JP2012049402A - Manufacturing device of semiconductor device, semiconductor device pickup method, and semiconductor device manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing device of a semiconductor device, a semiconductor device pickup method, and a semiconductor device manufacturing method, enabling secure pickup.SOLUTION: A manufacturing device 1 of a semiconductor device includes: a wafer support member 5 for supporting a wafer sheet 3, having a plurality of chips 2 adhered on one surface and a wafer ring 4 formed in a manner to surround the plurality of chips 2, so as to surround the plurality of chips 2 from the other surface side; a sheet expansion mechanism 6 provided in a ascendable/descendable manner relatively to the wafer support member 5 while retaining the wafer ring 4; and a pickup mechanism 7 for picking up the chips 2 on the wafer sheet 3 expanded by the sheet expansion mechanism 6. The sheet expansion mechanism 6 includes: a retention member 12 for retaining the wafer ring 4; and a retention member support 13 for supporting the retention member 12. The relative ascending/descending operation of the sheet expansion mechanism 6 to the wafer support member 5 is made by controlling a torque-controllable drive mechanism.

Description

  Embodiments described herein relate generally to a semiconductor device manufacturing apparatus, a semiconductor device pickup method, and a semiconductor device manufacturing method.

  Generally, in a semiconductor device manufacturing apparatus that picks up a semiconductor chip (hereinafter simply referred to as a chip) supplied in a state of being attached to a wafer sheet, the wafer sheet is stretched in the surface direction and the distance between the chips is increased. And a sheet extending mechanism for facilitating pickup and a push-up member for peeling the chip from the wafer sheet.

  As shown in FIG. 8, the sheet stretching mechanism 102 of the semiconductor device manufacturing apparatus 101 includes a holding member 105 that holds a wafer sheet 104 having a chip 103 provided on one surface, and a holding member 105. And a control unit (not shown) that controls the operation of the air cylinder 106 and the lowering restriction member 107. Further, the push-up member 108 is provided on the other surface side of the wafer sheet 104, and is provided so that the chip 103 can be pushed up through the wafer sheet 104.

  When the chip 103 is picked up, the wafer sheet 104 is stretched by the sheet stretching mechanism 102 and the holding member 105 is lowered to a predetermined lowering stop position, and then the chip 103 is pushed up by the push-up member 108 and picked up. The chip 103 is picked up by the head 109.

JP 2009-16470 A

  However, the conventional semiconductor device manufacturing apparatus 101 does not consider the following points.

  The wafer sheet 104 locally stretched by the push-up member 108 does not return to the state before being stretched after the push-up member 108 is lowered. As the number increased, the tension gradually decreased. However, when the relaxed wafer sheet 104 is stretched by the sheet stretching mechanism 102, the lowering position of the holding member 105 is used as a reference, so that it is difficult to adjust the tension of the wafer sheet 104 to be constant. It was easy for a pickup error to occur.

  Accordingly, an object of the present invention is to provide a semiconductor device manufacturing apparatus, a semiconductor device pickup method, and a semiconductor device manufacturing method capable of more reliable pickup.

  In order to achieve the above object, a semiconductor device manufacturing apparatus according to an embodiment has a wafer sheet in which a plurality of chips are attached to one surface and a wafer ring is formed so as to surround the plurality of chips. A wafer support member that supports a plurality of chips from the side, a sheet tension mechanism that is capable of moving up and down relative to the wafer support member while holding the wafer ring, and a tension by the sheet tension mechanism A semiconductor device manufacturing apparatus including a pickup mechanism for picking up a chip on a provided wafer sheet, wherein the sheet stretching mechanism includes a holding member for holding a wafer ring, and a holding member for supporting the holding member And a relative lifting operation of the sheet stretching mechanism and the wafer support member is performed by controlling a drive material structure capable of torque control. It is.

  A semiconductor device pickup method according to an embodiment is a semiconductor device pickup method using the semiconductor device manufacturing apparatus according to claim 1, wherein the chip is picked up by a pickup mechanism; A method of picking up a wafer sheet according to a decrease in the number thereof, and

  A semiconductor device manufacturing method according to an embodiment is a semiconductor device manufacturing method using the semiconductor device manufacturing apparatus according to claim 1, wherein a wafer ring of a wafer sheet is attached to a sheet stretching mechanism. A step of holding by the holding member, a step of moving the wafer support member and the sheet stretching mechanism relatively up and down by the driving material structure, and widening the interval between the plurality of chips attached to the wafer sheet; and a pickup mechanism The method includes a step of pushing up a chip by the push-up member and picking up the chip by a pickup head, and a step of stretching a wafer sheet in accordance with the reduction of the chip.

The top view of a general wafer sheet. The top view of the manufacturing apparatus of the semiconductor device which concerns on embodiment of this invention. Sectional drawing of the manufacturing apparatus of the semiconductor device which follows the AA line of FIG. Sectional drawing of the manufacturing apparatus of the semiconductor device which follows the BB line of FIG. Sectional drawing of the process of the manufacturing method of the semiconductor device which concerns on embodiment of this invention. Sectional drawing of the process of the manufacturing method of the semiconductor device which concerns on embodiment of this invention. The top view of the wafer sheet in connection with the manufacturing method of the semiconductor device which concerns on embodiment of this invention. Sectional drawing which shows the manufacturing apparatus of the conventional semiconductor device.

  Hereinafter, a semiconductor device manufacturing apparatus, a semiconductor device pickup method, and a semiconductor device manufacturing method capable of more reliable pickup according to embodiments of the present invention will be described in detail with reference to the drawings.

  First, a wafer sheet 3 provided with semiconductor chips 2 for forming a semiconductor device will be described with reference to FIG.

  As shown in FIG. 1, the wafer sheet 3 is obtained by attaching a wafer divided for each semiconductor chip 2 (hereinafter referred to as a chip) and forming a wafer ring 4 therearound.

  Next, a semiconductor device manufacturing apparatus according to an embodiment of the present invention will be described with reference to FIGS.

  As shown in FIGS. 2 and 3, the semiconductor device manufacturing apparatus 1 in this embodiment includes a wafer support member 5, a sheet stretching mechanism 6, a pickup mechanism 7, an airframe support member 8, and an XY table 9. I have.

  The wafer support member 5 is provided to support the opposite surface side (the other surface side) of the surface (one surface) on which the chip 2 of the wafer sheet 3 is provided when the wafer sheet 3 is stretched. The first annular member 10 and the second annular member 11 that is fitted to the first annular member 10 and supported by the body support member 8 are configured.

  Two sheet tensioning mechanisms 6 are provided, and are installed at positions where the wafer sheets 3 face each other, and are provided so as to be able to move up and down while holding the wafer ring 4 of the wafer sheets 3. Further, the sheet stretching mechanism 6 supports the holding member 12 that holds the wafer ring 4 of the wafer sheet 3, the holding member support 13 that is screwed to and supported by the holding member 12, and the holding member support 13. Supporting member 14, a motor 15 that drives the holding member support 13, a coupling 16 that connects a part of the holding member support 13 and the rotation axis R of the motor 15, and a controller 17 that controls the motor 15. It consists of and.

  The holding member 12 includes a presser 18 and a holding table 19, and holds the wafer ring 4 of the wafer sheet 3 by the presser 18 and the holding table 19. The holding base 19 is provided with a nut N for screwing with the holding member support 13 and can be moved up and down by the rotation of the holding member support 13.

  The holding member support 13 uses a member in which a spiral groove is provided in a portion of the holding member 12 that is screwed with the nut N, and a spiral groove is not formed in a region that is not screwed with the nut N. . As a specific object, for example, a ball screw or the like is used.

  The support member 14 supports the holding member support 13 through the bearing B. The support member 14 is provided with a sheet tension mechanism support member 20 to support the entire sheet tension mechanism 6 and is connected to the second annular member 11 of the wafer support member 5.

  The motor 15 is a drive material structure capable of torque control in accordance with a change in load in order to stretch the wafer sheet 3 with a constant tension, and uses a torque motor. By using such a torque-controllable driving material structure, it becomes easy to adjust the tension of the wafer sheet 3 to be constant each time the number of picked-up chips 2 gradually increases.

  The motor 15 is controlled by the control unit 17, and the two motors 15 are controlled by one control unit 17. In the present embodiment, the two motors 15 are controlled by the single control unit 17, but the control units 17 may be provided for the two motors 15 to perform control.

  As shown in FIGS. 2, 3, and 4, the pickup mechanism 7 is provided to push up the chip 2 on the stretched wafer sheet 3 and pick up the pushed-up chip 2. The material structure for pushing up the chip 2 on the wafer sheet 3 is provided in the drive unit 21, the push-up member 22 that moves up and down toward the other surface of the wafer sheet 3 by the drive unit 21, and the drive unit 21. The transmission member 24 is transmitted to the push-up member 22, and an inverted L-shaped stand S that supports the drive unit 21. The material structure for picking up the chip 2 includes a pickup head 23 provided at a position facing the push-up member 22 and the wafer sheet 3 and picking up the pushed-up chip 2.

  The drive unit 21 is provided to raise and lower the push-up member 22 toward the wafer sheet 3. The drive unit 21 is supported by the stand S so as to be disposed between the body support member 8 and the XY table 9.

  The transmission member 24 is installed on the driving unit 21, and is provided so as to pass through an opening O of the body support member 8 and a second annular member 11 of the wafer holding member 6, which will be described later, and to contact the wafer sheet 3. .

  The push-up member 22 is provided in the transmission member 24, and the length of the push-up member 22 is set such that the pickup head 23 can protrude to a height at which the chip 2 can be easily picked up.

  The pickup head 23 is installed on the push-up member 22 to pick up the chip 2 pushed up by the push-up member 22. Further, the pickup head 23 is provided so as to be able to move the chip 2 to a chip moving place (not shown) after picking up the chip 2.

  The body support member 8 is provided to support the second annular member 11 of the wafer support member 5, is installed on the XY table 9, and is provided in an L shape. And the opening area O which is an opening area smaller than the opening area of the 2nd annular member 11 of the wafer support member 5, and was provided through is formed.

  Since the position of the pickup mechanism 7 is fixed when the chip 2 of the wafer sheet 3 is picked up, the XY table 9 is provided to change the position of picking up by the XY table 9.

  Next, a method for manufacturing a semiconductor device and a method for picking up a semiconductor device according to an embodiment of the present invention will be described with reference to FIG. In addition, although there is a part which abbreviate | omits illustration, it refers to FIG.

  First, as shown in FIG. 5A, the wafer ring 4 of the wafer sheet 3 is positioned and installed on the holding table 19 of the holding member 12, and the wafer ring 4 of the wafer sheet 3 is pressed by the presser 18 and the holding table 19. Hold.

  Next, as shown in FIG. 5B, the holding member support 13 is rotated by a motor 15 (not shown) through a coupling 16 (not shown), and the holding member 12 is lowered. Then, the holding member 12 is lowered until the distance between the chips 2 on the wafer sheet 3 increases.

  At this time, the wafer sheet 3 is stretched while being supported by the first annular member 10 of the wafer support member 5.

  Then, as shown in FIG. 5C, the drive member 21 (not shown) of the pickup mechanism 7 causes the push-up member 22 to protrude through the transmission member 24, and the chip 2 on the wafer sheet 3 is pushed up. Further, the chip 2 pushed up is picked up by the pickup head 23.

  Thereafter, as shown in FIG. 5D, the push-up member 22 descends. Then, the chip 2 picked up by the pickup head 23 is placed at a predetermined location (not shown).

  Further, in order to stretch the relaxed wafer sheet 3 by the push-up member 22, torque control is performed by the control unit 17 (not shown), and the motor 15 is rotated. Then, the holding member support 13 is rotated via the coupling 16 by the rotation of the motor 15, whereby the holding member 12 holding the wafer ring 4 is further lowered. Thus, the torque of the rotation of the motor 15 is controlled by the control unit 17 according to the decrease of the chip 2, so that the tension of the relaxed wafer sheet 3 can be made constant, so that another chip 2 is picked up. Pick-up mistakes can be prevented.

  Next, as shown in FIG. 6, in order to pick up another chip 2, the XY table 9 is moved in the -X-axis direction, so that the wafer support member 5, the sheet stretching mechanism 6, and the body support member are moved. 8 is moved so that the other chip 2 is positioned on the wafer sheet 3 on the push-up member 22 of the pickup mechanism 7 that does not move.

  In the present embodiment, the XY table 9 moves in the −X axis direction, but is not limited to this, and the X axis direction, the Y axis direction, the −Y axis direction, It may be moved in any way such as in the XY axis direction.

  Then, another chip 2 is pushed up by the push-up member 22 again as shown in FIG. 5C, the chip 2 pushed up by the pickup head 23 is picked up, and the push-up member 22 is lowered as shown in FIG. The holding member 12 is lowered while controlling the torque of the motor 15 by the control unit 17 (not shown).

  In this way, the steps shown in FIGS. 5C, 5D, and 6 are repeated until all the chips 2 on the wafer sheet 3 are picked up.

  Further, as the order of picking up the chips 2, as shown in FIG. 7, the chips 2 on the wafer sheet 3 are picked up spirally from the center. Since the tension is applied concentrically, the tension applied to the wafer sheet 3 stretched by torque control can be made even more uniform by picking up in this order.

  In the present embodiment, the chip 2 is picked up spirally from the center. However, the chip 2 may be picked up spirally from the outer periphery, and the tension of the wafer sheet 3 is applied uniformly without unevenness. Any order may be used as long as pickup can be performed.

  As described above, according to this embodiment, the motor 15 capable of torque control is provided in the semiconductor device manufacturing apparatus 1, and when picking up the chip 2 on the wafer sheet 3, torque is applied so that the tension of the wafer sheet 3 is constant. It is possible to rotate while controlling. As a result, the tension of the wafer sheet 3 can be adjusted to be constant, and more reliable pickup can be performed.

  Further, in order to prevent the tension of the wafer sheet 3 from being biased, when the chip 2 is picked up, the chip 2 is picked up spirally from the center so that the tension is uniformly applied and can be stretched uniformly. Thereby, since the tension of the wafer sheet 3 can be made more uniform, it is possible to perform more reliable pickup.

DESCRIPTION OF SYMBOLS 1,101 ... Semiconductor device manufacturing apparatus 2,103 ... Chip 3,104 ... Wafer sheet 4 ... Wafer ring 5 ... Wafer support member 6,102 ... Sheet stretching mechanism 7 ... Pickup mechanism 8 ... Airframe support member 9 ... XY table DESCRIPTION OF SYMBOLS 10 ... 1st annular member 11 ... 2nd annular member 12, 105 ... Holding member 13 ... Holding member support tool 14 ... Supporting member 15 ... Motor 16 ... Coupling 17 ... Control part 18 ... Presser 19 ... Holding stand 20 ... Sheet tensioning mechanism support member 21... Driving part 22, 108 ... push-up member 23, 109 ... pickup head 24 ... transmission member D ... step part R ... rotating shaft N ... nut S ... stand B ... bearing O ... opening 106 ... air Cylinder 107 ... descent restriction member

Claims (6)

A wafer supporting member that supports a wafer sheet in which a plurality of chips are attached to one surface and a wafer ring is formed so as to surround the plurality of chips so as to surround the plurality of chips from the other surface side;
A sheet tensioning mechanism provided so as to be able to move up and down relatively with the wafer support member while holding the wafer ring;
A pickup mechanism for picking up the chips on the wafer sheet stretched by the sheet stretching mechanism;
A semiconductor device manufacturing apparatus comprising:
The sheet stretching mechanism includes a holding member that holds the wafer ring;
A holding member support that supports the holding member;
2. The semiconductor device manufacturing apparatus according to claim 1, wherein a relative lifting operation of the sheet stretching mechanism and the wafer support member is performed by controlling a driving material structure capable of torque control.   2. The apparatus for manufacturing a semiconductor device according to claim 1, wherein the driving material structure is a torque motor. A semiconductor device pick-up method using the semiconductor device manufacturing apparatus according to claim 1,
Picking up the chip by the pickup mechanism;
Stretching the tension of the wafer sheet constant according to the decrease in the number of chips;
A method for picking up a semiconductor device comprising:   5. The method of picking up a semiconductor device according to claim 4, wherein the picking up of the chips is picked up in an order in which the tension of the wafer sheet can be uniformly stretched. A semiconductor device manufacturing method using the semiconductor device manufacturing apparatus according to claim 1, wherein:
Holding the wafer ring of the wafer sheet by the holding member of the sheet stretching mechanism;
A step of moving the wafer support member and the sheet stretching mechanism relatively up and down by the driving material structure, and widening the interval between the plurality of chips attached to the wafer sheet;
A step of pushing up the chip by the push-up member of the pickup mechanism, and picking up the chip by the pickup head;
Stretching the tension of the wafer sheet according to the reduction of the chips, and
A method for manufacturing a semiconductor device, comprising:   6. The semiconductor device according to claim 5, further comprising a step of picking up the chips in an order in which tension of the wafer sheet can be uniformly stretched when the chips are picked up by the pickup mechanism. Manufacturing method.

Images