irradiation is a compound that generates a base upon irradiation, and the generated base increases the curing reaction rate of the thermosetting resin, and is also referred to as a photobase generator. As the base to be generated, a strongly basic compound is preferable in terms of reactivity and curing speed. In general, a pKa value that is a logarithm of an acid dissociation constant is used as a basic index, and a base having a pKa value in an aqueous solution of 7 or more is preferable, and a base of 9 or more is more preferable.

  Moreover, it is preferable to use the compound which generate | occur | produces a base by the light irradiation of wavelength 150-750nm as the compound which generate | occur | produces a base by the said radiation irradiation, In order to generate | occur | produce a base efficiently when using a general light source. A compound that generates a base upon irradiation with light of 250 to 500 nm is more preferable.

  Examples of such compounds that generate a base upon irradiation include imidazole derivatives such as imidazole, 2,4-dimethylimidazole and 1-methylimidazole, piperazine derivatives such as piperazine and 2,5-dimethylpiperazine, piperidine, 1 Piperidine derivatives such as 2-dimethylpiperidine, proline derivatives, trialkylamine derivatives such as trimethylamine, triethylamine, triethanolamine, 4-methylaminopyridine, 4-dimethylaminopyridine and the like, an amino group or an alkylamino group is at the 4-position Substituted pyridine derivatives, pyrrolidine derivatives such as pyrrolidine and n-methylpyrrolidine, alicyclic amine derivatives such as triethylenediamine and 1,8-diazabiscyclo (5,4,0) undecene-1 (DBU), benzylmethyl Min, benzyldimethylamine, and the like benzylamine derivatives such as benzyl diethylamine.

Moreover, in order to increase the storage elastic modulus of the adhesive layer that is cured by radiation or heat, for example, the use amount of an epoxy resin is increased, an epoxy resin having a high glycidyl group concentration, or a phenol resin having a high hydroxyl group concentration is used. Thus, methods such as increasing the crosslinking density of the whole polymer or adding an inorganic filler can be used.
The inorganic filler for increasing the storage elastic modulus of the adhesive layer will be described later.

  Furthermore, a high molecular weight component that is compatible with the thermopolymerizable component can be added to the adhesive layer for the purpose of improving flexibility and reflow crack resistance. Such a high molecular weight resin is not particularly limited, and examples thereof include a phenoxy resin, a high molecular weight thermopolymerizable component, and an ultrahigh molecular weight thermopolymerizable component. These can be used alone or in combination of two or more.

In addition, an inorganic filler may be added to the adhesive layer for the purpose of improving the handleability, improving the thermal conductivity, adjusting the melt viscosity and imparting thixotropic properties. The inorganic filler is not particularly limited. For example, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, aluminum borate whisker , Boron nitride, crystalline silica, amorphous silica and the like, and the shape of the filler is not particularly limited. These fillers can be used alone or in combination of two or more.
Among these, aluminum oxide, aluminum nitride, boron nitride, crystalline silica, and amorphous silica are preferable for improving thermal conductivity. For the purpose of adjusting melt viscosity and imparting thixotropic properties, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, crystallinity Silica, amorphous silica and the like are preferable.

Further, the average particle size of the inorganic filler is preferably 0.005 μm to 1 μm, and the adhesiveness may be lowered even if it is smaller or larger than this.
It is preferable that the compounding quantity of an inorganic filler is 1-20 mass% with respect to 100 mass% of adhesive bond layers. If the blending amount is less than 1% by mass, the effect of addition tends not to be obtained. If the blending amount exceeds 20% by mass, the storage elastic modulus of the adhesive layer increases, the adhesiveness decreases, the electrical properties decrease due to residual voids, etc. There is a tendency to cause problems.

  The thickness of the adhesive layer does not affect the bonding operation to the semiconductor wafer and the dicing operation after the bonding while ensuring sufficient adhesion to the adherend such as a support member for mounting the semiconductor element. A range is desirable. From this viewpoint, the thickness of the adhesive layer is preferably 1 to 300 μm, more preferably 5 to 150 μm, and particularly preferably 10 to 100 μm. When the thickness is less than 1 μm, it tends to be difficult to ensure a sufficient die-bonding adhesive force, and when it exceeds 300 μm, there is a tendency that problems such as an influence on the pasting work and the dicing work occur.

  Moreover, it is preferable that the thickness of an adhesion film layer is 10-500 micrometers, It is more preferable that it is 25-200 micrometers, It is especially preferable that it is 50-150 micrometers.

  The adhesion at the interface between the adhesive layer and the adhesive film layer is preferably greater than 4 N / m and not greater than 20 N / m. When the adhesive force at the interface between the adhesive layer and the adhesive film layer is in the above range, the interface between the adhesive layer and the adhesive film layer is peeled off in the step of picking up the semiconductor element and thermocompression bonding to the substrate to be mounted. Therefore, it is possible to prevent a defect that the element is damaged.

  The adhesive sheet of the present invention is an adhesive sheet subjected to the above-described precut processing. In the adhesive sheet of the present invention, when the adhesive force at the interface between the adhesive layer and the pressure-sensitive adhesive film layer is in the above range, in the step of picking up the semiconductor element and thermocompression bonding to the substrate to be mounted, The defect that the interface between the agent layer and the adhesive film layer does not peel off and the element is damaged can be prevented. Therefore, the semiconductor element can be easily picked up.

  Here, the adhesion strength in the present invention means an average value obtained by measuring five points of peel strength when the adhesive film layer is peeled in the direction of 180 degrees while supporting the adhesive layer side. From the viewpoint of sufficiently suppressing the occurrence of pick-up failure, it is preferable that five points are arbitrarily measured and all the calculated peel strengths are within the above range.

<Method for producing adhesive sheet>
The manufacturing method of the said adhesive sheet is demonstrated.
The manufacturing method of the adhesive sheet of the present invention includes: a first laminating step of laminating an adhesive layer on a release substrate; the surface of the adhesive layer on the side opposite to the side in contact with the release substrate; A first cutting step in which a cut is made with respect to the surface of the peeling substrate until it reaches, the adhesive layer on the cut outer peripheral portion is removed, and an adhesive layer having a predetermined planar shape is formed; A second laminating step of laminating the pressure-sensitive adhesive film layer so as to cover the adhesive layer having the predetermined planar shape and the peeling base material, and the peeling of the pressure-sensitive adhesive film layer; A cut is made in a non-perpendicular direction with respect to the release substrate plane from the surface opposite to the substrate side until the release substrate is reached, the adhesive film layer on the cut outer peripheral portion is removed, and the predetermined A planar adhesive layer, covering the adhesive layer and surrounding the adhesive layer; In comprising a pressure-sensitive adhesive film layer in contact with the release substrate, characterized in that it comprises a second cutting step of forming a laminated body having a predetermined shape.

Hereinafter, each manufacturing process will be described in more detail.
In the first laminating step, first, the material constituting the adhesive layer is dissolved or dispersed in a solvent to form an adhesive layer forming varnish, which is applied onto a release substrate, and then the solvent is removed by heating. On the other hand, the pressure-sensitive adhesive film layer used in the second laminating step is prepared by first dissolving or dispersing a material constituting the pressure-sensitive adhesive film layer in a solvent to form a pressure-sensitive adhesive film layer forming varnish, which is applied to the base film, and then heated. After removing the solvent by the step, it is bonded to another base film to obtain an adhesive film layer.

  Here, the solvent used in the preparation of the varnish for forming both layers is not particularly limited as long as it can dissolve or disperse each constituent material, but considering the volatility at the time of layer formation, For example, it is preferable to use a solvent having a relatively low boiling point such as methanol, ethanol, 2-methoxyethanol, 2-ethoxyethanol, 2-butoxyethanol, methyl ethyl ketone, acetone, methyl isobutyl ketone, toluene, and xylene. In addition, for the purpose of improving the coating properties, for example, a solvent having a relatively high boiling point such as dimethylacetamide, dimethylformamide, N-methylpyrrolidone, cyclohexanone can be used. These solvents can be used alone or in combination of two or more. In addition, after preparing a varnish, the bubble in a varnish can also be removed by vacuum deaeration.

As a method for applying the adhesive layer forming varnish to the release substrate in the first laminating step and a method for applying the adhesive film layer forming varnish to the substrate film in the second laminating step, known methods are used. For example, a knife coating method, a roll coating method, a spray coating method, a gravure coating method, a bar coating method, a curtain coating method, a die coating method, or the like can be used.
In addition, bonding of an adhesive bond layer and an adhesion film layer can be performed by a conventionally well-known method, for example, can be performed using a laminator etc.

  As a manufacturing method for uneven treatment on the adhesive film layer, a known method can be used, for example, rolling with a laminator roll subjected to surface treatment such as embossing, plasma treatment, ultraviolet treatment, etc. can be used. A method using a grained laminator roll is effective. A known method can be used as a method for applying a texture to the laminator roll, and examples thereof include a photo-etching method, a skin drawing method, a sand blasting method, and a surface treatment with a chemical. Molded product average depth: Rz is preferably 1.5 to 8 μm, more preferably 2 to 6 μm. If it is smaller than 1.5 μm, the effect of improving the pickup success rate tends to be reduced, and if it exceeds 8 μm, voids are generated at the interface between the adhesive layer and the pressure-sensitive adhesive film layer, and the appearance of the adhesive sheet tends to be lowered.

In the second lamination step, the adhesive force at the interface between the adhesive layer and the pressure-sensitive adhesive film layer is preferably greater than 4 N / m and not greater than 20 N / m. Adjust the average depth of the embossed molded product so that it is within this range, and if you want to reduce the adhesion, increase the depth, and if you want to increase the adhesion, reduce the depth, etc. adjust. When the adhesive force at the interface between the adhesive layer and the adhesive film layer is in the above range, the interface between the adhesive layer and the adhesive film layer is peeled off in the step of picking up the semiconductor element and thermocompression bonding to the substrate to be mounted. Therefore, it is possible to prevent a defect that the element is damaged. Therefore, the semiconductor element can be easily picked up. Thereafter, unnecessary portions of the laminate are peeled and removed as necessary to obtain a target adhesive sheet.
As mentioned above, although preferred embodiment of the adhesive sheet of this invention and the manufacturing method of an adhesive sheet was described in detail, this invention is not limited to these embodiment.

<Method for Manufacturing Semiconductor Device>
A method for manufacturing a semiconductor device using the adhesive sheet of the present invention will be described.
In the adhesive sheet of the present invention, the release substrate plays the role of a carrier film, and while being supported by two rolls and a wedge-shaped member, one end thereof is wound while being connected to a cylindrical core. 1 roll is formed and the other end is wound in a state of being connected to a cylindrical core to form a second roll. And the winding core drive motor for rotating the said core is connected to the core of the 2nd roll, and the peeling base material after the 2nd laminated body in an adhesive sheet peeled is predetermined. It is designed to be wound at a speed of.

  First, when the winding core driving motor rotates, the winding core of the second roll rotates, and the adhesive sheet wound around the winding core of the first roll is pulled out of the first roll. The drawn adhesive sheet is guided onto a disk-shaped semiconductor wafer disposed on a movable stage and a wafer ring disposed so as to surround the disk-shaped semiconductor wafer.

  Next, the laminated body which consists of an adhesive bond layer and an adhesion film layer is peeled from a peeling base material. At this time, a wedge-shaped member is applied from the peeling substrate side of the adhesive sheet, the peeling substrate is bent at an acute angle toward the member side, and a peeling starting point is created between the peeling substrate and the laminate. . Further, air is blown to the boundary surface between the peeling substrate and the laminate so that the peeling starting point is more efficiently created.

  After the separation starting point is created between the release substrate and the laminate in this way, the laminate is attached so that the adhesive film layer is in close contact with the wafer ring and the adhesive layer is in close contact with the semiconductor wafer. Is called. At this time, the laminate is pressed against the semiconductor wafer and the wafer ring by the roll. Then, the attachment of the stacked body on the semiconductor wafer and the wafer ring is completed.

By the procedure as described above, the second laminated body can be attached to the semiconductor wafer continuously in an automated process. As an apparatus for performing the operation of attaching the laminated body to such a semiconductor wafer, for example, RAD-2500 (trade name) manufactured by Lintec Corporation may be used.
And when sticking a laminated body to a semiconductor wafer by such a process, by using an adhesive sheet, the peeling origin between a peeling base material and a laminated body (the peeling origin between a peeling base material and an adhesive film layer) ) Can be easily produced, and the occurrence of peeling failure can be sufficiently suppressed.

  Next, the semiconductor wafer to which the laminated body is attached by the above-described process is diced to a required size by a cutting member, for example, a dicing blade, to obtain a semiconductor element to which an adhesive layer is attached. Here, steps such as washing and drying may be further performed. At this time, since the semiconductor wafer is sufficiently adhered and held by the adhesive film layer by the adhesive layer, the semiconductor wafer and the semiconductor element after dicing are sufficiently prevented from falling off during each of the above steps.

  Next, the adhesive layer is irradiated with high energy rays such as radiation, and a part of the adhesive layer is polymerized and cured. At this time, heating may be further performed for the purpose of accelerating the curing reaction simultaneously with or after irradiation with the high energy beam. Irradiation of the high energy ray to the adhesive layer is performed from the surface of the pressure-sensitive adhesive film layer on which the adhesive layer is not provided. Therefore, when ultraviolet rays are used as the high energy rays, the adhesive film layer needs to be light transmissive. In addition, when using an electron beam as a high energy ray, the adhesive film layer does not necessarily need to be light transmissive.

  After the high energy beam irradiation, the semiconductor element to be picked up is picked up by, for example, a suction collet. At this time, the semiconductor element to be picked up can be pushed up from the lower surface of the adhesive film layer, for example, with a needle pallet. By curing the adhesive layer, when picking up the semiconductor element, peeling is likely to occur at the interface between the adhesive layer and the adhesive film layer, and the adhesive layer is picked up with the adhesive layer attached to the lower surface of the semiconductor element. It becomes. Then, the semiconductor element to which the adhesive layer is attached is placed on the support member for mounting the semiconductor element via the adhesive layer, and heated. By heating, the adhesive layer exhibits an adhesive force, and the bonding between the semiconductor element and the semiconductor element mounting support member is completed. Then, a semiconductor device is manufactured through a wire bonding process, a sealing process, and the like as necessary.

<Semiconductor device>
In the semiconductor device of the present invention, a semiconductor element is laminated on an organic substrate serving as a support member for mounting a semiconductor element via an adhesive layer. Further, a circuit pattern and a terminal are formed on the organic substrate, and the circuit pattern and the semiconductor element are connected to each other by wire bonds. These are sealed with a sealing material to form a semiconductor device. This semiconductor device is manufactured using the adhesive sheet of the present invention by the above-described method for manufacturing a semiconductor device of the present invention. As mentioned above, although the manufacturing method of the semiconductor device of this invention and the suitable embodiment of the semiconductor device were demonstrated in detail, this invention is not limited to these embodiment.

EXAMPLES Hereinafter, examples and comparative examples will be described more specifically, but the present invention is not limited to the following examples.
<Preparation of adhesive layer varnish>
First, a cresol novolac type epoxy resin (manufactured by Toto Kasei Co., Ltd., trade name: YDCN-700-10, epoxy equivalent: 220) as an epoxy resin and a low water-absorbing phenol resin (manufactured by Mitsui Chemicals, Inc.) (Product name: XLC-LL, phenol xylene glycol dimethyl ether condensate) To 40 parts by mass, 1500 parts by mass of cyclohexanone as a varnish preparation solvent was added and stirred and mixed until completely dissolved.
Next, 1.5 parts by mass of γ-glycidoxypropyltrimethoxysilane (manufactured by Nippon Unicar Co., Ltd., trade name: NUC A-189) and γ-ureidopropyltriethoxysilane (manufactured by Nippon Unicar Co., Ltd.) as coupling agents (Trade name: NCU A-1160) 3 parts by mass was added, and further 32 parts by mass of silica filler (manufactured by Nippon Aerosil Co., Ltd., trade name: R972V) was added as an inorganic filler, followed by stirring and mixing, followed by dispersion treatment with a bead mill. .
Furthermore, as a high molecular weight component, an epoxy group-containing acrylic copolymer (manufactured by Nagase ChemteX Corporation, trade name: HTR-860P-3) 200 parts by mass and a curing accelerator 1-cyanoethyl-2-phenylimidazole (Shikoku) 0.5 parts by mass of Kasei Kogyo Co., Ltd., trade name: Curesol 2PZ-CN) was added and mixed with stirring to prepare an adhesive layer forming varnish.

Example 1
The adhesive layer forming varnish is applied onto a 50 μm-thick polyethylene terephthalate film (trade name: Teijin Purex A31, manufactured by Teijin DuPont Films, Ltd.), which is a peeling substrate, and heat-dried at 140 ° C. for 5 minutes. Then, an uncured adhesive layer having a thickness of 10 μm was formed (first laminating step).
The obtained adhesive layer was subjected to circular precut processing with a diameter of 210 mm by adjusting the cut angle to the release substrate to be 90 ° (first cutting step).
The adhesive film layer is composed of 63 parts by mass of dipentaerythritol hexaacrylate (trade name: Kayarad DPHA, manufactured by Nippon Kayaku Co., Ltd.) as a radiation polymerizable component, and 2-methyl-1 (4- (methylthio) phenyl as a photopolymerization initiator. 2-Morpholinopropan-1-one (Ciba Specialty Chemicals, trade name: Irgacure 907) 5 parts by mass, 32 parts by mass of cyclohexanone as a varnish adjusting solvent was added, and the mixture was stirred and mixed for 60 minutes or more. A varnish for forming was prepared by applying this varnish for forming an adhesive film layer on a substrate film having a film thickness of 38 μm (trade name: Teijin Purex A53, manufactured by Teijin DuPont Films, Ltd.) and drying by heating at 110 ° C. for 10 minutes. The adhesive film layer having a film thickness of 50 μm obtained was Bonded ethylene made film (thickness 100 [mu] m), to obtain a base film attached adhesive film layer.

  Thereafter, unnecessary portions of the adhesive layer are removed, and the portion of the pressure-sensitive adhesive film layer with a base film that is in contact with the adhesive layer, a portion having a diameter of 230 mm, room temperature (25 ° C.), linear pressure of 1 kg / cm, speed of 0.5 m / min. The pressure-sensitive adhesive film layer was subjected to an unevenness treatment while being rolled with a textured roll having a maximum depth of 3.1 μm and an average depth of Rz = 2.3 μm. Furthermore, it affixed so that an adhesive film layer with a base film might contact | connect an adhesive bond layer (2nd lamination process). And the circular pre-cut process of diameter 290mm was performed to the adhesive film layer with a base film concentrically with the adhesive bond layer, and the unnecessary part of the adhesive film layer was removed (2nd cutting process). Thereby, an adhesive sheet as shown in FIGS. 1 and 2 was obtained.

(Example 2)
In the second laminating step, a roll having a maximum depth of 5.5 μm and an average depth: Rz = 3.8 μm applied to a portion having a diameter of 230 mm in contact with the adhesive layer of the pressure-sensitive adhesive film layer with a base film is used. The adhesive sheet was obtained in the same manner as in Example 1 except that the unevenness treatment was performed.

(Example 3)
In the second laminating step, the embossing with a maximum depth of 5.5 μm and an average depth of Rz = 3.8 μm is applied in the vertical direction and the horizontal direction at a portion having a diameter of 230 mm in contact with the adhesive layer of the adhesive film layer with a base film. An adhesive sheet was obtained in the same manner as in Example 1 except that the unevenness treatment was performed using a roll having a spacing of 300 μm.

(Comparative Example 1)
Second Laminating Step An adhesive sheet was obtained in the same manner as in Example 1 except that the part having a diameter of 230 mm in contact with the adhesive layer of the pressure-sensitive adhesive film layer with a base film was not subjected to graining.

<Evaluation test>
The adhesive sheets obtained in Examples 1 to 3 and Comparative Example 1 were wound up so that the number of laminated bodies (with a release substrate) having a circular shape was 300 sheets, and adhesive sheet rolls were produced. The obtained adhesive sheet roll was left in a refrigerator (5 ° C.) for 2 weeks. Then, after returning the adhesive sheet roll to room temperature, the roll was unwound, and the adhesive layer and the pressure-sensitive adhesive film layer were peeled from the release substrate, and this was attached to the semiconductor wafer from the adhesive layer side as shown in FIG. After further dicing to 5 mm square, it was air-dried for 24 hours. Further, ultraviolet rays were irradiated from the adhesive film layer side. Thereafter, a pickup test was performed using a die bonder (BESTEM-D02) manufactured by Canon Machinery Co., Ltd.
The adhesion force between the adhesive layer and the adhesive film layer of the adhesive sheets obtained in Examples 1 to 3 and Comparative Example 1 described above was used in a state where the adhesive layer side was supported using a peeling device, and a pulling speed of 50 mm / The adhesive film layer was peeled off in the direction of 180 degrees, and the peel strength was measured at five points and averaged.
The results are shown in Table 1.

  As shown in Table 1, according to the adhesive sheets (Examples 1 to 3) according to the present invention, compared to the comparative adhesive sheet (Comparative Example 1), the interface between the adhesive layer and the adhesive film layer. It is clear that it is possible to sufficiently prevent the element from being peeled off and damaging the element. That is, it is confirmed that the adhesive sheets (Examples 1 to 3) according to the present invention can sufficiently suppress a decrease in the success rate of the pickup in the process of picking up the semiconductor element and thermocompression bonding to the substrate to be mounted. It was.

1: Release substrate, 2: Adhesive layer, 3: Adhesive film layer, 4: Processed surface with unevenness, 5: Semiconductor wafer, 6: Wafer ring.

Claims (8)

  A peeling base material, an adhesive layer partially provided on the surface of the peeling base material, and covering the adhesive layer and surrounding the adhesive layer on the peeling base material An adhesive sheet having a pressure-sensitive adhesive film layer provided so as to be in contact with the surface of the pressure-sensitive adhesive film layer, wherein the surface of the pressure-sensitive adhesive film layer includes a region subjected to a treatment having irregularities on all or part of the region in contact with the adhesive layer. .   2. The adhesive sheet according to claim 1, wherein an adhesive force between the surface of the pressure-sensitive adhesive film layer and the adhesive layer in a region subjected to the unevenness treatment is greater than 4 N / m and not greater than 20 N / m.   The adhesive according to claim 1 or 2, wherein the adhesive layer comprises an epoxy resin, an epoxy resin curing agent, and a polymer having a structural unit derived from a functional monomer and having a weight average molecular weight of 100,000 or more. Sheet.   The polymer contains at least one of a glycidyl group-containing acrylic copolymer and a glycidyl group-containing methacrylic copolymer, and the content of the epoxy resin with respect to the entire adhesive layer is 5% by mass or more and 50% by mass or less, Item 4. The adhesive sheet according to Item 3. It is a manufacturing method of the adhesive sheet according to any one of claims 1 to 4,
Preparing a release substrate with an adhesive layer having a release substrate and an adhesive layer partially provided on the surface of the release substrate;
Preparing a pressure-sensitive adhesive film layer having a region subjected to a treatment having irregularities in all or part of the region in contact with the adhesive layer;
In the release substrate with the adhesive layer, a step of covering the adhesive layer and providing the pressure-sensitive adhesive film layer so as to be in contact with the release substrate around a region where the adhesive layer is provided;
Cutting the adhesive film layer from the surface not in contact with the release substrate until it reaches the release substrate, and removing a part of the cut adhesive film layer;
A step of forming the predetermined planar shape adhesive layer and a laminated body having a predetermined shape comprising the adhesive layer and covering the adhesive layer and in contact with the release substrate around the adhesive layer; ,
The manufacturing method of the adhesive sheet containing this. The adhesive sheet according to any one of claims 1 to 4 or the adhesive sheet obtained by the method for producing an adhesive sheet according to claim 5, comprising an adhesive layer and an adhesive film layer. Peeling the laminated body from the release substrate, attaching the surface on the adhesive layer side of the laminated body to a semiconductor wafer, and obtaining a semiconductor wafer with a laminated body;
Cutting the semiconductor wafer with a laminate from the surface on the semiconductor wafer side to the interface between the adhesive layer and the adhesive film layer;
Peeling the cut semiconductor wafer and the adhesive layer from the adhesive film layer to obtain a semiconductor element with an adhesive layer;
Bonding the semiconductor element in the semiconductor element with an adhesive layer to an adherend via the adhesive layer;
A method for manufacturing a semiconductor device, comprising:   The method for manufacturing a semiconductor device according to claim 6, wherein the adherend is a support member for mounting a semiconductor element or another semiconductor element.   A semiconductor device manufactured by the method for manufacturing a semiconductor device according to claim 6.

Images