JP2011198951A - Control device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a control device reduced in manufacturing cost and improved in quality while exhibiting a sufficient heat dissipation effect.SOLUTION: In the control device, an electronic substrate on which a plurality of heat generators are arranged in a plurality of rows extending in the same directions is housed in a housing, and in this state, there are formed a plurality of concave portions extending in the same directions as the plurality of rows, and convex portions formed between the plurality of concave portions extending in the same direction as the plurality of rows, respectively, facing the plurality of rows. Therefore, a heat dissipation effect can be improved by increasing a volume of the housing, a heat dissipation sheet can be positioned in the concave portion, and furthermore, ribs having screw holes on its convex portions can be easily formed. Then, the control device can be reduced in manufacturing cost and improved in quality while exhibiting a sufficient heat dissipation effect.

Description

  The present invention relates to a technology of a structure of a control device.

  A control device for controlling a controlled object (for example, a motor) includes an electronic board on which an electronic component (for example, a MOS transistor or a microcomputer) that controls on / off of current to drive the motor, It is comprised by the housing | casing provided with the board | substrate.

When the control device controls a motor that outputs a high torque, it is necessary to frequently perform on / off control of the current by the MOS transistor, and the MOS transistor generates heat. Various measures are taken because there is a possibility that a pattern wired on the electronic substrate or a terminal of an electronic component mounted on the electronic substrate may be short-circuited due to the influence of the heat-generated MOS transistor.
(First measure)
As a first countermeasure, for example, there is a configuration like the control device 1a shown in FIG. The control device 1a includes a lid 2a, a first electronic board 3a1, a second electronic board 3a2, and a housing 4a.

  The lid 2a is a box that covers the first electronic board 3a1 and the second electronic board 3a2, and includes screw holes and the like that are fixed to the housing 4a with screws.

  The first electronic board 3a1 is an insulating plate-like body, and in a state of being housed in the housing, the capacitor 30a and the like are mounted on the surface on the housing 4a side (−Z side), and the mounted capacitor 30a. A pattern for electrically connecting electronic components such as these is wired.

  The second electronic substrate 3a2 is a plate-like body having a first layer made of a material based on aluminum and a second layer made of a material having excellent thermal conductivity and insulation on the upper surface + Z side of the first layer. In the state of being housed in the housing 4a, an electronic component that is a heating element, that is, the MOS transistor 31a is mounted on the surface on the lid 2a side, and the electronic components of the mounted MOS transistor 31a are electrically connected. The pattern to be connected is wired.

  The housing 4a is a base made of an aluminum-based material, and the first electronic board 3a1 and the second electronic board 3a2 are fixed flat and screw holes for fixing the lid 2a covering them with screws or the like. It has.

  The second electronic substrate 3a2 is provided with a fixing column xa for forming a space between the second electronic substrate 3a1 and the second electronic substrate 3a1 when the second electronic substrate 3a2 is fixed. In addition, the fixed column xa also has a function of an electric wire that enables electrical connection between the electronic component mounted on the second electronic substrate 3a2 and the electronic component mounted on the first electronic substrate 3A1.

That is, the control device 1a provides the MOS transistor at a position away from the electronic substrate on which the other electronic component is mounted, so that a short circuit related to the other electronic component is generated by the heat generated by the MOS transistor. The heat can be cooled by providing the second electronic substrate 3a2 and the housing 4a having the first layer made of aluminum which can be prevented and can easily transmit the heat generated by the MOS transistor.
(Second measure)
As a second countermeasure, for example, there is a configuration like a control device 1b shown in FIG. The control device 1b includes a lid 2b, an electronic substrate 3b, a heat dissipation sheet stb, and a housing 4b.

  The lid 2b is a box that includes a screw hole that covers the electronic substrate 3b and is fixed to the housing 4b with screws.

  The electronic substrate 3b is an insulating plate-like body, and in a state of being housed in the housing, the electronic component 3a that is a capacitor 30b and a heating element on the surface on the lid 2b side (+ Z side), that is, the MOS transistor 31b. And a pattern for electrically connecting electronic components such as the mounted capacitor 30b is wired. Also, a boss hole xb3 is formed to receive a boss xb1 formed by the housing 4b when fixed to the housing 4b.

  As shown in FIG. 2, the heat radiating sheet has a thin sheet shape. Further, the material is made of silicon and filler, and is excellent in thermal conductivity and insulation. That is, the heat dissipation sheet is processed from a sheet as shown in FIG. 2 to a heat dissipation sheet stb as shown in FIG.

  The housing 4b is a base made of an aluminum-based material, and includes a screw hole for fixing the electronic substrate 3b flat and fixing the lid 2b covering the electronic substrate 3b with screws.

  When fixing the electronic substrate 3b, the housing 4b attaches the heat dissipation sheet stb on the area 40b (+ Z side) in surface contact with the back side (−Z side) surface of the MOS transistor 31b mounted on the electronic substrate 3b. Prepare. At that time, the casing 4b fixes the boss xb1 of the area 40b through the first fixing hole xb2 of the heat dissipation sheet. The casing 4b includes the electronic substrate 3b on the upper side (+ Z side) in a state where the heat radiation sheet stb is fixed. At that time, the boss xb1 of the housing 4b penetrating the first fixing hole xb2 of the heat dissipation sheet stb is passed through the second fixing hole xb3 of the electronic substrate 3b and fixed.

  That is, the control device 1b can cool the heat by providing the housing 4b made of aluminum, which is a material to which heat generated by the MOS transistor is easily transmitted.

Further, thermal conductivity and insulation are excellent between the back (−Z side) surface of the surface of the electronic substrate 3b on which the MOS transistor is mounted and the area 40b of the housing 4b in surface contact with the surface. By providing the heat dissipating sheet xb2, the heat generated by the MOS transistor can be transferred to the housing 4b made of aluminum, and the terminals and patterns of the electronic components mounted on the electronic substrate 3b are connected to the housing. It can be prevented from short-circuiting.
(Third measure)
As a third countermeasure, for example, there is a configuration like a control device 1c shown in FIG. The control device 1c includes a lid 2c, an electronic board 3c, a heat dissipation sheet stc, and a housing 4c.

  The lid 2c is a box having a screw hole that covers the electronic substrate 3c and is fixed to the housing 4c with screws.

  The electronic substrate 3c is an insulating plate-like body, and in a state of being housed in the housing, the electronic component 3a, that is, the MOS transistor 31b, which is a capacitor 30b and a heating element on the surface of the housing 4c (+ Z side). And a pattern for electrically connecting electronic components such as the mounted capacitor 30c is wired. Further, the MOS transistor 31c is mounted on the electronic substrate 31c in a state where the package made of a rectangular parallelepiped is inclined by about 30% from the vertical.

  As described above, the heat radiation sheet stc is processed by folding a thin heat radiation sheet shown in FIG. 2 into a rectangular heat radiation sheet shown in FIG.

  The housing 4c is a base made of an aluminum-based material, and is configured to store the electronic board 3c so that a space is formed, that is, the electronic board 3c is an area on the second floor. And a screw hole for fixing the lid 2b covering the electronic substrate 3c with a screw. Furthermore, the package of the MOS transistor 31 forms a peak portion 40c in surface contact with the MOS transistor 31c mounted at an inclination on the electronic substrate 3c. The crest 40c is made of an aluminum-based material like the casing 4c, and ribs xc are formed so that the heat-dissipating sheet stc that has been subjected to the mountain folding can be positioned on the crest 40c.

  When housing the electronic substrate 3c and closing it with the lid 2c, the housing 4c is connected to the peak portion 40c that is in surface contact with the MOS transistor 31c when the electronic substrate 3c is housed in the second floor area. A heat-dissipating sheet stc that has undergone mountain folding is sandwiched between them.

  That is, the control device 1b can cool the heat by providing the housing 4c made of an aluminum material that easily transmits the heat generated by the MOS transistor.

Further, by bringing the package surface of the MOS transistor 31c into contact with the surface of the crest portion 40c made of aluminum with the heat dissipation sheet stc interposed therebetween, the heat generated by the MOS transistor 31c and the crest portion 40c made of aluminum and the housing 4c In addition, the terminals and patterns of the MOS transistor mounted on the electronic substrate 3c can be prevented from coming into contact with the housing to cause a short circuit.
(Fourth countermeasure)
As a fourth countermeasure, for example, there is a configuration like a control device 1d shown in FIG. The control device 1d includes a steering motor 2d, an electronic board 3d, a heat dissipation sheet std, and a housing 4d.

  The steering motor 2d includes a plate-like body that covers the electronic substrate 3d, has a screw hole that is fixed to the housing 4d with screws, and a single-phase three-phase motor.

  The electronic substrate 3d is a plate-like body having an insulating property, and in a state where it is housed in a housing, the electronic component that is a capacitor 30d and a heating element on the surface on the steering motor 2d side (+ Z side), that is, a MOS transistor 31d. And a pattern for electrically connecting electronic components such as the mounted capacitor 30d is wired.

  The heat dissipating sheet is the heat dissipating sheet described above, and the sheet as shown in FIG. 2 is processed into a heat dissipating sheet std as shown in FIG.

  The housing 4d is a base made of an aluminum-based material, and includes a screw hole for fixing the electronic board 3d flat and fixing the steering motor 2d covering it with screws.

  The housing 4d includes a heat dissipation sheet std on the area 40d (+ Z side) in surface contact with the surface on which the MOS transistor 31d is mounted on the electronic substrate 3d when the electronic substrate 3d is fixed. The housing 4d is provided with the heat dissipation sheet std, and the electronic substrate 3d is provided thereon (+ Z side).

  That is, the control device 1d can cool the heat by providing the housing 4d made of aluminum, which is a material easy to transmit the heat generated by the MOS transistor 30d.

Further, by providing a heat radiation sheet std having excellent thermal conductivity and insulation between the surface of the electronic substrate 3d on which the MOS transistor 30d is mounted and the area 40d of the housing 4d in surface contact with the surface. The heat generated by the MOS transistor 30d can be transmitted to the casing 4d made of aluminum as a material, and the terminals and patterns of the electronic components mounted on the electronic board 3d do not come into contact with the casing and are short-circuited. You can
(Fifth countermeasure)
As a fifth countermeasure, for example, there is a configuration in which the radiating fins 1e shown in FIG. 6 are provided in the respective housings of the control device 1a, the control device 1b, the control device 1c, and the control device 1d.

  According to this, since the area of the radiating fin 1e that comes into contact with the air increases, it is possible to radiate the heat of each control device that is constantly generated.

  Thus, for example, Patent Document 1 discloses a technique for dissipating heat generated by a heating element such as a MOS transistor using a heat dissipation sheet provided in a control device.

JP 2008-192697 A

  However, when the control device as described above is adopted, there arises a problem that the cost increases and the quality deteriorates.

  The problem in the control device that takes each measure will be described in detail. In the first countermeasure, there arises a problem that the manufacturing costs of the second electronic substrate 3a2 and the fixed column xa increase.

  In the second countermeasure, the boss xb1 for fixing the heat dissipation sheet stb of the housing 4b, the first fixing hole xb2 of the heat dissipation sheet stb, and the second fixing hole xb3 of the electronic board 3b are manufactured while maintaining a certain standard. The problem of quality is difficult.

  That is, when the housing 4b houses the heat dissipation sheet stb and the electronic substrate 3b and closes the lid 2b, the electronic substrate 3b, the heat dissipation sheet stb, and the area 40b of the housing 4b must be brought into close contact with each other in order to enhance the heat dissipation effect. Therefore, the height of the boss xb1 is made slightly higher than the height corresponding to the thickness of the first fixing hole xb2 of the heat radiation sheet stb, and the depth of the second fixing hole xb3 of the electronic board 3b is made slightly higher. Therefore, there is a problem that molding is difficult and quality cannot be maintained.

  In the third countermeasure, the MOS transistor 31c formed of a rectangular parallelepiped package must be mounted on the electronic substrate 31c in a state in which the package is inclined by about 30% from the vertical, and mounting different from normal mounting is required, and Since the peak portion 40c in surface contact with the MOS transistor 31c has to be formed, there arises a problem that the manufacturing cost increases.

  In the fourth countermeasure, there is a quality problem that it is difficult to manufacture the rib 41d for fixing and screwing the electronic substrate 3d included in the housing 4d while maintaining a certain standard.

  That is, in the housing 4d, when the mounting surface of the electronic substrate 3d on which the MOS transistor 31d is mounted is the housing 4d side (−Z side) and the electronic substrate 3d is stored, the MOS mounted on the electronic substrate 3d. Since the package surface of the transistor 31d needs to be brought into surface contact with the surface of the area 40d of the housing 4d with the heat dissipation sheet std interposed therebetween, the rib 41d that fixes the electronic substrate 3d and is screwed to the housing 4d. The height of the MOS transistor 31d needs to be equal to or greater than the thickness of the MOS transistor 31d, and the rib 41d must have a corresponding height in the planar area 40d. That is, the rib 41d has a small and elongated rib 41d. In a casting method in which aluminum melted with high heat is poured into a predetermined mold, a small and slender mold has its Al Since the bromide is hard to flow, a problem that the molding is difficult not be able to maintain the quality occurs.

  In the fifth countermeasure, the radiation fin 1e increases the area that comes into contact with the air, so that it is easy to radiate the heat of the control device that is constantly generated, but the heat of the control device that is generated only at a specific timing is effective. Since there is no effect that it is easy to dissipate heat, there arises a quality problem that it is not possible to prevent a short circuit of a terminal of an electronic component when heat is generated only at a specific timing.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a control device with high quality while reducing manufacturing costs while exhibiting a sufficient heat dissipation effect.

  In order to solve the above-mentioned problem, the invention of claim 1 is a control device for controlling a controlled object, and a plurality of electronic substrates arranged in a plurality of rows extending in the same direction on the substrate surface of the electronic substrate. A heating element and a housing for storing the electronic substrate, wherein the housing is opposed to the plurality of rows in a state in which the electronic substrate is stored, and extends in the same direction as the plurality of rows. A concave portion and a convex portion extending in the same direction as the plurality of rows are provided between the plurality of concave portions.

  According to a second aspect of the present invention, in the control device according to the first aspect, the controlled object is a steering motor that controls a steering mounted on a vehicle, and the heating element is a transistor. And

  According to a third aspect of the present invention, in the control device according to the first or second aspect, the casing is formed by casting, protrudes on the convex portion, and fixes the electronic substrate. It is further characterized by further comprising a rib for the purpose.

  According to a fourth aspect of the present invention, in the control device according to any one of the first to third aspects, the casing is made of metal, and has a thermal conductivity and an insulating property. The heat dissipation sheet is further sandwiched between the recess and the heating element in a state in which the housing houses the electronic substrate.

  According to the first to fourth aspects of the present invention, the control device opposes the plurality of rows in a state in which an electronic board in which a plurality of heating elements are arranged in a plurality of rows extending in the same direction is housed in the housing. In order to form a plurality of concave portions extending in the same direction as the row of rows and a convex portion extending in the same direction as the rows of rows between the plurality of concave portions, it is possible to increase the volume of the housing and enhance the heat dissipation effect. it can.

  According to a second aspect of the present invention, the control device controls a steering motor that controls a steering mounted on a vehicle, and the heating element is a transistor. Therefore, since the volume of the housing is increased, the heat generated by the steering motor only at a specific timing can be effectively radiated.

  According to the invention of claim 3, in the control device, the casing is cast, and a rib having a screw hole for housing the electronic substrate and fixing it to the casing is formed on the convex portion. Therefore, the heat dissipation effect of the housing can be enhanced, ribs can be easily formed during casting, and manufacturing can be performed while maintaining a certain standard.

  According to the invention of claim 4, the control device is further formed by casting the casing, and further includes a rib that protrudes above the convex portion and fixes the electronic substrate. A rib having a screw hole can be easily formed on the portion.

  According to the invention of claim 5, the control device further includes a casing made of metal, further includes a heat dissipation sheet having thermal conductivity and insulation, and the heat dissipation sheet includes the casing. Since the electronic substrate is accommodated between the recess and the heating element, the heat dissipation sheet can be positioned in the recess.

FIG. 1 is a diagram illustrating a control device. FIG. 2 is a diagram illustrating a heat dissipation sheet. FIG. 3 is a diagram illustrating the control device. FIG. 4 is a diagram illustrating the control device. FIG. 5 is a diagram illustrating the control device. FIG. 6 is a diagram illustrating the heat dissipating fins. FIG. 7 is a diagram illustrating a control device. FIG. 8 is a diagram illustrating a control device.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the figure, a three-dimensional orthogonal coordinate axis (XYZ) is attached, and in the description, the direction is indicated using this coordinate axis as appropriate.

<Representative form>
(Control device)
The invention in the representative form is the control device 1 mounted on the vehicle shown in FIGS. 7 and 8, and a steering three-phase motor that controls the steering is a controlled object. The control device 1 assists the steering force of the driver's steering wheel by controlling the steering three-phase motor. Equipped with various electronic components for demonstrating the function, for example, a microcomputer that executes control computation, a ROM that stores a program for demonstrating the function, a RAM that serves as a working area for computation, and a steering three-phase These include a MOS transistor that electrically controls the motor and an I / F that controls input / output signals.

  Further, the control device 1 includes a lid body 2, an electronic substrate 3, a heat radiation sheet st, and a housing 4.

When the user assists the steering force of the steering wheel, naturally, the user operates the steering, and particularly when the vehicle is parked, the steering apparatus is frequently operated. Control to assist the steering force. On the other hand, when the user drives the vehicle at a constant vehicle speed (for example, 25 km) or higher, the steering device is not operated as frequently as parking, so the control device 1 does not frequently control the steering motor. That is, the six MOS transistors included in the control device 1 that electrically control the steering three-phase motor generate heat at the specific timing. Therefore, the control device 1 has a configuration for suppressing the heat generation, suppressing an increase in cost, and improving the quality.
(Lid)
The steering motor 2 includes a plate-like body that covers the electronic substrate 3 and includes a screw hole that is fixed to the housing 4 with screws and a single-phase three-phase motor.
(Electronic substrate)
The electronic substrate 3 is an insulating plate-like body, and in a state of being housed in the housing, the electronic component 3 that is a capacitor 30 and a heating element on the surface on the housing 4 side (−Z side), that is, a MOS transistor 31 and the like are mounted, and a pattern for electrically connecting electronic components such as the mounted capacitor 30 is wired.

The MOS transistor 31 is an electronic component that controls on / off of the current in cooperation with other electronic components such as a microcomputer in order to drive the steering motor. The mounting of the MOS transistor 31 on the electronic substrate 3 generates heat when the MOS transistor 31 is controlled by a microcomputer. Arranged. That is, one column (first column) composed of the MOS transistor 31, the MOS transistor 32, and the MOS transistor 33 is arranged (mounted) on the electronic substrate 3, and the MOS transistor 34, the MOS transistor 35 are arranged in parallel with this column. And one column (second column) composed of the MOS transistors 36 is arranged (mounted).
(Heat dissipation sheet)
The heat dissipating sheet is the heat dissipating sheet described above, and the sheet as shown in FIG. 2 is processed into the rectangular first heat dissipating sheet st1 and second heat dissipating sheet st2 shown in FIG. The first heat dissipating sheet st <b> 1 is provided in the first recess 46 formed in the housing 4. The second heat dissipating sheet st <b> 2 is provided in the second recess 47 formed in the housing 4.

Further, the size of the first heat dissipation sheet st1 and the second heat dissipation sheet st2 is required to exhibit the function of dissipating the heat generated by the MOS transistor 31 and insulating the electrical contact with the casing 4 made of aluminum. At a minimum, the first heat radiation sheet st1 has a size equal to or larger than the area of the first row, and the second heat radiation sheet st2 is also processed to a size equal to or larger than the area of the second row.
(Casing)
The housing 4 is a base made of an aluminum-based material, and includes a screw hole for fixing the electronic substrate 3 flat and fixing the lid 2 that covers the housing 4 in that state with screws. Yes.

  The housing 4 is opposed to a plurality of columns (first column and second column) constituted by the MOS transistors 31 to 36 in a state in which the electronic substrate 3 is accommodated, and extends in the same direction as the plurality of columns. A plurality of recesses (first recess 46 and second recess 47) are formed.

  Further, the housing 4 includes convex portions (first convex portion 41, second convex portion 42, third convex portion 43, fourth convex portion 44, and the like extending in the same direction as the plurality of rows between the plurality of concave portions. A fifth protrusion 45) is formed.

  That is, in the housing 4, the concave portion and the convex portion are inseparably integrated, and inevitably, a mountain-shaped convex portion (the third convex portion 43 and the fourth convex portion is provided between the groove-shaped concave portions formed in parallel. Part 44) is formed.

  Further, in the housing 4, convex portions (the first convex portion 41, the second convex portion 42, and the fifth convex portion 45) are also provided between the non-concave portions, that is, on the side where the other concave portions are not formed facing the concave portions. It is formed.

  Moreover, in the housing | casing 4, the magnitude | size of the 1st recessed part 46 is formed in the magnitude | size in which the 1st heat radiating sheet st1 fits. That is, the first recess 46 is formed to have a size that can accommodate the first row in a state where the housing 4 stores the electronic substrate 3. Further, the depth of the first recess 46 is such that the package surface of the first row of MOS transistors can come into surface contact with the first heat radiation sheet st1 provided in the first recess 46 in a state where the housing 4 houses the electronic substrate 3. It is formed to a proper depth.

  Therefore, the positioning when the first heat dissipating sheet st1 is provided in the housing 4 can be performed.

  Moreover, in the housing | casing 4, the magnitude | size of the 2nd recessed part 47 is formed in the magnitude | size which the 2nd thermal radiation sheet st2 fits. That is, the second recess 47 is formed in a size that can accommodate the first row in a state in which the housing 4 stores the electronic substrate 3. Further, the depth of the second recess 47 is such that the package surface of the MOS transistor in the first row can come into surface contact with the surface of the second heat dissipating sheet st2 provided in the second recess 47 with the housing 4 accommodating the electronic substrate 3. It is formed to such a depth.

  Therefore, the positioning when the second heat dissipating sheet st2 is provided in the housing 4 can be performed.

  In the housing 4, a rib 40 having a screw hole for fixing and screwing the electronic substrate 3 to the top (+ Z side) of the third convex portion 43 is formed. The height of the rib 40 is such that the electronic substrate 3 on which the MOS transistor 31 is mounted can be accommodated together with the height of the third protrusion 43, and the package surface of the MOS transistor and the heat dissipation sheet surface are in surface contact. In order to be able to do so, the thickness of the MOS transistor 31 or more is required. That is, the height of the rib 40 is lower than the conventional rib 41e by the height of the third convex portion 43.

  In addition, the housing | casing 4 which forms such a recessed part, a convex part, and a rib is cast by the method of pouring the aluminum fuse | melted with high heat into a predetermined type | mold.

In other words, in the casting method in which aluminum melted by high heat is poured into a predetermined mold, since the aluminum is difficult to flow into a mold according to fine molding, there is a problem that molding is difficult and quality cannot be maintained, Since the rib 40 is shorter than the conventional small and long rib 41e, the aluminum easily flows into the mold corresponding to the rib 40, and it is easy to mold and maintain quality.
(Assembly of control device)
A method for assembling the control device 1 will be described with reference to FIGS. The housing 4 is housed in the order of the first heat radiating sheet st1, the second heat radiating sheet st2, and the electronic board 3, and is fixed by screws, which is closed by the lid 2 and fixed by screws. Further, the assembly method will be described in detail below.

  First, the first heat radiation sheet is accommodated in the first convex portion 41, the second convex portion 42, the third convex portion 43, the fourth convex portion 44, and the first concave portion 46 formed by the wall surface of the housing 4. The Further, the second heat radiation sheet is accommodated in a second concave portion 47 formed by the third convex portion 43, the fourth convex portion 44, the fifth convex portion and the wall surface of the housing 4.

  Next, the electronic substrate 3 in which the first row and the second row are arranged (mounted) on the housing 4 side (−Z side) is mounted on the package surface of the MOS transistor constituting the first row and the second row. The body 4 is housed in surface contact with the surfaces of the first heat radiation sheet st1 and the second heat radiation sheet st2 housed in the first recess and the second recess. That is, in the state where they are in surface contact, the vicinity of the first row and the second row is surrounded by the convex portion 41, the convex portion 42, the convex portion 43, the convex portion 44, the convex portion 45, and the wall surface of the housing 4.

  Next, in a state where the electronic substrate 3 is housed in the housing 4, the electronic substrate 3 is closed with the lid body 2 and further fixed with screws. Thus, the assembly of the control device 1 is completed.

  Thus, when the control device 1 is assembled, the package surfaces of the MOS transistors constituting the first row and the second row are in surface contact with the heat radiation sheet surfaces provided on the bottom surfaces of the recesses, and further, the first row. Since the convex portions and wall surfaces of the casing 4 are located in the vicinity of the second row, that is, the volume of the casing 4 having a heat dissipation function in the vicinity of the first row and the second row is increased, each MOS transistor is electrically connected. It is possible to insulate the electrical contact at the time of being controlled and to radiate the heat generated at that time to the housing 4 and to effectively cool the heat generated only at a specific timing.

<Modification>
Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications are possible. Other embodiments will be described below.

  In the above embodiment, the control device for controlling the steering motor mounted on the vehicle is described as a representative embodiment. However, a vehicle, a train, or an aircraft provided with a heating element such as a MOS transistor. The configuration described in the above embodiment may be applied to the control device, home appliance, manufacturing device, experimental device, or the like.

DESCRIPTION OF SYMBOLS 1 Control apparatus 2 Steering motor 3 Electronic board 4 Case 30 Capacitor 31 Transistor 32 Transistor 33 Transistor 34 Transistor 35 Transistor 36 Transistor 40 Rib 41 Convex part 42 Convex part 43 Convex part 44 Convex part 45 Convex part 46 Concave part 47 Concave part 48 Concave part st1 Heat dissipation sheet st2 heat dissipation sheet

Claims (4)

A control device for controlling a controlled object,
An electronic substrate;
A plurality of heating elements arranged in a plurality of rows extending in the same direction on the substrate surface of the electronic substrate,
A housing for housing the electronic substrate;
With
The housing is
A plurality of recesses facing the plurality of rows in a state in which the electronic substrate is housed, and extending in the same direction as the plurality of rows;
A convex portion extending in the same direction as the plurality of rows between the plurality of concave portions,
A control device comprising: The control device according to claim 1,
The controlled object is a steering motor that controls steering mounted on a vehicle,
The control device, wherein the heating element is a transistor. The control device according to claim 1 or 2,
The casing is formed by casting, protrudes on the convex portion, and a rib for fixing the electronic substrate,
The control apparatus further comprising: The control device according to any one of claims 1 to 3,
The casing is made of metal,
Heat dissipation sheet with thermal conductivity and insulation,
Further comprising
The control device, wherein the heat radiating sheet is sandwiched between the recess and the heating element in a state where the housing houses the electronic board.