JP2011200401A - Endoscope - Google Patents

Abstract

An object of the present invention is to efficiently dissipate heat from a circuit board.
A forceps channel 32 and an imaging module 51 having a CCD 53 and a flexible substrate 54 are arranged in the insertion portion 14 of the endoscope 2. The flexible substrate 54 is connected to the CCD 53 and has an electronic circuit component 58 mounted thereon. The flexible substrate 54 is bent in a substantially U shape in the horizontal direction, and a heat radiating portion 54d is provided. The heat radiating portion 54 d is fixed to the outer peripheral surface of the forceps channel 32 with a highly heat conductive adhesive 65 in a state of being bent along the outer shape of the forceps channel 32. A space formed by the portions 54 a to 54 c of the flexible substrate 54 is filled with a thermally conductive resin 68 and solidified. Heat generated from the CCD 53 and the electronic circuit component 58 is radiated to the forceps channel 32 through the heat conductive resin 69, the heat conductive resin 68, the flexible substrate 54, and the heat radiating portion 54d.
[Selection] Figure 8

Description

  The present invention relates to an endoscope provided with an image sensor at the distal end of an insertion portion.

  Conventionally, medical diagnosis using an endoscope has been performed in the medical field. The endoscope includes an insertion portion that is inserted into a patient's body and an operation portion that is provided at a proximal end of the insertion portion. An imaging module made up of an imaging device and a circuit board on which electronic circuit components constituting a drive circuit of the imaging device are mounted is incorporated in the internal space of the distal end portion of the insertion portion.

  The tip of the insertion portion rises in temperature due to the heat generated from the image sensor, the circuit board, and the like. When the temperature of the tip portion rises excessively, the operation of the image sensor becomes unstable, noise is generated in the output image signal, and the image quality of the captured image is degraded. Furthermore, there is a risk of shortening the lifetime of the image sensor and the electronic circuit component.

  In the electronic endoscope described in Patent Document 1, an air supply / water supply pipe is formed of a pipe having good thermal conductivity, and an image pickup element or a circuit board is fixed to the pipe, whereby the image pickup element or the circuit board is fixed. Temperature rise is suppressed. In addition, in the electronic endoscope described in Patent Document 1, the area where the pipe, the imaging element, and the circuit board are in contact with each other is increased by making the portion where the imaging element and the circuit board of the pipe are fixed to be a flat surface. It is increasing.

JP 63-226334 A

  In Patent Document 1, since the portion to which the image sensor and the electronic circuit component are fixed is a flat surface, the pipe is not cylindrical. In this case, since the direction when the pipe is arranged in the insertion portion is determined, it takes time during assembly, and furthermore, it is difficult to manufacture compared to a cylindrical one, and the cost of the pipe itself increases. In addition, when a cylindrical pipe is used, the area where the pipe, the imaging element, and the circuit board are in contact with each other is small, and sufficient heat dissipation cannot be performed.

  An object of the present invention is to provide an endoscope that can efficiently dissipate heat from a circuit board with a simple configuration.

  In order to achieve the above object, an endoscope of the present invention is built in a distal end portion of an insertion portion to be inserted into a subject, and includes an imaging device and a circuit board provided with a driving circuit for the imaging device. An imaging module; a cylindrical accommodation pipe that is provided in the insertion portion and has thermal conductivity and accommodates the imaging module; and a cylindrical forceps pipe that is accommodated in the accommodation pipe and has thermal conductivity; It is flexible and is bonded to the one pipe while being bent along the outer shape of one of the accommodation pipe and the forceps pipe, and connects the circuit board and the one pipe. And a heat dissipating sheet for dissipating heat of the imaging module to the one pipe.

  The circuit board is composed of a flexible flexible substrate, and at least one portion is bent, and a heat conductive resin having thermal conductivity is formed in the space formed by the bent flexible substrate. It is preferable that the flexible substrate is filled and solidified and fixed in a bent shape.

  Furthermore, it is preferable that the circuit board is composed of a flexible flexible board, and the heat dissipation sheet is a portion provided integrally with the flexible board and not provided with the driving circuit of the flexible board.

  Moreover, it is preferable that the said heat radiation sheet is provided separately from the said circuit board, and is adhere | attached on the said circuit board.

  Furthermore, it is preferable that the heat dissipation sheet is fixed to the one pipe with an adhesive having thermal conductivity.

  Moreover, it is preferable that the said heat radiating sheet is bend | folded before contacting the said one pipe so that it may have the elasticity toward the direction which contacts the said one pipe.

  Furthermore, it is preferable that the forceps pipe is disposed below the circuit board, and the heat dissipation sheet is bonded to an upper portion of the outer peripheral surface of the forceps pipe.

  Moreover, it is preferable that the accommodation pipe is formed with an insertion hole through which the heat dissipation sheet is inserted, and the heat dissipation sheet is inserted through the insertion hole and bonded to the upper portion of the outer peripheral surface of the accommodation pipe.

  According to the present invention, the heat radiating sheet is bonded in a state where the heat radiating sheet is bent along one outer shape of the cylindrical accommodation pipe and the forceps pipe having thermal conductivity, and the heat of the imaging module is passed through the heat radiating sheet. Since heat is radiated to the pipe, the imaging module can be efficiently radiated while using a cylindrical pipe. Accordingly, even when a high-pixel imaging device is used or the drive circuit is enhanced to stabilize the imaging signal, the imaging module can be reliably radiated.

  Further, since the circuit board is bent, the installation space of the circuit board can be reduced and the insertion portion can be reduced in size. Furthermore, since the circuit board is fixed in a bent shape by the heat conductive resin filled in the space formed by the bent circuit board, the heat of the imaging module is passed through the heat conductive resin, the circuit board, and the heat dissipation sheet. Heat to the pipe. Thereby, heat dissipation can be performed more efficiently.

It is a perspective view which shows an endoscope system. It is a front view which shows the front-end | tip cover of the insertion part of an endoscope. It is sectional drawing which shows the flexible tube part of an insertion part. It is sectional drawing which shows the front-end | tip part of an insertion part. It is a side view which shows a flexible substrate. (A) is a top view which shows the state which expand | deployed the flexible substrate, (B) is a front view which shows the state which expanded the flexible substrate. It is a front view which shows a flexible substrate and forceps channel. It is a perspective view which shows a flexible substrate and a forceps channel. It is sectional drawing which shows the front-end | tip part of the insertion part of embodiment which covers the circumference | surroundings of a flexible substrate with heat conductive resin. It is sectional drawing which shows the front-end | tip part of the insertion part of embodiment which adhere | attaches a thermal radiation part to an accommodation pipe. It is sectional drawing which shows the front-end | tip part of an insertion part when the circumference | surroundings of the flexible substrate of embodiment shown in FIG. 10 are covered with heat conductive resin. It is a top view which shows the state which expand | deployed the flexible substrate of embodiment which extended the thermal radiation part to the radial direction of the forceps channel. It is a front view which shows the flexible substrate and forceps channel of embodiment shown in FIG.

[First Embodiment]
As shown in FIGS. 1 and 2, the endoscope system 2 includes an endoscope 10, a processor device 11, a light source device 12, an air / water supply device 13, and the like. The air / water supply device 13 is built in the light source device 12 and is provided outside the light source device 12 and a well-known air supply pump 13a that generates a delivery pressure of fluid such as air or cleaning water, and stores cleaning water. It is comprised from the water tank 13b. The endoscope 10 is connected to an insertion unit 14 that is inserted into a subject, an operation unit 15 that is connected to a proximal end (rear end) portion of the insertion unit 14, and a processor device 11 and a light source device 12. And a universal cord 16.

  The insertion portion 14 is provided at the distal end thereof, and is continuously provided at the distal end portion 14a in which a CCD image sensor (hereinafter, referred to as CCD, see FIG. 4) 53 for photographing inside the subject is incorporated, and the proximal end of the distal end portion 14a. It consists of a bendable bending portion 14b and a flexible flexible tube portion 14c that is connected to the base end of the bending portion 14b. Hereinafter, the distal end side of the insertion portion 14 is simply referred to as “distal end side”, and the proximal end side of the insertion portion 14 is simply referred to as “proximal end side”.

  The distal end cover 20 of the distal end portion 14a is provided with an observation window 21, illumination windows 22a and 22b, a forceps outlet 23 from which the distal end of the forceps protrudes, and an injection nozzle 24. A CCD 53 and the like are attached to the back of the observation window 21. Two illumination windows 22a and 22b are arranged at symmetrical positions with respect to the observation window 21, and irradiate the observation site in the subject with illumination light from the light source device 12. The forceps outlet 23 communicates with a forceps port 26 provided in the operation unit 15. Various treatment tools (forceps) having an injection needle, a high-frequency knife or the like arranged at the tip are inserted into the forceps port 26. The injection nozzle 24 injects air and cleaning water supplied from the air / water supply device 13 toward the observation window 21 to wipe away dirt adhering to the observation window 21.

  A connector 28 is attached to one end of the universal cord 16. The connector 28 is a composite type connector, and is connected to the processor device 11 and the light source device 12.

  The processor device 11 performs various kinds of image processing on the imaging signal input from the CCD 53 via the universal cord 16 and the connector 28, and generates an endoscopic image. The endoscopic image generated by the processor device 11 is displayed on a monitor 29 connected to the processor device 11 by a cable. The processor device 11 is connected to the light source device 12 via a communication cable, and communicates various control information with the light source device 12.

  As shown in FIG. 3, light guides 31a and 31b, forceps channel 32, air / water supply channel 33, and multi-core cable 34 are arranged inside the flexible tube portion 14c. The light guides 31a and 31b guide the light from the light source device 12 to the illumination windows 22a and 22b. The forceps channel 32 is made of a metal pipe having thermal conductivity, and communicates the forceps outlet 23 and the forceps opening 26. The air / water supply channel 33 sends the air and washing water supplied from the air / water supply device 13 to the spray nozzle 24. The multi-core cable 34 electrically connects the processor device 11 and the CCD 53.

  The flexible tube portion 14c includes a screw tube 36 called a flex that protects the inside while maintaining flexibility in order from the inside, and a net 37 called a blade that covers the screw tube 36 and prevents the extension of the screw tube 36. And a flexible rubber 38 coated on the net 37.

  As shown in FIG. 4, inside the distal end portion 14 a, a metal accommodation pipe 41 that has thermal conductivity and accommodates the forceps channel 32 and the CCD 53, and a distal end that closes an opening on the distal end side of the accommodation pipe 41. A cover 20 is disposed, and the accommodation pipe 41 and the tip cover 20 are covered with rubber 38.

  Inside the accommodation pipe 41, light guides 31a and 31b, a forceps channel 32, an air / water supply channel 33, and a multi-core cable 34 are inserted.

  A forceps channel 32 is connected to the forceps outlet 23 of the tip cover 20. An illumination lens (not shown) is incorporated behind the illumination windows 22a and 22b, and the illumination lens faces the emission ends of the light guides 31a and 31b. Further, an air / water supply channel 33 is connected to the injection nozzle 24. One end of each of the forceps channel 32, the light guides 31a and 31b, and the air / water supply channel 33 is fixed to the tip cover 20, and the other end passes through the inside of the bending portion 14b, the flexible tube portion 14c, the operation portion 15, and the like. The forceps port 26, the light source device 12, and the air / water supply device 13 are respectively connected.

  The multi-core cable 34 includes a plurality of signal cables 34a, and the plurality of signal cables 34a are covered with an outer cover 34b (see FIG. 3) that functions as an electric shield layer.

  In the back of the observation window 21, an objective optical system 49, a prism 50, and an imaging module 51 are arranged. The imaging module 51 includes a CCD 53 and a flexible substrate 54 having flexibility. A CMOS image sensor may be provided instead of the CCD 53. The objective optical system 49 makes the image light of the observation site incident from the observation window 21 enter the prism 50. The prism 50 forms an image on the imaging surface 53 a of the CCD 53 by bending the image light from the objective optical system 49 inside.

  The CCD 53 is composed of, for example, an interline CCD, and a bare chip having an imaging surface 53a provided on the surface is used. A rectangular plate-like cover glass 56 is attached on the imaging surface 53a. The CCD 53 is connected to the prism 50 through a cover glass 56.

  The flexible substrate 54 is connected to the base end portion of the CCD 53. A plurality of electronic circuit components (drive circuits) 58 are mounted on the flexible substrate 54.

  As shown in FIG. 5, the flexible substrate 54 covers the base layer 61 made of polyimide, the wiring layer 62a and the heat conduction layer 62b made of copper foil, and the wiring layer 62a and the heat conduction layer 62b. The coating layer 63 is made of a solder resist so as to improve the flexibility. The wiring layer 62 a is formed by etching a copper foil sheet attached on the base layer 61 and connects the electronic circuit components 58. Further, the heat conductive layer 62b is a portion left without being etched on the copper foil sheet, and is not connected to the electronic circuit component 58 and the wiring layer 62a. That is, the wiring layer 62a and the heat conductive layer 62b are formed from the same single copper foil sheet. In addition, it may replace with a soldering resist and you may comprise the coating layer 63 from a coverlay film.

  One end of the signal cable 34a is soldered to the flexible substrate 54. The other end of the signal cable 34 a is connected to the processor device 11 through the bending portion 14 b, the flexible tube portion 14 c, the operation portion 15, the universal cord 16, and the connector 28. As a result, the flexible substrate 54 is electrically connected to the processor device 11, and the CCD 53 is electrically connected to the processor device 11 via the flexible substrate 54. With this connection, power is supplied from the processor device 11 to the CCD 53 and the flexible substrate 54, and various signals are exchanged between the processor device 11, the CCD 53 and the flexible substrate 54.

  As shown in FIGS. 4 to 8, the flexible substrate 54 includes a first attachment portion 54 a to which the CCD 53 is attached, a bent portion 54 b to be bent, a second attachment portion 54 c to which the electronic circuit component 58 is attached, and a first attachment. It is composed of a heat dissipating part 54d connected to the part 54a, and is bent into a substantially U shape in the lateral direction. The heat dissipating part 54d is provided with a heat conductive layer 62b on one surface, and the electronic circuit component 58 is not attached thereto.

  The heat radiating portion 54d is bent so as to be folded, and the folded portion is fixed to the outer peripheral surface of the forceps channel 32 with a high heat conductive adhesive 65 in a state where the portion is folded along the outer shape of the forceps channel 32. ing. As a result, the contact area between the heat dissipating part 54d and the forceps channel 32 is increased as compared with the case in which a rigid circuit board that cannot be deformed is placed on the forceps channel 32, and the heat of the flexible board 54 passes through the heat dissipating part 54d. The heat is efficiently radiated to the forceps channel 32. Further, since the heat radiating portion 54d has elasticity in a direction in contact with the forceps channel 32 by folding, the adhesiveness between the heat radiating portion 54d and the forceps channel 32 is high. In addition, you may form the notch which makes it easy to bend along the external shape of the forceps channel 32 in the thermal radiation part 54d.

  A space formed by the portions 54a to 54c of the flexible substrate 54 is filled and solidified with a heat conductive resin 68 (indicated by dots). As the heat conductive resin 68, a resin having a thermal conductivity of 2 W / mK or more and a withstand voltage of 15 KV / mm or more, for example, an epoxy resin is used. In addition, it may replace with an epoxy resin and what added the filler which has high heat conductivity to insulating resin with high insulation, such as silicone resin, may be used. Moreover, the kind of filler to add is not specifically limited, For example, aluminum nitride, an alumina, magnesium oxide, hexagonal boron nitride etc. are used.

  Next, the formation process of the flexible substrate 54 (application process and bending process of the heat conductive resin 68) will be described. First, as shown in FIG. 6A, after the electronic circuit component 58 and the signal cable 34a are attached to the plate-like flexible substrate 54, the flexible substrate 54 and the CCD 53 are connected.

  Next, as shown in FIGS. 6A and 6B, a heat conductive resin 68 is applied to each of the portions 54 to 54 c of the flexible substrate 54. After this application, the first attachment portion 54a is folded back to the second attachment portion 54c side while bending the bent portion 54b. And as shown in FIG. 7, the 1st attachment part 54a is fixed in the position where the 1st attachment part 54a and the 2nd attachment part 54c become substantially parallel. At this time, the space formed by the portions 54a to 54c is in a state filled with the heat conductive resin 68 as shown in FIGS.

  After fixing the first mounting portion 54a, the flexible substrate 54 is dried to solidify the heat conductive resin 68. The electronic circuit component 58 is sealed by the solidified heat conductive resin 68. Since the flexible substrate 54 is fixed in a state of being bent in a substantially U shape in the lateral direction by the heat conductive resin 68, the installation space for the flexible substrate 54 is reduced in size, and the tip end portion 14a is also reduced in size.

  In the above process, the coating process of the heat conductive resin 68, the bending process of the flexible board 54, and the drying process are performed in a state where the CCD 53 and the flexible board 54 are connected, but these processes are finished. Later, the CCD 53 and the flexible substrate 54 may be connected.

  At the same time or after the flexible substrate 54 is fixed, as shown in FIG. 4, the heat conduction of the same component as the heat conductive resin 68 is made between the prism 50 and the CCD 53 and the heat conductive resin 68 using an injection needle or the like. Insulating resin 69 is injected. The injected heat conductive resin 69 is solidified while being in close contact with the heat conductive resin 68.

  Next, the operation of the endoscope system 2 configured as described above will be described. When the endoscope system 2 is used, the insertion unit 14 is inserted into the subject.

  When the power is turned on, the CCD 53 built in the distal end portion 14a of the insertion section 14 captures an image of the subject and outputs an imaging signal. This imaging signal is input to the processor device 11 via the universal cord 16 and the connector 28. The processor device 11 performs various types of image processing on the input imaging signal to generate an image in the subject. The image in the subject is displayed on the monitor 29, and the operator observes the inside of the subject through the monitor 29.

  When an affected part such as a lesioned part is found during observation, a treatment tool suitable for the treatment of the affected part is inserted into the forceps channel 32 and protruded from the forceps outlet 23 to treat the affected part. After the treatment of the affected area, the treatment tool is removed from the forceps channel 32.

  When photographing is performed, the CCD 53 and the electronic circuit component 58 generate heat. The heat generated from the CCD 53 is transmitted to the heat conductive resin 69. Since the heat conductive resin 69 is in contact with the flexible substrate 54 and the heat conductive resin 68, the heat generated from the CCD 53 is transmitted to the flexible substrate 54 through the heat conductive resin 69 and the heat conductive resin 68. . Further, the heat generated from the electronic circuit component 58 is transmitted to the heat conductive resin 68. Since the heat conductive resin 68 is in contact with the flexible substrate 54, the heat generated from the electronic circuit component 58 is transmitted to the flexible substrate 54.

  Since the heat radiating portion 54d provided on the flexible substrate 54 is bonded to the forceps channel 32, the heat transmitted to the flexible substrate 54 is radiated to the forceps channel 32 via the heat radiating portion 54d.

  As described above, the heat generated from the CCD 53 and the electronic circuit component 58 is radiated to the forceps channel 32 through the heat conductive resin 69, the heat conductive resin 68, the flexible substrate 54, and the heat radiating portion 54d. Is done.

  As shown in FIG. 9, the periphery of the flexible substrate 54 may be covered with a silicone-based heat conductive resin 70. Thereby, the heat generated from the CCD 53 and the electronic circuit component 58 is radiated to the forceps channel 32 and the accommodation pipe 41 through the respective heat conductive resins 68 to 70 in addition to the heat radiated by the heat radiating portion 54d. By constituting the heat conductive resin 70 from silicone, even when the imaging module 51 is taken out for repair or replacement, the heat conductive resin 70 can be easily destroyed and the imaging module 51 can be taken out, and the repair property is improved. Excellent.

[Second Embodiment]
In the second embodiment shown in FIG. 10, the heat radiating portion 54 e connected to the second mounting portion 54 c of the flexible substrate 54 is bonded to the accommodation pipe 41. In addition, the same code | symbol is attached | subjected to the structural member similar to the thing of 1st Embodiment, and the detailed description is abbreviate | omitted.

  The housing pipe 41 is made of metal, and is formed with an insertion hole 72 through which the heat radiating portion 54e is inserted, and a concave portion 73 that is communicated with the insertion hole 72 and stores the heat radiating portion 54e.

  The heat radiating portion 54 e is bent and inserted through the insertion hole 72, and then bent again and stored in the recess 73. The heat radiating portion 54 e housed in the recess 73 is fixed to the outer peripheral surface of the housing pipe 41 with an adhesive 65 while being bent along the outer shape of the housing pipe 41. Further, since the heat radiating portion 54e has elasticity in a direction in contact with the accommodation pipe 41 by bending, the adhesion between the heat radiating portion 54e and the forceps channel 32 is high.

  Moreover, as shown in FIG. 11, the periphery of the flexible substrate 54 may be covered with a heat conductive resin 70. Thereby, the heat generated from the CCD 53 and the electronic circuit component 58 is radiated to the forceps channel 32 and the accommodation pipe 41 through the heat conductive resin 69 and the heat conductive resin 70 in addition to the heat radiated by the heat radiating portion 54e. .

  Further, as shown in FIGS. 12 and 13, a heat radiating portion 54 f extending in the radial direction of the forceps channel 32 is integrally provided on the flexible substrate 54, and the heat radiating portion 54 f is folded along the outer shape of the forceps channel 32 after being folded. In this state, the adhesive 65 may be fixed to the forceps channel 32.

  In the above embodiment, the heat radiating portion provided integrally with the flexible substrate is bonded to the metal forceps channel or the receiving pipe, but the heat radiating sheet provided separately from the flexible substrate is bonded to the flexible substrate. The heat dissipation sheet may be adhered to the forceps channel or the accommodation pipe. When a graphite sheet having flexibility and high thermal conductivity is used as the heat radiating sheet, the part folded back by 180 ° is composed of a flexible substrate, and the subsequent part that adheres to the forceps channel is composed of a graphite sheet. It is preferable. Moreover, when providing a thermal radiation sheet separately from a circuit board, it can replace with a flexible substrate and a rigid board | substrate can be used as a circuit board.

  Moreover, in the said embodiment, although the flexible substrate is bend | folded in the cylinder shape, as long as at least 1 place is bent, you may bend in L shape or S shape.

10 Endoscope 14 Insertion Section 32 Forceps Channel 41 Housing Pipe 53 CCD
54 Flexible substrate 54d Heat radiation part 58 Electronic circuit component 65 Adhesive 68, 69, 70 Thermally conductive resin

Claims (8)

An imaging module that is built in a distal end portion of an insertion portion to be inserted into a subject and includes an imaging device and a circuit board provided with a drive circuit for the imaging device;
A cylindrical accommodation pipe that is provided in the insertion portion and has thermal conductivity and accommodates the imaging module;
A cylindrical forceps pipe housed in the housing pipe and having thermal conductivity;
It is flexible and is bonded to the one pipe while being bent along the outer shape of one of the accommodation pipe and the forceps pipe, and connects the circuit board and the one pipe. A heat radiating sheet for radiating heat of the imaging module to the one pipe;
An endoscope comprising: The circuit board is composed of a flexible flexible board, and at least one place is bent,
The space formed by the bent flexible substrate is filled and solidified with a heat conductive resin having thermal conductivity, and the flexible substrate is fixed in a bent shape. Endoscope. The circuit board is composed of a flexible flexible board,
The endoscope according to claim 1, wherein the heat dissipation sheet is provided integrally with the flexible substrate and is a portion of the flexible substrate where the drive circuit is not provided.   The endoscope according to claim 1, wherein the heat dissipation sheet is provided separately from the circuit board and is bonded to the circuit board.   The endoscope according to any one of claims 1 to 4, wherein the heat radiation sheet is fixed to the one pipe with an adhesive having thermal conductivity.   6. The inside according to claim 1, wherein the heat radiating sheet is bent before coming into contact with the one pipe so as to have elasticity toward a direction in contact with the one pipe. Endoscope. The forceps pipe is disposed below the circuit board,
The endoscope according to any one of claims 1 to 6, wherein the heat radiation sheet is bonded to an upper portion of an outer peripheral surface of the forceps pipe. The accommodation pipe has an insertion hole through which the heat dissipation sheet is inserted,
The endoscope according to any one of claims 1 to 6, wherein the heat dissipation sheet is inserted through the insertion hole and bonded to an upper portion of an outer peripheral surface of the accommodation pipe.

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