JP2012004162A - Heat dissipation apparatus for surface mounting component - Google Patents
Heat dissipation apparatus for surface mounting component Download PDFInfo
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- JP2012004162A JP2012004162A JP2010135013A JP2010135013A JP2012004162A JP 2012004162 A JP2012004162 A JP 2012004162A JP 2010135013 A JP2010135013 A JP 2010135013A JP 2010135013 A JP2010135013 A JP 2010135013A JP 2012004162 A JP2012004162 A JP 2012004162A
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- surface mount
- copper foil
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 48
- 239000000758 substrate Substances 0.000 claims abstract description 64
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 41
- 230000002093 peripheral effect Effects 0.000 claims abstract description 5
- 230000020169 heat generation Effects 0.000 claims abstract 6
- 239000011889 copper foil Substances 0.000 claims description 30
- 230000005855 radiation Effects 0.000 claims description 21
- 238000005476 soldering Methods 0.000 claims description 9
- 230000000694 effects Effects 0.000 abstract description 7
- 238000001816 cooling Methods 0.000 description 15
- 238000009434 installation Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
本発明は、表面実装部品放熱装置に関するものである。
更に詳述すれば、効率よく放熱効果を高め、コストを抑え、基板アッセンブリーの生産性向上を図る表面実装部品放熱装置に関するものである。
The present invention relates to a surface mount component heat dissipation device.
More specifically, the present invention relates to a surface mount component heat dissipating device that efficiently enhances the heat dissipating effect, reduces the cost, and improves the productivity of the substrate assembly.
表面実装基板において、基板に実装された一部の部品自体の発熱、及びその周囲部品からのもらい熱により部品固有の許容温度を超えるものが存在する。
図５は従来より一般に使用されている従来例の要部構成説明図、図６は図５の放熱対策説明図である。
図において、表面実装基板１には、冷却対象部品２，３等が存在する。
また、回路の配線パタ−ン上から移動し難く、また、高さが高い電子部品４も存在する。
Some surface-mount substrates exceed the permissible temperature inherent to the components due to heat generated by some components themselves mounted on the substrate and heat received from surrounding components.
FIG. 5 is an explanatory diagram of a main part configuration of a conventional example that is generally used conventionally, and FIG. 6 is an explanatory diagram of heat radiation countermeasures of FIG.
In the figure, the surface mount substrate 1 has components 2 and 3 to be cooled.
There is also an electronic component 4 that is difficult to move from the circuit wiring pattern and that has a high height.
許容温度を超える電子部品に対しては、冷却したい部品の放熱面積を増やす対策がなされている。
具体的には、図６に示す如く、
対策１、ヒートシンク５を取付け、放熱効率をあげる。
対策２、基板内層の銅箔面積９を増し、基板面全体に熱を伝導させる。
対策３、許容温度の高い部品に変更する。
等が考えられる。
For electronic components that exceed the allowable temperature, measures are taken to increase the heat radiation area of the components that are to be cooled.
Specifically, as shown in FIG.
Countermeasure 1, heat sink 5 is attached to increase heat dissipation efficiency.
Measure 2, increase the copper foil area 9 of the inner layer of the substrate, and conduct heat to the entire substrate surface.
Measure 3, change to a part with high allowable temperature.
Etc. are considered.
このような装置においては、以下の問題点がある。
電子部品が密装された表面実装基板においては、基板面積に対し部品実装率が高いことから、容易に前記対策１、対策２の対策を実施できない。
理由として、ヒートシンク５を基板１に締結する為のねじや支柱などの締結部品６や、締結部品６に係わる部品実装禁止エリア８や、基板表面の銅箔面は容易に捻出し難い。
Such an apparatus has the following problems.
In a surface-mounted board on which electronic components are densely mounted, since the component mounting rate is high with respect to the board area, the measures 1 and 2 cannot be easily implemented.
The reason is that it is difficult to easily screw out the fastening component 6 such as a screw or a support for fastening the heat sink 5 to the substrate 1, the component mounting prohibited area 8 related to the fastening component 6, and the copper foil surface of the substrate surface.
また、ヒートシンク５を接触させたい、あおり熱を受ける部品２、発熱する部品３の部品群のエリアに、移動し難い障害となる部品４がある場合など、部分的にヒートシンク５に切欠き５１を設けるなどの処置が必要となる。
機械加工を行う為、ヒートシンク５の製造コストは高くなる。
Further, when the heat sink 5 is in contact with the heat sink 5 and the heat generating component 3 has a component 4 that is difficult to move in the area of the component group 2, the heat sink 5 is partially contacted with the notch 51. It is necessary to take measures such as providing it.
Since machining is performed, the manufacturing cost of the heat sink 5 increases.
また、ヒートシンク５を使用する為には、熱伝導シートの介在が必要で、部分的には絶縁シートを貼り付けるか、安全に必要な離間をとる必要がある。
対策３に関しては、コストの観点から、許容温度の高い特殊部品を避けて、なるべく標準的な部品を使用したい。
Further, in order to use the heat sink 5, it is necessary to interpose a heat conductive sheet, and it is necessary to partially attach an insulating sheet or to secure a necessary separation.
Regarding Measure 3, from the viewpoint of cost, we want to avoid standard parts with high allowable temperature and use standard parts as much as possible.
一方で、空冷ファンに代表される強制空冷方式は、パッケージの大きさ制限や、コスト面から除外される。
本発明装置は、基本的に自然空冷である。
On the other hand, the forced air cooling system typified by an air cooling fan is excluded from package size restrictions and cost.
The device of the present invention is basically natural air cooling.
本発明の目的は、上記の課題を解決するもので、発熱部品やあおり熱を受ける部品群のエリア全面にヒートシンクを取付けることをせず、わずかなエリアを有効に使用して放熱部材を配置し、効率よく放熱効果を高め、放熱手段としてのコストを抑え、基板アッセンブリーの生産性向上を図る表面実装部品放熱装置を提供することにある。 An object of the present invention is to solve the above-mentioned problems, and without disposing a heat sink on the entire area of a heat generating component or a component group that receives heat from the heat, a heat radiating member is arranged using a small area effectively. Another object of the present invention is to provide a surface mount component heat dissipating device that efficiently enhances the heat dissipating effect, suppresses the cost of heat dissipating means, and improves the productivity of the substrate assembly.
このような課題を達成するために、本発明では、請求項１の表面実装部品放熱装置においては、
表面実装基板に実装された発熱部品を放熱する表面実装部品放熱装置において、前記発熱部品のリード半田付け銅箔部の周縁に一端縁が接して設けられた半田付拡大銅箔部と、前記表面実装基板に直交して設けられ前記半田付拡大銅箔部に一端が接し所定長さを有する柱状の少なくとも一個の表面実装可能な放熱柱と、を具備したことを特徴とする。
In order to achieve such a problem, in the present invention, in the surface mount component heat dissipation device of claim 1,
In a surface mount component heat dissipating device for dissipating heat generating components mounted on a surface mount substrate, the soldered enlarged copper foil portion provided with one end edge in contact with a peripheral edge of a lead soldering copper foil portion of the heat generating component, and the surface It is characterized by comprising at least one columnar heat-dissipating column that is provided perpendicular to the mounting substrate and that has one end in contact with the soldered enlarged copper foil portion and having a predetermined length.
本発明の請求項２の表面実装部品放熱装置においては、
表面実装基板に実装された発熱部品を放熱する表面実装部品放熱装置において、前記表面実装基板との接触面に放熱板を有する前記発熱部品の前記放熱板に一端縁が接して設けられた接触銅箔部と、前記表面実装基板に直交して設けられ前記接触銅箔部に一端が接し所定長さを有する柱状の少なくとも一個の表面実装可能な放熱柱と、を具備したことを特徴とする。
In the surface mount component heat dissipation device of claim 2 of the present invention,
In a surface mount component heat dissipation device for radiating heat generating components mounted on a surface mount board, contact copper provided with one end edge in contact with the heat sink of the heat generating component having a heat sink on a contact surface with the surface mount board It is characterized by comprising: a foil part; and at least one columnar heat-dissipating column that is provided perpendicular to the surface-mounting substrate and has one end in contact with the contact copper foil part and having a predetermined length.
本発明の請求項３の表面実装部品放熱装置においては、
表面実装基板に実装された発熱部品を放熱する表面実装部品放熱装置において、前記発熱部品のリード半田付け銅箔部の周縁に一端縁が接して設けられた半田付拡大銅箔部と、前記表面実装基板内に設けられ前記半田付拡大銅箔部に一端が接する拡大銅箔部サーマルビアと、前記表面実装基板の裏面に直交して設けられ前記半田付拡大銅箔部サーマルビアの他端に一端が接し所定長さを有する柱状の少なくとも一個の放熱柱と、を具備したことを特徴とする。
In the surface mount component heat dissipation device of claim 3 of the present invention,
In a surface mount component heat dissipating device for dissipating heat generating components mounted on a surface mount substrate, the soldered enlarged copper foil portion provided with one end edge in contact with a peripheral edge of a lead soldering copper foil portion of the heat generating component, and the surface An enlarged copper foil portion thermal via provided in the mounting substrate and having one end in contact with the soldered enlarged copper foil portion, and the other end of the soldered enlarged copper foil portion thermal via provided orthogonal to the back surface of the surface mounting substrate And at least one columnar heat dissipation column having a predetermined length in contact with one end.
本発明の請求項４の表面実装部品放熱装置においては、
表面実装基板に実装された発熱部品を放熱する表面実装部品放熱装置において、前記表面実装基板内に設けられ前記表面実装基板との接触面に放熱板を有する前記発熱部品の前記放熱板に一端が接する放熱板サーマルビアと、前記表面実装基板の裏面に直交して設けられ前記放熱板サーマルビアの他端に一端が接し所定長さを有する柱状の少なくとも一個の放熱柱と、を具備したことを特徴とする。
In the surface mount component heat dissipation device according to claim 4 of the present invention,
In the surface mount component heat dissipating device for dissipating the heat generating component mounted on the surface mount substrate, one end of the heat dissipating plate of the heat generating component is provided in the surface mount substrate and has a heat dissipating plate on a contact surface with the surface mount substrate. A thermal plate thermal via in contact with the thermal mounting plate, and at least one columnar heat radiation column having a predetermined length with one end in contact with the other end of the thermal plate thermal via provided perpendicular to the back surface of the surface mount substrate. Features.
本発明の請求項１によれば、次のような効果がある。
基板上の冷却対象部品の実効的な放熱面積を拡大することにより、表面実装された発熱部品の十分な冷却を実現できる表面実装部品放熱装置が得られる。
ヒートシンクの取り付けに係わるデットスペースを無くすことができ、その分、部品実装面積を増やすことができる表面実装部品放熱装置が得られる。
According to claim 1 of the present invention, there are the following effects.
By expanding the effective heat radiation area of the component to be cooled on the substrate, a surface mount component heat dissipation device capable of realizing sufficient cooling of the heat mounted component mounted on the surface can be obtained.
A surface-mounted component heat dissipating device that can eliminate the dead space for mounting the heat sink and increase the component mounting area accordingly can be obtained.
ヒートシンク設置に係わり、部品実装位置や高さ、部品実装禁止エリアやパターン禁止エリアなどの制約がなくなり、基板設計の自由度が向上する表面実装部品放熱装置が得られる。
ヒートシンクや付帯する部品である、熱伝導シート，絶縁シート，締結部品等を使用しないで良いので、コストダウンが実現できる表面実装部品放熱装置が得られる。
In connection with the heat sink installation, there are no restrictions on the component mounting position and height, the component mounting prohibited area, the pattern prohibited area, and the like, and a surface mounted component heat dissipation device that improves the degree of freedom in board design can be obtained.
Since it is not necessary to use a heat conduction sheet, an insulating sheet, a fastening component, or the like, which is a heat sink or an accompanying component, a surface mount component heat dissipation device that can realize cost reduction can be obtained.
本発明の請求項２によれば、次のような効果がある。
基板上の冷却対象部品の実効的な放熱面積を拡大することにより、表面実装された発熱部品の十分な冷却を実現できる表面実装部品放熱装置が得られる。
ヒートシンクの取り付けに係わるデットスペースを無くすことができ、その分、部品実装面積を増やすことができる表面実装部品放熱装置が得られる。
According to claim 2 of the present invention, there are the following effects.
By expanding the effective heat radiation area of the component to be cooled on the substrate, a surface mount component heat dissipation device capable of realizing sufficient cooling of the heat mounted component mounted on the surface can be obtained.
A surface-mounted component heat dissipating device that can eliminate the dead space for mounting the heat sink and increase the component mounting area accordingly can be obtained.
ヒートシンク設置に係わり、部品実装位置や高さ、部品実装禁止エリアやパターン禁止エリアなどの制約がなくなり、基板設計の自由度が向上する表面実装部品放熱装置が得られる。
ヒートシンクや付帯する部品である、熱伝導シート，絶縁シート，締結部品等を使用しないで良いので、コストダウンが実現できる表面実装部品放熱装置が得られる。
基板との接触面に放熱板を有する発熱部品を、より積極的に冷却することができる表面実装部品放熱装置が得られる。
In connection with the heat sink installation, there are no restrictions on the component mounting position and height, the component mounting prohibited area, the pattern prohibited area, and the like, and a surface mounted component heat dissipation device that improves the degree of freedom in board design can be obtained.
Since it is not necessary to use a heat conduction sheet, an insulating sheet, a fastening component, or the like, which is a heat sink or an accompanying component, a surface mount component heat dissipation device that can realize cost reduction can be obtained.
A surface mount component heat dissipating device capable of more actively cooling a heat generating component having a heat dissipating plate on the contact surface with the substrate is obtained.
本発明の請求項３によれば、次のような効果がある。
基板上の冷却対象部品の実効的な放熱面積を拡大することにより、表面実装された発熱部品の十分な冷却を実現できる表面実装部品放熱装置が得られる。
ヒートシンクの取り付けに係わるデットスペースを無くすことができ、その分、部品実装面積を増やすことができる表面実装部品放熱装置が得られる。
According to claim 3 of the present invention, there are the following effects.
By expanding the effective heat radiation area of the component to be cooled on the substrate, a surface mount component heat dissipation device capable of realizing sufficient cooling of the heat mounted component mounted on the surface can be obtained.
A surface-mounted component heat dissipating device that can eliminate the dead space for mounting the heat sink and increase the component mounting area accordingly can be obtained.
ヒートシンク設置に係わり、部品実装位置や高さ、部品実装禁止エリアやパターン禁止エリアなどの制約がなくなり、基板設計の自由度が向上する表面実装部品放熱装置が得られる。
ヒートシンクや付帯する部品である、熱伝導シート，絶縁シート，締結部品等を使用しないで良いので、コストダウンが実現できる表面実装部品放熱装置が得られる。
In connection with the heat sink installation, there are no restrictions on the component mounting position and height, the component mounting prohibited area, the pattern prohibited area, and the like, and a surface mounted component heat dissipation device that improves the degree of freedom in board design can be obtained.
Since it is not necessary to use a heat conduction sheet, an insulating sheet, a fastening component, or the like, which is a heat sink or an accompanying component, a surface mount component heat dissipation device that can realize cost reduction can be obtained.
表面実装基板の表面に放熱柱が実装できないような密集表面実装基板に対して有効な表面実装部品放熱装置が得られる。
表面実装基板の表面に邪魔な部品が配置されていて、放熱柱のマウントができない場合に有効な表面実装部品放熱装置が得られる。
A surface mount component heat dissipating device effective for a dense surface mount substrate in which heat dissipating columns cannot be mounted on the surface of the surface mount substrate is obtained.
An effective surface mount component heat dissipation device can be obtained when a disturbing component is disposed on the surface of the surface mount substrate and the heat dissipating column cannot be mounted.
本発明の請求項４によれば、次のような効果がある。
基板上の冷却対象部品の実効的な放熱面積を拡大することにより、表面実装された発熱部品の十分な冷却を実現できる表面実装部品放熱装置が得られる。
ヒートシンクの取り付けに係わるデットスペースを無くすことができ、その分、部品実装面積を増やすことができる表面実装部品放熱装置が得られる。
According to claim 4 of the present invention, there are the following effects.
By expanding the effective heat radiation area of the component to be cooled on the substrate, a surface mount component heat dissipation device capable of realizing sufficient cooling of the heat mounted component mounted on the surface can be obtained.
A surface-mounted component heat dissipating device that can eliminate the dead space for mounting the heat sink and increase the component mounting area accordingly can be obtained.
ヒートシンク設置に係わり、部品実装位置や高さ、部品実装禁止エリアやパターン禁止エリアなどの制約がなくなり、基板設計の自由度が向上する表面実装部品放熱装置が得られる。
ヒートシンクや付帯する部品である、熱伝導シート，絶縁シート，締結部品等を使用しないで良いので、コストダウンが実現できる表面実装部品放熱装置が得られる。
In connection with the heat sink installation, there are no restrictions on the component mounting position and height, the component mounting prohibited area, the pattern prohibited area, and the like, and a surface mounted component heat dissipation device that improves the degree of freedom in board design can be obtained.
Since it is not necessary to use a heat conduction sheet, an insulating sheet, a fastening component, or the like, which is a heat sink or an accompanying component, a surface mount component heat dissipation device that can realize cost reduction can be obtained.
表面実装基板の表面に放熱柱が実装できないような密集表面実装基板に対して有効な表面実装部品放熱装置が得られる。
表面実装基板の表面に邪魔な部品が配置されていて、放熱柱のマウントができない場合に有効な表面実装部品放熱装置が得られる。
基板との接触面に放熱板を有する発熱部品を、より積極的に冷却することができる表面実装部品放熱装置が得られる。
A surface mount component heat dissipating device effective for a dense surface mount substrate in which heat dissipating columns cannot be mounted on the surface of the surface mount substrate is obtained.
An effective surface mount component heat dissipation device can be obtained when a disturbing component is disposed on the surface of the surface mount substrate and the heat dissipating column cannot be mounted.
A surface mount component heat dissipating device capable of more actively cooling a heat generating component having a heat dissipating plate on the contact surface with the substrate is obtained.
以下本発明を図面を用いて詳細に説明する。
図１は本発明の一実施例の要部構成説明図、図２，図３は図１の部品説明図である。
図において、図５と同一記号の構成は同一機能を表す。
以下、図５との相違部分のみ説明する。
Hereinafter, the present invention will be described in detail with reference to the drawings.
FIG. 1 is an explanatory view showing the construction of the main part of one embodiment of the present invention, and FIGS. 2 and 3 are explanatory views of parts of FIG.
In the figure, configurations with the same symbols as in FIG. 5 represent the same functions.
Only the differences from FIG. 5 will be described below.
図１において、基板１に対し部品実装機(マウンター)で搬送可能な形状の放熱柱９１，９２を冷却対象部品２，３の近傍に実装する。
図１では、代表例として円柱を用いているが、その形状にこだわらず、より表面積の大きくなる形状を用いても良い。
In FIG. 1, heat radiation columns 91 and 92 having a shape that can be transported to a substrate 1 by a component mounting machine (mounter) are mounted in the vicinity of components 2 and 3 to be cooled.
In FIG. 1, a cylinder is used as a representative example, but a shape having a larger surface area may be used regardless of its shape.
半田付拡大銅箔部１３は、冷却対象部品２，３のリード半田付け銅箔部２１，３１の周縁に一端縁が接して設けられている。
放熱柱９１は、表面実装基板１に直交して設けられ、半田付拡大銅箔部１３に一端が接し、所定長さを有する柱状をなす。
The soldered enlarged copper foil portion 13 is provided with one end edge in contact with the periphery of the lead soldered copper foil portions 21 and 31 of the cooling target components 2 and 3.
The heat radiating column 91 is provided perpendicular to the surface-mounting substrate 1 and has a columnar shape having one end in contact with the soldered copper foil portion 13 and having a predetermined length.
接触銅箔部１４は、表面実装基板１との接触面に放熱板３１１を有する発熱部品３１の放熱板３１１に一端縁が接して設けられている。
放熱柱９２は、表面実装基板１に直交して設けられ、接触銅箔部１４に一端が接し所定長さを有し、柱状をなす。
The contact copper foil portion 14 is provided such that one end edge thereof is in contact with the heat radiating plate 311 of the heat generating component 31 having the heat radiating plate 311 on the contact surface with the surface mount substrate 1.
The heat radiating column 92 is provided orthogonal to the surface mount substrate 1, and one end thereof is in contact with the contact copper foil portion 14 and has a predetermined length, and forms a column shape.
以上の構成において、放熱柱９１，９２は、他の電子部品と共に、表面実装基板１に、部品実装機（マウンター）により実装される。 In the above configuration, the radiating columns 91 and 92 are mounted on the surface mounting substrate 1 together with other electronic components by a component mounting machine (mounter).
この結果、
基板１上の冷却対象部品の実効的な放熱面積を拡大することにより、表面実装された冷却対象部品２，３の十分な冷却を実現できる表面実装部品放熱装置が得られる。
ヒートシンクの取り付けに係わるデットスペースを無くすことができ、その分、部品実装面積を増やすことができる表面実装部品放熱装置が得られる。
As a result,
By expanding the effective heat radiation area of the component to be cooled on the substrate 1, a surface-mounted component heat radiation device that can realize sufficient cooling of the surface-mounted components 2 and 3 to be cooled is obtained.
A surface-mounted component heat dissipating device that can eliminate the dead space for mounting the heat sink and increase the component mounting area accordingly can be obtained.
ヒートシンク設置に係わり、部品実装位置や高さ、部品実装禁止エリアやパターン禁止エリアなどの制約がなくなり、基板設計の自由度が向上する表面実装部品放熱装置が得られる。
ヒートシンクや付帯する部品である、熱伝導シート，絶縁シート，締結部品等を使用しないで良いので、コストダウンが実現できる表面実装部品放熱装置が得られる。
基板１との接触面に放熱板３１１を有する発熱部品３を、より積極的に冷却することができる表面実装部品放熱装置が得られる。
In connection with the heat sink installation, there are no restrictions on the component mounting position and height, the component mounting prohibited area, the pattern prohibited area, and the like, and a surface mounted component heat dissipation device that improves the degree of freedom in board design can be obtained.
Since it is not necessary to use a heat conduction sheet, an insulating sheet, a fastening component, or the like, which is a heat sink or an accompanying component, a surface mount component heat dissipation device that can realize cost reduction can be obtained.
A surface mount component heat dissipation device that can more actively cool the heat generating component 3 having the heat dissipation plate 311 on the contact surface with the substrate 1 is obtained.
図３は、本発明の他の実施例の要部構成説明図、図４は図３のＡ−Ａ断面図である。
図３，図４において、
半田付拡大銅箔部１３は、冷却対象部品２，３のリード半田付け銅箔部の周縁に一端縁が接して設けられている。
FIG. 3 is an explanatory view showing the structure of the main part of another embodiment of the present invention, and FIG.
3 and 4,
The soldered enlarged copper foil portion 13 is provided with one end edge in contact with the periphery of the lead soldered copper foil portion of the cooling target components 2 and 3.
拡大銅箔部サーマルビア１５は、表面実装基板１内に設けられ、半田付拡大銅箔部１３に一端が接している。
放熱柱９３は、表面実装基板１の裏面に直交して設けられ、半田付拡大銅箔部サーマルビア１５の他端に一端が接し、所定長さを有する柱状をなす。
The enlarged copper foil portion thermal via 15 is provided in the surface mount substrate 1, and one end thereof is in contact with the soldered enlarged copper foil portion 13.
The heat dissipating column 93 is provided orthogonal to the back surface of the surface mounting substrate 1, and one end is in contact with the other end of the soldered enlarged copper foil portion thermal via 15 and has a column shape having a predetermined length.
放熱板サーマルビア１６は、表面実装基板１内に設けられ、表面実装基板１との接触面に放熱板を有する発熱部品３の放熱板に一端が接する。
放熱柱９４は、表面実装基板の裏面に直交して設けられ、放熱板サーマルビア１６の他端に一端が接し、所定長さを有する柱状をなす。
The heat dissipation plate thermal via 16 is provided in the surface mount substrate 1, and one end thereof is in contact with the heat dissipation plate of the heat generating component 3 having a heat dissipation plate on the contact surface with the surface mount substrate 1.
The heat radiating column 94 is provided orthogonal to the back surface of the surface mount substrate, and one end is in contact with the other end of the heat radiating plate thermal via 16 and forms a column shape having a predetermined length.
以上の構成において、放熱柱９３は、表面実装基板１の裏面のサーマルビア１５の他端に実装される。
放熱柱９４は、表面実装基板１の裏面のサーマルビア，１６の他端に実装される。
In the above configuration, the heat radiation pillar 93 is mounted on the other end of the thermal via 15 on the back surface of the surface mounting substrate 1.
The heat radiation pillar 94 is mounted on the other end of the thermal via 16 on the back surface of the surface mounting substrate 1.
この結果、
基板１上の冷却対象部品の実効的な放熱面積を拡大することにより、表面実装された冷却対象部品２，３の十分な冷却を実現できる表面実装部品放熱装置が得られる。
ヒートシンクの取り付けに係わるデットスペースを無くすことができ、その分、部品実装面積を増やすことができる表面実装部品放熱装置が得られる。
As a result,
By expanding the effective heat radiation area of the component to be cooled on the substrate 1, a surface-mounted component heat radiation device that can realize sufficient cooling of the surface-mounted components 2 and 3 to be cooled is obtained.
A surface-mounted component heat dissipating device that can eliminate the dead space for mounting the heat sink and increase the component mounting area accordingly can be obtained.
ヒートシンク設置に係わり、部品実装位置や高さ、部品実装禁止エリアやパターン禁止エリアなどの制約がなくなり、基板設計の自由度が向上する表面実装部品放熱装置が得られる。
ヒートシンクや付帯する部品である、熱伝導シート，絶縁シート，締結部品等を使用しないで良いので、コストダウンが実現できる表面実装部品放熱装置が得られる。
In connection with the heat sink installation, there are no restrictions on the component mounting position and height, the component mounting prohibited area, the pattern prohibited area, and the like, and a surface mounted component heat dissipation device that improves the degree of freedom in board design can be obtained.
Since it is not necessary to use a heat conduction sheet, an insulating sheet, a fastening component, or the like, which is a heat sink or an accompanying component, a surface mount component heat dissipation device that can realize cost reduction can be obtained.
表面実装基板１の表面に放熱柱９１，９２が実装できないような密集表面実装基板１に対して有効な表面実装部品放熱装置が得られる。
表面実装基板１の表面に邪魔な部品４が配置されていて、放熱柱９１，９２のマウントができない場合に有効な表面実装部品放熱装置が得られる。
基板１との接触面に放熱板３１１を有する発熱部品３を、より積極的に冷却することができる表面実装部品放熱装置が得られる。
A surface mount component heat dissipation device effective for the dense surface mount substrate 1 in which the heat radiation pillars 91 and 92 cannot be mounted on the surface of the surface mount substrate 1 is obtained.
An effective surface mount component heat dissipating device is obtained when the disturbing component 4 is disposed on the surface of the surface mount substrate 1 and the heat dissipating columns 91 and 92 cannot be mounted.
A surface mount component heat dissipation device that can more actively cool the heat generating component 3 having the heat dissipation plate 311 on the contact surface with the substrate 1 is obtained.
なお、表面実装基板１は、積層板であっても良いことは勿論である。
また、以上の説明は、本発明の説明および例示を目的として特定の好適な実施例を示したに過ぎない。
したがって本発明は、上記実施例に限定されることなく、その本質から逸脱しない範囲で更に多くの変更、変形をも含むものである。
Of course, the surface mounting substrate 1 may be a laminated plate.
Further, the above description merely shows a specific preferred embodiment for the purpose of explanation and illustration of the present invention.
Therefore, the present invention is not limited to the above-described embodiments, and includes many changes and modifications without departing from the essence thereof.
１ 表面実装基板
２ 冷却対象部品
２１ リード半田付け銅箔部
３ 冷却対象部品
３１ リード半田付け銅箔部
３１１ 放熱板
４ 電子部品
５ ヒートシンク
５１ 切欠き
６ 締結部品
８ 部品実装禁止エリア
９ 銅箔面積
９１ 放熱柱
９２ 放熱柱
９３ 放熱柱
９４ 放熱柱
１１ 表面実装基板の表面
１２ 表面実装基板の裏面
１３ 半田付拡大銅箔部
１４ 接触銅箔部
１５ 拡大銅箔部サーマルビア
１６ 放熱板サーマルビア
DESCRIPTION OF SYMBOLS 1 Surface mounting board 2 Cooling target component 21 Lead soldering copper foil part 3 Cooling target component 31 Lead soldering copper foil part 311 Heat sink 4 Electronic component 5 Heat sink 51 Notch 6 Fastening component 8 Component mounting prohibition area 9 Copper foil area 91 Radiation column 92 Radiation column 93 Radiation column 94 Radiation column 11 Surface mount substrate surface 12 Surface mount substrate back surface 13 Soldering enlarged copper foil portion 14 Contact copper foil portion 15 Expanded copper foil portion thermal via 16 Heat radiation plate thermal via
Claims (4)
前記発熱部品のリード半田付け銅箔部の周縁に一端縁が接して設けられた半田付拡大銅箔部と、
前記表面実装基板に直交して設けられ前記半田付拡大銅箔部に一端が接し所定長さを有する柱状の少なくとも一個の表面実装可能な放熱柱と、
を具備したことを特徴とする表面実装部品放熱装置。 In a surface mount component heat dissipation device that dissipates heat generation components mounted on a surface mount board,
Soldering enlarged copper foil part provided with one end edge in contact with the peripheral edge of the lead soldering copper foil part of the heat generating component,
At least one surface-mountable heat dissipating column in the form of a column that is provided perpendicular to the surface-mount substrate and has a predetermined length at one end in contact with the soldered enlarged copper foil portion;
A surface-mounted component heat dissipating device comprising:
前記表面実装基板との接触面に放熱板を有する前記発熱部品の前記放熱板に一端縁が接して設けられた接触銅箔部と、
前記表面実装基板に直交して設けられ前記接触銅箔部に一端が接し所定長さを有する柱状の少なくとも一個の表面実装可能な放熱柱と、
を具備したことを特徴とする表面実装部品放熱装置。 In a surface mount component heat dissipation device that dissipates heat generation components mounted on a surface mount board,
A contact copper foil portion provided with one end edge in contact with the heat dissipation plate of the heat generating component having a heat dissipation plate on a contact surface with the surface mount substrate;
At least one surface-mountable heat dissipating column in the form of a column that is provided orthogonal to the surface-mounting substrate and has one end in contact with the contact copper foil portion and a predetermined length;
A surface-mounted component heat dissipating device comprising:
前記発熱部品のリード半田付け銅箔部の周縁に一端縁が接して設けられた半田付拡大銅箔部と、
前記表面実装基板内に設けられ前記半田付拡大銅箔部に一端が接する拡大銅箔部サーマルビアと、
前記表面実装基板の裏面に直交して設けられ前記半田付拡大銅箔部サーマルビアの他端に一端が接し所定長さを有する柱状の少なくとも一個の放熱柱と、
を具備したことを特徴とする表面実装部品放熱装置。 In a surface mount component heat dissipation device that dissipates heat generation components mounted on a surface mount board,
Soldering enlarged copper foil part provided with one end edge in contact with the peripheral edge of the lead soldering copper foil part of the heat generating component,
An enlarged copper foil portion thermal via that is provided in the surface mount substrate and has one end in contact with the soldered enlarged copper foil portion;
At least one columnar heat dissipating column having a predetermined length in contact with the other end of the soldered enlarged copper foil portion thermal via provided orthogonal to the back surface of the surface mount substrate;
A surface-mounted component heat dissipating device comprising:
前記表面実装基板内に設けられ前記表面実装基板との接触面に放熱板を有する前記発熱部品の前記放熱板に一端が接する放熱板サーマルビアと、
前記表面実装基板の裏面に直交して設けられ前記放熱板サーマルビアの他端に一端が接し所定長さを有する柱状の少なくとも一個の放熱柱と、
を具備したことを特徴とする表面実装部品放熱装置。 In a surface mount component heat dissipation device that dissipates heat generation components mounted on a surface mount board,
A heat dissipation plate thermal via that is provided in the surface mount substrate and has one end in contact with the heat dissipation plate of the heat generating component having a heat dissipation plate on a contact surface with the surface mount substrate,
At least one columnar heat radiation column having a predetermined length with one end in contact with the other end of the thermal plate thermal via provided orthogonal to the back surface of the surface mount substrate;
A surface-mounted component heat dissipating device comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010135013A JP2012004162A (en) | 2010-06-14 | 2010-06-14 | Heat dissipation apparatus for surface mounting component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010135013A JP2012004162A (en) | 2010-06-14 | 2010-06-14 | Heat dissipation apparatus for surface mounting component |
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| Publication Number | Publication Date |
|---|---|
| JP2012004162A true JP2012004162A (en) | 2012-01-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010135013A Pending JP2012004162A (en) | 2010-06-14 | 2010-06-14 | Heat dissipation apparatus for surface mounting component |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016507214A (en) * | 2013-02-14 | 2016-03-07 | スパル オートモーティブ ソチエタ レスポンサビリタ リミテ | Electric machine |
| WO2017208309A1 (en) * | 2016-05-30 | 2017-12-07 | 三菱電機株式会社 | Electronic module and production method therefor |
| CN113971340A (en) * | 2021-10-15 | 2022-01-25 | 飞腾信息技术有限公司 | Method, device and equipment for optimizing heat dissipation performance of copper pillar structure |
| CN116504733A (en) * | 2023-06-28 | 2023-07-28 | 深圳辰达行电子有限公司 | High-power patch bridge heat dissipation packaging structure and packaging method |
-
2010
- 2010-06-14 JP JP2010135013A patent/JP2012004162A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016507214A (en) * | 2013-02-14 | 2016-03-07 | スパル オートモーティブ ソチエタ レスポンサビリタ リミテ | Electric machine |
| WO2017208309A1 (en) * | 2016-05-30 | 2017-12-07 | 三菱電機株式会社 | Electronic module and production method therefor |
| JP6251420B1 (en) * | 2016-05-30 | 2017-12-20 | 三菱電機株式会社 | Electronic module and method for manufacturing electronic module |
| CN113971340A (en) * | 2021-10-15 | 2022-01-25 | 飞腾信息技术有限公司 | Method, device and equipment for optimizing heat dissipation performance of copper pillar structure |
| CN116504733A (en) * | 2023-06-28 | 2023-07-28 | 深圳辰达行电子有限公司 | High-power patch bridge heat dissipation packaging structure and packaging method |
| CN116504733B (en) * | 2023-06-28 | 2023-09-15 | 深圳辰达行电子有限公司 | High-power patch bridge heat dissipation packaging structure and packaging method |
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